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| MC9S12XEP100 Reference Manual Covers MC9S12XE Family HCS12X Microcontrollers Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 MC9S12XEP100RMV1 Rev. 1.22 05/2010 freescale.com To provide the most up-to-date information, the document revision on the World Wide Web is the most current. A printed copy may be an earlier revision. To verif, refer to: http://freescale.com/ This document contains information for the complete S12XE-Family and thus includes a set of separate FTM module sections to cover the whole family. A full list of family members and options is included in the appendices. This document contains information for all constituent modules, with the exception of the S12X CPU. For S12X CPU information please refer to CPU12XV2 in the CPU12/CPU12X Reference Manual. Revision History Date Revision Description Figure B-3 1 value corrected. Added LVR minimum assert level Enhanced RESET pin description. IIC register name corrected Corrected D-Flash size reference for XEG128 Changed module revision history tables to a unified format Corrected corrupted formats Added Module Run Idd Values Added 3.3V expansion bus timing Corrected NVM timing parameters Changed IIC SCL Divider note Updated NVM timing parameter section for brownout case Specified time delay from RESET to start of CPU code execution Added NVM patch Part IDs Enhanced ECT GPIO / timer function transitioning description Updated 208MAPBGA thermal parameters Revised TIM flag clearing procedure Corrected CRG register address Added maskset identifier suffix for ATMC fab Fixed typos Added 208MAPBGA disclaimer Added VREAPI to PT5. Added LVR Note to electricals. Updates to TIM/ECT/XGATE/SCI/MSCAN (see embedded rev. history) FTM section (see FTM revision history) PIM section (see PIM revision history) ECT and TIM sections (see ECT, TIM revision history tables) BDM Alternate clock source defined in device overview May,2008 1.16 Jul, 2008 1.17 Sep, 2008 1.18 Dec, 2008 1.19 Aug, 2009 1.20 Apr, 2010 May, 2010 1.21 1.22 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Chapter 7 Chapter 8 Chapter 9 Chapter 10 Chapter 11 Chapter 12 Chapter 13 Chapter 14 Chapter 15 Chapter 16 Chapter 17 Chapter 18 Chapter 19 Chapter 20 Chapter 21 Chapter 22 Chapter 23 Chapter 24 Chapter 25 Device Overview MC9S12XE-Family. . . . . . . . . . . . . . . . . . . . . 27 Port Integration Module (S12XEP100PIMV1) . . . . . . . . . . . . . . 89 Memory Mapping Control (S12XMMCV4) . . . . . . . . . . . . . . . . 187 Memory Protection Unit (S12XMPUV1) . . . . . . . . . . . . . . . . . 227 External Bus Interface (S12XEBIV4) . . . . . . . . . . . . . . . . . . . . 241 Interrupt (S12XINTV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 Background Debug Module (S12XBDMV2) . . . . . . . . . . . . . . 277 S12X Debug (S12XDBGV3) Module . . . . . . . . . . . . . . . . . . . . 303 Security (S12XE9SECV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 XGATE (S12XGATEV3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 S12XE Clocks and Reset Generator (S12XECRGV1) . . . . . . 467 Pierce Oscillator (S12XOSCLCPV2) . . . . . . . . . . . . . . . . . . . . 497 Analog-to-Digital Converter (ADC12B16CV1) . . . . . . . . . . . . 501 Enhanced Capture Timer (ECT16B8CV3). . . . . . . . . . . . . . . . 525 Inter-Integrated Circuit (IICV3) Block Description. . . . . . . . . 577 Scalable Controller Area Network (S12MSCANV3) . . . . . . . . 603 Periodic Interrupt Timer (S12PIT24B8CV2) . . . . . . . . . . . . . . 657 Periodic Interrupt Timer (S12PIT24B4CV2) . . . . . . . . . . . . . . 675 Pulse-Width Modulator (S12PWM8B8CV1) . . . . . . . . . . . . . . 689 Serial Communication Interface (S12SCIV5) . . . . . . . . . . . . . 721 Serial Peripheral Interface (S12SPIV5) . . . . . . . . . . . . . . . . . . 759 Timer Module (TIM16B8CV2) Block Description . . . . . . . . . . 785 Voltage Regulator (S12VREGL3V3V1) . . . . . . . . . . . . . . . . . . 813 128 KByte Flash Module (S12XFTM128K2V1) . . . . . . . . . . . . 829 256 KByte Flash Module (S12XFTM256K2V1) . . . . . . . . . . . . 889 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 3 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 26 Chapter 27 Chapter 28 Chapter 29 384 KByte Flash Module (S12XFTM384K2V1) . . . . . . . . . . . . 951 512 KByte Flash Module (S12XFTM512K3V1) . . . . . . . . . . . 1013 768 KByte Flash Module (S12XFTM768K4V2) . . . . . . . . . . . 1075 1024 KByte Flash Module (S12XFTM1024K5V2) . . . . . . . . . 1137 Appendix A Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 Appendix B Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1255 Appendix C PCB Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1260 Appendix D Derivative Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1265 Appendix E Detailed Register Address Map. . . . . . . . . . . . . . . . . . . . . . . 1268 Appendix F Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1319 MC9S12XE-Family Reference Manual , Rev. 1.21 4 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Blank Page MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 5 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Blank Page MC9S12XE-Family Reference Manual , Rev. 1.21 6 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 1.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 1.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 1.1.4 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 1.1.5 Address Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 1.1.6 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.1.7 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 1.2.1 Device Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 1.2.2 Pin Assignment Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 1.2.3 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 1.2.4 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.4.1 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 1.4.2 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 1.4.3 Freeze Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 1.4.4 System States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.1 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.2 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 1.6.3 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 ADC0 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 1.7.1 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 1.7.2 ADC0 Channel[17] Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 ADC1 External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 MPU Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 VREG Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 1.10.1 Temperature Sensor Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 BDM Clock Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 S12XEPIM Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Oscillator Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 Chapter 2 Port Integration Module (S12XEPIMV1) 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 7 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.2 2.3 2.1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 2.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 2.3.1 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 2.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 2.3.3 Port A Data Register (PORTA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 2.3.4 Port B Data Register (PORTB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 2.3.5 Port A Data Direction Register (DDRA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.3.6 Port B Data Direction Register (DDRB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 2.3.7 Port C Data Register (PORTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 2.3.8 Port D Data Register (PORTD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 2.3.9 Port C Data Direction Register (DDRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 2.3.10 Port D Data Direction Register (DDRD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 2.3.11 Port E Data Register (PORTE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 2.3.12 Port E Data Direction Register (DDRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 2.3.13 S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) . . . . . . . . . . . . . . . . . . 114 2.3.14 S12X_EBI ports Reduced Drive Register (RDRIV) . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 2.3.15 ECLK Control Register (ECLKCTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 2.3.16 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 2.3.17 IRQ Control Register (IRQCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 2.3.18 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 2.3.19 Port K Data Register (PORTK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 2.3.20 Port K Data Direction Register (DDRK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 2.3.21 Port T Data Register (PTT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 2.3.22 Port T Input Register (PTIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 2.3.23 Port T Data Direction Register (DDRT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 2.3.24 Port T Reduced Drive Register (RDRT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 2.3.25 Port T Pull Device Enable Register (PERT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 2.3.26 Port T Polarity Select Register (PPST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.27 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.28 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 2.3.29 Port S Data Register (PTS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 2.3.30 Port S Input Register (PTIS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.3.31 Port S Data Direction Register (DDRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 2.3.32 Port S Reduced Drive Register (RDRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 2.3.33 Port S Pull Device Enable Register (PERS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 2.3.34 Port S Polarity Select Register (PPSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 2.3.35 Port S Wired-Or Mode Register (WOMS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 2.3.36 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 2.3.37 Port M Data Register (PTM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 2.3.38 Port M Input Register (PTIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 2.3.39 Port M Data Direction Register (DDRM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 2.3.40 Port M Reduced Drive Register (RDRM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 2.3.41 Port M Pull Device Enable Register (PERM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 MC9S12XE-Family Reference Manual , Rev. 1.21 8 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.3.42 2.3.43 2.3.44 2.3.45 2.3.46 2.3.47 2.3.48 2.3.49 2.3.50 2.3.51 2.3.52 2.3.53 2.3.54 2.3.55 2.3.56 2.3.57 2.3.58 2.3.59 2.3.60 2.3.61 2.3.62 2.3.63 2.3.64 2.3.65 2.3.66 2.3.67 2.3.68 2.3.69 2.3.70 2.3.71 2.3.72 2.3.73 2.3.74 2.3.75 2.3.76 2.3.77 2.3.78 2.3.79 2.3.80 2.3.81 2.3.82 2.3.83 2.3.84 2.3.85 2.3.86 Port M Polarity Select Register (PPSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Port M Wired-Or Mode Register (WOMM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 Module Routing Register (MODRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 Port P Data Register (PTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 Port P Input Register (PTIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 Port P Data Direction Register (DDRP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 Port P Reduced Drive Register (RDRP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 Port P Pull Device Enable Register (PERP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140 Port P Polarity Select Register (PPSP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Port P Interrupt Enable Register (PIEP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Port P Interrupt Flag Register (PIFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Port H Data Register (PTH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Port H Input Register (PTIH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Port H Data Direction Register (DDRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 Port H Reduced Drive Register (RDRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146 Port H Pull Device Enable Register (PERH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Port H Polarity Select Register (PPSH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Port H Interrupt Enable Register (PIEH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 Port H Interrupt Flag Register (PIFH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 Port J Data Register (PTJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 Port J Input Register (PTIJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Port J Data Direction Register (DDRJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Port J Reduced Drive Register (RDRJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 Port J Pull Device Enable Register (PERJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Port J Polarity Select Register (PPSJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Port J Interrupt Enable Register (PIEJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Port J Interrupt Flag Register (PIFJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Port AD0 Data Register 0 (PT0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Port AD0 Data Register 1 (PT1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Port AD0 Data Direction Register 0 (DDR0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Port AD0 Data Direction Register 1 (DDR1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Port AD0 Reduced Drive Register 0 (RDR0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 Port AD0 Reduced Drive Register 1 (RDR1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Port AD0 Pull Up Enable Register 0 (PER0AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 Port AD0 Pull Up Enable Register 1 (PER1AD0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 Port AD1 Data Register 0 (PT0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 Port AD1 Data Register 1 (PT1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Port AD1 Data Direction Register 0 (DDR0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 Port AD1 Data Direction Register 1 (DDR1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Port AD1 Reduced Drive Register 0 (RDR0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Port AD1 Reduced Drive Register 1 (RDR1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 Port AD1 Pull Up Enable Register 0 (PER0AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Port AD1 Pull Up Enable Register 1 (PER1AD1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Port R Data Register (PTR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 Port R Input Register (PTIR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 9 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 2.4 2.5 2.3.87 Port R Data Direction Register (DDRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 2.3.88 Port R Reduced Drive Register (RDRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 2.3.89 Port R Pull Device Enable Register (PERR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 2.3.90 Port R Polarity Select Register (PPSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 2.3.91 PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 2.3.92 Port R Routing Register (PTRRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 2.3.93 Port L Data Register (PTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 2.3.94 Port L Input Register (PTIL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 2.3.95 Port L Data Direction Register (DDRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 2.3.96 Port L Reduced Drive Register (RDRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 2.3.97 Port L Pull Device Enable Register (PERL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 2.3.98 Port L Polarity Select Register (PPSL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 2.3.99 Port L Wired-Or Mode Register (WOML) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 2.3.100Port L Routing Register (PTLRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 2.3.101Port F Data Register (PTF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173 2.3.102Port F Input Register (PTIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 2.3.103Port F Data Direction Register (DDRF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 2.3.104Port F Reduced Drive Register (RDRF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 2.3.105Port F Pull Device Enable Register (PERF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 2.3.106Port F Polarity Select Register (PPSF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 2.3.107PIM Reserved Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 2.3.108Port F Routing Register (PTFRR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 2.4.3 Pins and Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 2.4.4 Pin interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 2.5.1 Port Data and Data Direction Register writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 186 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187 3.1.1 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 3.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 3.1.3 S12X Memory Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 3.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 3.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 3.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192 3.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 3.4.1 MCU Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 3.4.2 Memory Map Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205 MC9S12XE-Family Reference Manual , Rev. 1.21 10 Freescale Semiconductor 3.2 3.3 3.4 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 3.5 3.4.3 Chip Access Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 3.4.4 Chip Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 3.5.1 CALL and RTC Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218 3.5.2 Port Replacement Registers (PRRs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 3.5.3 On-Chip ROM Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.1 Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227 4.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228 4.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 4.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 4.4.1 Protection Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237 4.4.2 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 4.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239 4.2 4.3 4.4 4.5 Chapter 5 External Bus Interface (S12XEBIV4) 5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241 5.1.1 Glossary or Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242 5.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 5.4.1 Operating Modes and External Bus Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248 5.4.2 Internal Visibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249 5.4.3 Accesses to Port Replacement Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 5.4.4 Stretched External Bus Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253 5.4.5 Data Select and Data Direction Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254 5.4.6 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 5.5.1 Normal Expanded Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256 5.5.2 Emulation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257 5.2 5.3 5.4 5.5 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 11 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 261 6.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 6.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262 6.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263 6.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 6.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265 6.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271 6.4.1 S12X Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 6.4.2 Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 6.4.3 XGATE Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 6.4.4 Priority Decoders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273 6.4.5 Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 6.4.6 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.2 Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 6.5.3 Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276 6.2 6.3 6.4 6.5 Chapter 7 Background Debug Module (S12XBDMV2) 7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277 7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280 7.3.3 Family ID Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285 7.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286 7.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286 7.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287 7.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 7.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289 7.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 7.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294 7.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 296 7.4.9 SYNC -- Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299 7.2 7.3 7.4 MC9S12XE-Family Reference Manual , Rev. 1.21 12 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 7.4.10 Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 7.4.11 Serial Communication Time Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301 Chapter 8 S12X Debug (S12XDBGV3) Module 8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 8.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303 8.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 8.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 8.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305 8.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306 8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324 8.4.1 S12XDBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 8.4.2 Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325 8.4.3 Trigger Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 329 8.4.4 State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330 8.4.5 Trace Buffer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 331 8.4.6 Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339 8.4.7 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340 8.2 8.3 8.4 Chapter 9 Security (S12XE9SECV2) 9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345 9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 9.1.3 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346 9.1.4 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347 9.1.5 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348 9.1.6 Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 9.1.7 Complete Memory Erase (Special Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349 Chapter 10 XGATE (S12XGATEV3) 10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 351 10.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 352 10.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 10.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353 10.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 10.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 13 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 10.4 10.5 10.6 10.7 10.8 10.9 10.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 354 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371 10.4.1 XGATE RISC Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372 10.4.2 Programmer's Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372 10.4.3 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373 10.4.4 Semaphores . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374 10.4.5 Software Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.5.1 Incoming Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.5.2 Outgoing Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.6.1 Debug Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377 10.6.2 Leaving Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380 10.8.1 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380 10.8.2 Instruction Summary and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 383 10.8.3 Cycle Notation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 385 10.8.4 Thread Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 10.8.5 Instruction Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 10.8.6 Instruction Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459 Initialization and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.2 Code Example (Transmit "Hello World!" on SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461 10.9.3 Stack Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467 11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467 11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468 11.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468 11.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.2.1 VDDPLL, VSSPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.2.2 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469 11.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471 11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484 11.4.1 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484 11.4.2 Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 489 11.4.3 Low Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 490 11.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 492 11.5.1 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 493 11.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 495 MC9S12XE-Family Reference Manual , Rev. 1.21 14 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 11.6.1 Description of Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497 12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.2.1 VDDPLL and VSSPLL -- Operating and Ground Voltage Pins . . . . . . . . . . . . . . . . . . . . 498 12.2.2 EXTAL and XTAL -- Input and Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498 12.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.1 Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.2 Clock Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.3 Wait Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 12.4.4 Stop Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 501 13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502 13.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 503 13.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 504 13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 506 13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 13.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521 13.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 522 13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523 13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 14.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525 14.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 526 14.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2.1 IOC7 -- Input Capture and Output Compare Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . 527 14.2.2 IOC6 -- Input Capture and Output Compare Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . 527 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 15 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 14.2.3 IOC5 -- Input Capture and Output Compare Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.4 IOC4 -- Input Capture and Output Compare Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.5 IOC3 -- Input Capture and Output Compare Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.6 IOC2 -- Input Capture and Output Compare Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.7 IOC1 -- Input Capture and Output Compare Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.2.8 IOC0 -- Input Capture and Output Compare Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528 14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564 14.4.1 Enhanced Capture Timer Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 571 14.4.2 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575 14.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577 15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 577 15.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2.1 IIC_SCL -- Serial Clock Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.2.2 IIC_SDA -- Serial Data Line Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 578 15.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579 15.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579 15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591 15.4.1 I-Bus Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 591 15.4.2 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.4.3 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.4.4 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596 15.7 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597 15.7.1 IIC Programming Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603 16.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 16.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604 16.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 16.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605 16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.2.1 RXCAN -- CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 MC9S12XE-Family Reference Manual , Rev. 1.21 16 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 16.2.2 TXCAN -- CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606 16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607 16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607 16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 609 16.3.3 Programmer's Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 628 16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639 16.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 642 16.4.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 648 16.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 650 16.4.6 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 654 16.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 654 16.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 16.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 16.5.2 Bus-Off Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657 17.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658 17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658 17.3 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 659 17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 669 17.4.1 Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 670 17.4.2 Interrupt Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671 17.4.3 Hardware Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671 17.5 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.2 Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.5.3 Flag Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 17.6 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 672 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 675 18.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 17 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 18.3 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676 18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 685 18.4.1 Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 685 18.4.2 Interrupt Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.4.3 Hardware Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.2 Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.5.3 Flag Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 687 18.6 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 688 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689 19.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689 19.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 690 19.2.1 PWM7 -- PWM Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.2 PWM6 -- PWM Channel 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.3 PWM5 -- PWM Channel 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.4 PWM4 -- PWM Channel 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.5 PWM3 -- PWM Channel 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.6 PWM3 -- PWM Channel 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.7 PWM3 -- PWM Channel 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.2.8 PWM3 -- PWM Channel 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 691 19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 692 19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707 19.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707 19.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 710 19.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 718 19.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 719 Chapter 20 Serial Communication Interface (S12SCIV5) 20.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721 20.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 721 20.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 722 20.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 722 20.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 723 20.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 MC9S12XE-Family Reference Manual , Rev. 1.21 18 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 20.2.1 TXD -- Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.2.2 RXD -- Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3.1 Module Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 724 20.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 725 20.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 737 20.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738 20.4.2 LIN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 738 20.4.3 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739 20.4.4 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 740 20.4.5 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 741 20.4.6 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 746 20.4.7 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 754 20.4.8 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755 20.5.3 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 756 20.5.4 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 758 20.5.5 Recovery from Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 758 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759 21.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760 21.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.1 MOSI -- Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.2 MISO -- Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761 21.2.3 SS -- Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.2.4 SCK -- Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762 21.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763 21.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 771 21.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 772 21.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 773 21.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774 21.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 779 21.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 780 21.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 781 21.4.7 Low Power Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 782 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 19 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 785 22.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786 22.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786 22.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787 22.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 789 22.2.1 IOC7 -- Input Capture and Output Compare Channel 7 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.2 IOC6 -- Input Capture and Output Compare Channel 6 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.3 IOC5 -- Input Capture and Output Compare Channel 5 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.4 IOC4 -- Input Capture and Output Compare Channel 4 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.5 IOC3 -- Input Capture and Output Compare Channel 3 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.6 IOC2 -- Input Capture and Output Compare Channel 2 Pin . . . . . . . . . . . . . . . . . . . . 789 22.2.7 IOC1 -- Input Capture and Output Compare Channel 1 Pin . . . . . . . . . . . . . . . . . . . . 790 22.2.8 IOC0 -- Input Capture and Output Compare Channel 0 Pin . . . . . . . . . . . . . . . . . . . . 790 22.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 790 22.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 807 22.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808 22.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 809 22.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 809 22.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 810 22.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 810 22.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811 22.6.1 Channel [7:0] Interrupt (C[7:0]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 22.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813 23.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 814 23.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.1 VDDR -- Regulator Power Input Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.2 VDDA, VSSA -- Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.3 VDD, VSS -- Regulator Output1 (Core Logic) Pins . . . . . . . . . . . . . . . . . . . . . . . . . . 816 23.2.4 VDDF -- Regulator Output2 (NVM Logic) Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.5 VDDPLL, VSSPLL -- Regulator Output3 (PLL) Pins . . . . . . . . . . . . . . . . . . . . . . . . . 817 MC9S12XE-Family Reference Manual , Rev. 1.21 20 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 23.2.6 VDDX -- Power Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.7 VREGEN -- Optional Regulator Enable Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.2.8 VREG_API -- Optional Autonomous Periodical Interrupt Output Pin . . . . . . . . . . . . . . 817 23.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 817 23.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818 23.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818 23.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.2 Regulator Core (REG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.3 Low-Voltage Detect (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824 23.4.4 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.5 Low-Voltage Reset (LVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.6 HTD - High Temperature Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.7 Regulator Control (CTRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.8 Autonomous Periodical Interrupt (API) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 825 23.4.9 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 23.4.10Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 23.4.11Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 826 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 830 24.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 830 24.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 831 24.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 832 24.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833 24.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 834 24.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 834 24.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 839 24.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 860 24.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 860 24.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 865 24.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 885 24.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 886 24.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 887 24.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 888 24.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 888 24.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 888 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 889 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 21 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 25.2 25.3 25.4 25.5 25.6 25.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 890 25.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 891 25.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 892 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 893 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 894 25.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 894 25.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 899 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 920 25.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 920 25.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 925 25.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 946 25.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 25.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947 25.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 948 25.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 949 25.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 949 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 949 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 951 26.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 952 26.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 953 26.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 954 26.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 955 26.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 956 26.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 956 26.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 961 26.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 982 26.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 982 26.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 987 26.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1009 26.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010 26.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1011 26.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1012 26.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1012 26.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1012 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014 MC9S12XE-Family Reference Manual , Rev. 1.21 22 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 27.2 27.3 27.4 27.5 27.6 27.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014 27.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1015 27.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1016 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1017 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1018 27.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1018 27.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1023 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1044 27.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1044 27.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1049 27.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1070 27.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 27.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071 27.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1072 27.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1073 27.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1073 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1075 28.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1076 28.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1077 28.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1078 28.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1079 28.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1080 28.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1080 28.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1085 28.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106 28.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106 28.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1111 28.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1133 28.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1134 28.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1135 28.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1136 28.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1136 28.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1136 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1138 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 23 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 29.2 29.3 29.4 29.5 29.6 29.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1138 29.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1139 29.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1140 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1141 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142 29.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142 29.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1148 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1169 29.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1169 29.4.2 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1174 29.4.3 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1195 29.4.4 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 29.4.5 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1196 29.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1197 29.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1198 29.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1198 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1198 Appendix A Electrical Characteristics A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1199 A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1200 A.1.4 Current Injection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1201 A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1201 A.1.6 ESD Protection and Latch-up Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1202 A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1204 A.1.8 Power Dissipation and Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1205 A.1.9 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1207 A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1212 A.2 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.1 ATD Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.2 Factors Influencing Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1217 A.2.3 ATD Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1219 A.3 NVM, Flash and Emulated EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1222 A.3.1 Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1222 A.3.2 NVM Reliability Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1229 A.4 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1231 A.5 Output Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1231 A.5.1 Resistive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.5.2 Capacitive Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.5.3 Chip Power-up and Voltage Drops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1232 A.6 Reset, Oscillator and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1233 MC9S12XE-Family Reference Manual , Rev. 1.21 24 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 A.6.1 Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1233 A.6.2 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1235 A.6.3 Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1236 A.7 External Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.1 MSCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.2 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238 A.7.3 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1244 Appendix B Package Information B.1 B.2 B.3 B.4 208 MAPBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1256 144-Pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1256 112-Pin LQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1258 80-Pin QFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1259 Appendix C PCB Layout Guidelines Appendix D Derivative Differences D.1 Memory Sizes and Package Options S12XE - Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1265 D.2 Pinout explanations: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1267 Appendix E Detailed Register Address Map Appendix F Ordering Information MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 25 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 MC9S12XE-Family Reference Manual , Rev. 1.21 26 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1 Introduction The MC9S12XE-Family of micro controllers is a further development of the S12XD-Family including new features for enhanced system integrity and greater functionality. These new features include a Memory Protection Unit (MPU) and Error Correction Code (ECC) on the Flash memory together with enhanced EEPROM functionality (EEE), an enhanced XGATE, an Internally filtered, frequency modulated Phase Locked Loop (IPLL) and an enhanced ATD. The E-Family extends the S12X product range up to 1MB of Flash memory with increased I/O capability in the 208-pin version of the flagship MC9S12XE100. The MC9S12XE-Family delivers 32-bit performance with all the advantages and efficiencies of a 16 bit MCU. It retains the low cost, power consumption, EMC and code-size efficiency advantages currently enjoyed by users of Freescale's existing 16-Bit MC9S12 and S12X MCU families. There is a high level of compatibility between the S12XE and S12XD families. The MC9S12XE-Family features an enhanced version of the performance-boosting XGATE co-processor which is programmable in "C" language and runs at twice the bus frequency of the S12X with an instruction set optimized for data movement, logic and bit manipulation instructions and which can service any peripheral module on the device. The new enhanced version has improved interrupt handling capability and is fully compatible with the existing XGATE module. The MC9S12XE-Family is composed of standard on-chip peripherals including up to 64Kbytes of RAM, eight asynchronous serial communications interfaces (SCI), three serial peripheral interfaces (SPI), an 8channel IC/OC enhanced capture timer (ECT), two 16-channel, 12-bit analog-to-digital converters, an 8channel pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two inter-IC bus blocks (IIC), an 8-channel 24-bit periodic interrupt timer (PIT) and an 8-channel 16-bit standard timer module (TIM). The MC9S12XE-Family uses 16-bit wide accesses without wait states for all peripherals and memories. The non-multiplexed expanded bus interface available on the 144/208-Pin versions allows an easy interface to external memories. In addition to the I/O ports available in each module, up to 26 further I/O ports are available with interrupt capability allowing Wake-Up from STOP or WAIT modes. The MC9S12XE-Family is available in 208Pin MAPBGA, 144-Pin LQFP, 112-Pin LQFP or 80-Pin QFP options. 1.1.1 Features Features of the MC9S12XE-Family are listed here. Please see Table D-2.for memory options and Table D2. for the peripheral features that are available on the different family members. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 27 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family * * * * * * * * * * 16-Bit CPU12X -- Upward compatible with MC9S12 instruction set with the exception of five Fuzzy instructions (MEM, WAV, WAVR, REV, REVW) which have been removed -- Enhanced indexed addressing -- Access to large data segments independent of PPAGE INT (interrupt module) -- Eight levels of nested interrupts -- Flexible assignment of interrupt sources to each interrupt level. -- External non-maskable high priority interrupt (XIRQ) -- Internal non-maskable high priority Memory Protection Unit interrupt -- Up to 24 pins on ports J, H and P configurable as rising or falling edge sensitive interrupts EBI (external bus interface)(available in 208-Pin and 144-Pin packages only) -- Up to four chip select outputs to select 16K, 1M, 2M and up to 4MByte address spaces -- Each chip select output can be configured to complete transaction on either the time-out of one of the two wait state generators or the deassertion of EWAIT signal MMC (module mapping control) DBG (debug module) -- Monitoring of CPU and/or XGATE busses with tag-type or force-type breakpoint requests -- 64 x 64-bit circular trace buffer captures change-of-flow or memory access information BDM (background debug mode) MPU (memory protection unit) -- 8 address regions definable per active program task -- Address range granularity as low as 8-bytes -- No write / No execute Protection Attributes -- Non-maskable interrupt on access violation XGATE -- Programmable, high performance I/O coprocessor module -- Transfers data to or from all peripherals and RAM without CPU intervention or CPU wait states -- Performs logical, shifts, arithmetic, and bit operations on data -- Can interrupt the HCS12X CPU signalling transfer completion -- Triggers from any hardware module as well as from the CPU possible -- Two interrupt levels to service high priority tasks -- Hardware support for stack pointer initialisation OSC_LCP (oscillator) -- Low power loop control Pierce oscillator utilizing a 4MHz to 16MHz crystal -- Good noise immunity -- Full-swing Pierce option utilizing a 2MHz to 40MHz crystal -- Transconductance sized for optimum start-up margin for typical crystals IPLL (Internally filtered, frequency modulated phase-locked-loop clock generation) MC9S12XE-Family Reference Manual , Rev. 1.21 28 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family * * * * * * * -- No external components required -- Configurable option to spread spectrum for reduced EMC radiation (frequency modulation) CRG (clock and reset generation) -- COP watchdog -- Real time interrupt -- Clock monitor -- Fast wake up from STOP in self clock mode Memory Options -- 128K, 256k, 384K, 512K, 768K and 1M byte Flash -- 2K, 4K byte emulated EEPROM -- 12K, 16K, 24K, 32K, 48K and 64K Byte RAM Flash General Features -- 64 data bits plus 8 syndrome ECC (Error Correction Code) bits allow single bit failure correction and double fault detection -- Erase sector size 1024 bytes -- Automated program and erase algorithm D-Flash Features -- Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access. -- Dedicated commands to control access to the D-Flash memory over EEE operation. -- Single bit fault correction and double bit fault detection within a word during read operations. -- Automated program and erase algorithm with verify and generation of ECC parity bits. -- Fast sector erase and word program operation. -- Ability to program up to four words in a burst sequence Emulated EEPROM Features -- Automatic EEE file handling using an internal Memory Controller. -- Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset. -- Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory. -- Ability to disable EEE operation and allow priority access to the D-Flash memory. -- Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory. Two 16-channel, 12-bit Analog-to-Digital Converters -- 8/10/12 Bit resolution -- 3s, 10-bit single conversion time -- Left/right, signed/unsigned result data -- External and internal conversion trigger capability -- Internal oscillator for conversion in Stop modes -- Wake from low power modes on analog comparison > or <= match Five MSCAN (1 M bit per second, CAN 2.0 A, B software compatible modules) -- Five receive and three transmit buffers MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 29 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family * * * * * * * * -- Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit -- Four separate interrupt channels for Rx, Tx, error, and wake-up -- Low-pass filter wake-up function -- Loop-back for self-test operation ECT (enhanced capture timer) -- 8 x 16-bit channels for input capture or output compare -- 16-bit free-running counter with 8-bit precision prescaler -- 16-bit modulus down counter with 8-bit precision prescaler -- Four 8-bit or two 16-bit pulse accumulators TIM (standard timer module) -- 8 x 16-bit channels for input capture or output compare -- 16-bit free-running counter with 8-bit precision prescaler -- 1 x 16-bit pulse accumulator PIT (periodic interrupt timer) -- Up to eight timers with independent time-out periods -- Time-out periods selectable between 1 and 224 bus clock cycles -- Time-out interrupt and peripheral triggers 8 PWM (pulse-width modulator) channels -- 8 channel x 8-bit or 4 channel x 16-bit Pulse Width Modulator -- programmable period and duty cycle per channel -- Center- or left-aligned outputs -- Programmable clock select logic with a wide range of frequencies -- Fast emergency shutdown input Three Serial Peripheral Interface Modules (SPI) -- Configurable for 8 or 16-bit data size Eight Serial Communication Interfaces (SCI) -- Standard mark/space non-return-to-zero (NRZ) format -- Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths Two Inter-IC bus (IIC) Modules -- Multi-master operation -- Software programmable for one of 256 different serial clock frequencies -- Broadcast mode support -- 10-bit address support On-Chip Voltage Regulator -- Two parallel, linear voltage regulators with bandgap reference -- Low-voltage detect (LVD) with low-voltage interrupt (LVI) -- Power-on reset (POR) circuit -- 3.3V and 5V range operation -- Low-voltage reset (LVR) MC9S12XE-Family Reference Manual , Rev. 1.21 30 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family * * * * Low-power wake-up timer (API) -- Available in all modes including Full Stop Mode -- Trimmable to +-5% accuracy -- Time-out periods range from 0.2ms to ~13s with a 0.2ms resolution Input/Output -- Up to 152 general-purpose input/output (I/O) pins plus 2 input-only pins -- Hysteresis and configurable pull up/pull down device on all input pins -- Configurable drive strength on all output pins Package Options -- 208-pin MAPBGA -- 144-pin low-profile quad flat-pack (LQFP) -- 112-pin low-profile quad flat-pack (LQFP) -- 80-pin quad flat-pack (QFP) 50MHz maximum CPU bus frequency, 100MHz maximum XGATE bus frequency 1.1.2 Modes of Operation Memory map and bus interface modes: * Normal and emulation operating modes -- Normal single-chip mode -- Normal expanded mode -- Emulation of single-chip mode -- Emulation of expanded mode * Special Operating Modes -- Special single-chip mode with active background debug mode -- Special test mode (Freescale use only) Low-power modes: * System stop modes -- Pseudo stop mode -- Full stop mode with fast wake-up option * System wait mode Operating system states * Supervisor state * User state MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 31 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.3 Block Diagram Figure 1-1 shows a block diagram of the MC9S12XE-Family devices 128K ... 1M bytes Flash 12K ... 64K bytes RAM 2K ... 4K bytes EEPROM VDDR VDD VDDF VDDPLL Voltage Regulator 8/10/12-bit 16-channel AN[15:0] Analog-Digital Converter ECT IOC[7:0] 16-bit 8 channel Enhanced Capture Timer TIM PTAD1 PTT PTR PTP (Int) PTJ (Wake-up Int.) PTL PTM PTH (Wake-up Int) PTS 8/10/12-bit 16-channel AN[15:0] Analog-Digital Converter ATD1 PTAD0 ATD0 PAD[15:0] PAD[31:16] PT[7:0] CPU12X Debug Module Single-wire Background 4 address breakpoints Debug Module 2 data breakpoints 512 Byte Trace Buffer BKGD EXTAL XTAL 16-bit 8 channel Timer IOC[7:0] PR[7:0] Amplitude Controlled Low Power Pierce or Full drive Pierce Oscillator IPLL with Frequency Modulation option Clock Monitor COP Watchdog Periodic Interrupt Async. Periodic Int. PWM PWM[7:0] 8-bit 8 channel Pulse Width Modulator RXD SCI0 TXD Asynchronous Serial IF RXD SCI1 TXD Asynchronous Serial IF SPI0 MISO MOSI SCK SS MISO MOSI SCK SS MISO MOSI SCK SS RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXCAN TXCAN RXD TXD RXD TXD RXD TXD RXD TXD RXD TXD PP[7:0] PS0 PS1 PS2 PS3 PS4 PS5 PS6 PS7 PH0 PH1 PH2 PH3 PH4 PH5 PH6 PH7 PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7 PL0 PL1 PL2 PL3 PL4 PL5 PL6 PL7 PJ0 PJ1 PJ2 PJ3 PJ4 PJ5 PJ6 PJ7 INT Enhanced Multilevel Interrupt Module RESET TEST PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PK[7:0] Reset Generation and Test Entry XIRQ IRQ RW/WE LSTRB/LDS ECLK MODA/TAGLO/RE MODB/TAGHI XCLKS/ECLKX2 PTE X XGATE MPU Memory Protection 8 regions Synchronous Serial IF SPI1 Synchronous Serial IF SPI2 Synchronous Serial IF CAN0 msCAN 2.0B CAN1 msCAN 2.0B CAN2 msCAN 2.0B CAN3 msCAN 2.0B SCI4 Asynchronous Serial IF SCI5 Asynchronous Serial IF SCI6 Asynchronous Serial IF SCI7 Asynchronous Serial IF SCI2 Asynchronous Serial IF IIC1 Inter IC Module CAN4 msCAN 2.0B PTK EWAIT ADDR[22:16] ADDR[15:8] Non-Multiplexed External Bus Interface PIT 8ch 16-bit Timer PA[7:0] PTB PTA PB[7:0] ADDR[7:0] PTC PC[7:0] DATA[15:8] PTD PD[7:0] PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 DATA[7:0] CS0 CS1 CS2 CS3 SDA SCL RXD TXD PTF IIC0 Inter IC Module SCI3 Asynchronous Serial IF SDA SCL RXCAN TXCAN Figure 1-1. MC9S12XE-Family Block Diagram MC9S12XE-Family Reference Manual , Rev. 1.21 32 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.4 Device Memory Map Table 1-1. Device Register Memory Map Address 0x0000-0x0009 0x000A-0x000B 0x000C-0x000D 0x000E-0x000F 0x0010-0x0017 0x0018-0x0019 0x001A-0x001B 0x001C-0x001F 0x0020-0x002F 0x0030-0x0031 0x0032-0x0033 0x0034-0x003F 0x0040-0x007F 0x0080-0x00AF 0x00B0-0x00B7 0x00B8-0x00BF 0x00C0-0x00C7 0x00C8-0x00CF 0x00D0-0x00D7 0x00D8-0x00DF 0x00E0-0x00E7 0x00E8-0x00EF 0x00F0-0x00F7 0x00F8-0x00FF 0x0100-0x0113 0x0114-0x011F 0x0120-0x012F 0x0130-0x0137 0x0138-0x013F 0x0140-0x017F 0x0180-0x01BF 0x01C0-0x01FF Module PIM (port integration module) MMC (memory map control) PIM (port integration module) EBI (external bus interface) MMC (memory map control) Reserved Device ID register PIM (port integration module) DBG (debug module) Reserved PIM (port integration module) ECRG (clock and reset generator) ECT (enhanced capture timer 16-bit 8-channel)s ATD1 (analog-to-digital converter 12-bit 16-channel) IIC1 (inter IC bus) SCI2 (serial communications interface) SCI3 (serial communications interface) SCI0 (serial communications interface) SCI1 (serial communications interface) SPI0 (serial peripheral interface) IIC0 (inter IC bus) Reserved SPI1 (serial peripheral interface) SPI2 (serial peripheral interface) FTM control registers MPU (memory protection unit) INT (interrupt module) SCI4 (serial communications interface) SCI5 (serial communications interface) CAN0 CAN1 CAN2 Size (Bytes) 10 2 2 2 8 2 2 4 16 2 2 12 64 48 8 8 8 8 8 8 8 8 8 8 20 12 16 8 8 64 64 64 Table 1-1 shows the device register memory map. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 33 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-1. Device Register Memory Map (continued) Address 0x0200-0x023F 0x0240-0x027F 0x0280-0x02BF 0x02C0-0x02EF 0x02F0-0x02F7 0x02F8-0x02FF 0x0300-0x0327 0x0328-0x032F 0x0330-0x0337 0x0338-0x033F 0x0340-0x0367 0x0368-0x037F 0x0380-0x03BF 0x03C0-0x03CF 0x03D0-0x03FF 0x0400-0x07FF CAN3 PIM (port integration module) CAN4 ATD0 (analog-to-digital converter 12 bit 16-channel) Voltage regulator Reserved PWM (pulse-width modulator 8 channels) Reserved SCI6 (serial communications interface) SCI7 (serial communications interface) PIT (periodic interrupt timer) PIM (port integration module) XGATE Reserved TIM (timer module) Reserved Module Size (Bytes) 64 64 64 48 8 8 40 8 8 8 40 24 64 16 48 1024 NOTE Reserved register space shown in Table 1-1 is not allocated to any module. This register space is reserved for future use. Writing to these locations have no effect. Read access to these locations returns zero. 1.1.5 Address Mapping Figure 1-2 shows S12XE CPU & BDM local address translation to the global memory map. It indicates also the location of the internal resources in the memory map. EEEPROM size is presented like a fixed 256 KByte in the memory map. MC9S12XE-Family Reference Manual , Rev. 1.21 34 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family CPU and BDM Local Memory Map 0x00_0000 0x00_07FF Global Memory Map 2K REGISTERS Unimplemented RAM RAM_LOW RAM 2K REGISTERS 1K EEPROM window 1K EEPROM 4K RAM window 8K RAM 0x4000 0x13_FFFF CS2 0x1F_FFFF 0x8000 External Space CS1 16K FLASH window PPAGE 0x3F_FFFF Unimplemented FLASH Unpaged 16K FLASH 0xFFFF Reset Vectors FLASH_LOW FLASH 0x7F_FFFF Unpaged 16K FLASH RPAGE 256 K EEEPROM RESOURCES EPAGE 0x0F_FFFF RAMSIZE 0x0000 0x0800 0x0C00 0x1000 0x2000 NOTE: On smaller derivatives the flash memory map is split into 2 ranges separated by an unimplemeted range, as depicted by the dashed lines. For more information refer to tables below and MMC section. Figure 1-2. MC9S12XE100 Global Memory Map MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 35 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 FLASHSIZE CS0 0xC000 CS3 Chapter 1 Device Overview MC9S12XE-Family Unimplemented RAM pages are mapped externally in expanded modes. Accessing unimplemented RAM pages in single chip modes causes an illegal address reset if the MPU is not configured to flag an MPU protection error in that range. Accessing unimplemented FLASH pages in single chip modes causes an illegal address reset if the MPU is not configured to flag an MPU protection error in that range. The PARTID value should be referenced regarding the specific memory map for any given device. For devices sharing the same part ID, the memory regions which are implemented on the larger device but not supported on the smaller device are implemented but untested on that smaller device. These regions do not appear as unimplemented in the memory map and do not result in an illegal address reset if erroneously accessed. Table 1-2. Unimplemented Range Mapping to Part ID Mask Set Number xM22E xM48H xM25J xM53J Part ID $CC8x $CC9x $C48x $C08x RAM_LOW 0x0F_0000 0x0F_0000 0x0F_8000 0x0F_C000 EE_LOW 0x13_F000 0x13_F000 0x13_F000 0x13_F000 Flash Blocks B3, B2, B1S, B1N, B0 B3, B2, B1S, B1N, B0 B1N, B1S, B0 B1S, B0(128K) Registers 2K 2K 2K 2K From the above the following examples can be derived. The 9S12XEP768 is currently only available as a 9S12XEP100 die, thus the unimplemented FLASH pages are those of the 9S12XEP100 device map. The 9S12XEQ384, 9S12XEG384, 9S12XES384 are currently only available as a 9S12XEQ512 die, thus the unimplemented FLASH pages are those of the 9S12XEQ512 device map. The 9S12XEG128 is currently only available as a 9S12XET256 die, thus the unimplemented FLASH pages are those of the 9S12XET256 device map. The range between 0x10_0000 and 0x13_FFFF is mapped to EEPROM resources. The actual EEPROM and dataflash block sizes are listed in Table 1-4. Within EEPROM resource range an address range exists which is neither used by EEPROM resources nor remapped to external resources via chip selects (see the FTM/MMC descriptions for details). These ranges do not constitute unimplemented areas. Accessing reserved registers within the 2K register space does not generate an illegal address reset. The fixed 8K RAM default location in the global map is 0x0F_E000- 0x0F_FFFF. This is subject to remapping when configuring the local address map for a larger RAM access range. MC9S12XE-Family Reference Manual , Rev. 1.21 36 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Figure 1-3 shows XGATE local address translation to the global memory map. It indicates also the location of used internal resources in the memory map. Table 1-3. XGATE Resources Internal Resource XGATE RAM Size /KByte 32K (1) $Address XGRAM_LOW = 0x0F_8000 FLASH 30K XGFLASH_HIGH = 0x78_8000 1. This value is calculated by the following formula: (64K -2K- XGRAMSIZE) Table 1-4. Derivative Dependent Memory Parameters Device 9S12XEP100 9S12XEP768 9S12XEQ512 9S12XEx384 9S12XET256 9S12XEA256 (6) FLASH_LOW 0x70_0000 0x74_0000 0x78_0000 0x78_0000(5) 0x78_0000(7) PPAGE (1) RAM_LOW 0x0F_0000 0x0F_4000 0x0F_8000 0x0F_A000 0x0F_C000 RPAGE (2) EE_LOW 0x13_F000 0x13_F000 0x13_F000 0x13_F000 0x13_F000 EPAGE 4(3) + 32(4) 4 + 32 4 + 32 4 + 32 4 + 32 64 48 32 24 16 16 12 8 6 4 9S12XEG128 9S12XEA1286 0x78_0000(8) 8 0x0F_D000 3 0x13_F800 2 + 32 1. Number of 16K pages addressable via PPAGE register 2. Number of 4K pages addressing the RAM. RAM can also be mapped to 0x4000 - 0x7FFF 3. Number of 1K pages addressing the Cache RAM via the EPAGE register counting downwards from 0xFF 4. Number of 1K pages addressing the Data flash via the EPAGE register starting upwards from 0x00 5. The 384K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 256K block from 0x7C_0000 to 0x7F_FFFF 6. The 9S12XEA devices are a special bondout for access to extra ADC channels in 80QFP. Available in 80QFP only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. 7. The 256K memory map is split into a 128K block from 0x78_0000 to 0x79_FFFF and a 128K block from 0x7E_0000 to 0x7F_FFFF 8. The 128K memory map is split into a 64K block from 0x78_0000 to 0x78_FFFF and a 64K block from 0x7F_0000 to 0x7F_FFFF Table 1-5. Derivative Dependent Flash Block Mapping Device 9S12XEP100 9S12XEP768 9S12XEQ512 9S12XEx384 0x70_0000 B3 -- -- -- 0x74_0000 B2 B2 -- -- 0x78_0000 B1S B1S B1S B1S 0x7A_0000 B1N B1N B1N -- 0x7C_0000 B0 B0 B0 B0 0x7E_0000 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 37 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-5. Derivative Dependent Flash Block Mapping (continued) Device 9S12XET256 9S12XEA256 (1) 0x70_0000 -- 0x74_0000 -- 0x78_0000 B1S 0x7A_0000 -- 0x7C_0000 -- 0x7E_0000 B0(128K) 9S12XEG128 9S12XEA1281 -- -- B1S (64K) -- -- B0 (64K) 1. The 9S12XEA devices are special bondouts for access to extra ADC channels in 80QFP. Available in 80QFP only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. Block B1 is divided into two 128K blocks. The XGATE is always mapped to block B1S. On the 9S12XEG128 the flash is divided into two 64K blocks B0 and B1S, the B1S range extending from 0x78_0000 to 0x78_FFFF, the B0 range extending from 0x7F_0000 to 0x7F_FFFF. The block B0 is a reduced size 128K block on the 256K derivative. On the larger derivatives B0 is a 256K block. The block B0 is a reduced size 64K block on the 128K derivative. MC9S12XE-Family Reference Manual , Rev. 1.21 38 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family XGATE Local Memory Map 0x00_0000 0x00_07FF Global Memory Map Registers 0x0000 Registers 0x0800 RAM 0x0F_FFFF XGRAMSIZE XGRAM_LOW RAMSIZE FLASHSIZE 39 FLASH RAM 0x78_0800 FLASH XGFLASH_HIGH 0xFFFF 0x7F_FFFF Figure 1-3. XGATE Global Address Mapping MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.1.6 Detailed Register Map The detailed register map is listed in Appendix A. 1.1.7 Part ID Assignments The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B). The read-only value is a unique part ID for each revision of the chip. Table 1-6 shows the assigned part ID number and Mask Set number. MC9S12XE-Family Reference Manual , Rev. 1.21 40 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The Version ID is a word located in a flash information row at 0x40_00E8. The version ID number indicates a specific version of internal NVM variables used to patch NVM errata. The default is no patch (0xFFFF). Table 1-6. Assigned Part ID Numbers Device MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP100 MC9S12XEP768 (2) 2 Mask Set Number 0M22E 1M22E 2M22E 0M48H 1M48H 2M48H 3M48H 4M48H 5M48H 4M48H 5M48H 0M25J 1M25J 2M25J 3M25J 2M25J 3M25J 2M25J 3M25J 2M25J 3M25J 0M53J 1M53J 2M53J 1M53J 2M53J 1M53J 2M53J 1M53J Part ID(1) 0xCC80 0xCC80 0xCC82 0xCC90 0xCC91 0xCC92 0xCC93 0xCC94 0xCC94 0xCC94 0xCC94 0xC480 0xC481 0xC482 0xC482 0xC482 0xC482 0xC482 0xC482 0xC482 0xC482 0xC080 0xC081 0xC081 0xC081 0xC081 0xC081 0xC081 0xC081 Version ID 0xFFFF 0xFFFF 0xFFFF 0xFFFF 0xFFFF 0xFFFF 0xFFFF 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0xFFFF 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0x0004 0xFFFF 0x0004 MC9S12XEP768 MC9S12XEQ512 MC9S12XEQ512 MC9S12XEQ512 MC9S12XEQ512 MC9S12XEQ384 (3) MC9S12XEQ3843 MC9S12XEG384 MC9S12XEG384 MC9S12XES384 3 3 3 MC9S12XES3843 MC9S12XET256 MC9S12XET256 MC9S12XET256 MC9S12XEA256 MC9S12XEA256 MC9S12XEG128 (4) 4 MC9S12XEG128 MC9S12XEA1284 2M53J 0xC081 MC9S12XEA1284 1. The coding is as follows: Bit 15-12: Major family identifier Bit 11-6: Minor family identifier Bit 5-4: Major mask set revision number including FAB transfers Bit 3-0: Minor -- non full -- mask set revision 2. Currently available as MC9S12XEP100 die only 3. Currently available as MC9S12XEQ512 die only 4. Currently available as MC9S12XET256 die only 1.2 Signal Description MC9S12XE-Family Reference Manual Rev. 1.21 41 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal properties, and detailed discussion of signals. It is built from the signal description sections of the Block User Guides of the individual IP blocks on the device. 1.2.1 Device Pinout The MC9S12XE-Family offers pin-compatible packaged devices to assist with system development and accommodate expansion of the application. NOTE Smaller derivatives within the MC9S12XE-Family feature a subset of the listed modules. Refer to Appendix D Derivative Differences for more information about derivative device module subset and to Table 1-7. Port Availability by Package Option and Table 1-9. Pin-Out Summary for details of pins available in different package options. The MC9S12XE-Family devices are offered in the following package options: * 208-pin MAPBGA package with an external bus interface (address/data bus) * 144-pin LQFP package with an external bus interface (address/data bus) * 112-pin LQFP without external bus interface * 80-pin QFP without external bus interface MC9S12XE-Family Reference Manual , Rev. 1.21 42 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1 A B C D E F G H J K L M N P R T N.C. N.C. PJ2 PK1 PK0 PR1 PT2 PR3 PT5 PR6 PK5 PJ0 PC2 PB0 N.C. N.C. 2 N.C. PP2 PP1 PJ3 PK3 PR0 PT3 PR4 PR5 PT7 PJ1 PC0 PC3 PB3 PB5 N.C. 3 PP7 PP6 PP4 PP0 PK2 PT0 PR2 PT4 PT6 PK4 4 PM0 PF7 PP5 PP3 PK6 VDDX PT1 VDDF VSS1 PR7 5 PM1 PF6 PK7 VDDX 6 PF5 PF4 PM2 PM3 7 PF3 PF2 PM4 PM5 8 PF1 PF0 PJ5 PJ4 9 PJ6 10 PS6 11 PS5 12 PS3 13 14 15 16 N.C. PM6 PAD19 N.C. TEST PS4 PS7 PS2 PS1 PAD23 PAD21 PAD18 PAD31 N.C. PM7 PAD20 VRL PAD16 PAD07 PAD14 PJ7 VDDX PS0 PAD22 VRH PAD17 PAD30 PAD29 VSSA PAD15 PAD06 PAD28 VDDA PAD05 PAD13 PAD27 VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VSSX VDDA PAD12 PAD04 PAD11 VSSA PAD26 PAD03 PAD10 VSS2 PAD09 PAD25 PAD02 VDD VDDX PA6 PD7 PAD24 PAD01 PD4 PAD00 PAD08 PA2 PA1 PA0 PD3 PD2 PD5 PA5 PA3 PE3 N.C. PD6 PA7 PA4 N.C. N.C. BKGD VDDX PB1 PB2 PB4 PB6 PC5 PC1 PC7 PC4 PB7 PL3 PL1 PL2 PC6 PH7 PE6 PL0 PH6 PH5 VDDX VDDR VSS3 PH3 PL6 VDD PLL PH1 PH0 PH2 VDD PLL VDDX PE2 PL4 PL5 PE1 PE0 PD1 PD0 PE4 RESET PL7 PH4 PE7 PE5 VSS PLL VSS EXTAL XTAL PLL Figure 1-4. - Pin Assignments, 208 MAPBGA Package MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 43 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KPW5/PWM5/MOSI2/TIMIOC5 PP6/KWP6/PWM6/SS2/TIMIOC6 PP7/KWP7/PWM7/SCK2/TIMIOC7 PK7/ROMCTL/EWAIT VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ4/KWJ4/SDA1/CS0 PJ5/KWJ5/SCL1/CS2 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXACAN0 TEST PS7/SS0 PS6/SCK0 PS5/MOSI0 PS4/MISO0 PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 PM6/RXCAN3/RXCAN4/RXD3 PM7/TXCAN3/TXCAN4/TXD3 PAD23/AN23 PAD22/AN22 PAD21/AN21 PAD20/AN20 PAD19/AN19 PAD18/AN18 VSSA1 VRL TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 CS1/KWJ2/PJ2 ACC/ADDR22/PK6 ADDR19/PK3 IQSTAT2/ADDR18/PK2 IQSTAT1/ADDR17/PK1 IQSTAT0/ADDR16/PK0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 ACC/ADDR21/PK5 ACC/ADDR20/PK4 TXD2/KWJ1/PJ1 RXD2/KWJ0/PJ0 MODC/BKGD VDDX4 VSSX4 DATA8/PC0 DATA9/PC1 DATA10/PC2 DATA11/PC3 UDS/ADDR0/PB0 ADDR1/PB1 ADDR2/PB2 ADDR3/PB3 ADDR4/PB4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 MC9S12XE-Family 144 LQFP Pins shown in BOLD-ITALICS neither available on the 112 LQFP nor on the 80 QFP Package Option Pins shown in BOLD are not available on the 80 QFP package VRH VDDA1 PAD17/AN17 PAD16/AN16 PAD15/AN15 PAD07/AN07 PAD14/AN14 PAD06/AN06 PAD13/AN13 PAD05/AN05 PAD12/AN12 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PD7/DATA7 PD6/DATA6 PD5/DATA5 PD4/DATA4 VDDX3 VSSX3 PA7/ADDR15 PA6/ADDR14 PA5/ADDR13 PA4/ADDR12 PA3/ADDR11 PA2/ADDR10 PA1/ADDR9 PA0/ADDR8 Figure 1-5. MC9S12XE-Family Pin Assignments 144-pin LQFP Package 44 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 ADDR5/PB5 ADDR6/PB6 ADDR7/PB7 DATA12/PC4 DATA13/PC5 DATA14/PC6 DATA15/PC7 TXD5/SS2/KWH7/PH7 RXD5/SCK2/KWH6/PH6 TXD4/MOSI2/KWH5/PH5 RXD4/MISO2/KWH4/PH4 XCLKS/ECLK2X/PE7 TAGHI/MODB/PE6 RE/TAGLO/MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL TXD7/SS1/KWH3/PH3 RXD7/SCK1/KWH2/PH2 TXD6/MOSI1/KWH1/PH1 RXD6/MISO1/KWH0/PH0 DATA0/PD0 DATA1/PD1 DATA2/PD2 DATA3/PD3 EROMCTL/LDS/LSTRB/PE3 WE/RW/PE2 IRQ/PE1 XIRQ/PE0 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor Chapter 1 Device Overview MC9S12XE-Family Figure 1-6. MC9S12XE-Family Pin Assignments 112-pin LQFP Package Freescale Semiconductor PB5 PB6 PB7 TXD5/SS2/KWH7/PH7 RXD5/SCK2/KWH6/PH6 TXD4/MOSI2/KWH5/PH5 RXD4/MISO2/KWH4/PH4 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL TXD7/SS1/KWH3/PH3 RXD7/SCK1/KWH2/PH2 TXD6/MOSI1/KWH1/PH1 RXD6/MISO1/KWH0/PH0 PE3 PE2 IRQ/PE1 XIRQ/PE0 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 PK3 PK2 PK1 PK0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 PK5 PK4 TXD2/KWJ1/PJ1 RXD2/KWJ0/PJ0 MODC/BKGD PB0 PB1 PB2 PB3 PB4 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KPW5/PWM5/MOSI2/TIMIOC5 PP6/KWP6/PWM6/SS2/TIMIOC6 PP7/KWP7/PWM7/SCK2/TIMIOC7 PK7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS7/SS0 PS6/SCK0 PS5/MOSI0 PS4/MISO0 PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 PM6/RXCAN3/RXCAN4/RXD3 PM7/TXCAN3/TXCAN4/TXD3 VSSA1 VRL 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 Pins shown in BOLD are not available on the 80 QFP package 67 66 65 64 63 62 61 60 59 58 57 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 MC9S12XE-Family 112LQFP VRH VDDA1 PAD15/AN15 PAD07/AN07 PAD14/AN14 PAD06/AN06 PAD13/AN13 PAD05/AN05 PAD12/AN12 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 MC9S12XE-Family Reference Manual Rev. 1.21 45 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family PB5 PB6 PB7 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL PE3 PE2 Figure 1-7. MC9S12XE-Family Pin Assignments 80-pin QFP Package MC9S12XE-Family Reference Manual , Rev. 1.21 46 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 IRQ/PE1 XIRQ/PE0 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 MODC/BKGD PB0 PB1 PB2 PB3 PB4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KWP5/PWM5/MOSI2/TIMIOC5 PP7/KWP7/PWM7/SCK2/TIMIOC7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 VSSA1 VRL MC9S12XE-Family 80QFP VRH VDDA1 PAD07/AN07 PAD06/AN06 PAD05/AN05 PAD04/AN04 PAD03/AN03 PAD02/AN02 PAD01/AN01 PAD00/AN00 VSS2 VDD PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Chapter 1 Device Overview MC9S12XE-Family PB5 PB6 PB7 ECLK2X/XCLKS/PE7 MODB/PE6 MODA/PE5 ECLK/PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL PE3 PE2 Figure 1-8. MC9S12XEA256/MC9S12XEA128 80-pin QFP Package Pin Assignment NOTE SPECIAL BOND-OUT TO PROVIDE ACCESS TO EXTRA ADC CHANNELS IN 80QFP. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. THE MC9S12XET256 AND MC9S12XEG128 USE THE STANDARD 80QFP BOND-OUT, COMPATIBLE WITH OTHER FAMILY MEMBERS. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 47 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 IRQ/PE1 XIRQ/PE0 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 TIMIOC3/SS1/PWM3/KWP3/PP3 TIMIOC2/SCK1/PWM2/KWP2/PP2 TIMIOC1/MOSI1/PWM1/KWP1/PP1 TIMIOC0/MISO1/PWM0/KWP0/PP0 IOC0/PT0 IOC1/PT1 IOC2/PT2 IOC3/PT3 VDDF VSS1 IOC4/PT4 VREGAPI/IOC5/PT5 IOC6/PT6 IOC7/PT7 MODC/BKGD PB0 PB1 PB2 PB3 PB4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 PP4/KWP4/PWM4/MISO2/TIMIOC4 PP5/KWP5/PWM5/MOSI2/TIMIOC5 PP7/KWP7/PWM7/SCK2/TIMIOC7 VDDX1 VSSX1 PM0/RXCAN0 PM1/TXCAN0 PM2/RXCAN1/RXCAN0/MISO0 PM3/TXCAN1/TXCAN0/SS0 PM4/RXCAN2/RXCAN0/RXCAN4/MOSI0 PM5/TXCAN2/TXCAN0/TXCAN4/SCK0 PJ6/KWJ6/RXCAN4/SDA0/RXCAN0 PJ7/KWJ7/TXCAN4/SCL0/TXCAN0 TEST PS3/TXD1 PS2/RXD1 PS1/TXD0 PS0/RXD0 VSSA1 VRL MC9S12XEA256 MC9S12XEA128 80QFP VRH VDDA1 PAD07/AN07 PAD06/AN06 PAD05/AN05 PAD04/AN04 PAD11/AN11 PAD03/AN03 PAD10/AN10 PAD02/AN02 PAD09/AN09 PAD01/AN01 PAD08/AN08 PAD00/AN00 VSS2 VDD PA3 PA2 PA1 PA0 Chapter 1 Device Overview MC9S12XE-Family 1.2.2 Pin Assignment Overview Table 1-7 provides a summary of which Ports are available for each package option. Routing of pin functions is summarized in Table 1-8. Table 1-9 provides a pin out summary listing the availability of individual pins for each package option. MC9S12XE-Family Reference Manual , Rev. 1.21 48 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10 provides a list of individual pin functionality Table 1-7. Port Availability by Package Option Port Port AD/ADC Channels Port A pins Port B pins Port C pins Port D pins Port E pins inc. IRQ/XIRQ input only Port F Port H Port J Port K Port L Port M Port P Port R Port S Port T Sum of Ports I/O Power Pairs VDDX/VSSX 208 MAPBGA 32/32 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 152 7/7 144 LQFP 24/24 8 8 8 8 8 0 8 7 8 0 8 8 0 8 8 119 4/4 112 LQFP 16/16 8 8 0 0 8 0 8 4 7 0 8 8 0 8 8 91 2/2 Standard 80 QFP 8/8 8 8 0 0 8 0 0 2 0 0 6 7 0 4 8 59 2/2 XEA256(1) 80 QFP 12/12 4 8 0 0 8 0 0 2 0 0 6 7 0 4 8 59 2/2 1. The 9S12XEA256 is a special bondout for access to extra ADC channels in 80QFP. Available in 80QFP / 256K memory size only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. The 9S12XET256 is the standard 256K/80QFP bondout, compatible with other family members. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 49 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-8. Peripheral - Port Routing Options(1) CAN0 CAN1 CAN2 CAN3 CAN4 SCI0 SCI1 SCI2 SCI3 SCI4 SCI5 SCI6 SCI7 SPI0 SPI1 SPI2 CS0 CS1 CS2 CS3 X X X O O O O O O O X X X X O IIC0 IIC1 TIM X O X O PF[0] PF[1] PF[2] PF[3] PF[5:4] PF[7:6] PH[1:0] PH[3:2] PH[5:4] PH[7:6] PJ[0] PJ[1] PJ[2] PJ[3] PJ[4] PJ[5] PJ[7:6] PL[1:0] PL[3:2] PL[5:4] PL[7:6] PM[1:0] PM[3:2] PM[5:4] PM[7:6] PP[3:0] PP[7:4] PR[7:0] O X X O O O X X O O X X X O X X X X O O O X X X O O MC9S12XE-Family Reference Manual , Rev. 1.21 50 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-8. Peripheral - Port Routing Options(1) (continued) CAN0 CAN1 CAN2 CAN3 CAN4 SCI0 SCI1 SCI2 SCI3 SCI4 SCI5 SCI6 SCI7 SPI0 SPI1 SPI2 CS0 CS1 CS2 CS3 IIC0 IIC1 TIM 51 PS[1:0] PS[3:2] PS[7:4] O O O 1. "O" denotes reset condition, "X" denotes a possible rerouting under software control Table 1-9. Pin-Out Summary (Sheet 1 of 7) 208 MAPBGA D4 B2 C2 D3 D2 C1 E4 E2 E3 D1 E1 VDDX VSSX F3 F2 G4 F1 G1 G3 G2 H1 H4 15 13 9 14 12 8 13 11 7 12 10 6 11 9 5 5 6 7 8 9 10 5 6 7 8 LQFP 144 1 2 3 4 LQFP 112 1 2 3 4 QFP(1) 80 1 2 3 4 Pin PP3 PP2 PP1 PP0 PJ3 PJ2 PK6 PK3 PK2 PK1 PK0 VDDX7 VSSX7 PT0 PR0 PT1 PR1 PT2 PR2 PT3 PR3 VDDF IOC0 TIMIOC0 IOC1 TIMIOC1 IOC2 TIMIOC2 IOC3 TIMIOC3 2nd Func. KWP3 KWP2 KWP1 KWP0 KWJ3 KWJ2 ADDR22 ADDR19 ADDR18 ADDR17 ADDR16 CS1 ACC2 IQSTAT3 IQSTAT2 IQSTAT1 IQSTAT0 3rd Func. PWM3 PWM2 PWM1 PWM0 4th Func. SS1 SCK1 MOSI1 MISO1 5th Func. TIMIOC3 TIMIOC2 TIMIOC1 TIMIOC0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 2 of 7) 208 MAPBGA J4 H3 H2 J1 J2 J3 K1 K2 K4 L1 K3 L2 M1 L3 VDDX VSSX M2 M4 N1 N2 P1 M3 N3 P2 P3 R2 R3 R4 P4 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 24 25 26 27 28 29 30 31 16 17 18 19 20 21 22 23 19 20 21 22 23 15 20 18 14 19 17 13 18 16 12 LQFP 144 16 17 LQFP 112 14 15 QFP(1) 80 10 11 Pin VSS1 PT4 PR4 PT5 PR5 PT6 PR6 PT7 PR7 PK5 PK4 PJ1 PJ0 BKGD VDDX4 VSSX4 PC0 PC1 PC2 PC3 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC4 DATA8 DATA9 DATA10 DATA11 ADDR0 ADDR1 ADDR2 ADDR3 ADDR4 ADDR5 ADDR6 ADDR7 DATA12 IVD0 IVD1 IVD2 IVD3 IVD4 IVD5 IVD6 IVD7 UDS IOC4 TIMIOC4 IOC5 TIMIOC5 IOC6 TIMIOC6 IOC7 TIMIOC7 ADDR21 ADDR20 KWJ1 KWJ0 MODC ACC1 ACC0 TXD2 RXD2 CS3 VREGAPI 2nd Func. 3rd Func. 4th Func. 5th Func. MC9S12XE-Family Reference Manual , Rev. 1.21 52 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 3 of 7) 208 MAPBGA T3 R5 N4 T4 T5 P5 R6 N5 T6 P6 R7 T7 N6 R8 P7 VSSX VDDX P8 N8 N9 R9/T8 T9 T10 R10/T11 P9 N10 P10 R11 T12 62 50 61 49 47 48 49 50 51 52 53 54 55 56 57 58 59 60 35 36 37 38 39 40 41 42 43 44 45 46 47 48 24 25 26 27 28 29 30 31 32 33 34 35 36 46 34 45 33 44 32 LQFP 144 41 42 43 LQFP 112 QFP(1) 80 Pin PC5 PC6 PC7 PL3 PH7 PL2 PH6 PL1 PH5 PL0 PH4 PE7 PE6 PE5 PE4 VSSX2 VDDX2 RESET VDDR VSS3 VSSPLL EXTAL XTAL VDDPLL PL7 PH3 PL6 PH2 PL5 TXD7 KWH3 RXD7 KWH2 TXD6 SCK1 RXD7 SS1 TXD7 2nd Func. DATA13 DATA14 DATA15 TXD5 KWH7 RXD5 KWH6 TXD4 KWH5 RXD4 KWH4 XCLKS MODB MODA ECLK MISO2 ECLKX2 TAGHI TAGLO RE RXD4 MOSI2 TXD4 SCK2 RXD5 SS2 TXD5 3rd Func. 4th Func. 5th Func. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 53 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 4 of 7) 208 MAPBGA N11 R12 P11 T13 R13 T14 R14 VDDX VSSX R15 P12 N13 P13 P14 N14 M14 P15 P16 N15 M13 N16 VSSX VDDX L14 M15 M16 K14 K13 J13 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 65 66 49 50 53 54 55 56 57 58 59 60 61 62 63 64 37 38 39 40 41 42 43 44 45 46 47 48 64 65 66 67 68 52 LQFP 144 63 LQFP 112 51 QFP(1) 80 Pin PH1 PL4 PH0 PD0 PD1 PD2 PD3 VDDX5 VSSX5 PE3 PE2 PE1 PE0 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 VSSX3 VDDX3 PD4 PD5 PD6 PD7 VDD VSS2 DATA4 DATA5 DATA6 DATA7 LSTRB RW IRQ XIRQ ADDR8 ADDR9 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15 IVD8 IVD9 IVD10 IVD11 IVD12 IVD13 IVD14 IVD15 LDS WE EROMCTL 2nd Func. KWH1 RXD6 KWH0 DATA0 DATA1 DATA2 DATA3 MISO1 RXD6 3rd Func. MOSI1 4th Func. TXD6 5th Func. MC9S12XE-Family Reference Manual , Rev. 1.21 54 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 5 of 7) 208 MAPBGA L15 L16 K15 K16 J14 J15 J16 H16 H14 H13 G13 H15 G16 F16 G15 G14 E16 F14 F15 D16 E15 C16 D15 C15 E14 B15 C14 D14 F13 105 106 107 83 59 103 104 81 82 58 101 102 79 80 57 99 100 77 78 56 97 98 75 76 55 95 96 73 74 54 93 94 71 72 53 91 92 69 70 52 LQFP 144 89 90 LQFP 112 67 68 QFP(1) 80 51 Pin PAD00 PAD08 PAD24 PAD01 PAD09 PAD25 PAD02 PAD10 PAD26 VSSA2 VDDA2 PAD03 PAD11 PAD27 PAD04 PAD12 PAD28 PAD05 PAD13 PAD29 PAD06 PAD14 PAD30 PAD07 PAD15 PAD31 PAD16 PAD17 VDDA1 AN03 AN11 AN27 AN04 AN12 AN28 AN05 AN13 AN29 AN06 AN14 AN30 AN07 AN15 AN31 AN16 AN17 2nd Func. AN00 AN08 AN24 AN01 AN09 AN25 AN02 AN10 AN26 3rd Func. 4th Func. 5th Func. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 55 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 6 of 7) 208 MAPBGA D13 C13 E13 B14 A14 C12 B13 D12 B12 C11 A13 D11 B11 C10 A12 VSSX VDDX B10 A11 A10 C9 B9 D9 A9 C8 B8 D8 A8 D7 132 100 70 131 123 124 125 126 127 128 129 130 93 94 95 96 97 98 99 67 68 69 LQFP 144 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 87 88 89 90 91 92 63 64 65 66 LQFP 112 84 85 86 QFP(1) 80 60 61 62 Pin VRH VRL VSSA1 PAD18 PAD19 PAD20 PAD21 PAD22 PAD23 PM7 PM6 PS0 PS1 PS2 PS3 VSSX6 VDDX6 PS4 PS5 PS6 PS7 TEST PJ7 PJ6 PJ5 PF0 PJ4 PF1 PM5 KWJ7 KWJ6 KWJ5 CS0 KWJ4 CS1 TXCAN2 TXCAN0 TXCAN4 SCK0 SDA1 CS0 TXCAN4 RXCAN4 SCL1 SCL0 SDA0 CS2 TXCAN0 RXCAN0 MISO0 MOSI0 SCK0 SS0 AN18 AN19 AN20 AN21 AN22 AN23 TXCAN3 RXCAN3 RXD0 TXD0 RXD1 TXD1 TXCAN4 RXCAN4 TXD3 RXD3 2nd Func. 3rd Func. 4th Func. 5th Func. MC9S12XE-Family Reference Manual , Rev. 1.21 56 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-9. Pin-Out Summary (Sheet 7 of 7) 208 MAPBGA B7 C7 A7 D6 B6 C6 A6 A5 B5 A4 B4 VSSX VDDX C5 A3 B3 C4 C3 138 139 140 141 142 143 144 106 107 108 109 110 111 112 79 80 78 76 77 137 105 75 136 104 74 135 103 73 134 102 72 133 101 71 LQFP 144 LQFP 112 QFP(1) 80 Pin PF2 PM4 PF3 PM3 PF4 PM2 PF5 PM1 PF6 PM0 PF7 VSSX1 VDDX1 PK7 PP7 PP6 PP5 PP4 ROMCTL KWP7 KWP6 KWP5 KWP4 EWAIT PWM7 PWM6 PWM5 PWM4 SCK2 SS2 MOSI2 MISO2 TIMIOC7 TIMIOC6 TIMIOC5 TIMIOC4 2nd Func. CS2 RXCAN2 CS3 TXCAN1 SDA0 RXCAN1 SCL0 TXCAN0 RXD3 RXCAN0 TXD3 RXCAN0 MISO0 TXCAN0 SS0 RXCAN0 RXCAN4 MOSI0 3rd Func. 4th Func. 5th Func. 1. Standard 80QFP only. NOTE that XEA256 80QFP is not compatible MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 57 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 1 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 EXTAL XTAL RESET TEST BKGD PAD[31:16] PAD[15:0] PA[7:0] PB[7:1] PB0 PC[7:0] PD[7:0] PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0 PF7 PF6 PF5 PF4 PF3 -- -- -- -- MODC AN[31:16] AN[15:0] -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- VDDPLL VDDPLL VDDX N.A. VDDX VDDA VDDA VDDX VDDX VDDX -- -- -- -- TAGLO -- EROMCTL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX Internal Pull Resistor Description CTRL NA NA PULLUP RESET pin Always on PER0AD1 PER1AD1 PER0AD0 PER1AD0 PUCR PUCR PUCR PUCR PUCR PUCR Up Reset State NA NA External reset Background debug DOWN Test input Disabled Port AD inputs of ATD1, analog inputs of ATD1 Disabled Port AD inputs of ATD0, analog inputs of ATD0 Disabled Port A I/O, address bus, internal visibility data Disabled Port B I/O, address bus, internal visibility data Disabled Port B I/O, address bus, upper data strobe Disabled Port C I/O, data bus Disabled Port D I/O, data bus Up Port E I/O, system clock output, clock select Port E I/O, tag high, mode input Port E I/O, read enable, mode input, tag low input Port E I/O, bus clock output Port E I/O, low byte data strobe, EROMON control Port E I/O, read/write Port E Input, maskable interrupt Port E input, non-maskable interrupt Port F I/O, interrupt, TXD of SCI3 Port F I/O, interrupt, RXD of SCI3 Port F I/O, interrupt, SCL of IIC0 Port F I/O, interrupt, SDA of IIC0 Port F I/O, interrupt, chip select 3 Oscillator pins ADDR[15:8] IVD[15:8] ADDR[7:1] ADDR0 DATA[15:8] DATA[7:0] ECLKX2 TAGHI RE ECLK LSTRB R/W IRQ XIRQ TXD3 RXD3 SCL0 SDA0 CS3 IVD[7:0] UDS -- -- XCLKS MODB MODA -- LDS WE -- -- -- -- -- -- -- While RESET pin is low: down While RESET pin is low: down PUCR PUCR PUCR PUCR PUCR PERF/ PPSF PERF/ PPSF PERF/ PPSF PERF/ PPSF PERF/ PPSF Up Up Up Up Up Up Up Up Up Up MC9S12XE-Family Reference Manual , Rev. 1.21 58 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 2 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 PF2 PF1 PF0 PH7 PH6 PH5 PH4 PH3 PH2 PH1 PH0 PJ7 CS2 CS1 CS0 KWH7 KWH6 KWH5 KWH4 KWH3 KWH2 KWH1 KWH0 KWJ7 -- -- -- SS2 SCK2 MOSI2 MISO2 SS1 SCK1 MOSI1 MISO1 TXCAN4 -- -- -- TXD5 RXD5 TXD4 RXD4 TXD7 RXD7 TXD6 RXD6 SCL0 -- -- -- -- -- -- -- -- -- -- -- TXCAN0 VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX Internal Pull Resistor Description CTRL PERF/ PPSF PERF/ PPSF PERF/ PPSF PERH/ PPSH PERH/ PPSH PERH/ PPSH Reset State Up Up Up Port F I/O, interrupt, chip select 2 Port F I/O, interrupt, chip select 1 Port F I/O, interrupt, chip select 0 Disabled Port H I/O, interrupt, SS of SPI2, TXD of SCI5 Disabled Port H I/O, interrupt, SCK of SPI2, RXD of SCI5 Disabled Port H I/O, interrupt, MOSI of SPI2, TXD of SCI4 PERH/PPSH Disabled Port H I/O, interrupt, MISO of SPI2, RXD of SCI4 PERH/PPSH Disabled Port H I/O, interrupt, SS of SPI1 PERH/PPSH Disabled Port H I/O, interrupt, SCK of SPI1 PERH/PPSH Disabled Port H I/O, interrupt, MOSI of SPI1 PERH/PPSH Disabled Port H I/O, interrupt, MISO of SPI1 PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PERJ/ PPSJ PUCR Up Port J I/O, interrupt, TX of CAN4, SCL of IIC0, TX of CAN0 Port J I/O, interrupt, RX of CAN4, SDA of IIC0, RX of CAN0 Port J I/O, interrupt, SCL of IIC1, chip select 2 Port J I/O, interrupt, SDA of IIC1, chip select 0 Port J I/O, interrupt, Port J I/O, interrupt, chip select 1 Port J I/O, interrupt, TXD of SCI2 Port J I/O, interrupt, RXD of SCI2 Port K I/O, EWAIT input, ROM on control PJ6 KWJ6 RXCAN4 SDA0 RXCAN0 VDDX Up PJ5 PJ4 PJ3 PJ2 PJ1 PJ0 PK7 KWJ5 KWJ4 KWJ3 KWJ2 KWJ1 KWJ0 EWAIT SCL1 SDA1 -- CS1 TXD2 RXD2 ROMCTL CS2 CS0 -- -- -- CS3 -- -- -- -- -- -- -- -- VDDX VDDX VDDX VDDX VDDX VDDX VDDX Up Up Up Up Up Up Up MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 59 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 3 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 PK[6:4] ADDR [22:20] ADDR [19:16] TXD7 RXD7 TXD6 RXD6 TXD5 RXD5 TXD4 RXD4 TXCAN3 RXCAN3 TXCAN2 RXCAN2 TXCAN1 RXCAN1 TXCAN0 RXCAN0 KWP7 KWP6 KWP5 PWM7 PWM6 PWM5 ACC[2:0] -- -- VDDX Internal Pull Resistor Description CTRL PUCR Reset State Up Port K I/O, extended addresses, access source for external access Extended address, PIPE status Port L I/O, TXD of SCI7 Port LI/O, RXD of SCI7 Port L I/O, TXD of SCI6 Port LI/O, RXD of SCI6 Port L I/O, TXD of SCI5 Port LI/O, RXD of SCI5 Port L I/O, TXD of SCI4 Port LI/O, RXD of SCI4 PK[3:0] PL7 PL6 PL5 PL4 PL3 PL2 PL1 PL0 PM7 PM6 PM5 PM4 PM3 PM2 PM1 PM0 PP7 PP6 PP5 IQSTAT [3:0] -- -- -- -- -- -- -- -- TXD3 RXD3 TXCAN0 RXCAN0 TXCAN0 RXCAN0 -- -- -- -- -- -- -- -- -- TXCAN4 RXCAN4 TXCAN4 RXCAN4 SS0 MISO0 -- -- SCK2 SS2 MOSI2 -- -- -- -- -- -- -- -- -- -- -- SCK0 MOSI0 -- -- -- -- TIMIOC7 TIMIOC6 TIMIOC5 VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX PUCR PERL/ PPSL PERL/ PPSL PERL/ PPSL PERL/ PPSL PERL/ PPSL PERL/ PPSL PERL/ PPSL PERL/ PPSL PERM/ PPSM Up Up Up Up Up Up Up Up Up Disabled Port M I/O, TX of CAN3 and CAN4, TXD of SCI3 VDDX PERM/PPSM Disabled Port M I/O RX of CAN3 and CAN4, RXD of SCI3 VDDX PERM/PPSM Disabled Port M I/OCAN0, CAN2, CAN4, SCK of SPI0 VDDX PERM/PPSM Disabled Port M I/O, CAN0, CAN2, CAN4, MOSI of SPI0 VDDX PERM/PPSM Disabled Port M I/O TX of CAN1, CAN0, SS of SPI0 VDDX PERM/PPSM Disabled Port M I/O, RX of CAN1, CAN0, MISO of SPI0 VDDX PERM/PPSM Disabled Port M I/O, TX of CAN0 VDDX PERM/PPSM Disabled Port M I/O, RX of CAN0 VDDX VDDX VDDX PERP/ PPSP PERP/ PPSP PERP/ PPSP Disabled Port P I/O, interrupt, channel 7 of PWM/TIM , SCK of SPI2 Disabled Port P I/O, interrupt, channel 6 of PWM/TIM, SS of SPI2 Disabled Port P I/O, interrupt, channel 5 of PWM/TIM, MOSI of SPI2 MC9S12XE-Family Reference Manual , Rev. 1.21 60 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-10. Signal Properties Summary (Sheet 4 of 4) Pin Pin Pin Pin Pin Power Name Name Name Name Name Supply Function 1 Function 2 Function 3 Function 4 Function 5 PP4 KWP4 PWM4 MISO2 TIMIOC4 VDDX Internal Pull Resistor Description CTRL PERP/ PPSP PERP/ PPSP PERP/ PPSP PERP/ PPSP PERP/ PPSP PERR/ PPSR PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERS/ PPSS PERT/ PPST PERT/ PPST PERT/ PPST Reset State Disabled Port P I/O, interrupt, channel 4 of PWM/TIM, MISO2 of SPI2 Disabled Port P I/O, interrupt, channel 3 of PWM/TIM, SS of SPI1 Disabled Port P I/O, interrupt, channel 2 of PWM/TIM, SCK of SPI1 Disabled Port P I/O, interrupt, channel 1 of PWM/TIM, MOSI of SPI1 Disabled Port P I/O, interrupt, channel 0 of PWM/TIM, MISO2 of SPI1 Disabled Port RI/O, TIM channels Up Up Up Up Up Up Up Up Port S I/O, SS of SPI0 Port S I/O, SCK of SPI0 Port S I/O, MOSI of SPI0 Port S I/O, MISO of SPI0 Port S I/O, TXD of SCI1 Port S I/O, RXD of SCI1 Port S I/O, TXD of SCI0 Port S I/O, RXD of SCI0 PP3 PP2 PP1 KWP3 KWP2 KWP1 PWM3 PWM2 PWM1 SS1 SCK1 MOSI1 TIMIOC3 TIMIOC2 TIMIOC1 VDDX VDDX VDDX PP0 KWP0 PWM0 MISO1 TIMIOC0 VDDX PR[7:0] PS7 PS6 PS5 PS4 PS3 PS2 PS1 PS0 PT[7:6] PT[5] PT[4:0] TIMIOC [7:0] SS0 SCK0 MOSI0 MISO0 TXD1 RXD1 TXD0 RXD0 IOC[7:6] IOC[5] IOC[4:0] -- -- -- -- -- -- -- -- -- -- VREGAPI -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX VDDX Disabled Port T I/O, ECT channels Disabled Port T I/O, ECT channels Disabled Port T I/O, ECT channels MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 61 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3 Detailed Signal Descriptions NOTE The pin list of the largest package version of each MC9S12XE-Family derivative gives the complete of interface signals that also exist on smaller package options, although some of them are not bonded out. For devices assembled in smaller packages all non-bonded out pins should be configured as outputs after reset in order to avoid current drawn from floating inputs. Refer to Table 1-10 for affected pins. Particular attention is drawn to Port R, which does not have enabled pull-up/pull-down devices coming out of reset. 1.2.3.1 EXTAL, XTAL -- Oscillator Pins EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived from the EXTAL input frequency. XTAL is the oscillator output. 1.2.3.2 RESET -- External Reset Pin The RESET pin is an active low bidirectional control signal. It acts as an input to initialize the MCU to a known start-up state. As an output it is driven low to indicate when any internal MCU reset source triggers. The RESET pin has an internal pull-up device. 1.2.3.3 TEST -- Test Pin NOTE The TEST pin must be tied to VSS in all applications. This input only pin is reserved for test. This pin has a pull-down device. 1.2.3.4 BKGD / MODC -- Background Debug and Mode Pin The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit at the rising edge of RESET. The BKGD pin has a pull-up device. 1.2.3.5 PAD[15:0] / AN[15:0] -- Port AD Input Pins of ATD0 PAD[15:0] are general-purpose input or output pins and analog inputs AN[15:0] of the analog-to-digital converter ATD0. 1.2.3.6 PAD[31:16] / AN[31:16] -- Port AD Input Pins of ATD1 PAD[31:16] are general-purpose input or output pins and analog inputs AN[31:16] of the analog-to-digital converter ATD1. MC9S12XE-Family Reference Manual , Rev. 1.21 62 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.7 PA[7:0] / ADDR[15:8] / IVD[15:8] -- Port A I/O Pins PA[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external address bus. In MCU emulation modes of operation, these pins are used for external address bus and internal visibility read data. 1.2.3.8 PB[7:1] / ADDR[7:1] / IVD[7:1] -- Port B I/O Pins PB[7:1] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external address bus. In MCU emulation modes of operation, these pins are used for external address bus and internal visibility read data. 1.2.3.9 PB0 / ADDR0 / UDS / IVD[0] -- Port B I/O Pin 0 PB0 is a general-purpose input or output pin. In MCU expanded modes of operation, this pin is used for the external address bus ADDR0 or as upper data strobe signal. In MCU emulation modes of operation, this pin is used for external address bus ADDR0 and internal visibility read data IVD0. 1.2.3.10 PC[7:0] / DATA [15:8] -- Port C I/O Pins PC[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external data bus. The input voltage thresholds for PC[7:0] can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for PC[7:0] are configured to reduced levels out of reset in expanded and emulation modes. The input voltage thresholds for PC[7:0] are configured to 5-V levels out of reset in normal modes. 1.2.3.11 PD[7:0] / DATA [7:0] -- Port D I/O Pins PD[7:0] are general-purpose input or output pins. In MCU expanded modes of operation, these pins are used for the external data bus. The input voltage thresholds for PD[7:0] can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage thresholds for PD[7:0] are configured to reduced levels out of reset in expanded and emulation modes. The input voltage thresholds for PC[7:0] are configured to 5-V levels out of reset in normal modes. 1.2.3.12 PE7 / ECLKX2 / XCLKS -- Port E I/O Pin 7 PE7 is a general-purpose input or output pin. ECLKX2 is a free running clock of twice the internal bus frequency, available by default in emulation modes and when enabled in other modes. The XCLKS is an input signal which controls whether a crystal in combination with the internal loop controlled Pierce oscillator is used or whether full swing Pierce oscillator/external clock circuitry is used (refer to Oscillator Configuration). An internal pullup is enabled during reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 63 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.13 PE6 / MODB / TAGHI -- Port E I/O Pin 6 PE6 is a general-purpose input or output pin. It is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is an input with a pull-down device which is only active when RESET is low. TAGHI is used to tag the high half of the instruction word being read into the instruction queue. The input voltage threshold for PE6 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE6 is configured to reduced levels out of reset in expanded and emulation modes. 1.2.3.14 PE5 / MODA / TAGLO / RE -- Port E I/O Pin 5 PE5 is a general-purpose input or output pin. It is used as an MCU operating mode select pin during reset. The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the read enable RE output. This pin is an input with a pull-down device which is only active when RESET is low. TAGLO is used to tag the low half of the instruction word being read into the instruction queue. The input voltage threshold for PE5 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. The input voltage threshold for PE5 is configured to reduced levels out of reset in expanded and emulation modes. 1.2.3.15 PE4 / ECLK -- Port E I/O Pin 4 PE4 is a general-purpose input or output pin. It can be configured to drive the internal bus clock ECLK. ECLK can be used as a timing reference. The ECLK output has a programmable prescaler. 1.2.3.16 PE3 / LSTRB / LDS / EROMCTL-- Port E I/O Pin 3 PE3 is a general-purpose input or output pin. In MCU expanded modes of operation, LSTRB or LDS can be used for the low byte strobe function to indicate the type of bus access. At the rising edge of RESET the state of this pin is latched to the EROMON bit. 1.2.3.17 PE2 / R/W / WE-- Port E I/O Pin 2 PE2 is a general-purpose input or output pin. In MCU expanded modes of operations, this pin drives the read/write output signal or write enable output signal for the external bus. It indicates the direction of data on the external bus. 1.2.3.18 PE1 / IRQ -- Port E Input Pin 1 PE1 is a general-purpose input pin and the maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode. 1.2.3.19 PE0 / XIRQ -- Port E Input Pin 0 PE0 is a general-purpose input pin and the non-maskable interrupt request input that provides a means of applying asynchronous interrupt requests. This will wake up the MCU from stop or wait mode. The XIRQ MC9S12XE-Family Reference Manual , Rev. 1.21 64 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family interrupt is level sensitive and active low. As XIRQ is level sensitive, while this pin is low the MCU will not enter STOP mode. 1.2.3.20 PF7 / TXD3 -- Port F I/O Pin 7 PF7 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 3 (SCI3). 1.2.3.21 PF6 / RXD3 -- Port F I/O Pin 6 PF6 is a general-purpose input or output pin. It can be configured as the transmit pin RXD of serial communication interface 3 (SCI3). 1.2.3.22 PF5 / SCL0 -- Port F I/O Pin 5 PF5 is a general-purpose input or output pin. It can be configured as the serial clock pin SCL of the IIC0 module. 1.2.3.23 PF4 / SDA0 -- Port F I/O Pin 4 PF4 is a general-purpose input or output pin. It can be configured as the serial data pin SDA of the IIC0 module. 1.2.3.24 PF[3:0] / CS[3:0] -- Port F I/O Pins 3 to 0 PF[3:0] are a general-purpose input or output pins. They can be configured as chip select outputs [3:0]. 1.2.3.25 PH7 / KWH7 / SS2 / TXD5 -- Port H I/O Pin 7 PH7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as slave select pin SS of the serial peripheral interface 2 (SPI2). It can be configured as the transmit pin TXD of serial communication interface 5 (SCI5). 1.2.3.26 PH6 / KWH6 / SCK2 / RXD5 -- Port H I/O Pin 6 PH6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as serial clock pin SCK of the serial peripheral interface 2 (SPI2). It can be configured as the receive pin (RXD) of serial communication interface 5 (SCI5). 1.2.3.27 PH5 / KWH5 / MOSI2 / TXD4 -- Port H I/O Pin 5 PH5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 2 (SPI2). It can be configured as the transmit pin TXD of serial communication interface 4 (SCI4). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 65 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.28 PH4 / KWH4 / MISO2 / RXD4 -- Port H I/O Pin 4 PH4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 2 (SPI2). It can be configured as the receive pin RXD of serial communication interface 4 (SCI4). 1.2.3.29 PH3 / KWH3 / SS1 -- Port H I/O Pin 3 PH3 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as slave select pin SS of the serial peripheral interface 1 (SPI1). It can also be configured as the transmit pin TXD of serial communication interface 7 (SCI7). 1.2.3.30 PH2 / KWH2 / SCK1 -- Port H I/O Pin 2 PH2 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as serial clock pin SCK of the serial peripheral interface 1 (SPI1). It can be configured as the receive pin RXD of serial communication interface 7 (SCI7). 1.2.3.31 PH1 / KWH1 / MOSI1 -- Port H I/O Pin 1 PH1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 1 (SPI1). It can also be configured as the transmit pin TXD of serial communication interface 6 (SCI6). 1.2.3.32 PH0 / KWH0 / MISO1 -- Port H I/O Pin 0 PH0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 1 (SPI1). It can be configured as the receive pin RXD of serial communication interface 6 (SCI6). 1.2.3.33 PJ7 / KWJ7 / TXCAN4 / SCL0 / TXCAN0-- PORT J I/O Pin 7 PJ7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the transmit pin TXCAN for the scalable controller area network controller 0 or 4 (CAN0 or CAN4) or as the serial clock pin SCL of the IIC0 module. 1.2.3.34 PJ6 / KWJ6 / RXCAN4 / SDA0 / RXCAN0 -- PORT J I/O Pin 6 PJ6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the receive pin RXCAN for the scalable controller area network controller 0 or 4 (CAN0 or CAN4) or as the serial data pin SDA of the IIC0 module. MC9S12XE-Family Reference Manual , Rev. 1.21 66 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.35 PJ5 / KWJ5 / SCL1 / CS2 -- PORT J I/O Pin 5 PJ5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the serial clock pin SCL of the IIC1 module. It can be also configured as chip-select output 2. 1.2.3.36 PJ4 / KWJ4 / SDA1 / CS0 -- PORT J I/O Pin 4 PJ4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the serial data pin SDA of the IIC1 module. It can also be configured as chip-select output. 1.2.3.37 PJ3 / KWJ3 -- PORT J I/O Pin 3 PJ3 is a general-purpose input or output pins. It can be configured as a keypad wakeup input. 1.2.3.38 PJ2 / KWJ2 / CS1 -- PORT J I/O Pin 2 PJ2 is a general-purpose input or output pins. It can be configured as a keypad wakeup input. It can also be configured as chip-select output. 1.2.3.39 PJ1 / KWJ1 / TXD2 -- PORT J I/O Pin 1 PJ1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the transmit pin TXD of the serial communication interface 2 (SCI2). 1.2.3.40 PJ0 / KWJ0 / RXD2 / CS3 -- PORT J I/O Pin 0 PJ0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as the receive pin RXD of the serial communication interface 2 (SCI2).It can also be configured as chip-select output 3. 1.2.3.41 PK7 / EWAIT / ROMCTL -- Port K I/O Pin 7 PK7 is a general-purpose input or output pin. During MCU emulation modes and normal expanded modes of operation, this pin is used to enable the Flash EEPROM memory in the memory map (ROMCTL). At the rising edge of RESET, the state of this pin is latched to the ROMON bit. The EWAIT input signal maintains the external bus access until the external device is ready to capture data (write) or provide data (read). The input voltage threshold for PK7 can be configured to reduced levels, to allow data from an external 3.3-V peripheral to be read by the MCU operating at 5.0 V. 1.2.3.42 PK[6:4] / ADDR[22:20] / ACC[2:0] -- Port K I/O Pin [6:4] PK[6:4] are general-purpose input or output pins. During MCU expanded modes of operation, the ACC[2:0] signals are used to indicate the access source of the bus cycle. These pins also provide the expanded addresses ADDR[22:20] for the external bus. In Emulation modes ACC[2:0] is available and is time multiplexed with the high addresses MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 67 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.43 PK[3:0] / ADDR[19:16] / IQSTAT[3:0] -- Port K I/O Pins [3:0] PK3-PK0 are general-purpose input or output pins. In MCU expanded modes of operation, these pins provide the expanded address ADDR[19:16] for the external bus and carry instruction pipe information. 1.2.3.44 PL7 / TXD7 -- Port L I/O Pin 7 PL7 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 7 (SCI7). 1.2.3.45 PL6 / RXD7 -- Port L I/O Pin 6 PL6 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 7 (SCI7). 1.2.3.46 PL5 / TXD6 -- Port L I/O Pin 5 PL5 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 6 (SCI6). 1.2.3.47 PL4 / RXD6 -- Port L I/O Pin 4 PL4 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 6 (SCI6). 1.2.3.48 PL3 / TXD5 -- Port L I/O Pin 3 PL3 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 5 (SCI5). 1.2.3.49 PL2 / RXD5 -- Port L I/O Pin 2 PL2 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 5 (SCI5). 1.2.3.50 PL1 / TXD4 -- Port L I/O Pin 1 PL1 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 4 (SCI4). 1.2.3.51 PL0 / RXD4 -- Port L I/O Pin 0 PL0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 4 (SCI4). MC9S12XE-Family Reference Manual , Rev. 1.21 68 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.52 PM7 / TXCAN3 / TXCAN4 / TXD3 -- Port M I/O Pin 7 PM7 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM7 can be configured as the transmit pin TXD3 of the serial communication interface 3 (SCI3). 1.2.3.53 PM6 / RXCAN3 / RXCAN4 / RXD3 -- Port M I/O Pin 6 PM6 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controller 3 or 4 (CAN3 or CAN4). PM6 can be configured as the receive pin RXD3 of the serial communication interface 3 (SCI3). 1.2.3.54 PM5 / TXCAN0 / TXCAN2 / TXCAN4 / SCK0 -- Port M I/O Pin 5 PM5 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controllers 0, 2 or 4 (CAN0, CAN2, or CAN4). It can be configured as the serial clock pin SCK of the serial peripheral interface 0 (SPI0). 1.2.3.55 PM4 / RXCAN0 / RXCAN2 / RXCAN4 / MOSI0 -- Port M I/O Pin 4 PM4 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controllers 0, 2, or 4 (CAN0, CAN2, or CAN4). It can be configured as the master output (during master mode) or slave input pin (during slave mode) MOSI for the serial peripheral interface 0 (SPI0). 1.2.3.56 PM3 / TXCAN1 / TXCAN0 / SS0 -- Port M I/O Pin 3 PM3 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the slave select pin SS of the serial peripheral interface 0 (SPI0). 1.2.3.57 PM2 / RXCAN1 / RXCAN0 / MISO0 -- Port M I/O Pin 2 PM2 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controllers 1 or 0 (CAN1 or CAN0). It can be configured as the master input (during master mode) or slave output pin (during slave mode) MISO for the serial peripheral interface 0 (SPI0). 1.2.3.58 PM1 / TXCAN0 -- Port M I/O Pin 1 PM1 is a general-purpose input or output pin. It can be configured as the transmit pin TXCAN of the scalable controller area network controller 0 (CAN0). 1.2.3.59 PM0 / RXCAN0 -- Port M I/O Pin 0 PM0 is a general-purpose input or output pin. It can be configured as the receive pin RXCAN of the scalable controller area network controller 0 (CAN0). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 69 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.60 PP7 / KWP7 / PWM7 / SCK2 / TIMIOC7-- Port P I/O Pin 7 PP7 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 7 output, TIM channel 7, or as serial clock pin SCK of the serial peripheral interface 2 (SPI2). 1.2.3.61 PP6 / KWP6 / PWM6 / SS2 / TIMIOC6-- Port P I/O Pin 6 PP6 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 6 output, TIM channel 6 or as the slave select pin SS of the serial peripheral interface 2 (SPI2). 1.2.3.62 PP5 / KWP5 / PWM5 / MOSI2 / TIMIOC5-- Port P I/O Pin 5 PP5 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 5 output, TIM channel 5 or as the master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 2 (SPI2). 1.2.3.63 PP4 / KWP4 / PWM4 / MISO2 / TIMIOC4-- Port P I/O Pin 4 PP4 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 4 output, TIM channel 4 or as the master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 2 (SPI2). 1.2.3.64 PP3 / KWP3 / PWM3 / SS1 / TIMIOC3-- Port P I/O Pin 3 PP3 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 3 output, TIM channel 3, or as the slave select pin SS of the serial peripheral interface 1 (SPI1). 1.2.3.65 PP2 / KWP2 / PWM2 / SCK1 / TIMIOC2-- Port P I/O Pin 2 PP2 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 2 output, TIM channel 2, or as the serial clock pin SCK of the serial peripheral interface 1 (SPI1). 1.2.3.66 PP1 / KWP1 / PWM1 / MOSI1 / TIMIOC1-- Port P I/O Pin 1 PP1 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 1 output, TIM channel 1, or master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 1 (SPI1). MC9S12XE-Family Reference Manual , Rev. 1.21 70 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.67 PP0 / KWP0 / PWM0 / MISO1 / TIMIOC0-- Port P I/O Pin 0 PP0 is a general-purpose input or output pin. It can be configured as a keypad wakeup input. It can be configured as pulse width modulator (PWM) channel 0 output, TIM channel 0 or as the master input (during master mode) or slave output (during slave mode) pin MISO of the serial peripheral interface 1 (SPI1). 1.2.3.68 PR[7:0] / TIMIOC[7:0] -- Port R I/O Pins [7:0] PR[7:0] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[7:0] of the standard timer (TIM). 1.2.3.69 PS7 / SS0 -- Port S I/O Pin 7 PS7 is a general-purpose input or output pin. It can be configured as the slave select pin SS of the serial peripheral interface 0 (SPI0). 1.2.3.70 PS6 / SCK0 -- Port S I/O Pin 6 PS6 is a general-purpose input or output pin. It can be configured as the serial clock pin SCK of the serial peripheral interface 0 (SPI0). 1.2.3.71 PS5 / MOSI0 -- Port S I/O Pin 5 PS5 is a general-purpose input or output pin. It can be configured as master output (during master mode) or slave input pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0). 1.2.3.72 PS4 / MISO0 -- Port S I/O Pin 4 PS4 is a general-purpose input or output pin. It can be configured as master input (during master mode) or slave output pin (during slave mode) MOSI of the serial peripheral interface 0 (SPI0). 1.2.3.73 PS3 / TXD1 -- Port S I/O Pin 3 PS3 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 1 (SCI1). 1.2.3.74 PS2 / RXD1 -- Port S I/O Pin 2 PS2 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 1 (SCI1). 1.2.3.75 PS1 / TXD0 -- Port S I/O Pin 1 PS1 is a general-purpose input or output pin. It can be configured as the transmit pin TXD of serial communication interface 0 (SCI0). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 71 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.3.76 PS0 / RXD0 -- Port S I/O Pin 0 PS0 is a general-purpose input or output pin. It can be configured as the receive pin RXD of serial communication interface 0 (SCI0). 1.2.3.77 PT[7:6] / IOC[7:6] -- Port T I/O Pins [7:6] PT[7:6] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[7:6] of the enhanced capture timer (ECT). 1.2.3.78 PT[5] / IOC[5] / VREG_API-- Port T I/O Pins [5] PT[5] is a general-purpose input or output pin. It can be configured as input capture or output compare pin IOC[5] of the enhanced capture timer (ECT) or can be configured to output the VREG_API signal. 1.2.3.79 PT[4:0] / IOC[4:0] -- Port T I/O Pins [4:0] PT[4:0] are general-purpose input or output pins. They can be configured as input capture or output compare pins IOC[4:0] of the enhanced capture timer (ECT). 1.2.4 Power Supply Pins MC9S12XE-Family power and ground pins are described below. Because fast signal transitions place high, short-duration current demands on the power supply, use bypass capacitors with high-frequency characteristics and place them as close to the MCU as possible. NOTE All VSS pins must be connected together in the application. 1.2.4.1 VDDX[7:1], VSSX[7:1] -- Power and Ground Pins for I/O Drivers External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are loaded. All VDDX pins are connected together internally. All VSSX pins are connected together internally. 1.2.4.2 VDDR -- Power Pin for Internal Voltage Regulator Input to the internal voltage regulator. The internal voltage regulator is turned off, if VDDR is tied to ground 1.2.4.3 VDD, VSS1,VSS2,VSS3 -- Core Power Pins Power is supplied to the MCU core from the internal voltage regulator, whose load capacitor must be connected to VDD. The voltage supply of nominally 1.8V is derived from the internal voltage regulator. The return current path is through the VSS1,VSS2 and VSS3 pins. No static external loading of these pins is permitted. MC9S12XE-Family Reference Manual , Rev. 1.21 72 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.2.4.4 VDDF -- NVM Power Pin Power is supplied to the MCU NVM through VDDF . The voltage supply of nominally 2.8V is derived from the internal voltage regulator. No static external loading of these pins is permitted. 1.2.4.5 VDDA2, VDDA1, VSSA2, VSSA1 -- Power Supply Pins for ATD and Voltage Regulator These are the power supply and ground input pins for the analog-to-digital converters and the voltage regulator. Internally the VDDA pins are connected together. Internally the VSSA pins are connected together. 1.2.4.6 VRH, VRL -- ATD Reference Voltage Input Pins VRH and VRL are the reference voltage input pins for the analog-to-digital converter. 1.2.4.7 VDDPLL, VSSPL -- Power Supply Pins for PLL These pins provide operating voltage and ground for the oscillator and the phased-locked loop. The voltage supply of nominally 1.8V is derived from the internal voltage regulator. This allows the supply voltage to the oscillator and PLL to be bypassed independently. This voltage is generated by the internal voltage regulator. No static external loading of these pins is permitted. Table 1-11. Power and Ground Connection Summary Mnemonic VDDR VDDX[7:1] VSSX[7:1] VDDA2, VDDA1 VSSA2, VSSA1 VRL VRH VDD VSS1, VSS2, VSS3 VDDF Nominal Voltage 5.0 V 5.0 V 0V 5.0 V 0V Description External power supply to internal voltage regulator External power and ground, supply to pin drivers Operating voltage and ground for the analog-to-digital converters and the reference for the internal voltage regulator, allows the supply voltage to the A/D to be bypassed independently. Reference voltages for the analog-to-digital converter. Internal power and ground generated by internal regulator for the internal core. 0V 5.0 V 1.8 V 0V 2.8 V Internal power and ground generated by internal regulator for the internal NVM. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 73 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-11. Power and Ground Connection Summary (continued) Mnemonic VDDPLL VSSPLL Nominal Voltage 1.8 V 0V Description Provides operating voltage and ground for the phased-locked loop. This allows the supply voltage to the PLL to be bypassed independently. Internal power and ground generated by internal regulator. MC9S12XE-Family Reference Manual , Rev. 1.21 74 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.3 System Clock Description The clock and reset generator module (CRG) provides the internal clock signals for the core and all peripheral modules. Figure 1-9 shows the clock connections from the CRG to all modules. Consult the CRG specification for details on clock generation. SCI0 . . SCI 7 CAN0 . . CAN4 SPI0 . . SPI2 IIC0 & IIC1 ATD0 & ATD1 Bus Clock PIT EXTAL Oscillator Clock ECT CRG PIM Core Clock PWM XTAL RAM S12X XGATE FLASH & EEE TIM Figure 1-9. Clock Connections The system clock can be supplied in several ways enabling a range of system operating frequencies to be supported: * The on-chip phase locked loop (PLL) * the PLL self clocking * the oscillator The clock generated by the PLL or oscillator provides the main system clock frequencies core clock and bus clock. As shown in Figure 1-9, these system clocks are used throughout the MCU to drive the core, the memories, and the peripherals. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 75 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The program Flash memory and the EEPROM are supplied by the bus clock and the oscillator clock. The oscillator clock is used as a time base to derive the program and erase times for the NVM's. The CAN modules may be configured to have their clock sources derived either from the bus clock or directly from the oscillator clock. This allows the user to select its clock based on the required jitter performance. In order to ensure the presence of the clock the MCU includes an on-chip clock monitor connected to the output of the oscillator. The clock monitor can be configured to invoke the PLL self-clocking mode or to generate a system reset if it is allowed to time out as a result of no oscillator clock being present. In addition to the clock monitor, the MCU also provides a clock quality checker which performs a more accurate check of the clock. The clock quality checker counts a predetermined number of clock edges within a defined time window to insure that the clock is running. The checker can be invoked following specific events such as on wake-up or clock monitor failure. 1.4 Modes of Operation The MCU can operate in different modes associated with MCU resource mapping and bus interface configuration. These are described in 1.4.1 Chip Configuration Summary. The MCU can operate in different power modes to facilitate power saving when full system performance is not required. These are described in 1.4.2 Power Modes. Some modules feature a software programmable option to freeze the module status whilst the background debug module is active to facilitate debugging. This is described in 1.4.3 Freeze Mode. For system integrity support separate system states are featured as explained in 1.4.4 System States. 1.4.1 Chip Configuration Summary The MCU can operate in six different modes associated with resource configuration. The different modes, the state of ROMCTL and EROMCTL signal on rising edge of RESET and the security state of the MCU affect the following device characteristics: * External bus interface configuration * Flash in memory map, or not * Debug features enabled or disabled The operating mode out of reset is determined by the states of the MODC, MODB, and MODA signals during reset (see Table 1-12). The MODC, MODB, and MODA bits in the MODE register show the current operating mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA signals are latched into these bits on the rising edge of RESET. In normal expanded mode and in emulation modes the ROMON bit and the EROMON bit in the MMCCTL1 register defines if the on chip flash memory is the memory map, or not. (See Table 1-12.) For a detailed explanation of the ROMON and EROMON bits refer to the MMC description. MC9S12XE-Family Reference Manual , Rev. 1.21 76 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family The state of the ROMCTL signal is latched into the ROMON bit in the MMCCTL1 register on the rising edge of RESET. The state of the EROMCTL signal is latched into the EROMON bit in the MMCCTL1 register on the rising edge of RESET. Table 1-12. Chip Modes and Data Sources Chip Modes Normal single chip Special single chip Emulation single chip Normal expanded Emulation expanded MODC 1 0 0 1 0 MODB 0 0 0 0 1 MODA 0 0 1 1 1 X X 0 1 0 1 1 Special test 0 1 0 0 0 1 X X X 0 1 X Emulation memory Internal Flash External application Internal Flash External application Emulation memory Internal Flash External application ROMCTL X EROMCTL X Data Source(1) Internal 1 X Internal Flash 1. Internal means resources inside the MCU are read/written. Internal Flash means Flash resources inside the MCU are read/written. Emulation memory means resources inside the emulator are read/written (PRU registers, Flash replacement, RAM, EEPROM, and register space are always considered internal). External application means resources residing outside the MCU are read/written. 1.4.1.1 Normal Expanded Mode Ports K, A, and B are configured as a 23-bit address bus, ports C and D are configured as a 16-bit data bus, and port E provides bus control and status signals. This mode allows 16-bit external memory and peripheral devices to be interfaced to the system. The fastest external bus rate is divide by 2 from the internal bus rate. 1.4.1.2 Normal Single-Chip Mode There is no external bus in this mode. The processor program is executed from internal memory. Ports A, B,C,D, K, and most pins of port E are available as general-purpose I/O. 1.4.1.3 Special Single-Chip Mode This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The background debug module BDM is active in this mode. The CPU executes a monitor program located in an on-chip ROM. BDM firmware waits for additional serial commands through the BKGD pin. There is no external bus after reset in this mode. 1.4.1.4 Emulation of Expanded Mode Developers use this mode for emulation systems in which the users target application is normal expanded mode. Code is executed from external memory or from internal memory depending on the state of ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 77 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.4.1.5 Emulation of Single-Chip Mode Developers use this mode for emulation systems in which the user's target application is normal singlechip mode. Code is executed from external memory or from internal memory depending on the state of ROMON and EROMON bit. In this mode the internal operation is visible on external bus interface. 1.4.1.6 Special Test Mode This is for Freescale internal use only. 1.4.2 Power Modes The MCU features two main low-power modes. Consult the respective module description for module specific behavior in system stop, system pseudo stop, and system wait mode. An important source of information about the clock system is the Clock and Reset Generator description (CRG). 1.4.2.1 System Stop Modes The system stop modes are entered if the CPU executes the STOP instruction unless either the XGATE is active or an NVM command is active. The XGATE is active if it executes a thread or the XGFACT bit in the XGMCTL register is set. Depending on the state of the PSTP bit in the CLKSEL register the MCU goes into pseudo stop mode or full stop mode. Please refer to CRG description. Asserting RESET, XIRQ, IRQ or any other interrupt that is not masked exits system stop modes. System stop modes can be exited by XGATE or CPU activity independently, depending on the configuration of the interrupt request. If System-Stop is exited on an XGATE request then, as long as the XGATE does not set an interrupt flag on the CPU and the XGATE fake activity bit (FACT) remains cleared, once XGATE activity is completed System Stop mode will automatically be re-entered. If the CPU executes the STOP instruction whilst XGATE is active or an NVM command is being processed, then the system clocks continue running until XGATE/NVM activity is completed. If a nonmasked interrupt occurs within this time then the system does not effectively enter stop mode although the STOP instruction has been executed. 1.4.2.2 Full Stop Mode The oscillator is stopped in this mode. By default all clocks are switched off and all counters and dividers remain frozen. The Autonomous Periodic Interrupt (API) and ATD modules may be enabled to self wake the device. A Fast wake up mode is available to allow the device to wake from Full Stop mode immediately on the PLL internal clock without starting the oscillator clock. 1.4.2.3 Pseudo Stop Mode In this mode the system clocks are stopped but the oscillator is still running and the real time interrupt (RTI) and watchdog (COP), API and ATD modules may be enabled. Other peripherals are turned off. This mode consumes more current than system stop mode but, as the oscillator continues to run, the full speed wake up time from this mode is significantly shorter. MC9S12XE-Family Reference Manual , Rev. 1.21 78 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.4.2.4 XGATE Fake Activity Mode This mode is entered if the CPU executes the STOP instruction when the XGATE is not executing a thread and the XGFACT bit in the XGMCTL register is set. The oscillator remains active and any enabled peripherals continue to function. 1.4.2.5 Wait Mode This mode is entered when the CPU executes the WAI instruction. In this mode the CPU will not execute instructions. The internal CPU clock is switched off. All peripherals and the XGATE can be active in system wait mode. For further power consumption the peripherals can individually turn off their local clocks. Asserting RESET, XIRQ, IRQ or any other interrupt that is not masked and is not routed to XGATE ends system wait mode. 1.4.2.6 Run Mode Although this is not a low-power mode, unused peripheral modules should not be enabled in order to save power. 1.4.3 Freeze Mode The enhanced capture timer, pulse width modulator, analog-to-digital converters, and the periodic interrupt timer provide a software programmable option to freeze the module status when the background debug module is active. This is useful when debugging application software. For detailed description of the behavior of the ATD0, ATD1, ECT, PWM, and PIT when the background debug module is active consult the corresponding Block Guides. 1.4.4 System States To facilitate system integrity the MCU can run in Supervisor state or User state. The System States strategy is implemented by additional features on the S12X CPU and a Memory Protection Unit. This is designed to support restricted access for code modules executed by kernels or operating systems supporting access control to system resources. The current system state is indicated by the U bit in the CPU condition code register. In User state certain CPU instructions are restricted. See the CPU reference guide for details of the U bit and of those instructions affected by User state. In the case that software task accesses resources outside those defined for it in the MPU a non-maskable interrupt is generated. 1.4.4.1 Supervisor State This state is intended for configuring the MPU for different tasks that are then executed in User state, returning to Supervisor state on completion of each task. This is the default 'state' following reset and can be re-entered from User state by an exception (interrupt). If the SVSEN bit in the MPUSEL register of the MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 79 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family MPU is set, access to system resources is only allowed if enabled by a memory range descriptor as defined in the Memory Protection Unit (MPU) description. 1.4.4.2 User State This state is intended for carrying out system tasks and is entered by setting the U bit of the condition codes register while in Supervisor state. Restrictions apply for the execution of several CPU instructions in User state and access to system resources is only allowed in if enabled by a memory range descriptor as defined in the Memory Protection Unit (MPU) description. 1.5 Security The MCU security feature allows the protection of the on chip Flash and emulated EEPROM memory. For a detailed description of the security features refer to the S12X9SEC description. 1.6 Resets and Interrupts Consult the S12XCPU manual and the S12XINT description for information on exception processing. 1.6.1 Resets Table 1-13. Reset Sources and Vector Locations Vector Address $FFFE $FFFE $FFFE $FFFE $FFFC $FFFA Reset Source Power-On Reset (POR) Low Voltage Reset (LVR) External pin RESET Illegal Address Reset Clock monitor reset COP watchdog reset CCR Mask None None None None None None Local Enable None None None None PLLCTL (CME, SCME) COP rate select Resets are explained in detail in the Clock Reset Generator (CRG) description. 1.6.2 Vectors Table 1-14 lists all interrupt sources and vectors in the default order of priority. The interrupt module (S12XINT) provides an interrupt vector base register (IVBR) to relocate the vectors. Associated with each I-bit maskable service request is a configuration register. It selects if the service request is enabled, the service request priority level and whether the service request is handled either by the S12X CPU or by the XGATE module. MC9S12XE-Family Reference Manual , Rev. 1.21 80 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 1 of 4) Vector Address(1) Vector base + $F8 Vector base+ $F6 Vector base+ $F4 Vector base+ $F2 Vector base+ $F0 Vector base+ $EE Vector base + $EC Vector base+ $EA Vector base+ $E8 Vector base+ $E6 Vector base+ $E4 Vector base + $E2 Vector base+ $E0 Vector base+ $DE Vector base+ $DC Vector base + $DA Vector base + $D8 Vector base+ $D6 Vector base + $D4 Vector base + $D2 Vector base + $D0 Vector base + $CE Vector base + $CC Vector base + $CA Vector base + $C8 Vector base + $C6 Vector base + $C4 Vector base + $C2 Vector base + $C0 XGATE Channel ID(2) -- -- -- -- $78 $77 $76 $75 $74 $73 $72 $71 $70 $6F $6E $6D $6C $6B $6A $69 $68 $67 $66 $65 $64 $63 $62 $61 $60 Interrupt Source Unimplemented instruction trap SWI XIRQ IRQ Real time interrupt Enhanced capture timer channel 0 Enhanced capture timer channel 1 Enhanced capture timer channel 2 Enhanced capture timer channel 3 Enhanced capture timer channel 4 Enhanced capture timer channel 5 Enhanced capture timer channel 6 Enhanced capture timer channel 7 Enhanced capture timer overflow Pulse accumulator A overflow Pulse accumulator input edge SPI0 SCI0 SCI1 ATD0 ATD1 Port J Port H Modulus down counter underflow Pulse accumulator B overflow CRG PLL lock CRG self-clock mode SCI6 IIC0 bus CCR Mask None None X Bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit Local Enable None None None IRQCR (IRQEN) CRGINT (RTIE) TIE (C0I) TIE (C1I) TIE (C2I) TIE (C3I) TIE (C4I) TIE (C5I) TIE (C6I) TIE (C7I) TSRC2 (TOF) PACTL (PAOVI) PACTL (PAI) SPI0CR1 (SPIE, SPTIE) SCI0CR2 (TIE, TCIE, RIE, ILIE) SCI1CR2 (TIE, TCIE, RIE, ILIE) ATD0CTL2 (ASCIE) ATD1CTL2 (ASCIE) PIEJ (PIEJ7-PIEJ0) PIEH (PIEH7-PIEH0) MCCTL(MCZI) PBCTL(PBOVI) CRGINT(LOCKIE) CRGINT (SCMIE) SCI6CR2 (TIE, TCIE, RIE, ILIE) IBCR0 (IBIE) STOP WAIT Wake up Wake up -- -- Yes Yes -- -- Yes Yes Refer to CRG interrupt section No No No No No No No No No No No No Yes Yes Yes Yes Yes Yes No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Refer to CRG interrupt section Refer to CRG interrupt section Yes No Yes Yes MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 81 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 2 of 4) Vector Address(1) Vector base + $BE Vector base + $BC Vector base + $BA Vector base + $B8 Vector base + $B6 Vector base + $B4 Vector base + $B2 Vector base + $B0 Vector base + $AE Vector base + $AC Vector base + $AA Vector base + $A8 Vector base + $A6 Vector base + $A4 Vector base + $A2 Vector base + $A0 Vector base + $9E Vector base+ $9C Vector base+ $9A Vector base + $98 Vector base + $96 Vector base + $94 Vector base + $92 Vector base + $90 Vector base + $8E Vector base+ $8C XGATE Channel ID(2) $5F $5E $5D $5C $5B $5A $59 $58 $57 $56 $55 $54 $53 $52 $51 $50 $4F $4E $4D $4C $4B $4A $49 $48 $47 $46 Interrupt Source SPI1 SPI2 FLASH Fault Detect FLASH CAN0 wake-up CAN0 errors CAN0 receive CAN0 transmit CAN1 wake-up CAN1 errors CAN1 receive CAN1 transmit CAN2 wake-up CAN2 errors CAN2 receive CAN2 transmit CAN3 wake-up CAN3 errors CAN3 receive CAN3 transmit CAN4 wake-up CAN4 errors CAN4 receive CAN4 transmit Port P Interrupt PWM emergency shutdown CCR Mask I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit Local Enable SPI1CR1 (SPIE, SPTIE) SPI2CR1 (SPIE, SPTIE) FCNFG2 (FDIE) FCNFG (CCIE, CBEIE) CAN0RIER (WUPIE) CAN0RIER (CSCIE, OVRIE) CAN0RIER (RXFIE) CAN0TIER (TXEIE[2:0]) CAN1RIER (WUPIE) CAN1RIER (CSCIE, OVRIE) CAN1RIER (RXFIE) CAN1TIER (TXEIE[2:0]) CAN2RIER (WUPIE) CAN2RIER (CSCIE, OVRIE) CAN2RIER (RXFIE) CAN2TIER (TXEIE[2:0]) CAN3RIER (WUPIE) CAN3RIER (CSCIE, OVRIE) CAN3RIER (RXFIE) CAN3TIER (TXEIE[2:0]) CAN4RIER (WUPIE) CAN4RIER (CSCIE, OVRIE) CAN4RIER (RXFIE) CAN4TIER (TXEIE[2:0]) PIEP (PIEP7-PIEP0) PWMSDN (PWMIE) STOP WAIT Wake up Wake up No No No No Yes No No No Yes No No No Yes No No No Yes No No No Yes No No No Yes No Yes Yes No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes MC9S12XE-Family Reference Manual , Rev. 1.21 82 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 3 of 4) Vector Address(1) Vector base + $8A Vector base + $88 Vector base + $86 Vector base + $84 Vector base + $82 Vector base + $80 Vector base + $7E Vector base + $7C Vector base + $7A Vector base + $78 Vector base + $76 Vector base + $74 Vector base + $72 Vector base + $70 Vector base + $6E Vector base + $6C Vector base + $6A Vector base + $68 Vector base + $66 Vector base + $64 Vector base + $62 Vector base + $60 Vector base + $5E Vector base + $5C Vector base + $5A Vector base + $58 Vector base + $56 Vector base + $54 Vector base + $52 Vector base + $50 $2F $2E $2D $2C $2B $2A $29 $28 XGATE Channel ID(2) $45 $44 $43 $42 $41 $40 $3F -- $3D $3C $3B $3A $39 $38 $37 $36 $35 $34 $33 $32 Interrupt Source SCI2 SCI3 SCI4 SCI5 IIC1 Bus Low-voltage interrupt (LVI) Autonomous periodical interrupt (API) High Temperature Interrupt Periodic interrupt timer channel 0 Periodic interrupt timer channel 1 Periodic interrupt timer channel 2 Periodic interrupt timer channel 3 XGATE software trigger 0 XGATE software trigger 1 XGATE software trigger 2 XGATE software trigger 3 XGATE software trigger 4 XGATE software trigger 5 XGATE software trigger 6 XGATE software trigger 7 Reserved Reserved Periodic interrupt timer channel 4 Periodic interrupt timer channel 5 Periodic interrupt timer channel 6 Periodic interrupt timer channel 7 SCI7 TIM timer channel 0 TIM timer channel 1 TIM timer channel 2 I bit I bit I bit I bit I bit I bit I bit I bit PITINTE (PINTE4) PITINTE (PINTE5) PITINTE (PINTE6) PITINTE (PINTE7) SCI7CR2 (TIE, TCIE, RIE, ILIE) TIE (C0I) TIE (C1I) TIE (C2I) No No No No Yes No No No Yes Yes Yes Yes Yes Yes Yes Yes CCR Mask I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit Local Enable SCI2CR2 (TIE, TCIE, RIE, ILIE) SCI3CR2 (TIE, TCIE, RIE, ILIE) SCI4CR2 (TIE, TCIE, RIE, ILIE) SCI5CR2 (TIE, TCIE, RIE, ILIE) IBCR (IBIE) VREGCTRL (LVIE) VREGAPICTRL (APIE) VREGHTCL (HTIE) PITINTE (PINTE0) PITINTE (PINTE1) PITINTE (PINTE2) PITINTE (PINTE3) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) XGMCTL (XGIE) STOP WAIT Wake up Wake up Yes Yes Yes Yes No No Yes No No No No No No No No No No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 83 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family Table 1-14. Interrupt Vector Locations (Sheet 4 of 4) Vector Address(1) Vector base+ $4E Vector base + $4C Vector base+ $4A Vector base+ $48 Vector base+ $46 Vector base+ $44 Vector base + $42 Vector base+ $40 Vector base + $3E Vector base + $3C Vector base+ $18 to Vector base + $3A Vector base + $16 Vector base + $14 Vector base + $12 -- -- -- XGATE Channel ID(2) $27 $26 $25 $24 $23 $22 $21 $20 $1F $1E Interrupt Source TIM timer channel 3 TIM timer channel 4 TIM timer channel 5 TIM timer channel 6 TIM timer channel 7 TIM timer overflow TIM Pulse accumulator A overflow TIM Pulse accumulator input edge ATD0 Compare Interrupt ATD1 Compare Interrupt Reserved CCR Mask I bit I bit I bit I bit I bit I bit I bit I bit I bit I bit Local Enable TIE (C3I) TIE (C4I) TIE (C5I) TIE (C6I) TIE (C7I) TSRC2 (TOF) PACTL (PAOVI) PACTL (PAI) ATD0CTL2 (ACMPIE) ATD1CTL2 (ACMPIE) STOP WAIT Wake up Wake up No No No No No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes XGATE software error interrupt MPU Access Error System Call Interrupt (SYS) None None -- None None None None No No -- -- Yes No -- -- Vector base + $10 -- Spurious interrupt -- 1. 16 bits vector address based 2. For detailed description of XGATE channel ID refer to XGATE Block Guide 1.6.3 Effects of Reset When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block descriptions for register reset states. On each reset, the Flash module executes a reset sequence to load Flash configuration registers and initialize the buffer RAM EEE partition, if required. 1.6.3.1 Flash Configuration Reset Sequence (Core Hold Phase) On each reset, the Flash module will hold CPU activity while loading Flash module registers and configuration from the Flash memory. The duration of this phase is given as tRST in the device electrical parameter specification. If double faults are detected in the reset phase, Flash module protection and security may be active on leaving reset. This is explained in more detail in the Flash module section. 1.6.3.2 EEE Reset Sequence Phase (Core Active Phase) During this phase of the reset sequence (following on from the core hold phase) the CPU can execute instructions while the FTM initialization completes and, if configured for EEE operation, the EEE RAM MC9S12XE-Family Reference Manual , Rev. 1.21 84 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family is loaded with valid data from the D-Flash EEE partition. Completion of this phase is indicated by the CCIF flag in the FTM FSTAT register becoming set. If the CPU accesses any EEE RAM location before the CCIF flag is set, the CPU is stalled until the FTM reset sequence is complete and the EEE RAM data is valid. Once the CCIF flag is set, indicating the end of this phase, the EEE RAM can be accessed without impacting the CPU and FTM commands can be executed. 1.6.3.3 Reset While Flash Command Active If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. 1.6.3.4 I/O Pins Refer to the PIM block description for reset configurations of all peripheral module ports. 1.6.3.5 Memory The RAM arrays are not initialized out of reset. 1.6.3.6 COP Configuration The COP timeout rate bits CR[2:0] and the WCOP bit in the COPCTL register are loaded on rising edge of RESET from the Flash register FOPT. See Table 1-15 and Table 1-16 for coding. The FOPT register is loaded from the Flash configuration field byte at global address $7FFF0E during the reset sequence. If the MCU is secured the COP timeout rate is always set to the longest period (CR[2:0] = 111) after COP reset. Table 1-15. Initial COP Rate Configuration NV[2:0] in FOPT Register 000 001 010 011 100 101 110 111 CR[2:0] in COPCTL Register 111 110 101 100 011 010 001 000 Table 1-16. Initial WCOP Configuration NV[3] in FOPT Register 1 0 WCOP in COPCTL Register 0 1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 85 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.7 1.7.1 ADC0 Configuration External Trigger Input Connection The ADC module includes four external trigger inputs ETRIG0, ETRIG1, ETRIG2, and ETRIG3. The external trigger allows the user to synchronize ADC conversion to external trigger events. Table 1-17 shows the connection of the external trigger inputs. Table 1-17. ATD0 External Trigger Sources External Trigger Input ETRIG0 ETRIG1 ETRIG2 ETRIG3 Connectivity Pulse width modulator channel 1 Pulse width modulator channel 3 Periodic interrupt timer hardware trigger 0 Periodic interrupt timer hardware trigger 1 Consult the ATD block description for information about the analog-to-digital converter module. ATD block description refererences to freeze mode are equivalent to active BDM mode. 1.7.2 ADC0 Channel[17] Connection Further to the 16 externally available channels, ADC0 features an extra channel[17] that is connected to the internal temperature sensor at device level. To access this channel ADC0 must use the channel encoding SC:CD:CC:CB:CA = 1:0:0:0:1 in ATDCTL5. For more temperature sensor information, please refer to 1.10.1 Temperature Sensor Configuration 1.8 ADC1 External Trigger Input Connection The ADC module includes four external trigger inputs ETRIG0, ETRIG1, ETRIG2, and ETRIG3. The external trigger feature allows the user to synchronize ADC conversion to external trigger events. Table 118 shows the connection of the external trigger inputs. Table 1-18. ATD1 External Trigger Sources External Trigger Input ETRIG0 ETRIG1 ETRIG2 ETRIG3 Connectivity Pulse width modulator channel 1 Pulse width modulator channel 3 Periodic interrupt timer hardware trigger 0 Periodic interrupt timer hardware trigger 1 Consult the ADC block description for information about the analog-to-digital converter module. ADC block description refererences to freeze mode are equivalent to active BDM mode. MC9S12XE-Family Reference Manual , Rev. 1.21 86 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.9 MPU Configuration The MPU has the option of a third bus master (CPU + XGATE + other) which is not present on this device family but may be on other parts. 1.10 VREG Configuration The VREGEN connection of the voltage regulator is tied internally to VDDR such that the voltage regulator is always enabled with VDDR connected to a positive supply voltage. The device must be configured with the internal voltage regulator enabled. Operation in conjunction with an external voltage regulator is not supported. The autonomous periodic interrupt clock output is mapped to PortT[5]. The API trimming register APITR is loaded on rising edge of RESET from the Flash IFR option field at global address 0x40_00F0 bits[5:0] during the reset sequence. Currently factory programming of this IFR range is not supported. 1.10.1 Temperature Sensor Configuration The VREG high temperature trimming register bits VREGHTTR[3:0] are loaded from the internal Flash during the reset sequence. To use the high temperature interrupt within the specified limits (THTIA and THTID) these bits must be loaded with 0x8. Currently factory programming is not supported. The device temperature can be monitored on ADC0 channel[17]. The internal bandgap reference voltage can also be mapped to ADC0 analog input channel[17]. The voltage regulator VSEL bit when set, maps the bandgap and, when clear, maps the temperature sensor to ADC0 channel[17]. Read access to reserved VREG register space returns "0". Write accesses have no effect. This device does not support access abort of reserved VREG register space. 1.11 BDM Clock Configuration The BDM alternate clock source is the oscillator clock. 1.12 S12XEPIM Configuration On smaller derivatives the S12XEPIM module is a subset of the S12XEP100. The registers of the unavailable ports are unimplemented. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 87 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 1 Device Overview MC9S12XE-Family 1.13 Oscillator Configuration The XCLKS is an input signal which controls whether a crystal in combination with the internal loop controlled (low power) Pierce oscillator is used or whether full swing Pierce oscillator/external clock circuitry is used. For this device XCLKS is mapped to PE7. The XCLKS signal selects the oscillator configuration during reset low phase while a clock quality check is ongoing. This is the case for: * Power on reset or low-voltage reset * Clock monitor reset * Any reset while in self-clock mode or full stop mode The selected oscillator configuration is frozen with the rising edge of the RESET pin in any of these above described reset cases. EXTAL C1 MCU XTAL C2 VSSPLL Crystal or Ceramic Resonator Figure 1-10. Loop Controlled Pierce Oscillator Connections (XCLKS = 1) EXTAL C1 MCU RS XTAL C2 RB=1M ; RS specified by crystal vendor VSSPLL RB Crystal or Ceramic Resonator Figure 1-11. Full Swing Pierce Oscillator Connections (XCLKS = 0) EXTAL MCU XTAL CMOS-Compatible External Oscillator Not Connected Figure 1-12. External Clock Connections (XCLKS = 0) MC9S12XE-Family Reference Manual , Rev. 1.21 88 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-1. Revision History Revision Number V01.17 V01.18 V01.19 Revision Date 02 Apr 2008 25 Nov 2008 18 Dec 2009 2.3.19/120 2.4.3.4/181 Sections Affected Description of Changes * Corrected reduced drive strength to 1/5 * Separated PE1,0 bit descriptions from other PE GPIO * Corrected alternative functions on Port K (ACC[2:0]) * Corrected functions on PE[5] (MODB) and PE[2] (WE) * Added function independency to reduced drive and wired-or bit descriptions * Minor corrections 2.1 2.1.1 Introduction Overview The S12XE Family Port Integration Module establishes the interface between the peripheral modules including the non-multiplexed External Bus Interface module (S12X_EBI) and the I/O pins for all ports. It controls the electrical pin properties as well as the signal prioritization and multiplexing on shared pins. This document covers: * Port A and B used as address output of the S12X_EBI * Port C and D used as data I/O of the S12X_EBI * Port E associated with the S12X_EBI control signals and the IRQ, XIRQ interrupt inputs * Port K associated with address output and control signals of the S12X_EBI * Port T associated with 1 ECT module * Port S associated with 2 SCI and 1 SPI modules * Port M associated with 4 MSCAN and 1 SCI module * Port P connected to the PWM and 2 SPI modules - inputs can be used as an external interrupt source * Port H associated with 4 SCI modules - inputs can be used as an external interrupt source * Port J associated with 1 MSCAN, 1 SCI, 2 IIC modules and chip select outputs - inputs can be used as an external interrupt source * Port AD0 and AD1 associated with two 16-channel ATD modules * Port R associated with 1 standard timer (TIM) module * Port L associated with 4 SCI modules MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 89 Chapter 2 Port Integration Module (S12XEPIMV1) * Port F associated with IIC, SCI and chip select outputs Most I/O pins can be configured by register bits to select data direction and drive strength, to enable and select pull-up or pull-down devices. NOTE This document assumes the availability of all features (208-pin package option). Some functions are not available on lower pin count package options. Refer to the pin-out summary in the SOC Guide. 2.1.2 * * * * * * * * * * Features Data and data direction registers for Ports A, B, C, D, E, K, T, S, M, P, H, J, AD0, AD1, R, L, and F when used as general-purpose I/O Control registers to enable/disable pull-device and select pull-ups/pull-downs on Ports T, S, M, P, H, J, R, L, and F on per-pin basis Control registers to enable/disable pull-up devices on Ports AD0 and AD1 on per-pin basis Single control register to enable/disable pull-ups on Ports A, B, C, D, E, and K on per-port basis and on BKGD pin Control registers to enable/disable reduced output drive on Ports T, S, M, P, H, J, AD0, AD1, R, L, and F on per-pin basis Single control register to enable/disable reduced output drive on Ports A, B, C, D, E, and K on perport basis Control registers to enable/disable open-drain (wired-or) mode on Ports S, M, and L Interrupt flag register for pin interrupts on Ports P, H, and J Control register to configure IRQ pin operation Free-running clock outputs The Port Integration Module includes these distinctive registers: A standard port pin has the following minimum features: * Input/output selection * 5V output drive with two selectable drive strengths * 5V digital and analog input * Input with selectable pull-up or pull-down device Optional features supported on dedicated pins: * * * Open drain for wired-or connections Interrupt inputs with glitch filtering Reduced input threshold to support low voltage applications 2.2 External Signal Description This section lists and describes the signals that do connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 90 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-2 shows all the pins and their functions that are controlled by the Port Integration Module. Refer to the SOC Guide for the availability of the individual pins in the different package options. NOTE If there is more than one function associated with a pin, the priority is indicated by the position in the table from top (highest priority) to bottom (lowest priority). Table 2-2. Pin Functions and Priorities Port A Pin Name BKGD PA[7:0] Pin Function & Priority(1) MODC (2) BKGD ADDR[15:8] mux IVD[15:8] (3) GPIO B PB[7:1] ADDR[7:1] mux IVD[7:1] 3 GPIO PB[0] ADDR[0] mux IVD0 3 UDS GPIO C PC[7:0] DATA[15:8] GPIO D PD[7:0] DATA[7:0] GPIO I/O I O Description MODC input during RESET High-order external bus address output (multiplexed with IVIS data) Pin Function after Reset BKGD Mode dependent (4) I/O S12X_BDM communication pin I/O General-purpose I/O O Low-order external bus address output (multiplexed with IVIS data) Mode dependent 4 I/O General-purpose I/O O Low-order external bus address output (multiplexed with IVIS data) Upper data strobe Mode dependent 4 Mode dependent 4 O I/O General-purpose I/O I/O High-order bidirectional data input/output Configurable for reduced input threshold I/O General-purpose I/O I/O Low-order bidirectional data input/output Configurable for reduced input threshold I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 91 Chapter 2 Port Integration Module (S12XEPIMV1) Port E Pin Name PE[7] Pin Function & Priority(1) XCLKS 2 ECLKX2 GPIO I/O I I I I Description External clock selection input during RESET Free-running clock output at Core Clock rate (ECLK x 2) MODB input during RESET Instruction tagging low pin Configurable for reduced input threshold MODA input during RESET Read enable signal Instruction tagging low pin Configurable for reduced input threshold Free-running clock output at the Bus Clock rate or programmable divided in normal modes EROMON bit control input during RESET Low strobe bar output Lower data strobe Read/write output for external bus Write enable signal Maskable level- or falling edge-sensitive interrupt input General-purpose input Non-maskable level-sensitive interrupt input General-purpose input ROMON bit control input during RESET External Wait signal Configurable for reduced input threshold Extended external bus address output (multiplexed with access master output) Pin Function after Reset Mode dependent 4 I/O General-purpose I/O PE[6] MODB 2 TAGHI GPIO I/O General-purpose I/O I O I PE[5] MODA 2 RE TAGLO GPIO I/O General-purpose I/O O PE[4] ECLK GPIO I/O General-purpose I/O I O O O O I I I I 2 PE[3] EROMCTL 2 LSTRB LDS GPIO I/O General-purpose I/O PE[2] RW WE GPIO I/O General-purpose I/O PE[1] PE[0] K PK[7] IRQ GPI XIRQ GPI ROMCTL EWAIT GPIO I I Mode dependent 3 I/O General-purpose I/O O PK[6:4] ADDR[22:20] mux ACC[2:0] 3 GPIO ADDR[19:16] mux IQSTAT[3:0] 3 GPIO I/O General-purpose I/O O Extended external bus address output (multiplexed with instruction pipe status bits) PK[3:0] I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 92 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port T Pin Name PT[7] Pin Function & Priority(1) IOC[7] GPIO IOC[5] I/O Description Pin Function after Reset GPIO I/O Enhanced Capture Timer Channels 7 input/output I/O General-purpose I/O I/O Enhanced Capture Timer Channel 5 input/output O VREG Autonomous Periodical Interrupt output I/O General-purpose I/O I/O Enhanced Capture Timer Channels 4 - 0 input/output I/O General-purpose I/O I/O Serial Peripheral Interface 0 slave select output in master mode, input in slave mode or master mode. I/O General-purpose I/O I/O Serial Peripheral Interface 0 serial clock pin I/O General-purpose I/O I/O Serial Peripheral Interface 0 master out/slave in pin I/O General-purpose I/O I/O Serial Peripheral Interface 0 master in/slave out pin I/O General-purpose I/O O I O I Serial Communication Interface 1 transmit pin Serial Communication Interface 1 receive pin Serial Communication Interface 0 transmit pin Serial Communication Interface 0 receive pin I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O PT[5] PT[4:0] S PS7 VREG_API GPIO IOC[4:0] GPIO SS0 GPIO GPIO PS6 PS5 PS4 PS3 PS2 PS1 PS0 SCK0 GPIO MOSI0 GPIO MISO0 GPIO TXD1 GPIO RXD1 GPIO TXD0 GPIO RXD0 GPIO MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 93 Chapter 2 Port Integration Module (S12XEPIMV1) Port M Pin Name PM7 Pin Function & Priority(1) TXCAN3 (TXCAN4) TXD3 GPIO I/O O O O I I I O O O MSCAN3 transmit pin MSCAN4 transmit pin Description Pin Function after Reset GPIO Serial Communication Interface 3 transmit pin MSCAN3 receive pin MSCAN4 receive pin Serial Communication Interface 3 receive pin MSCAN2 transmit pin MSCAN0 transmit pin MSCAN4 transmit pin I/O General-purpose I/O PM6 RXCAN3 (RXCAN4) RXD3 GPIO I/O General-purpose I/O PM5 TXCAN2 (TXCAN0) (TXCAN4) (SCK0) I/O Serial Peripheral Interface 0 serial clock pin If CAN0 is routed to PM[3:2] the SPI0 can still be used in bidirectional master mode. I/O General-purpose I/O I I I MSCAN2 receive pin MSCAN0 receive pin MSCAN4 receive pin GPIO PM4 RXCAN2 (RXCAN0) (RXCAN4) (MOSI0) I/O Serial Peripheral Interface 0 master out/slave in pin If CAN0 is routed to PM[3:2] the SPI0 can still be used in bidirectional master mode. I/O General-purpose I/O O O MSCAN1 transmit pin MSCAN0 transmit pin GPIO PM3 TXCAN1 (TXCAN0) (SS0) GPIO PM2 RXCAN1 (RXCAN0) (MISO0) GPIO PM1 PM0 TXCAN0 GPIO RXCAN0 GPIO I/O Serial Peripheral Interface 0 slave select output in master mode, input for slave mode or master mode. I/O General-purpose I/O I I MSCAN1 receive pin MSCAN0 receive pin I/O Serial Peripheral Interface 0 master in/slave out pin I/O General-purpose I/O O I MSCAN0 transmit pin MSCAN0 receive pin I/O General-purpose I/O I/O General-purpose I/O MC9S12XE-Family Reference Manual , Rev. 1.21 94 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port P Pin Name PP7 Pin Function & Priority(1) PWM7 SCK2 (TIMIOC7) GPIO/KWP7 I/O Description Pin Function after Reset GPIO I/O Pulse Width Modulator input/output channel 7 I/O Serial Peripheral Interface 2 serial clock pin I/O Timer Channel 7 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 6 I/O Serial Peripheral Interface 2 slave select output in master mode, input for slave mode or master mode. I/O Timer Channel 6 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 5 I/O Serial Peripheral Interface 2 master out/slave in pin I/O Timer Channel 5 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 4 I/O Serial Peripheral Interface 2 master in/slave out pin I/O Timer Channel 4 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 3 I/O Serial Peripheral Interface 1 slave select output in master mode, input for slave mode or master mode. I/O Timer Channel 3 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 2 I/O Serial Peripheral Interface 1 serial clock pin I/O Timer Channel 2 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 1 I/O Serial Peripheral Interface 1 master out/slave in pin I/O Timer Channel 1 input/output I/O General-purpose I/O with interrupt O Pulse Width Modulator output channel 0 I/O Serial Peripheral Interface 1 master in/slave out pin I/O Timer Channel 0 input/output I/O General-purpose I/O with interrupt PP6 PWM6 SS2 (TIMIOC6) GPIO/KWP6 PP5 PWM5 MOSI2 (TIMIOC5) GPIO/KWP5 PP4 PWM4 MISO2 (TIMIOC4) GPIO/KWP4 PP3 PWM3 SS1 (TIMIOC3) GPIO/KWP3 PP2 PWM2 SCK1 (TIMIOC2) GPIO/KWP2 PP1 PWM1 MOSI1 (TIMIOC1) GPIO/KWP1 PP0 PWM0 MISO1 (TIMIOC0) GPIO/KWP0 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 95 Chapter 2 Port Integration Module (S12XEPIMV1) Port H Pin Name PH7 Pin Function & Priority(1) (SS2) TXD5 GPIO/KWH7 I/O Description Pin Function after Reset GPIO I/O Serial Peripheral Interface 2 slave select output in master mode, input for slave mode or master mode O Serial Communication Interface 5 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 serial clock pin I Serial Communication Interface 5 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 master out/slave in pin O Serial Communication Interface 4 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 2 master in/slave out pin I Serial Communication Interface 4 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 slave select output in master mode, input for slave mode or master mode. O Serial Communication Interface 7 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 serial clock pin I Serial Communication Interface 7 receive pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 master out/slave in pin O Serial Communication Interface 6 transmit pin I/O General-purpose I/O with interrupt I/O Serial Peripheral Interface 1 master in/slave out pin O Serial Communication Interface 6 transmit pin I/O General-purpose I/O with interrupt PH6 (SCK2) RXD5 GPIO/KWH6 PH5 (MOSI2) TXD4 GPIO/KWH5 PH4 (MISO2) RXD4 GPIO/KWH4 PH3 (SS1) TXD7 GPIO/KWH3 PH2 (SCK1) RXD7 GPIO/KWH2 PH1 (MOSI1) TXD6 GPIO/KWH1 PH0 (MISO1) TXD6 GPIO/KWH0 MC9S12XE-Family Reference Manual , Rev. 1.21 96 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Port J Pin Name PJ7 Pin Function & Priority(1) TXCAN4 SCL0 (TXCAN0) GPIO/KWJ7 I/O O O O I I O O MSCAN4 transmit pin Description Pin Function after Reset GPIO Inter Integrated Circuit 0 serial clock line MSCAN0 transmit pin MSCAN4 receive pin MSCAN0 receive pin Inter Integrated Circuit 1 serial clock line Chip select 2 I/O General-purpose I/O with interrupt I/O Inter Integrated Circuit 0 serial data line I/O General-purpose I/O with interrupt PJ6 RXCAN4 SDA0 (RXCAN0) GPIO/KWJ6 PJ5 SCL1 CS2 GPIO/KWJ5 I/O General-purpose I/O with interrupt I/O Inter Integrated Circuit 1 serial data line O Chip select 0 I/O General-purpose I/O with interrupt I/O General-purpose I/O with interrupt O O I O Chip select 1 Serial Communication Interface 2 transmit pin Serial Communication Interface 2 receive pin Chip select 3 GPIO GPIO GPIO I/O General-purpose I/O with interrupt I/O General-purpose I/O with interrupt PJ4 SDA1 CS0 GPIO/KWJ4 PJ3 PJ2 PJ1 PJ0 GPIO/KWJ3 CS1 GPIO/KWJ2 TXD2 GPIO/KWJ1 RXD2 CS3 GPIO/KWJ0 I/O General-purpose I/O with interrupt I/O General-purpose I/O I I ATD0 analog inputs ATD1 analog inputs I/O General-purpose I/O I/O Timer Channels 7- 0 input/output I/O General-purpose I/O AD0 PAD[15:0] GPIO AN[15:0] GPIO AN[15:0] TIMIOC[7:0] GPIO AD1 PAD[31:16] R PR[7:0] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 97 Chapter 2 Port Integration Module (S12XEPIMV1) Port L Pin Name PL7 PL6 PL5 PL4 PL3 PL2 PL1 PL0 Pin Function & Priority(1) (TXD7) GPIO (RXD7) GPIO (TXD6) GPIO (RXD6) GPIO (TXD5) GPIO (RXD5) GPIO (TXD4) GPIO (RXD4) GPIO (TXD3) GPIO (RXD3) GPIO (SCL0) GPIO (SDA0) GPIO (CS3) GPIO (CS2) GPIO (CS1) GPIO (CS0) I/O O I O I O I O I O I O Description Serial Communication Interface 7 transmit pin Serial Communication Interface 7 receive pin Serial Communication Interface 6 transmit pin Serial Communication Interface 6 receive pin Serial Communication Interface 5 transmit pin Serial Communication Interface 5 receive pin Serial Communication Interface 4 transmit pin Serial Communication Interface 4 receive pin Serial Communication Interface 3 transmit pin Serial Communication Interface 3 receive pin Inter Integrated Circuit 0 serial clock line Pin Function after Reset GPIO I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O GPIO I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O I/O Inter Integrated Circuit 0 serial data line I/O General-purpose I/O O O O O Chip select 3 Chip select 2 Chip select 1 Chip select 0 I/O General-purpose I/O I/O General-purpose I/O I/O General-purpose I/O F PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 GPIO I/O General-purpose I/O 1. Signals in brackets denote alternative module routing pins. 2. Function active when RESET asserted. 3. Only available in emulation modes or in Special Test Mode with IVIS on. 4. Refer to S12X_EBI section. 2.3 Memory Map and Register Definition This section provides a detailed description of all Port Integration Module registers. MC9S12XE-Family Reference Manual , Rev. 1.21 98 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.1 Register Name 0x0000 PORTA 0x0001 PORTB 0x0002 DDRA 0x0003 DDRB 0x0004 PORTC 0x0005 PORTD 0x0006 DDRC 0x0007 DDRD 0x0008 PORTE 0x0009 DDRE Memory Map Bit 7 R W R W R W R W R W R W R W R W R W R W PA7 6 PA6 5 PA5 4 PA4 3 PA3 2 PA2 1 PA1 Bit 0 PA0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 DDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0 DDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 DDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 PE1 DDRD0 PE0 PE7 PE6 PE5 PE4 PE3 PE2 DDRE7 DDRE6 DDRE5 DDRE4 DDRE3 DDRE2 0 0 0x000A R 0x000B W Non-PIM Address Range 0x000C PUCR 0x000D RDRIV R W R W PUPKE BKPUE 0 0 Non-PIM Address Range PUPEE PUPDE PUPCE PUPBE PUPAE RDPK 0 RDPE RDPD RDPC RDPB RDPA = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 99 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x000E- R 0x001B W Non-PIM Address Range 0x001C R ECLKCTL W 0x001D R Reserved W 0x001E IRQCR 0x001F Reserved R W R W Bit 7 6 5 4 3 2 1 Bit 0 Non-PIM Address Range NECLK 0 NCLKX2 0 DIV16 0 EDIV4 0 EDIV3 0 EDIV2 0 EDIV1 0 EDIV0 0 IRQE 0 IRQEN 0 0 0 0 0 0 0 0 0 0 0 0 0 0x0020- R 0x0031 W Non-PIM Address Range 0x0032 PORTK 0x0033 DDRK R W R W PK7 PK6 PK5 Non-PIM Address Range PK4 PK3 PK2 PK1 PK0 DDRK7 DDRK6 DDRK5 DDRK4 DDRK3 DDRK2 DDRK1 DDRK0 0x0034- R 0x023F W Non-PIM Address Range 0x0240 PTT 0x0241 PTIT 0x0242 DDRT 0x0243 RDRT R W R W R W R W DDRT7 DDRT6 DDRT5 PTT7 PTIT7 PTT6 PTIT6 PTT5 PTIT5 Non-PIM Address Range PTT4 PTIT4 PTT3 PTIT3 PTT2 PTIT2 PTT1 PTIT1 PTT0 PTIT0 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 RDRT7 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 100 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0244 PERT 0x0245 PPST R W R W Bit 7 PERT7 6 PERT6 5 PERT5 4 PERT4 3 PERT3 2 PERT2 1 PERT1 Bit 0 PERT0 PPST7 0 PPST6 0 PPST5 0 PPST4 0 PPST3 0 PPST2 0 PPST1 0 PPST0 0 0x0246 R Reserved W 0x0247 R Reserved W 0x0248 PTS 0x0249 PTIS 0x024A DDRS 0x024B RDRS 0x024C PERS 0x024D PPSS 0x024E WOMS R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 PTS7 PTIS7 PTS6 PTIS6 PTS5 PTIS5 PTS4 PTIS4 PTS3 PTIS3 PTS2 PTIS2 PTS1 PTIS1 PTS0 PTIS0 DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 RDRS7 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0 PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 WOMS7 0 WOMS6 0 WOMS5 0 WOMS4 0 WOMS3 0 WOMS2 0 WOMS1 0 WOMS0 0 0x024F R Reserved W 0x0250 PTM 0x0251 PTIM 0x0252 DDRM R W R W R W PTM7 PTIM7 PTM6 PTIM6 PTM5 PTIM5 PTM4 PTIM4 PTM3 PTIM3 PTM2 PTIM2 PTM1 PTIM1 PTM0 PTIM0 DDRM7 DDRM6 DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 101 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0253 RDRM 0x0254 PERM 0x0255 PPSM 0x0256 WOMM 0x0257 MODRR 0x0258 PTP 0x0259 PTIP 0x025A DDRP 0x025B RDRP 0x025C PERP 0x025D PPSP 0x025E PIEP 0x025F PIFP 0x0260 PTH 0x0261 PTIH 0x0262 DDRH R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 RDRM7 6 RDRM6 5 RDRM5 4 RDRM4 3 RDRM3 2 RDRM2 1 RDRM1 Bit 0 RDRM0 PERM7 PERM6 PERM5 PERM4 PERM3 PERM2 PERM1 PERM0 PPSM7 PPSM6 PPSM5 PPSM4 PPSM3 PPSM2 PPSM1 PPSM0 WOMM7 0 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0 MODRR6 MODRR5 MODRR4 MODRR3 MODRR2 MODRR1 MODRR0 PTP7 PTIP7 PTP6 PTIP6 PTP5 PTIP5 PTP4 PTIP4 PTP3 PTIP3 PTP2 PTIP2 PTP1 PTIP1 PTP0 PTIP0 DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 RDRP7 RDRP6 RDRP5 RDRP4 RDRP3 RDRP2 RDRP1 RDRP0 PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0 PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 PTH7 PTIH7 PTH6 PTIH6 PTH5 PTIH5 PTH4 PTIH4 PTH3 PTIH3 PTH2 PTIH2 PTH1 PTIH1 PTH0 PTIH0 DDRH7 DDRH6 DDRH5 DDRH4 DDRH3 DDRH2 DDRH1 DDRH0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 102 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0263 RDRH 0x0264 PERH 0x0265 PPSH 0x0266 PIEH 0x0267 PIFH 0x0268 PTJ 0x0269 PTIJ 0x026A DDRJ 0x026B RDRJ 0x026C PERJ 0x026D PPSJ 0x026E PIEJ 0x026F PIFJ 0x0270 PT0AD0 0x0271 PT1AD0 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 RDRH7 RDRH6 RDRH5 RDRH4 RDRH3 RDRH2 RDRH1 RDRH0 PERH7 PERH6 PERH5 PERH4 PERH3 PERH2 PERH1 PERH0 PPSH7 PPSH6 PPSH5 PPSH4 PPSH3 PPSH2 PPSH1 PPSH0 PIEH7 PIEH6 PIEH5 PIEH4 PIEH3 PIEH2 PIEH1 PIEH0 PIFH7 PIFH6 PIFH5 PIFH4 PIFH3 PIFH2 PIFH1 PIFH0 PTJ7 PTIJ7 PTJ6 PTIJ6 PTJ5 PTIJ5 PTJ4 PTIJ4 PTJ3 PTIJ3 PTJ2 PTIJ2 PTJ1 PTIJ1 PTJ0 PTIJ0 DDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0 RDRJ7 RDRJ6 RDRJ5 RDRJ4 RDRJ3 RDRJ2 RDRJ1 RDRJ0 PERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0 PPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0 PIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0 PIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0 PT0AD07 PT0AD06 PT0AD05 PT0AD04 PT0AD03 PT0AD02 PT0AD01 PT0AD00 PT1AD07 PT1AD06 PT1AD05 PT1AD04 PT1AD03 PT1AD02 PT1AD01 PT1AD00 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 103 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name Bit 7 6 5 4 3 2 1 Bit 0 0x0272 R DDR0AD0 W DDR0AD07 DDR0AD06 DDR0AD05 DDR0AD04 DDR0AD03 DDR0AD02 DDR0AD01 DDR0AD00 0x0273 R DDR1AD0 W DDR1AD07 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00 0x0274 R RDR0AD0 W RDR0AD07 RDR0AD06 RDR0AD05 RDR0AD04 RDR0AD03 RDR0AD02 RDR0AD01 RDR0AD00 0x0275 R RDR1AD0 W RDR1AD07 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00 0x0276 R PER0AD0 W PER0AD07 0x0277 R PER1AD0 W PER1AD07 0x0278 PT0AD1 0x0279 PT1AD1 R W R W PT0AD17 PER0AD06 PER0AD05 PER0AD04 PER0AD03 PER0AD02 PER0AD01 PER0AD00 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00 PT0AD16 PT0AD15 PT0AD14 PT0AD13 PT0AD12 PT0AD11 PT0AD10 PT1AD17 PT1AD16 PT1AD15 PT1AD14 PT1AD13 PT1AD12 PT1AD11 PT1AD10 0x027A R DDR0AD1 W DDR0AD17 DDR0AD16 DDR0AD15 DDR0AD14 DDR0AD13 DDR0AD12 DDR0AD11 DDR0AD10 0x027B R DDR1AD1 W DDR1AD17 DDR1AD16 DDR1AD15 DDR1AD14 DDR1AD13 DDR1AD12 DDR1AD11 DDR1AD10 0x027C R RDR0AD1 W RDR0AD17 RDR0AD16 RDR0AD15 RDR0AD14 RDR0AD13 RDR0AD12 RDR0AD11 RDR0AD10 0x027D R RDR1AD1 W RDR1AD17 RDR1AD16 RDR1AD15 RDR1AD14 RDR1AD13 RDR1AD12 RDR1AD11 RDR1AD10 0x027E R PER0AD1 W PER0AD17 0x027F R PER1AD1 W PER1AD17 0x0280- R 0x0267 W Non-PIM Address Range PER0AD16 PER0AD15 PER0AD14 PER0AD13 PER0AD12 PER0AD1` PER0AD10 PER1AD16 PER1AD15 PER1AD14 PER1AD13 PER1AD12 PER1AD11 PER1AD10 Non-PIM Address Range = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 104 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0368 PTR 0x0369 PTIR 0x036A DDRR 0x036B RDRR 0x036C PERR 0x036D PPSR R W R W R W R W R W R W Bit 7 PTR7 PTIR7 6 PTR6 PTIR6 5 PTR5 PTIR5 4 PTR4 PTIR4 3 PTR3 PTIR3 2 PTR2 PTIR2 1 PTR1 PTIR1 Bit 0 PTR0 PTIR0 DDRR7 DDRR6 DDRR5 DDRR4 DDRR3 DDRR2 DDRR1 DDRR0 RDRR7 RDRR6 RDRR5 RDRR4 RDRR3 RDRR2 RDRR1 RDRR0 PERR7 PERR6 PERR5 PERR4 PERR3 PERR2 PERR1 PERR0 PPSR7 0 PPSR6 0 PPSR5 0 PPSR4 0 PPSR3 0 PPSR2 0 PPSR1 0 PPSR0 0 0x036E R Reserved W 0x036F PTRRR 0x0370 PTL 0x0371 PTIL 0x0372 DDRL 0x0373 RDRL 0x0374 PERL 0x0375 PPSL 0x0376 WOML 0x0377 PTLRR R W R W R W R W R W R W R W R W R W PTRRR7 PTRRR6 PTRRR5 PTRRR4 PTRRR3 PTRRR2 PTRRR1 PTRRR0 PTL7 PTIL7 PTL6 PTIL6 PTL5 PTIL5 PTL4 PTIL4 PTL3 PTIL3 PTL2 PTIL2 PTL1 PTIL1 PTL0 PTIL0 DDRL7 DDRL6 DDRL5 DDRL4 DDRL3 DDRL2 DDRL1 DDRL0 RDRL7 RDRL6 RDRL5 RDRL4 RDRL3 RDRL2 RDRL1 RDRL0 PERL7 PERL6 PERL5 PERL4 PERL3 PERL2 PERL1 PERL0 PPSL7 PPSL6 PPSL5 PPSL4 PPSL3 PPSL2 PPSL1 PPSL0 WOML7 WOML6 WOML5 WOML4 WOML3 0 WOML2 0 WOML1 0 WOML0 0 PTLRR7 PTLRR6 PTLRR5 PTLRR4 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 105 Chapter 2 Port Integration Module (S12XEPIMV1) Register Name 0x0378 PTF 0x0379 PTIF 0x037A DDRF 0x037B RDRF 0x037C PERF 0x037D PPSF R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 PTF7 PTIF7 PTF6 PTIF6 PTF5 PTIF5 PTF4 PTIF4 PTF3 PTIF3 PTF2 PTIF2 PTF1 PTIF1 PTF0 PTIF0 DDRF7 DDRF6 DDRF5 DDRF4 DDRF3 DDRF2 DDRF1 DDRF0 RDRF7 RDRF6 RDRF5 RDRF4 RDRF3 RDRF2 RDRF1 RDRF0 PERF7 PERF6 PERF5 PERF4 PERF3 PERF2 PERF1 PERF0 PPSF7 0 PPSF6 0 PPSF5 0 PPSF4 0 PPSF3 0 PPSF2 0 PPSF1 0 PPSF0 0 0x037E R Reserved W 0x037F PTFRR R W 0 0 PTFRR5 PTFRR4 PTFRR3 PTFRR2 PTFRR1 PTFRR0 = Unimplemented or Reserved 2.3.2 Register Descriptions The following table summarizes the effect of the various configuration bits, i.e. data direction (DDR), output level (IO), reduced drive (RDR), pull enable (PE), pull select (PS) on the pin function and pull device activity. The configuration bit PS is used for two purposes: 1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled. 2. Select either a pull-up or pull-down device if PE is active. MC9S12XE-Family Reference Manual , Rev. 1.21 106 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-3. Pin Configuration Summary DDR 0 0 0 0 0 0 0 1 1 1 1 1 1 1 IO x x x x x x x 0 1 0 1 0 1 0 RDR x x x x x x x 0 0 1 1 0 0 1 PE 0 1 1 0 0 1 1 x x x x x x x PS(1) x 0 1 0 1 0 1 x x x x 0 1 0 IE(2) 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Input Input Input Input Input Input Input Output, full drive to 0 Output, full drive to 1 Output, reduced drive to 0 Output, reduced drive to 1 Output, full drive to 0 Output, full drive to 1 Output, reduced drive to 0 Output, reduced drive to 1 Function Pull Device Disabled Pull Up Pull Down Disabled Disabled Pull Up Pull Down Disabled Disabled Disabled Disabled Disabled Disabled Disabled Disabled Interrupt Disabled Disabled Disabled Falling edge Rising edge Falling edge Rising edge Disabled Disabled Disabled Disabled Falling edge Rising edge Falling edge Rising edge 1 1 1 x 1 1. Always "0" on Port A, B, C, D, E, K, AD0, and AD1. 2. Applicable only on Port P, H, and J. NOTE All register bits in this module are completely synchronous to internal clocks during a register read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 107 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.3 Port A Data Register (PORTA) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0000 (PRR) 7 R PA7 W Altern. Function ADDR15 mux IVD15 0 ADDR14 mux IVD14 0 ADDR13 mux IVD13 0 ADDR12 mux IVD12 0 ADDR11 mux IVD11 0 ADDR10 mux IVD10 0 ADDR9 mux IVD9 0 ADDR8 mux IVD8 0 PA6 PA5 PA4 PA3 PA2 PA1 PA0 Reset Figure 2-1. Port A Data Register (PORTA) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-4. PORTA Register Field Descriptions Field 7-0 PA Description Port A general purpose input/output data--Data Register Port A pins 7 through 0 are associated with address outputs ADDR[15:8] respectively in expanded modes. In emulation modes the address is multiplexed with IVD[15:8]. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.4 Port B Data Register (PORTB) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0001 (PRR) 7 R PB7 W Altern. Function ADDR0 mux IVD0 or UDS 0 PB6 PB5 PB4 PB3 PB2 PB1 PB0 ADDR7 mux IVD7 ADDR6 mux IVD6 ADDR5 mux IVD5 ADDR4 mux IVD4 ADDR3 mux IVD3 ADDR2 mux IVD2 ADDR1 mux IVD1 Reset 0 0 0 0 0 0 0 Figure 2-2. Port B Data Register (PORTB) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 108 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-5. PORTB Register Field Descriptions Field 7-0 PB Description Port B general purpose input/output data--Data Register Port B pins 7 through 0 are associated with address outputs ADDR[7:0] respectively in expanded modes. In emulation modes the address is multiplexed with IVD[7:0]. In normal expanded mode pin 0 is related to the UDS input. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.5 Port A Data Direction Register (DDRA) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0002 (PRR) 7 R DDRA7 W Reset 0 0 0 0 0 0 0 0 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0 Figure 2-3. Port A Data Direction Register (DDRA) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-6. DDRA Register Field Descriptions Field 7-0 DDRA Description Port A Data Direction-- This register controls the data direction of pins 7 through 0. The external bus function forces the I/O state to be outputs for all associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.6 Port B Data Direction Register (DDRB) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0003 (PRR) 7 R DDRB7 W Reset 0 0 0 0 0 0 0 0 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0 Figure 2-4. Port B Data Direction Register (DDRB) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 109 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-7. DDRB Register Field Descriptions Field 7-0 DDRB Description Port B Data Direction-- This register controls the data direction of pins 7 through 0. The external bus function forces the I/O state to be outputs for all associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.7 Port C Data Register (PORTC) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0004 (PRR) 7 R PC7 W Altern. Function Reset DATA15 0 DATA14 0 DATA13 0 DATA12 0 DATA11 0 DATA10 0 DATA9 0 DATA8 0 PC6 PC5 PC4 PC3 PC2 PC1 PC0 Figure 2-5. Port C Data Register (PORTC) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-8. PORTC Register Field Descriptions Field 7-0 PC Description Port C general purpose input/output data--Data Register Port C pins 7 through 0 are associated with data I/O lines DATA[15:8] respectively in expanded modes. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 110 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.8 Port D Data Register (PORTD) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0005 (PRR) 7 R PD7 W Altern. Function Reset DATA7 0 DATA6 0 DATA5 0 DATA4 0 DATA3 0 DATA2 0 DATA1 0 DATA0 0 PD6 PD5 PD4 PD3 PD2 PD1 PD0 Figure 2-6. Port D Data Register (PORTD) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-9. PORTD Register Field Descriptions Field 7-0 PD Description Port D general purpose input/output data--Data Register Port D pins 7 through 0 are associated with data I/O lines DATA[7:0] respectively in expanded modes. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.9 Port C Data Direction Register (DDRC) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0006 (PRR) 7 R DDRC7 W Reset 0 0 0 0 0 0 0 0 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0 Figure 2-7. Port C Data Direction Register (DDRC) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 111 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-10. DDRC Register Field Descriptions Field 7-0 DDRC Description Port C Data Direction-- This register controls the data direction of pins 7 through 0. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.10 Port D Data Direction Register (DDRD) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0007 (PRR) 7 R DDRD7 W Reset 0 0 0 0 0 0 0 0 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0 Figure 2-8. Port D Data Direction Register (DDRD) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-11. DDRD Register Field Descriptions Field 7-0 DDRD Description Port D Data Direction-- This register controls the data direction of pins 7 through 0. When used with the external bus this function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. MC9S12XE-Family Reference Manual , Rev. 1.21 112 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.11 Port E Data Register (PORTE) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0008 (PRR) 7 R PE7 W Altern. Function MODA or RE or TAGLO 0 EROMCTL or LSTRB or LDS 0 PE6 PE5 PE4 PE3 PE2 PE1 PE0 XCLKS or ECLKX2 MODB or TAGHI ECLK RW or WE IRQ XIRQ Reset 0 0 0 0 --(2) --2 = Unimplemented or Reserved Figure 2-9. Port E Data Register (PORTE) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. 2. These registers are reset to zero. Two bus clock cycles after reset release the register values are updated with the associated pin values. Table 2-12. PORTE Register Field Descriptions Field 7-2 PE Description Port E general purpose input/output data--Data Register Port E bits 7 through 0 are associated with external bus control signals and interrupt inputs. These include mode select (MODB, MODA), E clock, double frequency E clock, Instruction Tagging High and Low (TAGHI, TAGLO), Read/Write (RW), Read Enable and Write Enable (RE, WE), Lower Data Select (LDS). When not used with the alternative functions, Port E pins 7-2 can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Pins 6 and 5 are inputs with enabled pull-down devices while RESET pin is low. Pins 7 and 3 are inputs with enabled pull-up devices while RESET pin is low. Port E general purpose input data and interrupt--Data Register, IRQ input. This pin can be used as general purpose and IRQ input. Port E general purpose input data and interrupt--Data Register, XIRQ input. This pin can be used as general purpose and XIRQ input. 1 PE 0 PE MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 113 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.12 Port E Data Direction Register (DDRE) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0009 (PRR) 7 R DDRE7 W Reset 0 0 0 0 0 0 DDRE6 DDRE5 DDRE4 DDRE3 DDRE2 0 0 0 0 = Unimplemented or Reserved Figure 2-10. Port E Data Direction Register (DDRE) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-13. DDRE Register Field Descriptions Field 7-2 DDRE Description Port E Data Direction-- This register controls the data direction of pins 7 through 2. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. Reserved-- Port E bit 1 (associated with IRQ) and bit 0 (associated with XIRQ) cannot be configured as outputs. Port E, bits 1 and 0, can be read regardless of whether the alternate interrupt function is enabled. 1-0 2.3.13 S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x000C (PRR) 7 R PUPKE W Reset 1 1 BKPUE 0 PUPEE 0 1 PUPDE 0 PUPCE 0 PUPBE 0 PUPAE 0 = Unimplemented or Reserved Figure 2-11. S12X_EBI ports, BKGD pin Pull-up Control Register (PUCR) 1. Read:Anytime in single-chip modes. Write:Anytime, except BKPUE which is writable in Special Test Mode only. MC9S12XE-Family Reference Manual , Rev. 1.21 114 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-14. PUCR Register Field Descriptions Field 7 PUPKE Description Pull-up Port K Enable--Enable pull-up devices on all Port K input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are enabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. BKGD pin pull-up Enable--Enable pull-up devices on BKGD pin This bit configures whether a pull-up device is activated, if the pin is used as input. This bit has no effect if the pin is used as outputs. Out of reset the pull-up device is enabled. 1 Pull-up device enabled. 0 Pull-up device disabled. Reserved-- Pull-up Port E Enable--Enable pull-up devices on all Port E input pins except on pins 5 and 6 which have pull-down devices only enabled during reset. This bit has no effect on these pins. This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are enabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. Pull-up Port D Enable--Enable pull-up devices on all Port D input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. Pull-up Port C Enable--Enable pull-up devices on all Port C input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. Pull-up Port B Enable--Enable pull-up devices on all Port B input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. Pull-up Port A Enable--Enable pull-up devices on all Port A input pins This bit configures whether pull-up devices are activated, if the pins are used as inputs. This bit has no effect if the pins are used as outputs. Out of reset the pull-up devices are disabled. 1 Pull-up devices enabled. 0 Pull-up devices disabled. 6 BKPUE 5 4 PUPEE 3 PUPDE 2 PUPCE 1 PUPBE 0 PUPAE MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 115 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.14 S12X_EBI ports Reduced Drive Register (RDRIV) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x000D (PRR) 7 R RDPK W Reset 0 0 0 RDPE RDPD 0 RDPC 0 RDPB 0 RDPA 0 0 0 0 = Unimplemented or Reserved Figure 2-12. S12X_EBI ports Reduced Drive Register (RDRIV) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. This register is used to select reduced drive for the pins associated with the S12X_EBI ports A, B, C, D, E, and K. If enabled, the pins drive at approx. 1/5 of the full drive strength. The reduced drive functionality does not take effect on the pins in emulation modes. Table 2-15. RDRIV Register Field Descriptions Field 7 RDPK Description Port K reduced drive--Select reduced drive for outputs This bit configures the drive strength of all Port K output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Reserved-- Port E reduced drive--Select reduced drive for outputs This bit configures the drive strength of all Port E output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port D reduced drive--Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port C reduced drive--Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 6-5 4 RDPE 3 RDPD 2 RDPC MC9S12XE-Family Reference Manual , Rev. 1.21 116 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-15. RDRIV Register Field Descriptions (continued) Field 1 RDPB Description Port B reduced drive--Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. Port A reduced drive--Select reduced drive for outputs This bit configures the drive strength of all output pins as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 0 RDPA 2.3.15 ECLK Control Register (ECLKCTL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x001C (PRR) 7 R NECLK W Reset(2): Mode Dependent 0 1 0 0 1 0 NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0 1 0 0 0 0 0 0 SS ES ST EX NS NX 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-13. ECLK Control Register (ECLKCTL) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. 2. Reset values in emulation modes are identical to those of the target mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 117 Chapter 2 Port Integration Module (S12XEPIMV1) The ECLKCTL register is used to control the availability of the free-running clocks and the free-running clock divider. Table 2-16. ECLKCTL Register Field Descriptions Field 7 NECLK Description No ECLK--Disable ECLK output This bit controls the availability of a free-running clock on the ECLK pin. Clock output is always active in emulation modes and if enabled in all other operating modes. 1 ECLK disabled 0 ECLK enabled No ECLKX2--Disable ECLKX2 output This bit controls the availability of a free-running clock on the ECLKX2 pin. This clock has a fixed rate of twice the internal Bus Clock. Clock output is always active in emulation modes and if enabled in all other operating modes. 1 ECLKX2 disabled 0 ECLKX2 enabled Free-running ECLK predivider--Divide by 16 This bit enables a divide-by-16 stage on the selected EDIV rate. 1 Divider enabled: ECLK rate = EDIV rate divided by 16 0 Divider disabled: ECLK rate = EDIV rate Free-running ECLK Divider--Configure ECLK rate These bits determine the rate of the free-running clock on the ECLK pin. Divider is always disabled in emulation modes and active as programmed in all other operating modes. 00000 ECLK rate = Bus Clock rate 00001 ECLK rate = Bus Clock rate divided by 2 00010 ECLK rate = Bus Clock rate divided by 3, ... 11111 ECLK rate = Bus Clock rate divided by 32 6 NCLKX2 5 DIV16 4-0 EDIV 2.3.16 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 Address 0x001D (PRR) 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-14. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 118 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.17 IRQ Control Register (IRQCR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x001E 7 R IRQE W Reset 0 1 IRQEN 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-15. IRQ Control Register (IRQCR) 1. Read: See individual bit descriptions below. Write: See individual bit descriptions below. Table 2-17. IRQCR Register Field Descriptions Field 7 IRQE Description IRQ select edge sensitive only-- Special modes: Read or write anytime. Normal & emulation modes: Read anytime, write once. 1 IRQ configured to respond only to falling edges. Falling edges on the IRQ pin will be detected anytime IRQE = 1 and will be cleared only upon a reset or the servicing of the IRQ interrupt. 0 IRQ configured for low level recognition. External IRQ enable-- Read or write anytime. 1 External IRQ pin is connected to interrupt logic. 0 External IRQ pin is disconnected from interrupt logic. Reserved-- 6 IRQEN 5-0 2.3.18 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 This register is reserved for factory testing of the PIM module and is not available in normal operation. Address 0x001F 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-16. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented NOTE Writing to this register when in special modes can alter the pin functionality. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 119 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.19 Port K Data Register (PORTK) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0032 (PRR) 7 R PK7 W Altern. Function ROMCTL or EWAIT 0 ADDR22 mux ACC2 0 ADDR21 mux ACC1 0 ADDR20 mux ACC0 0 ADDR19 mux IQSTAT3 0 ADDR18 mux IQSTAT2 0 ADDR17 mux IQSTAT1 0 ADDR16 mux IQSTAT0 0 PK6 PK5 PK4 PK3 PK2 PK1 PK0 Reset Figure 2-17. Port K Data Register (PORTK) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. Table 2-18. PORTK Register Field Descriptions Field 7-0 PK Description Port K general purpose input/output data--Data Register Port K pins 7 through 0 are associated with external bus control signals and internal memory expansion emulation pins. These include ADDR[22:16], Access Source (ACC[2:0]), External Wait (EWAIT) and instruction pipe signals IQSTAT[3:0]. Bits 6-0 carry the external addresses in all expanded modes. In emulation modes the address is multiplexed with the alternate functions ACC and IQSTAT on the respective pins. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.20 Port K Data Direction Register (DDRK) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0033 (PRR) 7 R DDRK7 W Reset 0 0 0 0 0 0 0 0 DDRK6 DDRK5 DDRK4 DDRK3 DDRK2 DDRK1 DDRK0 Figure 2-18. Port K Data Direction Register (DDRK) 1. Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data source is depending on the data direction value. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual , Rev. 1.21 120 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-19. DDRK Register Field Descriptions Field 7-0 DDRK Description Port K Data Direction-- This register controls the data direction of pins 7 through 0. The external bus function controls the data direction for the associated pins. In this case the data direction bits will not change. When operating a pin as a general purpose I/O, the associated data direction bit determines whether it is an input or output. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. 2.3.21 Port T Data Register (PTT) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0240 7 R PTT7 W Altern. Function IOC7 -- Reset 0 IOC6 -- 0 IOC5 VREG_API 0 IOC4 -- 0 IOC3 -- 0 IOC2 -- 0 IOC1 -- 0 IOC0 -- 0 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0 Figure 2-19. Port T Data Register (PTT) 1. Read: Anytime. Write: Anytime. Table 2-20. PTT Register Field Descriptions Field 7-6 PTT Description Port T general purpose input/output data--Data Register Port T pins 7 through 0 are associated with ECT channels IOC7 and IOC6. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port T general purpose input/output data--Data Register Port T pins 5 is associated with ECT channel IOC5 and the VREG_API output. The ECT function takes precedence over the VREG_API and the general purpose I/O function if the related channel is enabled. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port T general purpose input/output data--Data Register Port T pins 4 through 0 are associated with ECT channels IOC4 through IOC0. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTT 4-0 PTT MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 121 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.22 Port T Input Register (PTIT) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0241 7 R W Reset PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-20. Port T Input Register (PTIT) Table 2-21. PTIT Register Field Descriptions Field 7-0 PTIT Description Port T input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.23 Port T Data Direction Register (DDRT) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0242 7 R DDRT7 W Reset 0 0 0 0 0 0 0 0 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0 Figure 2-21. Port T Data Direction Register (DDRT) 1. Read: Anytime. Write: Anytime. Table 2-22. DDRT Register Field Descriptions Field 7-0 DDRT Description Port T data direction-- This register controls the data direction of pins 7 through 0. The ECT forces the I/O state to be an output for each timer port associated with an enabled output compare. In this case the data direction bits will not change. The data direction bits revert to controlling the I/O direction of a pin when the associated timer output compare is disabled. The timer Input Capture always monitors the state of the pin. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. MC9S12XE-Family Reference Manual , Rev. 1.21 122 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTT or PTIT registers, when changing the DDRT register. 2.3.24 Port T Reduced Drive Register (RDRT) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0243 7 R RDRT7 W Reset 0 0 0 0 0 0 0 0 RDRT6 RDRT5 RDRT4 RDRT3 RDRT2 RDRT1 RDRT0 Figure 2-22. Port T Reduced Drive Register (RDRT) 1. Read: Anytime. Write: Anytime. Table 2-23. RDRT Register Field Descriptions Field 7-0 RDRT Description Port T reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.25 Port T Pull Device Enable Register (PERT) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0244 7 R PERT7 W Reset 0 0 0 0 0 0 0 0 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0 Figure 2-23. Port T Pull Device Enable Register (PERT) 1. Read: Anytime. Write: Anytime. Table 2-24. PERT Register Field Descriptions Field 7-0 PERT Description Port T pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 123 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.26 Port T Polarity Select Register (PPST) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0245 7 R PPST7 W Reset 0 0 0 0 0 0 0 0 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0 Figure 2-24. Port T Polarity Select Register (PPST) 1. Read: Anytime. Write: Anytime. Table 2-25. PPST Register Field Descriptions Field 7-0 PPST Description Port T pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. 2.3.27 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 Address 0x0246 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-25. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.28 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 Address 0x0247 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-26. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 124 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.29 Port S Data Register (PTS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0248 7 R PTS7 W Altern. Function Reset SS0 0 SCK0 0 MOSI0 0 MISO0 0 TXD1 0 RXD1 0 TXD0 0 RXD0 0 PTST6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0 Figure 2-27. Port S Data Register (PTS) 1. Read: Anytime. Write: Anytime. Table 2-26. PTS Register Field Descriptions Field 7 PTS Description Port S general purpose input/output data--Data Register Port S pin 7 is associated with the SS signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S pin 6 is associated with the SCK signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S pin 5 is associated with the MOSI signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S pin 4 is associated with the MISO signal of the SPI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S pin 3 is associated with the TXD signal of the SCI1 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S bits 2 is associated with the RXD signal of the SCI1 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTS 5 PTS 4 PTS 3 PTS 2 PTS MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 125 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-26. PTS Register Field Descriptions (continued) Field 1 PTS Description Port S general purpose input/output data--Data Register Port S pin 3 is associated with the TXD signal of the SCI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port S general purpose input/output data--Data Register Port S bits 2 is associated with the RXD signal of the SCI0 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTS 2.3.30 Port S Input Register (PTIS) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0249 7 R W Reset PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-28. Port S Input Register (PTIS) Table 2-27. PTIS Register Field Descriptions Field 7-0 PTIS Description Port S input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.31 Port S Data Direction Register (DDRS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x024A 7 R DDRS7 W Reset 0 0 0 0 0 0 0 0 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0 Figure 2-29. Port S Data Direction Register (DDRS) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 126 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-28. DDRS Register Field Descriptions Field 7-0 DDRS Description Port S data direction-- This register controls the data direction of pins 7 through 0.This register configures each Port S pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTS or PTIS registers, when changing the DDRS register. 2.3.32 Port S Reduced Drive Register (RDRS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x024B 7 R RDRS7 W Reset 0 0 0 0 0 0 0 0 RDRS6 RDRS5 RDRS4 RDRS3 RDRS2 RDRS1 RDRS0 Figure 2-30. Port S Reduced Drive Register (RDRS) 1. Read: Anytime. Write: Anytime. Table 2-29. RDRS Register Field Descriptions Field 7-0 RDRS Description Port S reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 127 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.33 Port S Pull Device Enable Register (PERS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x024C 7 R PERS7 W Reset 1 1 1 1 1 1 1 1 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0 Figure 2-31. Port S Pull Device Enable Register (PERS) 1. Read: Anytime. Write: Anytime. Table 2-30. PERS Register Field Descriptions Field 7-0 PERS Description Port S pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.34 Port S Polarity Select Register (PPSS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x024D 7 R PPSS7 W Reset 0 0 0 0 0 0 0 0 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0 Figure 2-32. Port S Polarity Select Register (PPSS) 1. Read: Anytime. Write: Anytime. Table 2-31. PPSS Register Field Descriptions Field 7-0 PPSS Description Port S pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 128 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.35 Port S Wired-Or Mode Register (WOMS) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x024E 7 R WOMS7 W Reset 0 0 0 0 0 0 0 0 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0 Figure 2-33. Port S Wired-Or Mode Register (WOMS) 1. Read: Anytime. Write: Anytime. Table 2-32. WOMS Register Field Descriptions Field 7-0 WOMS Description Port S wired-or mode--Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of "1" is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. 2.3.36 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 Address 0x024F 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved 1. Read: Always reads 0x00 Write: Unimplemented u = Unaffected by reset Figure 2-34. PIM Reserved Register MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 129 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.37 Port M Data Register (PTM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0250 7 R PTM7 W Altern. Function TXCAN3 -- (TXCAN4) -- TXD3 Reset 0 RXCAN3 -- (RXCAN4) -- RXD3 0 TXCAN2 (TXCAN0) (TXCAN4) (SCK0) -- 0 RXCAN2 (RXCAN0) (RXCAN4) (MOSI0) -- 0 TXCAN1 (TXCAN0) -- (SS0) -- 0 RXCAN1 (RXCAN0) -- (MISO0) -- 0 TXCAN0 -- -- -- -- 0 RXCAN0 -- -- -- -- 0 PTM6 PTM5 PTM4 PTM3 PTM2 PTM1 PTM0 Figure 2-35. Port M Data Register (PTM) 1. Read: Anytime. Write: Anytime. Table 2-33. PTM Register Field Descriptions Field 7-6 PTM Description Port M general purpose input/output data--Data Register Port M pins 7 and 6 are associated with TXCAN and RXCAN signals of CAN3 and the routed CAN4, as well as with TXD and RXD signals of SCI3, respectively. The CAN3 function takes precedence over the CAN4, SCI3 and the general purpose I/O function if the CAN3 module is enabled. The CAN4 function takes precedence over the SCI3 and the general purpose I/O function if the CAN4 module is enabled. The SCI3 function takes precedence over the general purpose I/O function if the SCI3 module is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port M general purpose input/output data--Data Register Port M pin 5 is associated with the TXCAN signal of CAN2 and the routed CAN4 and CAN0, as well as with SCK signals of SPI0. The CAN2 function takes precedence over the routed CAN0, routed CAN4, the routed SPI0 and the general purpose I/O function if the CAN2 module is enabled. The routed CAN0 function takes precedence over the routed CAN4, the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed CAN4 function takes precedence over the routed SPI0 and general purpose I/O function if the routed CAN4 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5 PTM MC9S12XE-Family Reference Manual , Rev. 1.21 130 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-33. PTM Register Field Descriptions (continued) Field 4 PTM Description Port M general purpose input/output data--Data Register Port M pin 4 is associated with the RXCAN signal of CAN2 and the routed CAN4 and CAN0, as well as with MOSI signals of SPI0. The CAN2 function takes precedence over the routed CAN0, routed CAN4, the routed SPI0 and the general purpose I/O function if the CAN2 module is enabled. The routed CAN0 function takes precedence over the routed CAN4, the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed CAN4 function takes precedence over the routed SPI0 and general purpose I/O function if the routed CAN4 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port M general purpose input/output data--Data Register Port M pin 5 is associated with the TXCAN signal of CAN1 and the routed CAN0, as well as with SS0 signals of SPI0. The CAN1 function takes precedence over the routed CAN0, the routed SPI0 and the general purpose I/O function if the CAN1 module is enabled. The routed CAN0 function takes precedence over the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port M general purpose input/output data--Data Register Port M pin 4 is associated with the RXCAN signal of CAN1 and the routed CAN0, as well as with MISO signals of SPI0. The CAN1 function takes precedence over the routed CAN0, the routed SPI0 and the general purpose I/O function if the CAN1 module is enabled. The routed CAN0 function takes precedence over the routed SPI0 and the general purpose I/O function if the routed CAN0 module is enabled. The routed SPI0 function takes precedence of the general purpose I/O function if the routed SPI0 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port M general purpose input/output data--Data Register Port M pins 1 and 0 are associated with TXCAN and RXCAN signals of CAN0, respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 3 PTM 2 PTM 1-0 PTM 2.3.38 Port M Input Register (PTIM) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0251 7 R W Reset PTIM7 PTIM6 PTIM5 PTIM4 PTIM3 PTIM2 PTIM1 PTIM0 u u u u u u u u = Unimplemented or Reserved u = Unaffected by reset Figure 2-36. Port M Input Register (PTIM) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 131 Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write:Never, writes to this register have no effect. Table 2-34. PTIM Register Field Descriptions Field 7-0 PTIM Description Port M input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.39 Port M Data Direction Register (DDRM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0252 7 R DDRM7 W Reset 0 0 0 0 0 0 0 0 DDRM6 DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0 Figure 2-37. Port M Data Direction Register (DDRM) 1. Read: Anytime. Write: Anytime. Table 2-35. DDRM Register Field Descriptions Field 7 DDRM Description Port M data direction-- This register controls the data direction of pin 7. The enabled CAN3, routed CAN4, or routed SCI3 forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 6. The enabled CAN3, routed CAN4, or routed SCI3 forces the I/O state to be an input. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 5. The enabled CAN2, routed CAN0, or routed CAN4 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRM 5 DDRM MC9S12XE-Family Reference Manual , Rev. 1.21 132 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-35. DDRM Register Field Descriptions (continued) Field 4 DDRM Description Port M data direction-- This register controls the data direction of pin 4. The enabled CAN2, routed CAN0, or routed CAN4 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output.In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 3. The enabled CAN1 or routed CAN0 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 2. The enabled CAN1 or routed CAN0 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI0 this pin will be forced to be input or output.In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 1. The enabled CAN0 forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port M data direction-- This register controls the data direction of pin 0. The enabled CAN0 forces the I/O state to be an input. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 3 DDRM 2 DDRM 1 DDRM 0 DDRM NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTM or PTIM registers, when changing the DDRM register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 133 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.40 Port M Reduced Drive Register (RDRM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0253 7 R RDRM7 W Reset 0 0 0 0 0 0 0 0 RDRM6 RDRM5 RDRM4 RDRM3 RDRM2 RDRM1 RDRM0 Figure 2-38. Port M Reduced Drive Register (RDRM) 1. Read: Anytime. Write: Anytime. Table 2-36. RDRM Register Field Descriptions Field 7-0 RDRM Description Port M reduced drive--Select reduced drive for outputs This register configures the drive strength of Port M output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.41 Port M Pull Device Enable Register (PERM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0254 7 R PERM7 W Reset 0 0 0 0 0 0 0 0 PERM6 PERM5 PERM4 PERM3 PERM2 PERM1 PERM0 Figure 2-39. Port M Pull Device Enable Register (PERM) 1. Read: Anytime. Write: Anytime. Table 2-37. PERM Register Field Descriptions Field 7-0 PERM Description Port M pull device enable--Enable pull-up devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input or wired-or output. This bit has no effect if the pin is used as push-pull output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 134 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.42 Port M Polarity Select Register (PPSM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0255 7 R PPSM7 W Reset 0 0 0 0 0 0 0 0 PPSM6 PPSM5 PPSM4 PPSM3 PPSM2 PPSM1 PPSM0 Figure 2-40. Port M Polarity Select Register (PPSM) 1. Read: Anytime. Write: Anytime. Table 2-38. PPSM Register Field Descriptions Field 7-0 PPSM Description Port M pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. If CAN is active a pull-up device can be activated on the RXCAN[3:0] inputs, but not a pull-down. 1 A pull-down device is connected to the associated Port M pin, if enabled by the associated bit in register PERM and if the port is used as a general purpose but not as RXCAN. 0 A pull-up device is connected to the associated Port M pin, if enabled by the associated bit in register PERM and if the port is used as general purpose or RXCAN input. 2.3.43 Port M Wired-Or Mode Register (WOMM) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0256 7 R WOMM7 W Reset 0 0 0 0 0 0 0 0 WOMM6 WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0 Figure 2-41. Port M Wired-Or Mode Register (WOMM) 1. Read: Anytime. Write: Anytime. Table 2-39. WOMM Register Field Descriptions Field 7-0 WOMM Description Port M wired-or mode--Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of "1" is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 135 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.44 Module Routing Register (MODRR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0257 7 R W Reset 0 MODRR6 0 0 MODRR5 0 MODRR4 0 MODRR3 0 MODRR2 0 MODRR1 0 MODRR0 0 = Unimplemented or Reserved Figure 2-42. Module Routing Register (MODRR) 1. Read: Anytime. Write: Anytime. This register configures the re-routing of CAN0, CAN4, SPI0, SPI1, and SPI2 on alternative ports. Table 2-40. Module Routing Summary Module 6 5 4 MODRR 3 2 1 0 RXCAN CAN0 x x x x CAN4 x x x x x x x x x x x x x x x x x x x x x x x x 0 0 1 1 x x x x 0 1 0 1 0 0 1 1 x x x x 0 1 0 1 x x x x MISO SPI0 SPI1 SPI2 x x x x 0 1 x x 0 1 x x 0 1 x x x x x x x x x x x x x x x x x x x x x x x x x x x x PS4 PM2 PP0 PH0 PP4 PH4 PM0 PM2 PM4 PJ6 PJ6 PM4 PM6 Reserved MOSI PS5 PM4 PP1 PH1 PP5 PH5 SCK PS6 PM5 PP2 PH2 PP7 PH6 SS PS7 PM3 PP3 PH3 PP6 PH7 TXCAN PM1 PM3 PM5 PJ7 PJ7 PM5 PM7 Related Pins MC9S12XE-Family Reference Manual , Rev. 1.21 136 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.45 Port P Data Register (PTP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0258 7 R PTP7 W Altern. Function Reset PWM7 SCK2 0 PWM6 SS2 0 PWM5 MOSI2 0 PWM4 MISO2 0 PWM3 SS1 0 PWM2 SCK1 0 PWM1 MOSI1 0 PWM0 MISO1 0 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0 Figure 2-43. Port P Data Register (PTP) 1. Read: Anytime. Write: Anytime. Table 2-41. PTP Register Field Descriptions Field 7 PTP Description Port P general purpose input/output data--Data Register Port P pin 6 is associated with the PWM output channel 7 and the SCK signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 7 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 6 is associated with the PWM output channel 6 and the SS signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 6 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 5 is associated with the PWM output channel 5 and the MOSI signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 5 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 4 is associated with the PWM output channel 4 and the MISO signal of SPI2. The PWM function takes precedence over the SPI2 and the general purpose I/O function if the PWM channel 4 is enabled. The SPI2 function takes precedence of the general purpose I/O function if the routed SPI2 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTP 5 PTP 4 PTP MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 137 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-41. PTP Register Field Descriptions (continued) Field 3 PTP Description Port P general purpose input/output data--Data Register Port P pin 3 is associated with the PWM output channel 3 and the SS signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 3 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 2 is associated with the PWM output channel 2 and the SCK signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 2 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 1 is associated with the PWM output channel 1 and the MOSI signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 1 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port P general purpose input/output data--Data Register Port P pin 0 is associated with the PWM output channel 0 and the MISO signal of SPI1. The PWM function takes precedence over the SPI1 and the general purpose I/O function if the PWM channel 0 is enabled. The SPI1 function takes precedence of the general purpose I/O function if the routed SPI1 is enabled. When not used with the alternative functions, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2 PTP 1 PTP 0 PTP 2.3.46 Port P Input Register (PTIP) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0259 7 R W Reset PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-44. Port P Input Register (PTIP) MC9S12XE-Family Reference Manual , Rev. 1.21 138 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-42. PTIP Register Field Descriptions Field 7-0 PTIP Description Port P input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.47 Port P Data Direction Register (DDRP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025A 7 R DDRP7 W Reset 0 0 0 0 0 0 0 0 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0 Figure 2-45. Port P Data Direction Register (DDRP) 1. Read: Anytime. Write: Anytime. Table 2-43. DDRP Register Field Descriptions Field 7 DDRP Description Port P data direction-- This register controls the data direction of pin 7. The enabled PWM channel 7 forces the I/O state to be an output. If the PWM shutdown feature is enabled this pin is forced to be an input. In these cases the data direction bit will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port P data direction-- The PWM forces the I/O state to be an output for each port line associated with an enabled PWM6-0 channel. In this case the data direction bit will not change. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6-0 DDRP NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTP or PTIP registers, when changing the DDRP register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 139 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.48 Port P Reduced Drive Register (RDRP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025B 7 R RDRP7 W Reset 0 0 0 0 0 0 0 0 RDRP6 RDRP5 RDRP4 RDRP3 RDRP2 RDRP1 RDRP0 Figure 2-46. Port P Reduced Drive Register (RDRP) 1. Read: Anytime. Write: Anytime. Table 2-44. RDRP Register Field Descriptions Field 7-0 RDRP Description Port P reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.49 Port P Pull Device Enable Register (PERP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025C 7 R PPSP7 W Reset 0 0 0 0 0 0 0 0 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 Figure 2-47. Port P Pull Device Enable Register (PERP) 1. Read: Anytime. Write: Anytime. Table 2-45. PERP Register Field Descriptions Field 7-0 PERP Description Port P pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 140 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.50 Port P Polarity Select Register (PPSP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025D 7 R PPSP7 W Reset 0 0 0 0 0 0 0 0 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0 Figure 2-48. Port P Polarity Select Register (PPSP) 1. Read: Anytime. Write: Anytime. Table 2-46. PPSP Register Field Descriptions Field 7-0 PPSP Description Port P pull device select--Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port P pin sets the associated flag bit in the PIFP register. A pull-down device is connected to the associated Port P pin, if enabled by the associated bit in register PERP and if the port is used as input. 0 A falling edge on the associated Port P pin sets the associated flag bit in the PIFP register.A pull-up device is connected to the associated Port P pin, if enabled by the associated bit in register PERP and if the port is used as input. 2.3.51 Read: Anytime. Port P Interrupt Enable Register (PIEP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025E 7 R PIEP7 W Reset 0 0 0 0 0 0 0 0 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0 Figure 2-49. Port P Interrupt Enable Register (PIEP) 1. Read: Anytime. Write: Anytime. Table 2-47. PPSP Register Field Descriptions Field 7-0 PIEP Description Port P interrupt enable-- This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port P. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 141 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.52 Port P Interrupt Flag Register (PIFP) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x025F 7 R PIFP7 W Reset 0 0 0 0 0 0 0 0 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0 Figure 2-50. Port P Interrupt Flag Register (PIFP) 1. Read: Anytime. Write: Anytime. Table 2-48. PPSP Register Field Descriptions Field 7-0 PIFP Description Port P interrupt flag-- Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSP register. To clear this flag, write logic level 1 to the corresponding bit in the PIFP register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. 2.3.53 Port H Data Register (PTH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0260 7 R PTH7 W Altern. Function Reset SS2 TXD5 0 SCK2 RXD5 0 MOSI2 TXD4 0 MISO2 RXD4 0 SS1 TXD7 0 SCK1 RXD7 0 MOSI1 TXD6 0 MISO1 RXD6 0 PTH6 PTH5 PTH4 PTH3 PTH2 PTH1 PTH0 Figure 2-51. Port H Data Register (PTH) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 142 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-49. PTH Register Field Descriptions Field 7 PTH Description Port H general purpose input/output data--Data Register Port H pin 7 is associated with the TXD signal of the SCI5 module and the SS signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI5 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI5 function takes precedence over the general purpose I/O function if the SCI5 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 6 is associated with the RXD signal of the SCI5 module and the SCK signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI5 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI5 function takes precedence over the general purpose I/O function if the SCI5 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 5 is associated with the TXD signal of the SCI4 module and the MOSI signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI4 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI4 function takes precedence over the general purpose I/O function if the SCI4 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 4 is associated with the RXD signal of the SCI4 module and the MISO signal of the routed SPI2. The routed SPI2 function takes precedence over the SCI4 and the general purpose I/O function if the routed SPI2 module is enabled. The SCI4 function takes precedence over the general purpose I/O function if the SCI4 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 3 is associated with the TXD signal of the SCI7 module and the SS signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI7 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI7 function takes precedence over the general purpose I/O function if the SCI7 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 2 is associated with the RXD signal of the SCI7 module and the SCK signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI7 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI7 function takes precedence over the general purpose I/O function if the SCI7 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTH 5 PTH 4 PTH 3 PTH 2 PTH MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 143 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-49. PTH Register Field Descriptions (continued) Field 1 PTH Description Port H general purpose input/output data--Data Register Port H pin 1 is associated with the TXD signal of the SCI6 module and the MOSI signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI6 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI6 function takes precedence over the general purpose I/O function if the SCI6 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port H general purpose input/output data--Data Register Port H pin 0 is associated with the RXD signal of the SCI6 module and the MISO signal of the routed SPI1. The routed SPI1 function takes precedence over the SCI6 and the general purpose I/O function if the routed SPI1 module is enabled. The SCI6 function takes precedence over the general purpose I/O function if the SCI6 is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTH 2.3.54 Port H Input Register (PTIH) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0261 7 R W Reset PTIH7 PTIH6 PTIH5 PTIH4 PTIH3 PTIH2 PTIH1 PTIH0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-52. Port H Input Register (PTIH) Table 2-50. PTIH Register Field Descriptions Field 7-0 PTIH Description Port H input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.55 Port H Data Direction Register (DDRH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0262 7 R DDRH7 W Reset 0 0 0 0 0 0 0 0 DDRH6 DDRH5 DDRH4 DDRH3 DDRH2 DDRH1 DDRH0 Figure 2-53. Port H Data Direction Register (DDRH) MC9S12XE-Family Reference Manual , Rev. 1.21 144 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write: Anytime. Table 2-51. DDRH Register Field Descriptions Field 7 DDRH Description Port H data direction-- This register controls the data direction of pin 7. The enabled SCI5 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 6. The enabled SCI5 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 5. The enabled SCI4 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 4. The enabled SCI4 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI2 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 3. The enabled SCI7 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 2. The enabled SCI7 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRH 5 DDRH 4 DDRH 3 DDRH 2 DDRH MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 145 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-51. DDRH Register Field Descriptions (continued) Field 1 DDRH Description Port H data direction-- This register controls the data direction of pin 1. The enabled SCI6 forces the I/O state to be an output. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port H data direction-- This register controls the data direction of pin 0. The enabled SCI6 forces the I/O state to be an input. Depending on the configuration of the enabled routed SPI1 this pin will be forced to be input or output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 0 DDRH NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTH or PTIH registers, when changing the DDRH register. 2.3.56 Port H Reduced Drive Register (RDRH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0263 7 R RDRH7 W Reset 0 0 0 0 0 0 0 0 RDRH6 RDRH5 RDRH4 RDRH3 RDRH2 RDRH1 RDRH0 Figure 2-54. Port H Reduced Drive Register (RDRH) 1. Read: Anytime. Write: Anytime. Table 2-52. RDRH Register Field Descriptions Field 7-0 RDRH Description Port H reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 146 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.57 Port H Pull Device Enable Register (PERH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0264 7 R PERH7 W Reset 0 0 0 0 0 0 0 0 PERH6 PERH5 PERH4 PERH3 PERH2 PERH1 PERH0 Figure 2-55. Port H Pull Device Enable Register (PERH) 1. Read: Anytime. Write: Anytime. Table 2-53. PERH Register Field Descriptions Field 7-0 PERH Description Port H pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.58 Port H Polarity Select Register (PPSH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0265 7 R PPSH7 W Reset 0 0 0 0 0 0 0 0 PPSH6 PPSH5 PPSH4 PPSH3 PPSH2 PPSH1 PPSH0 Figure 2-56. Port H Polarity Select Register (PPSH) 1. Read: Anytime. Write: Anytime. Table 2-54. PPSH Register Field Descriptions Field 7-0 PPSH Description Port H pull device select--Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port H pin sets the associated flag bit in the PIFH register. A pull-down device is connected to the associated Port H pin, if enabled by the associated bit in register PERH and if the port is used as input. 0 A falling edge on the associated Port H pin sets the associated flag bit in the PIFH register.A pull-up device is connected to the associated Port H pin, if enabled by the associated bit in register PERH and if the port is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 147 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.59 Read: Anytime. Port H Interrupt Enable Register (PIEH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0266 7 R PIEH7 W Reset 0 0 0 0 0 0 0 0 PIEH6 PIEH5 PIEH4 PIEH3 PIEH2 PIEH1 PIEH0 Figure 2-57. Port H Interrupt Enable Register (PIEH) 1. Read: Anytime. Write: Anytime. Table 2-55. PPSP Register Field Descriptions Field 7-0 PIEH Description Port H interrupt enable-- This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port H. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). 2.3.60 Port H Interrupt Flag Register (PIFH) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0267 7 R PIFH7 W Reset 0 0 0 0 0 0 0 0 PIFH6 PIFH5 PIFH4 PIFH3 PIFH2 PIFH1 PIFH0 Figure 2-58. Port H Interrupt Flag Register (PIFH) 1. Read: Anytime. Write: Anytime. Table 2-56. PPSP Register Field Descriptions Field 7-0 PIFH Description Port H interrupt flag-- Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSH register. To clear this flag, write logic level 1 to the corresponding bit in the PIFH register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. MC9S12XE-Family Reference Manual , Rev. 1.21 148 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.61 Port J Data Register (PTJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0268 7 R PTJ7 W Altern. Function TXCAN4 SCL0 (TXCAN0) Reset 0 RXCAN4 SDA0 (RXCAN0) 0 -- SCL1 CS2 0 -- SDA1 CS0 0 -- -- -- 0 -- -- CS1 0 TXD2 -- -- 0 RXD2 -- CS3 0 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0 Figure 2-59. Port J Data Register (PTJ) 1. Read: Anytime. Write: Anytime. Table 2-57. PTJ Register Field Descriptions Field 7-6 PTJ Description Port J general purpose input/output data--Data Register Port J pins 7 and 6 are associated with TXCAN and RXCAN signals of CAN4 and the routed CAN0, as well as with SCL and SDA signals of IIC0, respectively. The CAN4 function takes precedence over the IIC0, the routed CAN0 and the general purpose I/O function if the CAN4 module is enabled. The IIC0 function takes precedence over the routed CAN0 and the general purpose I/O function if the IIC0 is enabled. If the IIC0 module takes precedence the SDA0 and SCL0 outputs are configured as open drain outputs. The routed CAN0 function takes precedence over the general purpose I/O function if the routed CAN0 module is enabled. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port J general purpose input/output data--Data Register This pin is associated with the SCL and SDA signals of IIC1, and with chip select outputs CS2 and CS0, respectively. The IIC1 function takes precedence over the chip select and general purpose I/O function if the IIC1 is enabled. The chip selects take precedence over the general purpose I/O. If the IIC1 module takes precedence the SDA1 and SCL1 outputs are configured as open drain outputs. Refer to IIC section for details. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port J general purpose input/output data--Data Register This pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port J general purpose input/output data--Data Register This pin is associated with the chip select output signal CS2. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 5-4 PTJ 3 PTJ 2 PTJ MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 149 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-57. PTJ Register Field Descriptions (continued) Field 1 PTJ Description Port J general purpose input/output data--Data Register This pin is associated with the TXD signal of SCI2. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port J general purpose input/output data--Data Register This pin is associated with the TXD signal of SCI2 and chip select output CS3. The SCI function takes precedence over the chip select and general purpose I/O function if the SCI2 is enabled. The chip select takes precedence over the general purpose I/O. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 0 PTJ 2.3.62 Port J Input Register (PTIJ) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0269 7 R W Reset PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-60. Port J Input Register (PTIJ) Table 2-58. PTIJ Register Field Descriptions Field 7-0 PTIJ Description Port J input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.63 Port J Data Direction Register (DDRJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026A 7 R DDRJ7 W Reset 0 0 0 0 0 0 0 0 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0 Figure 2-61. Port J Data Direction Register (DDRJ) MC9S12XE-Family Reference Manual , Rev. 1.21 150 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 1. Read: Anytime. Write: Anytime. Table 2-59. DDRJ Register Field Descriptions Field 7 DDRJ Description Port J data direction-- This register controls the data direction of pin 7. The enabled CAN4 or routed CAN0 forces the I/O state to be an output. The enabled IIC0 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 6. The enabled CAN4 or routed CAN0 forces the I/O state to be an input. The enabled IIC0 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 5. The enabled CS2 signal forces the I/O state to be an output. The enabled IIC1 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 4. The enabled CS0 signal forces the I/O state to be an output. The enabled IIC1 module forces this pin to be a open drain output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 3. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 2. The enabled CS1 signal forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 6 DDRJ 5 DDRJ 4 DDRJ 3 DDRJ 2 DDRJ MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 151 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-59. DDRJ Register Field Descriptions (continued) Field 1 DDRJ Description Port J data direction-- This register controls the data direction of pin 1. The enabled SCI2 forces the I/O state to be an output. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. Port J data direction-- This register controls the data direction of pin 0. The enabled SCI3 or CS3 signal forces the I/O state to be an output. In those cases the data direction bits will not change. The DDRM bits revert to controlling the I/O direction of a pin when the associated peripheral module is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. 0 DDRJ NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTH or PTIH registers, when changing the DDRH register. 2.3.64 Port J Reduced Drive Register (RDRJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026B 7 R RDRJ7 W Reset 0 0 0 0 0 0 0 0 RDRJ6 RDRJ5 RDRJ4 RDRJ3 RDRJ2 RDRJ1 RDRJ0 Figure 2-62. Port J Reduced Drive Register (RDRJ) 1. Read: Anytime. Write: Anytime. Table 2-60. RDRJ Register Field Descriptions Field 7-0 RDRJ Description Port J reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 152 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.65 Port J Pull Device Enable Register (PERJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026C 7 R PERJ7 W Reset 1 1 1 1 1 1 1 1 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0 Figure 2-63. Port J Pull Device Enable Register (PERJ) 1. Read: Anytime. Write: Anytime. Table 2-61. PERJ Register Field Descriptions Field 7-0 PERJ Description Port J pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull device are enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.66 Port J Polarity Select Register (PPSJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026D 7 R PPSJ7 W Reset 0 0 0 0 0 0 0 0 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0 Figure 2-64. Port J Polarity Select Register (PPSJ) 1. Read: Anytime. Write: Anytime. Table 2-62. PPSJ Register Field Descriptions Field 7-0 PPSJ Description Port J pull device select--Determine pull device polarity on input pins This register serves a dual purpose by selecting the polarity of the active interrupt edge as well as selecting a pullup or pull-down device if enabled. 1 A rising edge on the associated Port J pin sets the associated flag bit in the PIFJ register. A pull-down device is connected to the associated Port J pin, if enabled by the associated bit in register PERJ and if the port is used as input. 0 A falling edge on the associated Port J pin sets the associated flag bit in the PIFJ register.A pull-up device is connected to the associated Port J pin, if enabled by the associated bit in register PERJ and if the port is used as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 153 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.67 Read: Anytime. Port J Interrupt Enable Register (PIEJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026E 7 R PIEJ7 W Reset 0 0 0 0 0 0 0 0 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0 Figure 2-65. Port J Interrupt Enable Register (PIEJ) 1. Read: Anytime. Write: Anytime. Table 2-63. PPSP Register Field Descriptions Field 7-0 PIEJ Description Port J interrupt enable-- This register disables or enables on a per-pin basis the edge sensitive external interrupt associated with Port J. 1 Interrupt is enabled. 0 Interrupt is disabled (interrupt flag masked). 2.3.68 Port J Interrupt Flag Register (PIFJ) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x026F 7 R PIFJ7 W Reset 0 0 0 0 0 0 0 0 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0 Figure 2-66. Port J Interrupt Flag Register (PIFJ) 1. Read: Anytime. Write: Anytime. Table 2-64. PPSP Register Field Descriptions Field 7-0 PIFJ Description Port J interrupt flag-- Each flag is set by an active edge on the associated input pin. This could be a rising or a falling edge based on the state of the PPSJ register. To clear this flag, write logic level 1 to the corresponding bit in the PIFJ register. Writing a 0 has no effect. 1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set). 0 No active edge pending. MC9S12XE-Family Reference Manual , Rev. 1.21 154 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.69 Port AD0 Data Register 0 (PT0AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0270 7 R PT0AD07 W Altern. Function Reset AN15 0 AN14 0 AN13 0 AN12 0 AN11 0 AN10 0 AN9 0 AN8 0 PT0AD06 PT0AD05 PT0AD04 PT0AD03 PT0AD02 PT0AD01 PT0AD00 Figure 2-67. Port AD0 Data Register 0 (PT0AD0) 1. Read: Anytime. Write: Anytime. Table 2-65. PT0AD0 Register Field Descriptions Field 7-0 PT0AD0 Description Port AD0 general purpose input/output data--Data Register This register is associated with ATD0 analog inputs AN[15:8] on PAD[15:8], respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.70 Port AD0 Data Register 1 (PT1AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0271 7 R PT1AD07 W Altern. Function Reset AN7 0 AN6 0 AN5 0 AN4 0 AN3 0 AN2 0 AN1 0 AN0 0 PT1AD06 PT1AD05 PT1AD04 PT1AD03 PT1AD02 PT1AD01 PT1AD00 Figure 2-68. Port AD0 Data Register 1 (PT1AD0) 1. Read: Anytime. Write: Anytime. Table 2-66. PT1AD0 Register Field Descriptions Field 7-0 PT1AD0 Description Port AD0 general purpose input/output data--Data Register This register is associated with ATD0 analog inputs AN[7:0] on PAD[7:0], respectively. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 155 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.71 Port AD0 Data Direction Register 0 (DDR0AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0272 7 R DDR0AD07 W Reset 0 0 0 0 0 0 0 0 DDR0AD06 DDR0AD05 DDR0AD04 DDR0AD03 DDR0AD02 DDR0AD01 DDR0AD00 Figure 2-69. Port AD0 Data Direction Register 0 (DDR0AD0) 1. Read: Anytime. Write: Anytime. Table 2-67. DDR0AD0 Register Field Descriptions Field Description 7-0 Port AD0 data direction-- DDR0AD0 This register controls the data direction of pins 15 through 8. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD0 registers, when changing the DDR0AD0 register. NOTE To use the digital input function on Port AD0 the ATD Digital Input Enable Register (ATD0DIEN1) has to be set to logic level "1". 2.3.72 Port AD0 Data Direction Register 1 (DDR1AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0273 7 R DDR1AD07 W Reset 0 0 0 0 0 0 0 0 DDR1AD06 DDR1AD05 DDR1AD04 DDR1AD03 DDR1AD02 DDR1AD01 DDR1AD00 Figure 2-70. Port AD0 Data Direction Register 1 (DDR1AD0) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 156 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-68. DDR1AD0 Register Field Descriptions Field Description 7-0 Port AD0 data direction-- DDR1AD0 This register controls the data direction of pins 7 through 0. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD0 registers, when changing the DDR1AD0 register. NOTE To use the digital input function on Port AD0 the ATD Digital Input Enable Register (ATD0DIEN1) has to be set to logic level "1". 2.3.73 Port AD0 Reduced Drive Register 0 (RDR0AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0274 7 R RDR0AD07 W Reset 0 0 0 0 0 0 0 0 RDR0AD06 RDR0AD05 RDR0AD04 RDR0AD03 RDR0AD02 RDR0AD01 RDR0AD00 Figure 2-71. Port AD0 Reduced Drive Register 0 (RDR0AD0) 1. Read: Anytime. Write: Anytime. Table 2-69. RDR0AD0 Register Field Descriptions Field Description 7-0 Port AD0 reduced drive--Select reduced drive for Port AD0 outputs RDR0AD0 This register configures the drive strength of Port AD0 output pins 15 through 8 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 157 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.74 Port AD0 Reduced Drive Register 1 (RDR1AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0275 7 R RDR1AD07 W Reset 0 0 0 0 0 0 0 0 RDR1AD06 RDR1AD05 RDR1AD04 RDR1AD03 RDR1AD02 RDR1AD01 RDR1AD00 Figure 2-72. Port AD0 Reduced Drive Register 1 (RDR1AD0) 1. Read: Anytime. Write: Anytime. Table 2-70. RDR1AD0 Register Field Descriptions Field Description 7-0 Port AD0 reduced drive--Select reduced drive for Port AD0 outputs RDR1AD0 This register configures the drive strength of Port AD0 output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.75 Port AD0 Pull Up Enable Register 0 (PER0AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0276 7 R PER0AD07 W Reset 0 0 0 0 0 0 0 0 PER0AD06 PER0AD05 PER0AD04 PER0AD03 PER0AD02 PER0AD01 PER0AD00 Figure 2-73. Port AD0 Pull Device Up Register 0 (PER0AD0) 1. Read: Anytime. Write: Anytime. Table 2-71. PER0AD0 Register Field Descriptions Field Description 7-0 Port AD0 pull device enable--Enable pull devices on input pins PER0AD0 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 158 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.76 Port AD0 Pull Up Enable Register 1 (PER1AD0) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0277 7 R PER1AD07 W Reset 0 0 0 0 0 0 0 0 PER1AD06 PER1AD05 PER1AD04 PER1AD03 PER1AD02 PER1AD01 PER1AD00 Figure 2-74. Port AD0 Pull Up Enable Register 1 (PER1AD0) 1. Read: Anytime. Write: Anytime. Table 2-72. PER1AD0 Register Field Descriptions Field Description 7-0 Port AD0 pull device enable--Enable pull devices on input pins PER1AD0 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.77 Port AD1 Data Register 0 (PT0AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0278 7 R PT0AD17 W Altern. Function Reset AN15 0 AN14 0 AN13 0 AN12 0 AN11 0 AN10 0 AN9 0 AN8 0 PT0AD16 PT0AD15 PT0AD14 PT0AD13 PT0AD12 PT0AD11 PT0AD10 Figure 2-75. Port AD1 Data Register 0 (PT0AD1) 1. Read: Anytime. Write: Anytime. Table 2-73. PT0AD1 Register Field Descriptions Field 7-0 PT0AD1 Description Port AD1 general purpose input/output data--Data Register This register is associated with ATD1 analog inputs AN[15:8] on PAD[31:24], respectively. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 159 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.78 Port AD1 Data Register 1 (PT1AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0279 7 R PT1AD17 W Altern. Function Reset AN7 0 AN6 0 AN5 0 AN4 0 AN3 0 AN2 0 AN1 0 AN0 0 PT1AD16 PT1AD15 PT1AD14 PT1AD13 PT1AD12 PT1AD11 PT1AD10 Figure 2-76. Port AD1 Data Register 1 (PT1AD1) 1. Read: Anytime. Write: Anytime. Table 2-74. PT1AD1 Register Field Descriptions Field 7-0 PT1AD1 Description Port AD1 general purpose input/output data--Data Register This register is associated with ATD1 analog inputs AN[7:0] on PAD[23:16], respectively. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bits of these pins are set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.79 Port AD1 Data Direction Register 0 (DDR0AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027A 7 R DDR0AD17 W Reset 0 0 0 0 0 0 0 0 DDR0AD16 DDR0AD15 DDR0AD14 DDR0AD13 DDR0AD12 DDR0AD11 DDR0AD10 Figure 2-77. Port AD1 Data Direction Register 0 (DDR0AD1) 1. Read: Anytime. Write: Anytime. Table 2-75. DDR0AD1 Register Field Descriptions Field Description 7-0 Port AD1 data direction-- DDR0AD1 This register controls the data direction of pins 15 through 8. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 160 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD1 registers, when changing the DDR0AD1 register. NOTE To use the digital input function on Port AD1 the ATD Digital Input Enable Register (ATD1DIEN1) has to be set to logic level "1". 2.3.80 Port AD1 Data Direction Register 1 (DDR1AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027B 7 R DDR1AD17 W Reset 0 0 0 0 0 0 0 0 DDR1AD16 DDR1AD15 DDR1AD14 DDR1AD13 DDR1AD12 DDR1AD11 DDR1AD10 Figure 2-78. Port AD1 Data Direction Register 1 (DDR1AD1) 1. Read: Anytime. Write: Anytime. Table 2-76. DDR1AD1 Register Field Descriptions Field Description 7-0 Port AD1 data direction-- DDR1AD1 This register controls the data direction of pins 7 through 0. 1 Associated pin is configured as output. 0 Associated pin is configured as input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PT0AD1 registers, when changing the DDR1AD1 register. NOTE To use the digital input function on Port AD1 the ATD Digital Input Enable Register (ATD1DIEN1) has to be set to logic level "1". MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 161 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.81 Port AD1 Reduced Drive Register 0 (RDR0AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027C 7 R RDR0AD17 W Reset 0 0 0 0 0 0 0 0 RDR0AD16 RDR0AD15 RDR0AD14 RDR0AD13 RDR0AD12 RDR0AD11 RDR0AD10 Figure 2-79. Port AD1 Reduced Drive Register 0 (RDR0AD1) 1. Read: Anytime. Write: Anytime. Table 2-77. RDR0AD1 Register Field Descriptions Field Description 7-0 Port AD1 reduced drive--Select reduced drive for Port AD1 outputs RDR0AD1 This register configures the drive strength of Port AD1 output pins 15 through 8 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.82 Port AD1 Reduced Drive Register 1 (RDR1AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027D 7 R RDR1AD17 W Reset 0 0 0 0 0 0 0 0 RDR1AD16 RDR1AD15 RDR1AD14 RDR1AD13 RDR1AD12 RDR1AD11 RDR1AD10 Figure 2-80. Port AD1 Reduced Drive Register 1 (RDR1AD1) 1. Read: Anytime. Write: Anytime. Table 2-78. RDR1AD1 Register Field Descriptions Field Description 7-0 Port AD1 reduced drive--Select reduced drive for Port AD1 outputs RDR1AD1 This register configures the drive strength of Port AD1 output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 162 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.83 Port AD1 Pull Up Enable Register 0 (PER0AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027E 7 R PER0AD17 W Reset 0 0 0 0 0 0 0 0 PER0AD16 PER0AD15 PER0AD14 PER0AD13 PER0AD12 PER0AD11 PER0AD10 Figure 2-81. Port AD1 Pull Device Up Register 0 (PER0AD1) 1. Read: Anytime. Write: Anytime. Table 2-79. PER0AD1 Register Field Descriptions Field Description 7-0 Port AD1 pull device enable--Enable pull devices on input pins PER0AD1 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.84 Port AD1 Pull Up Enable Register 1 (PER1AD1) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x027F 7 R PER1AD17 W Reset 0 0 0 0 0 0 0 0 PER1AD16 PER1AD15 PER1AD14 PER1AD13 PER1AD12 PER1AD11 PER1AD10 Figure 2-82. Port AD1 Pull Up Enable Register 1 (PER1AD1) 1. Read: Anytime. Write: Anytime. Table 2-80. PER1AD1 Register Field Descriptions Field Description 7-0 Port AD1 pull device enable--Enable pull devices on input pins PER1AD1 These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 163 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.85 Port R Data Register (PTR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0368 7 R PTR7 W Altern. Function Reset TIMIOC7 0 TIMIOC6 0 TIMIOC5 0 TIMIOC4 0 TIMIOC3 0 TIMIOC2 0 TIMIOC1 0 TIMIOC0 0 PTR6 PTR5 PTR4 PTR3 PTR2 PTR1 PTR0 Figure 2-83. Port R Data Register (PTR) 1. Read: Anytime. Write: Anytime. Table 2-81. PTR Register Field Descriptions Field 7-0 PTR Description Port R general purpose input/output data--Data Register Port R pins 7 through 0 are associated with TIM channels TIMIOC7 through TIMIOC0. When not used with the alternative function, these pins can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 2.3.86 Port R Input Register (PTIR) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0369 7 R W Reset PTIR7 PTIR6 PTIR5 PTIR4 PTIR3 PTIR2 PTIR1 PTIR0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-84. Port R Input Register (PTIR) Table 2-82. PTIR Register Field Descriptions Field 7-0 PTIR Description Port R input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. MC9S12XE-Family Reference Manual , Rev. 1.21 164 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.87 Port R Data Direction Register (DDRR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x036A 7 R DDRR7 W Reset 0 0 0 0 0 0 0 0 DDRR6 DDRR5 DDRR4 DDRR3 DDRR2 DDRR1 DDRR0 Figure 2-85. Port R Data Direction Register (DDRR) 1. Read: Anytime. Write: Anytime. Table 2-83. DDRR Register Field Descriptions Field 7-0 DDRR Description Port R data direction-- This register controls the data direction of pins 7 through 0. The TIM forces the I/O state to be an output for each timer port associated with an enabled output compare. In this case the data direction bits will not change. The data direction bits revert to controlling the I/O direction of a pin when the associated timer output compare is disabled. The timer Input Capture always monitors the state of the pin. 1 Associated pin is configured as output. 0 Associated pin is configured as high-impedance input. NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTR or PTIR registers, when changing the DDRR register. 2.3.88 Port R Reduced Drive Register (RDRR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x036B 7 R RDRR7 W Reset 0 0 0 0 0 0 0 0 RDRR6 RDRR5 RDRR4 RDRR3 RDRR2 RDRR1 RDRR0 Figure 2-86. Port R Reduced Drive Register (RDRR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 165 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-84. RDRR Register Field Descriptions Field 7-0 RDRR Description Port R reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.89 Port R Pull Device Enable Register (PERR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x036C 7 R PERR7 W Reset 0 0 0 0 0 0 0 0 PERR6 PERR5 PERR4 PERR3 PERR2 PERR1 PERR0 Figure 2-87. Port R Pull Device Enable Register (PERR) 1. Read: Anytime. Write: Anytime. Table 2-85. PERR Register Field Descriptions Field 7-0 PERR Description Port R pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset no pull device is enabled. 1 Pull device enabled. 0 Pull device disabled. 2.3.90 Port R Polarity Select Register (PPSR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x036D 7 R PPSR7 W Reset 0 0 0 0 0 0 0 0 PPSR6 PPSR5 PPSR4 PPSR3 PPSR2 PPSR1 PPSR0 Figure 2-88. Port R Polarity Select Register (PPSR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 166 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-86. PPSR Register Field Descriptions Field 7-0 PPSR Description Port R pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. 2.3.91 PIM Reserved Register Access: User read(1) 6 5 4 3 2 1 0 Address 0x036E 7 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-89. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.92 Port R Routing Register (PTRRR) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x036F 7 R PTRRR7 W Reset 0 0 0 0 0 0 0 0 PTRRR6 PTRRR5 PTRRR4 PTRRR3 PTRRR2 PTRRR1 PTRRR0 = Unimplemented or Reserved Figure 2-90. Port R Routing Register (PTRRR) 1. Read: Anytime. Write: Anytime. Table 2-87. PTR Routing Register Field Descriptions Field 7 PTRRR Description Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC7 is available on PP7 0 TIMIOC7 is available on PR7 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC6 is available on PP6 0 TIMIOC6 is available on PR6 6 PTRRR MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 167 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-87. PTR Routing Register Field Descriptions (continued) Field 5 PTRRR Description Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC5 is available on PP5 0 TIMIOC5 is available on PR5 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC4 is available on PP4 0 TIMIOC4 is available on PR4 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC3 is available on PP3 0 TIMIOC3 is available on PR3 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC2 is available on PP2 0 TIMIOC2 is available on PR2 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC1 is available on PP1 0 TIMIOC1 is available on PR1 Port R routing-- This register configures the re-routing of the associated TIM channel. 1 TIMIOC0 is available on PP0 0 TIMIOC0 is available on PR0 4 PTRRR 3 PTRRR 2 PTRRR 1 PTRRR 0 PTRRR 2.3.93 Port L Data Register (PTL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0370 7 R PTL7 W Altern. Function Reset (TXD7) 0 (RXD7) 0 (TXD6) 0 (RXD6) 0 (TXD5) 0 (RXD5) 0 (TXD4) 0 (RXD4) 0 PTLT6 PTL5 PTL4 PTL3 PTL2 PTL1 PTL0 Figure 2-91. Port L Data Register (PTL) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 168 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-88. PTL Register Field Descriptions Field 7 PTL Description Port L general purpose input/output data--Data Register Port L pin 7 is associated with the TXD signal of the SCI7 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 6 is associated with the RXD signal of the SCI7 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 5 is associated with the TXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 4 is associated with the RXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 3 is associated with the TXD signal of the SC5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 2 is associated with the RXD signal of the SCI5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 3 is associated with the TXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port L general purpose input/output data--Data Register Port L pin 2 is associated with the RXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTL 5 PTL 4 PTL 3 PTL 2 PTL 1 PTL 0 PTL MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 169 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.94 Port L Input Register (PTIL) Access: User read(1) 6 5 4 3 2 1 0 Address 0x0371 7 R W Reset PTIL7 PTIL6 PTIL5 PTIL4 PTIL3 PTIL2 PTIL1 PTIL0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-92. Port L Input Register (PTIL) Table 2-89. PTIL Register Field Descriptions Field 7-0 PTIL Description Port L input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.95 Port L Data Direction Register (DDRL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0372 7 R DDRL7 W Reset 0 0 0 0 0 0 0 0 DDRL6 DDRL5 DDRL4 DDRL3 DDRL2 DDRL1 DDRL0 Figure 2-93. Port L Data Direction Register (DDRL) 1. Read: Anytime. Write: Anytime. Table 2-90. DDRL Register Field Descriptions Field 7-0 DDRL Description Port L data direction-- This register controls the data direction of pins 7 through 0.This register configures each Port L pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 170 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTL or PTIL registers, when changing the DDRL register. 2.3.96 Port L Reduced Drive Register (RDRL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0373 7 R RDRL7 W Reset 0 0 0 0 0 0 0 0 RDRL6 RDRL5 RDRL4 RDRL3 RDRL2 RDRL1 RDRL0 Figure 2-94. Port L Reduced Drive Register (RDRL) 1. Read: Anytime. Write: Anytime. Table 2-91. RDRL Register Field Descriptions Field 7-0 RDRL Description Port L reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.97 Port L Pull Device Enable Register (PERL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0374 7 R PERL7 W Reset 1 1 1 1 1 1 1 1 PERL6 PERL5 PERL4 PERL3 PERL2 PERL1 PERL0 Figure 2-95. Port L Pull Device Enable Register (PERL) 1. Read: Anytime. Write: Anytime. Table 2-92. PERL Register Field Descriptions Field 7-0 PERL Description Port L pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 171 Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.98 Port L Polarity Select Register (PPSL) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0375 7 R PPSL7 W Reset 0 0 0 0 0 0 0 0 PPSL6 PPSL5 PPSL4 PPSL3 PPSL2 PPSL1 PPSL0 Figure 2-96. Port L Polarity Select Register (PPSL) 1. Read: Anytime. Write: Anytime. Table 2-93. PPSL Register Field Descriptions Field 7-0 PPSL Description Port L pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. 2.3.99 Port L Wired-Or Mode Register (WOML) Access: User read/write(1) 6 5 4 3 2 1 0 Address 0x0376 7 R WOML7 W Reset 0 0 0 0 0 0 0 0 WOML6 WOML5 WOML4 WOML3 WOML2 WOML1 WOML0 Figure 2-97. Port L Wired-Or Mode Register (WOML) 1. Read: Anytime. Write: Anytime. Table 2-94. WOML Register Field Descriptions Field 7-0 WOML Description Port L wired-or mode--Enable wired-or functionality This register configures the output pins as wired-or independent of the function used on the pins. If enabled the output is driven active low only (open-drain). A logic level of "1" is not driven.This allows a multipoint connection of several serial modules. These bits have no influence on pins used as inputs. 1 Output buffers operate as open-drain outputs. 0 Output buffers operate as push-pull outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 172 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.100 Port L Routing Register (PTLRR) Address 0x0377 7 6 5 4 3 2 Access: User read/write(1) 1 0 R PTLRR7 W Reset 0 0 0 0 PTLRR6 PTLRR5 PTLRR4 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-98. Port L Routing Register (PTLRR) 1. Read: Anytime. Write: Anytime. This register configures the re-routing of SCI7, SCI6, SCI5, and SCI4 on alternative ports. Table 2-95. Port L Routing Summary Module 7 PTLRR 6 5 4 TXD SCI7 SCI6 SCI5 SCI4 0 1 x x x x x x x x 0 1 x x x x x x x x 0 1 x x x x x x x x 0 1 PH3 PL7 PH1 PL5 PH7 PL3 PH5 PL1 RXD PH2 PL6 PH0 PL4 PH6 PL2 PH4 PL0 Related Pins 2.3.101 Port F Data Register (PTF) Address 0x0378 7 6 5 4 3 2 Access: User read/write(1) 1 0 R PTF7 W Altern. Function Reset (TXD3) 0 (RXD3) 0 (SCL0) 0 (SDA0) 0 (CS3) 0 (CS2) 0 (CS1) 0 (CS0) 0 PTFT6 PTF5 PTF4 PTF3 PTF2 PTF1 PTF0 Figure 2-99. Port F Data Register (PTF) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 173 Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-96. PTF Register Field Descriptions Field 7 PTF Description Port F general purpose input/output data--Data Register Port F pin 7 is associated with the TXD signal of the SCI3 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 6 is associated with the RXD signal of the SCI3 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 5 is associated with the TXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 4 is associated with the RXD signal of the SCI6 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 3 is associated with the TXD signal of the SC5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 2 is associated with the RXD signal of the SCI5 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 3 is associated with the TXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. Port F general purpose input/output data--Data Register Port F pin 2 is associated with the RXD signal of the SCI4 module. When not used with the alternative function, this pin can be used as general purpose I/O. If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the buffered pin input state is read. 6 PTF 5 PTF 4 PTF 3 PTF 2 PTF 1 PTF 0 PTF MC9S12XE-Family Reference Manual , Rev. 1.21 174 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.102 Port F Input Register (PTIF) Address 0x0379 7 6 5 4 3 2 1 Access: User read(1) 0 R W Reset PTIF7 PTIF6 PTIF5 PTIF4 PTIF3 PTIF2 PTIF1 PTIF0 u u u u u u u u = Unimplemented or Reserved 1. Read: Anytime. Write:Never, writes to this register have no effect. u = Unaffected by reset Figure 2-100. Port F Input Register (PTIF) Table 2-97. PTIF Register Field Descriptions Field 7-0 PTIF Description Port F input data-- This register always reads back the buffered state of the associated pins. This can also be used to detect overload or short circuit conditions on output pins. 2.3.103 Port F Data Direction Register (DDRF) Address 0x037A 7 6 5 4 3 2 Access: User read/write(1) 1 0 R DDRF7 W Reset 0 0 0 0 0 0 0 0 DDRF6 DDRF5 DDRF4 DDRF3 DDRF2 DDRF1 DDRF0 Figure 2-101. Port F Data Direction Register (DDRF) 1. Read: Anytime. Write: Anytime. Table 2-98. DDRF Register Field Descriptions Field 7-0 DDRF Description Port F data direction-- This register controls the data direction of pins 7 through 0.This register configures each Port F pin as either input or output. If SPI0 is enabled, the SPI0 determines the pin direction. Refer to SPI section for details. If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is forced to be an output if a SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel is enabled. The data direction bits revert to controlling the I/O direction of a pin when the associated channel is disabled. 1 Associated pin is configured as output. 0 Associated pin is configured as input. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 175 Chapter 2 Port Integration Module (S12XEPIMV1) NOTE Due to internal synchronization circuits, it can take up to 2 bus clock cycles until the correct value is read on PTF or PTIF registers, when changing the DDRF register. 2.3.104 Port F Reduced Drive Register (RDRF) Address 0x037B 7 6 5 4 3 2 Access: User read/write(1) 1 0 R RDRF7 W Reset 0 0 0 0 0 0 0 0 RDRF6 RDRF5 RDRF4 RDRF3 RDRF2 RDRF1 RDRF0 Figure 2-102. Port F Reduced Drive Register (RDRF) 1. Read: Anytime. Write: Anytime. Table 2-99. RDRF Register Field Descriptions Field 7-0 RDRF Description Port F reduced drive--Select reduced drive for outputs This register configures the drive strength of output pins 7 through 0 as either full or reduced independent of the function used on the pins. If a pin is used as input this bit has no effect. 1 Reduced drive selected (approx. 1/5 of the full drive strength). 0 Full drive strength enabled. 2.3.105 Port F Pull Device Enable Register (PERF) Address 0x037C 7 6 5 4 3 2 Access: User read/write(1) 1 0 R PERF7 W Reset 1 1 1 1 1 1 1 1 PERF6 PERF5 PERF4 PERF3 PERF2 PERF1 PERF0 Figure 2-103. Port F Pull Device Enable Register (PERF) 1. Read: Anytime. Write: Anytime. Table 2-100. PERF Register Field Descriptions Field 7-0 PERF Description Port F pull device enable--Enable pull devices on input pins These bits configure whether a pull device is activated, if the associated pin is used as an input. This bit has no effect if the pin is used as an output. Out of reset all pull devices are enabled. 1 Pull device enabled. 0 Pull device disabled. MC9S12XE-Family Reference Manual , Rev. 1.21 176 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.3.106 Port F Polarity Select Register (PPSF) Address 0x037D 7 6 5 4 3 2 Access: User read/write(1) 1 0 R PPSF7 W Reset 0 0 0 0 0 0 0 0 PPSF6 PPSF5 PPSF4 PPSF3 PPSF2 PPSF1 PPSF0 Figure 2-104. Port F Polarity Select Register (PPSF) 1. Read: Anytime. Write: Anytime. Table 2-101. PPSF Register Field Descriptions Field 7-0 PPSF Description Port F pull device select--Determine pull device polarity on input pins This register selects whether a pull-down or a pull-up device is connected to the pin. 1 A pull-down device is connected to the associated pin, if enabled and if the pin is used as input. 0 A pull-up device is connected to the associated pin, if enabled and if the pin is used as input. 2.3.107 PIM Reserved Register Address 0x037E 7 6 5 4 3 2 1 Access: User read(1) 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 2-105. PIM Reserved Register 1. Read: Always reads 0x00 Write: Unimplemented 2.3.108 Port F Routing Register (PTFRR) Address 0x037F 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset 0 0 PTFRR5 PTFRR4 0 PTFRR3 0 PTFRR2 0 PTFRR1 0 PTFRR0 0 0 0 0 = Unimplemented or Reserved Figure 2-106. Port F Routing Register (PTFRR) 1. Read: Anytime. Write: Anytime. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 177 Chapter 2 Port Integration Module (S12XEPIMV1) This register configures the re-routing of SCI3, IIC0, CS[3:0] on alternative ports. Table 2-102. Port F Routing Summary Module 5 4 PTFRR 3 2 1 0 TXD SCI3 0 1 x x x x x x x x x x PM7 PF7 SCL IIC0 x x 0 1 x x x x x x x x PJ7 PF5 CS CS3 CS2 CS1 CS0 x x x x x x x x x x x x x x x x 0 1 x x x x x x x x 0 1 x x x x x x x x 0 1 x x x x x x x x 0 1 PJ0 PF3 PJ5 PF2 PJ2 PF1 PJ4 PF0 RXD PM6 PF6 SDA PJ6 PF4 Related Pins 2.4 2.4.1 Functional Description General Each pin except PE0, PE1, and BKGD can act as general purpose I/O. In addition each pin can act as an output from the external bus interface module or a peripheral module or an input to the external bus interface module or a peripheral module. 2.4.2 Registers A set of configuration registers is common to all ports with exceptions in the expanded bus interface and ATD ports (Table 2-103). All registers can be written at any time, however a specific configuration might not become active. Example 2-1. Selecting a pull-up device This device does not become active while the port is used as a push-pull output. MC9S12XE-Family Reference Manual , Rev. 1.21 178 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) Table 2-103. Register availability per port(1) Port A B C D E K T S M P H J AD0 AD1 R L Data yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes Input yes yes yes yes yes yes yes yes Data Reduced Direction Drive yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes Pull Enable yes Polarity Select yes yes yes yes yes yes yes yes yes WiredOr Mode yes yes yes Interrupt Enable yes yes yes Interrupt Flag yes yes yes Routing yes yes yes yes F yes yes yes yes yes 1. Each cell represents one register with individual configuration bits 2.4.2.1 Data register (PORTx, PTx) This register holds the value driven out to the pin if the pin is used as a general purpose I/O. Writing to this register has only an effect on the pin if the pin is used as general purpose output. When reading this address, the buffered state of the pin is returned if the associated data direction register bit is set to "0". If the data direction register bits are set to logic level "1", the contents of the data register is returned. This is independent of any other configuration (Figure 2-107). 2.4.2.2 Input register (PTIx) This is a read-only register and always returns the buffered state of the pin (Figure 2-107). 2.4.2.3 Data direction register (DDRx) This register defines whether the pin is used as an input or an output. If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 2-107). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 179 Chapter 2 Port Integration Module (S12XEPIMV1) PTI 0 1 PT 0 1 PIN DDR data out 0 1 Module output enable module enable Figure 2-107. Illustration of I/O pin functionality 2.4.2.4 Reduced drive register (RDRx) If the pin is used as an output this register allows the configuration of the drive strength. 2.4.2.5 Pull device enable register (PERx) This register turns on a pull-up or pull-down device. It becomes active only if the pin is used as an input or as a wired-or output. 2.4.2.6 Polarity select register (PPSx) This register selects either a pull-up or pull-down device if enabled. It becomes only active if the pin is used as an input. A pull-up device can be activated if the pin is used as a wired-or output. 2.4.2.7 Wired-or mode register (WOMx) If the pin is used as an output this register turns off the active high drive. This allows wired-or type connections of outputs. 2.4.2.8 Interrupt enable register (PIEx) If the pin is used as an interrupt input this register serves as a mask to the interrupt flag to enable/disable the interrupt. MC9S12XE-Family Reference Manual , Rev. 1.21 180 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.4.2.9 Interrupt flag register (PIFx) If the pin is used as an interrupt input this register holds the interrupt flag after a valid pin event. 2.4.2.10 Module routing register (MODRR, PTRRR, PTLRR, PTFRR) This register supports the re-routing of the CAN0, CAN4, SPI2-0, SCI7-3, IIC0, TIM and CS[3:0] pins to alternative ports. This allows a software re-configuration of the pinouts of the different package options with respect to above peripherals. 2.4.3 Pins and Ports NOTE Please refer to the SOC Guide to determine the pin availability in the different package options. 2.4.3.1 BKGD pin The BKGD pin is associated with the S12X_BDM and S12X_EBI modules. During reset, the BKGD pin is used as MODC input. 2.4.3.2 Port A, B Port A pins PA[7:0] and Port B pins PB[7:0] can be used for either general-purpose I/O with the external bus interface. In this case Port A and Port B are associated with the external address bus outputs ADDR15ADDR8 and ADDR7-ADDR0, respectively. PB0 is the ADDR0 or UDS output. 2.4.3.3 Port C, D Port C pins PC[7:0] and Port D pins PD[7:0] can be used for either general-purpose I/O with the external bus interface. In this case Port C and Port D are associated with the external data bus inputs/outputs DATA15-DATA8 and DATA7-DATA0, respectively. These pins are configured for reduced input threshold in certain operating modes (refer to S12X_EBI section). 2.4.3.4 Port E Port E is associated with the external bus control outputs RW, LSTRB, LDS and RE, the free-running clock outputs ECLK and ECLK2X, as well as with the TAGHI, TAGLO, MODA and MODB and interrupt inputs IRQ and XIRQ. Port E pins PE[7:2] can be used for either general-purpose I/O or with the alternative functions. Port E pin PE[7] can be used for either general-purpose I/O or as the free-running clock ECLKX2 output running at the Core Clock rate. The clock output is always enabled in emulation modes. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 181 Chapter 2 Port Integration Module (S12XEPIMV1) Port E pin PE[6] can be used for either general-purpose I/O, as TAGHI input or as MODB input during reset. Port E pin PE[5] can be used for either general-purpose I/O, as TAGLO input, RE output or as MODA input during reset. Port E pin PE[4] can be used for either general-purpose I/O or as the free-running clock ECLK output running at the Bus Clock rate or at the programmed divided clock rate. The clock output is always enabled in emulation modes. Port E pin PE[3] can be used for either general-purpose I/O, as LSTRB or LDS output, or as EROMCTL input during reset. Port E pin PE[2] can be used for either general-purpose I/O, or as RW or WE output. Port E pin PE[1] can be used for either general-purpose input or as the level- or falling edge-sensitive IRQ interrupt input. IRQ will be enabled by setting the IRQEN configuration bit (2.3.17/119) and clearing the I-bit in the CPU condition code register. It is inhibited at reset so this pin is initially configured as a simple input with a pull-up. Port E pin PE[0] can be used for either general-purpose input or as the level-sensitive XIRQ interrupt input. XIRQ can be enabled by clearing the X-bit in the CPU condition code register. It is inhibited at reset so this pin is initially configured as a high-impedance input with a pull-up. Port E pins PE[5] and PE[6] are configured for reduced input threshold in certain modes (refer to S12X_EBI section). 2.4.3.5 Port K Port K pins PK[7:0] can be used for either general-purpose I/O, or with the external bus interface. In this case Port K pins PK[6:0] are associated with the external address bus outputs ADDR22-ADDR16 and PK7 is associated to the EWAIT input. Port K pin PE[7] is configured for reduced input threshold in certain modes (refer to S12X_EBI section). 2.4.3.6 Port T This port is associated with the ECT module. Port T pins PT[7:0] can be used for either general-purpose I/O, or with the channels of the Enhanced Capture Timer. 2.4.3.7 Port S This port is associated with SCI0, SCI1 and SPI0. Port S pins PS[7:4] can be used either for general-purpose I/O, or with the SPI0 subsystem. Port S pins PS[3:2] can be used either for general-purpose I/O, or with the SCI1 subsystem. Port S pins PS[1:0] can be used either for general-purpose I/O, or with the SCI0 subsystem. MC9S12XE-Family Reference Manual , Rev. 1.21 182 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) The SPI0 pins can be re-routed. 2.4.3.8 Port M This port is associated with the SCI3 CAN4-0 and SPI0. Port M pins PM[7:6] can be used for either general purpose I/O, or with the CAN3 subsystem. Port M pins PM[5:4] can be used for either general purpose I/O, or with the CAN2 subsystem. Port M pins PM[3:2] can be used for either general purpose I/O, or with the CAN1 subsystem. Port M pins PM[1:0] can be used for either general purpose I/O, or with the CAN0 subsystem. Port M pins PM[5:2] can be used for either general purpose I/O, or with the SPI0 subsystem. The CAN0, CAN4 and SPI0 pins can be re-routed. 2.4.3.9 Port P This port is associated with the PWM, SPI1, SPI2 and TIM. Port P pins PP[7:0] can be used for either general purpose I/O, or with the PWM or with the channels of the standard Timer.subsystem. Port P pins PP[7:4] can be used for either general purpose I/O, or with the SPI2 subsystem. Port P pins PP[3:0] can be used for either general purpose I/O, or with the SPI1 subsystem. 2.4.3.10 Port H This port is associated with the SPI1, SPI2, and SCI7-4. Port H pins PH[7:4] can be used for either general purpose I/O, or with the SPI2 subsystem. Port H pins PH[3:0] can be used for either general purpose I/O, or with the SPI1 subsystem. Port H pins PH[7:6] can be used for either general purpose I/O, or with the SCI5 subsystem. Port H pins PH[5:4] can be used for either general purpose I/O, or with the SCI4 subsystem. Port H pins PH[3:2] can be used for either general purpose I/O, or with the SCI7 subsystem. Port H pins PH[1:0] can be used for either general purpose I/O, or with the SCI6 subsystem. 2.4.3.11 Port J This port is associated with the chip selects CS[3:0] as well as with CAN4, CAN0, IIC1, IIC0, and SCI2. Port J pins PJ[7:6] can be used for either general purpose I/O, or with the CAN4, IIC0 or CAN0 subsystems. Port J pins PJ[5:4] can be used for either general purpose I/O, or with the IIC1 subsystem or as chip select outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 183 Chapter 2 Port Integration Module (S12XEPIMV1) Port J pin PJ[3] can be used for general purpose I/O. Port J pin PJ[2] can be used for either general purpose I/O or as chip select output. Port J pin PJ[1] can be used for either general purpose I/O, or with the SCI2 subsystem. Port J pin PJ[0] can be used for either general purpose I/O, or with the SCI2 subsystem or as chip select output. 2.4.3.12 Port AD0 This port is associated with the ATD0. Port AD0 pins PAD[15:0] can be used for either general purpose I/O, or with the ATD0 subsystem. 2.4.3.13 Port AD1 This port is associated with the ATD1. Port AD1 pins PAD[31:16] can be used for either general purpose I/O, or with the ATD1 subsystem. 2.4.3.14 Port R This port is associated with the TIM module. Port R pins PR[7:0] can be used for either general-purpose I/O, or with the channels of the standard Timer. The TIM channels can be re-routed. 2.4.3.15 Port L This port is associated with SCI7-4. Port L pins PL[7:6] can be used for either general purpose I/O, or with SCI7 subsystem. Port L pins PL[5:4] can be used for either general purpose I/O, or with SCI6 subsystem. Port L pins PL[3:2] can be used for either general purpose I/O, or with SCI5 subsystem. Port L pins PL[1:0] can be used for either general purpose I/O, or with SCI4 subsystem. 2.4.3.16 Port F This port is associated with SCI3, IIC0 and chip selects. Port L pins PL[7:6] can be used for either general purpose I/O, or with SCI3 subsystem. Port L pins PL[5:4] can be used for either general purpose I/O, or with IIC0 subsystem. Port L pins PL[3:0] can be used for either general purpose I/O, or with chip selects. MC9S12XE-Family Reference Manual , Rev. 1.21 184 Freescale Semiconductor Chapter 2 Port Integration Module (S12XEPIMV1) 2.4.4 Pin interrupts Ports P, H and J offer pin interrupt capability. The interrupt enable as well as the sensitivity to rising or falling edges can be individually configured on per-pin basis. All bits/pins in a port share the same interrupt vector. Interrupts can be used with the pins configured as inputs or outputs. An interrupt is generated when a bit in the port interrupt flag register and its corresponding port interrupt enable bit are both set. The pin interrupt feature is also capable to wake up the CPU when it is in STOP or WAIT mode. A digital filter on each pin prevents pulses (Figure 2-109) shorter than a specified time from generating an interrupt. The minimum time varies over process conditions, temperature and voltage (Figure 2-108 and Table 2-104). Glitch, filtered out, no interrupt flag set Valid pulse, interrupt flag set uncertain tpign tpval Figure 2-108. Interrupt Glitch Filter on Port P, H and J (PPS=0) Table 2-104. Pulse Detection Criteria Mode Pulse STOP Unit Ignored Uncertain Valid tpulse 3 3 < tpulse < 4 tpulse 4 bus clocks bus clocks bus clocks tpulse tpign tpign < tpulse < tpval tpulse tpval STOP(1) 1. These values include the spread of the oscillator frequency over temperature, voltage and process. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 185 Chapter 2 Port Integration Module (S12XEPIMV1) tpulse Figure 2-109. Pulse Illustration A valid edge on an input is detected if 4 consecutive samples of a passive level are followed by 4 consecutive samples of an active level directly or indirectly. The filters are continuously clocked by the bus clock in RUN and WAIT mode. In STOP mode the clock is generated by an RC-oscillator in the Port Integration Module. To maximize current saving the RC oscillator runs only if the following condition is true on any pin individually: Sample count <= 4 and interrupt enabled (PIE=1) and interrupt flag not set (PIF=0) 2.5 2.5.1 Initialization Information Port Data and Data Direction Register writes It is not recommended to write PORTx/PTx and DDRx in a word access. When changing the register pins from inputs to outputs, the data may have extra transitions during the write access. Initialize the port data register before enabling the outputs. MC9S12XE-Family Reference Manual , Rev. 1.21 186 Freescale Semiconductor Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-1. Revision History Revision Number V04.04 V04.05 V04.06 Revision Date 26 Oct 2005 26 Jul 2006 15 Nov 2006 3.4.2.4/3-212 Sections Affected Description of Changes - Reorganization of MEMCTL0 register bits. - Updated XGATE Memory Map - Adding AUTOSAR Compliance concerning illegal CPU accesses 3.1 Introduction This section describes the functionality of the module mapping control (MMC) sub-block of the S12X platform. The block diagram of the MMC is shown in Figure 3-1. The MMC module controls the multi-master priority accesses, the selection of internal resources and external space. Internal buses, including internal memories and peripherals, are controlled in this module. The local address space for each master is translated to a global memory space. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 187 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.1.1 Terminology Table 3-2. Acronyms and Abbreviations Logic level "1" Logic level "0" 0x x byte word local address global address Aligned address Mis-aligned address Bus Clock expanded modes Voltage that corresponds to Boolean true state Voltage that corresponds to Boolean false state Represents hexadecimal number Represents logic level 'don't care' 8-bit data 16-bit data based on the 64 KBytes Memory Space (16-bit address) based on the 8 MBytes Memory Space (23-bit address) Address on even boundary Address on odd boundary System Clock. Refer to CRG Block Guide. Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode Normal Single-Chip Mode Special Single-Chip Mode Emulation Single-Chip Mode Emulation Expanded Mode Normal Single-Chip Mode Normal Expanded Mode Special Single-Chip Mode Special Test Mode Normal Single-Chip Mode Special Single-Chip Mode Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode Areas which are accessible by the pages (RPAGE,PPAGE,EPAGE) and not implemented Area which is accessible in the global address range 14_0000 to 3F_FFFF Resources (Emulator, Application) connected to the MCU via the external bus on expanded modes (Unimplemented areas and External Space) Port Replacement Registers Port Replacement Unit located on the emulator side MicroController Unit Non-volatile Memory; Flash EEPROM or ROM single-chip modes emulation modes normal modes special modes NS SS NX ES EX ST Unimplemented areas External Space external resource PRR PRU MCU NVM 3.1.2 Features The main features of this block are: * Paging capability to support a global 8 Mbytes memory address space * Bus arbitration between the masters CPU, BDM and XGATE MC9S12XE-Family Reference Manual , Rev. 1.21 188 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) * * * * * * * * Simultaneous accesses to different resources1 (internal, external, and peripherals) (see Figure 3-1 ) Resolution of target bus access collision MCU operation mode control MCU security control Separate memory map schemes for each master CPU, BDM and XGATE ROM control bits to enable the on-chip FLASH or ROM selection Port replacement registers access control Generation of system reset when CPU accesses an unimplemented address (i.e., an address which does not belong to any of the on-chip modules) in single-chip modes 3.1.3 S12X Memory Mapping The S12X architecture implements a number of memory mapping schemes including * a CPU 8 MByte global map, defined using a global page (GPAGE) register and dedicated 23-bit address load/store instructions. * a BDM 8 MByte global map, defined using a global page (BDMGPR) register and dedicated 23bit address load/store instructions. * a (CPU or BDM) 64 KByte local map, defined using specific resource page (RPAGE, EPAGE and PPAGE) registers and the default instruction set. The 64 KBytes visible at any instant can be considered as the local map accessed by the 16-bit (CPU or BDM) address. * The XGATE 64 Kbyte local map. The MMC module performs translation of the different memory mapping schemes to the specific global (physical) memory implementation. 3.1.4 Modes of Operation This subsection lists and briefly describes all operating modes supported by the MMC. 3.1.4.1 * * * Power Saving Modes Run mode MMC is functional during normal run mode. Wait mode MMC is functional during wait mode. Stop mode MMC is inactive during stop mode. 3.1.4.2 * Functional Modes Single chip modes In normal and special single chip mode the internal memory is used. External bus is not active. 1. Resources are also called targets. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 189 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) * * Expanded modes Address, data, and control signals are activated in normal expanded and special test modes when accessing the external bus. Access to internal resources will not cause activity on the external bus. Emulation modes External bus is active to emulate, via an external tool, the normal expanded or the normal single chip mode.} 3.1.5 Block Diagram Figure 3-11 shows a block diagram of the MMC. BDM EEEPROM MMC FLASH Address Decoder & Priority DBG CPU XGATE FLEXRAY Target Bus Controller EBI RAM Peripherals Figure 3-1. MMC Block Diagram 3.2 External Signal Description The user is advised to refer to the device overview for port configuration and location of external bus signals. Some pins may not be bonded out in all implementations. Table 3-3 and Table 3-4 outline the pin names and functions. It also provides a brief description of their operation. 1. Doted blocks and lines are optional. Please refer to the Device User Guide for their availlibilities. MC9S12XE-Family Reference Manual , Rev. 1.21 190 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-3. External Input Signals Associated with the MMC Signal MODC MODB MODA EROMCTL ROMCTL I/O I I I I I Description Mode input Mode input Mode input EROM control input ROM control input Availability Latched after RESET (active low) Latched after RESET (active low) Latched after RESET (active low) Latched after RESET (active low) Latched after RESET (active low) Table 3-4. External Output Signals Associated with the MMC Available in Modes Signal CS0 CS1 CS2 CS3 I/O O O O O Description NS Chip select line 0 Chip select line 1 Chip select line 2 Chip select line 3 SS NX ES EX ST (see Table 3-5) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 191 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3 3.3.1 Memory Map and Registers Module Memory Map A summary of the registers associated with the MMC block is shown in Figure 3-2. Detailed descriptions of the registers and bits are given in the subsections that follow. Address 0x000A Register Name MMCCTL0 R W 0x000B MODE R W 0x0010 GPAGE R W 0x0011 DIRECT R W 0x0012 Reserved R W 0x0013 MMCCTL1 R W 0x0014 Reserved R W 0x0015 PPAGE R W 0x0016 RPAGE R W 0x0017 EPAGE R W 0 Bit 7 CS3E1 6 CS3E0 5 CS2E1 4 CS2E0 0 3 CS1E1 0 2 CS1E0 0 1 CS0E1 0 Bit 0 CS0E0 0 MODC 0 MODB MODA GP6 GP5 GP4 GP3 GP2 GP1 GP0 DP15 0 DP14 0 DP13 0 DP12 0 DP11 0 DP10 0 DP9 0 DP8 0 TGMRAMON 0 EEEIFRON PGMIFRON RAMHM 0 0 0 EROMON ROMHM 0 0 ROMON 0 0 PIX7 PIX6 PIX5 PIX4 PIX3 PIX2 PIX1 PIX0 RP7 RP6 RP5 RP4 RP3 RP2 RP1 RP0 EP7 EP6 EP5 EP4 EP3 EP2 EP1 EP0 = Unimplemented or Reserved Figure 3-2. MMC Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 192 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2 3.3.2.1 Register Descriptions MMC Control Register (MMCCTL0) Address: 0x000A PRR 7 6 5 4 3 2 1 0 R W Reset CS3E1 0 CS3E0 0 CS2E1 0 CS2E0 0 CS1E1 0 CS1E0 0 CS0E1 0 CS0E0 ROMON1 1. ROMON is bit[0] of the register MMCTL1 (see Figure 3-10) = Unimplemented or Reserved Figure 3-3. MMC Control Register (MMCCTL0) Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other modes the data is read from this register. Write: Anytime. In emulation modes write operations will also be directed to the external bus. Table 3-5. Chip Selects Function Activity Chip Modes Register Bit NS Disabled(1) SS NX (2) ES Disabled EX Enabled ST Disabled CS0E[1:0], CS1E[1:0], Disabled Enabled CS2E[1:0], CS3E[1:0] 1. Disabled: feature always inactive. 2. Enabled: activity is controlled by the appropriate register bit value. The MMCCTL0 register is used to control external bus functions, like: * Availability of chip selects. (See Table 3-5 and Table 3-6) * Control of different external stretch mechanism. For more detail refer to the S12X_EBI BlockGuide. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 193 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-6. MMCCTL0 Field Descriptions Field 7-6 CS3E[1:0] Description Chip Select 3 Enables -- These bits enable the external chip select CS3 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 3 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 3 is disabled 01,10,11 Chip select 3 is enabled Chip Select 2 Enables -- These bits enable the external chip select CS2 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 2 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 2 is disabled 01,10,11 Chip select 2 is enabled Chip Select 1 Enables -- These bits enable the external chip select CS1 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 1 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 1 is disabled 01,10,11 Chip select 1 is enabled Chip Select 0 Enables -- These bits enable the external chip select CS0 output which is asserted during accesses to specific external addresses. The associated global address range is shown in Table 3-7 and Figure 3-17. Chip select 0 is only active if enabled in Normal Expanded mode, Emulation Expanded mode. The function disabled in all other operating modes. 00 Chip select 0 is disabled 01,10,11 Chip select 0 is enabled 5-4 CS2E[1:0] 3-2 CS1E[1:0] 1-0 CS0E[1:0] Table 3-7 shows the address boundaries of each chip select and the relationship with the implemented resources (internal) parameters. Table 3-7. Global Chip Selects Memory Space Chip Selects CS3 CS2(2) CS1 Bottom Address 0x00_0800 0x14_0000 0x20_0000 Top Address 0x0F_FFFF minus RAMSIZE(1) 0x1F_FFFF 0x3F_FFFF 0x40_0000 0x7F_FFFF minus FLASHSIZE(4) CS0(3) 1. External RPAGE accesses in (NX, EX) 2. When ROMHM is set (see ROMHM in Table 3-16) the CS2 is asserted in the space occupied by this onchip memory block. 3. When the internal NVM is enabled (see ROMON in Section 3.3.2.5, "MMC Control Register (MMCCTL1)) the CS0 is not asserted in the space occupied by this on-chip memory block. 4. External PPAGE accesses in (NX, EX) MC9S12XE-Family Reference Manual , Rev. 1.21 194 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.2 Mode Register (MODE) Address: 0x000B PRR 7 6 5 4 3 2 1 0 R W Reset MODC MODC1 MODB MODB1 MODA MODA1 0 0 0 0 0 0 0 0 0 0 1. External signal (see Table 3-3). = Unimplemented or Reserved Figure 3-4. Mode Register (MODE) Read: Anytime. In emulation modes read operations will return the data read from the external bus. In all other modes the data are read from this register. Write: Only if a transition is allowed (see Figure 3-5). In emulation modes write operations will be also directed to the external bus. The MODE bits of the MODE register are used to establish the MCU operating mode. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Table 3-8. MODE Field Descriptions Field 7-5 MODC, MODB, MODA Description Mode Select Bits -- These bits control the current operating mode during RESET high (inactive). The external mode pins MODC, MODB, and MODA determine the operating mode during RESET low (active). The state of the pins is latched into the respective register bits after the RESET signal goes inactive (see Figure 3-4). Write restrictions exist to disallow transitions between certain modes. Figure 3-5 illustrates all allowed mode changes. Attempting non authorized transitions will not change the MODE bits, but it will block further writes to these register bits except in special modes. Both transitions from normal single-chip mode to normal expanded mode and from emulation single-chip to emulation expanded mode are only executed by writing a value of 3'b101 (write once). Writing any other value will not change the MODE bits, but will block further writes to these register bits. Changes of operating modes are not allowed when the device is secured, but it will block further writes to these register bits except in special modes. In emulation modes reading this address returns data from the external bus which has to be driven by the emulator. It is therefore responsibility of the emulator hardware to provide the expected value (i.e. a value corresponding to normal single chip mode while the device is in emulation single-chip mode or a value corresponding to normal expanded mode while the device is in emulation expanded mode). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 195 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) RESET 010 Special Test (ST) 010 10 10 0 1 1 01 00 1 Normal Expanded (NX) 101 010 000 RESET 100 110 111 Normal Single-Chip (NS) 100 101 101 RESET 001 RESET 10 1 Emulation Single-Chip (ES) 001 101 Emulation Expanded (EX) 011 011 RESET 10 0 Special Single-Chip (SS) 000 000 RESET Transition done by external pins (MODC, MODB, MODA) RESET Transition done by write access to the MODE register 110 111 Illegal (MODC, MODB, MODA) pin values. Do not use. (Reserved for future use). Figure 3-5. Mode Transition Diagram when MCU is Unsecured MC9S12XE-Family Reference Manual , Rev. 1.21 196 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 01 00 1 1 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.3 Global Page Index Register (GPAGE) Address: 0x0010 7 6 5 4 3 2 1 0 R W Reset 0 0 GP6 0 GP5 0 GP4 0 GP3 0 GP2 0 GP1 0 GP0 0 = Unimplemented or Reserved Figure 3-6. Global Page Index Register (GPAGE) Read: Anytime Write: Anytime The global page index register is used to construct a 23 bit address in the global map format. It is only used when the CPU is executing a global instruction (GLDAA, GLDAB, GLDD, GLDS, GLDX, GLDY,GSTAA, GSTAB, GSTD, GSTS, GSTX, GSTY) (see CPU Block Guide). The generated global address is the result of concatenation of the CPU local address [15:0] with the GPAGE register [22:16] (see Figure 3-7). CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] Bit22 Bit16 Bit15 Bit 0 GPAGE Register [6:0] CPU Address [15:0] Figure 3-7. GPAGE Address Mapping Table 3-9. GPAGE Field Descriptions Field 6-0 GP[6:0] Description Global Page Index Bits 6-0 -- These page index bits are used to select which of the 128 64-kilobyte pages is to be accessed. Example 3-1. This example demonstrates usage of the GPAGE register LDX MOVB GLDAA #0x5000 #0x14, GPAGE X ;Set GPAGE offset to the value of 0x5000 ;Initialize GPAGE register with the value of 0x14 ;Load Accu A from the global address 0x14_5000 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 197 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.4 Direct Page Register (DIRECT) Address: 0x0011 7 6 5 4 3 2 1 0 R W Reset DP15 0 DP14 0 DP13 0 DP12 0 DP11 0 DP10 0 DP9 0 DP8 0 Figure 3-8. Direct Register (DIRECT) Read: Anytime Write: anytime in special modes, one time only in other modes. This register determines the position of the 256 Byte direct page within the memory map.It is valid for both global and local mapping scheme. Table 3-10. DIRECT Field Descriptions Field 7-0 DP[15:8] Description Direct Page Index Bits 15-8 -- These bits are used by the CPU when performing accesses using the direct addressing mode. The bits from this register form bits [15:8] of the address (see Figure 3-9). CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] Bit22 Bit16 Bit15 Bit8 Bit7 Bit0 DP [15:8] CPU Address [15:0] Figure 3-9. DIRECT Address Mapping Bits [22:16] of the global address will be formed by the GPAGE[6:0] bits in case the CPU executes a global instruction in direct addressing mode or by the appropriate local address to the global address expansion (refer to Section 3.4.2.1.1, "Expansion of the Local Address Map). Example 3-2. This example demonstrates usage of the Direct Addressing Mode MOVB #0x80,DIRECT ;Set DIRECT register to 0x80. Write once only. ;Global data accesses to the range 0xXX_80XX can be direct. ;Logical data accesses to the range 0x80XX are direct. ;Load the Y index register from 0x8000 (direct access). ;< operator forces direct access on some assemblers but in LDY <00 MC9S12XE-Family Reference Manual , Rev. 1.21 198 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) ;many cases assemblers are "direct page aware" and can ;automatically select direct mode. 3.3.2.5 MMC Control Register (MMCCTL1) Address: 0x0013 PRR 7 6 5 4 3 2 1 0 R W Reset TGMRAMON 0 0 0 EEEIFRON 0 PGMIFRON 0 RAMHM 0 EROMON EROMCTL ROMHM 0 ROMON ROMCTL = Unimplemented or Reserved Figure 3-10. MMC Control Register (MMCCTL1) Read: Anytime. In emulation modes read operations will return the data from the external bus. In all other modes the data are read from this register. Write: Refer to each bit description. In emulation modes write operations will also be directed to the external bus. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Table 3-11. MMCCTL1 Field Descriptions Field Description 7 EEE Tag RAM and FTM SCRATCH RAM visible in the memory map TGMRAMON Write: Anytime This bit is used to made the EEE Tag RAM nd FTM SCRATCH RAM visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 5 EEEIFRON EEE IFR visible in the memory map Write: Anytime This bit is used to made the IFR sector of EEE DATA FLASH visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 4 Program IFR visible in the memory map PGMIFRON Write: Anytime This bit is used to made the IFR sector of the Program Flash visible in the global memory map. 0 Not visible in the memory map. 1 Visible in the memory map. 3 RAMHM RAM only in higher Half of the memory map Write: Once in normal and emulation modes and anytime in special modes 0 Accesses to $4000-$7FFF will be mapped to $14_4000-$14_7FFF in the global memory space (external access). 1 Accesses to $4000-$7FFF will be mapped to $0F_C000-$0F_FFFF in the global memory space (RAM area). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 199 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-11. MMCCTL1 Field Descriptions (continued) Field 2 EROMON Description Enables emulated Flash or ROM memory in the memory map Write: Never This bit is used in some modes to define the placement of the Emulated Flash or ROM (Refer to Table 3-12) 0 Disables the emulated Flash or ROM in the memory map. 1 Enables the emulated Flash or ROM in the memory map. FLASH or ROM only in higher Half of Memory Map Write: Once in normal and emulation modes and anytime in special modes 0 The fixed page of Flash or ROM can be accessed in the lower half of the memory map. Accesses to 0x4000-0x7FFF will be mapped to 0x7F_4000-0x7F_7FFF in the global memory space. 1 Disables access to the Flash or ROM in the lower half of the memory map.These physical locations of the Flash or ROM can still be accessed through the program page window. Accesses to 0x4000-0x7FFF will be mapped to 0x14_4000-0x14_7FFF in the global memory space (external access). Enable FLASH or ROM in the memory map Write: Once in normal and emulation modes and anytime in special modes. This bit is used in some modes to define the placement of the ROM (Refer to Table 3-12) 0 Disables the Flash or ROM from the memory map. 1 Enables the Flash or ROM in the memory map. 1 ROMHM 0 ROMON EROMON and ROMON control the visibility of the Flash in the memory map for CPU or BDM (not for XGATE). Both local and global memory maps are affected. Table 3-12. Data Sources when CPU or BDM is Accessing Flash Area Chip Modes Normal Single Chip Special Single Chip Emulation Single Chip X X Normal Expanded 0 1 Emulation Expanded 0 1 1 Special Test 0 0 1 X X X 0 1 X Emulation Memory Internal Flash External Application Internal Flash External Application Emulation Memory Internal Flash External Application N Y N Y N N ROMON X EROMON X DATA SOURCE(1) Internal Flash Stretch(2) N 1 X Internal Flash 1. Internal Flash means Flash resources inside the MCU are read/written. Emulation memory means resources inside the emulator are read/written (PRU registers, flash replacement, RAM, EEPROM and register space are always considered internal). External application means resources residing outside the MCU are read/written. 2. The external access stretch mechanism is part of the EBI module (refer to EBI Block Guide for details). MC9S12XE-Family Reference Manual , Rev. 1.21 200 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.3.2.6 Program Page Index Register (PPAGE) Address: 0x0015 7 6 5 4 3 2 1 0 R W Reset PIX7 1 PIX6 1 PIX5 1 PIX4 1 PIX3 1 PIX2 1 PIX1 1 PIX0 0 Figure 3-11. Program Page Index Register (PPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 16 KByte blocks into the Flash page window located in the local (CPU or BDM) memory map from address 0x8000 to address 0xBFFF (see Figure 3-12). This supports accessing up to 4 Mbytes of Flash (in the Global map) within the 64 KByte Local map. The PPAGE register is effectively used to construct paged Flash addresses in the Local map format. The CPU has special access to read and write this register directly during execution of CALL and RTC instructions.. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] 1 Bit21 Bit14 Bit13 Bit0 PPAGE Register [7:0] Address [13:0] Address: CPU Local Address or BDM Local Address Figure 3-12. PPAGE Address Mapping NOTE Writes to this register using the special access of the CALL and RTC instructions will be complete before the end of the instruction execution. Table 3-13. PPAGE Field Descriptions Field 7-0 PIX[7:0] Description Program Page Index Bits 7-0 -- These page index bits are used to select which of the 256 FLASH or ROM array pages is to be accessed in the Program Page Window. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 201 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) The fixed 16K page from 0x4000-0x7FFF (when ROMHM = 0) is the page number 0xFD. The reset value of 0xFE ensures that there is linear Flash space available between addresses 0x4000 and 0xFFFF out of reset. The fixed 16K page from 0xC000-0xFFFF is the page number 0xFF. 3.3.2.7 RAM Page Index Register (RPAGE) Address: 0x0016 7 6 5 4 3 2 1 0 R W Reset RP7 1 RP6 1 RP5 1 RP4 1 RP3 1 RP2 1 RP1 0 RP0 1 Figure 3-13. RAM Page Index Register (RPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 4 KByte blocks into the RAM page window located in the local (CPU or BDM) memory map from address 0x1000 to address 0x1FFF (see Figure 3-14). This supports accessing up to 1022 KByte of RAM (in the Global map) within the 64 KByte Local map. The RAM page index register is effectively used to construct paged RAM addresses in the Local map format. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. Global Address [22:0] 0 0 0 Bit19 Bit18 Bit12 Bit11 Bit0 RPAGE Register [7:0] Address [11:0] Address: CPU Local Address or BDM Local Address Figure 3-14. RPAGE Address Mapping NOTE Because RAM page 0 has the same global address as the register space, it is possible to write to registers through the RAM space when RPAGE = 0x00. MC9S12XE-Family Reference Manual , Rev. 1.21 202 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-14. RPAGE Field Descriptions Field 7-0 RP[7:0] Description RAM Page Index Bits 7-0 -- These page index bits are used to select which of the 256 RAM array pages is to be accessed in the RAM Page Window. The reset value of 0xFD ensures that there is a linear RAM space available between addresses 0x1000 and 0x3FFF out of reset. The fixed 4K page from 0x2000-0x2FFF of RAM is equivalent to page 254 (page number 0xFE). The fixed 4K page from 0x3000-0x3FFF of RAM is equivalent to page 255 (page number 0xFF). 3.3.2.8 EEPROM Page Index Register (EPAGE) Address: 0x0017 7 6 5 4 3 2 1 0 R W Reset EP7 1 EP6 1 EP5 1 EP4 1 EP3 1 EP2 1 EP1 1 EP0 0 Figure 3-15. EEPROM Page Index Register (EPAGE) Read: Anytime Write: Anytime These eight index bits are used to page 1 KByte blocks into the EEPROM page window located in the local (CPU or BDM) memory map from address 0x0800 to address 0x0BFF (see Figure 3-16). This supports accessing up to 256 KByte of EEPROM (in the Global map) within the 64 KByte Local map. The EEPROM page index register is effectively used to construct paged EEPROM addresses in the Local map format. CAUTION XGATE write access to this register during an CPU access which makes use of this register could lead to unexpected results. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 203 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Global Address [22:0] 0 0 1 0 0 Bit17 Bit16 Bit10 Bit9 Bit0 EPAGE Register [7:0] Address [9:0] Address: CPU Local Address or BDM Local Address Figure 3-16. EPAGE Address Mapping Table 3-15. EPAGE Field Descriptions Field 7-0 EP[7:0] Description EEPROM Page Index Bits 7-0 -- These page index bits are used to select which of the 256 EEPROM array pages is to be accessed in the EEPROM Page Window. The reset value of 0xFE ensures that there is a linear EEPROM space available between addresses 0x0800 and 0x0FFF out of reset. The fixed 1K page 0x0C00-0x0FFF of EEPROM is equivalent to page 255 (page number 0xFF). 3.4 Functional Description The MMC block performs several basic functions of the S12X sub-system operation: MCU operation modes, priority control, address mapping, select signal generation and access limitations for the system. Each aspect is described in the following subsections. 3.4.1 * MCU Operating Mode Normal single-chip mode There is no external bus in this mode. The MCU program is executed from the internal memory and no external accesses are allowed. Special single-chip mode This mode is generally used for debugging single-chip operation, boot-strapping or security related operations. The active background debug mode is in control of the CPU code execution and the BDM firmware is waiting for serial commands sent through the BKGD pin. There is no external bus in this mode. * MC9S12XE-Family Reference Manual , Rev. 1.21 204 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) * * * * Emulation single-chip mode Tool vendors use this mode for emulation systems in which the user's target application is normal single-chip mode. Code is executed from external or internal memory depending on the set-up of the EROMON bit (see Section 3.3.2.5, "MMC Control Register (MMCCTL1)). The external bus is active in both cases to allow observation of internal operations (internal visibility). Normal expanded mode The external bus interface is configured as an up to 23-bit address bus, 8 or 16-bit data bus with dedicated bus control and status signals. This mode allows 8 or 16-bit external memory and peripheral devices to be interfaced to the system. The fastest external bus rate is half of the internal bus rate. An external signal can be used in this mode to cause the external bus to wait as desired by the external logic. Emulation expanded mode Tool vendors use this mode for emulation systems in which the user's target application is normal expanded mode. Special test mode This mode is an expanded mode for factory test. 3.4.2 3.4.2.1 Memory Map Scheme CPU and BDM Memory Map Scheme The BDM firmware lookup tables and BDM register memory locations share addresses with other modules; however they are not visible in the memory map during user's code execution. The BDM memory resources are enabled only during the READ_BD and WRITE_BD access cycles to distinguish between accesses to the BDM memory area and accesses to the other modules. (Refer to BDM Block Guide for further details). When the MCU enters active BDM mode, the BDM firmware lookup tables and the BDM registers become visible in the local memory map in the range 0xFF00-0xFFFF (global address 0x7F_FF00 0x7F_FFFF) and the CPU begins execution of firmware commands or the BDM begins execution of hardware commands. The resources which share memory space with the BDM module will not be visible in the memory map during active BDM mode. Please note that after the MCU enters active BDM mode the BDM firmware lookup tables and the BDM registers will also be visible between addresses 0xBF00 and 0xBFFF if the PPAGE register contains value of 0xFF. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 205 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map 0x00_0000 0x00_0800 0x00_1000 Global Memory Map 2K REGISTERS 2K RAM 1M minus 2 Kilobytes 4 Mbytes 2.75 Mbytes Freescale Semiconductor 256 Kilobytes RAM 253*4K paged 0x0000 0x0800 0x0C00 0x1000 0x2000 0x0F_E000 2K REGISTERS 1K EEPROM window 1K EEPROM 4K RAM window 8K RAM RPAGE EEPROM 255*1K paged EPAGE 0x10_0000 8K RAM 0x4000 Unpaged 16K FLASH 0x13_FC00 0x14_0000 1K EEPROM 0x8000 External Space 16K FLASH window PPAGE 0x40_0000 0xC000 Unpaged 16K FLASH 0xFFFF Reset Vectors 0x7F_4000 16K FLASH (PPAGE 0xFD) 16K FLASH (PPAGE 0xFE) 16K FLASH (PPAGE 0xFF) FLASH 253 *16K paged 0x7F_8000 0x7F_C000 0x7F_FFFF Figure 3-17. Expansion of the Local Address Map MC9S12XE-Family Reference Manual , Rev. 1.21 206 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.1.1 Expansion of the Local Address Map Expansion of the CPU Local Address Map The program page index register in MMC allows accessing up to 4 Mbyte of FLASH or ROM in the global memory map by using the eight page index bits to page 256 16 Kbyte blocks into the program page window located from address 0x8000 to address 0xBFFF in the local CPU memory map. The page value for the program page window is stored in the PPAGE register. The value of the PPAGE register can be read or written by normal memory accesses as well as by the CALL and RTC instructions (see Section 3.5.1, "CALL and RTC Instructions). Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the 64-kilobyte local CPU address space. The starting address of an interrupt service routine must be located in unpaged memory unless the user is certain that the PPAGE register will be set to the appropriate value when the service routine is called. However an interrupt service routine can call other routines that are in paged memory. The upper 16kilobyte block of the local CPU memory space (0xC000-0xFFFF) is unpaged. It is recommended that all reset and interrupt vectors point to locations in this area or to the other unpaged sections of the local CPU memory map. Table 3-16 summarizes mapping of the address bus in Flash/External space based on the address, the PPAGE register value and value of the ROMHM bit in the MMCCTL1 register. Table 3-16. Global FLASH/ROM Allocated Local CPU Address 0x4000-0x7FFF ROMHM 0 1 0x8000-0xBFFF N/A N/A External Access No Yes No(1) Yes1 Global Address 0x7F_4000 -0x7F_7FFF 0x14_4000-0x14_7FFF 0x40_0000-0x7F_FFFF 0xC000-0xFFFF N/A No 0x7F_C000-0x7F_FFFF 1. The internal or the external bus is accessed based on the size of the memory resources implemented on-chip. Please refer to Figure 1-23 for further details. The RAM page index register allows accessing up to 1 Mbyte -2 Kbytes of RAM in the global memory map by using the eight RPAGE index bits to page 4 Kbyte blocks into the RAM page window located in the local CPU memory space from address 0x1000 to address 0x1FFF. The EEPROM page index register EPAGE allows accessing up to 256 Kbytes of EEPROM in the system by using the eight EPAGE index bits to page 1 Kbyte blocks into the EEPROM page window located in the local CPU memory space from address 0x0800 to address 0x0BFF. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 207 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Expansion of the BDM Local Address Map PPAGE, RPAGE, and EPAGE registers are also used for the expansion of the BDM local address to the global address. These registers can be read and written by the BDM. The BDM expansion scheme is the same as the CPU expansion scheme. 3.4.2.2 Global Addresses Based on the Global Page CPU Global Addresses Based on the Global Page The seven global page index bits allow access to the full 8 Mbyte address map that can be accessed with 23 address bits. This provides an alternative way to access all of the various pages of FLASH, RAM and EEE as well as additional external memory. The GPAGE Register is used only when the CPU is executing a global instruction (see Section 3.3.2.3, "Global Page Index Register (GPAGE)). The generated global address is the result of concatenation of the CPU local address [15:0] with the GPAGE register [22:16] (see Figure 3-7). BDM Global Addresses Based on the Global Page The seven BDMGPR Global Page index bits allow access to the full 8 Mbyte address map that can be accessed with 23 address bits. This provides an alternative way to access all of the various pages of FLASH, RAM and EEE as well as additional external memory. The BDM global page index register (BDMGPR) is used only in the case the CPU is executing a firmware command which uses a global instruction (like GLDD, GSTD) or by a BDM hardware command (like WRITE_W, WRITE_BYTE, READ_W, READ_BYTE). See the BDM Block Guide for further details. The generated global address is a result of concatenation of the BDM local address with the BDMGPR register [22:16] in the case of a hardware command or concatenation of the CPU local address and the BDMGPR register [22:16] in the case of a firmware command (see Figure 3-18). MC9S12XE-Family Reference Manual , Rev. 1.21 208 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) BDM HARDWARE COMMAND Global Address [22:0] Bit22 Bit16 Bit15 Bit0 BDMGPR Register [6:0] BDM Local Address BDM FIRMWARE COMMAND Global Address [22:0] Bit22 Bit16 Bit15 Bit0 BDMGPR Register [6:0] CPU Local Address Figure 3-18. BDMGPR Address Mapping 3.4.2.3 Implemented Memory Map The global memory spaces reserved for the internal resources (RAM, EEE, and FLASH) are not determined by the MMC module. Size of the individual internal resources are however fixed in the design of the device cannot be changed by the user. Please refer to the Device User Guide for further details. Figure 3-19 and Table 3-17 show the memory spaces occupied by the on-chip resources. Please note that the memory spaces have fixed top addresses. Table 3-17. Global Implemented Memory Space Internal Resource RAM $Address RAM_LOW = 0x10_0000 minus RAMSIZE(1) FLASH FLASH_LOW = 0x80_0000 minus FLASHSIZE(2) 1. RAMSIZE is the hexadecimal value of RAM SIZE in bytes 2. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes When the device is operating in expanded modes except emulation single-chip mode, accesses to global addresses which are not occupied by the on-chip resources (unimplemented areas or external memory space) result in accesses to the external bus (see Figure 3-19). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 209 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) In emulation single-chip mode, accesses to global addresses which are not occupied by the on-chip resources (unimplemented areas) result in accesses to the external bus. CPU accesses to global addresses which are occupied by external memory space result in an illegal access reset (system reset) in case of no MPU error. BDM accesses to the external space are performed but the data will be undefined. In single-chip modes accesses by the CPU (except for firmware commands) to any of the unimplemented areas (see Figure 3-19) will result in an illegal access reset (system reset) in case of no MPU error. BDM accesses to the unimplemented areas are allowed but the data will be undefined. No misaligned word access from the BDM module will occur; these accesses are blocked in the BDM module (Refer to BDM Block Guide). Misaligned word access to the last location of RAM is performed but the data will be undefined. Misaligned word access to the last location of any global page (64 Kbyte) by any global instruction, is performed by accessing the last byte of the page and the first byte of the same page, considering the above mentioned misaligned access cases. The non-internal resources (unimplemented areas or external space) are used to generate the chip selects (CS0,CS1,CS2 and CS3) (see Figure 3-19), which are only active in normal expanded, emulation expanded (see Section 3.3.2.1, "MMC Control Register (MMCCTL0)). MC9S12XE-Family Reference Manual , Rev. 1.21 210 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map 0x00_0000 0x00_07FF Global Memory Map 2K REGISTERS Unimplemented RAM RAM_LOW RAM 2K REGISTERS 1K EEPROM window 1K EEPROM 4K RAM window 8K RAM 0x4000 0x13_FFFF CS2 0x1F_FFFF 0x8000 External Space CS1 16K FLASH window PPAGE 0x3F_FFFF Unimplemented FLASH Unpaged 16K FLASH 0xFFFF Reset Vectors FLASH_LOW FLASH 0x7F_FFFF MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 211 FLASHSIZE CS0 Unpaged 16K FLASH RPAGE 256 K EEEPROM EPAGE 0x0F_FFFF RAMSIZE 0x0000 0x0800 0x0C00 0x1000 0x2000 0xC000 Figure 3-19. S12XE CPU & BDM Global Address Mapping Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 CS3 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.4 3.4.2.4.1 XGATE Memory Map Scheme Expansion of the XGATE Local Address Map The XGATE 64 Kbyte memory space allows access to internal resources only (Registers, RAM, and FLASH). The 2 Kilobyte register address range is the same register address range as for the CPU and the BDM module (see Table 3-18). XGATE can access the FLASH in single chip modes, even when the MCU is secured. In expanded modes, XGATE can not access the FLASH when MCU is secured. The local address of the XGATE RAM access is translated to the global RAM address range. The XGATE shares the RAM resource with the CPU and the BDM module (see Table 3-18). XGATE RAM size (XGRAMSIZE) may be lower or equal to the MCU RAM size (RAMSIZE).In case of XGATE RAM size less than 32 Kbytes (see Figure 3-20), the gap in the xgate local memory map will result in an illegal RAM access (see Section 3.4.3.1, "Illegal XGATE Accesses) The local address of the XGATE FLASH access is always translated to the global address 0x78_0800 0x78_7FFF. Example 3-3. is a general example of the XGATE memory map implementation. Table 3-18. XGATE Implemented Memory Space Internal Resource $Address XGATE RAM XGRAM_LOW = 0x0F_0000 plus (0x1_0000 minus XGRAMSIZE)(1) 1. XGRAMSIZE is the hexadecimal value of XGATE RAM SIZE in bytes. Example 3-3. The MCU FLASHSIZE is 64 Kbytes (0x10000) and MCU RAMSIZE is 32 Kbytes (0x8000). The XGATE RAMSIZE is 16 Kbytes (0x4000). The space occupied by the XGATE RAM in the global address space will be: Bottom address: (0x10_0000 minus 0x4000) = 0x0F_C000 Top address: 0x0F_FFFF XGATE accesses to local address range 0x0800-0x7FFF will result always in accesses to the following FLASH block in the global address space: Bottom address: 0x78_0800 Top address: 0x78_7FFF The gap range in the local memory map 0x8000-0xBFFF will be translated in the global address space: 0x0F_8000 - 0x0F_BFFF (illegal xgate access to system RAM). MC9S12XE-Family Reference Manual , Rev. 1.21 212 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) XGATE Local Memory Map 0x00_0000 0x00_07FF Global Memory Map Registers 0x0000 Registers 0x0800 RAM 0x0F_FFFF XGRAMSIZE XGRAM_LOW RAMSIZE FLASHSIZE 213 FLASH 0x7FFF Unimplemented area XGRAMSIZE RAM 0x78_0800 FLASH 0x78_7FFF 0xFFFF 0x7F_FFFF Figure 3-20. XGATE Global Address Mapping MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.5 Memory Configuration Two bits in the MMCCTL1 register (ROMHM, RAMHM) configure the mapping of the local address (0x4000-0x7FFF) in the global memory map. ROMHM, RAMHM are write once in normal and emulation modes and anytime in special modes. Three areas are identified (See Figure 3-21): * Program FLASH (0x7F_4000-0x7F_7FFF) when ROMHM = 0. * External Space (0x14_4000-0x14_7FFF) when ROMHM = 1 and RAMHM = 0. * XSRAM Space (0x0F_C000-0x0F_FFFF) when ROMHM = 1 and RAMHM = 1. Table 3-19 shows the translation from the local memory map to the global memory map taking in consideration the different configurations of ROMHM and RAMHM. Table 3-19. ROMHM and RAMHM Address Location Local Address ROMHM 0 0x4000 - 0x7FFF 0x2000 - 0x3FFF 0x2000 - 0x3FFF 1 1 1 RAMHM X 0 1 0 Global Address 0x7F_4000 - 0x7F_7FFF 0x14_4000 - 0x14_7FFF 0x0F_C000 - 0x0F_FFFF 0x0F_A000 - 0x0F_BFFF 0x0F_E000 - 0x0F_FFFF Location Internal Flash External Space Bottom of the Implemented RAM Fixed up to 8K RAM Fixed up to 8K RAM Table 3-20 describes the application note of the RAM configuration and its dedicated global address. Table 3-20. RAM Configuration phase After reset During setup RPAGE RPAGE = 0xFD (Reset value) RPAGE = 0xFD (Reset value) (0x00 <= RPAGE <= 0xF9) Normal Operation (0xFA <= RPAGE <= 0xFF) ROMHM 0 1 1 1 RAMHM 0 1 1 1 RAM AREA 12 Kilobytes 24 Kilobytes 28 Kilobytes 24 Kilobytes Global Address 0x0F_D000 - 0x0F_FFFF 0x0F_A000 - 0x0F_FFFF 0x00_0000 - 0x0F_9FFF 0x0F_A000 - 0x0F_FFFF MC9S12XE-Family Reference Manual , Rev. 1.21 214 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) CPU and BDM Local Memory Map 0x00_0000 0x00_0800 0x00_1000 Global Memory Map 2K REGISTERS 2K RAM 1M minus 2 Kilobytes 4 Mbytes 2.75 Mbytes 256 Kilobytes RAM 251*4K paged 0x0F_A000 8K RAM ROMHM RAMHM 0x0F_C000 1 1 0x10_0000 EEPROM 255*1K paged 0x0000 0x0800 0x0C00 0x1000 0x2000 2K REGISTERS 1K EEPROM window 1K EEPROM 4K RAM window 8K RAM 16K RAM 0x4000 0x13_FC00 0x14_0000 ROMHM RAMHM 0x14_4000 1 0 1K EEPROM 16K External External Space 0x8000 16K FLASH window 0x40_0000 0xC000 Unpaged 16K FLASH 0xFFFF Reset Vectors ROMHM RAMHM 0x7F_4000 0 x 0x7F_8000 16K FLASH FLASH 253 *16K paged 16K FLASH (PPAGE 0xFE) 16K FLASH (PPAGE 0xFF) 0x7F_C000 0x7F_FFFF Figure 3-21. ROMHM, RAMHM Memory Configuration MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 215 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.2.5.1 System XSRAM System XSRAM has two ways to be accessed by the CPU. One is by the programming of RPAGE and the fixed XSRAM areas configured by the values of ROMHM, RAMHM, or by the usage of the global instruction and the usage of GPAGE. Figure 3-22 shows the memory map for the implemented XSRAM. The size of the implemented XSRAM is done by the device definition and denoted by RAMSIZE. RAM Area in the Memory Map ROMHM = 1 RAMHM = 0 0x00_0000 0x00_07FF ROMHM = 0 RAMHM = X REG. Area 0x00_0800 0x00_0800 ROMHM = 1 RAMHM = 1 RAM Area Unimplemented RAM Unimplemented RAM 0x0F_FFFF EEPROM Area 0x0F_A000 RAMSIZE 8K RAM 0x0F_C000 0x13_FFFF 0x0F_E000 External Space Area 0x0F_FFFF 0x3F_FFFF 16K RAM 8K RAM 0x0F_FFFF FLASH Area 0x7F_FFFF Figure 3-22. S12XE System RAM in the Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 216 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.4.3 Chip Access Restrictions CPU and XGATE accesses are watched in the memory protection unit (See MPU Block Guide). In case of access violation, the suspect master is acknowledged with an indication of an error; the victim target will not be accessed. Other violations MPU is not handling are listed below. 3.4.3.1 Illegal XGATE Accesses A possible access error is flagged by the MMC and signalled to XGATE under the following conditions: * XGATE performs misaligned word (in case of load-store or opcode or vector fetch accesses). * XGATE accesses the register space (in case of opcode or vector fetch). * XGATE performs a write to Flash in any modes (in case of load-store access). * XGATE performs an access to a secured Flash in expanded modes (in case of load-store or opcode or vector fetch accesses). For further details refer to the XGATE Block Guide. 3.4.4 Chip Bus Control The MMC controls the address buses and the data buses that interface the S12X masters (CPU, BDM and XGATE) with the rest of the system (master buses). In addition the MMC handles all CPU read data bus swapping operations. All internal and external resources are connected to specific target buses (see Figure 3-231). 1. Doted blocks and lines are optional. Please refer to the Device User Guide for their availlibilities. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 217 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) XGATE DBG CPU BDM FLEXRAY XGATE S12X0 S12X1 S12X2 MMC "Crossbar Switch" XBUS3 XBUS1 XBUS0 XRAM XBUS2 BLKX EBI FTM FLASH EEE BDM resources XSRAM IPBI Figure 3-23. MMC Block Diagram 3.4.4.1 Master Bus Prioritization regarding access conflicts on Target Buses The arbitration scheme allows only one master to be connected to a target at any given time. The following rules apply when prioritizing accesses from different masters to the same target bus: * CPU always has priority over BDM and XGATE. * XGATE access to PRU registers constitutes a special case. It is always granted and stalls the CPU for its duration. * XGATE has priority over BDM. * BDM has priority over CPU and XGATE when its access is stalled for more than 128 cycles. In the later case the suspect master will be stalled after finishing the current operation and the BDM will gain access to the bus. * In emulation modes all internal accesses are visible on the external bus as well and the external bus is used during access to the PRU registers. 3.5 3.5.1 Initialization/Application Information CALL and RTC Instructions CALL and RTC instructions are uninterruptable CPU instructions that automate page switching in the program page window. The CALL instruction is similar to the JSR instruction, but the subroutine that is MC9S12XE-Family Reference Manual , Rev. 1.21 218 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) called can be located anywhere in the local address space or in any Flash or ROM page visible through the program page window. The CALL instruction calculates and stacks a return address, stacks the current PPAGE value and writes a new instruction-supplied value to the PPAGE register. The PPAGE value controls which of the 256 possible pages is visible through the 16 Kbyte program page window in the 64 Kbyte local CPU memory map. Execution then begins at the address of the called subroutine. During the execution of the CALL instruction, the CPU performs the following steps: 1. Writes the current PPAGE value into an internal temporary register and writes the new instructionsupplied PPAGE value into the PPAGE register 2. Calculates the address of the next instruction after the CALL instruction (the return address) and pushes this 16-bit value onto the stack 3. Pushes the temporarily stored PPAGE value onto the stack 4. Calculates the effective address of the subroutine, refills the queue and begins execution at the new address This sequence is uninterruptable. There is no need to inhibit interrupts during the CALL instruction execution. A CALL instruction can be performed from any address to any other address in the local CPU memory space. The PPAGE value supplied by the instruction is part of the effective address of the CPU. For all addressing mode variations (except indexed-indirect modes) the new page value is provided by an immediate operand in the instruction. In indexed-indirect variations of the CALL instruction a pointer specifies memory locations where the new page value and the address of the called subroutine are stored. Using indirect addressing for both the new page value and the address within the page allows usage of values calculated at run time rather than immediate values that must be known at the time of assembly. The RTC instruction terminates subroutines invoked by a CALL instruction. The RTC instruction unstacks the PPAGE value and the return address and refills the queue. Execution resumes with the next instruction after the CALL instruction. During the execution of an RTC instruction the CPU performs the following steps: 1. Pulls the previously stored PPAGE value from the stack 2. Pulls the 16-bit return address from the stack and loads it into the PC 3. Writes the PPAGE value into the PPAGE register 4. Refills the queue and resumes execution at the return address This sequence is uninterruptable. The RTC can be executed from anywhere in the local CPU memory space. The CALL and RTC instructions behave like JSR and RTS instruction, they however require more execution cycles. Usage of JSR/RTS instructions is therefore recommended when possible and CALL/RTC instructions should only be used when needed. The JSR and RTS instructions can be used to access subroutines that are already present in the local CPU memory map (i.e. in the same page in the program memory page window for example). However calling a function located in a different page requires usage of the CALL instruction. The function must be terminated by the RTC instruction. Because the RTC instruction restores contents of the PPAGE register from the stack, functions terminated with the RTC instruction must be called using the CALL instruction even when the correct page is already present MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 219 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) in the memory map. This is to make sure that the correct PPAGE value will be present on stack at the time of the RTC instruction execution. 3.5.2 Port Replacement Registers (PRRs) Registers used for emulation purposes must be rebuilt by the in-circuit emulator hardware to achieve full emulation of single chip mode operation. These registers are called port replacement registers (PRRs) (see Table 1-25). PRRs are accessible from CPU, BDM and XGATE using different access types (word aligned, word-misaligned and byte). Each access to PRRs will be extended to 2 bus cycles for write or read accesses independent of the operating mode. In emulation modes all write operations result in simultaneous writing to the internal registers (peripheral access) and to the emulated registers (external access) located in the PRU in the emulator. All read operations are performed from external registers (external access) in emulation modes. In all other modes the read operations are performed from the internal registers (peripheral access). Due to internal visibility of CPU accesses the CPU will be halted during XGATE or BDM access to any PRR. This rule applies also in normal modes to ensure that operation of the device is the same as in emulation modes. A summary of PRR accesses: * An aligned word access to a PRR will take 2 bus cycles. * A misaligned word access to a PRRs will take 4 cycles. If one of the two bytes accessed by the misaligned word access is not a PRR, the access will take only 3 cycles. * A byte access to a PRR will take 2 cycles. MC9S12XE-Family Reference Manual , Rev. 1.21 220 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Table 3-21. PRR Listing PRR Name PORTA PORTB DDRA DDRB PORTC PORTD DDRC DDRD PORTE DDRE MMCCTL0 MODE PUCR RDRIV EBICTL0 EBICTL1 Reserved MMCCTL1 ECLKCTL Reserved PORTK DDRK PRR Local Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D 0x000E 0x000F 0x0012 0x0013 0x001C 0x001D 0x0032 0x0033 PRR Location PIM PIM PIM PIM PIM PIM PIM PIM PIM PIM MMC MMC PIM PIM EBI EBI MMC MMC PIM PIM PIM PIM 3.5.3 On-Chip ROM Control The MCU offers two modes to support emulation. In the first mode (called generator) the emulator provides the data instead of the internal FLASH and traces the CPU actions. In the other mode (called observer) the internal FLASH provides the data and all internal actions are made visible to the emulator. 3.5.3.1 ROM Control in Single-Chip Modes In single-chip modes the MCU has no external bus. All memory accesses and program fetches are internal (see Figure 3-24). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 221 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) MCU No External Bus Flash Figure 3-24. ROM in Single Chip Modes 3.5.3.2 ROM Control in Emulation Single-Chip Mode In emulation single-chip mode the external bus is connected to the emulator. If the EROMON bit is set, the internal FLASH provides the data and the emulator can observe all internal CPU actions on the external bus. If the EROMON bit is cleared, the emulator provides the data (generator) and traces the all CPU actions (see Figure 3-25). Observer MCU Emulator Flash EROMON = 1 Generator MCU Emulator Flash EROMON = 0 Figure 3-25. ROM in Emulation Single-Chip Mode 3.5.3.3 ROM Control in Normal Expanded Mode In normal expanded mode the external bus will be connected to the application. If the ROMON bit is set, the internal FLASH provides the data. If the ROMON bit is cleared, the application memory provides the data (see Figure 3-26). MC9S12XE-Family Reference Manual , Rev. 1.21 222 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) MCU Application Flash Memory ROMON = 1 MCU Application Memory ROMON = 0 Figure 3-26. ROM in Normal Expanded Mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 223 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) 3.5.3.4 ROM Control in Emulation Expanded Mode In emulation expanded mode the external bus will be connected to the emulator and to the application. If the ROMON bit is set, the internal FLASH provides the data. If the EROMON bit is set as well the emulator observes all CPU internal actions, otherwise the emulator provides the data and traces all CPU actions (see Figure 3-27). When the ROMON bit is cleared, the application memory provides the data and the emulator will observe the CPU internal actions (see Figure 3-28). Observer MCU Emulator Flash Application Memory EROMON = 1 Generator MCU Emulator Flash Application Memory EROMON = 0 Figure 3-27. ROMON = 1 in Emulation Expanded Mode MC9S12XE-Family Reference Manual , Rev. 1.21 224 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) Observer MCU Emulator Application Memory Figure 3-28. ROMON = 0 in Emulation Expanded Mode 3.5.3.5 ROM Control in Special Test Mode In special test mode the external bus is connected to the application. If the ROMON bit is set, the internal FLASH provides the data, otherwise the application memory provides the data (see Figure 3-29). MCU Application Memory ROMON = 0 MCU Application Flash Memory ROMON = 1 Figure 3-29. ROM in Special Test Mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 225 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 3 Memory Mapping Control (S12XMMCV4) MC9S12XE-Family Reference Manual , Rev. 1.21 226 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Table 4-1. Revision History Revision Number V01.04 V01.05 V01.06 Revision Date Sections Affected 4.3.1.1/4-231 4.4.1/4-237 4.3.1.1/4-231 4.4/4-237 Description of Changes - Added note to only use the CPU to clear the AE flag. - Added disclaimer to avoid changing descriptors while they are in use because of other bus-masters doing accesses. - Clarified that interrupt generation is independent of AEF bit state. - Corrected preliminary statement about execution of violating accesses. - Made Revision History entries public. 14 Sep 2005 14 Mar 2006 09 Oct 2006 4.1 Introduction The MPU module provides basic functionality required to protect memory mapped resources from undesired accesses. Multiple address range comparators compare memory accesses against eight memory protection descriptors located in the MPU module to determine if each access is valid or not. The comparison is sensitive to which bus master generates the access and the type of the access. The MPU module can be used to isolate memory ranges accessible by different bus masters. It can be also be used by an operating system or software kernel to isolate the regions of memory "legally" available to specific software tasks, with the kernel re-configuring the task specific memory protection descriptors in supervisor state during task-switching. 4.1.1 Preface Table 4-2. Terminology Term MCU MPU CPU XGATE supervisor state user state Meaning Micro-Controller Unit Memory Protection Unit S12X Central Processing Unit (see S12XCPU Reference Manual) XGATE Co-processor (see XGATE chapter) refers to the supervisor state of the S12XCPU (see S12XCPU Reference Manual) refers to the user state of the S12XCPU (see S12XCPU Reference Manual) The following terms and abbreviations are used in the document. 4.1.2 Overview The MPU module monitors the bus activity of each bus master. The data describing each access is fed into multiple address range comparators. The output of the comparators is used to determine if a particular MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 227 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) access is allowed or represents an access violation. If an access violation caused by the S12X CPU is detected, the MPU module raises an access violation interrupt. If the MPU module detects an access violation caused by a bus master other than the S12X CPU, it flags an access error condition to the respective master. In addition to the restrictions defined for memory ranges in the MPU descriptors, accesses to memory not covered by any MPU descriptor (even read accesses!) are considered access violations. Figure 4-1 shows a block diagram of the MPU module. MPU Bus Interface Bus Interface Access Validation Comparators Data Access MPU Monitoring CPU Bus Interface Bus Interface Access Validation Op-code Fetch Comparators Data Access MPU Monitoring XGATE MPU Monitoring Bus Interface Bus Interface Data Access Access Validation Comparators Status Registers "Master3" MMC Access Violation Interrupt Figure 4-1. Block Diagram 4.1.3 * * Features Protects memory from undesired accesses coming from up to 3 bus masters1 Eight memory protection descriptors -- each descriptor can cover the full global memory map (8 MBytes) -- each descriptor has a granularity of 8 Bytes 1. Master 3 can be implemented or left out depending the chip configuration. Please refer to the Device Reference Manual for information about the availability and function of Master 3. MC9S12XE-Family Reference Manual , Rev. 1.21 228 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Protection Descriptors Protection Descriptors Op-code Fetch Chapter 4 Memory Protection Unit (S12XMPUV1) * * Each descriptor can be configured to allow one of four types of access privilege for the defined memory region -- Bus master has full access (read, write and execute enabled) -- Bus master can read and execute (write illegal) -- Bus master can read and write (execution illegal) -- Bus master can only read (write and execution illegal) Accesses to memory not covered by any protection descriptor will cause an access violation 4.1.4 Modes of Operation The MPU module can be used in all MCU modes. 4.2 External Signal Description The MPU module has no external signals. 4.3 Memory Map and Register Definition This section provides a detailed description of address space and registers used by the MPU module. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 229 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1 Register Descriptions This section describes in address order all the MPU module registers and their individual bits. Register Name 0x0000 MPUFLG 0x0001 MPUASTAT0 0x0002 MPUASTAT1 0x0003 MPUASTAT2 0x0004 Reserved 0x0005 MPUSEL 0x0006 MPUDESC0(1) 0x0007 MPUDESC11 0x0008 MPUDESC21 0x0009 MPUDESC31 0x000A MPUDESC41 0x000B MPUDESC51 R W R W R W R W R W R W R W R W R W R W R W R W WP NEX 0 SVSEN 0 0 0 0 SEL[2:0] 0 0 0 0 0 0 0 0 ADDR[7:0] ADDR[15:8] Bit 7 AEF 0 6 WPF 5 NEXF 4 0 3 0 2 0 1 0 Bit 0 SVSF ADDR[22:16] MSTR0 MSTR1 MSTR2 MSTR3 LOW_ADDR[22:19] LOW_ADDR[18:11] LOW_ADDR[10:3] 0 HIGH_ADDR[22:19] HIGH_ADDR[18:11] HIGH_ADDR[10:3] = Unimplemented or Reserved 1. The module addresses 0x0006-0x000B represent a window in the register map through which different descriptor registers are visible. Figure 4-2. MPU Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 230 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.1 MPU Flag Register (MPUFLG) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0000 R W Reset WPF 0 NEXF 0 0 0 0 0 0 0 0 0 SVSF 0 AEF 0 Figure 4-3. MPU Flag Register (MPUFLG) Read: Anytime Write: Write of 1 clears flag, write of 0 ignored Table 4-3. MPUFLG Field Descriptions Field 7 AEF Description Access Error Flag -- This bit is the CPU access error interrupt flag. It is set if a CPU access violation has occurred. At the same time this bit is set, all the other status flags in this register and the access violation address bits in the MPUASTATn registers are captured. Clear this flag by writing a one. Note: If a CPU access error is flagged and both the WPF bit and the NEXF bit are zero, the access violation was caused by an access to memory not covered by the MPU descriptors. Note: While this bit is set, the CPU in supervisor state ("Master 0") can read from and write to the peripheral register space even if there is no memory protection descriptor explicitly allowing this. This is to prevent the case that the CPU cannot clear the AEF bit if the registers are write protected for the CPU in supervisor state. Note: This bit should only be cleared by an access from the S12X CPU. Otherwise, when using one of the other masters (such as the XGATE) to clear this bit, the status flags and the address status registers may not get updated correctly if a CPU access causes a violation in the same bus cycle. Write-Protect Violation Flag -- This flag is set if the current CPU access violation has occurred because of an attempt to write to memory configured as read-only. The WPF bit is read-only; it will be automatically updated when the next access violation is flagged with the AEF bit. No-Execute Violation Flag -- This bit is set if the current CPU access violation has occurred because of an attempt to fetch code from memory configured as No-Execute. The NEXF bit is read-only; it will be automatically updated when the next access violation is flagged with the AEF bit. Supervisor State Flag -- This bit is set if the current CPU access violation occurred while the CPU was in supervisor state. This bit is cleared if the current CPU access violation occurred while the CPU was in user state. The supervisor state flag is read-only; it will be automatically updated when the next CPU access violation is flagged with the AEF bit. 6 WPF 5 NEXF 0 SVSF If the AEF bit is set further violations are not captured into the MPU status registers. The status of the AEF bit has no effect on the access restrictions, i.e. access restrictions for all masters are still enforced if the AEF bit is set. Also, the non-maskable hardware interrupt for violating accesses coming from the S12X CPU is generated regardless of the state of the AEF bit. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 231 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.2 MPU Address Status Register 0 (MPUASTAT0) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0001 R W Reset 0 0 0 0 0 0 0 0 0 ADDR[22:16] Figure 4-4. MPU Address Status Register 0 (MPUASTAT0) Read: Anytime Write: Never Table 4-4. MPUASTAT0 Field Descriptions Field Description 6-0 Access violation address bits -- The ADDR[22:16] bits contain bits [22:16] of the global address which ADDR[22:16] caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. 4.3.1.3 MPU Address Status Register 1 (MPUASTAT1) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0002 R W Reset 0 0 0 0 0 0 0 0 ADDR[15:8] Figure 4-5. MPU Address Status Register 1 (MPUASTAT1) Read: Anytime Write: Never Table 4-5. MPUASTAT1 Field Descriptions Field 7-0 ADDR[15:8] Description Access violation address bits -- The ADDR[15:8] bits contain bits [15:8] of the global address which caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. MC9S12XE-Family Reference Manual , Rev. 1.21 232 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.4 MPU Address Status Register 2 (MPUASTAT2) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0003 R W Reset 0 0 0 0 0 0 0 0 ADDR[7:0] Figure 4-6. MPU Address Status Register (MPUASTAT2) Read: Anytime Write: Never Table 4-6. MPUASTAT2 Field Descriptions Field 7-0 ADDR[7:0] Description Access violation address bits -- The ADDR[7:0] bits contain bits [7:0] of the global address which caused the current access violation interrupt. These bits are undefined if the access error flag bit (AEF) in the MPUFLG register is not set. 4.3.1.5 MPU Descriptor Select Register (MPUSEL) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0005 R W Reset 0 0 0 0 0 0 0 0 0 SVSEN 0 SEL[2:0] 0 0 Figure 4-7. MPU Descriptor Select Register (MPUSEL) Read: Anytime Write: Anytime Table 4-7. MPUSEL Field Descriptions Field 7 SVSEN Description MPU supervisor state enable bit -- This bit enables the memory protection for the CPU in supervisor state. If this bit is cleared, the MPU does not affect any accesses coming from the CPU in supervisor state. This is to prevent the CPU from locking out itself while configuring the protection descriptors (during initialization after a system reset and during the update of the protection descriptors for a task switch). The memory protection functionality for the other bus-masters is unaffected by this bit. 0 MPU is disabled for the CPU in supervisor state 1 MPU is enabled for the CPU in supervisor state Descriptor select bits -- The SEL[2:0] bits select which descriptor is visible in the MPU Descriptor Register window (MPUDESC0--MPUDESC5). 2-0 SEL[2:0] MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 233 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.3.1.6 MPU Descriptor Register 0 (MPUDESC0) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0006 R W MSTR0 MSTR1 MSTR2 MSTR3 LOW_ADDR[22:19] 0 0 0 0 Reset 1(1) 11 1(2) 11 1. initialized as set for descriptor 0 only, cleared for all others 2. initialized as set for descriptor 0 only, if MSTR3 is implemented on the device Figure 4-8. MPU Descriptor Register 0 (MPUDESC0) Read: Anytime Write: Anytime Table 4-8. MPUDESC0 Field Descriptions Field 7 MSTR0 6 MSTR1 5 MSTR2 4 MSTR3 Description Master 0 select bit -- If this bit is set the descriptor is valid for bus master 0 (CPU in supervisor state). Master 1 select bit -- If this bit is set the descriptor is valid for bus master 1 (CPU in user state). Master 2 select bit -- If this bit is set the descriptor is valid for bus master 2 (XGATE). Master 3 select bit -- If this bit is set the descriptor is valid for bus master 3. 3-0 Memory range lower boundary address bits -- The LOW_ADDR[22:19] bits represent bits [22:19] of the LOW_ADDR[ global memory address that is used as the lower boundary for the described memory range. 22:19] A descriptor can be configured as valid for more than one bus-master at the same time by setting multiple Master select bits to one. Setting all Master select bits of a descriptor to zero disables the descriptor. 4.3.1.7 MPU Descriptor Register 1 (MPUDESC1) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0007 R W Reset 0 0 0 LOW_ADDR[18:11] 0 0 0 0 0 Figure 4-9. MPU Descriptor Register 1 (MPUDESC1) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 234 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Table 4-9. MPUDESC1 Field Descriptions Field Description Memory range lower boundary address bits -- The LOW_ADDR[18:11] bits represent bits [18:11] of the 7-0 LOW_ADDR[ global memory address that is used as the lower boundary for the described memory range. 18:11] 4.3.1.8 MPU Descriptor Register 2 (MPUDESC2) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0008 R W Reset 0 0 0 LOW_ADDR[10:3] 0 0 0 0 0 Figure 4-10. MPU Descriptor Register 2 (MPUDESC2) Read: Anytime Write: Anytime Table 4-10. MPUDESC2 Field Descriptions Field Description 7-0 Memory range lower boundary address bits -- The LOW_ADDR[10:3] bits represent bits [10:3] of the global LOW_ADDR[ memory address that is used as the lower boundary for the described memory range. 10:3] 4.3.1.9 MPU Descriptor Register 3 (MPUDESC3) 7 6 5 4 3 2 1 0 Address: Module Base + 0x0009 R W Reset 0 0 0 0 1 WP 0 NEX 0 HIGH_ADDR[22:19] 1 1 1 Figure 4-11. MPU Descriptor Register 3 (MPUDESC3) Read: Anytime Write: Anytime Table 4-11. MPUDESC3 Field Descriptions Field 7 WP Description Write-Protect bit -- The WP bit causes the described memory range to be treated as write-protected. If this bit is set every attempt to write in the described memory range causes an access violation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 235 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) Field 6 NEX Description No-Execute bit -- The NEX bit prevents the described memory range from being used as code memory. If this bit is set every Op-code fetch in this memory range causes an access violation. 3-0 Memory range upper boundary address bits -- The HIGH_ADDR[22:19] bits represent bits [22:19] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 22:19] 4.3.1.10 MPU Descriptor Register 4 (MPUDESC4) 7 6 5 4 3 2 1 0 Address: Module Base + 0x000A R W Reset 1 1 1 HIGH_ADDR[18:11] 1 1 1 1 1 Figure 4-12. MPU Descriptor Register 4 (MPUDESC4) Read: Anytime Write: Anytime Table 4-12. MPUDESC4 Field Descriptions Field Description 7-0 Memory range upper boundary address bits -- The HIGH_ADDR[18:11] bits represent bits [18:11] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 18:11] 4.3.1.11 MPU Descriptor Register 5 (MPUDESC5) 7 6 5 4 3 2 1 0 Address: Module Base + 0x000B R W Reset 1 1 1 HIGH_ADDR[10:3] 1 1 1 1 1 Figure 4-13. MPU Descriptor Register 5 (MPUDESC5) Read: Anytime Write: Anytime Table 4-13. MPUDESC5 Field Descriptions Field Description 7-0 Memory range upper boundary address bits -- The HIGH_ADDR[10:3] bits represent bits [10:3] of the HIGH_ADDR[ global memory address that is used as the upper boundary for the described memory range. 10:3] MC9S12XE-Family Reference Manual , Rev. 1.21 236 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) 4.4 Functional Description The MPU module provides memory protection for accesses coming from multiple masters in the system. This is done by monitoring bus traffic of each master and compare this with the configuration information from a set of eight programmable descriptors located in the MPU module. If the MPU module detects an access violation caused by the S12X CPU, it will assert the CPU access violation interrupt signal. If the MPU module detects an access violation caused by a bus master other than the S12X CPU, it raises an access error signal. Please refer to the documentation chapter of the individual master modules (i.e. XGATE, etc.) for more information about the access error condition. Violating accesses are not executed. The return value of a violating read access is undefined for both 8 bit and 16 bit accesses. NOTE Accesses from BDM are not restricted. BDM hardware accesses always bypass the MPU module. During execution of BDM firmware code S12X CPU accesses are masked from the MPU module as well. 4.4.1 Protection Descriptors Each of the eight protection descriptors can be used to restrict the allowed types of memory accesses for a given memory range. Each of these memory ranges can cover up the entire 23 bits global memory range (8 MBytes). The descriptors are banked in the MPU module register map. Each descriptor can be selected for modifying using the SEL bits in the MPU Descriptor Select (MPUSEL) register. Table 4-14 gives an overview of the types of accesses that can be configured using the protection descriptors. Table 4-14. Access Types WP 0 0 1 1 NEX 0 1 0 1 Meaning read, write and execute read, write read and execute read only The granularity of each descriptor is 8 bytes. This means the protection comparators in the MPU module cover only address bits [22:3] of each access. The lower address bits [2:0] are ignored. NOTE A mis-aligned word access to the upper boundary address of a descriptor is always flagged as an access violation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 237 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) NOTE Configuring the lower boundary address of a descriptor to be higher than the upper boundary address of a descriptor causes this descriptor to be ignored by the comparator block. This effectively disables the descriptor. NOTE Avoid changing descriptors while they are in active use to validate accesses from bus-masters. This can be done by temporarily disabling the affected master during the update (XGATE, Master 3, switch S12X CPU states). Otherwise accesses from bus-masters affected by a descriptor which is updated concurrently could yield undefined results. 4.4.1.1 Overlapping Descriptors If the memory ranges of two protection descriptors defined for the same bus-master overlap, the access restrictions for the overlapped memory range are accumulated. For example: * a memory protection descriptor defines memory range 0x40_0000-0x41_FFFF as WP=1, NEX=0 (read and execute) * another descriptor defines memory range 0x41_0000-0x43_FFFF as WP=0, NEX=1 (read and write) * the resulting access rights for the overlapping range 0x41_0000-0x41_FFFF are WP=1, NEX=1 (read only) 4.4.1.2 Implicitly defined memory descriptors As mentioned in the bit description of the Access Error Flag (AEF) in the MPUFLG register (Table 4-3), there is an additional memory range implicitly defined only while the AEF bit is set: The CPU in supervisor state can read from and write to the peripheral register space even if there is no memory protection descriptor explicitly allowing this. This is to prevent the case that the CPU cannot clear the AEF bit if the registers are write protected for the CPU in supervisor state. The register address space containing the PAGE registers (EPAGE, RPAGE, GPAGE, PPAGE) at 0x0010- 0x0017 gets special treatment. It is defined like this: * The S12X CPU can always read and write these registers, regardless of the configuration in the descriptors. * XGATE or Master3 (if available) are never allowed to read or write these registers, even if the descriptor configuration allows accesses for other masters than the S12X CPU. 4.4.1.3 Op-code pre-fetch cycles and the NEX bit Some bus-masters (CPU, XGATE) do a pre-fetch of program-code past the current instruction. The S12XCPU pre-fetches two words past the current instruction, the XGATE pre-fetches one word, even if the pre-fetched code is not executed. The MPU module has no way of knowing this at the time when the pre-fetch cycles occur. Therefore this will result in an access violation if the op-code pre-fetch accesses a memory range marked as "No-Execute" (NEX=1). This must be taken into account when defining memory MC9S12XE-Family Reference Manual , Rev. 1.21 238 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) ranges with the NEX bit set adjacent to memory used for program code. The best way to do this would be to leave some fill-bytes between the memory ranges in this case, i.e. do not set the upper memory boundary to the address of the last op-code but to a following address which is at least two words (four bytes) away. 4.4.2 Interrupts This section describes all interrupts originated by the MPU module. 4.4.2.1 Description of Interrupt Operation The MPU module generates one interrupt request. It cannot be masked locally in the MPU module and is meant to be used as the source of a non-maskable hardware interrupt request for the S12X CPU Table 4-15. Interrupt vectors Interrupt Source S12X CPU access error interrupt (AEF) CCR Mask Local Enable - - 4.4.2.2 CPU Access Error Interrupt An S12X CPU access error interrupt request is generated if the MPU module has detected an illegal memory access originating from the S12X CPU. This is a non-maskable hardware interrupt. Due to the non-maskable nature of this interrupt, the de-assertion of this interrupt request is coupled to the S12X CPU interrupt vector fetch instead of the local access error flag (AEF). This means leaving the access error flag (AEF) in the MPUFLG register set will not cause the same interrupt to be serviced again after leaving the interrupt service routine with "RTI". Instead, the interrupt request will be asserted again only when the next illegal S12X CPU access is detected. 4.5 4.5.1 Initialization/Application Information Initialization After reset the MPU module is in an unconfigured state, with all eight protection descriptors covering the whole memory map. The master bits are all set for descriptor "0" and cleared for all other descriptors. The S12XCPU in supervisor state can access everything because the SVSEN bit in the MPUSEL register is cleared by a system reset. After system reset every master has full access to the memory map because of descriptor "0". In order to use the MPU module to protect memory ranges from undesired accesses, software needs to: * Initialize the protection descriptors. * Make sure there are meaningful interrupt service routines defined for the Access Violation interrupts because these are non-maskable (See S12XINT chapter for details). * Initialize peripherals and other masters for use (i.e. set-up XGATE, Master3 if applicable). * Enable the MPU protection for the S12X CPU in supervisor state, if desired. * Switch the S12X CPU to user state, if desired. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 239 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 4 Memory Protection Unit (S12XMPUV1) MC9S12XE-Family Reference Manual , Rev. 1.21 240 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-1. Revision History Revision Number V04.01 V04.02 V04.03 Revision Date 12 Sep 2005 23 May 2006 24 Jul 2006 Sections Affected Description of Changes - Added CSx stretch description. - Internal updates - Removed term IVIS 5.1 Introduction This document describes the functionality of the XEBI block controlling the external bus interface. The XEBI controls the functionality of a non-multiplexed external bus (a.k.a. `expansion bus') in relationship with the chip operation modes. Dependent on the mode, the external bus can be used for data exchange with external memory, peripherals or PRU, and provide visibility to the internal bus externally in combination with an emulator. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 241 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.1.1 Glossary or Terms bus clock System Clock. Refer to CRG Block Guide. Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode Normal Single-Chip Mode Special Single-Chip Mode Emulation Single-Chip Mode Emulation Expanded Mode Normal Single-Chip Mode Normal Expanded Mode Special Single-Chip Mode Special Test Mode Normal Single-Chip Mode Special Single-Chip Mode Normal Expanded Mode Emulation Single-Chip Mode Emulation Expanded Mode Special Test Mode Addresses outside MCU Port Replacement Registers Port Replacement Unit External emulation memory CPU or BDM or XGATE expanded modes single-chip modes emulation modes normal modes special modes NS SS NX ES EX ST external resource PRR PRU EMULMEM access source 5.1.2 Features The XEBI includes the following features: * Output of up to 23-bit address bus and control signals to be used with a non-muxed external bus * Bidirectional 16-bit external data bus with option to disable upper half * Visibility of internal bus activity 5.1.3 * * Modes of Operation Single-chip modes The external bus interface is not available in these modes. Expanded modes Address, data, and control signals are activated on the external bus in normal expanded mode and special test mode. Emulation modes The external bus is activated to interface to an external tool for emulation of normal expanded mode or normal single-chip mode applications. MC9S12XE-Family Reference Manual , Rev. 1.21 * 242 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Refer to the S12X_MMC section for a detailed description of the MCU operating modes. 5.1.4 Block Diagram Figure 5-1 is a block diagram of the XEBI with all related I/O signals. ADDR[22:0] DATA[15:0] IVD[15:0] LSTRB RW EWAIT XEBI UDS LDS RE WE ACC[2:0] IQSTAT[3:0] CS[3:0] Figure 5-1. XEBI Block Diagram 5.2 External Signal Description NOTE The following external bus related signals are described in other sections: ECLK, ECLKX2 (free-running clocks) -- PIM section TAGHI, TAGLO (tag inputs) -- PIM section, S12X_DBG section The user is advised to refer to the SoC section for port configuration and location of external bus signals. Table 5-2 outlines the pin names and gives a brief description of their function. Refer to the SoC section and PIM section for reset states of these pins and associated pull-ups or pull-downs. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 243 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-2. External System Signals Associated with XEBI EBI Signal Multiplex (T)ime(2) (F)unction(3) -- T -- -- -- T -- -- T -- -- T F Available in Modes Description NS Read Enable, indicates external read access External address Access source External address Instruction Queue Status External address Internal visibility read data External address Internal visibility read data -- -- -- -- -- -- -- -- -- -- -- -- -- F F Upper Data Select, indicates external access to the high byte DATA[15:8] Low Strobe, indicates valid data on DATA[7:0] Lower Data Select, indicates external access to the low byte DATA[7:0] Read/Write, indicates the direction of internal data transfers Write Enable, indicates external write access Chip select Bidirectional data (even address) Bidirectional data (odd address) No No No No No No No No No No No No No No No No No SS No No No No No No No No No No No No No No No No No NX Yes Yes No Yes No Yes No No No Yes No Yes No Yes Yes Yes Yes ES No Yes Yes Yes Yes Yes Yes Yes Yes No Yes No Yes No No Yes Yes EX No Yes Yes Yes Yes Yes Yes Yes Yes No Yes No Yes No Yes Yes Yes ST No Yes Yes Yes Yes Yes Yes Yes Yes No Yes No Yes No No Yes Yes Signal I /O (1) RE ADDR[22:20] ACC[2:0] ADDR[19:16] IQSTAT[3:0] ADDR[15:1] IVD[15:1] ADDR0 IVD0 UDS LSTRB LDS RW WE CS[3:0] DATA[15:8] DATA[7:0] EWAIT O O O O O O O O O O O O O O O I/O I/O I External control for external bus access No No Yes No Yes No stretches (adding wait states) 1. All inputs are capable of reducing input threshold level 2. Time-multiplex means that the respective signals share the same pin on chip level and are active alternating in a dedicated time slot (in modes where applicable). 3. Function-multiplex means that one of the respective signals sharing the same pin on chip level continuously uses the pin depending on configuration and reset state. MC9S12XE-Family Reference Manual , Rev. 1.21 244 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the XEBI. 5.3.1 Module Memory Map The registers associated with the XEBI block are shown in Figure 5-2. Register Name 0x0E EBICTL0 0x0F EBICTL1 R W R W Bit 7 ITHRS 0 6 0 5 HDBE 4 ASIZ4 3 ASIZ3 0 2 ASIZ2 1 ASIZ1 Bit 0 ASIZ0 EXSTR12 EXSTR11 EXSTR10 EXSTR02 EXSTR01 EXSTR00 = Unimplemented or Reserved Figure 5-2. XEBI Register Summary 5.3.2 Register Descriptions The following sub-sections provide a detailed description of each register and the individual register bits. All control bits can be written anytime, but this may have no effect on the related function in certain operating modes. This allows specific configurations to be set up before changing into the target operating mode. NOTE Depending on the operating mode an available function may be enabled, disabled or depend on the control register bit. Reading the register bits will reflect the status of related function only if the current operating mode allows user control. Please refer the individual bit descriptions. 5.3.2.1 External Bus Interface Control Register 0 (EBICTL0) Module Base +0x000E (PRR) 7 6 5 4 3 2 1 0 R W Reset ITHRS 0 0 0 HDBE 1 ASIZ4 1 ASIZ3 1 ASIZ2 1 ASIZ1 1 ASIZ0 1 = Unimplemented or Reserved Figure 5-3. External Bus Interface Control Register 0 (EBICTL0) Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes, the data is read from this register. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 245 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) This register controls input pin threshold level and determines the external address and data bus sizes in normal expanded mode. If not in use with the external bus interface, the related pins can be used for alternative functions. External bus is available as programmed in normal expanded mode and always full-sized in emulation modes and special test mode; function not available in single-chip modes. Table 5-3. EBICTL0 Field Descriptions Field 7 ITHRS Description Reduced Input Threshold -- This bit selects reduced input threshold on external data bus pins and specific control input signals which are in use with the external bus interface in order to adapt to external devices with a 3.3 V, 5 V tolerant I/O. The reduced input threshold level takes effect depending on ITHRS, the operating mode and the related enable signals of the EBI pin function as summarized in Table 5-4. 0 Input threshold is at standard level on all pins 1 Reduced input threshold level enabled on pins in use with the external bus interface High Data Byte Enable -- This bit enables the higher half of the 16-bit data bus. If disabled, only the lower 8bit data bus can be used with the external bus interface. In this case the unused data pins and the data select signals (UDS and LDS) are free to be used for alternative functions. 0 DATA[15:8], UDS, and LDS disabled 1 DATA[15:8], UDS, and LDS enabled External Address Bus Size -- These bits allow scalability of the external address bus. The programmed value corresponds to the number of available low-aligned address lines (refer to Table 5-5). All address lines ADDR[22:0] start up as outputs after reset in expanded modes. This needs to be taken into consideration when using alternative functions on relevant pins in applications which utilize a reduced external address bus. 5 HDBE 4-0 ASIZ[4:0] Table 5-4. Input Threshold Levels on External Signals ITHRS External Signal DATA[15:8] TAGHI, TAGLO 0 DATA[7:0] EWAIT DATA[15:8] TAGHI, TAGLO 1 DATA[7:0] Standard Standard Reduced if HDBE = 1 Reduced Standard Standard Standard NS SS NX ES Reduced Standard Reduced EX Reduced Standard Reduced Reduced ST Standard Reduced Reduced if EWAIT if EWAIT Standard EWAIT Standard (1) 1 enabled enabled 1. EWAIT function is enabled if at least one CSx line is configured respectively in MMCCTL0. Refer to S12X_MMC section and Table 5-6. Table 5-5. External Address Bus Size ASIZ[4:0] 00000 00001 00010 Available External Address Lines None UDS ADDR1, UDS MC9S12XE-Family Reference Manual , Rev. 1.21 246 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-5. External Address Bus Size ASIZ[4:0] 00011 : 10110 10111 : 11111 Available External Address Lines ADDR[2:1], UDS : ADDR[21:1], UDS ADDR[22:1], UDS 5.3.2.2 External Bus Interface Control Register 1 (EBICTL1) Module Base +0x000F (PRR) 7 6 5 4 3 2 1 0 R W Reset 0 0 EXSTR12 1 EXSTR11 1 EXSTR10 1 0 0 EXSTR02 1 EXSTR01 1 EXSTR00 1 = Unimplemented or Reserved Figure 5-4. External Bus Interface Control Register 1 (EBICTL1) Read: Anytime. In emulation modes, read operations will return the data from the external bus, in all other modes the data is read from this register. Write: Anytime. In emulation modes, write operations will also be directed to the external bus. This register allows programming of two independent values determining the amount of additional stretch cycles for external accesses (wait states). With two bits in S12X_MMC register MMCCTL0 for every individual CSx line one of the two counter options or the EWAIT input is selected as stretch source. The chip select outputs can also be disabled to free up the pins for alternative functions (Table 5-6). Refer also to S12X_MMC section for register bit descriptions. Table 5-6. Chip select function CSxE1 0 0 1 1 CSxE0 0 1 0 1 CSx disabled CSx stretched with EXSTR0 CSx stretched with EXSTR1 CSx stretched with EWAIT Function If EWAIT input usage is selected in MMCCTL0 the minimum number of stretch cycles is 2 for accesses to the related address range. If configured respectively, stretch cycles are added as programmed or dependent on EWAIT in normal expanded mode and emulation expanded mode; function not available in all other operating modes. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 247 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-7. EBICTL1 Field Descriptions Field Description 6-4 External Access Stretch Option 1 Bits 2, 1, 0 -- This three bit field determines the amount of additional clock EXSTR1[2:0] stretch cycles on every access to the external address space as shown in Table 5-8. 2-0 External Access Stretch Option 0 Bits 2, 1, 0 -- This three bit field determines the amount of additional clock EXSTR0[2:0] stretch cycles on every access to the external address space as shown in Table 5-8. Table 5-8. External Access Stretch Bit Definition EXSTRx[2:0] 000 001 010 011 100 101 110 111 Number of Stretch Cycles 1 2 3 4 5 6 7 8 5.4 Functional Description This section describes the functions of the external bus interface. The availability of external signals and functions in relation to the operating mode is initially summarized and described in more detail in separate sub-sections. 5.4.1 Operating Modes and External Bus Properties A summary of the external bus interface functions for each operating mode is shown in Table 5-9. Table 5-9. Summary of Functions Single-Chip Modes Properties (if Enabled) Normal Single-Chip Special Single-Chip Normal Expanded Expanded Modes Emulation Single-Chip Emulation Expanded Special Test Timing Properties PRR access(1) 2 cycles read internal write internal -- -- 2 cycles read internal write internal -- -- 2 cycles read internal write internal -- Max. of 2 to 9 programmed cycles or n cycles of ext. wait(3) 2 cycles read external write int & ext 1 cycle 1 cycle 2 cycles read external write int & ext 1 cycle Max. of 2 to 9 programmed cycles or n cycles of ext. wait3 2 cycles read internal write internal 1 cycle 1 cycle Internal access visible externally External address access and unimplemented area access(2) MC9S12XE-Family Reference Manual , Rev. 1.21 248 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-9. Summary of Functions (continued) Single-Chip Modes Properties (if Enabled) Flash area address access(4) Normal Single-Chip -- Special Single-Chip -- Normal Expanded -- Signal Properties Bus signals -- -- ADDR[22:1] DATA[15:0] ADDR[22:20]/ ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ADDR[15:0]/ IVD[15:0] DATA[15:0] ADDR0 LSTRB RW ADDR[22:20]/ ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ADDR[15:0]/ IVD[15:0] DATA[15:0] ADDR0 LSTRB RW CS0 CS1 CS2 CS3 EWAIT ADDR[22:0] DATA[15:0] Expanded Modes Emulation Single-Chip 1 cycle Emulation Expanded 1 cycle Special Test 1 cycle Data select signals (if 16-bit data bus) Data direction signals -- -- -- -- UDS LDS RE WE CS0 CS1 CS2 CS3 EWAIT ADDR0 LSTRB RW Chip Selects -- -- -- -- External wait feature -- -- -- -- Reduced input -- -- Refer to DATA[15:0] DATA[15:0] Refer to threshold enabled on Table 5-4 EWAIT EWAIT Table 5-4 1. Incl. S12X_EBI registers 2. Refer to S12X_MMC section. 3. If EWAIT enabled for at least one CSx line (refer to S12X_MMC section), the minimum number of external bus cycles is 3. 4. Available only if configured appropriately by ROMON and EROMON (refer to S12X_MMC section). 5.4.2 Internal Visibility Internal visibility allows the observation of the internal CPU address and data bus as well as the determination of the access source and the CPU pipe (queue) status through the external bus interface. Internal visibility is always enabled in emulation single chip mode and emulation expanded mode. Internal CPU accesses are made visible on the external bus interface except CPU execution of BDM firmware instructions. Internal reads are made visible on ADDRx/IVDx (address and read data multiplexed, see Table 5-12 to Table 5-14), internal writes on ADDRx and DATAx (see Table 5-15 to Table 5-17). RW and LSTRB show the type of access. External read data are also visible on IVDx. During `no access' cycles RW is held in read position while LSTRB is undetermined. All accesses which make use of the external bus interface are considered external accesses. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 249 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.4.2.1 Access Source Signals (ACC) The access source can be determined from the external bus control signals ACC[2:0] as shown in Table 510. Table 5-10. Determining Access Source from Control Signals ACC[2:0] 000 001 010 011 100 101 Access Description Repetition of previous access cycle CPU access BDM external access XGATE PRR access No access(1) CPU access error 110, 111 Reserved 1. Denotes also CPU accesses to BDM firmware and BDM registers (IQSTATx are `XXXX' and RW = 1 in these cases) 5.4.2.2 Instruction Queue Status Signals (IQSTAT) The CPU instruction queue status (execution-start and data-movement information) is brought out as IQSTAT[3:0] signals. For decoding of the IQSTAT values, refer to the S12X_CPU section. 5.4.2.3 Internal Visibility Data (IVD) Depending on the access size and alignment, either a word of read data is made visible on the address lines or only the related data byte will be presented in the ECLK low phase. For details refer to Table 5-11. Invalid IVD are brought out in case of non-CPU read accesses. Table 5-11. IVD Read Data Output Access Word read of data at an even and even+1 address Word read of data at an odd and odd+1 internal RAM address (misaligned) Byte read of data at an even address Byte read of data at an odd address IVD[15:8] ivd(even) ivd(odd+1) ivd(even) addr[15:8] (rep.) IVD[7:0] ivd(even+1) ivd(odd) addr[7:0] (rep.) ivd(odd) 5.4.2.4 Emulation Modes Timing A bus access lasts 1 ECLK cycle. In case of a stretched external access (emulation expanded mode), up to an infinite amount of ECLK cycles may be added. ADDRx values will only be shown in ECLK high phases, while ACCx, IQSTATx, and IVDx values will only be presented in ECLK low phases. Based on this multiplex timing, ACCx are only shown in the current (first) access cycle. IQSTATx and (for read accesses) IVDx follow in the next cycle. If the access takes more than one bus cycle, ACCx display NULL (0x000) in the second and all following cycles of the access. IQSTATx display NULL (0x0000) from the third until one cycle after the access to indicate continuation. MC9S12XE-Family Reference Manual , Rev. 1.21 250 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) The resulting timing pattern of the external bus signals is outlined in the following tables for read, write and interleaved read/write accesses. Three examples represent different access lengths of 1, 2, and n-1 bus cycles. Non-shaded bold entries denote all values related to Access #0. The following terminology is used: `addr' -- value(ADDRx); small letters denote the logic values at the respective pins `x' -- Undefined output pin values `z' -- Tristate pins `?' -- Dependent on previous access (read or write); IVDx: `ivd' or `x'; DATAx: `data' or `z' 5.4.2.4.1 Read Access Timing Table 5-12. Read Access (1 Cycle) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (internal read) DATA[15:0] (external read) RW ... ... ... addr 0 ? ? 1 ... ... ... ... high Access #1 2 3 low acc 1 iqstat 0 ivd 0 z z 1 high addr 2 z data 1 1 low acc 2 iqstat 1 ivd 1 z z 1 ... ... ... ... ... ... ... ... 1 low acc 0 iqstat -1 ? z z 1 z data 0 1 addr 1 high ADDR[19:16] / IQSTAT[3:0] ... Table 5-13. Read Access (2 Cycles) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (internal read) DATA[15:0] (external read) RW ... ... ... addr 0 ? ? 1 ... ... ... ... high Access #1 2 3 low 000 iqstat 0 x z z 1 high addr 1 z data 0 1 low acc 1 0000 ivd 0 z z 1 ... ... ... ... ... ... ... ... 1 low acc 0 iqstat-1 ? z z 1 z z 1 addr 0 high ADDR[19:16] / IQSTAT[3:0] ... Table 5-14. Read Access (n-1 Cycles) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (internal read) ... ... ... addr 0 ? ... ... high Access #1 3 ... low 000 addr 0 z 0000 x z ... ... ... ... ... z addr 1 high 1 low acc 0 iqstat-1 ? z z addr 0 high 2 low 000 iqstat 0 x z high n low acc 1 0000 ivd 0 z ... ... ... ... ... ... ADDR[19:16] / IQSTAT[3:0] ... MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 251 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-14. Read Access (n-1 Cycles) DATA[15:0] (external read) RW ... ... ? 1 z 1 z 1 z 1 z 1 z 1 ... ... data 0 1 z 1 ... ... 5.4.2.4.2 Write Access Timing Table 5-15. Write Access (1 Cycle) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (write) RW ... ... ... addr 0 ? 0 0 ... ... ... high Access #1 2 high addr 1 low acc 1 iqstat 0 x data 0 1 1 data 1 Access #2 3 high addr 2 low acc 2 iqstat 1 x data 2 1 1 ... ... ... ... ... ... ... 1 low acc 0 iqstat -1 ? ADDR[19:16] / IQSTAT[3:0] ... Table 5-16. Write Access (2 Cycles) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (write) RW ... ... ... addr 0 ? 0 0 0 ... ... ... high Access #1 2 3 low 000 iqstat 0 x data 0 0 1 high addr 1 low acc 1 0000 x x 1 ... ... ... ... ... ... ... 1 low acc 0 iqstat-1 ? addr 0 high ADDR[19:16] / IQSTAT[3:0] ... Table 5-17. Write Access (n-1 Cycles) Access #0 Bus cycle -> ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (write) RW ... ... ... addr 0 ? 0 0 0 0 ... ... ... high Access #1 3 ... low 000 addr 0 0000 x data 0 0 0 ... 1 ... ... ... ... addr 1 high 1 low acc 0 iqstat-1 ? addr 0 high 2 low 000 iqstat 0 x high n low acc 1 0000 x x 1 ... ... ... ... ... ... ... ADDR[19:16] / IQSTAT[3:0] ... 5.4.2.4.3 Read-Write-Read Access Timing Table 5-18. Interleaved Read-Write-Read Accesses (1 Cycle) Access #0 Access #1 2 Access #2 3 ... Bus cycle -> ... 1 MC9S12XE-Family Reference Manual , Rev. 1.21 252 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Table 5-18. Interleaved Read-Write-Read Accesses (1 Cycle) (continued) ECLK phase ADDR[22:20] / ACC[2:0] ADDR[15:0] / IVD[15:0] DATA[15:0] (internal read) DATA[15:0] (external read) RW ... ... addr 0 ? ? 1 ... ... ... ... high low acc 0 iqstat -1 ? z z 1 z data 0 0 addr 1 high low acc 1 iqstat 0 ivd 0 (write) data 1 (write) data 1 0 1 addr 2 high low acc 2 iqstat 1 x z z 1 ... ... ... ... ... ... ... ADDR[19:16] / IQSTAT[3:0] ... 5.4.3 Accesses to Port Replacement Registers All read and write accesses to PRR addresses take two bus clock cycles independent of the operating mode. If writing to these addresses in emulation modes, the access is directed to both, the internal register and the external resource while reads will be treated external. The XEBI control registers also belong to this category. 5.4.4 Stretched External Bus Accesses In order to allow fast internal bus cycles to coexist in a system with slower external resources, the XEBI supports stretched external bus accesses (wait states) for each external address range related to one of the 4 chip select lines individually. This feature is available in normal expanded mode and emulation expanded mode for accesses to all external addresses except emulation memory and PRR. In these cases the fixed access times are 1 or 2 cycles, respectively. Stretched accesses are controlled by: 1. EXSTR1[2:0] and EXSTR0[2:0] bits in the EBICTL1 register configuring a fixed amount of stretch cycles individually for each CSx line in MMCCTL0 2. Activation of the external wait feature for each CSx line MMCCTL0 register 3. Assertion of the external EWAIT signal when at least one CSx line is configured for EWAIT The EXSTRx[2:0] control bits can be programmed for generation of a fixed number of 1 to 8 stretch cycles. If the external wait feature is enabled, the minimum number of additional stretch cycles is 2. An arbitrary amount of stretch cycles can be added using the EWAIT input. EWAIT needs to be asserted at least for a minimal specified time window within an external access cycle for the internal logic to detect it and add a cycle (refer to electrical characteristics). Holding it for additional cycles will cause the external bus access to be stretched accordingly. Write accesses are stretched by holding the initiator in its current state for additional cycles as programmed and controlled by external wait after the data have been driven out on the external bus. This results in an extension of time the bus signals and the related control signals are valid externally. Read data are not captured by the system in normal expanded mode until the specified setup time before the RE rising edge. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 253 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) Read data are not captured in emulation expanded mode until the specified setup time before the falling edge of ECLK. In emulation expanded mode, accesses to the internal flash or the emulation memory (determined by EROMON and ROMON bits; see S12X_MMC section for details) always take 1 cycle and stretching is not supported. In case the internal flash is taken out of the map in user applications, accesses are stretched as programmed and controlled by external wait. 5.4.5 Data Select and Data Direction Signals The S12X_EBI supports byte and word accesses at any valid external address. The big endian system of the MCU is extended to the external bus; however, word accesses are restricted to even aligned addresses. The only exception is the visibility of misaligned word accesses to addresses in the internal RAM as this module exclusively supports these kind of accesses in a single cycle. With the above restriction, a fixed relationship is implied between the address parity and the dedicated bus halves where the data are accessed: DATA[15:8] is related to even addresses and DATA[7:0] is related to odd addresses. In expanded modes the data access type is externally determined by a set of control signals, i.e., data select and data direction signals, as described below. The data select signals are not available if using the external bus interface with an 8-bit data bus. 5.4.5.1 Normal Expanded Mode In normal expanded mode, the external signals RE, WE, UDS, LDS indicate the access type (read/write), data size and alignment of an external bus access (Table 5-19). Table 5-19. Access in Normal Expanded Mode DATA[15:8] Access Word write of data on DATA[15:0] at an even and even+1 address Byte write of data on DATA[7:0] at an odd address Byte write of data on DATA[15:8] at an even address Word read of data on DATA[15:0] at an even and even+1 address Byte read of data on DATA[7:0] at an odd address Byte read of data on DATA[15:8] at an even address Indicates No Access Unimplemented RE WE UDS LDS I/O data(addr) I/O data(addr) 1 1 1 0 0 0 1 1 1 0 0 0 1 1 1 1 1 1 0 1 0 0 1 0 1 1 0 0 0 1 0 0 1 1 0 1 Out data(even) Out In In In In In In In x data(even) x data(even) x x x Out In In In In In In In Out data(even) data(odd) data(odd) x data(odd) data(odd) x x x x DATA[7:0] 5.4.5.2 Emulation Modes and Special Test Mode In emulation modes and special test mode, the external signals LSTRB, RW, and ADDR0 indicate the access type (read/write), data size and alignment of an external bus access. Misaligned accesses to the MC9S12XE-Family Reference Manual , Rev. 1.21 254 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) internal RAM and misaligned XGATE PRR accesses in emulation modes are the only type of access that are able to produce LSTRB = ADDR0 = 1. This is summarized in Table 5-20. Table 5-20. Access in Emulation Modes and Special Test Mode DATA[15:8] Access Word write of data on DATA[15:0] at an even and even+1 address Byte write of data on DATA[7:0] at an odd address Byte write of data on DATA[15:8] at an even address Word write at an odd and odd+1 internal RAM address (misaligned -- only in emulation modes) Word read of data on DATA[15:0] at an even and even+1 address Byte read of data on DATA[7:0] at an odd address Byte read of data on DATA[15:8] at an even address Word read at an odd and odd+1 internal RAM address (misaligned - only in emulation modes) RW LSTRB ADDR0 I/O 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Out In Out data(addr) data(even) x data(odd) I/O Out Out In data(addr) data(odd) data(odd) x data(odd) data(even+1) data(odd) x data(odd) DATA[7:0] Out data(odd+1) Out In In In In data(even) x data(even) data(odd+1) In In In In MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 255 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.4.6 Low-Power Options The XEBI does not support any user-controlled options for reducing power consumption. 5.4.6.1 Run Mode The XEBI does not support any options for reducing power in run mode. Power consumption is reduced in single-chip modes due to the absence of the external bus interface. Operation in expanded modes results in a higher power consumption, however any unnecessary toggling of external bus signals is reduced to the lowest indispensable activity by holding the previous states between external accesses. 5.4.6.2 Wait Mode The XEBI does not support any options for reducing power in wait mode. 5.4.6.3 Stop Mode The XEBI will cease to function in stop mode. 5.5 Initialization/Application Information This section describes the external bus interface usage and timing. Typical customer operating modes are normal expanded mode and emulation modes, specifically to be used in emulator applications. Taking the availability of the external wait feature into account the use cases are divided into four scenarios: * Normal expanded mode -- External wait feature disabled - External wait feature enabled * Emulation modes - Emulation single-chip mode (without wait states) - Emulation expanded mode (with optional access stretching) Normal single-chip mode and special single-chip mode do not have an external bus. Special test mode is used for factory test only. Therefore, these modes are omitted here. All timing diagrams referred to throughout this section are available in the Electrical Characteristics appendix of the SoC section. 5.5.1 Normal Expanded Mode This mode allows interfacing to external memories or peripherals which are available in the commercial market. In these applications the normal bus operation requires a minimum of 1 cycle stretch for each external access. MC9S12XE-Family Reference Manual , Rev. 1.21 256 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) 5.5.1.1 Example 1a: External Wait Feature Disabled The first example of bus timing of an external read and write access with the external wait feature disabled is shown in * Figure `Example 1a: Normal Expanded Mode -- Read Followed by Write' The associated supply voltage dependent timing are numbers given in * Table `Example 1a: Normal Expanded Mode Timing VDD5 = 5.0 V (EWAIT disabled)' * Table `Example 1a: Normal Expanded Mode Timing VDD5 = 3.0 V (EWAIT disabled)' Systems designed this way rely on the internal programmable access stretching. These systems have predictable external memory access times. The additional stretch time can be programmed up to 8 cycles to provide longer access times. 5.5.1.2 Example 1b: External Wait Feature Enabled The external wait operation is shown in this example. It can be used to exceed the amount of stretch cycles over the programmed number in EXSTR[2:0]. The feature must be enabled by configuring at least one CSx line for EWAIT. If the EWAIT signal is not asserted, the number of stretch cycles is forced to a minimum of 2 cycles. If EWAIT is asserted within the predefined time window during the access it will be strobed active and another stretch cycle is added. If strobed inactive, the next cycle will be the last cycle before the access is finished. EWAIT can be held asserted as long as desired to stretch the access. An access with 1 cycle stretch by EWAIT assertion is shown in * Figure `Example 1b: Normal Expanded Mode -- Stretched Read Access' * Figure `Example 1b: Normal Expanded Mode -- Stretched Write Access' The associated timing numbers for both operations are given in * Table `Example 1b: Normal Expanded Mode Timing VDD5 = 5.0 V (EWAIT enabled)' * Table `Example 1b: Normal Expanded Mode Timing VDD5 = 3.0 V (EWAIT enabled)' It is recommended to use the free-running clock (ECLK) at the fastest rate (bus clock rate) to synchronize the EWAIT input signal. 5.5.2 Emulation Modes In emulation mode applications, the development systems use a custom PRU device to rebuild the singlechip or expanded bus functions which are lost due to the use of the external bus with an emulator. Accesses to a set of registers controlling the related ports in normal modes (refer to SoC section) are directed to the external bus in emulation modes which are substituted by PRR as part of the PRU. Accesses to these registers take a constant time of 2 cycles. Depending on the setting of ROMON and EROMON (refer to S12X_MMC section), the program code can be executed from internal memory or an optional external emulation memory (EMULMEM). No wait MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 257 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) state operation (stretching) of the external bus access is done in emulation modes when accessing internal memory or emulation memory addresses. In both modes observation of the internal operation is supported through the external bus (internal visibility). 5.5.2.1 Example 2a: Emulation Single-Chip Mode This mode is used for emulation systems in which the target application is operating in normal single-chip mode. Figure 5-5 shows the PRU connection with the available external bus signals in an emulator application. S12X_EBI ADDR[22:0]/IVD[15:0] DATA[15:0] EMULMEM Emulator PRU PRR Ports LSTRB RW ADDR[22:20]/ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] ECLK ECLKX2 Figure 5-5. Application in Emulation Single-Chip Mode The timing diagram for this operation is shown in: * Figure `Example 2a: Emulation Single-Chip Mode -- Read Followed by Write' The associated timing numbers are given in: * Table `Example 2a: Emulation Single-Chip Mode Timing (EWAIT disabled)' Timing considerations: * Signals muxed with address lines ADDRx, i.e., IVDx, IQSTATx and ACCx, have the same timing. * LSTRB has the same timing as RW. MC9S12XE-Family Reference Manual , Rev. 1.21 258 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) * * ECLKX2 rising edges have the same timing as ECLK edges. The timing for accesses to PRU registers, which take 2 cycles to complete, is the same as the timing for an external non-PRR access with 1 cycle of stretch as shown in example 2b. 5.5.2.2 Example 2b: Emulation Expanded Mode This mode is used for emulation systems in which the target application is operating in normal expanded mode. If the external bus is used with a PRU, the external device rebuilds the data select and data direction signals UDS, LDS, RE, and WE from the ADDR0, LSTRB, and RW signals. Figure 5-6 shows the PRU connection with the available external bus signals in an emulator application. S12X_EBI ADDR[22:0]/IVD[15:0] DATA[15:0] EMULMEM Emulator PRU PRR Ports LSTRB RW UDS LDS RE WE ADDR[22:20]/ACC[2:0] ADDR[19:16]/ IQSTAT[3:0] CS[3:0] EWAIT ECLK ECLKX2 Figure 5-6. Application in Emulation Expanded Mode The timings of accesses with 1 stretch cycle are shown in * Figure `Example 2b: Emulation Expanded Mode -- Read with 1 Stretch Cycle' * Figure `Example 2b: Emulation Expanded Mode -- Write with 1 Stretch Cycle' The associated timing numbers are given in MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 259 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 5 External Bus Interface (S12XEBIV4) * Table `Example 2b: Emulation Expanded Mode Timing VDD5 = 5.0 V (EWAIT disabled)' (this also includes examples for alternative settings of 2 and 3 additional stretch cycles) Timing considerations: * If no stretch cycle is added, the timing is the same as in Emulation Single-Chip Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 260 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-1. Revision History Revision Number V02.00 Revision Date 01 Jul 2005 Sections Affected 6.1.2/6-262 Description of Changes Initial V2 release, added new features: - XGATE threads can be interrupted. - SYS instruction vector. - Access violation interrupt vectors. - Added Notes for devices without XGATE module. - Fixed priority definition for software exceptions. - Added clarification of "Wake-up from STOP or WAIT by XIRQ with X bit set" feature. V02.04 V02.05 V02.06 11 Jan 2007 20 Mar 2007 07 Jan 2008 6.3.2.2/6-267 6.3.2.4/6-268 6.4.6/6-274 6.1.2/6-262 6.1 Introduction The XINT module decodes the priority of all system exception requests and provides the applicable vector for processing the exception to either the CPU or the XGATE module. The XINT module supports: * I bit and X bit maskable interrupt requests * One non-maskable unimplemented op-code trap * One non-maskable software interrupt (SWI) or background debug mode request * One non-maskable system call interrupt (SYS) * Three non-maskable access violation interrupt * One spurious interrupt vector request * Three system reset vector requests Each of the I bit maskable interrupt requests can be assigned to one of seven priority levels supporting a flexible priority scheme. For interrupt requests that are configured to be handled by the CPU, the priority scheme can be used to implement nested interrupt capability where interrupts from a lower level are automatically blocked if a higher level interrupt is being processed. Interrupt requests configured to be handled by the XGATE module can be nested one level deep. NOTE The HPRIO register and functionality of the original S12 interrupt module is no longer supported, since it is superseded by the 7-level interrupt request priority scheme. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 261 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.1 Glossary Table 6-2. Terminology Term CCR DMA INT IPL ISR MCU XGATE IRQ XIRQ Direct Memory Access Interrupt Interrupt Processing Level Interrupt Service Routine Micro-Controller Unit refers to the XGATE co-processor; XGATE is an optional feature refers to the interrupt request associated with the IRQ pin refers to the interrupt request associated with the XIRQ pin The following terms and abbreviations are used in the document. Meaning Condition Code Register (in the S12X CPU) 6.1.2 * * * * * * * * * * * * * * Features Interrupt vector base register (IVBR) One spurious interrupt vector (at address vector base1 + 0x0010). One non-maskable system call interrupt vector request (at address vector base + 0x0012). Three non-maskable access violation interrupt vector requests (at address vector base + 0x0014- 0x0018). 2-109 I bit maskable interrupt vector requests (at addresses vector base + 0x001A-0x00F2). Each I bit maskable interrupt request has a configurable priority level and can be configured to be handled by either the CPU or the XGATE module2. I bit maskable interrupts can be nested, depending on their priority levels. One X bit maskable interrupt vector request (at address vector base + 0x00F4). One non-maskable software interrupt request (SWI) or background debug mode vector request (at address vector base + 0x00F6). One non-maskable unimplemented op-code trap (TRAP) vector (at address vector base + 0x00F8). Three system reset vectors (at addresses 0xFFFA-0xFFFE). Determines the highest priority XGATE and interrupt vector requests, drives the vector to the XGATE module or to the bus on CPU request, respectively. Wakes up the system from stop or wait mode when an appropriate interrupt request occurs or whenever XIRQ is asserted, even if X interrupt is masked. XGATE can wake up and execute code, even with the CPU remaining in stop or wait mode. 1. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used as upper byte) and 0x00 (used as lower byte). 2. The IRQ interrupt can only be handled by the CPU MC9S12XE-Family Reference Manual , Rev. 1.21 262 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.3 * * Modes of Operation Run mode This is the basic mode of operation. Wait mode In wait mode, the XINT module is frozen. It is however capable of either waking up the CPU if an interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to Section 6.5.3, "Wake Up from Stop or Wait Mode" for details. Stop Mode In stop mode, the XINT module is frozen. It is however capable of either waking up the CPU if an interrupt occurs or waking up the XGATE if an XGATE request occurs. Please refer to Section 6.5.3, "Wake Up from Stop or Wait Mode" for details. Freeze mode (BDM active) In freeze mode (BDM active), the interrupt vector base register is overridden internally. Please refer to Section 6.3.2.1, "Interrupt Vector Base Register (IVBR)" for details. * * MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 263 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.1.4 Block Diagram Figure 6-1 shows a block diagram of the XINT module. Peripheral Interrupt Requests Wake Up CPU Non I Bit Maskable Channels Vector Address Priority Decoder IRQ Channel IVBR New IPL Current IPL Interrupt Requests PRIOLVL2 PRIOLVL1 PRIOLVL0 RQST One Set Per Channel (Up to 108 Channels) INT_XGPRIO XGATE Requests Priority Decoder Wake up XGATE Vector ID XGATE Interrupts RQST XGATE Request Route, PRIOLVLn Priority Level = bits from the channel configuration in the associated configuration register INT_XGPRIO = XGATE Interrupt Priority IVBR = Interrupt Vector Base IPL = Interrupt Processing Level To XGATE Module Figure 6-1. XINT Block Diagram 6.2 External Signal Description The XINT module has no external signals. MC9S12XE-Family Reference Manual , Rev. 1.21 264 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 To CPU Chapter 6 Interrupt (S12XINTV2) 6.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the XINT module. 6.3.1 Module Memory Map Table 6-3 gives an overview over all XINT module registers. Table 6-3. XINT Memory Map Address 0x0120 0x0121 0x0122-0x0125 0x0126 0x0127 0x0128 0x0129 0x012A 0x012B 0x012C 0x012D 0x012E 0x012F Use RESERVED Interrupt Vector Base Register (IVBR) RESERVED XGATE Interrupt Priority Configuration Register (INT_XGPRIO) Interrupt Request Configuration Address Register (INT_CFADDR) Interrupt Request Configuration Data Register 0 (INT_CFDATA0) Interrupt Request Configuration Data Register 1 (INT_CFDATA1) Interrupt Request Configuration Data Register 2 (INT_CFDATA2 Interrupt Request Configuration Data Register 3 (INT_CFDATA3) Interrupt Request Configuration Data Register 4 (INT_CFDATA4) Interrupt Request Configuration Data Register 5 (INT_CFDATA5) Interrupt Request Configuration Data Register 6 (INT_CFDATA6) Interrupt Request Configuration Data Register 7 (INT_CFDATA7) Access -- R/W -- R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 265 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.3.2 Register Descriptions This section describes in address order all the XINT module registers and their individual bits. Address 0x0121 Register Name IVBR R W 0x0126 INT_XGPRIO R W 0x0127 INT_CFADDR R W 0x0128 INT_CFDATA0 R W 0x0129 INT_CFDATA1 R W 0x012A INT_CFDATA2 R W 0x012B INT_CFDATA3 R W 0x012C INT_CFDATA4 R W 0x012D INT_CFDATA5 R W 0x012E INT_CFDATA6 R W 0x012F INT_CFDATA7 R W RQST INT_CFADDR[7:4] 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 IVB_ADDR[7:0]7 0 0 XILVL[2:0] 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] RQST 0 0 0 0 PRIOLVL[2:0] = Unimplemented or Reserved Figure 6-2. XINT Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 266 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.3.2.1 Interrupt Vector Base Register (IVBR) Address: 0x0121 7 6 5 4 3 2 1 0 R W Reset 1 1 1 IVB_ADDR[7:0] 1 1 1 1 1 Figure 6-3. Interrupt Vector Base Register (IVBR) Read: Anytime Write: Anytime Table 6-4. IVBR Field Descriptions Field Description 7-0 Interrupt Vector Base Address Bits -- These bits represent the upper byte of all vector addresses. Out of IVB_ADDR[7:0] reset these bits are set to 0xFF (i.e., vectors are located at 0xFF10-0xFFFE) to ensure compatibility to previous S12 microcontrollers. Note: A system reset will initialize the interrupt vector base register with "0xFF" before it is used to determine the reset vector address. Therefore, changing the IVBR has no effect on the location of the three reset vectors (0xFFFA-0xFFFE). Note: If the BDM is active (i.e., the CPU is in the process of executing BDM firmware code), the contents of IVBR are ignored and the upper byte of the vector address is fixed as "0xFF". 6.3.2.2 XGATE Interrupt Priority Configuration Register (INT_XGPRIO) Address: 0x0126 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 XILVL[2:0] 0 1 = Unimplemented or Reserved Figure 6-4. XGATE Interrupt Priority Configuration Register (INT_XGPRIO) Read: Anytime Write: Anytime Table 6-5. INT_XGPRIO Field Descriptions Field 2-0 XILVL[2:0] Description XGATE Interrupt Priority Level -- The XILVL[2:0] bits configure the shared interrupt level of the XGATE interrupts coming from the XGATE module. Out of reset the priority is set to the lowest active level ("1"). Note: If the XGATE module is not available on the device, write accesses to this register are ignored and read accesses to this register will return all 0. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 267 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-6. XGATE Interrupt Priority Levels Priority XILVL2 0 low 0 0 0 1 1 1 high 1 XILVL1 0 0 1 1 0 0 1 1 XILVL0 0 1 0 1 0 1 0 1 Meaning Interrupt request is disabled Priority level 1 Priority level 2 Priority level 3 Priority level 4 Priority level 5 Priority level 6 Priority level 7 6.3.2.3 Interrupt Request Configuration Address Register (INT_CFADDR) Address: 0x0127 7 6 5 4 3 2 1 0 R W Reset 0 INT_CFADDR[7:4] 0 0 1 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 6-5. Interrupt Configuration Address Register (INT_CFADDR) Read: Anytime Write: Anytime Table 6-7. INT_CFADDR Field Descriptions Field Description 7-4 Interrupt Request Configuration Data Register Select Bits -- These bits determine which of the 128 INT_CFADDR[7:4] configuration data registers are accessible in the 8 register window at INT_CFDATA0-7. The hexadecimal value written to this register corresponds to the upper nibble of the lower byte of the address of the interrupt vector, i.e., writing 0xE0 to this register selects the configuration data register block for the 8 interrupt vector requests starting with vector at address (vector base + 0x00E0) to be accessible as INT_CFDATA0-7. Note: Writing all 0s selects non-existing configuration registers. In this case write accesses to INT_CFDATA0-7 will be ignored and read accesses will return all 0. 6.3.2.4 Interrupt Request Configuration Data Registers (INT_CFDATA0-7) The eight register window visible at addresses INT_CFDATA0-7 contains the configuration data for the block of eight interrupt requests (out of 128) selected by the interrupt configuration address register (INT_CFADDR) in ascending order. INT_CFDATA0 represents the interrupt configuration data register of the vector with the lowest address in this block, while INT_CFDATA7 represents the interrupt configuration data register of the vector with the highest address, respectively. MC9S12XE-Family Reference Manual , Rev. 1.21 268 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Address: 0x0128 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-6. Interrupt Request Configuration Data Register 0 (INT_CFDATA0) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x0129 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-7. Interrupt Request Configuration Data Register 1 (INT_CFDATA1) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012A 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-8. Interrupt Request Configuration Data Register 2 (INT_CFDATA2) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012B 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-9. Interrupt Request Configuration Data Register 3 (INT_CFDATA3) 1. Please refer to the notes following the PRIOLVL[2:0] description below. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 269 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Address: 0x012C 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-10. Interrupt Request Configuration Data Register 4 (INT_CFDATA4) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012D 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-11. Interrupt Request Configuration Data Register 5 (INT_CFDATA5) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012E 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-12. Interrupt Request Configuration Data Register 6 (INT_CFDATA6) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Address: 0x012F 7 6 5 4 3 2 1 0 R W Reset RQST 0 0 0 0 0 0 0 0 0 0 PRIOLVL[2:0] 0 1(1) = Unimplemented or Reserved Figure 6-13. Interrupt Request Configuration Data Register 7 (INT_CFDATA7) 1. Please refer to the notes following the PRIOLVL[2:0] description below. Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 270 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) Table 6-8. INT_CFDATA0-7 Field Descriptions Field 7 RQST Description XGATE Request Enable -- This bit determines if the associated interrupt request is handled by the CPU or by the XGATE module. 0 Interrupt request is handled by the CPU 1 Interrupt request is handled by the XGATE module Note: The IRQ interrupt cannot be handled by the XGATE module. For this reason, the configuration register for vector (vector base + 0x00F2) = IRQ vector address) does not contain a RQST bit. Writing a 1 to the location of the RQST bit in this register will be ignored and a read access will return 0. Note: If the XGATE module is not available on the device, writing a 1 to the location of the RQST bit in this register will be ignored and a read access will return 0. 2-0 Interrupt Request Priority Level Bits -- The PRIOLVL[2:0] bits configure the interrupt request priority level of PRIOLVL[2:0] the associated interrupt request. Out of reset all interrupt requests are enabled at the lowest active level ("1") to provide backwards compatibility with previous S12 interrupt controllers. Please also refer to Table 6-9 for available interrupt request priority levels. Note: Write accesses to configuration data registers of unused interrupt channels will be ignored and read accesses will return all 0. For information about what interrupt channels are used in a specific MCU, please refer to the Device Reference Manual of that MCU. Note: When vectors (vector base + 0x00F0-0x00FE) are selected by writing 0xF0 to INT_CFADDR, writes to INT_CFDATA2-7 (0x00F4-0x00FE) will be ignored and read accesses will return all 0s. The corresponding vectors do not have configuration data registers associated with them. Note: When vectors (vector base + 0x0010-0x001E) are selected by writing 0x10 to INT_CFADDR, writes to INT_CFDATA1-INT_CFDATA4 (0x0012-0x0018) will be ignored and read accesses will return all 0s. The corresponding vectors do not have configuration data registers associated with them. Note: Write accesses to the configuration register for the spurious interrupt vector request (vector base + 0x0010) will be ignored and read accesses will return 0x07 (request is handled by the CPU, PRIOLVL = 7). Table 6-9. Interrupt Priority Levels Priority PRIOLVL2 0 low 0 0 0 1 1 1 high 1 PRIOLVL1 0 0 1 1 0 0 1 1 PRIOLVL0 0 1 0 1 0 1 0 1 Meaning Interrupt request is disabled Priority level 1 Priority level 2 Priority level 3 Priority level 4 Priority level 5 Priority level 6 Priority level 7 6.4 Functional Description The XINT module processes all exception requests to be serviced by the CPU module. These exceptions include interrupt vector requests and reset vector requests. Each of these exception types and their overall priority level is discussed in the subsections below. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 271 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.4.1 S12X Exception Requests The CPU handles both reset requests and interrupt requests. The XINT module contains registers to configure the priority level of each I bit maskable interrupt request which can be used to implement an interrupt priority scheme. This also includes the possibility to nest interrupt requests. A priority decoder is used to evaluate the priority of a pending interrupt request. 6.4.2 Interrupt Prioritization After system reset all interrupt requests with a vector address lower than or equal to (vector base + 0x00F2) are enabled, are set up to be handled by the CPU and have a pre-configured priority level of 1. Exceptions to this rule are the non-maskable interrupt requests and the spurious interrupt vector request at (vector base + 0x0010) which cannot be disabled, are always handled by the CPU and have a fixed priority levels. A priority level of 0 effectively disables the associated I bit maskable interrupt request. If more than one interrupt request is configured to the same interrupt priority level the interrupt request with the higher vector address wins the prioritization. The following conditions must be met for an I bit maskable interrupt request to be processed. 1. The local interrupt enabled bit in the peripheral module must be set. 2. The setup in the configuration register associated with the interrupt request channel must meet the following conditions: a) The XGATE request enable bit must be 0 to have the CPU handle the interrupt request. b) The priority level must be set to non zero. c) The priority level must be greater than the current interrupt processing level in the condition code register (CCR) of the CPU (PRIOLVL[2:0] > IPL[2:0]). 3. The I bit in the condition code register (CCR) of the CPU must be cleared. 4. There is no access violation interrupt request pending. 5. There is no SYS, SWI, BDM, TRAP, or XIRQ request pending. NOTE All non I bit maskable interrupt requests always have higher priority than I bit maskable interrupt requests. If an I bit maskable interrupt request is interrupted by a non I bit maskable interrupt request, the currently active interrupt processing level (IPL) remains unaffected. It is possible to nest non I bit maskable interrupt requests, e.g., by nesting SWI or TRAP calls. 6.4.2.1 Interrupt Priority Stack The current interrupt processing level (IPL) is stored in the condition code register (CCR) of the CPU. This way the current IPL is automatically pushed to the stack by the standard interrupt stacking procedure. The new IPL is copied to the CCR from the priority level of the highest priority active interrupt request channel which is configured to be handled by the CPU. The copying takes place when the interrupt vector is fetched. The previous IPL is automatically restored by executing the RTI instruction. MC9S12XE-Family Reference Manual , Rev. 1.21 272 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.4.3 XGATE Requests If the XGATE module is implemented on the device, the XINT module is also used to process all exception requests to be serviced by the XGATE module. The overall priority level of those exceptions is discussed in the subsections below. 6.4.3.1 XGATE Request Prioritization An interrupt request channel is configured to be handled by the XGATE module, if the RQST bit of the associated configuration register is set to 1 (please refer to Section 6.3.2.4, "Interrupt Request Configuration Data Registers (INT_CFDATA0-7)"). The priority level configuration (PRIOLVL) for this channel becomes the XGATE priority which will be used to determine the highest priority XGATE request to be serviced next by the XGATE module. Additionally, XGATE interrupts may be raised by the XGATE module by setting one or more of the XGATE channel interrupt flags (by using the SIF instruction). This will result in an CPU interrupt with vector address vector base + (2 * channel ID number), where the channel ID number corresponds to the highest set channel interrupt flag, if the XGIE and channel RQST bits are set. The shared interrupt priority for the XGATE interrupt requests is taken from the XGATE interrupt priority configuration register (please refer to Section 6.3.2.2, "XGATE Interrupt Priority Configuration Register (INT_XGPRIO)"). If more than one XGATE interrupt request channel becomes active at the same time, the channel with the highest vector address wins the prioritization. 6.4.4 Priority Decoders The XINT module contains priority decoders to determine the priority for all interrupt requests pending for the respective target. There are two priority decoders, one for each interrupt request target, CPU or XGATE. The function of both priority decoders is basically the same with one exception: the priority decoder for the XGATE module does not take the current XGATE thread processing level into account. Instead, XGATE requests are handed to the XGATE module including a 1-bit priority identifier. The XGATE module uses this additional information to decide if the new request can interrupt a currently running thread. The 1-bit priority identifier corresponds to the most significant bit of the priority level configuration of the requesting channel. This means that XGATE requests with priority levels 4, 5, 6 or 7 can interrupt running XGATE threads with priority levels 1, 2 and 3. A CPU interrupt vector is not supplied until the CPU requests it. Therefore, it is possible that a higher priority interrupt request could override the original exception which caused the CPU to request the vector. In this case, the CPU will receive the highest priority vector and the system will process this exception instead of the original request. If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive after the interrupt has been recognized, but prior to the vector request), the vector address supplied to the CPU will default to that of the spurious interrupt vector. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 273 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) NOTE Care must be taken to ensure that all exception requests remain active until the system begins execution of the applicable service routine; otherwise, the exception request may not get processed at all or the result may be a spurious interrupt request (vector at address (vector base + 0x0010)). 6.4.5 Reset Exception Requests The XINT module supports three system reset exception request types (for details please refer to the Clock and Reset Generator module (CRG)): 1. Pin reset, power-on reset, low-voltage reset, or illegal address reset 2. Clock monitor reset request 3. COP watchdog reset request 6.4.6 Exception Priority The priority (from highest to lowest) and address of all exception vectors issued by the XINT module upon request by the CPU is shown in Table 6-10. Generally, all non-maskable interrupts have higher priorities than maskable interrupts. Please note that between the three software interrupts (Unimplemented op-code trap request, SWI/BGND request, SYS request) there is no real priority defined because they cannot occur simultaneously (the S12XCPU executes one instruction at a time). Table 6-10. Exception Vector Map and Priority Vector Address(1) 0xFFFE 0xFFFC 0xFFFA (Vector base + 0x00F8) (Vector base + 0x00F6) (Vector base + 0x0012) (Vector base + 0x0018) (Vector base + 0x0016) (Vector base + 0x0014) (Vector base + 0x00F4) (Vector base + 0x00F2) (Vector base + 0x00F0-0x001A) Source Pin reset, power-on reset, low-voltage reset, illegal address reset Clock monitor reset COP watchdog reset Unimplemented op-code trap Software interrupt instruction (SWI) or BDM vector request System call interrupt instruction (SYS) (reserved for future use) XGATE Access violation interrupt request(2) CPU Access violation interrupt request(3) XIRQ interrupt request IRQ interrupt request Device specific I bit maskable interrupt sources (priority determined by the associated configuration registers, in descending order) (Vector base + 0x0010) Spurious interrupt 1. 16 bits vector address based 2. only implemented if device features both a Memory Protection Unit (MPU) and an XGATE co-processor 3. only implemented if device features a Memory Protection Unit (MPU) MC9S12XE-Family Reference Manual , Rev. 1.21 274 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 6.5 6.5.1 Initialization/Application Information Initialization After system reset, software should: * Initialize the interrupt vector base register if the interrupt vector table is not located at the default location (0xFF10-0xFFF9). * Initialize the interrupt processing level configuration data registers (INT_CFADDR, INT_CFDATA0-7) for all interrupt vector requests with the desired priority levels and the request target (CPU or XGATE module). It might be a good idea to disable unused interrupt requests. * If the XGATE module is used, setup the XGATE interrupt priority register (INT_XGPRIO) and configure the XGATE module (please refer the XGATE Block Guide for details). * Enable I maskable interrupts by clearing the I bit in the CCR. * Enable the X maskable interrupt by clearing the X bit in the CCR (if required). 6.5.2 Interrupt Nesting The interrupt request priority level scheme makes it possible to implement priority based interrupt request nesting for the I bit maskable interrupt requests handled by the CPU. * I bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority, so that there can be up to seven nested I bit maskable interrupt requests at a time (refer to Figure 614 for an example using up to three nested interrupt requests). I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the I bit in the CCR (CLI). After clearing the I bit, I bit maskable interrupt requests with higher priority can interrupt the current ISR. An ISR of an interruptible I bit maskable interrupt request could basically look like this: * Service interrupt, e.g., clear interrupt flags, copy data, etc. * Clear I bit in the CCR by executing the instruction CLI (thus allowing interrupt requests with higher priority) * Process data * Return from interrupt by executing the instruction RTI MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 275 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 6 Interrupt (S12XINTV2) 0 Stacked IPL 0 4 0 0 0 IPL in CCR 7 6 5 4 Processing Levels 3 2 1 0 0 4 7 4 3 1 0 L7 RTI RTI L3 (Pending) L4 L1 (Pending) Reset RTI RTI Figure 6-14. Interrupt Processing Example 6.5.3 6.5.3.1 Wake Up from Stop or Wait Mode CPU Wake Up from Stop or Wait Mode Every I bit maskable interrupt request which is configured to be handled by the CPU is capable of waking the MCU from stop or wait mode. To determine whether an I bit maskable interrupts is qualified to wake up the CPU or not, the same settings as in normal run mode are applied during stop or wait mode: * If the I bit in the CCR is set, all I bit maskable interrupts are masked from waking up the MCU. * An I bit maskable interrupt is ignored if it is configured to a priority level below or equal to the current IPL in CCR. * I bit maskable interrupt requests which are configured to be handled by the XGATE module are not capable of waking up the CPU. The X bit maskable interrupt request can wake up the MCU from stop or wait mode at anytime, even if the X bit in CCR is set. If the X bit maskable interrupt request is used to wake-up the MCU with the X bit in the CCR set, the associated ISR is not called. The CPU then resumes program execution with the instruction following the WAI or STOP instruction. This features works following the same rules like any interrupt request, i.e. care must be taken that the X interrupt request used for wake-up remains active at least until the system begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not occur. 6.5.3.2 XGATE Wake Up from Stop or Wait Mode Interrupt request channels which are configured to be handled by the XGATE module are capable of waking up the XGATE module. Interrupt request channels handled by the XGATE module do not affect the state of the CPU. MC9S12XE-Family Reference Manual , Rev. 1.21 276 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-1. Revision History Revision Number V02.00 V02.01 Revision Date 07 Mar 2006 14 May 2008 Sections Affected Description of Changes - First version of S12XBDMV2 - Introduced standardized Revision History Table 7.1 Introduction This section describes the functionality of the background debug module (BDM) sub-block of the HCS12X core platform. The background debug module (BDM) sub-block is a single-wire, background debug system implemented in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD pin. The BDM has enhanced capability for maintaining synchronization between the target and host while allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate and a handshake signal to indicate when an operation is complete. The system is backwards compatible to the BDM of the S12 family with the following exceptions: * TAGGO command no longer supported by BDM * External instruction tagging feature now part of DBG module * BDM register map and register content extended/modified * Global page access functionality * Enabled but not active out of reset in emulation modes (if modes available) * CLKSW bit set out of reset in emulation modes (if modes available). * Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices is 0xC1) 7.1.1 Features The BDM includes these distinctive features: * Single-wire communication with host development system * Enhanced capability for allowing more flexibility in clock rates * SYNC command to determine communication rate * GO_UNTIL command * Hardware handshake protocol to increase the performance of the serial communication MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 277 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) * * * * * * * * * * * * Active out of reset in special single chip mode Nine hardware commands using free cycles, if available, for minimal CPU intervention Hardware commands not requiring active BDM 14 firmware commands execute from the standard BDM firmware lookup table Software control of BDM operation during wait mode Software selectable clocks Global page access functionality Enabled but not active out of reset in emulation modes (if modes available) CLKSW bit set out of reset in emulation modes (if modes available). When secured, hardware commands are allowed to access the register space in special single chip mode, if the non-volatile memory erase test fail. Family ID readable from firmware ROM at global address 0x7FFF0F (value for HCS12X devices is 0xC1) BDM hardware commands are operational until system stop mode is entered (all bus masters are in stop mode) 7.1.2 Modes of Operation BDM is available in all operating modes but must be enabled before firmware commands are executed. Some systems may have a control bit that allows suspending thefunction during background debug mode. 7.1.2.1 Regular Run Modes All of these operations refer to the part in run mode and not being secured. The BDM does not provide controls to conserve power during run mode. * Normal modes General operation of the BDM is available and operates the same in all normal modes. * Special single chip mode In special single chip mode, background operation is enabled and active out of reset. This allows programming a system with blank memory. * Emulation modes (if modes available) In emulation mode, background operation is enabled but not active out of reset. This allows debugging and programming a system in this mode more easily. 7.1.2.2 Secure Mode Operation If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode operation. Secure operation prevents BDM and CPU accesses to non-volatile memory (Flash and/or EEPROM) other than allowing erasure. For more information please see Section 7.4.1, "Security". MC9S12XE-Family Reference Manual , Rev. 1.21 278 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.1.2.3 Low-Power Modes The BDM can be used until all bus masters (e.g., CPU or XGATE or others depending on which masters are available on the SOC) are in stop mode. When CPU is in a low power mode (wait or stop mode) all BDM firmware commands as well as the hardware BACKGROUND command can not be used respectively are ignored. In this case the CPU can not enter BDM active mode, and only hardware read and write commands are available. Also the CPU can not enter a low power mode during BDM active mode. If all bus masters are in stop mode, the BDM clocks are stopped as well. When BDM clocks are disabled and one of the bus masters exits from stop mode the BDM clocks will restart and BDM will have a soft reset (clearing the instruction register, any command in progress and disable the ACK function). The BDM is now ready to receive a new command. 7.1.3 Block Diagram A block diagram of the BDM is shown in Figure 7-1. Host System BKGD Serial Interface Data Control Register Block Address TRACE BDMACT Instruction Code and Execution Bus Interface and Control Logic Data Control Clocks 16-Bit Shift Register ENBDM SDV Standard BDM Firmware LOOKUP TABLE Secured BDM Firmware LOOKUP TABLE UNSEC CLKSW BDMSTS Register Figure 7-1. BDM Block Diagram 7.2 External Signal Description A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate with the BDM system. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the background debug mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 279 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3 7.3.1 Memory Map and Register Definition Module Memory Map Table 7-2. BDM Memory Map Global Address 0x7FFF00-0x7FFF0B 0x7FFF0C-0x7FFF0E 0x7FFF0F 0x7FFF10-0x7FFFFF Module BDM registers BDM firmware ROM Family ID (part of BDM firmware ROM) BDM firmware ROM Size (Bytes) 12 3 1 240 Table 7-2 shows the BDM memory map when BDM is active. 7.3.2 Register Descriptions A summary of the registers associated with the BDM is shown in Figure 7-2. Registers are accessed by host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands. Global Address 0x7FFF00 Register Name Reserved R W 0x7FFF01 BDMSTS R W 0x7FFF02 Reserved R W 0x7FFF03 Reserved R W 0x7FFF04 Reserved R W 0x7FFF05 Reserved R W 0x7FFF06 BDMCCRL R W CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 X X X X X X X X X X X X X X X X X X X X X X X X ENBDM X BDMACT 0 SDV TRACE CLKSW X UNSEC 0 Bit 7 X 6 X 5 X 4 X 3 X 2 X 1 0 Bit 0 0 X X X X X X = Unimplemented, Reserved X = Indeterminate 0 = Implemented (do not alter) = Always read zero Figure 7-2. BDM Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 280 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Global Address 0x7FFF07 Register Name BDMCCRH R W Bit 7 0 6 0 5 0 4 0 3 0 2 CCR10 1 CCR9 Bit 0 CCR8 0x7FFF08 BDMGPR R W BGAE 0 BGP6 0 BGP5 0 BGP4 0 BGP3 0 BGP2 0 BGP1 0 BGP0 0 0x7FFF09 Reserved R W 0x7FFF0A Reserved R W 0 0 0 0 0 0 0 0 0x7FFF0B Reserved R W 0 0 0 0 0 0 0 0 = Unimplemented, Reserved X = Indeterminate 0 = Implemented (do not alter) = Always read zero Figure 7-2. BDM Register Summary (continued) 7.3.2.1 BDM Status Register (BDMSTS) Register Global Address 0x7FFF01 7 6 5 4 3 2 1 0 R W Reset Special Single-Chip Mode Emulation Modes (if modes available) ENBDM BDMACT 0 SDV TRACE CLKSW UNSEC 0 0(1) 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1(2) 0 0(3) 0 0 0 0 0 All Other Modes = Unimplemented, Reserved = Implemented (do not alter) 0 = Always read zero 1. ENBDM is read as 1 by a debugging environment in special single chip mode when the device is not secured or secured but fully erased (non-volatile memory). This is because the ENBDM bit is set by the standard firmware before a BDM command can be fully transmitted and executed. 2. CLKSW is read as 1 by a debugging environment in emulation modes when the device is not secured and read as 0 when secured if emulation modes available. 3. UNSEC is read as 1 by a debugging environment in special single chip mode when the device is secured and fully erased, else it is 0 and can only be read if not secure (see also bit description). Figure 7-3. BDM Status Register (BDMSTS) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 281 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured, but subject to the following: -- ENBDM should only be set via a BDM hardware command if the BDM firmware commands are needed. (This does not apply in special single chip and emulation modes). -- BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the standard BDM firmware lookup table upon exit from BDM active mode. -- CLKSW can only be written via BDM hardware WRITE_BD commands. -- All other bits, while writable via BDM hardware or standard BDM firmware write commands, should only be altered by the BDM hardware or standard firmware lookup table as part of BDM command execution. Table 7-3. BDMSTS Field Descriptions Field 7 ENBDM Description Enable BDM -- This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM hardware commands are still allowed. 0 BDM disabled 1 BDM enabled Note: ENBDM is set by the firmware out of reset in special single chip mode. In emulation modes (if modes available) the ENBDM bit is set by BDM hardware out of reset. In special single chip mode with the device secured, this bit will not be set by the firmware until after the non-volatile memory erase verify tests are complete. In emulation modes (if modes available) with the device secured, the BDM operations are blocked. BDM Active Status -- This bit becomes set upon entering BDM. The standard BDM firmware lookup table is then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from the map. 0 BDM not active 1 BDM active Shift Data Valid -- This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as part of a firmware or hardware read command or after data has been received as part of a firmware or hardware write command. It is cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM firmware to control program flow execution. 0 Data phase of command not complete 1 Data phase of command is complete TRACE1 BDM Firmware Command is Being Executed -- This bit gets set when a BDM TRACE1 firmware command is first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands: GO or GO_UNTIL. 0 TRACE1 command is not being executed 1 TRACE1 command is being executed 6 BDMACT 4 SDV 3 TRACE MC9S12XE-Family Reference Manual , Rev. 1.21 282 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-3. BDMSTS Field Descriptions (continued) Field 2 CLKSW Description Clock Switch -- The CLKSW bit controls which clock the BDM operates with. It is only writable from a hardware BDM command. A minimum delay of 150 cycles at the clock speed that is active during the data portion of the command send to change the clock source should occur before the next command can be send. The delay should be obtained no matter which bit is modified to effectively change the clock source (either PLLSEL bit or CLKSW bit). This guarantees that the start of the next BDM command uses the new clock for timing subsequent BDM communications. Table 7-4 shows the resulting BDM clock source based on the CLKSW and the PLLSEL (PLL select in the CRG module, the bit is part of the CLKSEL register) bits. Note: The BDM alternate clock source can only be selected when CLKSW = 0 and PLLSEL = 1. The BDM serial interface is now fully synchronized to the alternate clock source, when enabled. This eliminates frequency restriction on the alternate clock which was required on previous versions. Refer to the device specification to determine which clock connects to the alternate clock source input. Note: If the acknowledge function is turned on, changing the CLKSW bit will cause the ACK to be at the new rate for the write command which changes it. Note: In emulation modes (if modes available), the CLKSW bit will be set out of RESET. Unsecure -- If the device is secured this bit is only writable in special single chip mode from the BDM secure firmware. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled and put into the memory map overlapping the standard BDM firmware lookup table. The secure BDM firmware lookup table verifies that the non-volatile memories (e.g. on-chip EEPROM and/or Flash EEPROM) are erased. This being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware lookup table and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will not be asserted. 0 System is in a secured mode. 1 System is in a unsecured mode. Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip Flash EEPROM. Note that if the user does not change the state of the bits to "unsecured" mode, the system will be secured again when it is next taken out of reset.After reset this bit has no meaning or effect when the security byte in the Flash EEPROM is configured for unsecure mode. 1 UNSEC Table 7-4. BDM Clock Sources PLLSEL 0 0 1 1 CLKSW 0 1 0 1 Bus clock dependent on oscillator Bus clock dependent on oscillator Alternate clock (refer to the device specification to determine the alternate clock source) Bus clock dependent on the PLL BDMCLK MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 283 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3.2.2 BDM CCR LOW Holding Register (BDMCCRL) Register Global Address 0x7FFF06 7 6 5 4 3 2 1 0 R W Reset Special Single-Chip Mode All Other Modes CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0 1 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 Figure 7-4. BDM CCR LOW Holding Register (BDMCCRL) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured NOTE When BDM is made active, the CPU stores the content of its CCRL register in the BDMCCRL register. However, out of special single-chip reset, the BDMCCRL is set to 0xD8 and not 0xD0 which is the reset value of the CCRL register in this CPU mode. Out of reset in all other modes the BDMCCRL register is read zero. When entering background debug mode, the BDM CCR LOW holding register is used to save the low byte of the condition code register of the user's program. It is also used for temporary storage in the standard BDM firmware mode. The BDM CCR LOW holding register can be written to modify the CCR value. 7.3.2.3 BDM CCR HIGH Holding Register (BDMCCRH) Register Global Address 0x7FFF07 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 CCR10 0 CCR9 0 CCR8 0 = Unimplemented or Reserved Figure 7-5. BDM CCR HIGH Holding Register (BDMCCRH) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured When entering background debug mode, the BDM CCR HIGH holding register is used to save the high byte of the condition code register of the user's program. The BDM CCR HIGH holding register can be written to modify the CCR value. MC9S12XE-Family Reference Manual , Rev. 1.21 284 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.3.2.4 BDM Global Page Index Register (BDMGPR) Register Global Address 0x7FFF08 7 R W Reset BGAE 0 6 BGP6 0 5 BGP5 0 4 BGP4 0 3 BGP3 0 2 BGP2 0 1 BGP1 0 0 BGP0 0 Figure 7-6. BDM Global Page Register (BDMGPR) Read: All modes through BDM operation when not secured Write: All modes through BDM operation when not secured Table 7-5. BDMGPR Field Descriptions Field 7 BGAE Description BDM Global Page Access Enable Bit -- BGAE enables global page access for BDM hardware and firmware read/write instructions The BDM hardware commands used to access the BDM registers (READ_BD_ and WRITE_BD_) can not be used for global accesses even if the BGAE bit is set. 0 BDM Global Access disabled 1 BDM Global Access enabled BDM Global Page Index Bits 6-0 -- These bits define the extended address bits from 22 to 16. For more detailed information regarding the global page window scheme, please refer to the S12X_MMC Block Guide. 6-0 BGP[6:0] 7.3.3 Family ID Assignment The family ID is a 8-bit value located in the firmware ROM (at global address: 0x7FFF0F). The read-only value is a unique family ID which is 0xC1 for S12X devices. 7.4 Functional Description The BDM receives and executes commands from a host via a single wire serial interface. There are two types of BDM commands: hardware and firmware commands. Hardware commands are used to read and write target system memory locations and to enter active background debug mode, see Section 7.4.3, "BDM Hardware Commands". Target system memory includes all memory that is accessible by the CPU. Firmware commands are used to read and write CPU resources and to exit from active background debug mode, see Section 7.4.4, "Standard BDM Firmware Commands". The CPU resources referred to are the accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC). Hardware commands can be executed at any time and in any mode excluding a few exceptions as highlighted (see Section 7.4.3, "BDM Hardware Commands") and in secure mode (see Section 7.4.1, "Security"). Firmware commands can only be executed when the system is not secure and is in active background debug mode (BDM). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 285 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.4.1 Security If the user resets into special single chip mode with the system secured, a secured mode BDM firmware lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table. The secure BDM firmware verifies that the on-chip non-volatile memory (e.g. EEPROM and Flash EEPROM) is erased. This being the case, the UNSEC and ENBDM bit will get set. The BDM program jumps to the start of the standard BDM firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the non-volatile memory does not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled, but does not enable the firmware commands. This allows the BDM hardware to be used to erase the non-volatile memory. BDM operation is not possible in any other mode than special single chip mode when the device is secured. The device can be unsecured via BDM serial interface in special single chip mode only. For more information regarding security, please see the S12X_9SEC Block Guide. 7.4.2 Enabling and Activating BDM The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS) register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire interface, using a hardware command such as WRITE_BD_BYTE. After being enabled, BDM is activated by one of the following1: * Hardware BACKGROUND command * CPU BGND instruction * External instruction tagging mechanism2 * Breakpoint force or tag mechanism2 When BDM is activated, the CPU finishes executing the current instruction and then begins executing the firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type of breakpoint used determines if BDM becomes active before or after execution of the next instruction. NOTE If an attempt is made to activate BDM before being enabled, the CPU resumes normal instruction execution after a brief delay. If BDM is not enabled, any hardware BACKGROUND commands issued are ignored by the BDM and the CPU is not delayed. In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses 0x7FFF00 to 0x7FFFFF. BDM registers are mapped to addresses 0x7FFF00 to 0x7FFF0B. The BDM uses these registers which are readable anytime by the BDM. However, these registers are not readable by user programs. 1. BDM is enabled and active immediately out of special single-chip reset. 2. This method is provided by the S12X_DBG module. MC9S12XE-Family Reference Manual , Rev. 1.21 286 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 7.4.3 BDM Hardware Commands Hardware commands are used to read and write target system memory locations and to enter active background debug mode. Target system memory includes all memory that is accessible by the CPU on the SOC which can be on-chip RAM, non-volatile memory (e.g. EEPROM, Flash EEPROM), I/O and control registers, and all external memory. Hardware commands are executed with minimal or no CPU intervention and do not require the system to be in active BDM for execution, although, they can still be executed in this mode. When executing a hardware command, the BDM sub-block waits for a free bus cycle so that the background access does not disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the operation does not intrude on normal CPU operation provided that it can be completed in a single cycle. However, if an operation requires multiple cycles the CPU is frozen until the operation is complete, even though the BDM found a free cycle. The BDM hardware commands are listed in Table 7-6. The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations are not normally in the system memory map but share addresses with the application in memory. To distinguish between physical memory locations that share the same address, BDM memory resources are enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM locations unobtrusively, even if the addresses conflict with the application memory map. Table 7-6. Hardware Commands Command BACKGROUND ACK_ENABLE ACK_DISABLE READ_BD_BYTE READ_BD_WORD READ_BYTE READ_WORD WRITE_BD_BYTE WRITE_BD_WORD WRITE_BYTE Opcode (hex) 90 D5 D6 E4 EC E0 E8 C4 CC C0 Data None None None Description Enter background mode if firmware is enabled. If enabled, an ACK will be issued when the part enters active background mode. Enable Handshake. Issues an ACK pulse after the command is executed. Disable Handshake. This command does not issue an ACK pulse. 16-bit address Read from memory with standard BDM firmware lookup table in map. 16-bit data out Odd address data on low byte; even address data on high byte. 16-bit address Read from memory with standard BDM firmware lookup table in map. 16-bit data out Must be aligned access. 16-bit address Read from memory with standard BDM firmware lookup table out of map. 16-bit data out Odd address data on low byte; even address data on high byte. 16-bit address Read from memory with standard BDM firmware lookup table out of map. 16-bit data out Must be aligned access. 16-bit address Write to memory with standard BDM firmware lookup table in map. 16-bit data in Odd address data on low byte; even address data on high byte. 16-bit address Write to memory with standard BDM firmware lookup table in map. 16-bit data in Must be aligned access. 16-bit address Write to memory with standard BDM firmware lookup table out of map. 16-bit data in Odd address data on low byte; even address data on high byte. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 287 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-6. Hardware Commands (continued) Command WRITE_WORD Opcode (hex) C8 Data Description 16-bit address Write to memory with standard BDM firmware lookup table out of map. 16-bit data in Must be aligned access. NOTE: If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands. 7.4.4 Standard BDM Firmware Commands Firmware commands are used to access and manipulate CPU resources. The system must be in active BDM to execute standard BDM firmware commands, see Section 7.4.2, "Enabling and Activating BDM". Normal instruction execution is suspended while the CPU executes the firmware located in the standard BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM. As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become visible in the on-chip memory map at 0x7FFF00-0x7FFFFF, and the CPU begins executing the standard BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are received. The firmware commands are shown in Table 7-7. MC9S12XE-Family Reference Manual , Rev. 1.21 288 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Table 7-7. Firmware Commands Command(1) READ_NEXT(2) READ_PC READ_D READ_X READ_Y READ_SP WRITE_NEXT WRITE_PC WRITE_D WRITE_X WRITE_Y WRITE_SP GO GO_UNTIL(3) TRACE1 TAGGO -> GO Opcode (hex) 62 63 64 65 66 67 42 43 44 45 46 47 08 0C 10 18 Data Description 16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to. 16-bit data out Read program counter. 16-bit data out Read D accumulator. 16-bit data out Read X index register. 16-bit data out Read Y index register. 16-bit data out Read stack pointer. 16-bit data in 16-bit data in 16-bit data in 16-bit data in 16-bit data in 16-bit data in none none none none Increment X index register by 2 (X = X + 2), then write word to location pointed to by X. Write program counter. Write D accumulator. Write X index register. Write Y index register. Write stack pointer. Go to user program. If enabled, ACK will occur when leaving active background mode. Go to user program. If enabled, ACK will occur upon returning to active background mode. Execute one user instruction then return to active BDM. If enabled, ACK will occur upon returning to active background mode. (Previous enable tagging and go to user program.) This command will be deprecated and should not be used anymore. Opcode will be executed as a GO command. 1. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is complete for all BDM WRITE commands. 2. When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space the BDM resources are accessed rather than user code. Writing BDM firmware is not possible. 3. System stop disables the ACK function and ignored commands will not have an ACK-pulse (e.g., CPU in stop or wait mode). The GO_UNTIL command will not get an Acknowledge if CPU executes the wait or stop instruction before the "UNTIL" condition (BDM active again) is reached (see Section 7.4.7, "Serial Interface Hardware Handshake Protocol" last Note). 7.4.5 BDM Command Structure Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a 16-bit data word depending on the command. All the read commands return 16 bits of data despite the byte or word implication in the command name. 8-bit reads return 16-bits of data, of which, only one byte will contain valid data. If reading an even address, the valid data will appear in the MSB. If reading an odd address, the valid data will appear in the LSB. 16-bit misaligned reads and writes are generally not allowed. If attempted by BDM hardware command, the BDM will ignore the least significant bit of the address and will assume an even address from the remaining bits. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 289 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) For devices with external bus: The following cycle count information is only valid when the external wait function is not used (see wait bit of EBI sub-block). During an external wait the BDM can not steal a cycle. Hence be careful with the external wait function if the BDM serial interface is much faster than the bus, because of the BDM soft-reset after time-out (see Section 7.4.11, "Serial Communication Time Out"). For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending the address before attempting to obtain the read data. This is to be certain that valid data is available in the BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait 150 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a free cycle before stealing a cycle. For firmware read commands, the external host should wait at least 48 bus clock cycles after sending the command opcode and before attempting to obtain the read data. This includes the potential of extra cycles when the access is external and stretched (+1 to maximum +7 cycles) or to registers of the PRU (port replacement unit) in emulation modes (if modes available). The 48 cycle wait allows enough time for the requested data to be made available in the BDM shift register, ready to be shifted out. NOTE This timing has increased from previous BDM modules due to the new capability in which the BDM serial interface can potentially run faster than the bus. On previous BDM modules this extra time could be hidden within the serial time. For firmware write commands, the external host must wait 36 bus clock cycles after sending the data to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register before the write has been completed. The external host should wait at least for 76 bus clock cycles after a TRACE1 or GO command before starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup table and resume execution of the user code. Disturbing the BDM shift register prematurely may adversely affect the exit from the standard BDM firmware lookup table. NOTE If the bus rate of the target processor is unknown or could be changing or the external wait function is used, it is recommended that the ACK (acknowledge function) is used to indicate when an operation is complete. When using ACK, the delay times are automated. Figure 7-7 represents the BDM command structure. The command blocks illustrate a series of eight bit times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles in the high state. The time for an 8-bit command is 8 x 16 target clock cycles.1 1. Target clock cycles are cycles measured using the target MCU's serial clock rate. See Section 7.4.6, "BDM Serial Interface" and Section 7.3.2.1, "BDM Status Register (BDMSTS)" for information on how serial clock rate is selected. MC9S12XE-Family Reference Manual , Rev. 1.21 290 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) 8 Bits AT ~16 TC/Bit Hardware Read Command 16 Bits AT ~16 TC/Bit Address 150-BC Delay 16 Bits AT ~16 TC/Bit Data 150-BC Delay Next Command Hardware Write Command 48-BC DELAY Address Data Next Command Firmware Read Command Data 36-BC DELAY Next Command Firmware Write Command 76-BC Delay Data Next Command GO, TRACE Command Next Command BC = Bus Clock Cycles TC = Target Clock Cycles Figure 7-7. BDM Command Structure 7.4.6 BDM Serial Interface The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode select input which selects between normal and special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the BDM. The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see Section 7.3.2.1, "BDM Status Register (BDMSTS)". This clock will be referred to as the target clock in the following explanation. The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per bit. The interface times out if 512 clock cycles occur between falling edges from the host. The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host for transmit cases and the target for receive cases. The timing for host-to-target is shown in Figure 7-8 and that of target-to-host in Figure 7-9 and Figure 7-10. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since the host and target are operating from separate clocks, it can take the target system up to one full clock cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 291 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) earlier. Synchronization between the host and target is established in this manner at the start of every bit time. Figure 7-8 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1 transmission. Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven signals. BDM Clock (Target MCU) Host Transmit 1 Host Transmit 0 Perceived Start of Bit Time 10 Cycles Synchronization Uncertainty Target Senses Bit Earliest Start of Next Bit Figure 7-8. BDM Host-to-Target Serial Bit Timing The receive cases are more complicated. Figure 7-9 shows the host receiving a logic 1 from the target system. Since the host is asynchronous to the target, there is up to one clock-cycle delay from the hostgenerated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it started the bit time. MC9S12XE-Family Reference Manual , Rev. 1.21 292 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) BDM Clock (Target MCU) Host Drive to BKGD Pin Target System Speedup Pulse Perceived Start of Bit Time R-C Rise BKGD Pin High-Impedance High-Impedance High-Impedance 10 Cycles 10 Cycles Host Samples BKGD Pin Earliest Start of Next Bit Figure 7-9. BDM Target-to-Host Serial Bit Timing (Logic 1) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 293 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Figure 7-10 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Since the target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting the bit time. BDM Clock (Target MCU) Host Drive to BKGD Pin Target System Drive and Speedup Pulse Perceived Start of Bit Time BKGD Pin 10 Cycles 10 Cycles Host Samples BKGD Pin Earliest Start of Next Bit High-Impedance Speedup Pulse Figure 7-10. BDM Target-to-Host Serial Bit Timing (Logic 0) 7.4.7 Serial Interface Hardware Handshake Protocol BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM clock source can be asynchronously related to the bus frequency, when CLKSW = 0, it is very helpful to provide a handshake protocol in which the host could determine when an issued command is executed by the CPU. The alternative is to always wait the amount of time equal to the appropriate number of cycles at the slowest possible rate the clock could be running. This sub-section will describe the hardware handshake protocol. The hardware handshake protocol signals to the host controller when an issued command was successfully executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued by the host, has been successfully executed (see Figure 7-11). This pulse is referred to as the ACK pulse. After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read command, or start a new command if the last command was a write command or a control command (BACKGROUND, GO, GO_UNTIL or TRACE1). The ACK pulse is not issued earlier than 32 serial clock cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also that, there is no upper limit for the delay between the command and the related ACK pulse, since the command execution depends upon the CPU bus frequency, which in some cases could be very slow MC9S12XE-Family Reference Manual , Rev. 1.21 294 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) compared to the serial communication rate. This protocol allows a great flexibility for the POD designers, since it does not rely on any accurate time measurement or short response time to any event in the serial communication. BDM Clock (Target MCU) 16 Cycles Target Transmits ACK Pulse High-Impedance 32 Cycles Speedup Pulse Minimum Delay From the BDM Command BKGD Pin Earliest Start of Next Bit High-Impedance 16th Tick of the Last Command Bit Figure 7-11. Target Acknowledge Pulse (ACK) NOTE If the ACK pulse was issued by the target, the host assumes the previous command was executed. If the CPU enters wait or stop prior to executing a hardware command, the ACK pulse will not be issued meaning that the BDM command was not executed. After entering wait or stop mode, the BDM command is no longer pending. Figure 7-12 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed (free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved. After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form of a word and the host needs to determine which is the appropriate byte based on whether the address was odd or even. Target BKGD Pin READ_BYTE Host Byte Address Target Host New BDM Command Host BDM Issues the ACK Pulse (out of scale) BDM Executes the READ_BYTE Command Target (2) Bytes are Retrieved BDM Decodes the Command Figure 7-12. Handshake Protocol at Command Level MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 295 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK handshake pulse is initiated by the target MCU by issuing a negative edge in the BKGD pin. The hardware handshake protocol in Figure 7-11 specifies the timing when the BKGD pin is being driven, so the host should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin. NOTE The only place the BKGD pin can have an electrical conflict is when one side is driving low and the other side is issuing a speedup pulse (high). Other "highs" are pulled rather than driven. However, at low rates the time of the speedup pulse can become lengthy and so the potential conflict time becomes longer as well. The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to issue a new BDM command. When the CPU enters wait or stop while the host issues a hardware command (e.g., WRITE_BYTE), the target discards the incoming command due to the wait or stop being detected. Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be issued in this case. After a certain time the host (not aware of stop or wait) should decide to abort any possible pending ACK pulse in order to be sure a new command can be issued. Therefore, the protocol provides a mechanism in which a command, and its corresponding ACK, can be aborted. NOTE The ACK pulse does not provide a time out. This means for the GO_UNTIL command that it can not be distinguished if a stop or wait has been executed (command discarded and ACK not issued) or if the "UNTIL" condition (BDM active) is just not reached yet. Hence in any case where the ACK pulse of a command is not issued the possible pending command should be aborted before issuing a new command. See the handshake abort procedure described in Section 7.4.8, "Hardware Handshake Abort Procedure". 7.4.8 Hardware Handshake Abort Procedure The abort procedure is based on the SYNC command. In order to abort a command, which had not issued the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol, see Section 7.4.9, "SYNC -- Request Timed Reference Pulse", and assumes that the pending command and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been completed the host is free to issue new BDM commands. For Firmware READ or WRITE commands it can not be guaranteed that the pending command is aborted when issuing a SYNC before the corresponding ACK pulse. There is a short latency time from the time the READ or WRITE access begins until it is finished and the corresponding ACK pulse is issued. The latency time depends on the firmware READ or WRITE command that is issued and if the serial interface is running on a different clock rate than the bus. When the SYNC command starts during this latency time the READ or WRITE command will not be aborted, but the corresponding ACK pulse will be aborted. A pending GO, TRACE1 or MC9S12XE-Family Reference Manual , Rev. 1.21 296 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) GO_UNTIL command can not be aborted. Only the corresponding ACK pulse can be aborted by the SYNC command. Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command. The ACK is actually aborted when a negative edge is perceived by the target in the BKGD pin. The short abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the negative edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending command will be aborted along with the ACK pulse. The potential problem with this abort procedure is when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not perceive the abort pulse. The worst case is when the pending command is a read command (i.e., READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new command after the abort pulse was issued, while the target expects the host to retrieve the accessed memory byte. In this case, host and target will run out of synchronism. However, if the command to be aborted is not a read command the short abort pulse could be used. After a command is aborted the target assumes the next negative edge, after the abort pulse, is the first bit of a new BDM command. NOTE The details about the short abort pulse are being provided only as a reference for the reader to better understand the BDM internal behavior. It is not recommended that this procedure be used in a real application. Since the host knows the target serial clock frequency, the SYNC command (used to abort a command) does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to assure the SYNC pulse will not be misinterpreted by the target. See Section 7.4.9, "SYNC -- Request Timed Reference Pulse". Figure 7-13 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE command. Note that, after the command is aborted a new command could be issued by the host computer. READ_BYTE CMD is Aborted by the SYNC Request (Out of Scale) BKGD Pin READ_BYTE Host Memory Address Target SYNC Response From the Target (Out of Scale) READ_STATUS Host Target New BDM Command Host Target BDM Decode and Starts to Execute the READ_BYTE Command New BDM Command Figure 7-13. ACK Abort Procedure at the Command Level NOTE Figure 7-13 does not represent the signals in a true timing scale Figure 7-14 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 297 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Since this is not a probable situation, the protocol does not prevent this conflict from happening. At Least 128 Cycles BDM Clock (Target MCU) ACK Pulse Target MCU Drives to BKGD Pin Host Drives SYNC To BKGD Pin Host and Target Drive to BKGD Pin Host SYNC Request Pulse BKGD Pin 16 Cycles High-Impedance Electrical Conflict Speedup Pulse Figure 7-14. ACK Pulse and SYNC Request Conflict NOTE This information is being provided so that the MCU integrator will be aware that such a conflict could eventually occur. The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE BDM commands. This provides backwards compatibility with the existing POD devices which are not able to execute the hardware handshake protocol. It also allows for new POD devices, that support the hardware handshake protocol, to freely communicate with the target device. If desired, without the need for waiting for the ACK pulse. The commands are described as follows: * ACK_ENABLE -- enables the hardware handshake protocol. The target will issue the ACK pulse when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the ACK pulse as a response. * ACK_DISABLE -- disables the ACK pulse protocol. In this case, the host needs to use the worst case delay time at the appropriate places in the protocol. The default state of the BDM after reset is hardware handshake protocol disabled. All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See Section 7.4.3, "BDM Hardware Commands" and Section 7.4.4, "Standard BDM Firmware Commands" for more information on the BDM commands. MC9S12XE-Family Reference Manual , Rev. 1.21 298 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is issued in response to this command, the host knows that the target supports the hardware handshake protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a valid command. The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse related to this command could be aborted using the SYNC command. The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this case, is issued when the CPU enters into background mode. This command is an alternative to the GO command and should be used when the host wants to trace if a breakpoint match occurs and causes the CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related to this command could be aborted using the SYNC command. The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode after one instruction of the application program is executed. The ACK pulse related to this command could be aborted using the SYNC command. 7.4.9 SYNC -- Request Timed Reference Pulse The SYNC command is unlike other BDM commands because the host does not necessarily know the correct communication speed to use for BDM communications until after it has analyzed the response to the SYNC command. To issue a SYNC command, the host should perform the following steps: 1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication frequency (the lowest serial communication frequency is determined by the crystal oscillator or the clock chosen by CLKSW.) 2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically one cycle of the host clock.) 3. Remove all drive to the BKGD pin so it reverts to high impedance. 4. Listen to the BKGD pin for the sync response pulse. Upon detecting the SYNC request from the host, the target performs the following steps: 1. Discards any incomplete command received or bit retrieved. 2. Waits for BKGD to return to a logic one. 3. Delays 16 cycles to allow the host to stop driving the high speedup pulse. 4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency. 5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD. 6. Removes all drive to the BKGD pin so it reverts to high impedance. The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed for subsequent BDM communications. Typically, the host can determine the correct communication speed MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 299 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) within a few percent of the actual target speed and the communication protocol can easily tolerate speed errors of several percent. As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the SYNC response, the target will consider the next negative edge (issued by the host) as the start of a new BDM command or the start of new SYNC request. Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the same as in a regular SYNC command. Note that one of the possible causes for a command to not be acknowledged by the target is a host-target synchronization problem. In this case, the command may not have been understood by the target and so an ACK response pulse will not be issued. 7.4.10 Instruction Tracing When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM firmware and executes a single instruction in the user code. Once this has occurred, the CPU is forced to return to the standard BDM firmware and the BDM is active and ready to receive a new command. If the TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or tracing through the user code one instruction at a time. If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but no user instruction is executed. Once back in standard BDM firmware execution, the program counter points to the first instruction in the interrupt service routine. Be aware when tracing through the user code that the execution of the user code is done step by step but all peripherals are free running. Hence possible timing relations between CPU code execution and occurrence of events of other peripherals no longer exist. Do not trace the CPU instruction BGND used for soft breakpoints. Tracing the BGND instruction will result in a return address pointing to BDM firmware address space. When tracing through user code which contains stop or wait instructions the following will happen when the stop or wait instruction is traced: The CPU enters stop or wait mode and the TRACE1 command can not be finished before leaving the low power mode. This is the case because BDM active mode can not be entered after CPU executed the stop instruction. However all BDM hardware commands except the BACKGROUND command are operational after tracing a stop or wait instruction and still being in stop or wait mode. If system stop mode is entered (all bus masters are in stop mode) no BDM command is operational. As soon as stop or wait mode is exited the CPU enters BDM active mode and the saved PC value points to the entry of the corresponding interrupt service routine. In case the handshake feature is enabled the corresponding ACK pulse of the TRACE1 command will be discarded when tracing a stop or wait instruction. Hence there is no ACK pulse when BDM active mode is entered as part of the TRACE1 command after CPU exited from stop or wait mode. All valid commands sent during CPU being in stop or wait mode or after CPU exited from stop or wait mode will have an ACK pulse. The handshake feature becomes disabled only when system MC9S12XE-Family Reference Manual , Rev. 1.21 300 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) stop mode has been reached. Hence after a system stop mode the handshake feature must be enabled again by sending the ACK_ENABLE command. 7.4.11 Serial Communication Time Out The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any time-out limit. Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting memory or the operating mode of the MCU. This is referred to as a soft-reset. If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will occur causing the command to be disregarded. The data is not available for retrieval after the time-out has occurred. This is the expected behavior if the handshake protocol is not enabled. However, consider the behavior where the BDM is running in a frequency much greater than the CPU frequency. In this case, the command could time out before the data is ready to be retrieved. In order to allow the data to be retrieved even with a large clock frequency mismatch (between BDM and CPU) when the hardware handshake protocol is enabled, the time out between a read command and the data retrieval is disabled. Therefore, the host could wait for more then 512 serial clock cycles and still be able to retrieve the data from an issued read command. However, once the handshake pulse (ACK pulse) is issued, the time-out feature is reactivated, meaning that the target will time out after 512 clock cycles. Therefore, the host needs to retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After that period, the read command is discarded and the data is no longer available for retrieval. Any negative edge in the BKGD pin after the time-out period is considered to be a new command or a SYNC request. Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the serial communication is active. This means that if a time frame higher than 512 serial clock cycles is observed between two consecutive negative edges and the command being issued or data being retrieved is not complete, a soft-reset will occur causing the partially received command or data retrieved to be disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is considered by the target as the start of a new BDM command, or the start of a SYNC request pulse. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 301 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 7 Background Debug Module (S12XBDMV2) MC9S12XE-Family Reference Manual , Rev. 1.21 302 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-1. Revision History Revision Number V03.18 V03.19 V03.20 V03.21 V03.22 V03.23 V03.24 Revision Date Sections Affected 8.4.2.3/8-327 8.4.3.5/8-329 8.3.2.7/8-315 8.4.2.2/8-327 8.4.2.4/8-328 8.4.5.2/8-332 8.4.5.5/8-339 General 8.4.5.3/8-334 Description of Changes - Added "Data Bus Comparison NDB Dependency" section - Clarified effect TRIG has on state sequencer. - Clarified simultaneous arm and disarm effect. - Clarified reserved State Sequencer encodings. - Added single databyte comparison limitation information - Added statement about interrupt vector fetches whilst tagging. - Removed LOOP1 tracing restriction NOTE. - Added pin reset effect NOTE. - Text readability improved, typo removed. - Corrected bit name. 20 Apr 2007 24 Apr 2007 14 Apr 2007 23 Oct 2007 12 Nov 2007 13 Nov 2007 04 Jan 2008 8.1 Introduction The S12XDBG module provides an on-chip trace buffer with flexible triggering capability to allow nonintrusive debug of application software. The S12XDBG module is optimized for the S12X 16-bit architecture and allows debugging of CPU12Xand XGATE module operations. Typically the S12XDBG module is used in conjunction with the S12XBDM module, whereby the user configures the S12XDBG module for a debugging session over the BDM interface. Once configured the S12XDBG module is armed and the device leaves BDM Mode returning control to the user program, which is then monitored by the S12XDBG module. Alternatively the S12XDBG module can be configured over a serial interface using SWI routines. 8.1.1 Glossary Table 8-2. Glossary Of Terms Term COF BDM DUG Definition Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt Background Debug Mode Device User Guide, describing the features of the device into which the DBG is integrated MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 303 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-2. Glossary Of Terms (continued) Term WORD Data Line CPU Tag 16 bit data entity 64 bit data entity CPU12X module Tags can be attached to XGATE or CPU opcodes as they enter the instruction pipe. If the tagged opcode reaches the execution stage a tag hit occurs. Definition 8.1.2 Overview The comparators monitor the bus activity of the CPU12X and XGATE. When a match occurs the control logic can trigger the state sequencer to a new state. On a transition to the Final State, bus tracing is triggered and/or a breakpoint can be generated. Independent of comparator matches a transition to Final State with associated tracing and breakpoint can be triggered by the external TAGHI and TAGLO signals, or by an XGATE module S/W breakpoint request or by writing to the TRIG control bit. The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word reads. Tracing is disabled when the MCU system is secured. 8.1.3 * Features Four comparators (A, B, C, and D) -- Comparators A and C compare the full address bus and full 16-bit data bus -- Comparators A and C feature a data bus mask register -- Comparators B and D compare the full address bus only -- Each comparator can be configured to monitor CPU12X or XGATE buses -- Each comparator features selection of read or write access cycles -- Comparators B and D allow selection of byte or word access cycles -- Comparisons can be used as triggers for the state sequencer Three comparator modes -- Simple address/data comparator match mode -- Inside address range mode, Addmin Address Addmax -- Outside address range match mode, Address < Addmin or Address > Addmax Two types of triggers -- Tagged -- This triggers just before a specific instruction begins execution -- Force -- This triggers on the first instruction boundary after a match occurs. The following types of breakpoints -- CPU12X breakpoint entering BDM on breakpoint (BDM) -- CPU12X breakpoint executing SWI on breakpoint (SWI) -- XGATE breakpoint * * * MC9S12XE-Family Reference Manual , Rev. 1.21 304 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module * * * * * External CPU12X instruction tagging trigger independent of comparators XGATE S/W breakpoint request trigger independent of comparators TRIG Immediate software trigger independent of comparators Four trace modes -- Normal: change of flow (COF) PC information is stored (see Section 8.4.5.2.1) for change of flow definition. -- Loop1: same as Normal but inhibits consecutive duplicate source address entries -- Detail: address and data for all cycles except free cycles and opcode fetches are stored -- Pure PC: All program counter addresses are stored. 4-stage state sequencer for trace buffer control -- Tracing session trigger linked to Final State of state sequencer -- Begin, End, and Mid alignment of tracing to trigger 8.1.4 Modes of Operation The S12XDBG module can be used in all MCU functional modes. During BDM hardware accesses and whilst the BDM module is active, CPU12X monitoring is disabled. Thus breakpoints, comparators, and CPU12X bus tracing are disabled but XGATE bus monitoring accessing the S12XDBG registers, including comparator registers, is still possible. While in active BDM or during hardware BDM accesses, XGATE activity can still be compared, traced and can be used to generate a breakpoint to the XGATE module. When the CPU12X enters active BDM Mode through a BACKGROUND command, with the S12XDBG module armed, the S12XDBG remains armed. The S12XDBG module tracing is disabled if the MCU is secure. However, breakpoints can still be generated if the MCU is secure. Table 8-3. Mode Dependent Restriction Summary BDM Enable x 0 0 1 1 BDM Active x 0 1 0 1 MCU Secure 1 0 0 0 0 Yes XGATE only Comparator Matches Enabled Yes Yes Breakpoints Possible Yes Only SWI Yes XGATE only Tagging Possible Yes Yes Yes XGATE only Tracing Possible No Yes Yes XGATE only Active BDM not possible when not enabled MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 305 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.1.5 Block Diagram TAGS BREAKPOINT REQUESTS CPU12X & XGATE TAGHITS EXTERNAL TAGHI / TAGLO XGATE S/W BREAKPOINT REQUEST SECURE COMPARATOR A COMPARATOR B COMPARATOR C COMPARATOR D MATCH0 COMPARATOR MATCH CONTROL MATCH1 MATCH2 MATCH3 TAG & TRIGGER CONTROL LOGIC TRIGGER STATE STATE SEQUENCER STATE CPU12X BUS XGATE BUS BUS INTERFACE TRACE CONTROL TRIGGER TRACE BUFFER READ TRACE DATA (DBG READ DATA BUS) Figure 8-1. Debug Module Block Diagram 8.2 External Signal Description The S12XDBG sub-module features two external tag input signals. See Device User Guide (DUG) for the mapping of these signals to device pins. These tag pins may be used for the external tagging in emulation modes only. Table 8-4. External System Pins Associated With S12XDBG Pin Name TAGHI (See DUG) TAGLO (See DUG) TAGLO (See DUG) Pin Functions TAGHI TAGLO Unconditional Tagging Enable Description When instruction tagging is on, tags the high half of the instruction word being read into the instruction queue. When instruction tagging is on, tags the low half of the instruction word being read into the instruction queue. In emulation modes, a low assertion on this pin in the 7th or 8th cycle after the end of reset enables the Unconditional Tagging function. 8.3 8.3.1 Memory Map and Registers Module Memory Map A summary of the registers associated with the S12XDBG sub-block is shown in Table 8-2. Detailed descriptions of the registers and bits are given in the subsections that follow. MC9S12XE-Family Reference Manual , Rev. 1.21 306 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Address 0x0020 Name DBGC1 R W R W R W R W R W R W R W R W R W Bit 7 ARM TBF 6 0 TRIG EXTF 5 XGSBPE 0 4 BDM 0 3 DBGBRK 0 2 1 Bit 0 COMRV 0x0021 DBGSR SSF2 SSF1 SSF0 0x0022 DBGTCR TSOURCE 0 0 0 TRANGE 0 TRCMOD TALIGN 0x0023 DBGC2 CDCM Bit 11 Bit 10 Bit 9 ABCM Bit 8 0x0024 DBGTBH Bit 15 Bit 14 Bit 13 Bit 12 0x0025 DBGTBL Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0026 DBGCNT 0 CNT 0x0027 0x0027 0x00281 0x00282 DBGSCRX DBGMFR 0 0 0 0 0 0 0 0 SC3 MC3 SC2 MC2 SC1 MC1 SC0 MC0 DBGXCTL R (COMPA/C) W DBGXCTL R (COMPB/D) W DBGXAH R W R W R W R W R W R W 0 NDB SZ TAG TAG BRK BRK RW RW RWE RWE SRC SRC COMPE COMPE SZE 0 0x0029 Bit 22 21 20 19 18 17 Bit 16 0x002A DBGXAM Bit 15 14 13 12 11 10 9 Bit 8 0x002B DBGXAL Bit 7 6 5 4 3 2 1 Bit 0 0x002C DBGXDH Bit 15 14 13 12 11 10 9 Bit 8 0x002D DBGXDL Bit 7 6 5 4 3 2 1 Bit 0 0x002E DBGXDHM Bit 15 14 13 12 11 10 9 Bit 8 R Bit 7 6 5 4 3 2 W 1 This represents the contents if the Comparator A or C control register is blended into this address. 2 This represents the contents if the Comparator B or D control register is blended into this address 0x002F DBGXDLM 1 Bit 0 Figure 8-2. Quick Reference to S12XDBG Registers MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 307 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2 Register Descriptions This section consists of the S12XDBG control and trace buffer register descriptions in address order. Each comparator has a bank of registers that are visible through an 8-byte window between 0x0028 and 0x002F in the S12XDBG module register address map. When ARM is set in DBGC1, the only bits in the S12XDBG module registers that can be written are ARM, TRIG, and COMRV[1:0] 8.3.2.1 Debug Control Register 1 (DBGC1) Address: 0x0020 7 6 5 4 3 2 1 0 R W Reset ARM 0 0 TRIG 0 XGSBPE 0 BDM 0 0 DBGBRK 0 0 COMRV 0 Figure 8-3. Debug Control Register (DBGC1) Read: Anytime Write: Bits 7, 1, 0 anytime Bit 6 can be written anytime but always reads back as 0. Bits 5:2 anytime S12XDBG is not armed. NOTE If a write access to DBGC1 with the ARM bit position set occurs simultaneously to a hardware disarm from an internal trigger event, then the ARM bit is cleared due to the hardware disarm. NOTE When disarming the S12XDBG by clearing ARM with software, the contents of bits[5:2] are not affected by the write, since up until the write operation, ARM = 1 preventing these bits from being written. These bits must be cleared using a second write if required. Table 8-5. DBGC1 Field Descriptions Field 7 ARM Description Arm Bit -- The ARM bit controls whether the S12XDBG module is armed. This bit can be set and cleared by user software and is automatically cleared on completion of a tracing session, or if a breakpoint is generated with tracing not enabled. On setting this bit the state sequencer enters State1. 0 Debugger disarmed 1 Debugger armed Immediate Trigger Request Bit -- This bit when written to 1 requests an immediate trigger independent of comparator or external tag signal status. When tracing is complete a forced breakpoint may be generated depending upon DBGBRK and BDM bit settings. This bit always reads back a 0. Writing a 0 to this bit has no effect. If TSOURCE are clear no tracing is carried out. If tracing has already commenced using BEGIN- or MID trigger alignment, it continues until the end of the tracing session as defined by the TALIGN bit settings, thus TRIG has no affect. In secure mode tracing is disabled and writing to this bit has no effect. 0 Do not trigger until the state sequencer enters the Final State. 1 Trigger immediately . 6 TRIG MC9S12XE-Family Reference Manual , Rev. 1.21 308 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-5. DBGC1 Field Descriptions (continued) Field 5 XGSBPE Description XGATE S/W Breakpoint Enable -- The XGSBPE bit controls whether an XGATE S/W breakpoint request is passed to the CPU12X. The XGATE S/W breakpoint request is handled by the S12XDBG module, which can request an CPU12X breakpoint depending on the state of this bit. 0 XGATE S/W breakpoint request is disabled 1 XGATE S/W breakpoint request is enabled Background Debug Mode Enable -- This bit determines if an S12X breakpoint causes the system to enter Background Debug Mode (BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDM is not enabled by the ENBDM bit in the BDM module, then breakpoints default to SWI. 0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint. 1 Breakpoint to BDM, if BDM enabled. Otherwise breakpoint to SWI S12XDBG Breakpoint Enable Bits -- The DBGBRK bits control whether the debugger will request a breakpoint to either CPU12X or XGATE or both upon reaching the state sequencer Final State. If tracing is enabled, the breakpoint is generated on completion of the tracing session. If tracing is not enabled, the breakpoint is generated immediately. Please refer to Section 8.4.7 for further details. XGATE software breakpoints are independent of the DBGBRK bits. XGATE software breakpoints force a breakpoint to the CPU12X independent of the DBGBRK bit field configuration. See Table 8-6. Comparator Register Visibility Bits -- These bits determine which bank of comparator register is visible in the 8-byte window of the S12XDBG module address map, located between 0x0028 to 0x002F. Furthermore these bits determine which register is visible at the address 0x0027. See Table 8-7. 4 BDM 3-2 DBGBRK 1-0 COMRV Table 8-6. DBGBRK Encoding DBGBRK 00 01 10 11 Resource Halted by Breakpoint No breakpoint generated XGATE breakpoint generated CPU12X breakpoint generated Breakpoints generated for CPU12X and XGATE Table 8-7. COMRV Encoding COMRV 00 01 10 11 Visible Comparator Comparator A Comparator B Comparator C Comparator D Visible Register at 0x0027 DBGSCR1 DBGSCR2 DBGSCR3 DBGMFR MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 309 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.2 Debug Status Register (DBGSR) 7 6 5 4 3 2 1 0 Address: 0x0021 R W Reset POR -- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TBF EXTF 0 0 0 SSF2 SSF1 SSF0 = Unimplemented or Reserved Figure 8-4. Debug Status Register (DBGSR) Read: Anytime Write: Never Table 8-8. DBGSR Field Descriptions Field 7 TBF Description Trace Buffer Full -- The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits CNT[6:0]. The TBF bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization. Other system generated resets have no affect on this bit External Tag Hit Flag -- The EXTF bit indicates if a tag hit condition from an external TAGHI/TAGLO tag was met since arming. This bit is cleared when ARM in DBGC1 is written to a one. 0 External tag hit has not occurred 1 External tag hit has occurred State Sequencer Flag Bits -- The SSF bits indicate in which state the State Sequencer is currently in. During a debug session on each transition to a new state these bits are updated. If the debug session is ended by software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer before disarming. If a debug session is ended by an internal trigger, then the state sequencer returns to state0 and these bits are cleared to indicate that state0 was entered during the session. On arming the module the state sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See Table 8-9. 6 EXTF 2-0 SSF[2:0] Table 8-9. SSF[2:0] -- State Sequence Flag Bit Encoding SSF[2:0] 000 001 010 011 100 101,110,111 Current State State0 (disarmed) State1 State2 State3 Final State Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 310 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.3 Debug Trace Control Register (DBGTCR) 7 6 5 4 3 2 1 0 Address: 0x0022 R W Reset 0 TSOURCE 0 0 TRANGE 0 0 TRCMOD 0 0 TALIGN 0 Figure 8-5. Debug Trace Control Register (DBGTCR) Read: Anytime Write: Bits 7:6 only when S12XDBG is neither secure nor armed. Bits 5:0 anytime the module is disarmed. Table 8-10. DBGTCR Field Descriptions Field 7-6 TSOURCE 5-4 TRANGE Description Trace Source Control Bits -- The TSOURCE bits select the data source for the tracing session. If the MCU system is secured, these bits cannot be set and tracing is inhibited. See Table 8-11. Trace Range Bits -- The TRANGE bits allow filtering of trace information from a selected address range when tracing from the CPU12X in Detail Mode. The XGATE tracing range cannot be narrowed using these bits. To use a comparator for range filtering, the corresponding COMPE and SRC bits must remain cleared. If the COMPE bit is not clear then the comparator will also be used to generate state sequence triggers. If the corresponding SRC bit is set the comparator is mapped to the XGATE buses, the TRANGE bits have no effect on the valid address range, memory accesses within the whole memory map are traced. See Table 8-12. Trace Mode Bits -- See Section 8.4.5.2 for detailed Trace Mode descriptions. In Normal Mode, change of flow information is stored. In Loop1 Mode, change of flow information is stored but redundant entries into trace memory are inhibited. In Detail Mode, address and data for all memory and register accesses is stored. See Table 8-13. Trigger Align Bits -- These bits control whether the trigger is aligned to the beginning, end or the middle of a tracing session. See Table 8-14. 3-2 TRCMOD 1-0 TALIGN Table 8-11. TSOURCE -- Trace Source Bit Encoding TSOURCE 00 01 10(1) 1,(2) Tracing Source No tracing requested CPU12X XGATE Both CPU12X and XGATE 11 1. No range limitations are allowed. Thus tracing operates as if TRANGE = 00. 2. No Detail Mode tracing supported. If TRCMOD = 10, no information is stored. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 311 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-12. TRANGE Trace Range Encoding TRANGE 00 01 10 11 Tracing Range Trace from all addresses (No filter) Trace only in address range from $00000 to Comparator D Trace only in address range from Comparator C to $7FFFFF Trace only in range from Comparator C to Comparator D Table 8-13. TRCMOD Trace Mode Bit Encoding TRCMOD 00 01 10 11 Description Normal Loop1 Detail Pure PC Table 8-14. TALIGN Trace Alignment Encoding TALIGN 00 01 10 11 Description Trigger at end of stored data Trigger before storing data Trace buffer entries before and after trigger Reserved 8.3.2.4 Debug Control Register2 (DBGC2) Address: 0x0023 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 CDCM 0 0 ABCM 0 = Unimplemented or Reserved Figure 8-6. Debug Control Register2 (DBGC2) Read: Anytime Write: Anytime the module is disarmed. This register configures the comparators for range matching. Table 8-15. DBGC2 Field Descriptions Field 3-2 CDCM[1:0] 1-0 ABCM[1:0] Description C and D Comparator Match Control -- These bits determine the C and D comparator match mapping as described in Table 8-16. A and B Comparator Match Control -- These bits determine the A and B comparator match mapping as described in Table 8-17. MC9S12XE-Family Reference Manual , Rev. 1.21 312 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-16. CDCM Encoding CDCM 00 01 10 Description Match2 mapped to comparator C match....... Match3 mapped to comparator D match. Match2 mapped to comparator C/D inside range....... Match3 disabled. Match2 mapped to comparator C/D outside range....... Match3 disabled. 11 Reserved(1) 1. Currently defaults to Match2 mapped to comparator C : Match3 mapped to comparator D Table 8-17. ABCM Encoding ABCM 00 01 10 Description Match0 mapped to comparator A match....... Match1 mapped to comparator B match. Match 0 mapped to comparator A/B inside range....... Match1 disabled. Match 0 mapped to comparator A/B outside range....... Match1 disabled. 11 Reserved(1) 1. Currently defaults to Match0 mapped to comparator A : Match1 mapped to comparator B 8.3.2.5 Debug Trace Buffer Register (DBGTBH:DBGTBL) Address: 0x0024, 0x0025 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W POR Other Resets Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 X -- X -- X -- X -- X -- X -- X -- Bit 8 X -- Bit 7 X -- Bit 6 X -- Bit 5 X -- Bit 4 X -- Bit 3 X -- Bit 2 X -- Bit 1 X -- Bit 0 X -- Figure 8-7. Debug Trace Buffer Register (DBGTB) Read: Only when unlocked AND not secured AND not armed AND with a TSOURCE bit set. Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer contents. Table 8-18. DBGTB Field Descriptions Field 15-0 Bit[15:0] Description Trace Buffer Data Bits -- The Trace Buffer Register is a window through which the 64-bit wide data lines of the Trace Buffer may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer which points to the next address to be read. When the ARM bit is written to 1 the trace buffer is locked to prevent reading. The trace buffer can only be unlocked for reading by writing to DBGTB with an aligned word write when the module is disarmed. The DBGTB register can be read only as an aligned word, any byte reads or misaligned access of these registers will return 0 and will not cause the trace buffer pointer to increment to the next trace buffer address. The same is true for word reads while the debugger is armed. The POR state is undefined Other resets do not affect the trace buffer contents. . MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 313 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.6 Debug Count Register (DBGCNT) Address: 0x0026 7 6 5 4 3 2 1 0 R W Reset POR 0 0 0 -- 0 -- 0 -- 0 CNT -- 0 -- 0 -- 0 -- 0 = Unimplemented or Reserved Figure 8-8. Debug Count Register (DBGCNT) Read: Anytime Write: Never Table 8-19. DBGCNT Field Descriptions Field 6-0 CNT[6:0] Description Count Value -- The CNT bits [6:0] indicate the number of valid data 64-bit data lines stored in the Trace Buffer. Table 8-20 shows the correlation between the CNT bits and the number of valid data lines in the Trace Buffer. When the CNT rolls over to zero, the TBF bit in DBGSR is set and incrementing of CNT will continue in endtrigger or mid-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a one. The DBGCNT register is cleared by power-on-reset initialization but is not cleared by other system resets. Thus should a reset occur during a debug session, the DBGCNT register still indicates after the reset, the number of valid trace buffer entries stored before the reset occurred. The DBGCNT register is not decremented when reading from the trace buffer. Table 8-20. CNT Decoding Table TBF (DBGSR) 0 0 0 CNT[6:0] 0000000 0000001 0000010 0000100 0000110 .. 1111100 1111110 0000000 Description No data valid 32 bits of one line valid(1) 1 line valid 2 lines valid 3 lines valid .. 62 lines valid 63 lines valid 64 lines valid; if using Begin trigger alignment, ARM bit will be cleared and the tracing session ends. 0 1 1 64 lines valid, 0000010 oldest data has been overwritten by most recent data .. .. 1111110 1. This applies to Normal/Loop1/PurePC Modes when tracing from either CPU12X or XGATE only. MC9S12XE-Family Reference Manual , Rev. 1.21 314 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.7 Debug State Control Registers There is a dedicated control register for each of the state sequencer states 1 to 3 that determines if transitions from that state are allowed, depending upon comparator matches or tag hits, and defines the next state for the state sequencer following a match. The three debug state control registers are located at the same address in the register address map (0x0027). Each register can be accessed using the COMRV bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag register (DBGMFR). Table 8-21. State Control Register Access Encoding COMRV 00 01 10 11 Visible State Control Register DBGSCR1 DBGSCR2 DBGSCR3 DBGMFR 8.3.2.7.1 Address: 0x0027 7 Debug State Control Register 1 (DBGSCR1) 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 SC3 0 SC2 0 SC1 0 SC0 0 = Unimplemented or Reserved Figure 8-9. Debug State Control Register 1 (DBGSCR1) Read: If COMRV[1:0] = 00 Write: If COMRV[1:0] = 00 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the targeted next state whilst in State1. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-22. DBGSCR1 Field Descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state whilst in State1, based upon the match event. Table 8-23. State1 Sequencer Next State Selection SC[3:0] 0000 0001 0010 0011 Description Any match triggers to state2 Any match triggers to state3 Any match triggers to Final State Match2 triggers to State2....... Other matches have no effect MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 315 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-23. State1 Sequencer Next State Selection (continued) SC[3:0] 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Match2 triggers to State3....... Other matches have no effect Match2 triggers to Final State....... Other matches have no effect Match0 triggers to State2....... Match1 triggers to State3....... Other matches have no effect Match1 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match0 triggers to State2....... Match2 triggers to State3....... Other matches have no effect Match2 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match1 triggers to State2....... Match3 triggers to State3....... Other matches have no effect Match3 triggers to State3....... Match1 triggers to Final State....... Other matches have no effect Match3 has no effect....... All other matches (M0,M1,M2) trigger to State2 Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.2 Address: 0x0027 7 6 5 4 3 2 1 0 Debug State Control Register 2 (DBGSCR2) R W Reset 0 0 0 0 0 0 0 0 SC3 0 SC2 0 SC1 0 SC0 0 = Unimplemented or Reserved Figure 8-10. Debug State Control Register 2 (DBGSCR2) Read: If COMRV[1:0] = 01 Write: If COMRV[1:0] = 01 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the targeted next state whilst in State2. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-24. DBGSCR2 Field Descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state whilst in State2, based upon the match event. Table 8-25. State2 --Sequencer Next State Selection SC[3:0] 0000 0001 Description Any match triggers to state1 Any match triggers to state3 MC9S12XE-Family Reference Manual , Rev. 1.21 316 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-25. State2 --Sequencer Next State Selection (continued) SC[3:0] 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Any match triggers to Final State Match3 triggers to State1....... Other matches have no effect Match3 triggers to State3....... Other matches have no effect Match3 triggers to Final State....... Other matches have no effect Match0 triggers to State1....... Match1 triggers to State3....... Other matches have no effect Match1 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match0 triggers to State1....... Match2 triggers to State3....... Other matches have no effect Match2 triggers to State3....... Match0 triggers Final State....... Other matches have no effect Match1 triggers to State1....... Match3 triggers to State3....... Other matches have no effect Match3 triggers to State3....... Match1 triggers Final State....... Other matches have no effect Match2 triggers to State1..... Match3 trigger to Final State Match2 has no affect, all other matches (M0,M1,M3) trigger to Final State Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.3 Address: 0x0027 7 6 5 4 3 2 1 0 Debug State Control Register 3 (DBGSCR3) R W Reset 0 0 0 0 0 0 0 0 SC3 0 SC2 0 SC1 0 SC0 0 = Unimplemented or Reserved Figure 8-11. Debug State Control Register 3 (DBGSCR3) Read: If COMRV[1:0] = 10 Write: If COMRV[1:0] = 10 and S12XDBG is not armed. This register is visible at 0x0027 only with COMRV[1:0] = 10. The state control register three selects the targeted next state whilst in State3. The matches refer to the match channels of the comparator match control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1". Comparators must be enabled by setting the comparator enable bit in the associated DBGXCTL control register. Table 8-26. DBGSCR3 Field Descriptions Field 3-0 SC[3:0] Description These bits select the targeted next state whilst in State3, based upon the match event. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 317 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-27. State3 -- Sequencer Next State Selection SC[3:0] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Description Any match triggers to state1 Any match triggers to state2 Any match triggers to Final State Match0 triggers to State1....... Other matches have no effect Match0 triggers to State2....... Other matches have no effect Match0 triggers to Final State.......Match1 triggers to State1...Other matches have no effect Match1 triggers to State1....... Other matches have no effect Match1 triggers to State2....... Other matches have no effect Match1 triggers to Final State....... Other matches have no effect Match2 triggers to State2....... Match0 triggers to Final State....... Other matches have no effect Match1 triggers to State1....... Match3 triggers to State2....... Other matches have no effect Match3 triggers to State2....... Match1 triggers to Final State....... Other matches have no effect Match2 triggers to Final State....... Other matches have no effect Match3 triggers to Final State....... Other matches have no effect Reserved. (No match triggers state sequencer transition) Reserved. (No match triggers state sequencer transition) The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches. 8.3.2.7.4 Address: 0x0027 7 6 5 4 3 2 1 0 Debug Match Flag Register (DBGMFR) R W Reset 0 0 0 0 0 0 0 0 MC3 0 MC2 0 MC1 0 MC0 0 = Unimplemented or Reserved Figure 8-12. Debug Match Flag Register (DBGMFR) Read: If COMRV[1:0] = 11 Write: Never DBGMFR is visible at 0x0027 only with COMRV[1:0] = 11. It features four flag bits each mapped directly to a channel. Should a match occur on the channel during the debug session, then the corresponding flag is set and remains set until the next time the module is armed by writing to the ARM bit. Thus the contents are retained after a debug session for evaluation purposes. These flags cannot be cleared by software, they are cleared only when arming the module. A set flag does not inhibit the setting of other flags. Once a flag is set, further triggers on the same channel have no affect. MC9S12XE-Family Reference Manual , Rev. 1.21 318 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8 Comparator Register Descriptions Each comparator has a bank of registers that are visible through an 8-byte window in the S12XDBG module register address map. Comparators A and C consist of 8 register bytes (3 address bus compare registers, two data bus compare registers, two data bus mask registers and a control register). Comparators B and D consist of four register bytes (three address bus compare registers and a control register). Each set of comparator registers is accessible in the same 8-byte window of the register address map and can be accessed using the COMRV bits in the DBGC1 register. If the Comparators B or D are accessed through the 8-byte window, then only the address and control bytes are visible, the 4 bytes associated with data bus and data bus masking read as zero and cannot be written. Furthermore the control registers for comparators B and D differ from those of comparators A and C. Table 8-28. Comparator Register Layout 0x0028 0x0029 0x002A 0x002B 0x002C 0x002D 0x002E 0x002F CONTROL ADDRESS HIGH ADDRESS MEDIUM ADDRESS LOW DATA HIGH COMPARATOR DATA LOW COMPARATOR DATA HIGH MASK DATA LOW MASK Read/Write Read/Write Read/Write Read/Write Read/Write Read/Write Read/Write Read/Write Comparators A,B,C,D Comparators A,B,C,D Comparators A,B,C,D Comparators A,B,C,D Comparator A and C only Comparator A and C only Comparator A and C only Comparator A and C only 8.3.2.8.1 Debug Comparator Control Register (DBGXCTL) The contents of this register bits 7 and 6 differ depending upon which comparator registers are visible in the 8-byte window of the DBG module register address map. Address: 0x0028 7 6 5 4 3 2 1 0 R W Reset 0 0 NDB 0 TAG 0 BRK 0 RW 0 RWE 0 SRC 0 COMPE 0 = Unimplemented or Reserved Figure 8-13. Debug Comparator Control Register (Comparators A and C) Address: 0x0028 7 6 5 4 3 2 1 0 R W Reset SZE 0 SZ 0 TAG 0 BRK 0 RW 0 RWE 0 SRC 0 COMPE 0 Figure 8-14. Debug Comparator Control Register (Comparators B and D) Read: Anytime. See Table 8-29 for visible register encoding. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 319 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Write: If DBG not armed. See Table 8-29 for visible register encoding. The DBGC1_COMRV bits determine which comparator control, address, data and datamask registers are visible in the 8-byte window from 0x0028 to 0x002F as shown in Section Table 8-29. Table 8-29. Comparator Address Register Visibility COMRV 00 01 10 11 Visible Comparator DBGACTL, DBGAAH ,DBGAAM, DBGAAL, DBGADH, DBGADL, DBGADHM, DBGADLM DBGBCTL, DBGBAH, DBGBAM, DBGBAL DBGCCTL, DBGCAH, DBGCAM, DBGCAL, DBGCDH, DBGCDL, DBGCDHM, DBGCDLM DBGDCTL, DBGDAH, DBGDAM, DBGDAL Table 8-30. DBGXCTL Field Descriptions Field 7 SZE (Comparators B and D) 6 NDB (Comparators A and C Description Size Comparator Enable Bit -- The SZE bit controls whether access size comparison is enabled for the associated comparator. This bit is ignored if the TAG bit in the same register is set. 0 Word/Byte access size is not used in comparison 1 Word/Byte access size is used in comparison Not Data Bus -- The NDB bit controls whether the match occurs when the data bus matches the comparator register value or when the data bus differs from the register value. Furthermore data bus bits can be individually masked using the comparator data mask registers. This bit is only available for comparators A and C. This bit is ignored if the TAG bit in the same register is set. This bit position has an SZ functionality for comparators B and D. 0 Match on data bus equivalence to comparator register contents 1 Match on data bus difference to comparator register contents Size Comparator Value Bit -- The SZ bit selects either word or byte access size in comparison for the associated comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set. This bit position has NDB functionality for comparators A and C 0 Word access size will be compared 1 Byte access size will be compared Tag Select -- This bit controls whether the comparator match will cause a trigger or tag the opcode at the matched address. Tagged opcodes trigger only if they reach the execution stage of the instruction queue. 0 Trigger immediately on match 1 On match, tag the opcode. If the opcode is about to be executed a trigger is generated Break -- This bit controls whether a channel match terminates a debug session immediately, independent of state sequencer state. To generate an immediate breakpoint the module breakpoints must be enabled using DBGBRK. 0 The debug session termination is dependent upon the state sequencer and trigger conditions. 1 A match on this channel terminates the debug session immediately; breakpoints if active are generated, tracing, if active, is terminated and the module disarmed. Read/Write Comparator Value Bit -- The RW bit controls whether read or write is used in compare for the associated comparator . The RW bit is not used if RWE = 0. 0 Write cycle will be matched 1 Read cycle will be matched Read/Write Enable Bit -- The RWE bit controls whether read or write comparison is enabled for the associated comparator. This bit is not used for tagged operations. 0 Read/Write is not used in comparison 1 Read/Write is used in comparison 6 SZ (Comparators B and D) 5 TAG 4 BRK 3 RW 2 RWE MC9S12XE-Family Reference Manual , Rev. 1.21 320 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-30. DBGXCTL Field Descriptions (continued) Field 1 SRC 0 COMPE Description Determines mapping of comparator to CPU12X or XGATE 0 The comparator is mapped to CPU12X buses 1 The comparator is mapped to XGATE address and data buses Determines if comparator is enabled 0 The comparator is not enabled 1 The comparator is enabled for state sequence triggers or tag generation Table 8-31 shows the effect for RWE and RW on the comparison conditions. These bits are not useful for tagged operations since the trigger occurs based on the tagged opcode reaching the execution stage of the instruction queue. Thus these bits are ignored if tagged triggering is selected. Table 8-31. Read or Write Comparison Logic Table RWE Bit 0 0 1 1 1 1 RW Bit x x 0 0 1 1 RW Signal 0 1 0 1 0 1 Comment RW not used in comparison RW not used in comparison Write No match No match Read 8.3.2.8.2 Address: 0x0029 7 Debug Comparator Address High Register (DBGXAH) 6 5 4 3 2 1 0 R W Reset 0 0 Bit 22 0 Bit 21 0 Bit 20 0 Bit 19 0 Bit 18 0 Bit 17 0 Bit 16 0 = Unimplemented or Reserved Figure 8-15. Debug Comparator Address High Register (DBGXAH) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-32. DBGXAH Field Descriptions Field 6-0 Bit[22:16] Description Comparator Address High Compare Bits -- The Comparator address high compare bits control whether the selected comparator will compare the address bus bits [22:16] to a logic one or logic zero. This register byte is ignored for XGATE compares. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 321 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.3 Address: 0x002A 7 Debug Comparator Address Mid Register (DBGXAM) 6 5 4 3 2 1 0 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 8-16. Debug Comparator Address Mid Register (DBGXAM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-33. DBGXAM Field Descriptions Field 7-0 Bit[15:8] Description Comparator Address Mid Compare Bits-- The Comparator address mid compare bits control whether the selected comparator will compare the address bus bits [15:8] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one 8.3.2.8.4 Address: 0x002B 7 Debug Comparator Address Low Register (DBGXAL) 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 8-17. Debug Comparator Address Low Register (DBGXAL) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-34. DBGXAL Field Descriptions Field 7-0 Bits[7:0] Description Comparator Address Low Compare Bits -- The Comparator address low compare bits control whether the selected comparator will compare the address bus bits [7:0] to a logic one or logic zero. 0 Compare corresponding address bit to a logic zero 1 Compare corresponding address bit to a logic one MC9S12XE-Family Reference Manual , Rev. 1.21 322 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.5 Address: 0x002C 7 Debug Comparator Data High Register (DBGXDH) 6 5 4 3 2 1 0 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 8-18. Debug Comparator Data High Register (DBGXDH) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-35. DBGXAH Field Descriptions Field 7-0 Bits[15:8] Description Comparator Data High Compare Bits -- The Comparator data high compare bits control whether the selected comparator compares the data bus bits [15:8] to a logic one or logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators A and C. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one 8.3.2.8.6 Address: 0x002D 7 Debug Comparator Data Low Register (DBGXDL) 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 8-19. Debug Comparator Data Low Register (DBGXDL) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-36. DBGXDL Field Descriptions Field 7-0 Bits[7:0] Description Comparator Data Low Compare Bits -- The Comparator data low compare bits control whether the selected comparator compares the data bus bits [7:0] to a logic one or logic zero. The comparator data compare bits are only used in comparison if the corresponding data mask bit is logic 1. This register is available only for comparators A and C. 0 Compare corresponding data bit to a logic zero 1 Compare corresponding data bit to a logic one MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 323 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.3.2.8.7 Address: 0x002E 7 Debug Comparator Data High Mask Register (DBGXDHM) 6 5 4 3 2 1 0 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 8-20. Debug Comparator Data High Mask Register (DBGXDHM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-37. DBGXDHM Field Descriptions Field 7-0 Bits[15:8] Description Comparator Data High Mask Bits -- The Comparator data high mask bits control whether the selected comparator compares the data bus bits [15:8] to the corresponding comparator data compare bits. This register is available only for comparators A and C. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 8.3.2.8.8 Address: 0x002F 7 Debug Comparator Data Low Mask Register (DBGXDLM) 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 8-21. Debug Comparator Data Low Mask Register (DBGXDLM) Read: Anytime. See Table 8-29 for visible register encoding. Write: If DBG not armed. See Table 8-29 for visible register encoding. Table 8-38. DBGXDLM Field Descriptions Field 7-0 Bits[7:0] Description Comparator Data Low Mask Bits -- The Comparator data low mask bits control whether the selected comparator compares the data bus bits [7:0] to the corresponding comparator data compare bits. This register is available only for comparators A and C. 0 Do not compare corresponding data bit 1 Compare corresponding data bit 8.4 Functional Description This section provides a complete functional description of the S12XDBG module. If the part is in secure mode, the S12XDBG module can generate breakpoints but tracing is not possible. MC9S12XE-Family Reference Manual , Rev. 1.21 324 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.1 S12XDBG Operation Arming the S12XDBG module by setting ARM in DBGC1 allows triggering, and storing of data in the trace buffer and can be used to cause breakpoints to the CPU12X or the XGATE module. The DBG module is made up of four main blocks, the comparators, control logic, the state sequencer, and the trace buffer. The comparators monitor the bus activity of the CPU12X and XGATE. Comparators can be configured to monitor address and databus. Comparators can also be configured to mask out individual data bus bits during a compare and to use R/W and word/byte access qualification in the comparison. When a match with a comparator register value occurs the associated control logic can trigger the state sequencer to another state (see Figure 8-22). Either forced or tagged triggers are possible. Using a forced trigger, the trigger is generated immediately on a comparator match. Using a tagged trigger, at a comparator match, the instruction opcode is tagged and only if the instruction reaches the execution stage of the instruction queue is a trigger generated. In the case of a transition to Final State, bus tracing is triggered and/or a breakpoint can be generated. Tracing of both CPU12X and/or XGATE bus activity is possible. Independent of the state sequencer, a breakpoint can be triggered by the external TAGHI / TAGLO signals or by an XGATE S/W breakpoint request or by writing to the TRIG bit in the DBGC1 control register. The trace buffer is visible through a 2-byte window in the register address map and can be read out using standard 16-bit word reads. 8.4.2 Comparator Modes The S12XDBG contains four comparators, A, B, C, and D. Each comparator can be configured to monitor CPU12X or XGATE buses. Each comparator compares the selected address bus with the address stored in DBGXAH, DBGXAM, and DBGXAL. Furthermore, comparators A and C also compare the data buses to the data stored in DBGXDH, DBGXDL and allow masking of individual data bus bits. S12X comparator matches are disabled in BDM and during BDM accesses. The comparator match control logic configures comparators to monitor the buses for an exact address or an address range. The comparator configuration is controlled by the control register contents and the range control by the DBGC2 contents. On a match a trigger can initiate a transition to another state sequencer state (see Section 8.4.3"). The comparator control register also allows the type of access to be included in the comparison through the use of the RWE, RW, SZE, and SZ bits. The RWE bit controls whether read or write comparison is enabled for the associated comparator and the RW bit selects either a read or write access for a valid match. Similarly the SZE and SZ bits allows the size of access (word or byte) to be considered in the compare. Only comparators B and D feature SZE and SZ. The TAG bit in each comparator control register is used to determine the triggering condition. By setting TAG, the comparator will qualify a match with the output of opcode tracking logic and a trigger occurs before the tagged instruction executes (tagged-type trigger). Whilst tagging, the RW, RWE, SZE, and SZ bits are ignored and the comparator register must be loaded with the exact opcode address. If the TAG bit is clear (forced type trigger) a comparator match is generated when the selected address appears on the system address bus. If the selected address is an opcode address, the match is generated MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 325 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module when the opcode is fetched from the memory. This precedes the instruction execution by an indefinite number of cycles due to instruction pipe lining. For a comparator match of an opcode at an odd address when TAG = 0, the corresponding even address must be contained in the comparator register. Thus for an opcode at odd address (n), the comparator register must contain address (n-1). Once a successful comparator match has occurred, the condition that caused the original match is not verified again on subsequent matches. Thus if a particular data value is verified at a given address, this address may not still contain that data value when a subsequent match occurs. Comparators C and D can also be used to select an address range to trace from. This is determined by the TRANGE bits in the DBGTCR register. The TRANGE encoding is shown in Table 8-12. If the TRANGE bits select a range definition using comparator D, then comparator D is configured for trace range definition and cannot be used for address bus comparisons. Similarly if the TRANGE bits select a range definition using comparator C, then comparator C is configured for trace range definition and cannot be used for address bus comparisons. Match[0, 1, 2, 3] map directly to Comparators[A, B, C, D] respectively, except in range modes (see Section 8.3.2.4"). Comparator priority rules are described in the trigger priority section (Section 8.4.3.6"). 8.4.2.1 Exact Address Comparator Match (Comparators A and C) With range comparisons disabled, the match condition is an exact equivalence of address/data bus with the value stored in the comparator address/data registers. Further qualification of the type of access (R/W, word/byte) is possible. Comparators A and C do not feature SZE or SZ control bits, thus the access size is not compared. Table 840 lists access considerations without data bus compare. Table 8-39 lists access considerations with data bus comparison. To compare byte accesses DBGxDH must be loaded with the data byte, the low byte must be masked out using the DBGxDLM mask register. On word accesses the data byte of the lower address is mapped to DBGxDH. Table 8-39. Comparator A and C Data Bus Considerations Access Word Byte Word Word Address ADDR[n] ADDR[n] ADDR[n] ADDR[n] DBGxDH Data[n] Data[n] Data[n] x DBGxDL Data[n+1] x x Data[n+1] DBGxDHM $FF $FF $FF $00 DBGxDLM $FF $00 $00 $FF Example Valid Match MOVW #$WORD ADDR[n] MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] MOVW #$WORD ADDR[n] config1 config2 config2 config3 Code may contain various access forms of the same address, i.e. a word access of ADDR[n] or byte access of ADDR[n+1] both access n+1. At a word access of ADDR[n], address ADDR[n+1] does not appear on the address bus and so cannot cause a comparator match if the comparator contains ADDR[n]. Thus it is not possible to monitor all data accesses of ADDR[n+1] with one comparator. To detect an access of ADDR[n+1] through a word access of ADDR[n] the comparator can be configured to ADDR[n], DBGxDL is loaded with the data pattern and DBGxDHM is cleared so only the data[n+1] is compared on accesses of ADDR[n]. MC9S12XE-Family Reference Manual , Rev. 1.21 326 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module NOTE Using this configuration, a byte access of ADDR[n] can cause a comparator match if the databus low byte by chance contains the same value as ADDR[n+1] because the databus comparator does not feature access size comparison and uses the mask as a "don't care" function. Thus masked bits do not prevent a match. Comparators A and C feature an NDB control bit to determine if a match occurs when the data bus differs to comparator register contents or when the data bus is equivalent to the comparator register contents. 8.4.2.2 Exact Address Comparator Match (Comparators B and D) Comparators B and D feature SZ and SZE control bits. If SZE is clear, then the comparator address match qualification functions the same as for comparators A and C. If the SZE bit is set the access size (word or byte) is compared with the SZ bit value such that only the specified type of access causes a match. Thus if configured for a byte access of a particular address, a word access covering the same address does not lead to match. Table 8-40. Comparator Access Size Considerations Comparator Comparators A and C Comparators B and D Comparators B and D Address ADDR[n] SZE -- SZ8 -- Condition For Valid Match Word and byte accesses of ADDR[n](1) MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] Word and byte accesses of ADDR[n]1 MOVB #$BYTE ADDR[n] MOVW #$WORD ADDR[n] Word accesses of ADDR[n]1 MOVW #$WORD ADDR[n] ADDR[n] 0 X ADDR[n] 1 0 Comparators ADDR[n] 1 1 Byte accesses of ADDR[n] B and D MOVB #$BYTE ADDR[n] 1. A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match. The comparator address register must contain the exact address used in the code. 8.4.2.3 Data Bus Comparison NDB Dependency Comparators A and C each feature an NDB control bit, which allows data bus comparators to be configured to either trigger on equivalence or trigger on difference. This allows monitoring of a difference in the contents of an address location from an expected value. When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by clearing the corresponding mask bit (DBGxDHM/DBGxDLM), so that it is ignored in the comparison. A match occurs when all data bus bits with corresponding mask bits set are equivalent. If all mask register bits are clear, then a match is based on the address bus only, the data bus is ignored. When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any data bus bit with corresponding mask bit set is different. Clearing all mask bits, causes all bits to be ignored and prevents a match because no difference can be detected. In this case address bus equivalence does not cause a match. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 327 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-41. NDB and MASK bit dependency NDB 0 0 1 1 DBGxDHM[n] / DBGxDLM[n] 0 1 0 1 Comment Do not compare data bus bit. Compare data bus bit. Match on equivalence. Do not compare data bus bit. Compare data bus bit. Match on difference. 8.4.2.4 Range Comparisons When using the AB comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator A data and data mask registers. Furthermore the DBGACTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access. The corresponding DBGBCTL bits are ignored. Similarly when using the CD comparator pair for a range comparison, the data bus can also be used for qualification by using the comparator C data and data mask registers. Furthermore the DBGCCTL RW and RWE bits can be used to qualify the range comparison on either a read or a write access if tagging is not selected. The corresponding DBGDCTL bits are ignored. The SZE and SZ control bits are ignored in range mode. The comparator A and C TAG bits are used to tag range comparisons for the AB and CD ranges respectively. The comparator B and D TAG bits are ignored in range modes. In order for a range comparison using comparators A and B, both COMPEA and COMPEB must be set; to disable range comparisons both must be cleared. Similarly for a range CD comparison, both COMPEC and COMPED must be set. If a range mode is selected SRCA and SRCC select the source (S12X or XGATE), SRCB and SRCD are ignored. The comparator A and C BRK bits are used for the AB and CD ranges respectively, the comparator B and D BRK bits are ignored in range mode. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. 8.4.2.4.1 Inside Range (CompAC_Addr address CompBD_Addr) In the Inside Range comparator mode, either comparator pair A and B or comparator pair C and D can be configured for range comparisons by the control register (DBGC2). The match condition requires that a valid match for both comparators happens on the same bus cycle. A match condition on only one comparator is not valid. An aligned word access which straddles the range boundary will cause a trigger only if the aligned address is inside the range. 8.4.2.4.2 Outside Range (address < CompAC_Addr or address > CompBD_Addr) In the Outside Range comparator mode, either comparator pair A and B or comparator pair C and D can be configured for range comparisons. A single match condition on either of the comparators is recognized as valid. An aligned word access which straddles the range boundary will cause a trigger only if the aligned address is outside the range. Outside range mode in combination with tagged triggers can be used to detect if the opcode fetches are from an unexpected range. In forced trigger modes the outside range trigger would typically be activated at any interrupt vector fetch or register access. This can be avoided by setting the upper or lower range limit to $7FFFFF or $000000 respectively. Interrupt vector fetches do not cause taghits MC9S12XE-Family Reference Manual , Rev. 1.21 328 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module When comparing the XGATE address bus in outside range mode, the initial vector fetch as determined by the vector contained in the XGATE XGVBR register should be taken into consideration. The XGVBR register and hence vector address can be modified. 8.4.3 Trigger Modes Trigger modes are used as qualifiers for a state sequencer change of state. The control logic determines the trigger mode and provides a trigger to the state sequencer. The individual trigger modes are described in the following sections. 8.4.3.1 Forced Trigger On Comparator Match If a forced trigger comparator match occurs, the trigger immediately initiates a transition to the next state sequencer state whereby the corresponding flags in DBGSR are set. The state control register for the current state determines the next state for each trigger. Forced triggers are generated as soon as the matching address appears on the address bus, which in the case of opcode fetches occurs several cycles before the opcode execution. For this reason a forced trigger at an opcode address precedes a tagged trigger at the same address by several cycles. 8.4.3.2 Trigger On Comparator Related Taghit If a CPU12X or XGATE taghit occurs, a transition to another state sequencer state is initiated and the corresponding DBGSR flags are set. For a comparator related taghit to occur, the S12XDBG must first generate tags based on comparator matches. When the tagged instruction reaches the execution stage of the instruction queue a taghit is generated by the CPU12X/XGATE. The state control register for the current state determines the next state for each trigger. 8.4.3.3 External Tagging Trigger The TAGLO and TAGHI pins (mapped to device pins) can be used to tag an instruction. This function can be used as another breakpoint source. When the tagged opcode reaches the execution stage of the instruction queue a transition to the disarmed state0 occurs, ending the debug session and generating a breakpoint, if breakpoints are enabled. External tagging is only possible in device emulation modes. 8.4.3.4 Trigger On XGATE S/W Breakpoint Request The XGATE S/W breakpoint request issues a forced breakpoint request to the CPU12X immediately and triggers the state sequencer into the disarmed state. Active tracing sessions are terminated immediately, thus if tracing has not yet begun, no trace information is stored. XGATE generated breakpoints are independent of the DBGBRK bits. The XGSBPE bit in DBGC1 determines if the XGATE S/W breakpoint function is enabled. The BDM bit in DBGC1 determines if the XGATE requested breakpoint causes the system to enter BDM Mode or initiate a software interrupt (SWI). 8.4.3.5 TRIG Immediate Trigger Independent of comparator matches or external tag signals it is possible to initiate a tracing session and/or breakpoint by writing the TRIG bit in DBGC1 to a logic "1". If configured for begin or mid aligned tracing, MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 329 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module this triggers the state sequencer into the Final State, if configured for end alignment, setting the TRIG bit disarms the module, ending the session. If breakpoints are enabled, a forced breakpoint request is issued immediately (end alignment) or when tracing has completed (begin or mid alignment). 8.4.3.6 Trigger Priorities In case of simultaneous triggers, the priority is resolved according to Table 8-42. The lower priority trigger is suppressed. It is thus possible to miss a lower priority trigger if it occurs simultaneously with a trigger of a higher priority. The trigger priorities described in Table 8-42 dictate that in the case of simultaneous matches, the match on the lower channel number (0,1,2,3) has priority. The SC[3:0] encoding ensures that a match leading to final state has priority over all other matches in each state sequencer state. When configured for range modes a simultaneous match of comparators A and C generates an active match0 whilst match2 is suppressed. If a write access to DBGC1 with the ARM bit position set occurs simultaneously to a hardware disarm from an internal trigger event, then the ARM bit is cleared due to the hardware disarm. Table 8-42. Trigger Priorities Priority Highest Source XGATE BKP TRIG External TAGHI/TAGLO Match0 (force or tag hit) Match1 (force or tag hit) Match2 (force or tag hit) Lowest Match3 (force or tag hit) Action Immediate forced breakpoint......(Tracing terminated immediately). Trigger immediately to final state (begin or mid aligned tracing enabled) Trigger immediately to state 0 (end aligned or no tracing enabled) Enter State0 Trigger to next state as defined by state control registers Trigger to next state as defined by state control registers Trigger to next state as defined by state control registers Trigger to next state as defined by state control registers 8.4.4 State Sequence Control ARM = 0 State 0 (Disarmed) ARM = 1 State1 ARM = 0 Session Complete (Disarm) Final State ARM = 0 State3 State2 Figure 8-22. State Sequencer Diagram The state sequencer allows a defined sequence of events to provide a trigger point for tracing of data in the trace buffer. Once the S12XDBG module has been armed by setting the ARM bit in the DBGC1 register, MC9S12XE-Family Reference Manual , Rev. 1.21 330 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module then state1 of the state sequencer is entered. Further transitions between the states are then controlled by the state control registers and depend upon a selected trigger mode condition being met. From Final State the only permitted transition is back to the disarmed state0. Transition between any of the states 1 to 3 is not restricted. Each transition updates the SSF[2:0] flags in DBGSR accordingly to indicate the current state. Alternatively by setting the TRIG bit in DBGSC1, the state machine can be triggered to state0 or Final State depending on tracing alignment. A tag hit through TAGHI/TAGLO brings the state sequencer immediately into state0, causes a breakpoint, if breakpoints are enabled, and ends tracing immediately independent of the trigger alignment bits TALIGN[1:0]. Independent of the state sequencer, each comparator channel can be individually configured to generate an immediate breakpoint when a match occurs through the use of the BRK bits in the DBGxCTL registers. Thus it is possible to generate an immediate breakpoint on selected channels, whilst a state sequencer transition can be initiated by a match on other channels. If a debug session is ended by a trigger on a channel with BRK = 1, the state sequencer transitions through Final State for a clock cycle to state0. This is independent of tracing and breakpoint activity, thus with tracing and breakpoints disabled, the state sequencer enters state0 and the debug module is disarmed. An XGATE S/W breakpoint request, if enabled causes a transition to the State0 and generates a breakpoint request to the CPU12X immediately 8.4.4.1 Final State On entering Final State a trigger may be issued to the trace buffer according to the trace position control as defined by the TALIGN field (see Section 8.3.2.3"). If TSOURCE in the trace control register DBGTCR are cleared then the trace buffer is disabled and the transition to Final State can only generate a breakpoint request. In this case or upon completion of a tracing session when tracing is enabled, the ARM bit in the DBGC1 register is cleared, returning the module to the disarmed state0. If tracing is enabled, a breakpoint request can occur at the end of the tracing session. If neither tracing nor breakpoints are enabled then when the final state is reached it returns automatically to state0 and the debug module is disarmed. 8.4.5 Trace Buffer Operation The trace buffer is a 64 lines deep by 64-bits wide RAM array. The S12XDBG module stores trace information in the RAM array in a circular buffer format. The RAM array can be accessed through a register window (DBGTBH:DBGTBL) using 16-bit wide word accesses. After each complete 64-bit trace buffer line is read, an internal pointer into the RAM is incremented so that the next read will receive fresh information. Data is stored in the format shown in Table 8-43. After each store the counter register bits DBGCNT[6:0] are incremented. Tracing of CPU12X activity is disabled when the BDM is active but tracing of XGATE activity is still possible. Reading the trace buffer whilst the DBG is armed returns invalid data and the trace buffer pointer is not incremented. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 331 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.1 Trace Trigger Alignment Using the TALIGN bits (see Section 8.3.2.3") it is possible to align the trigger with the end, the middle, or the beginning of a tracing session. If End or Mid tracing is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered. The transition to Final State if End is selected signals the end of the tracing session. The transition to Final State if Mid is selected signals that another 32 lines will be traced before ending the tracing session. Tracing with Begin-Trigger starts at the opcode of the trigger. 8.4.5.1.1 Storing with Begin-Trigger Storing with Begin-Trigger, data is not stored in the Trace Buffer until the Final State is entered. Once the trigger condition is met the S12XDBG module will remain armed until 64 lines are stored in the Trace Buffer. If the trigger is at the address of the change-of-flow instruction the change of flow associated with the trigger will be stored in the Trace Buffer. Using Begin-trigger together with tagging, if the tagged instruction is about to be executed then the trace is started. Upon completion of the tracing session the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary. 8.4.5.1.2 Storing with Mid-Trigger Storing with Mid-Trigger, data is stored in the Trace Buffer as soon as the S12XDBG module is armed. When the trigger condition is met, another 32 lines will be traced before ending the tracing session, irrespective of the number of lines stored before the trigger occurred, then the S12XDBG module is disarmed and no more data is stored. Using Mid-trigger with tagging, if the tagged instruction is about to be executed then the trace is continued for another 32 lines. Upon tracing completion the breakpoint is generated, thus the breakpoint does not occur at the tagged instruction boundary. 8.4.5.1.3 Storing with End-Trigger Storing with End-Trigger, data is stored in the Trace Buffer until the Final State is entered, at which point the S12XDBG module will become disarmed and no more data will be stored. If the trigger is at the address of a change of flow instruction the trigger event will not be stored in the Trace Buffer. 8.4.5.2 Trace Modes The S12XDBG module can operate in four trace modes. The mode is selected using the TRCMOD bits in the DBGTCR register. In each mode tracing of XGATE or CPU12X information is possible. The source for the trace is selected using the TSOURCE bits in the DBGTCR register. The modes are described in the following subsections. The trace buffer organization is shown in Table 8-43. 8.4.5.2.1 Normal Mode In Normal Mode, change of flow (COF) program counter (PC) addresses will be stored. COF addresses are defined as follows for the CPU12X: * Source address of taken conditional branches (long, short, bit-conditional, and loop primitives) * Destination address of indexed JMP, JSR, and CALL instruction MC9S12XE-Family Reference Manual , Rev. 1.21 332 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module * * Destination address of RTI, RTS, and RTC instructions. Vector address of interrupts, except for SWI and BDM vectors LBRA, BRA, BSR, BGND as well as non-indexed JMP, JSR, and CALL instructions are not classified as change of flow and are not stored in the trace buffer. COF addresses are defined as follows for the XGATE: * Source address of taken conditional branches * Destination address of indexed JAL instructions. * First XGATE code address in a thread Change-of-flow addresses stored include the full 23-bit address bus of CPU12X, the 16-bit address bus for the XGATE module and an information byte, which contains a source/destination bit to indicate whether the stored address was a source address or destination address. NOTE When an CPU12X COF instruction with destination address is executed, the destination address is stored to the trace buffer on instruction completion, indicating the COF has taken place. If an interrupt occurs simultaneously then the next instruction carried out is actually from the interrupt service routine. The instruction at the destination address of the original program flow gets exectuted after the interrupt service routine. In the following example an IRQ interrupt occurs during execution of the indexed JMP at address MARK1. The BRN at the destination (SUB_1) is not executed until after the IRQ service routine but the destination address is entered into the trace buffer to indicate that the indexed JMP COF has taken place. MARK1 MARK2 SUB_1 LDX JMP NOP BRN NOP DBNE LDAB STAB RTI #SUB_1 0,X ; IRQ interrupt occurs during execution of this ; ; JMP Destination address TRACE BUFFER ENTRY 1 ; RTI Destination address TRACE BUFFER ENTRY 3 ; ; Source address TRACE BUFFER ENTRY 4 ; IRQ Vector $FFF2 = TRACE BUFFER ENTRY 2 ; * ADDR1 IRQ_ISR A,PART5 #$F0 VAR_C1 The execution flow taking into account the IRQ is as follows MARK1 IRQ_ISR LDX JMP LDAB STAB RTI BRN NOP DBNE #SUB_1 0,X #$F0 VAR_C1 * A,PART5 ; ; ; ; ; SUB_1 ADDR1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 333 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.2.2 Loop1 Mode Loop1 Mode, similarly to Normal Mode also stores only COF address information to the trace buffer, it however allows the filtering out of redundant information. The intent of Loop1 Mode is to prevent the Trace Buffer from being filled entirely with duplicate information from a looping construct such as delays using the DBNE instruction or polling loops using BRSET/BRCLR instructions. Immediately after address information is placed in the Trace Buffer, the S12XDBG module writes this value into a background register. This prevents consecutive duplicate address entries in the Trace Buffer resulting from repeated branches. Loop1 Mode only inhibits consecutive duplicate source address entries that would typically be stored in most tight looping constructs. It does not inhibit repeated entries of destination addresses or vector addresses, since repeated entries of these would most likely indicate a bug in the user's code that the S12XDBG module is designed to help find. 8.4.5.2.3 Detail Mode In Detail Mode, address and data for all memory and register accesses is stored in the trace buffer. In the case of XGATE tracing this means that initialization of the R1 register during a vector fetch is not traced. This mode also features information byte entries to the trace buffer, for each address byte entry. The information byte indicates the size of access (word or byte) and the type of access (read or write). When tracing CPU12X activity in Detail Mode, all cycles are traced except those when the CPU12X is either in a free or opcode fetch cycle. In this mode the XGATE program counter is also traced to provide a snapshot of the XGATE activity. CXINF information byte bits indicate the type of XGATE activity occurring at the time of the trace buffer entry. When tracing CPU12X activity alone in Detail Mode, the address range can be limited to a range specified by the TRANGE bits in DBGTCR. This function uses comparators C and D to define an address range inside which CPU12X activity should be traced (see Table 8-43). Thus the traced CPU12X activity can be restricted to particular register range accesses. When tracing XGATE activity in Detail Mode, all load and store cycles are traced. Additionally the CPU12X program counter is stored at the time of the XGATE trace buffer entry to provide a snapshot of CPU12X activity. 8.4.5.2.4 Pure PC Mode In Pure PC Mode, tracing from the CPU the PC addresses of all executed opcodes, including illegal opcodes, are stored. In Pure PC Mode, tracing from the XGATE the PC addresses of all executed opcodes are stored. 8.4.5.3 Trace Buffer Organization Referring to Table 8-43. An X prefix denotes information from the XGATE module, a C prefix denotes information from the CPU12X. ADRH, ADRM, ADRL denote address high, middle and low byte respectively. INF bytes contain control information (R/W, S/D etc.). The numerical suffix indicates which tracing step. The information format for Loop1 Mode and PurePC Mode is the same as that of Normal Mode. Whilst tracing from XGATE or CPU12X only, in Normal or Loop1 modes each array line contains MC9S12XE-Family Reference Manual , Rev. 1.21 334 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 2 data entries, thus in this case the DBGCNT[0] is incremented after each separate entry. In Detail mode DBGCNT[0] remains cleared whilst the other DBGCNT bits are incremented on each trace buffer entry. XGATE and CPU12X COFs occur independently of each other and the profile of COFs for the two sources is totally different. When both sources are being traced in Normal or Loop1 mode, for each COF from one source, there may be many COFs from the other source, depending on user code. COF events could occur far from each other in the time domain, on consecutive cycles or simultaneously. When a COF occurs in either source (S12X or XGATE) a trace buffer entry is made and the corresponding CDV or XDV bit is set. The current PC of the other source is simultaneously stored to the trace buffer even if no COF has occurred, in which case CDV/XDV remains cleared indicating the address is not associated with a COF, but is simply a snapshot of the PC contents at the time of the COF from the other source. Single byte data accesses in Detail Mode are always stored to the low byte of the trace buffer (CDATAL or XDATAL) and the high byte is cleared. When tracing word accesses, the byte at the lower address is always stored to trace buffer byte3 and the byte at the higher address is stored to byte2 Table 8-43. Trace Buffer Organization Mode 8-Byte Wide Word Buffer 7 CXINF1 CXINF2 CXINF1 CXINF2 XINF0 XINF1 XINF1 XINF3 CINF1 CINF3 CPCH1 CPCH3 6 CADRH1 CADRH2 CADRH1 CADRH2 5 CADRM1 CADRM2 CADRM1 CADRM2 XPCM0 XPCM1 XPCM1 XPCM3 CPCM1 CPCM3 4 CADRL1 CADRL2 CADRL1 CADRL2 XPCL0 XPCL1 XPCL1 XPCL3 CPCL1 CPCL3 3 XDATAH1 XDATAH2 CDATAH1 CDATAH2 CINF0 CINF1 XINF0 XINF2 CINF0 CINF2 CPCH0 CPCH2 2 XDATAL1 XDATAL2 CDATAL1 CDATAL2 CPCH0 CPCH1 1 XADRM1 XADRM2 XADRM1 XADRM2 CPCM0 CPCM1 XPCM0 XPCM2 CPCM0 CPCM2 0 XADRL1 XADRL2 XADRL1 XADRL2 CPCL0 CPCL1 XPCL0 XPCL2 CPCL0 CPCL2 XGATE Detail CPU12X Detail Both Other Modes XGATE Other Modes CPU12X Other Modes MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 335 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.5.3.1 Information Byte Organization The format of the control information byte is dependent upon the active trace mode as described below. In Normal, Loop1, or Pure PC modes tracing of XGATE activity, XINF is used to store control information. In Normal, Loop1, or Pure PC modes tracing of CPU12X activity, CINF is used to store control information. In Detail Mode, CXINF contains the control information XGATE Information Byte Bit 7 XSD Bit 6 XSOT Bit 5 XCOT Bit 4 XDV Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 8-23. XGATE Information Byte XINF Table 8-44. XINF Field Descriptions Field 7 XSD Description Source Destination Indicator -- This bit indicates if the corresponding stored address is a source or destination address. This is only used in Normal and Loop1 mode tracing. 0 Source address 1 Destination address or Start of Thread or Continuation of Thread Start Of Thread Indicator -- This bit indicates that the corresponding stored address is a start of thread address. This is only used in Normal and Loop1 mode tracing. NOTE. This bit only has effect on devices where the XGATE module supports multiple interrupt levels. 0 Stored address not from a start of thread 1 Stored address from a start of thread Continuation Of Thread Indicator -- This bit indicates that the corresponding stored address is the first address following a return from a higher priority thread. This is only used in Normal and Loop1 mode tracing. NOTE. This bit only has effect on devices where the XGATE module supports multiple interrupt levels. 0 Stored address not from a continuation of thread 1 Stored address from a continuation of thread Data Invalid Indicator -- This bit indicates if the trace buffer entry is invalid. It is only used when tracing from both sources in Normal, Loop1 and Pure PC modes, to indicate that the XGATE trace buffer entry is valid. 0 Trace buffer entry is invalid 1 Trace buffer entry is valid 6 XSOT 5 XCOT 4 XDV XGATE info bit setting XGATE FLOW XSD XSOT XCOT SOT1 SOT2 JAL RTS COT1 RTS Figure 8-24. XGATE info bit setting Figure 8-24 indicates the XGATE information bit setting when switching between threads, the initial thread starting at SOT1 and continuing at COT1 after the higher priority thread2 has ended. MC9S12XE-Family Reference Manual , Rev. 1.21 336 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module CPU12X Information Byte Bit 7 CSD Bit 6 CVA Bit 5 0 Bit 4 CDV Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 8-25. CPU12X Information Byte CINF Table 8-45. CINF Field Descriptions Field 7 CSD Description Source Destination Indicator -- This bit indicates if the corresponding stored address is a source or destination address. This is only used in Normal and Loop1 mode tracing. 0 Source address 1 Destination address Vector Indicator -- This bit indicates if the corresponding stored address is a vector address.. Vector addresses are destination addresses, thus if CVA is set, then the corresponding CSD is also set. This is only used in Normal and Loop1 mode tracing. This bit has no meaning in Pure PC mode. 0 Indexed jump destination address 1 Vector destination address Data Invalid Indicator -- This bit indicates if the trace buffer entry is invalid. It is only used when tracing from both sources in Normal, Loop1 and Pure PC modes, to indicate that the CPU12X trace buffer entry is valid. 0 Trace buffer entry is invalid 1 Trace buffer entry is valid 6 CVA 4 CDV CXINF Information Byte Bit 7 CFREE Bit 6 CSZ Bit 5 CRW Bit 4 COCF Bit 3 XACK Bit 2 XSZ Bit 1 XRW Bit 0 XOCF Figure 8-26. Information Byte CXINF This describes the format of the information byte used only when tracing in Detail Mode. When tracing from the CPU12X in Detail Mode, information is stored to the trace buffer on all cycles except opcode fetch and free cycles. The XGATE entry stored on the same line is a snapshot of the XGATE program counter. In this case the CSZ and CRW bits indicate the type of access being made by the CPU12X, whilst the XACK and XOCF bits indicate if the simultaneous XGATE cycle is a free cycle (no bus acknowledge) or opcode fetch cycle. Similarly when tracing from the XGATE in Detail Mode, information is stored to the trace buffer on all cycles except opcode fetch and free cycles. The CPU12X entry stored on the same line is a snapshot of the CPU12X program counter. In this case the XSZ and XRW bits indicate the type of access being made by the XGATE, whilst the CFREE and COCF bits indicate if the simultaneous CPU12X cycle is a free cycle or opcode fetch cycle. Table 8-46. CXINF Field Descriptions Field 7 CFREE Description CPU12X Free Cycle Indicator -- This bit indicates if the stored CPU12X address corresponds to a free cycle. This bit only contains valid information when tracing the XGATE accesses in Detail Mode. 0 Stored information corresponds to free cycle 1 Stored information does not correspond to free cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 337 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module Table 8-46. CXINF Field Descriptions (continued) Field 6 CSZ Description Access Type Indicator -- This bit indicates if the access was a byte or word size access.This bit only contains valid information when tracing CPU12X activity in Detail Mode. 0 Word Access 1 Byte Access Read Write Indicator -- This bit indicates if the corresponding stored address corresponds to a read or write access. This bit only contains valid information when tracing CPU12X activity in Detail Mode. 0 Write Access 1 Read Access CPU12X Opcode Fetch Indicator -- This bit indicates if the stored address corresponds to an opcode fetch cycle. This bit only contains valid information when tracing the XGATE accesses in Detail Mode. 0 Stored information does not correspond to opcode fetch cycle 1 Stored information corresponds to opcode fetch cycle XGATE Access Indicator -- This bit indicates if the stored XGATE address corresponds to a free cycle. This bit only contains valid information when tracing the CPU12X accesses in Detail Mode. 0 Stored information corresponds to free cycle 1 Stored information does not correspond to free cycle Access Type Indicator -- This bit indicates if the access was a byte or word size access. This bit only contains valid information when tracing XGATE activity in Detail Mode. 0 Word Access 1 Byte Access Read Write Indicator -- This bit indicates if the corresponding stored address corresponds to a read or write access. This bit only contains valid information when tracing XGATE activity in Detail Mode. 0 Write Access 1 Read Access XGATE Opcode Fetch Indicator -- This bit indicates if the stored address corresponds to an opcode fetch cycle.This bit only contains valid information when tracing the CPU12X accesses in Detail Mode. 0 Stored information does not correspond to opcode fetch cycle 1 Stored information corresponds to opcode fetch cycle 5 CRW 4 COCF 3 XACK 2 XSZ 1 XRW 0 XOCF 8.4.5.4 Reading Data from Trace Buffer The data stored in the Trace Buffer can be read using either the background debug module (BDM) module, the XGATE or the CPU12X provided the S12XDBG module is not armed, is configured for tracing and the system not secured. When the ARM bit is written to 1 the trace buffer is locked to prevent reading. The trace buffer can only be unlocked for reading by an aligned word write to DBGTB when the module is disarmed. The Trace Buffer can only be read through the DBGTB register using aligned word reads, any byte or misaligned reads return 0 and do not cause the trace buffer pointer to increment to the next trace buffer address. The Trace Buffer data is read out first-in first-out. By reading CNT in DBGCNT the number of valid 64-bit lines can be determined. DBGCNT will not decrement as data is read. Whilst reading an internal pointer is used to determine the next line to be read. After a tracing session, the pointer points to the oldest data entry, thus if no overflow has occurred, the pointer points to line0, otherwise it points to the line with the oldest entry. The pointer is initialized by each aligned write to DBGTBH to point to the oldest data again. This enables an interrupted trace buffer read sequence to be easily restarted from the oldest data entry. MC9S12XE-Family Reference Manual , Rev. 1.21 338 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module The least significant word of each 64-bit wide array line is read out first. This corresponds to the bytes 1 and 0 of Table 8-43. The bytes containing invalid information (shaded in Table 8-43) are also read out. Reading the Trace Buffer while the S12XDBG module is armed will return invalid data and no shifting of the RAM pointer will occur. 8.4.5.5 Trace Buffer Reset State The Trace Buffer contents are not initialized by a system reset. Thus should a system reset occur, the trace session information from immediately before the reset occurred can be read out. The DBGCNT bits are not cleared by a system reset. Thus should a reset occur, the number of valid lines in the trace buffer is indicated by DBGCNT. The internal pointer to the current trace buffer address is initialized by unlocking the trace buffer thus points to the oldest valid data even if a reset occurred during the tracing session. Generally debugging occurrences of system resets is best handled using mid or end trigger alignment since the reset may occur before the trace trigger, which in the begin trigger alignment case means no information would be stored in the trace buffer. NOTE An external pin RESET that occurs simultaneous to a trace buffer entry can, in very seldom cases, lead to either that entry being corrupted or the first entry of the session being corrupted. In such cases the other contents of the trace buffer still contain valid tracing information. The case occurs when the reset assertion coincides with the trace buffer entry clock edge. 8.4.6 Tagging A tag follows program information as it advances through the instruction queue. When a tagged instruction reaches the head of the queue a tag hit occurs and triggers the state sequencer. Each comparator control register features a TAG bit, which controls whether the comparator match will cause a trigger immediately or tag the opcode at the matched address. If a comparator is enabled for tagged comparisons, the address stored in the comparator match address registers must be an opcode address for the trigger to occur. Both CPU12X and XGATE opcodes can be tagged with the comparator register TAG bits. Using Begin trigger together with tagging, if the tagged instruction is about to be executed then the transition to the next state sequencer state occurs. If the transition is to the Final State, tracing is started. Only upon completion of the tracing session can a breakpoint be generated. Similarly using Mid trigger with tagging, if the tagged instruction is about to be executed then the trace is continued for another 32 lines. Upon tracing completion the breakpoint is generated. Using End trigger, when the tagged instruction is about to be executed and the next transition is to Final State then a breakpoint is generated immediately, before the tagged instruction is carried out. Read/Write (R/W), access size (SZ) monitoring and data bus monitoring is not useful if tagged triggering is selected, since the tag is attached to the opcode at the matched address and is not dependent on the data bus nor on the type of access. Thus these bits are ignored if tagged triggering is selected. When configured for range comparisons and tagging, the ranges are accurate only to word boundaries. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 339 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module S12X tagging is disabled when the BDM becomes active. XGATE tagging is possible when the BDM is active. 8.4.6.1 External Tagging using TAGHI and TAGLO External tagging using the external TAGHI and TAGLO pins can only be used to tag CPU12X opcodes; tagging of XGATE code using these pins is not possible. An external tag triggers the state sequencer into state0 when the tagged opcode reaches the execution stage of the instruction queue. The pins operate independently, thus the state of one pin does not affect the function of the other. External tagging is possible in emulation modes only. The presence of logic level 0 on either pin at the rising edge of the external clock (ECLK) performs the function indicated in the Table 8-47. It is possible to tag both bytes of an instruction word. If a taghit occurs, a breakpoint can be generated as defined by the DBGBRK and BDM bits in DBGC1. Each time TAGHI or TAGLO are low on the rising edge of ECLK, the old tag is replaced by a new one. Table 8-47. Tag Pin Function TAGHI 1 1 0 0 TAGLO 1 0 1 0 Tag No tag Low byte High byte Both bytes 8.4.6.2 Unconditional Tagging Function In emulation modes a low assertion of PE5/TAGLO/MODA in the 7th or 8th bus cycle after reset enables the unconditional tagging function, allowing immediate tagging via TAGHI/TAGLO with breakpoint to BDM independent of the ARM, BDM and DBGBRK bits. Conversely these bits are not affected by unconditional tagging. The unconditional tagging function remains enabled until the next reset. This function allows an immediate entry to BDM in emulation modes before user code execution. The TAGLO assertion must be in the 7th or 8th bus cycle following the end of reset, whereby the prior RESET pin assertion lasts the full 192 bus cycles. 8.4.7 Breakpoints Breakpoints can be generated as follows. * Through XGATE software breakpoint requests. * From comparator channel triggers to final state. * Using software to write to the TRIG bit in the DBGC1 register. * From taghits generated using the external TAGHI and TAGLO pins. Breakpoints generated by the XGATE module or via the BDM BACKGROUND command have no affect on the CPU12X in STOP or WAIT mode. MC9S12XE-Family Reference Manual , Rev. 1.21 340 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.7.1 XGATE Software Breakpoints The XGATE software breakpoint instruction BRK can request a CPU12X breakpoint, via the S12XDBG module. In this case, if the XGSBPE bit is set, the S12XDBG module immediately generates a forced breakpoint request to the CPU12X, the state sequencer is returned to state0 and tracing, if active, is terminated. If configured for BEGIN trigger and tracing has not yet been triggered from another source, the trace buffer contains no information. Breakpoint requests from the XGATE module do not depend upon the state of the DBGBRK or ARM bits in DBGC1. They depend solely on the state of the XGSBPE and BDM bits. Thus it is not necessary to ARM the DBG module to use XGATE software breakpoints to generate breakpoints in the CPU12X program flow, but it is necessary to set XGSBPE. Furthermore, if a breakpoint to BDM is required, the BDM bit must also be set. When the XGATE requests an CPU12X breakpoint, the XGATE program flow stops by default, independent of the S12XDBG module. 8.4.7.2 Breakpoints From Internal Comparator Channel Final State Triggers Breakpoints can be generated when internal comparator channels trigger the state sequencer to the Final State. If configured for tagging, then the breakpoint is generated when the tagged opcode reaches the execution stage of the instruction queue. If a tracing session is selected by TSOURCE, breakpoints are requested when the tracing session has completed, thus if Begin or Mid aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 8-48). If no tracing session is selected, breakpoints are requested immediately. If the BRK bit is set on the triggering channel, then the breakpoint is generated immediately independent of tracing trigger alignment. Table 8-48. Breakpoint Setup For Both XGATE and CPU12X Breakpoints BRK 0 0 0 0 0 0 1 1 x TALIGN 00 00 01 01 10 10 00,01,10 00,01,10 11 DBGBRK[n] 0 1 0 1 0 1 1 0 x Breakpoint Alignment Fill Trace Buffer until trigger (no breakpoints -- keep running) Fill Trace Buffer until trigger, then breakpoint request occurs Start Trace Buffer at trigger (no breakpoints -- keep running) Start Trace Buffer at trigger A breakpoint request occurs when Trace Buffer is full Store a further 32 Trace Buffer line entries after trigger (no breakpoints -- keep running) Store a further 32 Trace Buffer line entries after trigger Request breakpoint after the 32 further Trace Buffer entries Terminate tracing and generate breakpoint immediately on trigger Terminate tracing immediately on trigger Reserved MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 341 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module 8.4.7.3 Breakpoints Generated Via The TRIG Bit If a TRIG triggers occur, the Final State is entered. If a tracing session is selected by TSOURCE, breakpoints are requested when the tracing session has completed, thus if Begin or Mid aligned triggering is selected, the breakpoint is requested only on completion of the subsequent trace (see Table 8-48). If no tracing session is selected, breakpoints are requested immediately. TRIG breakpoints are possible even if the S12XDBG module is disarmed. 8.4.7.4 Breakpoints Via TAGHI Or TAGLO Pin Taghits Tagging using the external TAGHI/TAGLO pins always ends the session immediately at the tag hit. It is always end aligned, independent of internal channel trigger alignment configuration. 8.4.7.5 S12XDBG Breakpoint Priorities XGATE software breakpoints have the highest priority. Active tracing sessions are terminated immediately. If a TRIG trigger occurs after Begin or Mid aligned tracing has already been triggered by a comparator instigated transition to Final State, then TRIG no longer has an effect. When the associated tracing session is complete, the breakpoint occurs. Similarly if a TRIG is followed by a subsequent trigger from a comparator channel, it has no effect, since tracing has already started. If a comparator tag hit occurs simultaneously with an external TAGHI/TAGLO hit, the state sequencer enters state0. TAGHI/TAGLO triggers are always end aligned, to end tracing immediately, independent of the tracing trigger alignment bits TALIGN[1:0]. 8.4.7.5.1 S12XDBG Breakpoint Priorities And BDM Interfacing Breakpoint operation is dependent on the state of the S12XBDM module. If the S12XBDM module is active, the CPU12X is executing out of BDM firmware and S12X breakpoints are disabled. In addition, while executing a BDM TRACE command, tagging into BDM is disabled. If BDM is not active, the breakpoint will give priority to BDM requests over SWI requests if the breakpoint coincides with a SWI instruction in the user's code. On returning from BDM, the SWI from user code gets executed. Table 8-49. Breakpoint Mapping Summary DBGBRK[1] (DBGC1[3]) 0 1 1 1 1 1 BDM Bit (DBGC1[4]) X 0 0 1 1 1 BDM Enabled X X X 0 1 1 BDM Active X 0 1 X 0 1 S12X Breakpoint Mapping No Breakpoint Breakpoint to SWI No Breakpoint Breakpoint to SWI Breakpoint to BDM No Breakpoint BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via a BGND instruction is attempted and the ENABLE bit in the BDM is cleared, the CPU12X actually MC9S12XE-Family Reference Manual , Rev. 1.21 342 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module executes the BDM firmware code. It checks the ENABLE and returns if ENABLE is not set. If not serviced by the monitor then the breakpoint is re-asserted when the BDM returns to normal CPU12X flow. If the comparator register contents coincide with the SWI/BDM vector address then an SWI in user code and DBG breakpoint could occur simultaneously. The CPU12X ensures that BDM requests have a higher priority than SWI requests. Returning from the BDM/SWI service routine care must be taken to avoid re triggering a breakpoint. NOTE When program control returns from a tagged breakpoint using an RTI or BDM GO command without program counter modification it will return to the instruction whose tag generated the breakpoint. To avoid re triggering a breakpoint at the same location reconfigure the S12XDBG module in the SWI routine, if configured for an SWI breakpoint, or over the BDM interface by executing a TRACE command before the GO to increment the program flow past the tagged instruction. An XGATE software breakpoint is forced immediately, the tracing session terminated and the XGATE module execution stops. The user can thus determine if an XGATE breakpoint has occurred by reading out the XGATE program counter over the BDM interface. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 343 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 8 S12X Debug (S12XDBGV3) Module MC9S12XE-Family Reference Manual , Rev. 1.21 344 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) Table 9-1. Revision History Revision Number V02.00 V02.01 V02.02 Revision Date 27 Aug 2004 21 Feb 2007 19 Apr 2007 Sections Affected Description of Changes - Reviewed and updated for S12XD architecture - Added S12XE, S12XF and S12XS architectures - Corrected statement about Backdoor key access via BDM on XE, XF, XS 9.1 Introduction NOTE No security feature is absolutely secure. However, Freescale's strategy is to make reading or copying the FLASH and/or EEPROM difficult for unauthorized users. This specification describes the function of the security mechanism in the S12XE chip family (9SEC). 9.1.1 Features The user must be reminded that part of the security must lie with the application code. An extreme example would be application code that dumps the contents of the internal memory. This would defeat the purpose of security. At the same time, the user may also wish to put a backdoor in the application program. An example of this is the user downloads a security key through the SCI, which allows access to a programming routine that updates parameters stored in another section of the Flash memory. The security features of the S12XE chip family (in secure mode) are: * Protect the content of non-volatile memories (Flash, EEPROM) * Execution of NVM commands is restricted * Disable access to internal memory via background debug module (BDM) * Disable access to internal Flash/EEPROM in expanded modes * Disable debugging features for the CPU and XGATE MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 345 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) 9.1.2 Modes of Operation Table 9-2. Feature Availability in Unsecure and Secure Modes on S12XE Unsecure Mode NS Flash Array Access EEPROM Array Access NVM Commands BDM DBG Module Trace XGATE Debugging External Bus Interface Internal status visible multiplexed on external bus (2) Table 9-2 gives an overview over availability of security relevant features in unsecure and secure modes. Secure Mode EX 1 2 SS -- -- NX (1) 2 ES 1 2 ST 1 -- NS 2 SS 2 NX -- -- 2 ES -- -- 2 EX -- -- 2 ST -- -- 2 -- -- -- -- -- -- -- -- -- -- -- -- (3) -- -- -- -- -- -- -- -- -- -- -- -- -- -- Internal accesses visible -- -- -- -- -- -- -- -- -- -- on external bus 1. Availability of Flash arrays in the memory map depends on ROMCTL/EROMCTL pins and/or the state of the ROMON/EROMON bits in the MMCCTL1 register. Please refer to the S12X_MMC block guide for detailed information. 2. Restricted NVM command set only. Please refer to the NVM wrapper block guides for detailed information. 3. BDM hardware commands restricted to peripheral registers only. 9.1.3 Securing the Microcontroller Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the security bits located in the options/security byte in the Flash memory array. These non-volatile bits will keep the device secured through reset and power-down. The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory array. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used for security (SEC[1:0]). On devices which have a memory page window, the Flash options/security byte is also available at address 0xBF0F by selecting page 0x3F with the PPAGE register. The contents of this byte are copied into the Flash security register (FSEC) during a reset sequence. 7 6 5 4 3 2 1 0 0xFF0F KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0 Figure 9-1. Flash Options/Security Byte The meaning of the bits KEYEN[1:0] is shown in Table 9-3. Please refer to Section 9.1.5.1, "Unsecuring the MCU Using the Backdoor Key Access" for more information. MC9S12XE-Family Reference Manual , Rev. 1.21 346 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) Table 9-3. Backdoor Key Access Enable Bits KEYEN[1:0] 00 01 10 11 Backdoor Key Access Enabled 0 (disabled) 0 (disabled) 1 (enabled) 0 (disabled) The meaning of the security bits SEC[1:0] is shown in Table 9-4. For security reasons, the state of device security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to SEC[1:0] = `10'. All other combinations put the device in a secured mode. The recommended value to put the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = `01'. Table 9-4. Security Bits SEC[1:0] 00 01 10 11 Security State 1 (secured) 1 (secured) 0 (unsecured) 1 (secured) NOTE Please refer to the Flash block guide for actual security configuration (in section "Flash Module Security"). 9.1.4 Operation of the Secured Microcontroller By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented. However, it must be understood that the security of the EEPROM and Flash memory contents also depends on the design of the application program. For example, if the application has the capability of downloading code through a serial port and then executing that code (e.g. an application containing bootloader code), then this capability could potentially be used to read the EEPROM and Flash memory contents even when the microcontroller is in the secure state. In this example, the security of the application could be enhanced by requiring a challenge/response authentication before any code can be downloaded. Secured operation has the following effects on the microcontroller: 9.1.4.1 * * * * Normal Single Chip Mode (NS) Background debug module (BDM) operation is completely disabled. Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 347 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) 9.1.4.2 * * * * * Special Single Chip Mode (SS) BDM firmware commands are disabled. BDM hardware commands are restricted to the register space. Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled. Special single chip mode means BDM is active after reset. The availability of BDM firmware commands depends on the security state of the device. The BDM secure firmware first performs a blank check of both the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off and the state of the security bits in the appropriate Flash memory location can be changed If the blank check fails, security will remain active, only the BDM hardware commands will be enabled, and the accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed and the options/security byte can be programmed to "unsecured" state via BDM. While the BDM is executing the blank check, the BDM interface is completely blocked, which means that all BDM commands are temporarily blocked. 9.1.4.3 * * * * * Expanded Modes (NX, ES, EX, and ST) BDM operation is completely disabled. Internal Flash memory and EEPROM are disabled. Execution of Flash and EEPROM commands is restricted. Please refer to the FTM block guide for details. Tracing code execution using the DBG module is disabled. Debugging XGATE code (breakpoints, single-stepping) is disabled 9.1.5 Unsecuring the Microcontroller Unsecuring the microcontroller can be done by three different methods: 1. Backdoor key access 2. Reprogramming the security bits 3. Complete memory erase (special modes) 9.1.5.1 Unsecuring the MCU Using the Backdoor Key Access In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key access method. This method requires that: * The backdoor key at 0xFF00-0xFF07 (= global addresses 0x7F_FF00-0x7F_FF07) has been programmed to a valid value. MC9S12XE-Family Reference Manual , Rev. 1.21 348 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) * * The KEYEN[1:0] bits within the Flash options/security byte select `enabled'. In single chip mode, the application program programmed into the microcontroller must be designed to have the capability to write to the backdoor key locations. The backdoor key values themselves would not normally be stored within the application data, which means the application program would have to be designed to receive the backdoor key values from an external source (e.g. through a serial port). The backdoor key access method allows debugging of a secured microcontroller without having to erase the Flash. This is particularly useful for failure analysis. NOTE No word of the backdoor key is allowed to have the value 0x0000 or 0xFFFF. 9.1.6 Reprogramming the Security Bits In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security bits within Flash options/security byte to the unsecured value. Because the erase operation will erase the entire sector from 0xFE00-0xFFFF (0x7F_FE00-0x7F_FFFF), the backdoor key and the interrupt vectors will also be erased; this method is not recommended for normal single chip mode. The application software can only erase and program the Flash options/security byte if the Flash sector containing the Flash options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of preventing this method. The microcontroller will enter the unsecured state after the next reset following the programming of the security bits to the unsecured value. This method requires that: * The application software previously programmed into the microcontroller has been designed to have the capability to erase and program the Flash options/security byte, or security is first disabled using the backdoor key method, allowing BDM to be used to issue commands to erase and program the Flash options/security byte. * The Flash sector containing the Flash options/security byte is not protected. 9.1.7 Complete Memory Erase (Special Modes) The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory contents. When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies whether the EEPROM and Flash memory are erased. If any EEPROM or Flash memory address is not erased, only BDM hardware commands are enabled. BDM hardware commands can then be used to write to the EEPROM and Flash registers to mass erase the EEPROM and all Flash memory blocks. When next reset into special single chip mode, the BDM firmware will again verify whether all EEPROM and Flash memory are erased, and this being the case, will enable all BDM commands, allowing the Flash options/security byte to be programmed to the unsecured value. The security bits SEC[1:0] in the Flash security register will indicate the unsecure state following the next reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 349 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 9 Security (S12XE9SECV2) MC9S12XE-Family Reference Manual , Rev. 1.21 350 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-1. Revision History Revision Number V03.22 V03.23 V03.24 Revision Date 06 Oct 2005 14 Dec 2005 17 Jan 2006 10.9.2/10-461 Sections Affected - Internal updates - Updated code example - Internal updates Description of Changes 10.1 Introduction The XGATE module is a peripheral co-processor that allows autonomous data transfers between the MCU's peripherals and the internal memories. It has a built in RISC core that is able to pre-process the transferred data and perform complex communication protocols. The XGATE module is intended to increase the MCU's data throughput by lowering the S12X_CPU's interrupt load. Figure 10-1 gives an overview on the XGATE architecture. This document describes the functionality of the XGATE module, including: * XGATE registers (Section 10.3, "Memory Map and Register Definition") * XGATE RISC core (Section 10.4.1, "XGATE RISC Core") * Hardware semaphores (Section 10.4.4, "Semaphores") * Interrupt handling (Section 10.5, "Interrupts") * Debug features (Section 10.6, "Debug Mode") * Security (Section 10.7, "Security") * Instruction set (Section 10.8, "Instruction Set") 10.1.1 Glossary of Terms XGATE Request A service request from a peripheral module which is directed to the XGATE by the S12X_INT module (see Figure 10-1). Each XGATE request attempts to activate a XGATE channel at a certain priority level. XGATE Channel The resources in the XGATE module (i.e. Channel ID number, Priority level, Service Request Vector, Interrupt Flag) which are associated with a particular XGATE Request. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 351 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XGATE Channel ID A 7-bit identifier associated with an XGATE channel. In S12XE designs valid Channel IDs range from $0D to $78. XGATE Priority Level A priority ranging from 1 to 7 which is associated with an XGATE channel. The priority level of an XGATE channel is selected in the S12X_INT module. XGATE Register Bank A register bank consists of registers R1-R7, CCR and the PC. Each interrupt level is associated with one register bank. XGATE Channel Interrupt An S12X_CPU interrupt that is triggered by a code sequence running on the XGATE module. XGATE Software Channel Special XGATE channel that is not associated with any peripheral service request. A Software Channel is triggered by its Software Trigger Bit which is implemented in the XGATE module. XGATE Semaphore A set of hardware flip-flops that can be exclusively set by either the S12X_CPU or the XGATE. (see Section 10.4.4, "Semaphores") XGATE Thread A code sequence which is executed by the XGATE's RISC core after receiving an XGATE request. XGATE Debug Mode A special mode in which the XGATE's RISC core is halted for debug purposes. This mode enables the XGATE's debug features (see Section 10.6, "Debug Mode"). XGATE Software Error The XGATE is able to detect a number of error conditions caused by erratic software (see Section 10.4.5, "Software Error Detection"). These error conditions will cause the XGATE to seize program execution and flag an Interrupt to the S12X_CPU. Word A 16 bit entity. Byte An 8 bit entity. 10.1.2 Features The XGATE module includes these features: * Data movement between various targets (i.e. Flash, RAM, and peripheral modules) * Data manipulation through built in RISC core MC9S12XE-Family Reference Manual , Rev. 1.21 352 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) * * * * * * Provides up to 108 XGATE channels, including 8 software triggered channels Interruptible thread execution Two register banks to support fast context switching between threads Hardware semaphores which are shared between the S12X_CPU and the XGATE module Able to trigger S12X_CPU interrupts upon completion of an XGATE transfer Software error detection to catch erratic application code 10.1.3 * Modes of Operation There are four run modes on S12XE devices. Run mode, wait mode, stop mode The XGATE is able to operate in all of these three system modes. Clock activity will be automatically stopped when the XGATE module is idle. Freeze mode (BDM active) In freeze mode all clocks of the XGATE module may be stopped, depending on the module configuration (see Section 10.3.1.1, "XGATE Control Register (XGMCTL)"). * 10.1.4 Block Diagram Figure 10-1 shows a block diagram of the XGATE. Peripheral Interrupts S12X_INT XGATE Interrupts (XGIF) XGATE Requests XGATE Interrupt Flags Semaphores Software Triggers RISC Core Software Triggers SWE Interrupt Software Error Logic Data/Code S12X_DBG Peripherals S12X_MMC Figure 10-1. XGATE Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 353 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.2 External Signal Description The XGATE module has no external pins. 10.3 Memory Map and Register Definition This section provides a detailed description of address space and registers used by the XGATE module. The memory map for the XGATE module is given below in Figure 10-2.The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reserved registers read zero. Write accesses to the reserved registers have no effect. 10.3.1 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bits and field functions follow the register diagrams, in bit order. Register Name 0x0000 R XGMCTL 15 0 14 0 13 0 12 0 11 0 10 0 9 0 XG SWEFM 8 0 7 6 5 4 3 2 0 1 0 XG XG XG XGEM XGSSM W FRZM DBGM FACTM XG XGE XGFRZ XGDBG XGSS FACT XGIEM 0 XG XGIE SWEF 0x0002 R XGCHID W 0x0003 R XGCHPL W 0x0004 R Reserved W 0x0005 R XGISPSEL W 0x0006 R XGISP74 W 0x0006 R XGISP31 W 0x0006 XGVBR R W = Unimplemented or Reserved XGCHID[6:0] 0 0 0 0 0 XGCHPL[2:0] 0 0 0 0 0 0 XGISPSEL[1:0] 0 0 0 XGISP74[15:1] XGISP31[15:1] XGVBR[15:1] Figure 10-2. XGATE Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 354 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 127 0x0008 XGIF R W 111 0x000A XGIF R W 0 126 0 125 0 124 0 123 0 122 0 121 0 120 119 118 117 116 115 114 113 112 XGIF_78 XGF_77 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGF_67 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60 95 0x000C XGIF R W 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGF_57 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50 79 0x000E XGIF R W 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40 63 0x0010 XGIF R W 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30 47 0x0012 XGIF R W 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20 31 0x0014 XGIF R W 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10 15 0x0016 XGIF R W 14 13 12 0 11 0 10 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0 XGIF_0F XGIF_0E XGIF_0D = Unimplemented or Reserved Figure 10-2. XGATE Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 355 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 15 0x0018 R XGSWTM W 0x001A R XGSEMM W 0x001C R Reserved W 0x001D XGCCR 0x001E XGPC R W R W 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 6 5 4 3 2 1 0 XGSWTM[7:0] 0 0 0 0 0 0 0 0 XGSWT[7:0] XGSEMM[7:0] XGSEM[7:0] 0 0 0 0 XGN XGZ XGV XGC XGPC 0x0020 R Reserved W 0x0021 R Reserved W 0x0022 XGR1 0x0024 XGR2 0x0026 XGR3 0x0028 XGR4 0x002A XGR5 0x002C XGR6 0x002E XGR7 R W R W R W R W R W R W R W = Unimplemented or Reserved XGR1 XGR2 XGR3 XGR4 XGR5 XGR6 XGR7 Figure 10-2. XGATE Register Summary (Sheet 3 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 356 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.1 XGATE Control Register (XGMCTL) All module level switches and flags are located in the XGATE Module Control Register Figure 10-3. Module Base +0x00000 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 XGEM 0 0 0 0 XG SSM 0 0 XG FACTM 0 0 0 0 XGE 0 XGFRZ XGDBG XGSS XGFACT 0 0 0 0 0 XG XG FRZM DBGM 0 0 XG XGIEM SWEFM 0 0 0 XG SWEF 0 XGIE 0 0 = Unimplemented or Reserved Figure 10-3. XGATE Control Register (XGMCTL) Read: Anytime Write: Anytime Table 10-2. XGMCTL Field Descriptions (Sheet 1 of 3) Field 15 XGEM Description XGE Mask -- This bit controls the write access to the XGE bit. The XGE bit can only be set or cleared if a "1" is written to the XGEM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGE in the same bus cycle 1 Enable write access to the XGE in the same bus cycle XGFRZ Mask -- This bit controls the write access to the XGFRZ bit. The XGFRZ bit can only be set or cleared if a "1" is written to the XGFRZM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGFRZ in the same bus cycle 1 Enable write access to the XGFRZ in the same bus cycle XGDBG Mask -- This bit controls the write access to the XGDBG bit. The XGDBG bit can only be set or cleared if a "1" is written to the XGDBGM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGDBG in the same bus cycle 1 Enable write access to the XGDBG in the same bus cycle XGSS Mask -- This bit controls the write access to the XGSS bit. The XGSS bit can only be set or cleared if a "1" is written to the XGSSM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGSS in the same bus cycle 1 Enable write access to the XGSS in the same bus cycle 14 XGFRZM 13 XGDBGM 12 XGSSM MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 357 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-2. XGMCTL Field Descriptions (Sheet 2 of 3) Field 11 XGFACTM Description XGFACT Mask -- This bit controls the write access to the XGFACT bit. The XGFACT bit can only be set or cleared if a "1" is written to the XGFACTM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGFACT in the same bus cycle 1 Enable write access to the XGFACT in the same bus cycle XGSWEF Mask -- This bit controls the write access to the XGSWEF bit. The XGSWEF bit can only be cleared 9 XGSWEFM if a "1" is written to the XGSWEFM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGSWEF in the same bus cycle 1 Enable write access to the XGSWEF in the same bus cycle 8 XGIEM XGIE Mask -- This bit controls the write access to the XGIE bit. The XGIE bit can only be set or cleared if a "1" is written to the XGIEM bit in the same register access. Read: This bit will always read "0". Write: 0 Disable write access to the XGIE in the same bus cycle 1 Enable write access to the XGIE in the same bus cycle XGATE Module Enable (Request Enable)-- This bit enables incoming XGATE requests from the S12X_INT module. If the XGE bit is cleared, pending XGATE requests will be ignored. The thread that is executed by the RISC core while the XGE bit is cleared will continue to run. Read: 0 Incoming requests are disabled 1 Incoming requests are enabled Write: 0 Disable incoming requests 1 Enable incoming requests Halt XGATE in Freeze Mode -- The XGFRZ bit controls the XGATE operation in Freeze Mode (BDM active). Read: 0 RISC core operates normally in Freeze (BDM active) 1 RISC core stops in Freeze Mode (BDM active) Write: 0 Don't stop RISC core in Freeze Mode (BDM active) 1 Stop RISC core in Freeze Mode (BDM active) XGATE Debug Mode -- This bit indicates that the XGATE is in Debug Mode (see Section 10.6, "Debug Mode"). Debug Mode can be entered by Software Breakpoints (BRK instruction), Tagged or Forced Breakpoints (see S12X_DBG Section), or by writing a "1" to this bit. Read: 0 RISC core is not in Debug Mode 1 RISC core is in Debug Mode Write: 0 Leave Debug Mode 1 Enter Debug Mode Note: Freeze Mode and Software Error Interrupts have no effect on the XGDBG bit. 7 XGE 6 XGFRZ 5 XGDBG MC9S12XE-Family Reference Manual , Rev. 1.21 358 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-2. XGMCTL Field Descriptions (Sheet 3 of 3) Field 4 XGSS Description XGATE Single Step -- This bit forces the execution of a single instruction.(1) Read: 0 No single step in progress 1 Single step in progress Write 0 No effect 1 Execute a single RISC instruction Note: Invoking a Single Step will cause the XGATE to temporarily leave Debug Mode until the instruction has been executed. Fake XGATE Activity -- This bit forces the XGATE to flag activity to the MCU even when it is idle. When it is set the MCU will never enter system stop mode which assures that peripheral modules will be clocked during XGATE idle periods Read: 0 XGATE will only flag activity if it is not idle or in debug mode. 1 XGATE will always signal activity to the MCU. Write: 0 Only flag activity if not idle or in debug mode. 1 Always signal XGATE activity. XGATE Software Error Flag -- This bit signals a software error. It is set whenever the RISC core detects an error condition(2). The RISC core is stopped while this bit is set. Clearing this bit will terminate the current thread and cause the XGATE to become idle. Read: 0 No software error detected 1 Software error detected Write: 0 No effect 1 Clears the XGSWEF bit 3 XGFACT 1 XGSWEF XGATE Interrupt Enable -- This bit acts as a global interrupt enable for the XGATE module Read: 0 All outgoing XGATE interrupts disabled (except software error interrupts) 1 All outgoing XGATE interrupts enabled Write: 0 Disable all outgoing XGATE interrupts (except software error interrupts) 1 Enable all outgoing XGATE interrupts 1. Refer to Section 10.6.1, "Debug Features" 2. Refer to Section 10.4.5, "Software Error Detection" 0 XGIE 10.3.1.2 XGATE Channel ID Register (XGCHID) The XGATE Channel ID Register (Figure 10-4) shows the identifier of the XGATE channel that is currently active. This register will read "$00" if the XGATE module is idle. In debug mode this register can be used to start and terminate threads. Refer to Section 10.6.1, "Debug Features" for further information. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 359 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Module Base +0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 XGCHID[6:0] 0 0 0 0 = Unimplemented or Reserved Figure 10-4. XGATE Channel ID Register (XGCHID) Read: Anytime Write: In Debug Mode1 Table 10-3. XGCHID Field Descriptions Field Description 6-0 Request Identifier -- ID of the currently active channel XGCHID[6:0] 10.3.1.3 XGATE Channel Priority Level (XGCHPL) The XGATE Channel Priority Level Register (Figure 10-5) shows the priority level of the current thread. In debug mode this register can be used to select a priority level when launching a thread (see Section 10.6.1, "Debug Features"). Module Base +0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 XGCHPL[2:0] 0 0 = Unimplemented or Reserved Figure 10-5. XGATE Channel Priority Level Register (XGCHPL) Read: Anytime Write: In Debug Mode1 Table 10-4. XGCHPL Field Descriptions Field 2-0 XGCHPL[2:0] Description Priority Level-- Priority level of the currently active channel 10.3.1.4 XGATE Initial Stack Pointer Select Register (XGISPSEL) The XGATE Initial Stack Pointer Select Register (Figure 10-6) determines the register which is mapped to address "Module Base +0x0006". A value of zero selects the Vector Base Register (XGVBR). Setting 1. Refer to Section 10.6.1, "Debug Features" MC9S12XE-Family Reference Manual , Rev. 1.21 360 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) this register to a channel priority level (non-zero value) selects the corresponding Initial Stack Pointer Registers XGISP74 or XGISP31 (see Table 10-6). Module Base +0x0005 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 XGISPSEL[1:0] 0 0 = Unimplemented or Reserved Figure 10-6. XGATE Initial Stack Pointer Select Register (XGISPSEL) Read: Anytime Write: Anytime Table 10-5. XGISPSEL Field Descriptions Field Description 1-0 Register select-- Determines whether XGISP74, XGISP31, or XGVBR is mapped to "Module Base +0x0006". XGISPSEL[1:0] See Table 10-6. Table 10-6. XGISP74, XGISP31, XGVBR Mapping XGISPSEL[1:0] 3 2 1 0 Register Mapped to "Module Base +0x0006" Reserved XGISP74 XGISP31 XGVBR 10.3.1.5 XGATE Initial Stack Pointer for Interrupt Priorities 7 to 4 (XGISP74) The XGISP74 register is intended to point to the stack region that is used by XGATE channels of priority 7 to 4. Every time a thread of such priority is started, RISC core register R7 will be initialized with the content of XGISP74. Module Base +0x0006 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 XGISP74[15:1] 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-7. XGATE Initial Stack Pointer for Interrupt Priorities 7 to 4 (XGISP74) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 361 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-7. XGISP74 Field Descriptions Field 15-1 XBISP74[15:1] Description Initial Stack Pointer-- The XGISP74 register holds the initial value of RISC core register R7, for threads of priority 7 to 4. 10.3.1.6 XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31) The XGISP31 register is intended to point to the stack region that is used by XGATE channels of priority 3 to 1. Every time a thread of such priority is started, RISC core register R7 will be initialized with the content of XGISP31. Module Base +0x0006 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 XGISP31[15:1] 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-8. XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) Table 10-8. XGISP31 Field Descriptions Field 15-1 XBISP31[15:1] Description Initial Stack Pointer-- The XGISP31 register holds the initial value of RISC core register R7, for threads of priority 3 to 1. 10.3.1.7 XGATE Vector Base Address Register (XGVBR) The Vector Base Address Register (Figure 10-9) determines the location of the XGATE vector block (see Section Figure 10-23., "XGATE Vector Block). Module Base +0x0006 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 1 1 1 1 1 1 1 XGVBR[15:1] 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-9. XGATE Vector Base Address Register (XGVBR) Read: Anytime Write: Only if XGATE requests are disabled (XGE = 0) and idle (XGCHID = $00)) MC9S12XE-Family Reference Manual , Rev. 1.21 362 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-9. XGVBR Field Descriptions Field Description 15-1 Vector Base Address -- The XGVBR register holds the start address of the vector block in the XGATE XBVBR[15:1] memory map. 10.3.1.8 XGATE Channel Interrupt Flag Vector (XGIF) The XGATE Channel Interrupt Flag Vector (Figure 10-10) provides access to the interrupt flags of all channels. Each flag may be cleared by writing a "1" to its bit location. Refer to Section 10.5.2, "Outgoing Interrupt Requests" for further information. Module Base +0x0008 127 126 125 124 123 122 121 120 XGIF_78 119 XGF_77 118 117 116 115 114 113 112 R W Reset 0 0 111 0 0 110 0 0 109 0 0 108 0 0 107 0 0 106 0 0 105 XGIF_76 XGIF_75 XGIF_74 XGIF_73 XGIF_72 XGIF_71 XGIF_70 0 104 0 103 XGF_67 0 102 0 101 0 100 0 99 0 98 0 97 0 96 R W Reset XGIF_6F XGIF_6E XGIF_6D XGIF_6C XGIF_6B XGIF_6A XGIF_69 XGIF_68 XGIF_66 XGIF_65 XGIF_64 XGIF_63 XGIF_62 XGIF_61 XGIF_60 0 95 0 94 0 93 0 92 0 91 0 90 0 89 0 88 0 87 XGF_57 0 86 0 85 0 84 0 83 0 82 0 81 0 80 R W Reset XGIF_5F XGIF_5E XGIF_5D XGIF_5C XGIF_5B XGIF_5A XGIF_59 XGIF_58 XGIF_56 XGIF_55 XGIF_54 XGIF_53 XGIF_52 XGIF_51 XGIF_50 0 79 0 78 0 77 0 76 0 75 0 74 0 73 0 72 0 71 0 70 0 69 0 68 0 67 0 66 0 65 0 64 R W Reset XGIF_4F XGIF_4E XGIF_4D XGIF_4C XGIF_4B XGIF_4A XGIF_49 XGIF_48 XGF _47 XGIF_46 XGIF_45 XGIF_44 XGIF_43 XGIF_42 XGIF_41 XGIF_40 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 10-10. XGATE Channel Interrupt Flag Vector (XGIF) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 363 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 R W Reset XGIF_3F XGIF_3E XGIF_3D XGIF_3C XGIF_3B XGIF_3A XGIF_39 XGIF_38 XGF _37 XGIF_36 XGIF_35 XGIF_34 XGIF_33 XGIF_32 XGIF_31 XGIF_30 0 47 46 0 45 0 44 0 43 0 42 0 41 0 40 0 39 0 38 0 37 0 36 0 35 0 34 0 33 0 32 0 R W Reset XGIF_2F XGIF_2E XGIF_2D XGIF_2C XGIF_2B XGIF_2A XGIF_29 XGIF_28 XGF _27 XGIF_26 XGIF_25 XGIF_24 XGIF_23 XGIF_22 XGIF_21 XGIF_20 0 31 0 30 0 29 0 28 0 27 0 26 0 25 0 24 0 23 0 22 0 21 0 20 0 19 0 18 0 17 0 16 R W Reset XGIF_1F XGIF_1E XGIF_1D XGIF_1C XGIF_1B XGIF_1A XGIF_19 XGIF_18 XGF _17 XGIF_16 XGIF_15 XGIF_14 XGIF_13 XGIF_12 XGIF_11 XGIF_10 0 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 R W Reset XGIF_0F XGIF_0E XGIF_0D 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 10-10. XGATE Channel Interrupt Flag Vector (XGIF) (continued) Read: Anytime Write: Anytime Table 10-10. XGIV Field Descriptions Field 127-9 XGIF[78:9] Description Channel Interrupt Flags -- These bits signal pending channel interrupts. They can only be set by the RISC core (see SIF instruction on page 10-447). Each flag can be cleared by writing a "1" to its bit location. Unimplemented interrupt flags will always read "0". Section "Interrupts" of the device overview for a list of implemented Interrupts. Read: 0 Channel interrupt is not pending 1 Channel interrupt is pending if XGIE is set Write: 0 No effect 1 Clears the interrupt flag MC9S12XE-Family Reference Manual , Rev. 1.21 364 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NOTE Suggested Mnemonics for accessing the interrupt flag vector on a word basis are: XGIF_7F_70 (XGIF[127:112]), XGIF_6F_60 (XGIF[111:96]), XGIF_5F_50 (XGIF[95:80]), XGIF_4F_40 (XGIF[79:64]), XGIF_3F_30 (XGIF[63:48]), XGIF_2F_20 (XGIF[47:32]), XGIF_1F_10 (XGIF[31:16]), XGIF_0F_00 (XGIF[15:0]) 10.3.1.9 XGATE Software Trigger Register (XGSWT) The eight software triggers of the XGATE module can be set and cleared through the XGATE Software Trigger Register (Figure 10-11). The upper byte of this register, the software trigger mask, controls the write access to the lower byte, the software trigger bits. These bits can be set or cleared if a "1" is written to the associated mask in the same bus cycle. Refer to Section 10.5.2, "Outgoing Interrupt Requests" for further information. Module Base +0x00018 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XGSWTM[7:0] XGSWT[7:0] 0 0 0 0 0 Figure 10-11. XGATE Software Trigger Register (XGSWT) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 365 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-11. XGSWT Field Descriptions Field Description 15-8 Software Trigger Mask -- These bits control the write access to the XGSWT bits. Each XGSWT bit can only XGSWTM[7:0] be written if a "1" is written to the corresponding XGSWTM bit in the same access. Read: These bits will always read "0". Write: 0 Disable write access to the XGSWT in the same bus cycle 1 Enable write access to the corresponding XGSWT bit in the same bus cycle 7-0 XGSWT[7:0] Software Trigger Bits -- These bits act as interrupt flags that are able to trigger XGATE software channels. They can only be set and cleared by software. Read: 0 No software trigger pending 1 Software trigger pending if the XGIE bit is set Write: 0 Clear Software Trigger 1 Set Software Trigger NOTE The XGATE channel IDs that are associated with the eight software triggers are determined on chip integration level. (see Section "Interrupts" of the device overview) XGATE software triggers work like any peripheral interrupt. They can be used as XGATE requests as well as S12X_CPU interrupts. The target of the software trigger must be selected in the S12X_INT module. 10.3.1.10 XGATE Semaphore Register (XGSEM) The XGATE provides a set of eight hardware semaphores that can be shared between the S12X_CPU and the XGATE RISC core. Each semaphore can either be unlocked, locked by the S12X_CPU or locked by the RISC core. The RISC core is able to lock and unlock a semaphore through its SSEM and CSEM instructions. The S12X_CPU has access to the semaphores through the XGATE Semaphore Register (Figure 10-12). Refer to section Section 10.4.4, "Semaphores" for details. Module Base +0x0001A 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XGSEMM[7:0] XGSEM[7:0] 0 0 0 0 0 Figure 10-12. XGATE Semaphore Register (XGSEM) Read: Anytime Write: Anytime (see Section 10.4.4, "Semaphores") MC9S12XE-Family Reference Manual , Rev. 1.21 366 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-12. XGSEM Field Descriptions Field Description 15-8 Semaphore Mask -- These bits control the write access to the XGSEM bits. XGSEMM[7:0] Read: These bits will always read "0". Write: 0 Disable write access to the XGSEM in the same bus cycle 1 Enable write access to the XGSEM in the same bus cycle 7-0 XGSEM[7:0] Semaphore Bits -- These bits indicate whether a semaphore is locked by the S12X_CPU. A semaphore can be attempted to be set by writing a "1" to the XGSEM bit and to the corresponding XGSEMM bit in the same write access. Only unlocked semaphores can be set. A semaphore can be cleared by writing a "0" to the XGSEM bit and a "1" to the corresponding XGSEMM bit in the same write access. Read: 0 Semaphore is unlocked or locked by the RISC core 1 Semaphore is locked by the S12X_CPU Write: 0 Clear semaphore if it was locked by the S12X_CPU 1 Attempt to lock semaphore by the S12X_CPU 10.3.1.11 XGATE Condition Code Register (XGCCR) The XGCCR register (Figure 10-13) provides access to the RISC core's condition code register. Module Base +0x001D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGN 0 XGZ 0 XGV 0 XGC 0 = Unimplemented or Reserved Figure 10-13. XGATE Condition Code Register (XGCCR) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-13. XGCCR Field Descriptions Field 3 XGN 2 XGZ 1 XGV 0 XGC Sign Flag -- The RISC core's Sign flag Zero Flag -- The RISC core's Zero flag Overflow Flag -- The RISC core's Overflow flag Carry Flag -- The RISC core's Carry flag Description MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 367 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.12 XGATE Program Counter Register (XGPC) The XGPC register (Figure 10-14) provides access to the RISC core's program counter. Module Base +0x0001E 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 XGPC 0 0 0 0 0 0 0 0 0 Figure 10-14. XGATE Program Counter Register (XGPC) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-14. XGPC Field Descriptions Field 15-0 XGPC[15:0] Description Program Counter -- The RISC core's program counter 10.3.1.13 XGATE Register 1 (XGR1) The XGR1 register (Figure 10-15) provides access to the RISC core's register 1. Module Base +0x00022 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR1 0 0 0 0 0 0 0 0 Figure 10-15. XGATE Register 1 (XGR1) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-15. XGR1 Field Descriptions Field 15-0 XGR1[15:0] Description XGATE Register 1 -- The RISC core's register 1 MC9S12XE-Family Reference Manual , Rev. 1.21 368 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.14 XGATE Register 2 (XGR2) The XGR2 register (Figure 10-16) provides access to the RISC core's register 2. Module Base +0x00024 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR2 0 0 0 0 0 0 0 0 Figure 10-16. XGATE Register 2 (XGR2) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-16. XGR2 Field Descriptions Field 15-0 XGR2[15:0] Description XGATE Register 2 -- The RISC core's register 2 10.3.1.15 XGATE Register 3 (XGR3) The XGR3 register (Figure 10-17) provides access to the RISC core's register 3. Module Base +0x00026 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR3 0 0 0 0 0 0 0 0 Figure 10-17. XGATE Register 3 (XGR3) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-17. XGR3 Field Descriptions Field 15-0 XGR3[15:0] Description XGATE Register 3 -- The RISC core's register 3 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 369 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.16 XGATE Register 4 (XGR4) The XGR4 register (Figure 10-18) provides access to the RISC core's register 4. Module Base +0x00028 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR4 0 0 0 0 0 0 0 0 Figure 10-18. XGATE Register 4 (XGR4) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-18. XGR4 Field Descriptions Field 15-0 XGR4[15:0] Description XGATE Register 4 -- The RISC core's register 4 10.3.1.17 XGATE Register 5 (XGR5) The XGR5 register (Figure 10-19) provides access to the RISC core's register 5. Module Base +0x0002A 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR5 0 0 0 0 0 0 0 0 Figure 10-19. XGATE Register 5 (XGR5) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-19. XGR5 Field Descriptions Field 15-0 XGR5[15:0] Description XGATE Register 5 -- The RISC core's register 5 MC9S12XE-Family Reference Manual , Rev. 1.21 370 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.3.1.18 XGATE Register 6 (XGR6) The XGR6 register (Figure 10-20) provides access to the RISC core's register 6. Module Base +0x0002C 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR6 0 0 0 0 0 0 0 0 Figure 10-20. XGATE Register 6 (XGR6) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-20. XGR6 Field Descriptions Field 15-0 XGR6[15:0] Description XGATE Register 6 -- The RISC core's register 6 10.3.1.19 XGATE Register 7 (XGR7) The XGR7 register (Figure 10-21) provides access to the RISC core's register 7. Module Base +0x0002E 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 XGR7 0 0 0 0 0 0 0 0 Figure 10-21. XGATE Register 7 (XGR7) Read: In debug mode if unsecured and not idle (XGCHID 0x00) Write: In debug mode if unsecured and not idle (XGCHID 0x00) Table 10-21. XGR7 Field Descriptions Field 15-0 XGR7[15:0] Description XGATE Register 7 -- The RISC core's register 7 10.4 Functional Description The core of the XGATE module is a RISC processor which is able to access the MCU's internal memories and peripherals (see Figure 10-1). The RISC processor always remains in an idle state until it is triggered by an XGATE request. Then it executes a code sequence (thread) that is associated with the requested XGATE channel. Each thread can run on a priority level ranging from 1 to 7. Refer to the S12X_INT MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 371 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Section for information on how to select priority levels for XGATE threads. Low priority threads (interrupt levels 1 to 3) can be interrupted by high priority threads (interrupt levels 4 to 7). High priority threads are not interruptible. The register content of an interrupted thread is maintained and restored by the XGATE hardware. To signal the completion of a task the XGATE is able to send interrupts to the S12X_CPU. Each XGATE channel has its own interrupt vector. Refer to the S12X_INT Section for detailed information. The XGATE module also provides a set of hardware semaphores which are necessary to ensure data consistency whenever RAM locations or peripherals are shared with the S12X_CPU. The following sections describe the components of the XGATE module in further detail. 10.4.1 XGATE RISC Core The RISC core is a 16 bit processor with an instruction set that is well suited for data transfers, bit manipulations, and simple arithmetic operations (see Section 10.8, "Instruction Set"). It is able to access the MCU's internal memories and peripherals without blocking these resources from the S12X_CPU1. Whenever the S12X_CPU and the RISC core access the same resource, the RISC core will be stalled until the resource becomes available again.1 The XGATE offers a high access rate to the MCU's internal RAM. Depending on the bus load, the RISC core can perform up to two RAM accesses per S12X_CPU bus cycle. Bus accesses to peripheral registers or flash are slower. A transfer rate of one bus access per S12X_CPU cycle can not be exceeded. The XGATE module is intended to execute short interrupt service routines that are triggered by peripheral modules or by software. 10.4.2 Programmer's Model Register Block 15 15 15 15 15 15 15 15 Program Counter 0 0 0 0 0 0 0 0 15 R7 (Stack Pointer) R6 R5 R4 R3 R2 R1(Data Pointer) R0 = 0 PC 0 Condition Code Register NZVC 3210 Figure 10-22. Programmer's Model 1. With the exception of PRR registers (see Section "S12X_MMC"). MC9S12XE-Family Reference Manual , Rev. 1.21 372 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) The programmer's model of the XGATE RISC core is shown in Figure 10-22. The processor offers a set of seven general purpose registers (R1 - R7), which serve as accumulators and index registers. An additional eighth register (R0) is tied to the value "$0000". Registers R1 and R7 have additional functionality. R1 is preloaded with the initial data pointer of the channel's service request vector (see Figure 10-23). R7 is either preloaded with the content of XGISP74 if the interrupt priority of the current channel is in the range 7 to 4, or it is with preloaded the content of XGISP31 if the interrupt priority of the current channel is in the range 3 to 1. The remaining general purpose registers will be reset to an unspecified value at the beginning of each thread. The 16 bit program counter allows the addressing of a 64 kbyte address space. The condition code register contains four bits: the sign bit (S), the zero flag (Z), the overflow flag (V), and the carry bit (C). The initial content of the condition code register is undefined. 10.4.3 Memory Map The XGATE's RISC core is able to access an address space of 64K bytes. The allocation of memory blocks within this address space is determined on chip level. Refer to the S12X_MMC Section for a detailed information. The XGATE vector block assigns a start address and a data pointer to each XGATE channel. Its position in the XGATE memory map can be adjusted through the XGVBR register (see Section 10.3.1.7, "XGATE Vector Base Address Register (XGVBR)"). Figure 10-23 shows the layout of the vector block. Each vector consists of two 16 bit words. The first contains the start address of the service routine. This value will be loaded into the program counter before a service routine is executed. The second word is a pointer to the service routine's data space. This value will be loaded into register R1 before a service routine is executed. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 373 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XGVBR +$0000 unused Code +$0024 Channel $09 Initial Program Counter Channel $09 Initial Data Pointer +$0028 Channel $0A Initial Program Counter Channel $0A Initial Data Pointer +$002C Channel $0B Initial Program Counter Channel $0B Initial Data Pointer +$0030 Channel $0C Initial Program Counter Channel $0C Initial Data Pointer Data Code +$01E0 Channel $78 Initial Program Counter Channel $78 Initial Data Pointer Data Figure 10-23. XGATE Vector Block 10.4.4 Semaphores The XGATE module offers a set of eight hardware semaphores. These semaphores provide a mechanism to protect system resources that are shared between two concurrent threads of program execution; one thread running on the S12X_CPU and one running on the XGATE RISC core. Each semaphore can only be in one of the three states: "Unlocked", "Locked by S12X_CPU", and "Locked by XGATE". The S12X_CPU can check and change a semaphore's state through the XGATE semaphore register (XGSEM, see Section 10.3.1.10, "XGATE Semaphore Register (XGSEM)"). The RISC core does this through its SSEM and CSEM instructions. IFigure 10-24 illustrates the valid state transitions. MC9S12XE-Family Reference Manual , Rev. 1.21 374 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) set_xgsem: clr_xgsem: ssem: csem: 1 is written to XGSEM[n] (and 1 is written to XGSEMM[n]) 0 is written to XGSEM[n] (and 1 is written to XGSEMM[n]) Executing SSEM instruction (on semaphore n) Executing CSEM instruction (on semaphore n) clr_xgsem csem LOCKED BY S12X_CPU LOCKED BY XGATE clr_xgsem ssem & set_xgsem csem ssem UNLOCKED ssem & set_xgsem Figure 10-24. Semaphore State Transitions Figure 10-25 gives an example of the typical usage of the XGATE hardware semaphores. Two concurrent threads are running on the system. One is running on the S12X_CPU and the other is running on the RISC core. They both have a critical section of code that accesses the same system resource. To guarantee that the system resource is only accessed by one thread at a time, the critical code sequence must be embedded in a semaphore lock/release sequence as shown. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 375 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) S12X_CPU ......... 1 XGSEM[n] XGATE ......... SSEM XGSEM[n] 1? BCC? critical code sequence critical code sequence 0 XGSEM[n] ......... CSEM ......... Figure 10-25. Algorithm for Locking and Releasing Semaphores 10.4.5 Software Error Detection Upon detecting an error condition caused by erratic application code, the XGATE module will immediately terminate program execution and trigger a non-maskable interrupt to the S12X_CPU. There are three error conditions: * Execution of an illegal opcode * Illegal opcode fetches * Illegal load or store accesses All opcodes which are not listed in section Section 10.8, "Instruction Set" are illegal opcodes. Illegal opcode fetches as well as illegal load and store accesses are defined on chip level. Refer to the S12X_MMC Section for a detailed information. NOTE When executing a branch (BCC, BCS,...), a jump (JAL) or an RTS instruction, the XGATE prefetches and discards the opcode of the following instruction. The XGATE will perform its software error handling actions (see above) if this opcode fetch is illegal. MC9S12XE-Family Reference Manual , Rev. 1.21 376 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.5 10.5.1 Interrupts Incoming Interrupt Requests XGATE threads are triggered by interrupt requests which are routed to the XGATE module (see S12X_INT Section). Only a subset of the MCU's interrupt requests can be routed to the XGATE. Which specific interrupt requests these are and which channel ID they are assigned to is documented in Section "Interrupts" of the device overview. 10.5.2 Outgoing Interrupt Requests There are three types of interrupt requests which can be triggered by the XGATE module: 4. Channel interrupts For each XGATE channel there is an associated interrupt flag in the XGATE interrupt flag vector (XGIF, see Section 10.3.1.8, "XGATE Channel Interrupt Flag Vector (XGIF)"). These flags can be set through the "SIF" instruction by the RISC core. They are typically used to flag an interrupt to the S12X_CPU when the XGATE has completed one of its task. 5. Software triggers Software triggers are interrupt flags, which can be set and cleared by software (see Section 10.3.1.9, "XGATE Software Trigger Register (XGSWT)"). They are typically used to trigger XGATE tasks by the S12X_CPU software. However these interrupts can also be routed to the S12X_CPU (see S12X_INT Section) and triggered by the XGATE software. 6. Software error interrupt The software error interrupt signals to the S12X_CPU the detection of an error condition in the XGATE application code (see Section 10.4.5, "Software Error Detection"). This is a non-maskable interrupt. Executing the interrupt service routine will automatically reset the interrupt line. All outgoing XGATE interrupts, except software error interrupts, can be disabled by the XGIE bit in the XGATE module control register (XGMCTL, see Section 10.3.1.1, "XGATE Control Register (XGMCTL)"). 10.6 Debug Mode The XGATE debug mode is a feature to allow debugging of application code. 10.6.1 Debug Features In debug mode the RISC core will be halted and the following debug features will be enabled: * Read and Write accesses to RISC core registers (XGCCR, XGPC, XGR1-XGR7)1 All RISC core registers can be modified. Leaving debug mode will cause the RISC core to continue program execution with the modified register values. 1. Only possible if MCU is unsecured MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 377 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) * * Single Stepping Writing a "1" to the XGSS bit will call the RISC core to execute a single instruction. All RISC core registers will be updated accordingly. Write accesses to the XGCHID register and the XGCHPL register XGATE threads can be initiated and terminated through a 16 write access to the XGCHID and the XGCHPL register or through a 8 bit write access to the XGCHID register. Detailed operation is shown in Table 10-22. Once a thread has been initiated it's code can be either single stepped or it can be executed by leaving debug mode. Table 10-22. Initiating and Terminating Threads in Debug Mode Register Content XGCHID 0 XGCHPL 0 Single Cycle Write Access to... XGCHID 1..127 XGCHPL -(1) Set new XGCHID Set XGCHPL to 0x01 Initiate new thread Set new XGCHID Set new XGCHPL Initiate new thread Interrupt current thread Set new XGCHID Set new XGCHPL Initiate new thread Terminate current thread. Resume interrupted thread or become idle if no interrupted thread is pending No action Action 0 0 1..127 0..7 1..127 0..3 1..127 4..7 0..7 1..127 0..7 0 -1 All other combinations 1. 8 bit write access to XGCHID NOTE Even though zero is not a valid interrupt priority level of the S12X_INT module, a thread of priority level 0 can be initiated in debug mode. The XGATE handles requests of priority level 0 in the same way as it handles requests of priority levels 1 to 3. NOTE All channels 1 to 127 can be initiated by writing to the XGCHID register, even if they are not assigned to any peripheral module. NOTE In Debug Mode the XGATE will ignore all requests from peripheral modules. 10.6.1.0.1 Entering Debug Mode Debug mode can be entered in four ways: 1. Setting XGDBG to "1" MC9S12XE-Family Reference Manual , Rev. 1.21 378 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Writing a "1" to XGDBG and XGDBGM in the same write access causes the XGATE to enter debug mode upon completion of the current instruction. NOTE After writing to the XGDBG bit the XGATE will not immediately enter debug mode. Depending on the instruction that is executed at this time there may be a delay of several clock cycles. The XGDBG will read "0" until debug mode is entered. 2. Software breakpoints XGATE programs which are stored in the internal RAM allow the use of software breakpoints. A software breakpoint is set by replacing an instruction of the program code with the "BRK" instruction. As soon as the program execution reaches the "BRK" instruction, the XGATE enters debug mode. Additionally a software breakpoint request is sent to the S12X_DBG module (see section 4.9 of the S12X_DBG Section). Upon entering debug mode, the program counter will point to the "BRK" instruction. The other RISC core registers will hold the result of the previous instruction. To resume program execution, the "BRK" instruction must be replaced by the original instruction before leaving debug mode. 3. Tagged Breakpoints The S12X_DBG module is able to place tags on fetched opcodes. The XGATE is able to enter debug mode right before a tagged opcode is executed (see section 4.9 of the S12X_DBG Section). Upon entering debug mode, the program counter will point to the tagged instruction. The other RISC core registers will hold the result of the previous instruction. 4. Forced Breakpoints Forced breakpoints are triggered by the S12X_DBG module (see section 4.9 of the S12X_DBG Section). When a forced breakpoint occurs, the XGATE will enter debug mode upon completion of the current instruction. 10.6.2 Leaving Debug Mode Debug mode can only be left by setting the XGDBG bit to "0". If a thread is active (XGCHID has not been cleared in debug mode), program execution will resume at the value of XGPC. 10.7 Security In order to protect XGATE application code on secured S12X devices, a few restrictions in the debug features have been made. These are: * Registers XGCCR, XGPC, and XGR1-XGR7 will read zero on a secured device * Registers XGCCR, XGPC, and XGR1-XGR7 can not be written on a secured device * Single stepping is not possible on a secured device MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 379 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8 10.8.1 Instruction Set Addressing Modes For the ease of implementation the architecture is a strict Load/Store RISC machine, which means all operations must have one of the eight general purpose registers R0 ... R7 as their source as well their destination. All word accesses must work with a word aligned address, that is A[0] = 0! 10.8.1.1 Naming Conventions Destination register, allowed range is R0-R7 Low byte of the destination register, bits [7:0] High byte of the destination register, bits [15:8] Source register, allowed range is R0-R7 Low byte of the source register, bits [7:0] High byte of the source register, bits[15:8] Base register for indexed addressing modes, allowed range is R0-R7 Offset register for indexed addressing modes with register offset, allowed range is R0-R7 Offset register for indexed addressing modes with register offset and post-increment, Allowed range is R0-R7 (R0+ is equivalent to R0) Offset register for indexed addressing modes with register offset and pre-decrement, Allowed range is R0-R7 (-R0 is equivalent to R0) RD RD.L RD.H RS, RS1, RS2 RS.L, RS1.L, RS2.L RS.H, RS1.H, RS2.H RB RI RI+ -RI NOTE Even though register R1 is intended to be used as a pointer to the data segment, it may be used as a general purpose data register as well. Selecting R0 as destination register will discard the result of the instruction. Only the condition code register will be updated 10.8.1.2 Inherent Addressing Mode (INH) Instructions that use this addressing mode either have no operands or all operands are in internal XGATE registers. Examples: BRK RTS MC9S12XE-Family Reference Manual , Rev. 1.21 380 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.3 Immediate 3-Bit Wide (IMM3) Operands for immediate mode instructions are included in the instruction stream and are fetched into the instruction queue along with the rest of the 16 bit instruction. The '#' symbol is used to indicate an immediate addressing mode operand. This address mode is used for semaphore instructions. Examples: CSEM SSEM #1 #3 ; Unlock semaphore 1 ; Lock Semaphore 3 10.8.1.4 Immediate 4 Bit Wide (IMM4) The 4 bit wide immediate addressing mode is supported by all shift instructions. RD = RD IMM4 Examples: LSL LSR R4,#1 R4,#3 ; R4 = R4 << 1; shift register R4 by 1 bit to the left ; R4 = R4 >> 3; shift register R4 by 3 bits to the right 10.8.1.5 Immediate 8 Bit Wide (IMM8) The 8 bit wide immediate addressing mode is supported by four major commands (ADD, SUB, LD, CMP). RD = RD imm8 Examples: ADDL SUBL LDH CMPL R1,#1 R2,#2 R3,#3 R4,#4 ; ; ; ; adds an 8 bit value to register R1 subtracts an 8 bit value from register R2 loads an 8 bit immediate into the high byte of Register R3 compares the low byte of register R4 with an immediate value 10.8.1.6 Immediate 16 Bit Wide (IMM16) The 16 bit wide immediate addressing mode is a construct to simplify assembler code. Instructions which offer this mode are translated into two opcodes using the eight bit wide immediate addressing mode. RD = RD IMM16 Examples: LDW ADD R4,#$1234 R4,#$5678 ; translated to LDL R4,#$34; LDH R4,#$12 ; translated to ADDL R4,#$78; ADDH R4,#$56 10.8.1.7 Monadic Addressing (MON) In this addressing mode only one operand is explicitly given. This operand can either be the source (f(RD)), the target (RD = f()), or both source and target of the operation (RD = f(RD)). Examples: JAL SIF R1 R2 ; PC = R1, R1 = PC+2 ; Trigger IRQ associated with the channel number in R2.L MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 381 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.8 Dyadic Addressing (DYA) In this mode the result of an operation between two registers is stored in one of the registers used as operands. RD = RD RS is the general register to register format, with register RD being the first operand and RS the second. RD and RS can be any of the 8 general purpose registers R0 ... R7. If R0 is used as the destination register, only the condition code flags are updated. This addressing mode is used only for shift operations with a variable shift value Examples: LSL LSR R4,R5 R4,R5 ; R4 = R4 << R5 ; R4 = R4 >> R5 10.8.1.9 Triadic Addressing (TRI) In this mode the result of an operation between two or three registers is stored into a third one. RD = RS1 RS2 is the general format used in the order RD, RS1, RS1. RD, RS1, RS2 can be any of the 8 general purpose registers R0 ... R7. If R0 is used as the destination register RD, only the condition code flags are updated. This addressing mode is used for all arithmetic and logical operations. Examples: ADC SUB R5,R6,R7 R5,R6,R7 ; R5 = R6 + R7 + Carry ; R5 = R6 - R7 10.8.1.10 Relative Addressing 9-Bit Wide (REL9) A 9-bit signed word address offset is included in the instruction word. This addressing mode is used for conditional branch instructions. Examples: BCC BEQ REL9 REL9 ; PC = PC + 2 + (REL9 << 1) ; PC = PC + 2 + (REL9 << 1) 10.8.1.11 Relative Addressing 10-Bit Wide (REL10) An 10-bit signed word address offset is included in the instruction word. This addressing mode is used for the unconditional branch instruction. Examples: BRA REL10 ; PC = PC + 2 + (REL10 << 1) 10.8.1.12 Index Register plus Immediate Offset (IDO5) (RS, #OFFS5) provides an unsigned offset from the base register. Examples: LDB STW R4,(R1,#OFFS5) R4,(R1,#OFFS5) ; loads a byte from (R1+OFFS5) into R4 ; stores R4 as a word to (R1+OFFS5) MC9S12XE-Family Reference Manual , Rev. 1.21 382 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.1.13 Index Register plus Register Offset (IDR) For load and store instructions (RS, RI) provides a variable offset in a register. Examples: LDB STW R4,(R1,R2) R4,(R1,R2) ; loads a byte from (R1+R2) into R4 ; stores R4 as a word to (R1+R2) 10.8.1.14 Index Register plus Register Offset with Post-increment (IDR+) [RS, RI+] provides a variable offset in a register, which is incremented after accessing the memory. In case of a byte access the index register will be incremented by one. In case of a word access it will be incremented by two. Examples: LDB STW R4,(R1,R2+) R4,(R1,R2+) ; loads a byte from (R1+R2) into R4, R2+=1 ; stores R4 as a word to (R1+R2), R2+=2 10.8.1.15 Index Register plus Register Offset with Pre-decrement (-IDR) [RS, -RI] provides a variable offset in a register, which is decremented before accessing the memory. In case of a byte access the index register will be decremented by one. In case of a word access it will be decremented by two. Examples: LDB STW R4,(R1,-R2) R4,(R1,-R2) ; R2 -=1, loads a byte from (R1+R2) into R4 ; R2 -=2, stores R4 as a word to (R1+R2) 10.8.2 10.8.2.1 Instruction Summary and Usage Load & Store Instructions Any register can be loaded either with an immediate or from the address space using indexed addressing modes. LDL LDW LDB RD,#IMM8 RD,(RB,RI) RD,(RB, RI+) ; loads an immediate 8 bit value to the lower byte of RD ; loads data using RB+RI as effective address ; loads data using RB+RI as effective address ; followed by an increment of RI depending on ; the size of the operation The same set of modes is available for the store instructions STB STW RS,(RB, RI) RS,(RB, RI+) ; stores data using RB+RI as effective address ; stores data using RB+RI as effective address ; followed by an increment of RI depending on ; the size of the operation. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 383 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.2.2 Logic and Arithmetic Instructions All logic and arithmetic instructions support the 8 bit immediate addressing mode (IMM8: RD = RD #IMM8) and the triadic addressing mode (TRI: RD = RS1 RS2). All arithmetic is considered as signed, sign, overflow, zero and carry flag will be updated. The carry will not be affected for logical operations. ADDL ANDH ADD SUB AND OR R2,#1 R4,#$FE R3,R4,R5 R3,R4,R5 R3,R4,R5 R3,R4,R5 ; increment R2 ; R4.H = R4.H & $FE, clear lower bit of higher byte ; R3 = R4 + R5 ; R3 = R4 - R5 ; R3 = R4 & R5 logical AND on the whole word ; R3 = R4 | R5 10.8.2.3 TFR Register - Register Transfers R3,CCR ; transfers the condition code register to the low byte of ; register R3 This group comprises transfers from and to some special registers Branch Instructions The branch offset is +255 words or -256 words counted from the beginning of the next instruction. Since instructions have a fixed 16 bit width, the branch offsets are word aligned by shifting the offset value by 2. BEQ label ; if Z flag = 1 branch to label An unconditional branch allows a +511 words or -512 words branch distance. BRA label 10.8.2.4 Shift Instructions Shift operations allow the use of a 4 bit wide immediate value to identify a shift width within a 16 bit word. For shift operations a value of 0 does not shift at all, while a value of 15 shifts the register RD by 15 bits. In a second form the shift value is contained in the bits 3:0 of the register RS. Examples: LSL LSR ASR R4,#1 R4,#3 R4,R2 ; R4 = R4 << 1; shift register R4 by 1 bit to the left ; R4 = R4 >> 3; shift register R4 by 3 bits to the right ; R4 = R4 >> R2;arithmetic shift register R4 right by the amount ; of bits contained in R2[3:0]. MC9S12XE-Family Reference Manual , Rev. 1.21 384 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.2.5 Bit Field Operations This addressing mode is used to identify the position and size of a bit field for insertion or extraction. The width and offset are coded in the lower byte of the source register 2, RS2. The content of the upper byte is ignored. An offset of 0 denotes the right most position and a width of 0 denotes 1 bit. These instructions are very useful to extract, insert, clear, set or toggle portions of a 16 bit word 7 15 43 W4 O4 5 2 W4=3, O4=2 0 RS2 0 RS1 Bit Field Extract Bit Field Insert 15 3 0 RD Figure 10-26. Bit Field Addressing BFEXT R3,R4,R5 ; R5: W4+1 bits with offset O4, will be extracted from R4 into R3 10.8.2.6 Special Instructions for DMA Usage The XGATE offers a number of additional instructions for flag manipulation, program flow control and debugging: 1. SIF: Set a channel interrupt flag 2. SSEM: Test and set a hardware semaphore 3. CSEM: Clear a hardware semaphore 4. BRK: Software breakpoint 5. NOP: No Operation 6. RTS: Terminate the current thread 10.8.3 Cycle Notation Table 10-23 show the XGATE access detail notation. Each code letter equals one XGATE cycle. Each letter implies additional wait cycles if memories or peripherals are not accessible. Memories or peripherals are not accessible if they are blocked by the S12X_CPU. In addition to this Peripherals are only accessible every other XGATE cycle. Uppercase letters denote 16 bit operations. Lowercase letters denote 8 bit operations. The XGATE is able to perform two bus or wait cycles per S12X_CPU cycle. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 385 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-23. Access Detail Notation V -- Vector fetch: always an aligned word read, lasts for at least one RISC core cycle P -- Program word fetch: always an aligned word read, lasts for at least one RISC core cycle r -- 8 bit data read: lasts for at least one RISC core cycle R -- 16 bit data read: lasts for at least one RISC core cycle w -- 8 bit data write: lasts for at least one RISC core cycle W -- 16 bit data write: lasts for at least one RISC core cycle A -- Alignment cycle: no read or write, lasts for zero or one RISC core cycles f -- Free cycle: no read or write, lasts for one RISC core cycles Special Cases PP/P -- Branch: PP if branch taken, P if not 10.8.4 Thread Execution When the RISC core is triggered by an interrupt request (see Figure 10-1) it first executes a vector fetch sequence which performs three bus accesses: 1. A V-cycle to fetch the initial content of the program counter. 2. A V-cycle to fetch the initial content of the data segment pointer (R1). 3. A P-cycle to load the initial opcode. Afterwards a sequence of instructions (thread) is executed which is terminated by an "RTS" instruction. If further interrupt requests are pending after a thread has been terminated, a new vector fetch will be performed. Otherwise the RISC core will either resume a previous thread (beginning with a P-cycle to refetch the interrupted opcode) or it will become idle until a new interrupt request is received. A thread can only be interrupted by an interrupt request of higher priority. 10.8.5 Instruction Glossary This section describes the XGATE instruction set in alphabetical order. MC9S12XE-Family Reference Manual , Rev. 1.21 386 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADC Operation RS1 + RS2 + C RD Add with Carry ADC Adds the content of register RS1, the content of register RS2 and the value of the Carry bit using binary addition and stores the result in the destination register RD. The Zero Flag is also carried forward from the previous operation allowing 32 and more bit additions. Example: ADD ADC BCC R6,R2,R2 R7,R3,R3 ; R7:R6 = R5:R4 + R3:R2 ; conditional branch on 32 bit addition CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000 and Z was set before this operation; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Code and CPU Cycles Source Form ADC RD, RS1, RS2 Address Mode TRI 0 0 0 1 1 Machine Code RD RS1 RS2 1 1 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 387 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADD Operation Add without Carry ADD RS1 + RS2 RD RD + IMM16 RD (translates to ADDL RD, #IMM16[7:0]; ADDH RD, #IMM16[15:8]) Performs a 16 bit addition and stores the result in the destination register RD. NOTE When using immediate addressing mode (ADD RD, #IMM16), the V-flag and the C-Flag of the first instruction (ADDL RD, #IMM16[7:0]) are not considered by the second instruction (ADDH RD, #IMM16[15:8]). Don't rely on the V-Flag if RD + IMM16[7:0] 215. Don't rely on the C-Flag if RD + IMM16[7:0] 216. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Refer to ADDH instruction for #IMM16 operations. Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Refer to ADDH instruction for #IMM16 operations. Code and CPU Cycles Source Form ADD RD, RS1, RS2 ADD RD, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 1 1 0 1 1 1 0 0 1 0 1 Machine Code RD RD RD RS1 RS2 IMM16[7:0] IMM16[15:8] 1 0 Cycles P P P MC9S12XE-Family Reference Manual , Rev. 1.21 388 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADDH Operation RD + IMM8:$00 RD Add Immediate 8 bit Constant (High Byte) ADDH Adds the content of high byte of register RD and a signed immediate 8 bit constant using binary addition and stores the result in the high byte of the destination register RD. This instruction can be used after an ADDL for a 16 bit immediate addition. Example: ADDL ADDH R2,#LOWBYTE R2,#HIGHBYTE ; R2 = R2 + 16 bit immediate CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old & IMM8[7] & RD[15]new | RD[15]old & IMM8[7] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & IMM8[7] | RD[15]old & RD[15]new | IMM8[7] & RD[15]new Code and CPU Cycles Source Form ADDH RD, #IMM8 Address Mode IMM8 1 1 1 0 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 389 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ADDL Operation RD + $00:IMM8 RD Add Immediate 8 bit Constant (Low Byte) ADDL Adds the content of register RD and an unsigned immediate 8 bit constant using binary addition and stores the result in the destination register RD. This instruction must be used first for a 16 bit immediate addition in conjunction with the ADDH instruction. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the 8 bit operation; cleared otherwise. RD[15]old & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & RD[15]new Code and CPU Cycles Source Form ADDL RD, #IMM8 Address Mode IMM8 1 1 1 0 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 390 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) AND Operation Logical AND AND RS1 & RS2 RD RD & IMM16 RD (translates to ANDL RD, #IMM16[7:0]; ANDH RD, #IMM16[15:8]) Performs a bit wise logical AND of two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (AND RD, #IMM16), the Z-flag of the first instruction (ANDL RD, #IMM16[7:0]) is not considered by the second instruction (ANDH RD, #IMM16[15:8]). Don't rely on the Z-Flag. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to ANDH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form AND RD, RS1, RS2 AND RD, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 0 0 0 0 0 1 0 0 0 0 1 Machine Code RD RD RD RS1 RS2 IMM16[7:0] IMM16[15:8] 0 0 Cycles P P P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 391 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ANDH Operation RD.H & IMM8 RD.H Logical AND Immediate 8 bit Constant (High Byte) ANDH Performs a bit wise logical AND between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ANDH RD, #IMM8 Address Mode IMM8 1 0 0 0 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 392 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ANDL Operation RD.L & IMM8 RD.L Logical AND Immediate 8 bit Constant (Low Byte) ANDL Performs a bit wise logical AND between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ANDL RD, #IMM8 Address Mode IMM8 1 0 0 0 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 393 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ASR Operation b15 Arithmetic Shift Right ASR C n RD n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with the sign bit (RD[15]). The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form ASR RD, #IMM4 ASR RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 0 0 0 0 1 1 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 394 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BCC Operation Branch if Carry Cleared (Same as BHS) BCC If C = 0, then PC + $0002 + (REL9 << 1) PC Tests the Carry flag and branches if C = 0. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BCC REL9 Address Mode REL9 0 0 1 0 0 0 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 395 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BCS Operation Branch if Carry Set (Same as BLO) BCS If C = 1, then PC + $0002 + (REL9 << 1) PC Tests the Carry flag and branches if C = 1. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BCS REL9 Address Mode REL9 0 0 1 0 0 0 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 396 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BEQ Operation Tests the Zero flag and branches if Z = 1. CCR Effect N Z V C Branch if Equal BEQ If Z = 1, then PC + $0002 + (REL9 << 1) PC -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BEQ REL9 Address Mode REL9 0 0 1 0 0 1 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 397 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFEXT Operation Bit Field Extract BFEXT RS1[(o+w):o] RD[w:0]; 0 RD[15:(w+1)] w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position o and writes them right aligned into register RD. The remaining bits in RD will be cleared. If (o+w) > 15 only bits [15:o] get extracted. 15 7 W4 15 5 2 4 3 O4 0 RS1 Bit Field Extract 0 RS2 W4=3, O4=2 15 0 3 0 RD CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFEXT RD, RS1, RS2 Address Mode TRI 0 1 1 0 0 Machine Code RD RS1 RS2 1 1 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 398 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFFO Operation FirstOne(RS) RD; Bit Field Find First One BFFO Searches the first "1" in register RS (from MSB to LSB) and writes the bit position into the destination register RD. The upper bits of RD are cleared. In case the content of RS is equal to $0000, RD will be cleared and the carry flag will be set. This is used to distinguish a "1" in position 0 versus no "1" in the whole RS register at all. CCR Effects N Z V C 0 0 N: 0; cleared. Z: Set if the result is $0000; cleared otherwise. V: 0; cleared. C: Set if RS = $0000(1); cleared otherwise. 1. Before executing the instruction Code and CPU Cycles Source Form BFFO RD, RS Address Mode DYA 0 0 0 0 1 Machine Code RD RS 1 0 0 0 0 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 399 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINS Operation RS1[w:0] RD[(w+o):o]; w = (RS2[7:4]) o = (RS2[3:0]) Bit Field Insert BFINS Extracts w+1 bits from register RS1 starting at position 0 and writes them into register RD starting at position o. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to clear bits. 15 7 W4 15 3 4 3 O4 0 RS1 Bit Field Insert 15 5 2 0 RD 0 RS2 W4=3, O4=2 CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINS RD, RS1, RS2 Address Mode TRI 0 1 1 0 1 Machine Code RD RS1 RS2 1 1 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 400 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINSI Operation !RS1[w:0] RD[w+o:o]; w = (RS2[7:4]) o = (RS2[3:0]) Bit Field Insert and Invert BFINSI Extracts w+1 bits from register RS1 starting at position 0, inverts them and writes into register RD starting at position o. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to set bits. 15 7 W4 15 3 4 3 O4 0 RS1 Inverted Bit Field Insert 15 5 2 0 RD 0 RS2 W4=3, O4=2 CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINSI RD, RS1, RS2 Address Mode TRI 0 1 1 1 0 Machine Code RD RS1 RS2 1 1 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 401 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BFINSX Operation Bit Field Insert and XNOR BFINSX !(RS1[w:0] ^ RD[w+o:o]) RD[w+o:o]; w = (RS2[7:4]) o = (RS2[3:0]) Extracts w+1 bits from register RS1 starting at position 0, performs an XNOR with RD[w+o:o] and writes the bits back to RD. The remaining bits in RD are not affected. If (o+w) > 15 the upper bits are ignored. Using R0 as a RS1, this command can be used to toggle bits. 15 7 W4 15 3 4 3 O4 0 RS1 Bit Field Insert XNOR 15 5 2 0 RD 0 RS2 W4=3, O4=2 CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BFINSX RD, RS1, RS2 Address Mode TRI 0 1 1 1 1 Machine Code RD RS1 RS2 1 1 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 402 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BGE Operation Branch if RS1 RS2: SUB BGE Branch if Greater than or Equal to Zero BGE If N ^ V = 0, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare signed numbers. R0,RS1,RS2 REL9 CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BGE REL9 Address Mode REL9 0 0 1 1 0 1 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 403 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BGT Operation Branch if RS1 > RS2: SUB BGT R0,RS1,RS2 REL9 Branch if Greater than Zero BGT If Z | (N ^ V) = 0, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare signed numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BGT REL9 Address Mode REL9 0 0 1 1 1 0 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 404 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BHI Operation Branch if RS1 > RS2: SUB BHI R0,RS1,RS2 REL9 Branch if Higher BHI If C | Z = 0, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare unsigned numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BHI REL9 Address Mode REL9 0 0 1 1 0 0 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 405 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BHS Operation Branch if RS1 RS2: SUB BHS R0,RS1,RS2 REL9 Branch if Higher or Same (Same as BCC) BHS If C = 0, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare unsigned numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BHS REL9 Address Mode REL9 0 0 1 0 0 0 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 406 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BITH Operation RD.H & IMM8 NONE Bit Test Immediate 8 bit Constant (High Byte) BITH Performs a bit wise logical AND between the high byte of register RD and an immediate 8 bit constant. Only the condition code flags get updated, but no result is written back. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BITH RD, #IMM8 Address Mode IMM8 1 0 0 1 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 407 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BITL Operation RD.L & IMM8 NONE Bit Test Immediate 8 bit Constant (Low Byte) BITL Performs a bit wise logical AND between the low byte of register RD and an immediate 8 bit constant. Only the condition code flags get updated, but no result is written back. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form BITL RD, #IMM8 Address Mode IMM8 1 0 0 1 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 408 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLE Operation Branch if RS1 RS2: SUB BLE R0,RS1,RS2 REL9 Branch if Less or Equal to Zero BLE If Z | (N ^ V) = 1, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare signed numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLE REL9 Address Mode REL9 0 0 1 1 1 0 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 409 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLO Operation Branch if RS1 < RS2: SUB BLO R0,RS1,RS2 REL9 Branch if Carry Set (Same as BCS) BLO If C = 1, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare unsigned numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLO REL9 Address Mode REL9 0 0 1 0 0 0 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 410 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLS Operation Branch if RS1 RS2: SUB BLS R0,RS1,RS2 REL9 Branch if Lower or Same BLS If C | Z = 1, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare unsigned numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLS REL9 Address Mode REL9 0 0 1 1 0 0 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 411 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BLT Operation Branch if RS1 < RS2: SUB BLT R0,RS1,RS2 REL9 Branch if Lower than Zero BLT If N ^ V = 1, then PC + $0002 + (REL9 << 1) PC Branch instruction to compare signed numbers. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BLT REL9 Address Mode REL9 0 0 1 1 0 1 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 412 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BMI Operation Tests the sign flag and branches if N = 1. CCR Effects N Z V C Branch if Minus BMI If N = 1, then PC + $0002 + (REL9 << 1) PC -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BMI REL9 Address Mode REL9 0 0 1 0 1 0 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 413 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BNE Operation Branch if Not Equal BNE If Z = 0, then PC + $0002 + (REL9 << 1) PC Tests the Zero flag and branches if Z = 0. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BNE REL9 Address Mode REL9 0 0 1 0 0 1 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 414 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BPL Operation Tests the Sign flag and branches if N = 0. CCR Effects N Z V C Branch if Plus BPL If N = 0, then PC + $0002 + (REL9 << 1) PC -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BPL REL9 Address Mode REL9 0 0 1 0 1 0 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 415 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BRA Operation PC + $0002 + (REL10 << 1) PC Branches always. CCR Effects N Z V C Branch Always BRA -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BRA REL10 Address Mode REL10 0 0 1 1 1 1 Machine Code REL10 Cycles PP MC9S12XE-Family Reference Manual , Rev. 1.21 416 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BRK Operation Break BRK Put XGATE into Debug Mode (see Section 10.6.1.0.1, "Entering Debug Mode") and signals a software breakpoint to the S12X_DBG module (see section 4.9 of the S12X_DBG Section). NOTE It is not possible to single step over a BRK instruction. This instruction does not advance the program counter. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BRK Address Mode INH 0 0 0 0 0 0 Machine Code 0 0 0 0 0 0 0 0 0 0 Cycles PAff MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 417 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BVC Operation Branch if Overflow Cleared BVC If V = 0, then PC + $0002 + (REL9 << 1) PC Tests the Overflow flag and branches if V = 0. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BVC REL9 Address Mode REL9 0 0 1 0 1 1 Machine Code 0 REL9 Cycles PP/P MC9S12XE-Family Reference Manual , Rev. 1.21 418 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) BVS Operation Branch if Overflow Set BVS If V = 1, then PC + $0002 + (REL9 << 1) PC Tests the Overflow flag and branches if V = 1. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form BVS REL9 Address Mode REL9 0 0 1 0 1 1 Machine Code 1 REL9 Cycles PP/P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 419 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CMP Operation Compare CMP RS1 - RS2 NONE (translates to SUB R0, RS1, RS2) RD - IMM16 NONE (translates to CMPL RD, #IMM16[7:0]; CPCH RD, #IMM16[15:8]) Subtracts two 16 bit values and discards the result. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15] RD[15] & IMM16[15] & result[15] | RD[15] & IMM16[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15] RD[15] & IMM16[15] | RD[15] & result[15] | IMM16[15] & result[15] Code and CPU Cycles Source Form CMP RS1, RS2 CMP RS, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 1 1 0 0 0 1 1 1 1 0 1 0 Machine Code 0 RS RS 0 RS1 RS2 IMM16[7:0] IMM16[15:8] 0 0 Cycles P P P MC9S12XE-Family Reference Manual , Rev. 1.21 420 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CMPL Operation Compare Immediate 8 bit Constant (Low Byte) CMPL RS.L - IMM8 NONE, only condition code flags get updated Subtracts the 8 bit constant IMM8 contained in the instruction code from the low byte of the source register RS.L using binary subtraction and updates the condition code register accordingly. Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers can be performed by using the subtract instruction with R0 as destination register. CCR Effects N Z V C N: Z: V: C: Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. Set if a twos complement overflow resulted from the 8 bit operation; cleared otherwise. RS[7] & IMM8[7] & result[7] | RS[7] & IMM8[7] & result[7] Set if there is a carry from the Bit 7 to Bit 8 of the result; cleared otherwise. RS[7] & IMM8[7] | RS[7] & result[7] | IMM8[7] & result[7] Code and CPU Cycles Source Form CMPL RS, #IMM8 Address Mode IMM8 1 1 0 1 0 Machine Code RS IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 421 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) COM Operation One's Complement COM ~RS RD (translates to XNOR RD, R0, RS) ~RD RD (translates to XNOR RD, R0, RD) Performs a one's complement on a general purpose register. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form COM RD, RS COM RD Address Mode TRI TRI 0 0 0 0 0 0 1 1 0 0 Machine Code RD RD 0 0 0 0 0 0 RS RD 1 1 1 1 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 422 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CPC Operation Compare with Carry CPC RS1 - RS2 - C NONE (translates to SBC R0, RS1, RS2) Subtracts the carry bit and the content of register RS2 from the content of register RS1 using binary subtraction and discards the result. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & result[15] | RS1[15] & RS2[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & result[15] | RS2[15] & result[15] Code and CPU Cycles Source Form CPC RS1, RS2 Address Mode TRI 0 0 0 1 1 0 Machine Code 0 0 RS1 RS2 0 1 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 423 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CPCH Operation Compare Immediate 8 bit Constant with Carry (High Byte) CPCH RS.H - IMM8 - C NONE, only condition code flags get updated Subtracts the carry bit and the 8 bit constant IMM8 contained in the instruction code from the high byte of the source register RD using binary subtraction and updates the condition code register accordingly. The carry bit and Zero bits are taken into account to allow a 16 bit compare in the form of CMPL CPCH BCC R2,#LOWBYTE R2,#HIGHBYTE ; branch condition Remark: There is no equivalent operation using triadic addressing. Comparing the values of two registers can be performed by using the subtract instruction with R0 as destination register. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $00 and Z was set before this operation; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS[15] & IMM8[7] & result[15] | RS[15] & IMM8[7] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS[15] & IMM8[7] | RS[15] & result[15] | IMM8[7] & result[15] Code and CPU Cycles Source Form CPCH RD, #IMM8 Address Mode IMM8 1 1 0 1 1 Machine Code RS IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 424 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSEM Operation Clear Semaphore CSEM Unlocks a semaphore that was locked by the RISC core. In monadic address mode, bits RS[2:0] select the semaphore to be cleared. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form CSEM #IMM3 CSEM RS Address Mode IMM3 MON 0 0 0 0 0 0 0 0 0 0 Machine Code IMM3 RS 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 Cycles PA PA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 425 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSL Operation C Logical Shift Left with Carry CSL C C n bits n RD C C n = RS or IMM4 Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with the carry flag. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form CSL RD, #IMM4 CSL RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 0 0 1 1 0 0 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 426 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) CSR Operation C C C n bits Logical Shift Right with Carry CSR C n C RD n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with the carry flag. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 if IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form CSR RD, #IMM4 CSR RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 0 0 1 1 1 1 Cycles P P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 427 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) JAL Operation PC + $0002 RD; RD PC Jump and Link JAL Jumps to the address stored in RD and saves the return address in RD. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form JAL RD Address Mode MON 0 0 0 0 0 Machine Code RD 1 1 1 1 0 1 1 0 Cycles PP MC9S12XE-Family Reference Manual , Rev. 1.21 428 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDB Operation M[RB, #OFFS5] M[RB, RI] M[RB, RI] RI-1 RD.L; RD.L; RD.L; RI; Load Byte from Memory (Low Byte) LDB $00 RD.H $00 RD.H $00 RD.H; M[RS, RI] RD.L; RI+1 RI;1 $00 RD.H Loads a byte from memory into the low byte of register RD. The high byte is cleared. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDB RD, (RB, #OFFS5) LDB RD, (RS, RI) LDB RD, (RS, RI+) LDB RD, (RS, -RI) Address Mode IDO5 IDR IDR+ -IDR 0 0 0 0 1 1 1 1 0 1 1 1 0 0 0 0 0 0 0 0 Machine Code RD RD RD RD RB RB RB RB OFFS5 RI RI RI 0 0 1 0 1 0 Cycles Pr Pr Pr Pr 1. If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not be incremented after the data move: M[RB, RI] RD.L; $00 RD.H MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 429 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDH Operation IMM8 RD.H; Load Immediate 8 bit Constant (High Byte) LDH Loads an 8 bit immediate constant into the high byte of register RD. The low byte is not affected. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDH RD, #IMM8 Address Mode IMM8 1 1 1 1 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 430 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDL Operation IMM8 RD.L; $00 RD.H Load Immediate 8 bit Constant (Low Byte) LDL Loads an 8 bit immediate constant into the low byte of register RD. The high byte is cleared. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDL RD, #IMM8 Address Mode IMM8 1 1 1 1 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 431 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LDW Operation M[RB, #OFFS5] M[RB, RI] M[RB, RI] RI-2 IMM16 Load Word from Memory LDW RD RD RD; RI+2 RI1 RI; M[RS, RI] RD RD (translates to LDL RD, #IMM16[7:0]; LDH RD, #IMM16[15:8]) Loads a 16 bit value into the register RD. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form LDW RD, (RB, #OFFS5) LDW RD, (RB, RI) LDW RD, (RB, RI+) LDW RD, (RB, -RI) LDW RD, #IMM16 Address Mode IDO5 IDR IDR+ -IDR IMM8 IMM8 0 0 0 0 1 1 1 1 1 1 1 1 0 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 1 Machine Code RD RD RD RD RD RD RB RB RB RB OFFS5 RI RI RI IMM16[7:0] IMM16[15:8] 0 0 1 0 1 0 Cycles PR PR PR PR P P 1. If the same general purpose register is used as index (RI) and destination register (RD), the content of the register will not be incremented after the data move: M[RB, RI] RD MC9S12XE-Family Reference Manual , Rev. 1.21 432 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LSL Operation C Logical Shift Left LSL 0 0 0 n bits n RD 0 n = RS or IMM4 Shifts the bits in register RD n positions to the left. The lower n bits of the register RD become filled with zeros. The carry flag will be updated to the bit contained in RD[16-n] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[16-n] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form LSL RD, #IMM4 LSL RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 1 1 0 0 0 0 Cycles P P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 433 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) LSR Operation 0 0 0 0 n bits Logical Shift Right LSR C n RD n = RS or IMM4 Shifts the bits in register RD n positions to the right. The higher n bits of the register RD become filled with zeros. The carry flag will be updated to the bit contained in RD[n-1] before the shift for n > 0. n can range from 0 to 16. In immediate address mode, n is determined by the operand IMM4. n is considered to be 16 in IMM4 is equal to 0. In dyadic address mode, n is determined by the content of RS. n is considered to be 16 if the content of RS is greater than 15. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old ^ RD[15]new Set if n > 0 and RD[n-1] = 1; if n = 0 unaffected. Code and CPU Cycles Source Form LSR RD, #IMM4 LSR RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 1 1 0 0 1 1 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 434 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MOV Operation Copies the content of RS to RD. CCR Effects N Z V C Move Register Content MOV RS RD (translates to OR RD, R0, RS) N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form MOV RD, RS Address Mode TRI 0 0 0 1 0 Machine Code RD 0 0 0 RS 1 0 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 435 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NEG Operation Two's Complement NEG -RS RD (translates to SUB RD, R0, RS) -RD RD (translates to SUB RD, R0, RD) Performs a two's complement on a general purpose register. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS[15] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise RS[15] | RD[15]new Code and CPU Cycles Source Form NEG RD, RS NEG RD Address Mode TRI TRI 00011 00011 Machine Code RD RD 000 000 RS RD 00 00 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 436 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) NOP Operation No Operation for one cycle. CCR Effects N Z V C No Operation NOP -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form NOP Address Mode INH 0 0 0 0 0 0 Machine Code 0 1 0 0 0 0 0 0 0 0 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 437 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) OR Operation Logical OR OR RS1 | RS2 RD RD | IMM16 RD (translates to ORL RD, #IMM16[7:0]; ORH RD, #IMM16[15:8] Performs a bit wise logical OR between two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (OR RD, #IMM16), the Z-flag of the first instruction (ORL RD, #IMM16[7:0]) is not considered by the second instruction (ORH RD, #IMM16[15:8]). Don't rely on the Z-Flag. CCR Effects N N: Z: V: C: Z V 0 C -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to ORH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form OR RD, RS1, RS2 OR RD, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 0 0 0 1 1 1 0 0 0 0 1 Machine Code RD RD RD RS1 RS2 IMM16[7:0] IMM16[15:8] 1 0 Cycles P P P MC9S12XE-Family Reference Manual , Rev. 1.21 438 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ORH Operation RD.H | IMM8 RD.H Logical OR Immediate 8 bit Constant (High Byte) ORH Performs a bit wise logical OR between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ORH RD, #IMM8 Address Mode IMM8 1 0 1 0 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 439 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ORL Operation RD.L | IMM8 RD.L Logical OR Immediate 8 bit Constant (Low Byte) ORL Performs a bit wise logical OR between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ORL RD, #IMM8 Address Mode IMM8 1 0 1 0 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 440 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) PAR Operation CCR Effects N Z V C Calculate Parity PAR Calculates the number of ones in the register RD. The Carry flag will be set if the number is odd, otherwise it will be cleared. 0 N: Z: V: C: 0 0; cleared. Set if RD is $0000; cleared otherwise. 0; cleared. Set if the number of ones in the register RD is odd; cleared otherwise. Code and CPU Cycles Source Form PAR, RD Address Mode MON 0 0 0 0 0 Machine Code RD 1 1 1 1 0 1 0 1 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 441 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ROL Operation Rotate Left ROL RD n bits n = RS or IMM4 Rotates the bits in register RD n positions to the left. The lower n bits of the register RD are filled with the upper n bits. Two source forms are available. In the first form, the parameter n is contained in the instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits of the source register RS[3:0]. All other bits in RS are ignored. If n is zero, no shift will take place and the register RD will be unaffected; however, the condition code flags will be updated. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ROL RD, #IMM4 ROL RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 1 1 1 1 0 0 Cycles P P MC9S12XE-Family Reference Manual , Rev. 1.21 442 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ROR Operation Rotate Right ROR RD n bits n = RS or IMM4 Rotates the bits in register RD n positions to the right. The upper n bits of the register RD are filled with the lower n bits. Two source forms are available. In the first form, the parameter n is contained in the instruction code as an immediate operand. In the second form, the parameter is contained in the lower bits of the source register RS[3:0]. All other bits in RS are ignored. If n is zero no shift will take place and the register RD will be unaffected; however, the condition code flags will be updated. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form ROR RD, #IMM4 ROR RD, RS Address Mode IMM4 DYA 0 0 0 0 0 0 0 0 1 1 Machine Code RD RD IMM4 RS 1 1 0 1 1 1 1 1 1 Cycles P P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 443 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) RTS Operation CCR Effects N Z V C Return to Scheduler RTS Terminates the current thread of program execution. -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form RTS Address Mode INH 0 0 0 0 0 0 Machine Code 1 0 0 0 0 0 0 0 0 0 Cycles PA MC9S12XE-Family Reference Manual , Rev. 1.21 444 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SBC Operation RS1 - RS2 - C RD Subtract with Carry SBC Subtracts the content of register RS2 and the value of the Carry bit from the content of register RS1 using binary subtraction and stores the result in the destination register RD. Also the zero flag is carried forward from the previous operation allowing 32 and more bit subtractions. Example: SUB SBC BCC R6,R4,R2 R7,R5,R3 ; R7:R6 = R5:R4 - R3:R2 ; conditional branch on 32 bit subtraction CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000 and Z was set before this operation; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Set if there is a carry from bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Code and CPU Cycles Source Form SBC RD, RS1, RS2 Address Mode TRI 0 0 0 1 1 Machine Code RD RS1 RS2 0 1 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 445 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SEX Operation CCR Effects N Z V C Sign Extend Byte to Word SEX The result in RD is the 16 bit sign extended representation of the original two's complement number in the low byte of RD.L. N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form SEX RD Address Mode MON 0 0 0 0 0 Machine Code RD 1 1 1 1 0 1 0 0 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 446 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SIF Operation Set Interrupt Flag SIF Sets the interrupt flag of an XGATE channel (XGIF). This instruction supports two source forms. If inherent address mode is used, then the interrupt flag of the current channel (XGCHID) will be set. If the monadic address form is used, the interrupt flag associated with the channel id number contained in RS[6:0] is set. The content of RS[15:7] is ignored. NOTE Interrupt flags of reserved channels (see Device User Guide) can't be set. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form SIF SIF RS Address Mode INH MON 0 0 0 0 0 0 0 0 0 0 0 Machine Code 1 RS 1 0 1 0 1 0 1 0 1 0 0 0 1 0 1 0 1 Cycles PA PA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 447 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SSEM Operation Set Semaphore SSEM Attempts to set a semaphore. The state of the semaphore will be stored in the Carry-Flag: 1 = Semaphore is locked by the RISC core 0 = Semaphore is locked by the S12X_CPU In monadic address mode, bits RS[2:0] select the semaphore to be set. CCR Effects N Z V C -- N: Z: V: C: -- -- Not affected. Not affected. Not affected. Set if semaphore is locked by the RISC core; cleared otherwise. Code and CPU Cycles Source Form SSEM #IMM3 SSEM RS Address Mode IMM3 MON 0 0 0 0 0 0 0 0 0 0 Machine Code IMM3 RS 1 1 1 1 1 1 1 1 0 0 0 0 1 1 0 1 Cycles PA PA MC9S12XE-Family Reference Manual , Rev. 1.21 448 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) STB Operation Store Byte to Memory (Low Byte) STB RS.L M[RB, #OFFS5] RS.L M[RB, RI] RS.L M[RB, RI]; RI+1 RI; RI-1 RI; RS.L M[RB, RI]1 Stores the low byte of register RS to memory. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form STB RS, (RB, #OFFS5), STB RS, (RB, RI) STB RS, (RB, RI+) STB RS, (RB, -RI) Address Mode IDO5 IDR IDR+ -IDR 0 0 0 0 1 1 1 1 0 1 1 1 1 1 1 1 0 0 0 0 Machine Code RS RS RS RS RB RB RB RB OFFS5 RI RI RI 0 0 1 0 1 0 Cycles Pw Pw Pw Pw 1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source register is written to the memory: RS.L M[RB, RS-1]; RS-1 RS MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 449 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) STW Operation Store Word to Memory STW RS M[RB, #OFFS5] RS M[RB, RI] RS M[RB, RI]; RI+2 RI; RI-2 RI; RS M[RB, RI]1 Stores the content of register RS to memory. CCR Effects N Z V C -- N: Z: V: C: -- -- -- Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form STW RS, (RB, #OFFS5) STW RS, (RB, RI) STW RS, (RB, RI+) STW RS, (RB, -RI) Address Mode IDO5 IDR IDR+ -IDR 0 0 0 0 1 1 1 1 0 1 1 1 1 1 1 1 1 1 1 1 Machine Code RS RS RS RS RB RB RB RB OFFS5 RI RI RI 0 0 1 0 1 0 Cycles PW PW PW PW 1. If the same general purpose register is used as index (RI) and source register (RS), the unmodified content of the source register is written to the memory: RS M[RB, RS-2]; RS-2 RS MC9S12XE-Family Reference Manual , Rev. 1.21 450 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUB Operation Subtract without Carry SUB RS1 - RS2 RD RD - IMM16 RD (translates to SUBL RD, #IMM16[7:0]; SUBH RD, #IMM16{15:8]) Subtracts two 16 bit values and stores the result in the destination register RD. NOTE When using immediate addressing mode (SUB RD, #IMM16), the V-flag and the C-Flag of the first instruction (SUBL RD, #IMM16[7:0]) are not considered by the second instruction (SUBH RD, #IMM16[15:8]). Don't rely on the V-Flag if RD - IMM16[7:0] < -215. Don't rely on the C-Flag if RD < IMM16[7:0]. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS1[15] & RS2[15] & RD[15]new | RS1[15] & RS2[15] & RD[15]new Refer to SUBH instruction for #IMM16 operations. Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & RS2[15] | RS1[15] & RD[15]new | RS2[15] & RD[15]new Refer to SUBH instruction for #IMM16 operations. Code and CPU Cycles Source Form SUB RD, RS1, RS2 SUB RD, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 1 1 0 0 0 1 0 0 1 0 1 Machine Code RD RD RD RS1 RS2 IMM16[7:0] IMM16[15:8] 0 0 Cycles P P P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 451 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUBH Operation RD - IMM8:$00 RD Subtract Immediate 8 bit Constant (High Byte) SUBH Subtracts a signed immediate 8 bit constant from the content of high byte of register RD and using binary subtraction and stores the result in the high byte of destination register RD. This instruction can be used after an SUBL for a 16 bit immediate subtraction. Example: SUBL SUBH R2,#LOWBYTE R2,#HIGHBYTE ; R2 = R2 - 16 bit immediate CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RD[15]old & IMM8[7] & RD[15]new | RD[15]old & IMM8[7] & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & IMM8[7] | RD[15]old & RD[15]new | IMM8[7] & RD[15]new Code and CPU Cycles Source Form SUBH RD, #IMM8 Address Mode IMM8 1 1 0 0 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 452 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SUBL Operation RD - $00:IMM8 RD Subtract Immediate 8 bit Constant (Low Byte) SUBL Subtracts an immediate 8 bit constant from the content of register RD using binary subtraction and stores the result in the destination register RD. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the 8 bit operation; cleared otherwise. RD[15]old & RD[15]new Set if there is a carry from the bit 15 of the result; cleared otherwise. RD[15]old & RD[15]new Code and CPU Cycles Source Form SUBL RD, #IMM8 Address Mode IMM8 1 1 0 0 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 453 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) TFR Operation Transfer from and to Special Registers TFR TFR RD,CCR: CCR RD[3:0]; 0 RD[15:4] TFR CCR,RD: RD[3:0] CCR TFR RD,PC: PC+4 RD Transfers the content of one RISC core register to another. The TFR RD,PC instruction can be used to implement relative subroutine calls. Example: RETADDR SUBR TFR BRA ... ... JAL R7,PC SUBR ;Return address (RETADDR) is stored in R7 ;Relative branch to subroutine (SUBR) R7 ;Jump to return address (RETADDR) CCR Effects TFR RD,CCR, TFR RD,PC: N Z V C TFR CCR,RS: N Z V C -- N: Z: V: C: -- -- -- N: Z: V: C: RS[3]. RS[2]. RS[1]. RS[0]. Not affected. Not affected. Not affected. Not affected. Code and CPU Cycles Source Form TFR RD,CCR CCR RD TFR CCR,RS RS CCR TFR RD,PCPC+4 RD Address Mode MON MON MON 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Machine Code RD RS RD 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 1 0 1 0 Cycles P P P MC9S12XE-Family Reference Manual , Rev. 1.21 454 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) TST Operation Test Register TST RS - 0 NONE (translates to SUB R0, RS, R0) Subtracts zero from the content of register RS using binary subtraction and discards the result. CCR Effects N Z V C N: Z: V: C: Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Set if a twos complement overflow resulted from the operation; cleared otherwise. RS[15] & result[15] Set if there is a carry from the bit 15 of the result; cleared otherwise. RS1[15] & result[15] Code and CPU Cycles Source Form TST RS Address Mode TRI 0 0 0 1 1 0 Machine Code 0 0 RS1 0 0 0 0 0 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 455 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNOR Operation Logical Exclusive NOR XNOR ~(RS1 ^ RS2) RD ~(RD ^ IMM16) RD (translates to XNOR RD, #IMM16{15:8]; XNOR RD, #IMM16[7:0]) Performs a bit wise logical exclusive NOR between two 16 bit values and stores the result in the destination register RD. Remark: Using R0 as a source registers will calculate the one's complement of the other source register. Using R0 as both source operands will fill RD with $FFFF. NOTE When using immediate addressing mode (XNOR RD, #IMM16), the Z-flag of the first instruction (XNORL RD, #IMM16[7:0]) is not considered by the second instruction (XNORH RD, #IMM16[15:8]). Don't rely on the Z-Flag. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the result is $0000; cleared otherwise. Refer to XNORH instruction for #IMM16 operations. 0; cleared. Not affected. Code and CPU Cycles Source Form XNOR RD, RS1, RS2 XNOR RD, #IMM16 Address Mode TRI IMM8 IMM8 0 1 1 0 0 0 0 1 1 1 1 1 0 0 1 Machine Code RD RD RD RS1 RS2 IMM16[7:0] IMM16[15:8] 1 1 Cycles P P P MC9S12XE-Family Reference Manual , Rev. 1.21 456 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNORH Operation ~(RD.H ^ IMM8) RD.H Logical Exclusive NOR Immediate 8 bit Constant (High Byte) XNORH Performs a bit wise logical exclusive NOR between the high byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.H. The low byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 15 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form XNORH RD, #IMM8 Address Mode IMM8 1 0 1 1 1 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 457 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) XNORL Operation ~(RD.L ^ IMM8) RD.L Logical Exclusive NOR Immediate 8 bit Constant (Low Byte) XNORL Performs a bit wise logical exclusive NOR between the low byte of register RD and an immediate 8 bit constant and stores the result in the destination register RD.L. The high byte of RD is not affected. CCR Effects N Z V C N: Z: V: C: 0 -- Set if bit 7 of the result is set; cleared otherwise. Set if the 8 bit result is $00; cleared otherwise. 0; cleared. Not affected. Code and CPU Cycles Source Form XNORL RD, #IMM8 Address Mode IMM8 1 0 1 1 0 Machine Code RD IMM8 Cycles P MC9S12XE-Family Reference Manual , Rev. 1.21 458 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) 10.8.6 Instruction Coding Table 10-24. Instruction Set Summary (Sheet 1 of 3) Functionality 15 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 14 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 13 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 12 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 11 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 1 1 1 1 10 0 0 0 0 9 0 0 1 1 IMM3 RS IMM3 RS RD RD RD RS RD RS RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD 8 0 1 0 1 7 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 6 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 RS RS RS RS RS RS RS RS IMM4 IMM4 IMM4 IMM4 IMM4 IMM4 IMM4 5 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 4 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 2 0 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 1 1 1 1 0 0 0 1 1 1 1 1 0 0 0 0 0 0 1 1 0 0 1 1 0 0 1 0 0 1 1 0 0 1 1 0 1 1 0 0 1 1 0 1 1 0 0 1 1 0 0 0 0 0 0 1 0 1 0 1 0 1 0 1 0 0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 0 1 0 1 0 1 Table 10-24 summarizes all XGATE instructions in the order of their machine coding. Return to Scheduler and Others BRK NOP RTS SIF Semaphore Instructions CSEM IMM3 CSEM RS SSEM IMM3 SSEM RS Single Register Instructions SEX RD PAR RD JAL RD SIF RS Special Move instructions TFR RD,CCR TFR CCR,RS TFR RD,PC Shift instructions Dyadic BFFO RD, RS ASR RD, RS CSL RD, RS CSR RD, RS LSL RD, RS LSR RD, RS ROL RD, RS ROR RD, RS Shift instructions immediate ASR RD, #IMM4 CSL RD, #IMM4 CSR RD, #IMM4 LSL RD, #IMM4 LSR RD, #IMM4 ROL RD, #IMM4 ROR RD, #IMM4 Logical Triadic AND RD, RS1, RS2 OR RD, RS1, RS2 XNOR RD, RS1, RS2 Arithmetic Triadic SUB RD, RS1, RS2 SBC RD, RS1, RS2 ADD RD, RS1, RS2 ADC RD, RS1, RS2 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 For compare use SUB R0,Rs1,Rs2 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 RD RS1 RS2 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 459 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-24. Instruction Set Summary (Sheet 2 of 3) Functionality Branches BCC REL9 BCS REL9 BNE REL9 BEQ REL9 BPL REL9 BMI REL9 BVC REL9 BVS REL9 BHI REL9 BLS REL9 BGE REL9 BLT REL9 BGT REL9 BLE REL9 BRA REL10 Load and Store Instructions LDB RD, (RB, #OFFS5) LDW RD, (RB, #OFFS5) STB RS, (RB, #OFFS5) STW RS, (RB, #OFFS5) LDB RD, (RB, RI) LDW RD, (RB, RI) STB RS, (RB, RI) STW RS, (RB, RI) LDB RD, (RB, RI+) LDW RD, (RB, RI+) STB RS, (RB, RI+) STW RS, (RB, RI+) LDB RD, (RB, -RI) LDW RD, (RB, -RI) STB RS, (RB, -RI) STW RS, (RB, -RI) Bit Field Instructions BFEXT RD, RS1, RS2 BFINS RD, RS1, RS2 BFINSI RD, RS1, RS2 BFINSX RD, RS1, RS2 Logic Immediate Instructions ANDL RD, #IMM8 ANDH RD, #IMM8 BITL RD, #IMM8 BITH RD, #IMM8 ORL RD, #IMM8 ORH RD, #IMM8 XNORL RD, #IMM8 XNORH RD, #IMM8 15 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 14 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 13 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 12 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 11 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 10 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 9 0 1 0 1 0 1 0 1 0 1 0 1 0 1 8 7 6 5 4 3 2 1 0 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL9 REL10 RB RB RB RB RB RB RB RB RB RB RB RB RB RB RB RB RS1 RS1 RS1 RS1 OFFS5 OFFS5 OFFS5 OFFS5 RI RI RI RI RI RI RI RI RI RI RI RI RS2 RS2 RS2 RS2 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 RD RD RS RS RD RD RS RS RD RD RS RS RD RD RS RS RD RD RD RD RD RD RD RD RD RD RD RD MC9S12XE-Family Reference Manual , Rev. 1.21 460 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Table 10-24. Instruction Set Summary (Sheet 3 of 3) Functionality Arithmetic Immediate Instructions SUBL RD, #IMM8 SUBH RD, #IMM8 CMPL RS, #IMM8 CPCH RS, #IMM8 ADDL RD, #IMM8 ADDH RD, #IMM8 LDL RD, #IMM8 LDH RD, #IMM8 15 1 1 1 1 1 1 1 1 14 1 1 1 1 1 1 1 1 13 0 0 0 0 1 1 1 1 12 0 0 1 1 0 0 1 1 11 0 1 0 1 0 1 0 1 10 9 RD RD RS RS RD RD RD RD 8 7 6 5 4 3 2 1 0 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 IMM8 10.9 10.9.1 Initialization and Application Information Initialization The recommended initialization of the XGATE is as follows: 1. Clear the XGE bit to suppress any incoming service requests. 2. Make sure that no thread is running on the XGATE. This can be done in several ways: a) Poll the XGCHID register until it reads $00. Also poll XGDBG and XGSWEF to make sure that the XGATE has not been stopped. b) Enter Debug Mode by setting the XGDBG bit. Clear the XGCHID register. Clear the XGDBG bit. The recommended method is a). 3. Set the XGVBR register to the lowest address of the XGATE vector space. 4. Clear all Channel ID flags. 5. Copy XGATE vectors and code into the RAM. 6. Initialize the S12X_INT module. 7. Enable the XGATE by setting the XGE bit. The following code example implements the XGATE initialization sequence. 10.9.2 Code Example (Transmit "Hello World!" on SCI) CPU S12X ;########################################### ;# SYMBOLS # ;########################################### EQU $00C8 ;SCI register space EQU SCI_REGS+$00; ;SCI Baud Rate Register EQU SCI_REGS+$00 ;SCI Baud Rate Register EQU SCI_REGS+$03 ;SCI Control Register 2 EQU SCI_REGS+$04 ;SCI Status Register 1 EQU SCI_REGS+$07 ;SCI Control Register 2 EQU $80 ;TIE bit mask EQU $08 ;TE bit mask EQU $04 ;RE bit mask SCI_REGS SCIBDH SCIBDL SCICR2 SCISR1 SCIDRL TIE TE RE MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 461 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) SCI_VEC INT_REGS INT_CFADDR INT_CFDATA RQST XGATE_REGS XGMCTL XGMCTL_CLEAR XGMCTL_ENABLE XGCHID XGISPSEL XGVBR XGIF XGSWT XGSEM RPAGE RAM_SIZE RAM_START RAM_START_XG RAM_START_GLOB XGATE_VECTORS XGATE_VECTORS_XG XGATE_DATA XGATE_DATA_XG XGATE_CODE XGATE_CODE_XG BUS_FREQ_HZ EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU EQU $D6 $0120 INT_REGS+$07 INT_REGS+$08 $80 $0380 XGATE_REGS+$00 $FA02 $8282 XGATE_REGS+$02 XGATE_REGS+$05 XGATE_REGS+$06 XGATE_REGS+$08 XGATE_REGS+$18 XGATE_REGS+$1A $0016 32*$400 ;SCI vector number ;S12X_INT register space ;Interrupt Configuration Address Register ;Interrupt Configuration Data Registers ;RQST bit mask ;XGATE register space ;XGATE Module Control Register ;Clear all XGMCTL bits ;Enable XGATE ;XGATE Channel ID Register ;XGATE Channel ID Register ;XGATE ISP Select Register ;XGATE Interrupt Flag Vector ;XGATE Software Trigger Register ;XGATE Semaphore Register ;32k RAM $1000 $10000-RAM_SIZE $100000-RAM_SIZE RAM_START RAM_START_XG RAM_START+(4*128) RAM_START_XG+(4*128) XGATE_DATA+(XGATE_CODE_FLASH-XGATE_DATA_FLASH) XGATE_DATA_XG+(XGATE_CODE_FLASH-XGATE_DATA_FLASH) 40000000 ;########################################### ;# S12XE VECTOR TABLE # ;########################################### ORG $FF10 ;non-maskable interrupts DW DUMMY_ISR DUMMY_ISR DUMMY_ISR DUMMY_ISR ORG DW ORG DW $FFF4 ;non-maskable interrupts DUMMY_ISR DUMMY_ISR DUMMY_ISR $FFFA ;resets START_OF_CODE START_OF_CODE START_OF_CODE ;########################################### ;# DISABLE COP # ;########################################### ORG $FF0E DW $FFFE ORG START_OF_CODE $C000 MC9S12XE-Family Reference Manual , Rev. 1.21 462 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) ;########################################### ;# INITIALIZE S12XE CORE # ;########################################### SEI MOVB #(RAM_START_GLOB>>12), RPAGE ;set RAM page ;########################################### ;# INITIALIZE SCI # ;########################################### MOVW #(BUS_FREQ_HZ/(16*9600)), SCIBDH;set baud rate MOVB #(TIE|TE), SCICR2;enable tx buffer empty interrupt ;########################################### ;# INITIALIZE S12X_INT # ;########################################### MOVB #(SCI_VEC&$F0), INT_CFADDR ;switch SCI interrupts to XGATE MOVB #RQST|$01, INT_CFDATA+((SCI_VEC&$0F)>>1) ;########################################### ;# INITIALIZE XGATE # ;########################################### MOVW #XGMCTL_CLEAR, XGMCTL ;clear all XGMCTL bits TST BNE LDX LDD STD STD STD STD STD STD STD STD XGCHID ;wait until current thread is finished INIT_XGATE_BUSY_LOOP #XGIF #$FFFF 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ 2,X+ ;clear all channel interrupt flags INIT_SCI INIT_INT INIT_XGATE INIT_XGATE_BUSY_LOOP CLR XGISPSEL ;set vector base register MOVW #XGATE_VECTORS_XG, XGVBR MOVW #$FF00, XGSWT ;clear all software triggers ;########################################### ;# INITIALIZE XGATE VECTOR TABLE # ;########################################### LDAA #128 ;build XGATE vector table LDY #XGATE_VECTORS MOVW #XGATE_DUMMY_ISR_XG, 4,Y+ DBNE A, INIT_XGATE_VECTAB_LOOP MOVW #XGATE_CODE_XG, RAM_START+(2*SCI_VEC) MOVW #XGATE_DATA_XG, RAM_START+(2*SCI_VEC)+2 ;########################################### ;# COPY XGATE CODE # ;########################################### LDX #XGATE_DATA_FLASH MOVW 2,X+, 2,Y+ INIT_XGATE_VECTAB_LOOP COPY_XGATE_CODE COPY_XGATE_CODE_LOOP MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 463 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MOVW MOVW MOVW CPX BLS 2,X+, 2,Y+ 2,X+, 2,Y+ 2,X+, 2,Y+ #XGATE_CODE_FLASH_END COPY_XGATE_CODE_LOOP START_XGATE ;########################################### ;# START XGATE # ;########################################### MOVW #XGMCTL_ENABLE, XGMCTL ;enable XGATE BRA * ;########################################### ;# DUMMY INTERRUPT SERVICE ROUTINE # ;########################################### RTI CPU XGATE ;########################################### ;# XGATE DATA # ;########################################### ALIGN 1 EQU * EQU *-XGATE_DATA_FLASH DW SCI_REGS ;pointer to SCI register space EQU *-XGATE_DATA_FLASH DB XGATE_DATA_MSG ;string pointer EQU *-XGATE_DATA_FLASH FCC "Hello World! ;ASCII string DB $0D ;CR ;########################################### ;# XGATE CODE # ;########################################### ALIGN 1 LDW R2,(R1,#XGATE_DATA_SCI) ;SCI -> R2 LDB R3,(R1,#XGATE_DATA_IDX) ;msg -> R3 LDB R4,(R1,R3+) ;curr. char -> R4 STB R3,(R1,#XGATE_DATA_IDX) ;R3 -> idx LDB R0,(R2,#(SCISR1-SCI_REGS)) ;initiate SCI transmit STB R4,(R2,#(SCIDRL-SCI_REGS)) ;initiate SCI transmit CMPL R4,#$0D BEQ XGATE_CODE_DONE RTS LDL R4,#$00 ;disable SCI interrupts STB R4,(R2,#(SCICR2-SCI_REGS)) LDL R3,#XGATE_DATA_MSG;reset R3 STB R3,(R1,#XGATE_DATA_IDX) RTS EQU (XGATE_CODE_FLASH_END-XGATE_CODE_FLASH)+XGATE_CODE_XG DUMMY_ISR XGATE_DATA_FLASH XGATE_DATA_SCI XGATE_DATA_IDX XGATE_DATA_MSG XGATE_CODE_FLASH XGATE_CODE_DONE XGATE_CODE_FLASH_END XGATE_DUMMY_ISR_XG 10.9.3 Stack Support To simplify the implementation of a program stack the XGATE can be configured to set RISC core register R7 to the beginning of a stack region before executing a thread. Two separate stack regions can be defined: One for threads of priority level 7 to 4 (refer to Section 10.3.1.5, "XGATE Initial Stack Pointer for MC9S12XE-Family Reference Manual , Rev. 1.21 464 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) Interrupt Priorities 7 to 4 (XGISP74)") and one for threads of priority level 3 to 1 (refer to Section 10.3.1.6, "XGATE Initial Stack Pointer for Interrupt Priorities 3 to 1 (XGISP31)"). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 465 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 10 XGATE (S12XGATEV3) MC9S12XE-Family Reference Manual , Rev. 1.21 466 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-1. Revision History Revision Number V01.00 V01.01 V01.02 V01.03 V01.04 Revision Date 26 Oct. 2005 02 Nov 2006 4 Mar. 2008 1 Sep. 2008 20 Nov. 2008 Sections Affected Initial release 11.4.1.1/11-484 Table "Examples of IPLL Divider settings": corrected $32 to $31 11.4.1.4/11-487 Corrected details 11.4.3.3/11-491 Table 11-14 added 100MHz example for PLL 11.3.2.4/11-473 S12XECRG Flags Register: corrected address to Module Base + 0x0003 Description of Changes 11.1 Introduction This specification describes the function of the Clocks and Reset Generator (S12XECRG). 11.1.1 Features The main features of this block are: * Phase Locked Loop (IPLL) frequency multiplier with internal filter -- Reference divider -- Post divider -- Configurable internal filter (no external pin) -- Optional frequency modulation for defined jitter and reduced emission -- Automatic frequency lock detector -- Interrupt request on entry or exit from locked condition -- Self Clock Mode in absence of reference clock * System Clock Generator -- Clock Quality Check -- User selectable fast wake-up from Stop in Self-Clock Mode for power saving and immediate program execution -- Clock switch for either Oscillator or PLL based system clocks * Computer Operating Properly (COP) watchdog timer with time-out clear window. * System Reset generation from the following possible sources: -- Power on reset -- Low voltage reset MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 467 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) * -- Illegal address reset -- COP reset -- Loss of clock reset -- External pin reset Real-Time Interrupt (RTI) 11.1.2 Modes of Operation This subsection lists and briefly describes all operating modes supported by the S12XECRG. * Run Mode All functional parts of the S12XECRG are running during normal Run Mode. If RTI or COP functionality is required the individual bits of the associated rate select registers (COPCTL, RTICTL) have to be set to a non zero value. * Wait Mode In this mode the IPLL can be disabled automatically depending on the PLLWAI bit. * Stop Mode Depending on the setting of the PSTP bit Stop Mode can be differentiated between Full Stop Mode (PSTP = 0) and Pseudo Stop Mode (PSTP = 1). -- Full Stop Mode The oscillator is disabled and thus all system and core clocks are stopped. The COP and the RTI remain frozen. -- Pseudo Stop Mode The oscillator continues to run and most of the system and core clocks are stopped. If the respective enable bits are set the COP and RTI will continue to run, else they remain frozen. * Self Clock Mode Self Clock Mode will be entered if the Clock Monitor Enable Bit (CME) and the Self Clock Mode Enable Bit (SCME) are both asserted and the clock monitor in the oscillator block detects a loss of clock. As soon as Self Clock Mode is entered the S12XECRG starts to perform a clock quality check. Self Clock Mode remains active until the clock quality check indicates that the required quality of the incoming clock signal is met (frequency and amplitude). Self Clock Mode should be used for safety purposes only. It provides reduced functionality to the MCU in case a loss of clock is causing severe system conditions. 11.1.3 Block Diagram Figure 11-1 shows a block diagram of the S12XECRG. MC9S12XE-Family Reference Manual , Rev. 1.21 468 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Illegal Address Reset S12X_MMC Power on Reset Voltage Regulator Low Voltage Reset ICRG RESET Clock Monitor CM Fail COP Timeout Reset Generator System Reset XCLKS EXTAL OSCCLK Oscillator XTAL Clock Quality Checker Bus Clock Core Clock COP RTI Oscillator Clock Registers PLLCLK VDDPLL VSSPLL IPLL Clock and Reset Control Real Time Interrupt PLL Lock Interrupt Self Clock Mode Interrupt Figure 11-1. Block diagram of S12XECRG 11.2 Signal Description This section lists and describes the signals that connect off chip. 11.2.1 VDDPLL, VSSPLL These pins provides operating voltage (VDDPLL) and ground (VSSPLL) for the IPLL circuitry. This allows the supply voltage to the IPLL to be independently bypassed. Even if IPLL usage is not required VDDPLL and VSSPLL must be connected to properly. 11.2.2 RESET RESET is an active low bidirectional reset pin. As an input it initializes the MCU asynchronously to a known start-up state. As an open-drain output it indicates that an system reset (internal to MCU) has been triggered. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 469 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3 Memory Map and Registers This section provides a detailed description of all registers accessible in the S12XECRG. 11.3.1 Module Memory Map Figure 11-2 gives an overview on all S12XECRG registers. Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B Name SYNR REFDV POSTDIV CRGFLG CRGINT CLKSEL PLLCTL RTICTL COPCTL FORBYP2 CTCTL2 ARMCOP R W R W R W R W R W R W R W R W R W R W R W R W 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0 0 0 0 0 0 0 RTIF RTIE PLLSEL CME RTDEC WCOP 0 PORF 0 LVRF 0 XCLKS LOCKIF LOCKIE 0 LOCK 0 Bit 7 6 5 4 3 2 1 Bit 0 VCOFRQ[1:0] REFFRQ[1:0] 0 0 0 SYNDIV[5:0] REFDIV[5:0] POSTDIV[4:0] ILAF 0 0 SCMIF SCMIE RTIWAI PCE RTR1 CR1 0 SCM 0 PSTP PLLON RTR6 RSBCK 0 PLLWAI FSTWKP RTR3 0 0 COPWAI SCME RTR0 CR0 0 FM1 RTR5 0 WRTMASK 0 FM0 RTR4 0 0 PRE RTR2 CR2 0 2. FORBYP and CTCTL are intended for factory test purposes only. = Unimplemented or Reserved Figure 11-2. CRG Register Summary NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. MC9S12XE-Family Reference Manual , Rev. 1.21 470 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3.2 Register Descriptions This section describes in address order all the S12XECRG registers and their individual bits. 11.3.2.1 S12XECRG Synthesizer Register (SYNR) The SYNR register controls the multiplication factor of the IPLL and selects the VCO frequency range. Module Base + 0x0000 7 6 5 4 3 2 1 0 R VCOFRQ[1:0] W Reset 0 0 0 0 0 0 0 0 SYNDIV[5:0] Figure 11-3. S12XECRG Synthesizer Register (SYNR) Read: Anytime Write: Anytime except if PLLSEL = 1 NOTE Write to this register initializes the lock detector bit. ( SYNDIV + 1 ) f VCO = 2 x f OSC x -----------------------------------( REFDIV + 1 ) f VCO f PLL = ----------------------------------2 x POSTDIV f PLL f BUS = -----------2 NOTE fVCO must be within the specified VCO frequency lock range. F.BUS (Bus Clock) must not exceed the specified maximum. If POSTDIV = $00 then fPLL is same as fVCO (divide by one). The VCOFRQ[1:0] bit are used to configure the VCO gain for optimal stability and lock time. For correct IPLL operation the VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK frequency as shown in Table 11-2. Setting the VCOFRQ[1:0] bits wrong can result in a non functional IPLL (no locking and/or insufficient stability). Table 11-2. VCO Clock Frequency Selection VCOCLK Frequency Ranges 32MHz <= fVCO<= 48MHz 48MHz < fVCO<= 80MHz Reserved 80MHz < fVCO <= 120MHz VCOFRQ[1:0] 00 01 10 11 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 471 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.3.2.2 S12XECRG Reference Divider Register (REFDV) The REFDV register provides a finer granularity for the IPLL multiplier steps. Module Base + 0x0001 7 6 5 4 3 2 1 0 R REFFRQ[1:0] W Reset 0 0 0 0 0 0 0 0 REFDIV[5:0] Figure 11-4. S12XECRG Reference Divider Register (REFDV) Read: Anytime Write: Anytime except when PLLSEL = 1 NOTE Write to this register initializes the lock detector bit. f OSC f REF = -----------------------------------( REFDIV + 1 ) The REFFRQ[1:0] bit are used to configure the internal PLL filter for optimal stability and lock time. For correct IPLL operation the REFFRQ[1:0] bits have to be selected according to the actual REFCLK frequency as shown in Figure 11-3. Setting the REFFRQ[1:0] bits wrong can result in a non functional IPLL (no locking and/or insufficient stability). Table 11-3. Reference Clock Frequency Selection REFCLK Frequency Ranges 1MHz <= fREF <= 2MHz 2MHz < fREF <= 6MHz 6MHz < fREF <= 12MHz fREF >12MHz REFFRQ[1:0] 00 01 10 11 11.3.2.3 S12XECRG Post Divider Register (POSTDIV) The POSTDIV register controls the frequency ratio between the VCOCLK and PLLCLK. The count in the final divider divides VCOCLK frequency by 1 or 2*POSTDIV. Note that if POSTDIV = $00 fPLL= fVCO (divide by one). MC9S12XE-Family Reference Manual , Rev. 1.21 472 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 POSTDIV[4:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-5. S12XECRG Post Divider Register (POSTDIV) Read: Anytime Write: Anytime except if PLLSEL = 1 f VCO f PLL = ------------------------------------( 2xPOSTDIV ) NOTE If POSTDIV = $00 then fPLL is identical to fVCO (divide by one). 11.3.2.4 S12XECRG Flags Register (CRGFLG) This register provides S12XECRG status bits and flags. Module Base + 0x0003 7 6 5 4 3 2 1 0 R RTIF W Reset 0 Note 1 Note 2 Note 3 PORF LVRF LOCKIF LOCK ILAF 0 0 SCMIF 0 SCM 0 1. PORF is set to 1 when a power on reset occurs. Unaffected by system reset. 2. LVRF is set to 1 when a low voltage reset occurs. Unaffected by system reset. 3. ILAF is set to 1 when an illegal address reset occurs. Unaffected by system reset. Cleared by power on or low voltage reset. = Unimplemented or Reserved Figure 11-6. S12XECRG Flags Register (CRGFLG) Read: Anytime Write: Refer to each bit for individual write conditions MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 473 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-4. CRGFLG Field Descriptions Field 7 RTIF Description Real Time Interrupt Flag -- RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request. 0 RTI time-out has not yet occurred. 1 RTI time-out has occurred. Power on Reset Flag -- PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Power on reset has not occurred. 1 Power on reset has occurred. Low Voltage Reset Flag -- LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Low voltage reset has not occurred. 1 Low voltage reset has occurred. IPLL Lock Interrupt Flag -- LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect.If enabled (LOCKIE=1), LOCKIF causes an interrupt request. 0 No change in LOCK bit. 1 LOCK bit has changed. Lock Status Bit -- LOCK reflects the current state of IPLL lock condition. This bit is cleared in Self Clock Mode. Writes have no effect. 0 VCOCLK is not within the desired tolerance of the target frequency. 1 VCOCLK is within the desired tolerance of the target frequency. Illegal Address Reset Flag -- ILAF is set to 1 when an illegal address reset occurs. Refer to S12XMMC Block Guide for details. This flag can only be cleared by writing a 1. Writing a 0 has no effect. 0 Illegal address reset has not occurred. 1 Illegal address reset has occurred. Self Clock Mode Interrupt Flag -- SCMIF is set to 1 when SCM status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (SCMIE=1), SCMIF causes an interrupt request. 0 No change in SCM bit. 1 SCM bit has changed. Self Clock Mode Status Bit -- SCM reflects the current clocking mode. Writes have no effect. 0 MCU is operating normally with OSCCLK available. 1 MCU is operating in Self Clock Mode with OSCCLK in an unknown state. All clocks are derived from PLLCLK running at its minimum frequency fSCM. 6 PORF 5 LVRF 4 LOCKIF 3 LOCK 2 ILAF 1 SCMIF 0 SCM 11.3.2.5 S12XECRG Interrupt Enable Register (CRGINT) This register enables S12XECRG interrupt requests. Module Base + 0x0004 7 6 5 4 3 2 1 0 R RTIE W Reset 0 0 0 LOCKIE 0 0 SCMIE 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-7. S12XECRG Interrupt Enable Register (CRGINT) MC9S12XE-Family Reference Manual , Rev. 1.21 474 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Read: Anytime Write: Anytime Table 11-5. CRGINT Field Descriptions Field 7 RTIE 4 LOCKIE 1 SCMIE Description Real Time Interrupt Enable Bit 0 Interrupt requests from RTI are disabled. 1 Interrupt will be requested whenever RTIF is set. Lock Interrupt Enable Bit 0 LOCK interrupt requests are disabled. 1 Interrupt will be requested whenever LOCKIF is set. Self Clock Mode Interrupt Enable Bit 0 SCM interrupt requests are disabled. 1 Interrupt will be requested whenever SCMIF is set. 11.3.2.6 S12XECRG Clock Select Register (CLKSEL) This register controls S12XECRG clock selection. Refer toFigure 11-16 for more details on the effect of each bit. Module Base + 0x0005 7 6 5 4 3 2 1 0 R PLLSEL W Reset 0 0 PSTP XCLKS 0 PLLWAI 0 RTIWAI 0 0 COPWAI 0 0 0 0 = Unimplemented or Reserved Figure 11-8. S12XECRG Clock Select Register (CLKSEL) Read: Anytime Write: Refer to each bit for individual write conditions MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 475 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-6. CLKSEL Field Descriptions Field 7 PLLSEL Description PLL Select Bit Write: Anytime. Writing a one when LOCK=0 has no effect. This prevents the selection of an unstable PLLCLK as SYSCLK. PLLSEL bit is cleared when the MCU enters Self Clock Mode, Stop Mode or Wait Mode with PLLWAI bit set. It is recommended to read back the PLLSEL bit to make sure PLLCLK has really been selected as SYSCLK, as LOCK status bit could theoretically change at the very moment writing the PLLSEL bit. 0 System clocks are derived from OSCCLK (fBUS = fOSC / 2). 1 System clocks are derived from PLLCLK (fBUS = fPLL / 2). Pseudo Stop Bit Write: Anytime This bit controls the functionality of the oscillator during Stop Mode. 0 Oscillator is disabled in Stop Mode. 1 Oscillator continues to run in Stop Mode (Pseudo Stop). Note: Pseudo Stop Mode allows for faster STOP recovery and reduces the mechanical stress and aging of the resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption. Oscillator Configuration Status Bit -- This read-only bit shows the oscillator configuration status. 0 Loop controlled Pierce Oscillator is selected. 1 External clock / full swing Pierce Oscillator is selected. PLL Stops in Wait Mode Bit Write: Anytime If PLLWAI is set, the S12XECRG will clear the PLLSEL bit before entering Wait Mode. The PLLON bit remains set during Wait Mode but the IPLL is powered down. Upon exiting Wait Mode, the PLLSEL bit has to be set manually if PLL clock is required. 0 IPLL keeps running in Wait Mode. 1 IPLL stops in Wait Mode. RTI Stops in Wait Mode Bit Write: Anytime 0 RTI keeps running in Wait Mode. 1 RTI stops and initializes the RTI dividers whenever the part goes into Wait Mode. COP Stops in Wait Mode Bit Normal modes: Write once Special modes: Write anytime 0 COP keeps running in Wait Mode. 1 COP stops and initializes the COP counter whenever the part goes into Wait Mode. 6 PSTP 5 XCLKS 3 PLLWAI 1 RTIWAI 0 COPWAI 11.3.2.7 S12XECRG IPLL Control Register (PLLCTL) This register controls the IPLL functionality. Module Base + 0x0006 7 6 5 4 3 2 1 0 R CME W Reset 1 1 0 0 0 0 0 1 PLLON FM1 FM0 FSTWKP PRE PCE SCME Figure 11-9. S12XECRG IPLL Control Register (PLLCTL) MC9S12XE-Family Reference Manual , Rev. 1.21 476 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Read: Anytime Write: Refer to each bit for individual write conditions Table 11-7. PLLCTL Field Descriptions Field 7 CME Description Clock Monitor Enable Bit -- CME enables the clock monitor. Write anytime except when SCM = 1. 0 Clock monitor is disabled. 1 Clock monitor is enabled. Slow or stopped clocks will cause a clock monitor reset sequence or Self Clock Mode. Note: Operating with CME=0 will not detect any loss of clock. In case of poor clock quality this could cause unpredictable operation of the MCU! In Stop Mode (PSTP=0) the clock monitor is disabled independently of the CME bit setting and any loss of external clock will not be detected. Also after wake-up from stop mode (PSTP = 0) with fast wake-up enabled (FSTWKP = 1) the clock monitor is disabled independently of the CME bit setting and any loss of external clock will not be detected. Phase Lock Loop On Bit -- PLLON turns on the IPLL circuitry. In Self Clock Mode, the IPLL is turned on, but the PLLON bit reads the last written value. Write anytime except when PLLSEL = 1. 0 IPLL is turned off. 1 IPLL is turned on. IPLL Frequency Modulation Enable Bit -- FM1 and FM0 enable additional frequency modulation on the VCOCLK. This is to reduce noise emission. The modulation frequency is fref divided by 16. Write anytime except when PLLSEL = 1. See Table 11-8 for coding. Fast Wake-up from Full Stop Bit -- FSTWKP enables fast wake-up from full stop mode. Write anytime. If SelfClock Mode is disabled (SCME = 0) this bit has no effect. 0 Fast wake-up from full stop mode is disabled. 1 Fast wake-up from full stop mode is enabled. When waking up from full stop mode the system will immediately resume operation in Self-Clock Mode (see Section 11.4.1.4, "Clock Quality Checker"). The SCMIF flag will not be set. The system will remain in Self-Clock Mode with oscillator and clock monitor disabled until FSTWKP bit is cleared. The clearing of FSTWKP will start the oscillator, the clock monitor and the clock quality check. If the clock quality check is successful, the S12XECRG will switch all system clocks to OSCCLK. The SCMIF flag will be set. See application examples in Figure 11-19 and Figure 11-20. RTI Enable During Pseudo Stop Bit -- PRE enables the RTI during Pseudo Stop Mode. Write anytime. 0 RTI stops running during Pseudo Stop Mode. 1 RTI continues running during Pseudo Stop Mode. Note: If the PRE bit is cleared the RTI dividers will go static while Pseudo Stop Mode is active. The RTI dividers will not initialize like in Wait Mode with RTIWAI bit set. COP Enable During Pseudo Stop Bit -- PCE enables the COP during Pseudo Stop Mode. Write anytime. 0 COP stops running during Pseudo Stop Mode 1 COP continues running during Pseudo Stop Mode Note: If the PCE bit is cleared the COP dividers will go static while Pseudo Stop Mode is active. The COP dividers will not initialize like in Wait Mode with COPWAI bit set. Self Clock Mode Enable Bit Normal modes: Write once Special modes: Write anytime SCME can not be cleared while operating in Self Clock Mode (SCM = 1). 0 Detection of crystal clock failure causes clock monitor reset (see Section 11.5.1.1, "Clock Monitor Reset"). 1 Detection of crystal clock failure forces the MCU in Self Clock Mode (see Section 11.4.2.2, "Self Clock Mode"). 6 PLLON 5, 4 FM1, FM0 3 FSTWKP 2 PRE 1 PCE 0 SCME MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 477 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-8. FM Amplitude selection FM1 0 0 1 1 0 1 0 1 FM0 FM Amplitude / fVCO Variation FM off 1% 2% 4% 11.3.2.8 S12XECRG RTI Control Register (RTICTL) This register selects the timeout period for the Real Time Interrupt. Module Base + 0x0007 7 6 5 4 3 2 1 0 R RTDEC W Reset 0 0 0 0 0 0 0 0 RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0 Figure 11-10. S12XECRG RTI Control Register (RTICTL) Read: Anytime Write: Anytime NOTE A write to this register initializes the RTI counter. Table 11-9. RTICTL Field Descriptions Field 7 RTDEC 6-4 RTR[6:4] 3-0 RTR[3:0] Description Decimal or Binary Divider Select Bit -- RTDEC selects decimal or binary based prescaler values. 0 Binary based divider value. See Table 11-10 1 Decimal based divider value. See Table 11-11 Real Time Interrupt Prescale Rate Select Bits -- These bits select the prescale rate for the RTI. See Table 1110 and Table 11-11. Real Time Interrupt Modulus Counter Select Bits -- These bits select the modulus counter target value to provide additional granularity.Table 11-10 and Table 11-11 show all possible divide values selectable by the RTICTL register. The source clock for the RTI is OSCCLK. Table 11-10. RTI Frequency Divide Rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 000 (OFF) OFF(1) 001 (210) 210 010 (211) 211 011 (212) 212 100 (213) 213 101 (214) 214 110 (215) 215 111 (216) 216 0000 (/1) MC9S12XE-Family Reference Manual , Rev. 1.21 478 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-10. RTI Frequency Divide Rates for RTDEC = 0 RTR[6:4] = RTR[3:0] 000 (OFF) OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF 001 (210) 2x210 3x210 4x210 5x210 6x210 7x210 8x210 9x210 10x210 11x210 12x210 13x210 14x210 15x210 16x210 010 (211) 2x211 3x211 4x211 5x211 6x211 7x211 8x211 9x211 10x211 11x211 12x211 13x211 14x211 15x211 16x211 011 (212) 2x212 3x212 4x212 5x212 6x212 7x212 8x212 9x212 10x212 11x212 12x212 13x212 14x212 15x212 16x212 100 (213) 2x213 3x213 4x213 5x213 6x213 7x213 8x213 9x213 10x213 11x213 12x213 13x213 14x213 15x213 16x213 101 (214) 2x214 3x214 4x214 5x214 6x214 7x214 8x214 9x214 10x214 11x214 12x214 13x214 14x214 15x214 16x214 110 (215) 2x215 3x215 4x215 5x215 6x215 7x215 8x215 9x215 10x215 11x215 12x215 13x215 14x215 15x215 16x215 111 (216) 2x216 3x216 4x216 5x216 6x216 7x216 8x216 9x216 10x216 11x216 12x216 13x216 14x216 15x216 16x216 0001 (/2) 0010 (/3) 0011 (/4) 0100 (/5) 0101 (/6) 0110 (/7) 0111 (/8) 1000 (/9) 1001 (/10) 1010 (/11) 1011 (/12) 1100 (/13) 1101 (/14) 1110 (/15) 1111 (/16) 1. Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility. Table 11-11. RTI Frequency Divide Rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 1x103 2x103 3x103 4x103 5x103 6x103 001 (2x103) 2x103 4x103 6x103 8x103 10x103 12x103 010 (5x103) 5x103 10x103 15x103 20x103 25x103 30x103 011 (10x103) 10x103 20x103 30x103 40x103 50x103 60x103 100 (20x103) 20x103 40x103 60x103 80x103 100x103 120x103 101 (50x103) 50x103 100x103 150x103 200x103 250x103 300x103 110 (100x103) 100x103 200x103 300x103 400x103 500x103 600x103 111 (200x103) 200x103 400x103 600x103 800x103 1x106 1.2x106 0000 (/1) 0001 (/2) 0010 (/3) 0011 (/4) 0100 (/5) 0101 (/6) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 479 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-11. RTI Frequency Divide Rates for RTDEC=1 RTR[6:4] = RTR[3:0] 000 (1x103) 7x103 8x103 9x103 10 x103 11 x103 12x103 13x103 14x103 15x103 16x103 001 (2x103) 14x103 16x103 18x103 20x103 22x103 24x103 26x103 28x103 30x103 32x103 010 (5x103) 35x103 40x103 45x103 50x103 55x103 60x103 65x103 70x103 75x103 80x103 011 (10x103) 70x103 80x103 90x103 100x103 110x103 120x103 130x103 140x103 150x103 160x103 100 (20x103) 140x103 160x103 180x103 200x103 220x103 240x103 260x103 280x103 300x103 320x103 101 (50x103) 350x103 400x103 450x103 500x103 550x103 600x103 650x103 700x103 750x103 800x103 110 (100x103) 700x103 800x103 900x103 1x106 1.1x106 1.2x106 1.3x106 1.4x106 1.5x106 1.6x106 111 (200x103) 1.4x106 1.6x106 1.8x106 2x106 2.2x106 2.4x106 2.6x106 2.8x106 3x106 3.2x106 0110 (/7) 0111 (/8) 1000 (/9) 1001 (/10) 1010 (/11) 1011 (/12) 1100 (/13) 1101 (/14) 1110 (/15) 1111 (/16) 11.3.2.9 S12XECRG COP Control Register (COPCTL) This register controls the COP (Computer Operating Properly) watchdog. Module Base + 0x0008 7 6 5 4 3 2 1 0 R WCOP W Reset1 0 0 RSBCK 0 WRTMASK 0 0 0 CR2 CR1 0 CR0 0 0 0 0 1. Refer to Device User Guide (Section: S12XECRG) for reset values of WCOP, CR2, CR1 and CR0. = Unimplemented or Reserved Figure 11-11. S12XECRG COP Control Register (COPCTL) Read: Anytime Write: 1. RSBCK: anytime in special modes; write to "1" but not to "0" in all other modes 2. WCOP, CR2, CR1, CR0: -- Anytime in special modes -- Write once in all other modes - Writing CR[2:0] to "000" has no effect, but counts for the "write once" condition. - Writing WCOP to "0" has no effect, but counts for the "write once" condition. MC9S12XE-Family Reference Manual , Rev. 1.21 480 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The COP time-out period is restarted if one these two conditions is true: 1. Writing a non zero value to CR[2:0] (anytime in special modes, once in all other modes) with WRTMASK = 0. or 2. Changing RSBCK bit from "0" to "1". Table 11-12. COPCTL Field Descriptions Field 7 WCOP Description Window COP Mode Bit -- When set, a write to the ARMCOP register must occur in the last 25% of the selected period. A write during the first 75% of the selected period will reset the part. As long as all writes occur during this window, $55 can be written as often as desired. Once $AA is written after the $55, the time-out logic restarts and the user must wait until the next window before writing to ARMCOP. Table 11-13 shows the duration of this window for the seven available COP rates. 0 Normal COP operation 1 Window COP operation COP and RTI Stop in Active BDM Mode Bit 0 Allows the COP and RTI to keep running in Active BDM mode. 1 Stops the COP and RTI counters whenever the part is in Active BDM mode. 6 RSBCK Write Mask for WCOP and CR[2:0] Bit -- This write-only bit serves as a mask for the WCOP and CR[2:0] bits 5 WRTMASK while writing the COPCTL register. It is intended for BDM writing the RSBCK without touching the contents of WCOP and CR[2:0]. 0 Write of WCOP and CR[2:0] has an effect with this write of COPCTL 1 Write of WCOP and CR[2:0] has no effect with this write of COPCTL. (Does not count for "write once".) 2-0 CR[2:0] COP Watchdog Timer Rate Select -- These bits select the COP time-out rate (see Table 11-13). Writing a nonzero value to CR[2:0] enables the COP counter and starts the time-out period. A COP counter time-out causes a system reset. This can be avoided by periodically (before time-out) reinitialize the COP counter via the ARMCOP register. While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at highest time-out period (2 24 cycles) in normal COP mode (Window COP mode disabled): 1) COP is enabled (CR[2:0] is not 000) 2) BDM mode active 3) RSBCK = 0 4) Operation in emulation or special modes Table 11-13. COP Watchdog Rates(1) CR2 0 0 0 0 1 1 1 CR1 0 0 1 1 0 0 1 CR0 0 1 0 1 0 1 0 OSCCLK Cycles to Timeout COP disabled 2 14 2 16 2 18 2 20 2 22 2 23 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 481 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-13. COP Watchdog Rates(1) CR2 CR1 CR0 OSCCLK Cycles to Timeout 1 1 1 2 24 1. OSCCLK cycles are referenced from the previous COP time-out reset (writing $55/$AA to the ARMCOP register) 11.3.2.10 Reserved Register (FORBYP) NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special modes can alter the S12XECRG's functionality. Module Base + 0x0009 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-12. Reserved Register (FORBYP) Read: Always read $00 except in special modes Write: Only in special modes 11.3.2.11 Reserved Register (CTCTL) NOTE This reserved register is designed for factory test purposes only, and is not intended for general user access. Writing to this register when in special test modes can alter the S12XECRG's functionality. Module Base + 0x000A 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 11-13. Reserved Register (CTCTL) Read: Always read $00 except in special modes MC9S12XE-Family Reference Manual , Rev. 1.21 482 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Write: Only in special modes 11.3.2.12 S12XECRG COP Timer Arm/Reset Register (ARMCOP) This register is used to restart the COP time-out period. Module Base + 0x000B 7 6 5 4 3 2 1 0 R W Reset 0 Bit 7 0 0 Bit 6 0 0 Bit 5 0 0 Bit 4 0 0 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 Figure 11-14. S12XECRG ARMCOP Register Diagram Read: Always reads $00 Write: Anytime When the COP is disabled (CR[2:0] = "000") writing to this register has no effect. When the COP is enabled by setting CR[2:0] nonzero, the following applies: Writing any value other than $55 or $AA causes a COP reset. To restart the COP time-out period you must write $55 followed by a write of $AA. Other instructions may be executed between these writes but the sequence ($55, $AA) must be completed prior to COP end of time-out period to avoid a COP reset. Sequences of $55 writes or sequences of $AA writes are allowed. When the WCOP bit is set, $55 and $AA writes must be done in the last 25% of the selected time-out period; writing any value in the first 75% of the selected period will cause a COP reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 483 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4 11.4.1 Functional Description Functional Blocks Phase Locked Loop with Internal Filter (IPLL) 11.4.1.1 The IPLL is used to run the MCU from a different time base than the incoming OSCCLK. Figure 11-15 shows a block diagram of the IPLL. REFCLK EXTAL REDUCED CONSUMPTION OSCILLATOR XTAL OSCCLK REFDIV[5:0] FBCLK LOCK DETECTOR LOCK REFERENCE PROGRAMMABLE DIVIDER VDDPLL/VSSPLL PDET PHASE DETECTOR UP DOWN CPUMP AND FILTER VCOCLK VCO CLOCK MONITOR LOOP PROGRAMMABLE DIVIDER SYNDIV[5:0] Supplied by: VDDPLL/VSSPLL VDD/VSS POST PROGRAMMABLE DIVIDER POSTDIV[4:0] PLLCLK Figure 11-15. IPLL Functional Diagram For increased flexibility, OSCCLK can be divided in a range of 1 to 64 to generate the reference frequency REFCLK using the REFDIV[5:0] bits. This offers a finer multiplication granularity. Based on the SYNDIV[5:0] bits the IPLL generates the VCOCLK by multiplying the reference clock by a multiple of 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits the VCOCLK can be divided in a range of 1,2,4,6,8,... to 62 to generate the PLLCLK. . SYNDIV + 1 f PLL = 2 x f OSC x ----------------------------------------------------------------------------[ REFDIV + 1 ] [ 2 x POSTDIV ] NOTE Although it is possible to set the dividers to command a very high clock frequency, do not exceed the specified bus frequency limit for the MCU. If (PLLSEL = 1) then fBUS = fPLL / 2. IF POSTDIV = $00 the fPLL is identical to fVCO (divide by one) Several examples of IPLL divider settings are shown in Table 11-14. Shaded rows indicated that these settings are not recommended. The following rules help to achieve optimum stability and shortest lock time: * Use lowest possible fVCO / fREF ratio (SYNDIV value). * Use highest possible REFCLK frequency fREF. MC9S12XE-Family Reference Manual , Rev. 1.21 484 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-14. Examples of IPLL Divider Settings fOSC 4MHz 8MHz 4MHz 8MHz 4MHz 4MHz 4MHz 4MHz REFDIV[5:0] $01 $03 $00 $00 $00 $01 $03 $03 fREF 2MHz 2MHz 4MHz 8MHz 4MHz 2MHz 1MHz 1MHz REFFRQ[1:0] SYNDIV[5:0] 01 01 01 10 01 01 00 00 $18 $18 $09 $04 $03 $18 $18 $31 fVCO 100MHz 100MHz 80MHz 80MHz 32MHz 100MHz 50MHz 100MHz VCOFRQ[1:0] POSTDIV[4:0] 11 11 01 01 00 11 01 11 $00 $00 $00 $00 $01 $01 $00 $01 fPLL fBUS 100MHz 50 MHz 100MHz 50 MHz 80MHz 80MHz 16MHz 50MHz 50MHz 50MHz 40MHz 40MHz 8MHz 25MHz 25MHz 25MHz 11.4.1.1.1 IPLL Operation The oscillator output clock signal (OSCCLK) is fed through the reference programmable divider and is divided in a range of 1 to 64 (REFDIV+1) to output the REFCLK. The VCO output clock, (VCOCLK) is fed back through the programmable loop divider and is divided in a range of 2 to 128 in increments of [2 x (SYNDIV +1)] to output the FBCLK. The VCOCLK is fed to the final programmable divider and is divided in a range of 1,2,4,6,8,... to 62 (2*POSTDIV) to output the PLLCLK. See Figure 11-15. The phase detector then compares the FBCLK, with the REFCLK. Correction pulses are generated based on the phase difference between the two signals. The loop filter then slightly alters the DC voltage on the internal filter capacitor, based on the width and direction of the correction pulse. The user must select the range of the REFCLK frequency and the range of the VCOCLK frequency to ensure that the correct IPLL loop bandwidth is set. The lock detector compares the frequencies of the FBCLK, and the REFCLK. Therefore, the speed of the lock detector is directly proportional to the reference clock frequency. The circuit determines the lock condition based on this comparison. If IPLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and then check the LOCK bit. If interrupt requests are disabled, software can poll the LOCK bit continuously (during IPLL start-up, usually) or at periodic intervals. In either case, only when the LOCK bit is set, the PLLCLK can be selected as the source for the system and core clocks. If the IPLL is selected as the source for the system and core clocks and the LOCK bit is clear, the IPLL has suffered a severe noise hit and the software must take appropriate action, depending on the application. * The LOCK bit is a read-only indicator of the locked state of the IPLL. * The LOCK bit is set when the VCO frequency is within a certain tolerance, Lock, and is cleared when the VCO frequency is out of a certain tolerance, unl. * Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the LOCK bit. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 485 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.2 System Clocks Generator PLLSEL or SCM PHASE LOCK LOOP (IIPLL) PLLCLK 1 0 STOP SYSCLK Core Clock SCM /2 EXTAL OSCILLATOR OSCCLK 1 0 WAIT(RTIWAI), STOP(PSTP, PRE), RTI ENABLE CLOCK PHASE GENERATOR Bus Clock RTI XTAL WAIT(COPWAI), STOP(PSTP, PCE), COP ENABLE Clock Monitor COP STOP Gating Condition = Clock Gate Oscillator Clock Figure 11-16. System Clocks Generator The clock generator creates the clocks used in the MCU (see Figure 11-16). The gating condition placed on top of the individual clock gates indicates the dependencies of different modes (STOP, WAIT) and the setting of the respective configuration bits. The peripheral modules use the Bus Clock. Some peripheral modules also use the Oscillator Clock. If the MCU enters Self Clock Mode (see Section 11.4.2.2, "Self Clock Mode") Oscillator clock source is switched to PLLCLK running at its minimum frequency fSCM. The Bus Clock is used to generate the clock visible at the ECLK pin. The Core Clock signal is the clock for the CPU. The Core Clock is twice the Bus Clock. But note that a CPU cycle corresponds to one Bus Clock. IPLL clock mode is selected with PLLSEL bit in the CLKSEL register. When selected, the IPLL output clock drives SYSCLK for the main system including the CPU and peripherals. The IPLL cannot be turned off by clearing the PLLON bit, if the IPLL clock is selected. When PLLSEL is changed, it takes a maximum of 4 OSCCLK plus 4 PLLCLK cycles to make the transition. During the transition, all clocks freeze and CPU activity ceases. MC9S12XE-Family Reference Manual , Rev. 1.21 486 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.3 Clock Monitor (CM) If no OSCCLK edges are detected within a certain time, the clock monitor within the oscillator block generates a clock monitor fail event. The S12XECRG then asserts self clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated by the oscillator block.The clock monitor function is enabled/disabled by the CME control bit. 11.4.1.4 Clock Quality Checker The clock monitor performs a coarse check on the incoming clock signal. The clock quality checker provides a more accurate check in addition to the clock monitor. A clock quality check is triggered by any of the following events: * Power on reset (POR) * Low voltage reset (LVR) * Wake-up from Full Stop Mode (exit full stop) * Clock Monitor fail indication (CM fail) A time window of 50000 PLLCLK cycles1 is called check window. A number greater equal than 4096 rising OSCCLK edges within a check window is called osc ok. Note that osc ok immediately terminates the current check window. See Figure 11-17 as an example. CHECK WINDOW 1 PLLCLK 1 OSCCLK 4095 OSC OK 2 3 4 5 4096 2 3 49999 50000 Figure 11-17. Check Window Example 1. IPLL is running at self clock mode frequency fSCM. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 487 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The Sequence for clock quality check is shown in Figure 11-18. CLOCK OK CM FAIL NO POR LVR EXIT FULL STOP SCME=1 & FSTWKP=1 ? NO YES NUM = 0 ENTER SCM FSTWKP = 0 ? YES CLOCK MONITOR RESET NUM = 50 ENTER SCM YES NO SCM ACTIVE? NUM = 0 CHECK WINDOW NUM = NUM-1 YES YES NO SCME = 1 ? NO OSC OK ? YES SCM ACTIVE? NO NO NUM > 0 ? YES SWITCH TO OSCCLK EXIT SCM Figure 11-18. Sequence for Clock Quality Check NOTE Remember that in parallel to additional actions caused by Self Clock Mode or Clock Monitor Reset1 handling the clock quality checker continues to check the OSCCLK signal. NOTE The Clock Quality Checker enables the IPLL and the voltage regulator (VREG) anytime a clock check has to be performed. An ongoing clock quality check could also cause a running IPLL (fSCM) and an active VREG during Pseudo Stop Mode. 1. A Clock Monitor Reset will always set the SCME bit to logical'1'. MC9S12XE-Family Reference Manual , Rev. 1.21 488 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.1.5 Computer Operating Properly Watchdog (COP) The COP (free running watchdog timer) enables the user to check that a program is running and sequencing properly. When the COP is being used, software is responsible for keeping the COP from timing out. If the COP times out it is an indication that the software is no longer being executed in the intended sequence; thus a system reset is initiated (see Section 11.4.1.5, "Computer Operating Properly Watchdog (COP)"). The COP runs with a gated OSCCLK. Three control bits in the COPCTL register allow selection of seven COP time-out periods. When COP is enabled, the program must write $55 and $AA (in this order) to the ARMCOP register during the selected time-out period. Once this is done, the COP time-out period is restarted. If the program fails to do this and the COP times out, the part will reset. Also, if any value other than $55 or $AA is written, the part is immediately reset. Windowed COP operation is enabled by setting WCOP in the COPCTL register. In this mode, writes to the ARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period. A premature write will immediately reset the part. If PCE bit is set, the COP will continue to run in Pseudo Stop Mode. 11.4.1.6 Real Time Interrupt (RTI) The RTI can be used to generate a hardware interrupt at a fixed periodic rate. If enabled (by setting RTIE=1), this interrupt will occur at the rate selected by the RTICTL register. The RTI runs with a gated OSCCLK. At the end of the RTI time-out period the RTIF flag is set to one and a new RTI time-out period starts immediately. A write to the RTICTL register restarts the RTI time-out period. If the PRE bit is set, the RTI will continue to run in Pseudo Stop Mode. 11.4.2 11.4.2.1 Operation Modes Normal Mode The S12XECRG block behaves as described within this specification in all normal modes. 11.4.2.2 Self Clock Mode If the external clock frequency is not available due to a failure or due to long crystal start-up time, the Bus Clock and the Core Clock are derived from the PLLCLK running at self clock mode frequency fSCM; this mode of operation is called Self Clock Mode. This requires CME = 1 and SCME = 1, which is the default after reset. If the MCU was clocked by the PLLCLK prior to entering Self Clock Mode, the PLLSEL bit will be cleared. If the external clock signal has stabilized again, the S12XECRG will automatically select OSCCLK to be the system clock and return to normal mode. See Section 11.4.1.4, "Clock Quality Checker" for more information on entering and leaving Self Clock Mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 489 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) NOTE In order to detect a potential clock loss the CME bit should always be enabled (CME = 1). If CME bit is disabled and the MCU is configured to run on PLLCLK, a loss of external clock (OSCCLK) will not be detected and will cause the system clock to drift towards lower frequencies. As soon as the external clock is available again the system clock ramps up to its IPLL target frequency. If the MCU is running on external clock any loss of clock will cause the system to go static. 11.4.3 Low Power Options This section summarizes the low power options available in the S12XECRG. 11.4.3.1 Run Mode This is the default mode after reset. The RTI can be stopped by setting the associated rate select bits to zero. The COP can be stopped by setting the associated rate select bits to zero. 11.4.3.2 Wait Mode The WAI instruction puts the MCU in a low power consumption stand-by mode depending on setting of the individual bits in the CLKSEL register. All individual Wait Mode configuration bits can be superposed. This provides enhanced granularity in reducing the level of power consumption during Wait Mode. Table 11-15 lists the individual configuration bits and the parts of the MCU that are affected in Wait Mode. Table 11-15. MCU Configuration During Wait Mode PLLWAI IPLL RTI COP RTIWAI COPWAI Stopped -- -- -- Stopped -- -- -- Stopped After executing the WAI instruction the core requests the S12XECRG to switch MCU into Wait Mode. The S12XECRG then checks whether the PLLWAI bit is asserted. Depending on the configuration the S12XECRG switches the system and core clocks to OSCCLK by clearing the PLLSEL bit and disables the IPLL. There are two ways to restart the MCU from Wait Mode: 1. Any reset 2. Any interrupt MC9S12XE-Family Reference Manual , Rev. 1.21 490 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.4.3.3 Stop Mode All clocks are stopped in STOP mode, dependent of the setting of the PCE, PRE and PSTP bit. The oscillator is disabled in STOP mode unless the PSTP bit is set. If the PRE or PCE bits are set, the RTI or COP continues to run in Pseudo Stop Mode. In addition to disabling system and core clocks the S12XECRG requests other functional units of the MCU (e.g. voltage-regulator) to enter their individual power saving modes (if available). If the PLLSEL bit is still set when entering Stop Mode, the S12XECRG will switch the system and core clocks to OSCCLK by clearing the PLLSEL bit. Then the S12XECRG disables the IPLL, disables the core clock and finally disables the remaining system clocks. If Pseudo Stop Mode is entered from Self-Clock Mode the S12XECRG will continue to check the clock quality until clock check is successful. In this case the IPLL and the voltage regulator (VREG) will remain enabled. If Full Stop Mode (PSTP = 0) is entered from Self-Clock Mode the ongoing clock quality check will be stopped. A complete timeout window check will be started when Stop Mode is left again. There are two ways to restart the MCU from Stop Mode: 1. Any reset 2. Any interrupt If the MCU is woken-up from Full Stop Mode by an interrupt and the fast wake-up feature is enabled (FSTWKP=1 and SCME=1), the system will immediately (no clock quality check) resume operation in Self-Clock Mode (see Section 11.4.1.4, "Clock Quality Checker"). The SCMIF flag will not be set for this special case. The system will remain in Self-Clock Mode with oscillator disabled until FSTWKP bit is cleared. The clearing of FSTWKP will start the oscillator and the clock quality check. If the clock quality check is successful, the S12XECRG will switch all system clocks to oscillator clock. The SCMIF flag will be set. See application examples in Figure 11-19 and Figure 11-20. Because the IPLL has been powered-down during Stop Mode the PLLSEL bit is cleared and the MCU runs on OSCCLK after leaving Stop-Mode. The software must manually set the PLLSEL bit again, in order to switch system and core clocks to the PLLCLK. NOTE In Full Stop Mode or Self-Clock Mode caused by the fast wake-up feature the clock monitor and the oscillator are disabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 491 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) CPU resumes program execution immediately Instruction STOP FSTWKP=1 SCME=1 IRQ service Interrupt STOP IRQ service Interrupt Power Saving Oscillator Clock Oscillator Disabled PLL Clock Core Clock Self-Clock Mode Interrupt STOP IRQ service Figure 11-19. Fast Wake-up from Full Stop Mode: Example 1 . CPU resumes program execution immediately Instruction STOP FSTWKP=1 SCME=1 IRQ Interrupt FSTWKP=0 SCMIE=1 IRQ Service Frequent Uncritical Frequent Critical Instructions Instructions Possible SCM Interrupt Oscillator Clock Oscillator Disabled Osc Startup PLL Clock Core Clock Self-Clock Mode Clock Quality Check Figure 11-20. Fast Wake-up from Full Stop Mode: Example 2 11.5 Resets All reset sources are listed in Table 11-16. Refer to MCU specification for related vector addresses and priorities. Table 11-16. Reset Summary Reset Source Power on Reset Low Voltage Reset External Reset Illegal Address Reset Clock Monitor Reset Local Enable None None None None PLLCTL (CME=1, SCME=0) MC9S12XE-Family Reference Manual , Rev. 1.21 492 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) Table 11-16. Reset Summary Reset Source COP Watchdog Reset Local Enable COPCTL (CR[2:0] nonzero) 11.5.1 Description of Reset Operation The reset sequence is initiated by any of the following events: * Low level is detected at the RESET pin (External Reset). * Power on is detected. * Low voltage is detected. * Illegal Address Reset is detected (see S12XMMC Block Guide for details). * COP watchdog times out. * Clock monitor failure is detected and Self-Clock Mode was disabled (SCME=0). Upon detection of any reset event, an internal circuit drives the RESET pin low for 128 SYSCLK cycles (see Figure 11-21). Since entry into reset is asynchronous it does not require a running SYSCLK. However, the internal reset circuit of the S12XECRG cannot sequence out of current reset condition without a running SYSCLK. The number of 128 SYSCLK cycles might be increased by n = 3 to 6 additional SYSCLK cycles depending on the internal synchronization latency. After 128+n SYSCLK cycles the RESET pin is released. The reset generator of the S12XECRG waits for additional 64 SYSCLK cycles and then samples the RESET pin to determine the originating source. Table 11-17 shows which vector will be fetched. Table 11-17. Reset Vector Selection Sampled RESET Pin Clock Monitor COP (64 cycles after release) Reset Pending Reset Pending 1 0 0 Vector Fetch POR / LVR / Illegal Address Reset/ External Reset Clock Monitor Reset COP Reset POR / LVR / Illegal Address Reset/ External Reset with rise of RESET pin 1 1 0 1 0 X X 1 X NOTE External circuitry connected to the RESET pin should not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one within 64 SYSCLK cycles after the low drive is released. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 493 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) The internal reset of the MCU remains asserted while the reset generator completes the 192 SYSCLK long reset sequence. In case the RESET pin is externally driven low for more than these 192 SYSCLK cycles (External Reset), the internal reset remains asserted longer. Figure 11-21. RESET Timing RESET )( )( RESET pin released ICRG drives RESET pin low SYSCLK ) ( 128+n cycles possibly SYSCLK not running with n being min 3 / max 6 cycles depending on internal synchronization delay ) ( 64 cycles ) ( possibly RESET driven low externally 11.5.1.1 Clock Monitor Reset The S12XECRG generates a Clock Monitor Reset in case all of the following conditions are true: * Clock monitor is enabled (CME = 1) * Loss of clock is detected * Self-Clock Mode is disabled (SCME = 0). The reset event asynchronously forces the configuration registers to their default settings. In detail the CME and the SCME are reset to logical `1' (which changes the state of the SCME bit. As a consequence the S12XECRG immediately enters Self Clock Mode and starts its internal reset sequence. In parallel the clock quality check starts. As soon as clock quality check indicates a valid Oscillator Clock the S12XECRG switches to OSCCLK and leaves Self Clock Mode. Since the clock quality checker is running in parallel to the reset generator, the S12XECRG may leave Self Clock Mode while still completing the internal reset sequence. 11.5.1.2 Computer Operating Properly Watchdog (COP) Reset When COP is enabled, the S12XECRG expects sequential write of $55 and $AA (in this order) to the ARMCOP register during the selected time-out period. Once this is done, the COP time-out period restarts. If the program fails to do this the S12XECRG will generate a reset. 11.5.1.3 Power On Reset, Low Voltage Reset The on-chip voltage regulator detects when VDD to the MCU has reached a certain level and asserts power on reset or low voltage reset or both. As soon as a power on reset or low voltage reset is triggered the MC9S12XE-Family Reference Manual , Rev. 1.21 494 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) S12XECRG performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid Oscillator Clock signal the reset sequence starts using the Oscillator clock. If after 50 check windows the clock quality check indicated a non-valid Oscillator Clock the reset sequence starts using Self-Clock Mode. Figure 11-22 and Figure 11-23 show the power-up sequence for cases when the RESET pin is tied to VDD and when the RESET pin is held low. Clock Quality Check (no Self-Clock Mode) )( RESET Internal POR )( 128 SYSCLK Internal RESET )( 64 SYSCLK Figure 11-22. RESET Pin Tied to VDD (by a Pull-up Resistor) RESET Clock Quality Check (no Self Clock Mode) )( Internal POR )( 128 SYSCLK Internal RESET )( 64 SYSCLK Figure 11-23. RESET Pin Held Low Externally 11.6 Interrupts The interrupts/reset vectors requested by the S12XECRG are listed in Table 11-18. Refer to MCU specification for related vector addresses and priorities. Table 11-18. S12XECRG Interrupt Vectors Interrupt Source Real time interrupt LOCK interrupt SCM interrupt CCR Mask I bit I bit I bit Local Enable CRGINT (RTIE) CRGINT (LOCKIE) CRGINT (SCMIE) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 495 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 11 S12XE Clocks and Reset Generator (S12XECRGV1) 11.6.1 11.6.1.1 Description of Interrupt Operation Real Time Interrupt The S12XECRG generates a real time interrupt when the selected interrupt time period elapses. RTI interrupts are locally disabled by setting the RTIE bit to zero. The real time interrupt flag (RTIF) is set to1 when a timeout occurs, and is cleared to 0 by writing a 1 to the RTIF bit. The RTI continues to run during Pseudo Stop Mode if the PRE bit is set to 1. This feature can be used for periodic wakeup from Pseudo Stop if the RTI interrupt is enabled. 11.6.1.2 IPLL Lock Interrupt The S12XECRG generates a IPLL Lock interrupt when the LOCK condition of the IPLL has changed, either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the LOCKIE bit to zero. The IPLL Lock interrupt flag (LOCKIF) is set to1 when the LOCK condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit. 11.6.1.3 Self Clock Mode Interrupt The S12XECRG generates a Self Clock Mode interrupt when the SCM condition of the system has changed, either entered or exited Self Clock Mode. SCM conditions are caused by a failing clock quality check after power on reset (POR) or low voltage reset (LVR) or recovery from Full Stop Mode (PSTP = 0) or Clock Monitor failure. For details on the clock quality check refer to Section 11.4.1.4, "Clock Quality Checker". If the clock monitor is enabled (CME = 1) a loss of external clock will also cause a SCM condition (SCME = 1). SCM interrupts are locally disabled by setting the SCMIE bit to zero. The SCM interrupt flag (SCMIF) is set to1 when the SCM condition has changed, and is cleared to 0 by writing a 1 to the SCMIF bit. MC9S12XE-Family Reference Manual , Rev. 1.21 496 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) Table 12-1. Revision History Revision Number V01.05 V02.00 Revision Date 19 Jul 2006 04 Aug 2006 Sections Affected Description of Changes - All xclks info was removed - Incremented revision to match the design system spec revision 12.1 Introduction The Pierce oscillator (XOSC) module provides a robust, low-noise and low-power clock source. The module will be operated from the VDDPLL supply rail (1.8 V nominal) and require the minimum number of external components. It is designed for optimal start-up margin with typical crystal oscillators. 12.1.1 Features The XOSC will contain circuitry to dynamically control current gain in the output amplitude. This ensures a signal with low harmonic distortion, low power and good noise immunity. * High noise immunity due to input hysteresis * Low RF emissions with peak-to-peak swing limited dynamically * Transconductance (gm) sized for optimum start-up margin for typical oscillators * Dynamic gain control eliminates the need for external current limiting resistor * Integrated resistor eliminates the need for external bias resistor in loop controlled Pierce mode. * Low power consumption: -- Operates from 1.8 V (nominal) supply -- Amplitude control limits power * Clock monitor 12.1.2 Modes of Operation Two modes of operation exist: 1. Loop controlled Pierce (LCP) oscillator 2. External square wave mode featuring also full swing Pierce (FSP) without internal bias resistor The oscillator mode selection is described in the Device Overview section, subsection Oscillator Configuration. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 497 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.1.3 Block Diagram Figure 12-1 shows a block diagram of the XOSC. Monitor_Failure Clock Monitor OSCCLK Peak Detector Gain Control VDDPLL = 1.8 V Rf EXTAL XTAL Figure 12-1. XOSC Block Diagram 12.2 External Signal Description This section lists and describes the signals that connect off chip 12.2.1 VDDPLL and VSSPLL -- Operating and Ground Voltage Pins Theses pins provides operating voltage (VDDPLL) and ground (VSSPLL) for the XOSC circuitry. This allows the supply voltage to the XOSC to use an independent bypass capacitor. 12.2.2 EXTAL and XTAL -- Input and Output Pins These pins provide the interface for either a crystal or a 1.8V CMOS compatible clock to control the internal clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. The MCU internal system clock is derived MC9S12XE-Family Reference Manual , Rev. 1.21 498 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) from the EXTAL input frequency. In full stop mode (PSTP = 0), the EXTAL pin is pulled down by an internal resistor of typical 200 k. NOTE Freescale recommends an evaluation of the application board and chosen resonator or crystal by the resonator or crystal supplier. Loop controlled circuit is not suited for overtone resonators and crystals. EXTAL C1 MCU XTAL C2 VSSPLL Crystal or Ceramic Resonator Figure 12-2. Loop Controlled Pierce Oscillator Connections (LCP mode selected) NOTE Full swing Pierce circuit is not suited for overtone resonators and crystals without a careful component selection. EXTAL C1 MCU RS* XTAL C2 VSSPLL * Rs can be zero (shorted) when use with higher frequency crystals. Refer to manufacturer's data. RB Crystal or Ceramic Resonator Figure 12-3. Full Swing Pierce Oscillator Connections (FSP mode selected) EXTAL MCU XTAL CMOS Compatible External Oscillator (VDDPLL Level) Not Connected Figure 12-4. External Clock Connections (FSP mode selected) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 499 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 12 Pierce Oscillator (S12XOSCLCPV2) 12.3 Memory Map and Register Definition The CRG contains the registers and associated bits for controlling and monitoring the oscillator module. 12.4 Functional Description The XOSC module has control circuitry to maintain the crystal oscillator circuit voltage level to an optimal level which is determined by the amount of hysteresis being used and the maximum oscillation range. The oscillator block has two external pins, EXTAL and XTAL. The oscillator input pin, EXTAL, is intended to be connected to either a crystal or an external clock source. The XTAL pin is an output signal that provides crystal circuit feedback. A buffered EXTAL signal becomes the internal clock. To improve noise immunity, the oscillator is powered by the VDDPLL and VSSPLL power supply pins. 12.4.1 Gain Control In LCP mode a closed loop control system will be utilized whereby the amplifier is modulated to keep the output waveform sinusoidal and to limit the oscillation amplitude. The output peak to peak voltage will be kept above twice the maximum hysteresis level of the input buffer. Electrical specification details are provided in the Electrical Characteristics appendix. 12.4.2 Clock Monitor The clock monitor circuit is based on an internal RC time delay so that it can operate without any MCU clocks. If no OSCCLK edges are detected within this RC time delay, the clock monitor indicates failure which asserts self-clock mode or generates a system reset depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated.The clock monitor function is enabled/disabled by the CME control bit, described in the CRG block description chapter. 12.4.3 Wait Mode Operation During wait mode, XOSC is not impacted. 12.4.4 Stop Mode Operation XOSC is placed in a static state when the part is in stop mode except when pseudo-stop mode is enabled. During pseudo-stop mode, XOSC is not impacted. MC9S12XE-Family Reference Manual , Rev. 1.21 500 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-1. Revision History Revision Number V01.00 V01.01 Revision Date 13 Oct. 2005 04 Mar. 2008 Sections Affected - Initial version corrected reference to DJM bit Description of Changes 13.1 Introduction The ADC12B16C is a 16-channel, 12-bit, multiplexed input successive approximation analog-to-digital converter. Refer to device electrical specifications for ATD accuracy. 13.1.1 * * * * * * * * * * * * * * Features * 8-, 10-, or 12-bit resolution. Conversion in Stop Mode using internally generated clock Automatic return to low power after conversion sequence Automatic compare with interrupt for higher than or less/equal than programmable value Programmable sample time. Left/right justified result data. External trigger control. Sequence complete interrupt. Analog input multiplexer for 16 analog input channels. Special conversions for VRH, VRL, (VRL+VRH)/2. 1-to-16 conversion sequence lengths. Continuous conversion mode. Multiple channel scans. Configurable external trigger functionality on any AD channel or any of four additional trigger inputs. The four additional trigger inputs can be chip external or internal. Refer to device specification for availability and connectivity. Configurable location for channel wrap around (when converting multiple channels in a sequence). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 501 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1.2 13.1.2.1 Modes of Operation Conversion Modes There is software programmable selection between performing single or continuous conversion on a single channel or multiple channels. 13.1.2.2 * MCU Operating Modes * * Stop Mode -- ICLKSTP=0 (in ATDCTL2 register) Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted sequence all flags are cleared etc. -- ICLKSTP=1 (in ATDCTL2 register) A/D conversion sequence seamless continues in Stop Mode based on the internally generated clock ICLK as ATD clock. For conversions during transition from Run to Stop Mode or vice versa the result is not written to the results register, no CCF flag is set and no compare is done. When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time. Wait Mode ADC12B16C behaves same in Run and Wait Mode. For reduced power consumption continuos conversions should be aborted before entering Wait mode. Freeze Mode In Freeze Mode the ADC12B16C will either continue or finish or stop converting according to the FRZ1 and FRZ0 bits. This is useful for debugging and emulation. MC9S12XE-Family Reference Manual , Rev. 1.21 502 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.1.3 Block Diagram Bus Clock ICLK Clock Prescaler Trigger Mux Internal Clock ATD_12B16C Sequence Complete Interrupt Compare Interrupt ATD Clock ETRIG0 ETRIG1 ETRIG2 ETRIG3 (See device specification for availability and connectivity) ATDCTL1 ATDDIEN Mode and Timing Control VDDA VSSA VRH VRL AN15 AN14 AN13 AN12 AN11 AN10 AN9 AN8 Analog MUX Sample & Hold Successive Approximation Register (SAR) and DAC Results ATD 0 ATD 1 ATD 2 ATD 3 ATD 4 ATD 5 ATD 6 ATD 7 ATD 8 ATD 9 ATD 10 ATD 11 ATD 12 ATD 13 ATD 14 ATD 15 + Comparator AN7 AN6 AN5 AN4 AN3 AN2 AN1 AN0 Figure 13-1. ADC12B16C Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 503 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.2 Signal Description This section lists all inputs to the ADC12B16C block. 13.2.1 13.2.1.1 Detailed Signal Descriptions ANx (x = 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger for the ATD conversion. 13.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0 These inputs can be configured to serve as an external trigger for the ATD conversion. Refer to device specification for availability and connection of these inputs! 13.2.1.3 VRH, VRL VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion. 13.2.1.4 VDDA, VSSA These pins are the power supplies for the analog circuitry of the ADC12B16C block. 13.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the ADC12B16C. 13.3.1 Module Memory Map NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. Figure 13-2 gives an overview on all ADC12B16C registers. Address 0x0000 0x0001 0x0002 Name ATDCTL0 ATDCTL1 ATDCTL2 Bit 7 R Reserved W R ETRIGSEL W R 0 W 6 0 5 0 4 0 3 WRAP3 2 WRAP2 1 WRAP1 Bit 0 WRAP0 SRES1 AFFC SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 ETRIGP ETRIGE ASCIE ACMPIE ICLKSTP ETRIGLE = Unimplemented or Reserved Figure 13-2. ADC12B16C Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 504 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Address 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 0x000A 0x000B 0x000C 0x000D Name ATDCTL3 ATDCTL4 ATDCTL5 ATDSTAT0 Unimplemented ATDCMPEH ATDCMPEL ATDSTAT2H ATDSTAT2L ATDDIENH ATDDIENL R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 DJM SMP2 0 6 S8C SMP1 SC 0 0 5 S4C SMP0 SCAN ETORF 0 4 S2C 3 S1C 2 FIFO PRS[4:0] 1 FRZ1 Bit 0 FRZ0 MULT FIFOR 0 CD CC3 0 CC CC2 0 CB CC1 0 CA CC0 0 SCF 0 CMPE[15:8] CMPE[7:0] CCF[15:8] CCF[7:0] IEN[15:8] IEN[7:0] CMPHT[15:8] CMPHT[7:0] See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" = Unimplemented or Reserved 0x000E ATDCMPHTH 0x000F ATDCMPHTL 0x0010 0x0012 0x0014 0x0016 0x0018 0x001A 0x001C 0x001E 0x0020 0x0022 ATDDR0 ATDDR1 ATDDR2 ATDDR3 ATDDR4 ATDDR5 ATDDR6 ATDDR7 ATDDR8 ATDDR9 Figure 13-2. ADC12B16C Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 505 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Address 0x0024 0x0026 0x0028 0x002A 0x002C 0x002E Name ATDDR10 ATDDR11 ATDDR12 ATDDR13 ATDDR14 ATDDR15 R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" See Section 13.3.2.12.1, "Left Justified Result Data (DJM=0)" and Section 13.3.2.12.2, "Right Justified Result Data (DJM=1)" = Unimplemented or Reserved Bit 0 Figure 13-2. ADC12B16C Register Summary (Sheet 3 of 3) 13.3.2 Register Descriptions This section describes in address order all the ADC12B16C registers and their individual bits. 13.3.2.1 ATD Control Register 0 (ATDCTL0) Writes to this register will abort current conversion sequence. Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset Reserved 0 0 0 0 0 0 0 WRAP3 1 WRAP2 1 WRAP1 1 WRAP0 1 = Unimplemented or Reserved Figure 13-3. ATD Control Register 0 (ATDCTL0) Read: Anytime Write: Anytime, in special modes always write 0 to Reserved Bit 7. Table 13-2. ATDCTL0 Field Descriptions Field Description 3-0 WRAP[3-0] Wrap Around Channel Select Bits -- These bits determine the channel for wrap around when doing multichannel conversions. The coding is summarized in Table 13-3. Table 13-3. Multi-Channel Wrap Around Coding WRAP3 WRAP2 WRAP1 WRAP0 0 0 0 0 Multiple Channel Conversions (MULT = 1) Wraparound to AN0 after Converting Reserved(1) MC9S12XE-Family Reference Manual , Rev. 1.21 506 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-3. Multi-Channel Wrap Around Coding WRAP3 WRAP2 WRAP1 WRAP0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Multiple Channel Conversions (MULT = 1) Wraparound to AN0 after Converting AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 1 1 1 1 1. If only AN0 should be converted use MULT=0. 13.3.2.2 ATD Control Register 1 (ATDCTL1) Writes to this register will abort current conversion sequence. Module Base + 0x0001 7 6 5 4 3 2 1 0 R ETRIGSEL W Reset 0 0 1 0 1 1 1 1 SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 Figure 13-4. ATD Control Register 1 (ATDCTL1) Read: Anytime Write: Anytime Table 13-4. ATDCTL1 Field Descriptions Field 7 ETRIGSEL Description External Trigger Source Select -- This bit selects the external trigger source to be either one of the AD channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG30 inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has not effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for external trigger. The coding is summarized in Table 13-6. A/D Resolution Select -- These bits select the resolution of A/D conversion results. See Table 13-5 for coding. 6-5 SRES[1:0] MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 507 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-4. ATDCTL1 Field Descriptions (continued) Field 4 SMP_DIS Description Discharge Before Sampling Bit 0 No discharge before sampling. 1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to the sampling time. This can help to detect an open circuit instead of measuring the previous sampled channel. 3-0 External Trigger Channel Select -- These bits select one of the AD channels or one of the ETRIG3-0 inputs ETRIGCH[3:0] as source for the external trigger. The coding is summarized in Table 13-6. Table 13-5. A/D Resolution Coding SRES1 0 0 1 1 SRES0 0 1 0 1 A/D Resolution 8-bit data 10-bit data 12-bit data Reserved Table 13-6. External Trigger Channel Select Coding ETRIGSEL 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 ETRIGCH3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 ETRIGCH2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 ETRIGCH1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 X ETRIGCH0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X External trigger source is AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 ETRIG0(1) ETRIG11 ETRIG21 ETRIG31 Reserved 1 1 X X X Reserved 1. Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means external trigger source is still on one of the AD channels selected by ETRIGCH3-0 MC9S12XE-Family Reference Manual , Rev. 1.21 508 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.3 ATD Control Register 2 (ATDCTL2) Writes to this register will abort current conversion sequence. Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 AFFC 0 0 ICLKSTP 0 ETRIGLE 0 ETRIGP 0 ETRIGE 0 ASCIE 0 ACMPIE 0 = Unimplemented or Reserved Figure 13-5. ATD Control Register 2 (ATDCTL2) Read: Anytime Write: Anytime Table 13-7. ATDCTL2 Field Descriptions Field 6 AFFC Description ATD Fast Flag Clear All 0 ATD flag clearing done by write 1 to respective CCF[n] flag. 1 Changes all ATD conversion complete flags to a fast clear sequence. For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag to clear automatically. For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag to clear automatically. Internal Clock in Stop Mode Bit -- This bit enables A/D conversions in stop mode. When going into stop mode and ICLKSTP=1 the ATD conversion clock is automatically switched to the internally generated clock ICLK. Current conversion sequence will seamless continue. Conversion speed will change from prescaled bus frequency to the ICLK frequency (see ATD Electrical Characteristics in device description). The prescaler bits PRS4-0 in ATDCTL4 have no effect on the ICLK frequency. For conversions during stop mode the automatic compare interrupt or the sequence complete interrupt can be used to inform software handler about changing A/D values. External trigger will not work while converting in stop mode. For conversions during transition from Run to Stop Mode or vice versa the result is not written to the results register, no CCF flag is set and no compare is done. When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time. 0 If A/D conversion sequence is ongoing when going into stop mode, the actual conversion sequence will be aborted and automatically restarted when exiting stop mode. 1 A/D continues to convert in stop mode using internally generated clock (ICLK) External Trigger Level/Edge Control -- This bit controls the sensitivity of the external trigger signal. See Table 13-8 for details. External Trigger Polarity -- This bit controls the polarity of the external trigger signal. See Table 13-8 for details. External Trigger Mode Enable -- This bit enables the external trigger on one of the AD channels or one of the ETRIG3-0 inputs as described in Table 13-6. If external trigger source is one of the AD channels, the digital input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with external events. External trigger will not work while converting in stop mode. 0 Disable external trigger 1 Enable external trigger 5 ICLKSTP 4 ETRIGLE 3 ETRIGP 2 ETRIGE MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 509 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-7. ATDCTL2 Field Descriptions (continued) Field 1 ASCIE 0 ACMPIE Description ATD Sequence Complete Interrupt Enable 0 ATD Sequence Complete interrupt requests are disabled. 1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set. ATD Compare Interrupt Enable -- If automatic compare is enabled for conversion n (CMPE[n]=1 in ATDCMPE register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for conversion n), the compare interrupt is triggered. 0 ATD Compare interrupt requests are disabled. 1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), ATD Compare Interrupt will be requested whenever any of the respective CCF flags is set. Table 13-8. External Trigger Configurations ETRIGLE 0 0 1 1 ETRIGP 0 1 0 1 External Trigger Sensitivity Falling edge Rising edge Low level High level 13.3.2.4 ATD Control Register 3 (ATDCTL3) Writes to this register will abort current conversion sequence. Module Base + 0x0003 7 6 5 4 3 2 1 0 R DJM W Reset 0 0 1 0 0 0 0 0 S8C S4C S2C S1C FIFO FRZ1 FRZ0 = Unimplemented or Reserved Figure 13-6. ATD Control Register 3 (ATDCTL3) Read: Anytime Write: Anytime Field 7 DJM Description Result Register Data Justification -- Result data format is always unsigned. This bit controls justification of conversion data in the result registers. 0 Left justified data in the result registers. 1 Right justified data in the result registers. Table 13-10 gives examples ATD results for an input signal range between 0 and 5.12 Volts. Table 13-9. ATDCTL3 Field Descriptions MC9S12XE-Family Reference Manual , Rev. 1.21 510 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Field 6-3 S8C, S4C, S2C, S1C 2 FIFO Description Conversion Sequence Length -- These bits control the number of conversions per sequence. Table 13-11 shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12 family. Result Register FIFO Mode -- If this bit is zero (non-FIFO mode), the A/D conversion results map into the result registers based on the conversion sequence; the result of the first conversion appears in the first result register (ATDDR0), the second result in the second result register (ATDDR1), and so on. If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or ending of a conversion sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning conversion sequence, the result register counter will wrap around when it reaches the end of the result register file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register file, the current conversion result will be placed. Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register (ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion (ETRIG=1). Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode may or may not be useful in a particular application to track valid data. If this bit is one, automatic compare of result registers is always disabled, that is ADC12B16C will behave as if ACMPIE and all CPME[n] were zero. 0 Conversion results are placed in the corresponding result register up to the selected sequence length. 1 Conversion results are placed in consecutive result registers (wrap around at end). 1-0 FRZ[1:0] Background Debug Freeze Enable -- When debugging an application, it is useful in many cases to have the ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond to a breakpoint as shown in Table 13-12. Leakage onto the storage node and comparator reference capacitors may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period. Table 13-9. ATDCTL3 Field Descriptions (continued) Table 13-10. Examples of ideal decimal ATD Results Input Signal VRL = 0 Volts VRH = 5.12 Volts 5.120 Volts ... 0.022 0.020 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.003 0.002 0.000 8-Bit Codes (resolution=20mV) 255 ... 1 1 1 1 1 1 1 0 0 0 0 0 0 10-Bit Codes (resolution=5mV) 1023 ... 4 4 4 3 3 2 2 2 1 1 0 0 0 12-Bit Codes (transfer curve has 1.25mV offset) (resolution=1.25mV) 4095 ... 17 16 14 12 11 9 8 6 4 3 2 1 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 511 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-11. Conversion Sequence Length Coding S8C 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 S4C 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 S2C 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 S1C 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Number of Conversions per Sequence 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Table 13-12. ATD Behavior in Freeze Mode (Breakpoint) FRZ1 0 0 1 1 FRZ0 0 1 0 1 Behavior in Freeze Mode Continue conversion Reserved Finish current conversion, then freeze Freeze Immediately 13.3.2.5 ATD Control Register 4 (ATDCTL4) Writes to this register will abort current conversion sequence. Module Base + 0x0004 7 6 5 4 3 2 1 0 R SMP2 W Reset 0 0 0 0 0 1 0 1 SMP1 SMP0 PRS[4:0] Figure 13-7. ATD Control Register 4 (ATDCTL4) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 512 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-13. ATDCTL4 Field Descriptions Field 7-5 SMP[2:0] 4-0 PRS[4:0] Description Sample Time Select -- These three bits select the length of the sample time in units of ATD conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0). Table 13-14 lists the available sample time lengths. ATD Clock Prescaler -- These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency is calculated as follows: f BUS f ATDCLK = -----------------------------------2 x ( PRS + 1 ) Refer to Device Specification for allowed frequency range of fATDCLK. Table 13-14. Sample Time Select SMP2 0 0 0 0 1 1 1 1 SMP1 0 0 1 1 0 0 1 1 SMP0 0 1 0 1 0 1 0 1 Sample Time in Number of ATD Clock Cycles 4 6 8 10 12 16 20 24 13.3.2.6 ATD Control Register 5 (ATDCTL5) Writes to this register will abort current conversion sequence and start a new conversion sequence. If external trigger is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting of a conversion sequence which will then occur on each trigger event. Start of conversion means the beginning of the sampling phase. Module Base + 0x0005 7 6 5 4 3 2 1 0 R W Reset 0 SC 0 0 SCAN 0 MULT 0 CD 0 CC 0 CB 0 CA 0 Figure 13-8. ATD Control Register 5 (ATDCTL5) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 513 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-15. ATDCTL5 Field Descriptions Field 6 SC Description Special Channel Conversion Bit -- If this bit is set, then special channel conversion can be selected using CD, CC, CB and CA of ATDCTL5. Table 13-16 lists the coding. 0 Special channel conversions disabled 1 Special channel conversions enabled Continuous Conversion Sequence Mode -- This bit selects whether conversion sequences are performed continuously or only once. If external trigger is enabled (ETRIGE=1) setting this bit has no effect, that means external trigger always starts a single conversion sequence. 0 Single conversion sequence 1 Continuous conversion sequences (scan mode) Multi-Channel Sample Mode -- When MULT is 0, the ATD sequence controller samples only from the specified analog input channel for an entire conversion sequence. The analog channel is selected by channel selection code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C, S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits); subsequent channels sampled in the sequence are determined by incrementing the channel selection code or wrapping around to AN0 (channel 0). 0 Sample only one channel 1 Sample across several channels Analog Input Channel Select Code -- These bits select the analog input channel(s) whose signals are sampled and converted to digital codes. Table 13-16 lists the coding used to select the various analog input channels. In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined. In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be examined in the conversion sequence. Subsequent channels are determined by incrementing the channel selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel Select Bits WRAP3-0 in ATDCTL0). In case of starting with a channel number higher than the one defined by WRAP3-0 the first wrap around will be AN15 to AN0. 5 SCAN 4 MULT 3-0 CD, CC, CB, CA MC9S12XE-Family Reference Manual , Rev. 1.21 514 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-16. Analog Input Channel Select Coding SC 0 CD 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 CC 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 1 1 1 1 X CB 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 0 1 1 X CA 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X 0 1 0 1 X Analog Input Channel AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 AN8 AN9 AN10 AN11 AN12 AN13 AN14 AN15 Reserved Reserved Reserved VRH VRL (VRH+VRL) / 2 Reserved Reserved 13.3.2.7 ATD Status Register 0 (ATDSTAT0) This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and the conversion counter. Module Base + 0x0006 7 6 5 4 3 2 1 0 R SCF W Reset 0 0 ETORF 0 0 FIFOR 0 CC3 CC2 CC1 CC0 0 0 0 0 = Unimplemented or Reserved Figure 13-9. ATD Status Register 0 (ATDSTAT0) Read: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 515 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Write: Anytime (No effect on (CC3, CC2, CC1, CC0)) Table 13-17. ATDSTAT0 Field Descriptions Field 7 SCF Description Sequence Complete Flag -- This flag is set upon completion of a conversion sequence. If conversion sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared when one of the following occurs: A) Write "1" to SCF B) Write to ATDCTL5 (a new conversion sequence is started) C) If AFFC=1 and read of a result register 0 Conversion sequence not completed 1 Conversion sequence has completed External Trigger Overrun Flag -- While in edge trigger mode (ETRIGLE=0), if additional active edges are detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the following occurs: A) Write "1" to ETORF B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted) C) Write to ATDCTL5 (a new conversion sequence is started) 0 No External trigger over run error has occurred 1 External trigger over run error has occurred Result Register Over Run Flag -- This bit indicates that a result register has been written to before its associated conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because the flag potentially indicates that result registers are out of sync with the input channels. However, it is also practical for non-FIFO modes, and indicates that a result register has been over written before it has been read (i.e. the old data has been lost). This flag is cleared when one of the following occurs: A) Write "1" to FIFOR B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted) C) Write to ATDCTL5 (a new conversion sequence is started) 0 No over run has occurred 1 Overrun condition exists (result register has been written while associated CCFx flag was still set) Conversion Counter -- These 4 read-only bits are the binary value of the conversion counter. The conversion counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1, CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO mode (FIFO=0) the conversion counter is initialized to zero at the begin and end of the conversion sequence. If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counters wraps around when its maximum value is reached. Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. 5 ETORF 4 FIFOR 3-0 CC[3:0] 13.3.2.8 ATD Compare Enable Register (ATDCMPE) Writes to this register will abort current conversion sequence. Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 516 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Module Base + 0x0008 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 CMPE[15:0] 0 0 0 0 0 0 0 0 0 Figure 13-10. ATD Compare Enable Register (ATDCMPE) Table 13-18. ATDCMPE Field Descriptions Field Description 15-0 Compare Enable for Conversion Number n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence CMPE[15:0] -- These bits enable automatic compare of conversion results individually for conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in the ATDCMPHT register. For each conversion number with CMPE[n]=1 do the following: 1) Write compare value to ATDDRn result register 2) Write compare operator with CMPHT[n] in ATDCPMHT register CCF[n] in ATDSTAT2 register will flag individual success of any comparison. 0 No automatic compare 1 Automatic compare of results for conversion n of a sequence is enabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 517 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.9 ATD Status Register 2 (ATDSTAT2) This read-only register contains the Conversion Complete Flags CCF[15:0]. Module Base + 0x000A 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 CCF[15:0] 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 13-11. ATD Status Register 2 (ATDSTAT2) Read: Anytime Write: Anytime, no effect Table 13-19. ATDSTAT2 Field Descriptions Field 15-0 CCF[15:0] Description Conversion Complete Flag n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) -- A conversion complete flag is set at the end of each conversion in a sequence. The flags are associated with the conversion position in a sequence (and also the result register number). Therefore in non-fifo mode, CCF[8] is set when the ninth conversion in a sequence is complete and the result is available in result register ATDDR8; CCF[9] is set when the tenth conversion in a sequence is complete and the result is available in ATDDR9, and so forth. If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag is only set if comparison with ATDDRn is true and if ACMPIE=1 a compare interrupt will be requested. In this case, as the ATDDRn result register is used to hold the compare value, the result will not be stored there at the end of the conversion but is lost. A flag CCF[n] is cleared when one of the following occurs: A) Write to ATDCTL5 (a new conversion sequence is started) B) If AFFC=0, write "1" to CCF[n] C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing by methods B) or C) or D) will be overwritten by the set. 0 Conversion number n not completed or successfully compared 1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn. If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare operator CMPGT[n] is true. (No result available in ATDDRn) MC9S12XE-Family Reference Manual , Rev. 1.21 518 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.10 ATD Input Enable Register (ATDDIEN) Module Base + 0x000C 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 IEN[15:0] 0 0 0 0 0 0 0 0 0 Figure 13-12. ATD Input Enable Register (ATDDIEN) Read: Anytime Write: Anytime Table 13-20. ATDDIEN Field Descriptions Field 15-0 IEN[15:0] Description ATD Digital Input Enable on channel x (x= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) -- This bit controls the digital input buffer from the analog input pin (ANx) to the digital data register. 0 Disable digital input buffer to ANx pin 1 Enable digital input buffer on ANx pin. Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while simultaneously using it as an analog port, there is potentially increased power consumption because the digital input buffer maybe in the linear region. 13.3.2.11 ATD Compare Higher Than Register (ATDCMPHT) Writes to this register will abort current conversion sequence. Read: Anytime Write: Anytime Module Base + 0x000E 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 CMPHT[15:0] 0 0 0 0 0 0 0 0 0 Figure 13-13. ATD Compare Higher Than Register (ATDCMPHT) Table 13-21. ATDCMPHT Field Descriptions Field Description 15-0 Compare Operation Higher Than Enable for conversion number n (n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, CMPHT[15:0] 4, 3, 2, 1, 0) of a Sequence -- This bit selects the operator for comparison of conversion results. 0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2 1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 519 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.3.2.12 ATD Conversion Result Registers (ATDDRn) The A/D conversion results are stored in 16 result registers. Results are always in unsigned data representation. Left and right justification is selected using the DJM control bit in ATDCTL3. If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must be written with the compare values in left or right justified format depending on the actual value of the DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be stored there at the end of the conversion but is lost. Read: Anytime Write: Anytime NOTE For conversions not using automatic compare, results are stored in the result registers after each conversion. In this case avoid writing to ATDDRn except for initial values, because an A/D result might be overwritten. 13.3.2.12.1 Left Justified Result Data (DJM=0) Module Base + 0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3 0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7 0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11 0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset Bit 11 Bit 10 Bit 9 0 0 0 Bit 8 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0 0 0 0 0 0 0 0 Figure 13-14. Left justified ATD conversion result register (ATDDRn) 13.3.2.12.2 Right Justified Result Data (DJM=1) Module Base + 0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3 0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7 0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11 0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 Bit 11 Bit 10 Bit 9 0 0 0 Bit 8 0 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bi1 1 0 Bit 0 0 Figure 13-15. Right justified ATD conversion result register (ATDDRn) Table 13-16 shows how depending on the A/D resolution the conversion result is transferred to the ATD result registers. Compare is always done using all 12 bits of both the conversion result and the compare value in ATDDRn. MC9S12XE-Family Reference Manual , Rev. 1.21 520 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Table 13-22. Conversion result mapping to ATDDRn A/D resolution 8-bit data 8-bit data 10-bit data 10-bit data 12-bit data DJM 0 1 0 1 X conversion result mapping to ATDDRn Bit[11:4] = result, Bit[3:0]=0000 Bit[7:0] = result, Bit[11:8]=0000 Bit[11:2] = result, Bit[1:0]=00 Bit[9:0] = result, Bit[11:10]=00 Bit[11:0] = result 13.4 Functional Description The ADC12B16C is structured into an analog sub-block and a digital sub-block. 13.4.1 Analog Sub-Block The analog sub-block contains all analog electronics required to perform a single conversion. Separate power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block. 13.4.1.1 Sample and Hold Machine The Sample and Hold (S/H) Machine accepts analog signals from the external world and stores them as capacitor charge on a storage node. During the sample process the analog input connects directly to the storage node. The input analog signals are unipolar and must fall within the potential range of VSSA to VDDA. During the hold process the analog input is disconnected from the storage node. 13.4.1.2 Analog Input Multiplexer The analog input multiplexer connects one of the 16 external analog input channels to the sample and hold machine. 13.4.1.3 Analog-to-Digital (A/D) Machine The A/D Machine performs analog to digital conversions. The resolution is program selectable at either 8 or 10 or 12 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the stored analog sample potential with a series of digitally generated analog potentials. By following a binary search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled potential. When not converting the A/D machine is automatically powered down. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 521 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result in a non-railed digital output code. 13.4.2 Digital Sub-Block This subsection explains some of the digital features in more detail. See Section 13.3.2, "Register Descriptions" for all details. 13.4.2.1 External Trigger Input The external trigger feature allows the user to synchronize ATD conversions to the external environment events rather than relying on software to signal the ATD module when ATD conversions are to take place. The external trigger signal (out of reset ATD channel 15, configurable in ATDCTL1) is programmable to be edge or level sensitive with polarity control. Table 13-23 gives a brief description of the different combinations of control bits and their effect on the external trigger function. Table 13-23. External Trigger Control Bits ETRIGLE X X 0 0 1 1 ETRIGP X X 0 1 0 1 ETRIGE 0 0 1 1 1 1 SCAN 0 1 X X X X Description Ignores external trigger. Performs one conversion sequence and stops. Ignores external trigger. Performs continuous conversion sequences. Falling edge triggered. Performs one conversion sequence per trigger. Rising edge triggered. Performs one conversion sequence per trigger. Trigger active low. Performs continuous conversions while trigger is active. Trigger active high. Performs continuous conversions while trigger is active. During a conversion, if additional active edges are detected the overrun error flag ETORF is set. In either level or edge triggered modes, the first conversion begins when the trigger is received. Once ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be triggered externally. If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left asserted in level mode while a sequence is completing, another sequence will be triggered immediately. MC9S12XE-Family Reference Manual , Rev. 1.21 522 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) 13.4.2.2 General-Purpose Digital Port Operation The input channel pins can be multiplexed between analog and digital data. As analog inputs, they are multiplexed and sampled as analog channels to the A/D converter. The analog/digital multiplex operation is performed in the input pads. The input pad is always connected to the analog input channels of the ADC12B16C. The input pad signal is buffered to the digital port registers. This buffer can be turned on or off with the ATDDIEN register. This is important so that the buffer does not draw excess current when analog potentials are presented at its input. 13.5 Resets At reset the ADC12B16C is in a power down state. The reset state of each individual bit is listed within the Register Description section (see Section 13.3.2, "Register Descriptions") which details the registers and their bit-field. 13.6 Interrupts The interrupts requested by the ADC12B16C are listed in Table 13-24. Refer to MCU specification for related vector address and priority. Table 13-24. ATD Interrupt Vectors Interrupt Source Sequence Complete Interrupt Compare Interrupt CCR Mask I bit I bit Local Enable ASCIE in ATDCTL2 ACMPIE in ATDCTL2 See Section 13.3.2, "Register Descriptions" for further details. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 523 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 13 Analog-to-Digital Converter (ADC12B16CV1) MC9S12XE-Family Reference Manual , Rev. 1.21 524 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-1. Revision History Revision Number V03.06 Revision Date 05 Aug 2009 Sections Affected 14.3.2.15/14547 14.3.2.16/14549 14.3.2.24/14555 14.3.2.29/14560 14.4.1.1.2/14571 Description of Changes update register PACTL bit4 PEDGE PT7 to IC7 update register PAFLG bit0 PAIF PT7 to IC7,update bit1 PAOVF PT3 to IC3 update register ICSYS bit3 TFMOD PTx to ICx update register PBFLG bit1 PBOVF PT1 to IC1 update IC Queue Mode description. V03.07 26 Aug 2009 14.3.2.2/14-534 - Add description, ?a counter overflow when TTOV[7] is set?, to be the 14.3.2.3/14-534 condition of channel 7 override event. 14.3.2.4/14-535 - Phrase the description of OC7M to make it more explicit 14.3.2.8/14-538 - Add Table 14-11 14.3.2.11/14- - TCRE description, add Note and Figure 14-17 541 V03.08 04 May 2010 14.1 Introduction The HCS12 enhanced capture timer module has the features of the HCS12 standard timer module enhanced by additional features in order to enlarge the field of applications, in particular for automotive ABS applications. This design specification describes the standard timer as well as the additional features. The basic timer consists of a 16-bit, software-programmable counter driven by a prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. Pulse widths can vary from microseconds to many seconds. A full access for the counter registers or the input capture/output compare registers will take place in one clock cycle. Accessing high byte and low byte separately for all of these registers will not yield the same result as accessing them in one word. 14.1.1 * Features 16-bit buffer register for four input capture (IC) channels. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 525 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) * * * Four 8-bit pulse accumulators with 8-bit buffer registers associated with the four buffered IC channels. Configurable also as two 16-bit pulse accumulators. 16-bit modulus down-counter with 8-bit prescaler. Four user-selectable delay counters for input noise immunity increase. 14.1.2 * * * * Modes of Operation Stop -- Timer and modulus counter are off since clocks are stopped. Freeze -- Timer and modulus counter keep on running, unless the TSFRZ bit in the TSCR1 register is set to one. Wait -- Counters keep on running, unless the TSWAI bit in the TSCR1 register is set to one. Normal -- Timer and modulus counter keep on running, unless the TEN bit in the TSCR1 register or the MCEN bit in the MCCTL register are cleared. MC9S12XE-Family Reference Manual Rev. 1.22 526 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.1.3 Block Diagram Bus Clock Prescaler 16-bit Counter Channel 0 Input Capture Output Compare Channel 1 Input Capture IOC0 Modulus Counter Interrupt Timer Overflow Interrupt Timer Channel 0 Interrupt 16-Bit Modulus Counter Output Compare Channel 2 Input Capture Output Compare Channel 3 Input Capture Output Compare IOC1 IOC2 IOC3 Registers Channel 4 Input Capture Output Compare Channel 5 Input Capture Output Compare IOC4 IOC5 Timer Channel 7 Interrupt PA Overflow Interrupt PA Input Interrupt PB Overflow Interrupt 16-Bit Pulse Accumulator A 16-Bit Pulse Accumulator B Channel 6 Input Capture Output Compare Channel 7 Input Capture Output Compare IOC6 IOC7 Figure 14-1. ECT Block Diagram 14.2 External Signal Description The ECT module has a total of eight external pins. 14.2.1 IOC7 -- Input Capture and Output Compare Channel 7 This pin serves as input capture or output compare for channel 7. 14.2.2 IOC6 -- Input Capture and Output Compare Channel 6 This pin serves as input capture or output compare for channel 6. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 527 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.2.3 IOC5 -- Input Capture and Output Compare Channel 5 This pin serves as input capture or output compare for channel 5. 14.2.4 IOC4 -- Input Capture and Output Compare Channel 4 This pin serves as input capture or output compare for channel 4. 14.2.5 IOC3 -- Input Capture and Output Compare Channel 3 This pin serves as input capture or output compare for channel 3. 14.2.6 IOC2 -- Input Capture and Output Compare Channel 2 This pin serves as input capture or output compare for channel 2. 14.2.7 IOC1 -- Input Capture and Output Compare Channel 1 This pin serves as input capture or output compare for channel 1. 14.2.8 IOC0 -- Input Capture and Output Compare Channel 0 NOTE For the description of interrupts see Section 14.4.3, "Interrupts". This pin serves as input capture or output compare for channel 0. 14.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers. 14.3.1 Module Memory Map The memory map for the ECT module is given below in the Table 14-2. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the ECT module and the address offset for each register. 14.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. MC9S12XE-Family Reference Manual Rev. 1.22 528 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Register Name 0x0000 TIOS 0x0001 CFORC 0x0002 OC7M 0x0003 OC7D R W R W R W R W Bit 7 IOS7 0 FOC7 OC7M7 6 IOS6 0 FOC6 OC7M6 5 IOS5 0 FOC5 OC7M5 4 IOS4 0 FOC4 OC7M4 3 IOS3 0 FOC3 OC7M3 2 IOS2 0 FOC2 OC7M2 1 IOS1 0 FOC1 OC7M1 Bit 0 IOS0 0 FOC0 OC7M0 OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0 0x0004 R TCNT (High) W 0x0005 R TCNT (Low) W 0x0006 TSCR1 0x0007 TTOF 0x0008 TCTL1 0x0009 TCTL2 0x000A TCTL3 0x000B TCTL4 0x000C TIE R W R W R W R W R W R W R W TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 0 TCNT1 0 TCNT0 0 TEN TSWAI TSFRZ TFFCA PRNT TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0 OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A C7I C6I C5I C4I C3I C2I C1I C0I = Unimplemented or Reserved Figure 14-2. ECT Register Summary (Sheet 1 of 5) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 529 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Register Name 0x000D TSCR2 0x000E TFLG1 0x000F TFLG2 R W R W R W Bit 7 TOI 6 0 5 0 4 0 3 TCRE 2 PR2 1 PR1 Bit 0 PR0 C7F C6F 0 C5F 0 C4F 0 C3F 0 C2F 0 C1F 0 C0F 0 TOF 0x0010 R TC0 (High) W 0x0011 TC0 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0012 R TC1 (High) W 0x0013 TC1 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0014 R TC2 (High) W 0x0015 TC2 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0016 R TC3 (High) W 0x0017 TC3 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0018 R TC4 (High) W 0x0019 TC4 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x001A R TC5 (High) W 0x001B TC5 (Low) R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 = Unimplemented or Reserved Figure 14-2. ECT Register Summary (Sheet 2 of 5) MC9S12XE-Family Reference Manual Rev. 1.22 530 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Register Name 0x001C R TC6 (High) W 0x001D TC6 (Low) R W Bit 7 Bit 15 6 Bit 14 5 Bit 13 4 Bit 12 3 Bit 11 2 Bit 10 1 Bit 9 Bit 0 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x001E R TC7 (High) W 0x001F TC7 (Low) 0x0020 PACTL 0x0021 PAFLG 0x0022 PACN3 0x0023 PACN2 0x0024 PACN1 0x0025 PACN0 0x0026 MCCTL 0x0027 MCFLG 0x0028 ICPAR 0x0029 DLYCT 0x002A ICOVW R W R W R W R W R W R W R W R W R W R W R W R W Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PAEN 0 PAMOD 0 PEDGE 0 CLK1 0 CLK0 0 PA0VI PAI 0 PA0VF PAIF PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8) PACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) PACNT1(9) PACNT0(8) PACNT7 PACNT6 PACNT5 PACNT4 0 ICLAT 0 PACNT3 0 FLMC POLF3 PACNT2 PACNT1 PACNT0 MCZI MODMC 0 RDMCL 0 MCEN POLF2 MCPR1 POLF1 MCPR0 POLF0 MCZF 0 0 0 0 PA3EN PA2EN PA1EN PA0EN DLY7 DLY6 DLY5 DLY4 DLY3 DLY2 DLY1 DLY0 NOVW7 NOVW6 NOVW5 NOVW4 NOVW3 NOVW2 NOVW1 NOVW0 = Unimplemented or Reserved Figure 14-2. ECT Register Summary (Sheet 3 of 5) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 531 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Register Name 0x002B ICSYS 0x002C OCPD 0x002D TIMTST 0x002E PTPSR R W R W R W R W Bit 7 SH37 6 SH26 5 SH15 4 SH04 3 TFMOD 2 PACMX 1 BUFEN Bit 0 LATQ OCPD7 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0 Timer Test Register PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 0x002F R PTMCPSR W 0x0030 PBCTL 0x0031 PBFLG 0x0032 PA3H 0x0033 PA2H 0x0034 PA1H 0x0035 PA0H 0x0036 MCCNT (High) 0x0037 MCCNT (Low) R W R W R W R W R W R W R PTMPS7 0 PTMPS6 PTMPS5 0 PTMPS4 0 PTMPS3 0 PTMPS2 0 PTMPS1 PTMPS0 0 PBEN 0 PBOVI 0 0 0 0 0 PBOVF PA3H1 0 PA3H7 PA3H6 PA3H5 PA3H4 PA3H3 PA3H2 PA3H0 PA2H7 PA2H6 PA2H5 PA2H4 PA2H3 PA2H2 PA2H1 PA2H0 PA1H7 PA1H6 PA1H5 PA1H4 PA1H3 PA1H2 PA1H1 PA1H0 PA0H7 PA0H6 PA0H5 PA0H4 PA0H3 PA0H2 PA0H1 PA0H0 W MCCNT15 R W MCCNT7 MCCNT14 MCCNT13 MCCNT12 MCCNT11 MCCNT10 MCCNT9 MCCNT8 MCCNT6 MCCNT5 MCCNT4 MCCNT3 MCCNT2 MCCNT1 MCCNT0 0x0038 R TC0H (High) W 0x0039 R TC0H (Low) TC15 TC14 TC13 TC12 TC11 TC10 TC9 TC8 TC7 TC6 TC5 TC4 TC3 TC2 TC1 TC0 = Unimplemented or Reserved Figure 14-2. ECT Register Summary (Sheet 4 of 5) MC9S12XE-Family Reference Manual Rev. 1.22 532 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Register Name 0x003A R TC1H (High) W 0x003B R TC1H (Low) W 0x003C R TC2H (High) W 0x003D R TC2H (Low) W 0x003E R TC3H (High) W 0x003F R TC3H (Low) W Bit 7 TC15 6 TC14 5 TC13 4 TC12 3 TC11 2 TC10 1 TC9 Bit 0 TC8 TC7 TC6 TC5 TC4 TC3 TC2 TC1 TC0 TC15 TC14 TC13 TC12 TC11 TC10 TC9 TC8 TC7 TC6 TC5 TC4 TC3 TC2 TC1 TC0 TC15 TC14 TC13 TC12 TC11 TC10 TC9 TC8 TC7 TC6 TC5 TC4 TC3 TC2 TC1 TC0 = Unimplemented or Reserved Figure 14-2. ECT Register Summary (Sheet 5 of 5) 14.3.2.1 Timer Input Capture/Output Compare Select Register (TIOS) Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset IOS7 0 IOS6 0 IOS5 0 IOS4 0 IOS3 0 IOS2 0 IOS1 0 IOS0 0 Figure 14-3. Timer Input Capture/Output Compare Register (TIOS) Read or write: Anytime All bits reset to zero. Table 14-2. TIOS Field Descriptions Field 7:0 IOS[7:0] Description Input Capture or Output Compare Channel Configuration 0 The corresponding channel acts as an input capture. 1 The corresponding channel acts as an output compare. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 533 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.2 Timer Compare Force Register (CFORC) Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset 0 FOC7 0 0 FOC6 0 0 FOC5 0 0 FOC4 0 0 FOC3 0 0 FOC2 0 0 FOC1 0 0 FOC0 0 Figure 14-4. Timer Compare Force Register (CFORC) Read or write: Anytime but reads will always return 0x0000 (1 state is transient). All bits reset to zero. Table 14-3. CFORC Field Descriptions Field 7:0 FOC[7:0] Description Force Output Compare Action for Channel 7:0 -- A write to this register with the corresponding data bit(s) set causes the action which is programmed for output compare "x" to occur immediately. The action taken is the same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not get set. Note: A channel 7 event, which can be a counter overflow when TTOV[7] is set or A successful channel 7 output compare overrides any channel 6:0 compares. If a forced output compare on any channel occurs at the same time as the successful output compare, then the forced output compare action will take precedence and the interrupt flag will not get set. 14.3.2.3 Output Compare 7 Mask Register (OC7M) Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset OC7M7 0 OC7M6 0 OC7M5 0 OC7M4 0 OC7M3 0 OC7M2 0 OC7M1 0 OC7M0 0 Figure 14-5. Output Compare 7 Mask Register (OC7M) Read or write: Anytime All bits reset to zero. MC9S12XE-Family Reference Manual Rev. 1.22 534 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-4. OC7M Field Descriptions Field 7:0 OC7M[7:0] Description Output Compare Mask Action for Channel 7:0 A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides any channel 6:0 compares. For each OC7M bit that is set,the output compare action reflects the corresponding OC7D bit. 0 The corresponding OC7Dx bit in the output compare 7 data register will not be transferred to the timer port on a channel 7 event, even if the corresponding pin is setup for output compare. 1 The corresponding OC7Dx bit in the output compare 7 data register will be transferred to the timer port on a channel 7 event. Note: The corresponding channel must also be setup for output compare (IOSx = 1 andOCPDx = 0) for data to be transferred from the output compare 7 data register to the timer port. 14.3.2.4 Output Compare 7 Data Register (OC7D) Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset OC7D7 0 OC7D6 0 OC7D5 0 OC7D4 0 OC7D3 0 OC7D2 0 OC7D1 0 OC7D0 0 Figure 14-6. Output Compare 7 Data Register (OC7D) Read or write: Anytime All bits reset to zero. Table 14-5. OC7D Field Descriptions Field 7:0 OC7D[7:0] Description Output Compare 7 Data Bits -- A channel 7 event, which can be a counter overflow when TTOV[7] is set or A channel 7 output compare can cause bits in the output compare 7 data register to transfer to the timer port data register depending on the output compare 7 mask register. 14.3.2.5 Timer Count Register (TCNT) Module Base + 0x0004 15 14 13 12 11 10 9 8 R W Reset TCNT15 0 TCNT14 0 TCNT13 0 TCNT12 0 TCNT11 0 TCNT10 0 TCNT9 0 TCNT8 0 Figure 14-7. Timer Count Register High (TCNT) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 535 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x0005 7 6 5 4 3 2 1 0 R W Reset TCNT7 0 TCNT6 0 TCNT5 0 TCNT4 0 TCNT3 0 TCNT2 0 TCNT1 0 TCNT0 0 Figure 14-8. Timer Count Register Low (TCNT) Read: Anytime Write: Writable in special modes. All bits reset to zero. Table 14-6. TCNT Field Descriptions Field Description 15:0 Timer Counter Bits -- The 16-bit main timer is an up counter. A read to this register will return the current value TCNT[15:0] of the counter. Access to the counter register will take place in one clock cycle. Note: A separate read/write for high byte and low byte in test mode will give a different result than accessing them as a word. The period of the first count after a write to the TCNT registers may be a different size because the write is not synchronized with the prescaler clock. 14.3.2.6 Timer System Control Register 1 (TSCR1) Module Base + 0x0006 7 6 5 4 3 2 1 0 R W Reset TEN 0 TSWAI 0 TSFRZ 0 TFFCA 0 PRNT 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-9. Timer System Control Register 1 (TSCR1) Read or write: Anytime except PRNT bit is write once All bits reset to zero. Table 14-7. TSCR1 Field Descriptions Field 7 TEN Description Timer Enable 0 Disables the main timer, including the counter. Can be used for reducing power consumption. 1 Allows the timer to function normally. Note: If for any reason the timer is not active, there is no /64 clock for the pulse accumulator since the /64 is generated by the timer prescaler. Timer Module Stops While in Wait 0 Allows the timer module to continue running during wait. 1 Disables the timer counter, pulse accumulators and modulus down counter when the MCU is in wait mode. Timer interrupts cannot be used to get the MCU out of wait. 6 TSWAI MC9S12XE-Family Reference Manual Rev. 1.22 536 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-7. TSCR1 Field Descriptions (continued) Field 5 TSFRZ Description Timer and Modulus Counter Stop While in Freeze Mode 0 Allows the timer and modulus counter to continue running while in freeze mode. 1 Disables the timer and modulus counter whenever the MCU is in freeze mode. This is useful for emulation. The pulse accumulators do not stop in freeze mode. Timer Fast Flag Clear All 0 Allows the timer flag clearing to function normally. 1 A read from an input capture or a write to the output compare channel registers causes the corresponding channel flag, CxF, to be cleared in the TFLG1 register. Any access to the TCNT register clears the TOF flag in the TFLG2 register. Any access to the PACN3 and PACN2 registers clears the PAOVF and PAIF flags in the PAFLG register. Any access to the PACN1 and PACN0 registers clears the PBOVF flag in the PBFLG register. Any access to the MCCNT register clears the MCZF flag in the MCFLG register. This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses. Note: The flags cannot be cleared via the normal flag clearing mechanism (writing a one to the flag) when TFFCA = 1. Precision Timer 0 Enables legacy timer. Only bits DLY0 and DLY1 of the DLYCT register are used for the delay selection of the delay counter. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler selection. MCPR0 and MCPR1 bits of the MCCTL register are used for modulus down counter prescaler selection. 1 Enables precision timer. All bits in the DLYCT register are used for the delay selection, all bits of the PTPSR register are used for Precision Timer Prescaler Selection, and all bits of PTMCPSR register are used for the prescaler Precision Timer Modulus Counter Prescaler selection. 4 TFFCA 3 PRNT 14.3.2.7 Timer Toggle On Overflow Register 1 (TTOV) Module Base + 0x0007 7 6 5 4 3 2 1 0 R W Reset TOV7 0 TOV6 0 TOV5 0 TOV4 0 TOV3 0 TOV2 0 TOV1 0 TOV0 0 Figure 14-10. Timer Toggle On Overflow Register 1 (TTOV) Read or write: Anytime All bits reset to zero. Table 14-8. TTOV Field Descriptions Field 7:0 TOV[7:0] Description Toggle On Overflow Bits -- TOV97:0] toggles output compare pin on timer counter overflow. This feature only takes effect when in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override events. 0 Toggle output compare pin on overflow feature disabled. 1 Toggle output compare pin on overflow feature enabled. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 537 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2) Module Base + 0x0008 7 6 5 4 3 2 1 0 R W Reset OM7 0 OL7 0 OM6 0 OL6 0 OM5 0 OL5 0 OM4 0 OL4 0 Figure 14-11. Timer Control Register 1 (TCTL1) Module Base + 0x0009 7 6 5 4 3 2 1 0 R W Reset OM3 0 OL3 0 OM2 0 OL2 0 OM1 0 OL1 0 OM0 0 OL0 0 Figure 14-12. Timer Control Register 2 (TCTL2) Read or write: Anytime All bits reset to zero. Table 14-9. TCTL1/TCTL2 Field Descriptions Field OM[7:0] 7, 5, 3, 1 OL[7:0] 6, 4, 2, 0 Description OMx -- Output Mode OLx -- Output Level These eight pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is one, the pin associated with OCx becomes an output tied to OCx. See Table 14-10. Table 14-10. Compare Result Output Action OMx 0 0 1 1 OLx 0 1 0 1 Action No output compare action on the timer output signal Toggle OCx output line Clear OCx output line to zero Set OCx output line to one NOTE To enable output action by OMx and OLx bits on timer port, the corresponding bit in OC7M should be cleared. The settings for these bits can be seen in Table 14-11 MC9S12XE-Family Reference Manual Rev. 1.22 538 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-11. The OC7 and OCx event priority OC7M7=0 OC7Mx=1 TC7=TCx TC7>TCx IOCx=OC7Dx IOCx=OC7Dx IOC7=OM7/O +OMx/OLx IOC7=OM7/O L7 L7 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OMx/OLx IOC7=OM7/OL7 OC7Mx=1 TC7=TCx TC7>TCx IOCx=OC7Dx IOCx=OC7Dx IOC7=OC7D7 +OMx/OLx IOC7=OC7D7 OC7M7=1 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OMx/OLx IOC7=OC7D7 Note: in Table 14-11,the IOS7 and IOSx should be set to 1 IOSx is the register TIOS bit x, OC7Mx is the register OC7M bit x, TCx is timer Input Capture/Output Compare register, IOCx is channel x, OMx/OLx is the register TCTL1/TCTL2, OC7Dx is the register OC7D bit x. IOCx = OC7Dx+ OMx/OLx, means that both OC7 event and OCx event will change channel x value. 14.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3/TCTL4) Module Base + 0x000A 7 6 5 4 3 2 1 0 R W Reset EDG7B 0 EDG7A 0 EDG6B 0 EDG6A 0 EDG5B 0 EDG5A 0 EDG4B 0 EDG4A 0 Figure 14-13. Timer Control Register 3 (TCTL3) Module Base + 0x000B 7 6 5 4 3 2 1 0 R W Reset EDG3B 0 EDG3A 0 EDG2B 0 EDG2A 0 EDG1B 0 EDG1A 0 EDG0B 0 EDG0A 0 Figure 14-14. Timer Control Register 4 (TCTL4) Read or write: Anytime All bits reset to zero. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 539 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-12. TCTL3/TCTL4 Field Descriptions Field EDG[7:0]B 7, 5, 3, 1 EDG[7:0]A 6, 4, 2, 0 Description Input Capture Edge Control -- These eight pairs of control bits configure the input capture edge detector circuits for each input capture channel. The four pairs of control bits in TCTL4 also configure the input capture edge control for the four 8-bit pulse accumulators PAC0-PAC3.EDG0B and EDG0A in TCTL4 also determine the active edge for the 16-bit pulse accumulator PACB. See Table 14-13. Table 14-13. Edge Detector Circuit Configuration EDGxB 0 0 1 1 EDGxA 0 1 0 1 Configuration Capture disabled Capture on rising edges only Capture on falling edges only Capture on any edge (rising or falling) 14.3.2.10 Timer Interrupt Enable Register (TIE) Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset C7I 0 C6I 0 C5I 0 C4I 0 C3I 0 C2I 0 C1I 0 C0I 0 Figure 14-15. Timer Interrupt Enable Register (TIE) Read or write: Anytime All bits reset to zero. The bits C7I-C0I correspond bit-for-bit with the flags in the TFLG1 status register. Table 14-14. TIE Field Descriptions Field 7:0 C[7:0]I Description Input Capture/Output Compare "x" Interrupt Enable 0 The corresponding flag is disabled from causing a hardware interrupt. 1 The corresponding flag is enabled to cause an interrupt. MC9S12XE-Family Reference Manual Rev. 1.22 540 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.11 Timer System Control Register 2 (TSCR2) Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset TOI 0 0 0 0 0 0 0 TCRE 0 PR2 0 PR1 0 PR0 0 = Unimplemented or Reserved Figure 14-16. Timer System Control Register 2 (TSCR2) Read or write: Anytime All bits reset to zero. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 541 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-15. TSCR2 Field Descriptions Field 7 TOI Description Timer Overflow Interrupt Enable 0 Timer overflow interrupt disabled. 1 Hardware interrupt requested when TOF flag set. Timer Counter Reset Enable -- This bit allows the timer counter to be reset by a successful channel 7 output compare. This mode of operation is similar to an up-counting modulus counter. 0 Counter reset disabled and counter free runs. 1 Counter reset by a successful output compare on channel 7. Note: If register TC7 = 0x0000 and TCRE = 1, then the TCNT register will stay at 0x0000 continuously. If register TC7 = 0xFFFF and TCRE = 1, the TOF flag will never be set when TCNT is reset from 0xFFFF to 0x0000. Note: TCRE=1 and TC7!=0, the TCNT cycle period will be TC7 x "prescaler counter width" + "1 Bus Clock". When TCRE is set and TC7 is not equal to 0, TCNT will cycle from 0 to TC7. When TCNT reaches TC7 value, it will last only one bus cycle then reset to 0. for a more detail explanation please refer to Figure 1417. Note: in Figure 14-17,if PR[2:0] is equal to 0, one prescaler counter equal to one bus clock 2:0 PR[2:0] Timer Prescaler Select -- These three bits specify the division rate of the main Timer prescaler when the PRNT bit of register TSCR1 is set to 0. The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. See Table 14-16. 3 TCRE Figure 14-17. The TCNT cycle diagram under TCRE=1 condition prescaler counter TC7 0 1 bus clock 1 ----TC7-1 TC7 0 TC7 event TC7 event Table 14-16. Prescaler Selection PR2 0 0 0 0 1 1 1 1 PR1 0 0 1 1 0 0 1 1 PR0 0 1 0 1 0 1 0 1 Prescale Factor 1 2 4 8 16 32 64 128 MC9S12XE-Family Reference Manual Rev. 1.22 542 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.12 Main Timer Interrupt Flag 1 (TFLG1) Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset C7F 0 C6F 0 C5F 0 C4F 0 C3F 0 C2F 0 C1F 0 C0F 0 Figure 14-18. Main Timer Interrupt Flag 1 (TFLG1) Read: Anytime Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not affect the current status of the bit. NOTE When TFFCA = 1, the flags cannot be cleared via the normal flag clearing mechanism (writing a one to the flag). Reference Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)". All bits reset to zero. TFLG1 indicates when interrupt conditions have occurred. The flags can be cleared via the normal flag clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (reference TFFCA bit in Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)"). Use of the TFMOD bit in the ICSYS register in conjunction with the use of the ICOVW register allows a timer interrupt to be generated after capturing two values in the capture and holding registers, instead of generating an interrupt for every capture. Table 14-17. TFLG1 Field Descriptions Field 7:0 C[7:0]F Description Input Capture/Output Compare Channel "x" Flag -- A CxF flag is set when a corresponding input capture or output compare is detected. C0F can also be set by 16-bit Pulse Accumulator B (PACB). C3F-C0F can also be set by 8-bit pulse accumulators PAC3-PAC0. If the delay counter is enabled, the CxF flag will not be set until after the delay. 14.3.2.13 Main Timer Interrupt Flag 2 (TFLG2) Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset TOF 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 14-19. Main Timer Interrupt Flag 2 (TFLG2) Read: Anytime MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 543 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not affect the current status of the bit. NOTE When TFFCA = 1, the flag cannot be cleared via the normal flag clearing mechanism (writing a one to the flag). Reference Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)". All bits reset to zero. TFLG2 indicates when interrupt conditions have occurred. The flag can be cleared via the normal flag clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA bit in Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)"). Table 14-18. TFLG2 Field Descriptions Field 7 TOF Description Timer Overflow Flag -- Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. 14.3.2.14 Timer Input Capture/Output Compare Registers 0-7 Module Base + 0x0010 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-20. Timer Input Capture/Output Compare Register 0 High (TC0) Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-21. Timer Input Capture/Output Compare Register 0 Low (TC0) Module Base + 0x0012 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-22. Timer Input Capture/Output Compare Register 1 High (TC1) MC9S12XE-Family Reference Manual Rev. 1.22 544 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-23. Timer Input Capture/Output Compare Register 1 Low (TC1) Module Base + 0x0014 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-24. Timer Input Capture/Output Compare Register 2 High (TC2) Module Base + 0x0015 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-25. Timer Input Capture/Output Compare Register 2 Low (TC2) Module Base + 0x0016 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-26. Timer Input Capture/Output Compare Register 3 High (TC3) Module Base + 0x0017 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-27. Timer Input Capture/Output Compare Register 3 Low (TC3) Module Base + 0x0018 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-28. Timer Input Capture/Output Compare Register 4 High (TC4) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 545 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x0019 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-29. Timer Input Capture/Output Compare Register 4 Low (TC4) Module Base + 0x001A 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-30. Timer Input Capture/Output Compare Register 5 High (TC5) Module Base + 0x001B 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-31. Timer Input Capture/Output Compare Register 5 Low (TC5) Module Base + 0x001C 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-32. Timer Input Capture/Output Compare Register 6 High (TC6) Module Base + 0x001D 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-33. Timer Input Capture/Output Compare Register 6 Low (TC6) Module Base + 0x001E 15 14 13 12 11 10 9 8 R W Reset Bit 15 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 0 Bit 10 0 Bit 9 0 Bit 8 0 Figure 14-34. Timer Input Capture/Output Compare Register 7 High (TC7) MC9S12XE-Family Reference Manual Rev. 1.22 546 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x001F 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 Figure 14-35. Timer Input Capture/Output Compare Register 7 Low (TC7) Read: Anytime Write anytime for output compare function. Writes to these registers have no meaning or effect during input capture. All bits reset to zero. Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. 14.3.2.15 16-Bit Pulse Accumulator A Control Register (PACTL) Module Base + 0x0020 7 6 5 4 3 2 1 0 R W Reset 0 0 PAEN 0 PAMOD 0 PEDGE 0 CLK1 0 CLK0 0 PAOVI 0 PAI 0 = Unimplemented or Reserved Figure 14-36. 16-Bit Pulse Accumulator Control Register (PACTL) Read: Anytime Write: Anytime All bits reset to zero. Table 14-19. PACTL Field Descriptions Field 6 PAEN Description Pulse Accumulator A System Enable -- PAEN is independent from TEN. With timer disabled, the pulse accumulator can still function unless pulse accumulator is disabled. 0 16-Bit Pulse Accumulator A system disabled. 8-bit PAC3 and PAC2 can be enabled when their related enable bits in ICPAR are set. Pulse Accumulator Input Edge Flag (PAIF) function is disabled. 1 16-Bit Pulse Accumulator A system enabled. The two 8-bit pulse accumulators PAC3 and PAC2 are cascaded to form the PACA 16-bit pulse accumulator. When PACA in enabled, the PACN3 and PACN2 registers contents are respectively the high and low byte of the PACA. PA3EN and PA2EN control bits in ICPAR have no effect. Pulse Accumulator Input Edge Flag (PAIF) function is enabled. The PACA shares the input pin with IC7. Pulse Accumulator Mode -- This bit is active only when the Pulse Accumulator A is enabled (PAEN = 1). 0 Event counter mode 1 Gated time accumulation mode 5 PAMOD MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 547 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-19. PACTL Field Descriptions (continued) Field 4 PEDGE Description Pulse Accumulator Edge Control -- This bit is active only when the Pulse Accumulator A is enabled (PAEN = 1). Refer to Table 14-20. For PAMOD bit = 0 (event counter mode). 0 Falling edges on IC7 pin cause the count to be incremented 1 Rising edges on IC7 pin cause the count to be incremented For PAMOD bit = 1 (gated time accumulation mode). 0 IC7 input pin high enables bus clock divided by 64 to Pulse Accumulator and the trailing falling edge on IC7 sets the PAIF flag. 1 IC7 input pin low enables bus clock divided by 64 to Pulse Accumulator and the trailing rising edge on IC7 sets the PAIF flag. If the timer is not active (TEN = 0 in TSCR1), there is no divide-by-64 since the /64 clock is generated by the timer prescaler. 3:2 CLK[1:0] Clock Select Bits -- For the description of PACLK please refer to Figure 14-72. If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an input clock to the timer counter. The change from one selected clock to the other happens immediately after these bits are written. Refer to Table 14-21. Pulse Accumulator A Overflow Interrupt Enable 0 Interrupt inhibited 1 Interrupt requested if PAOVF is set Pulse Accumulator Input Interrupt Enable 0 Interrupt inhibited 1 Interrupt requested if PAIF is set 2 PAOVI 0 PAI . Table 14-20. Pin Action PAMOD 0 0 1 1 PEDGE 0 1 0 1 Falling edge Rising edge Divide by 64 clock enabled with pin high level Divide by 64 clock enabled with pin low level Pin Action Table 14-21. Clock Selection CLK1 0 0 1 1 CLK0 0 1 0 1 Clock Source Use timer prescaler clock as timer counter clock Use PACLK as input to timer counter clock Use PACLK/256 as timer counter clock frequency Use PACLK/65536 as timer counter clock frequency MC9S12XE-Family Reference Manual Rev. 1.22 548 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.16 Pulse Accumulator A Flag Register (PAFLG) Module Base + 0x0021 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 PAOVF 0 PAIF 0 = Unimplemented or Reserved Figure 14-37. Pulse Accumulator A Flag Register (PAFLG) Read: Anytime Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not affect the current status of the bit. NOTE When TFFCA = 1, the flags cannot be cleared via the normal flag clearing mechanism (writing a one to the flag). Reference Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)". All bits reset to zero. PAFLG indicates when interrupt conditions have occurred. The flags can be cleared via the normal flag clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA bit in Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)"). Table 14-22. PAFLG Field Descriptions Field 1 PAOVF Description Pulse Accumulator A Overflow Flag -- Set when the 16-bit pulse accumulator A overflows from 0xFFFF to 0x0000, or when 8-bit pulse accumulator 3 (PAC3) overflows from 0x00FF to 0x0000. When PACMX = 1, PAOVF bit can also be set if 8-bit pulse accumulator 3 (PAC3) reaches 0x00FF followed by an active edge on IC3. 0 PAIF Pulse Accumulator Input edge Flag -- Set when the selected edge is detected at the IC7 input pin. In event mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at the IC7 input pin triggers PAIF. 14.3.2.17 Pulse Accumulators Count Registers (PACN3 and PACN2) Module Base + 0x0022 7 6 5 4 3 2 1 0 R W Reset PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) 0 0 0 0 0 0 PACNT1(9) 0 PACNT0(8) 0 Figure 14-38. Pulse Accumulators Count Register 3 (PACN3) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 549 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x0023 7 6 5 4 3 2 1 0 R W Reset PACNT7 0 PACNT6 0 PACNT5 0 PACNT4 0 PACNT3 0 PACNT2 0 PACNT1 0 PACNT0 0 Figure 14-39. Pulse Accumulators Count Register 2 (PACN2) Read: Anytime Write: Anytime All bits reset to zero. The two 8-bit pulse accumulators PAC3 and PAC2 are cascaded to form the PACA 16-bit pulse accumulator. When PACA in enabled (PAEN = 1 in PACTL), the PACN3 and PACN2 registers contents are respectively the high and low byte of the PACA. When PACN3 overflows from 0x00FF to 0x0000, the interrupt flag PAOVF in PAFLG is set. Full count register access will take place in one clock cycle. NOTE A separate read/write for high byte and low byte will give a different result than accessing them as a word. When clocking pulse and write to the registers occurs simultaneously, write takes priority and the register is not incremented. 14.3.2.18 Pulse Accumulators Count Registers (PACN1 and PACN0) Module Base + 0x0024 7 6 5 4 3 2 1 0 R W Reset PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10) 0 0 0 0 0 0 PACNT1(9) 0 PACNT0(8) 0 Figure 14-40. Pulse Accumulators Count Register 1 (PACN1) Module Base + 0x0025 7 6 5 4 3 2 1 0 R W Reset PACNT7 0 PACNT6 0 PACNT5 0 PACNT4 0 PACNT3 0 PACNT2 0 PACNT1 0 PACNT0 0 Figure 14-41. Pulse Accumulators Count Register 0 (PACN0) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.22 550 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) All bits reset to zero. The two 8-bit pulse accumulators PAC1 and PAC0 are cascaded to form the PACB 16-bit pulse accumulator. When PACB in enabled, (PBEN = 1 in PBCTL) the PACN1 and PACN0 registers contents are respectively the high and low byte of the PACB. When PACN1 overflows from 0x00FF to 0x0000, the interrupt flag PBOVF in PBFLG is set. Full count register access will take place in one clock cycle. NOTE A separate read/write for high byte and low byte will give a different result than accessing them as a word. When clocking pulse and write to the registers occurs simultaneously, write takes priority and the register is not incremented. 14.3.2.19 16-Bit Modulus Down-Counter Control Register (MCCTL) Module Base + 0x0026 7 6 5 4 3 2 1 0 R W Reset MCZI 0 MODMC 0 RDMCL 0 0 ICLAT 0 0 FLMC 0 MCEN 0 MCPR1 0 MCPR0 0 Figure 14-42. 16-Bit Modulus Down-Counter Control Register (MCCTL) Read: Anytime Write: Anytime All bits reset to zero. Table 14-23. MCCTL Field Descriptions Field 7 MCZI 6 MODMC Modulus Counter Underflow Interrupt Enable 0 Modulus counter interrupt is disabled. 1 Modulus counter interrupt is enabled. Modulus Mode Enable 0 The modulus counter counts down from the value written to it and will stop at 0x0000. 1 Modulus mode is enabled. When the modulus counter reaches 0x0000, the counter is loaded with the latest value written to the modulus count register. Note: For proper operation, the MCEN bit should be cleared before modifying the MODMC bit in order to reset the modulus counter to 0xFFFF. Read Modulus Down-Counter Load 0 Reads of the modulus count register (MCCNT) will return the present value of the count register. 1 Reads of the modulus count register (MCCNT) will return the contents of the load register. Description 5 RDMCL MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 551 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-23. MCCTL Field Descriptions (continued) Field 4 ICLAT Description Input Capture Force Latch Action -- When input capture latch mode is enabled (LATQ and BUFEN bit in ICSYS are set), a write one to this bit immediately forces the contents of the input capture registers TC0 to TC3 and their corresponding 8-bit pulse accumulators to be latched into the associated holding registers. The pulse accumulators will be automatically cleared when the latch action occurs. Writing zero to this bit has no effect. Read of this bit will always return zero. 3 FLMC Force Load Register into the Modulus Counter Count Register -- This bit is active only when the modulus down-counter is enabled (MCEN = 1). A write one into this bit loads the load register into the modulus counter count register (MCCNT). This also resets the modulus counter prescaler. Write zero to this bit has no effect. Read of this bit will return always zero. 2 MCEN Modulus Down-Counter Enable 0 Modulus counter disabled. The modulus counter (MCCNT) is preset to 0xFFFF. This will prevent an early interrupt flag when the modulus down-counter is enabled. 1 Modulus counter is enabled. Modulus Counter Prescaler Select -- These two bits specify the division rate of the modulus counter prescaler when PRNT of TSCR1 is set to 0. The newly selected prescaler division rate will not be effective until a load of the load register into the modulus counter count register occurs. 1:0 MCPR[1:0] Table 14-24. Modulus Counter Prescaler Select MCPR1 0 0 1 1 MCPR0 0 1 0 1 Prescaler Division 1 4 8 16 14.3.2.20 16-Bit Modulus Down-Counter FLAG Register (MCFLG) Module Base + 0x0027 7 6 5 4 3 2 1 0 R W Reset MCZF 0 0 0 0 0 0 0 POLF3 0 POLF2 0 POLF1 0 POLF0 0 = Unimplemented or Reserved Figure 14-43. 16-Bit Modulus Down-Counter FLAG Register (MCFLG) Read: Anytime Write only used in the flag clearing mechanism for bit 7. Writing a one to bit 7 clears the flag. Writing a zero will not affect the current status of the bit. MC9S12XE-Family Reference Manual Rev. 1.22 552 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) NOTE When TFFCA = 1, the flag cannot be cleared via the normal flag clearing mechanism (writing a one to the flag). Reference Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)". All bits reset to zero. Table 14-25. MCFLG Field Descriptions Field 7 MCZF Description Modulus Counter Underflow Flag -- The flag is set when the modulus down-counter reaches 0x0000. The flag indicates when interrupt conditions have occurred. The flag can be cleared via the normal flag clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA bit in Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)"). First Input Capture Polarity Status -- These are read only bits. Writes to these bits have no effect. Each status bit gives the polarity of the first edge which has caused an input capture to occur after capture latch has been read. Each POLFx corresponds to a timer PORTx input. 0 The first input capture has been caused by a falling edge. 1 The first input capture has been caused by a rising edge. 3:0 POLF[3:0] 14.3.2.21 ICPAR -- Input Control Pulse Accumulators Register (ICPAR) Module Base + 0x0028 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 PA3EN 0 PA2EN 0 PA1EN 0 PA0EN 0 = Unimplemented or Reserved Figure 14-44. Input Control Pulse Accumulators Register (ICPAR) Read: Anytime Write: Anytime. All bits reset to zero. The 8-bit pulse accumulators PAC3 and PAC2 can be enabled only if PAEN in PACTL is cleared. If PAEN is set, PA3EN and PA2EN have no effect. The 8-bit pulse accumulators PAC1 and PAC0 can be enabled only if PBEN in PBCTL is cleared. If PBEN is set, PA1EN and PA0EN have no effect. Table 14-26. ICPAR Field Descriptions Field 3:0 PA[3:0]EN 8-Bit Pulse Accumulator `x' Enable 0 8-Bit Pulse Accumulator is disabled. 1 8-Bit Pulse Accumulator is enabled. Description MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 553 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.22 Delay Counter Control Register (DLYCT) Module Base + 0x0029 7 6 5 4 3 2 1 0 R W Reset DLY7 0 DLY6 0 DLY5 0 DLY4 0 DLY3 0 DLY2 0 DLY1 0 DLY0 0 Figure 14-45. Delay Counter Control Register (DLYCT) Read: Anytime Write: Anytime All bits reset to zero. Table 14-27. DLYCT Field Descriptions Field 7:0 DLY[7:0] Description Delay Counter Select -- When the PRNT bit of TSCR1 register is set to 0, only bits DLY0, DLY1 are used to calculate the delay.Table 14-28 shows the delay settings in this case. When the PRNT bit of TSCR1 register is set to 1, all bits are used to set a more precise delay. Table 14-29 shows the delay settings in this case. After detection of a valid edge on an input capture pin, the delay counter counts the pre-selected number of [(dly_cnt + 1)*4]bus clock cycles, then it will generate a pulse on its output if the level of input signal, after the preset delay, is the opposite of the level before the transition.This will avoid reaction to narrow input pulses. Delay between two active edges of the input signal period should be longer than the selected counter delay. Note: It is recommended to not write to this register while the timer is enabled, that is when TEN is set in register TSCR1. Table 14-28. Delay Counter Select when PRNT = 0 DLY1 0 0 1 1 DLY0 0 1 0 1 Delay Disabled 256 bus clock cycles 512 bus clock cycles 1024 bus clock cycles Table 14-29. Delay Counter Select Examples when PRNT = 1 DLY7 0 0 0 0 0 0 0 DLY6 0 0 0 0 0 0 0 DLY5 0 0 0 0 0 0 0 DLY4 0 0 0 0 0 0 0 DLY3 0 0 0 0 0 0 0 DLY2 0 0 0 0 1 1 1 DLY1 0 0 1 1 0 0 1 DLY0 0 1 0 1 0 1 0 Delay Disabled (bypassed) 8 bus clock cycles 12 bus clock cycles 16 bus clock cycles 20 bus clock cycles 24 bus clock cycles 28 bus clock cycles MC9S12XE-Family Reference Manual Rev. 1.22 554 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-29. Delay Counter Select Examples when PRNT = 1 DLY7 0 0 0 0 0 1 DLY6 0 0 0 0 1 1 DLY5 0 0 0 1 1 1 DLY4 0 0 1 1 1 1 DLY3 0 1 1 1 1 1 DLY2 1 1 1 1 1 1 DLY1 1 1 1 1 1 1 DLY0 1 1 1 1 1 1 Delay 32 bus clock cycles 64 bus clock cycles 128 bus clock cycles 256 bus clock cycles 512 bus clock cycles 1024 bus clock cycles 14.3.2.23 Input Control Overwrite Register (ICOVW) Module Base + 0x002A 7 6 5 4 3 2 1 0 R W Reset NOVW7 0 NOVW6 0 NOVW5 0 NOVW4 0 NOVW3 0 NOVW2 0 NOVW1 0 NOVW0 0 Figure 14-46. Input Control Overwrite Register (ICOVW) Read: Anytime Write: Anytime All bits reset to zero. Table 14-30. ICOVW Field Descriptions Field 7:0 NOVW[7:0] Description No Input Capture Overwrite 0 The contents of the related capture register or holding register can be overwritten when a new input capture or latch occurs. 1 The related capture register or holding register cannot be written by an event unless they are empty (see Section 14.4.1.1, "IC Channels"). This will prevent the captured value being overwritten until it is read or latched in the holding register. 14.3.2.24 Input Control System Control Register (ICSYS) Module Base + 0x002B 7 6 5 4 3 2 1 0 R W Reset SH37 0 SH26 0 SH15 0 SH04 0 TFMOD 0 PACMX 0 BUFEN 0 LATQ 0 Figure 14-47. Input Control System Register (ICSYS) Read: Anytime Write: Once in normal modes MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 555 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) All bits reset to zero. Table 14-31. ICSYS Field Descriptions Field 7:4 SHxy Description Share Input action of Input Capture Channels x and y 0 Normal operation 1 The channel input `x' causes the same action on the channel `y'. The port pin `x' and the corresponding edge detector is used to be active on the channel `y'. Timer Flag Setting Mode -- Use of the TFMOD bit in conjunction with the use of the ICOVW register allows a timer interrupt to be generated after capturing two values in the capture and holding registers instead of generating an interrupt for every capture. By setting TFMOD in queue mode, when NOVWx bit is set and the corresponding capture and holding registers are emptied, an input capture event will first update the related input capture register with the main timer contents. At the next event, the TCx data is transferred to the TCxH register, the TCx is updated and the CxF interrupt flag is set. In all other input capture cases the interrupt flag is set by a valid external event on ICx. 0 The timer flags C3F-C0F in TFLG1 are set when a valid input capture transition on the corresponding port pin occurs. 1 If in queue mode (BUFEN = 1 and LATQ = 0), the timer flags C3F-C0F in TFLG1 are set only when a latch on the corresponding holding register occurs. If the queue mode is not engaged, the timer flags C3F-C0F are set the same way as for TFMOD = 0. 8-Bit Pulse Accumulators Maximum Count 0 Normal operation. When the 8-bit pulse accumulator has reached the value 0x00FF, with the next active edge, it will be incremented to 0x0000. 1 When the 8-bit pulse accumulator has reached the value 0x00FF, it will not be incremented further. The value 0x00FF indicates a count of 255 or more. IC Buffer Enable 0 Input capture and pulse accumulator holding registers are disabled. 1 Input capture and pulse accumulator holding registers are enabled. The latching mode is defined by LATQ control bit. Input Control Latch or Queue Mode Enable -- The BUFEN control bit should be set in order to enable the IC and pulse accumulators holding registers. Otherwise LATQ latching modes are disabled. Write one into ICLAT bit in MCCTL, when LATQ and BUFEN are set will produce latching of input capture and pulse accumulators registers into their holding registers. 0 Queue mode of Input Capture is enabled. The main timer value is memorized in the IC register by a valid input pin transition. With a new occurrence of a capture, the value of the IC register will be transferred to its holding register and the IC register memorizes the new timer value. 1 Latch mode is enabled. Latching function occurs when modulus down-counter reaches zero or a zero is written into the count register MCCNT (see Section 14.4.1.1.2, "Buffered IC Channels"). With a latching event the contents of IC registers and 8-bit pulse accumulators are transferred to their holding registers. 8-bit pulse accumulators are cleared. 3 TFMOD 2 PACMX 1 BUFFEN 0 LATQ MC9S12XE-Family Reference Manual Rev. 1.22 556 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.25 Output Compare Pin Disconnect Register (OCPD) Module Base + 0x002C 7 6 5 4 3 2 1 0 R W Reset OCPD7 0 OCPD6 0 OCPD5 0 OCPD4 0 OCPD3 0 OCPD2 0 OCPD1 0 OCPD0 0 Figure 14-48. Output Compare Pin Disconnect Register (OCPD) Read: Anytime Write: Anytime All bits reset to zero. Table 14-32. OCPD Field Descriptions Field 7:0 OCPD[7:0] Description Output Compare Pin Disconnect Bits 0 Enables the timer channel IO port. Output Compare actions will occur on the channel pin. These bits do not affect the input capture or pulse accumulator functions. 1 Disables the timer channel IO port. Output Compare actions will not affect on the channel pin; the output compare flag will still be set on an Output Compare event. 14.3.2.26 Precision Timer Prescaler Select Register (PTPSR) Module Base + 0x002E 7 6 5 4 3 2 1 0 R W Reset PTPS7 0 PTPS6 0 PTPS5 0 PTPS4 0 PTPS3 0 PTPS2 0 PTPS1 0 PTPS0 0 Figure 14-49. Precision Timer Prescaler Select Register (PTPSR) Read: Anytime Write: Anytime All bits reset to zero. Table 14-33. PTPSR Field Descriptions Field 7:0 PTPS[7:0] Description Precision Timer Prescaler Select Bits -- These eight bits specify the division rate of the main Timer prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 14-34 shows some selection examples in this case. The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 557 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-34. Precision Timer Prescaler Selection Examples when PRNT = 1 PTPS7 0 0 0 0 0 0 0 0 0 0 0 0 1 PTPS6 0 0 0 0 0 0 0 0 0 0 0 1 1 PTPS5 0 0 0 0 0 0 0 0 0 0 1 1 1 PTPS4 0 0 0 0 0 0 0 0 0 1 1 1 1 PTPS3 0 0 0 0 0 0 0 0 1 1 1 1 1 PTPS2 0 0 0 0 1 1 1 1 1 1 1 1 1 PTPS1 0 0 1 1 0 0 1 1 1 1 1 1 1 PTPS0 0 1 0 1 0 1 0 1 1 1 1 1 1 Prescale Factor 1 2 3 4 5 6 7 8 16 32 64 128 256 14.3.2.27 Precision Timer Modulus Counter Prescaler Select Register (PTMCPSR) Module Base + 0x002F 7 6 5 4 3 2 1 0 R W Reset PTMPS7 0 PTMPS6 0 PTMPS5 0 PTMPS4 0 PTMPS3 0 PTMPS2 0 PTMPS1 0 PTMPS0 0 Figure 14-50. Precision Timer Modulus Counter Prescaler Select Register (PTMCPSR) Read: Anytime Write: Anytime All bits reset to zero. Table 14-35. PTMCPSR Field Descriptions Field Description 7:0 Precision Timer Modulus Counter Prescaler Select Bits -- These eight bits specify the division rate of the PTMPS[7:0] modulus counter prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 14-36 shows some possible division rates. The newly selected prescaler division rate will not be effective until a load of the load register into the modulus counter count register occurs. MC9S12XE-Family Reference Manual Rev. 1.22 558 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-36. Precision Timer Modulus Counter Prescaler Select Examples when PRNT = 1 PTMPS7 0 0 0 0 0 0 0 0 0 0 0 0 1 PTMPS6 0 0 0 0 0 0 0 0 0 0 0 1 1 PTMPS5 0 0 0 0 0 0 0 0 0 0 1 1 1 PTMPS4 0 0 0 0 0 0 0 0 0 1 1 1 1 PTMPS3 0 0 0 0 0 0 0 0 1 1 1 1 1 PTMPS2 0 0 0 0 1 1 1 1 1 1 1 1 1 PTMPS1 0 0 1 1 0 0 1 1 1 1 1 1 1 PTMPS0 0 1 0 1 0 1 0 1 1 1 1 1 1 Prescaler Division Rate 1 2 3 4 5 6 7 8 16 32 64 128 256 14.3.2.28 16-Bit Pulse Accumulator B Control Register (PBCTL) Module Base + 0x0030 7 6 5 4 3 2 1 0 R W Reset 0 0 PBEN 0 0 0 0 0 0 0 0 0 PBOVI 0 0 0 = Unimplemented or Reserved Figure 14-51. 16-Bit Pulse Accumulator B Control Register (PBCTL) Read: Anytime Write: Anytime All bits reset to zero. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 559 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Table 14-37. PBCTL Field Descriptions Field 6 PBEN Description Pulse Accumulator B System Enable -- PBEN is independent from TEN. With timer disabled, the pulse accumulator can still function unless pulse accumulator is disabled. 0 16-bit pulse accumulator system disabled. 8-bit PAC1 and PAC0 can be enabled when their related enable bits in ICPAR are set. 1 Pulse accumulator B system enabled. The two 8-bit pulse accumulators PAC1 and PAC0 are cascaded to form the PACB 16-bit pulse accumulator B. When PACB is enabled, the PACN1 and PACN0 registers contents are respectively the high and low byte of the PACB. PA1EN and PA0EN control bits in ICPAR have no effect. The PACB shares the input pin with IC0. Pulse Accumulator B Overflow Interrupt Enable 0 Interrupt inhibited 1 Interrupt requested if PBOVF is set 1 PBOVI 14.3.2.29 Pulse Accumulator B Flag Register (PBFLG) Module Base + 0x0031 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 PBOVF 0 0 0 = Unimplemented or Reserved Figure 14-52. Pulse Accumulator B Flag Register (PBFLG) Read: Anytime Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not affect the current status of the bit. NOTE When TFFCA = 1, the flag cannot be cleared via the normal flag clearing mechanism (writing a one to the flag). Reference Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)". All bits reset to zero. PBFLG indicates when interrupt conditions have occurred. The flag can be cleared via the normal flag clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA bit in Section 14.3.2.6, "Timer System Control Register 1 (TSCR1)"). Table 14-38. PBFLG Field Descriptions Field 1 PBOVF Description Pulse Accumulator B Overflow Flag -- This bit is set when the 16-bit pulse accumulator B overflows from 0xFFFF to 0x0000, or when 8-bit pulse accumulator 1 (PAC1) overflows from 0x00FF to 0x0000. When PACMX = 1, PBOVF bit can also be set if 8-bit pulse accumulator 1 (PAC1) reaches 0x00FF and an active edge follows on IC1. MC9S12XE-Family Reference Manual Rev. 1.22 560 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.30 8-Bit Pulse Accumulators Holding Registers (PA3H-PA0H) Module Base + 0x0032 7 6 5 4 3 2 1 0 R W Reset PA3H7 0 PA3H6 0 PA3H5 0 PA3H4 0 PA3H3 0 PA3H2 0 PA3H1 0 PA3H0 0 = Unimplemented or Reserved Figure 14-53. 8-Bit Pulse Accumulators Holding Register 3 (PA3H) Module Base + 0x0033 7 6 5 4 3 2 1 0 R W Reset PA2H7 0 PA2H6 0 PA2H5 0 PA2H4 0 PA2H3 0 PA2H2 0 PA2H1 0 PA2H0 0 = Unimplemented or Reserved Figure 14-54. 8-Bit Pulse Accumulators Holding Register 2 (PA2H) Module Base + 0x0034 7 6 5 4 3 2 1 0 R W Reset PA1H7 0 PA1H6 0 PA1H5 0 PA1H4 0 PA1H3 0 PA1H2 0 PA1H1 0 PA1H0 0 = Unimplemented or Reserved Figure 14-55. 8-Bit Pulse Accumulators Holding Register 1 (PA1H) Module Base + 0x0035 7 6 5 4 3 2 1 0 R W Reset PA0H7 0 PA0H6 0 PA0H5 0 PA0H4 0 PA0H3 0 PA0H2 0 PA0H1 0 PA0H0 0 = Unimplemented or Reserved Figure 14-56. 8-Bit Pulse Accumulators Holding Register 0 (PA0H) Read: Anytime. Write: Has no effect. All bits reset to zero. These registers are used to latch the value of the corresponding pulse accumulator when the related bits in register ICPAR are enabled (see Section 14.4.1.3, "Pulse Accumulators"). MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 561 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.31 Modulus Down-Counter Count Register (MCCNT) Module Base + 0x0036 15 14 13 12 11 10 9 8 R W Reset MCCNT15 1 MCCNT14 1 MCCNT13 1 MCCNT12 1 MCCNT11 1 MCCNT10 1 MCCNT9 1 MCCNT8 1 Figure 14-57. Modulus Down-Counter Count Register High (MCCNT) Module Base + 0x0037 7 6 5 4 3 2 1 0 R W Reset MCCNT7 1 MCCNT6 1 MCCNT5 1 MCCNT4 1 MCCNT3 1 MCCNT2 1 MCCNT1 1 MCCNT0 1 Figure 14-58. Modulus Down-Counter Count Register Low (MCCNT) Read: Anytime Write: Anytime. All bits reset to one. A full access for the counter register will take place in one clock cycle. NOTE A separate read/write for high byte and low byte will give different results than accessing them as a word. If the RDMCL bit in MCCTL register is cleared, reads of the MCCNT register will return the present value of the count register. If the RDMCL bit is set, reads of the MCCNT will return the contents of the load register. If a 0x0000 is written into MCCNT when LATQ and BUFEN in ICSYS register are set, the input capture and pulse accumulator registers will be latched. With a 0x0000 write to the MCCNT, the modulus counter will stay at zero and does not set the MCZF flag in MCFLG register. If the modulus down counter is enabled (MCEN = 1) and modulus mode is enabled (MODMC = 1), a write to MCCNT will update the load register with the value written to it. The count register will not be updated with the new value until the next counter underflow. If modulus mode is not enabled (MODMC = 0), a write to MCCNT will clear the modulus prescaler and will immediately update the counter register with the value written to it and down-counts to 0x0000 and stops. The FLMC bit in MCCTL can be used to immediately update the count register with the new value if an immediate load is desired. MC9S12XE-Family Reference Manual Rev. 1.22 562 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.3.2.32 Timer Input Capture Holding Registers 0-3 (TCxH) Module Base + 0x0038 15 14 13 12 11 10 9 8 R W Reset TC15 0 TC14 0 TC13 0 TC12 0 TC11 0 TC10 0 TC9 0 TC8 0 = Unimplemented or Reserved Figure 14-59. Timer Input Capture Holding Register 0 High (TC0H) Module Base + 0x0039 7 6 5 4 3 2 1 0 R W Reset TC7 0 TC6 0 TC5 0 TC4 0 TC3 0 TC2 0 TC1 0 TC0 0 = Unimplemented or Reserved Figure 14-60. Timer Input Capture Holding Register 0 Low (TC0H) Module Base + 0x003A 15 14 13 12 11 10 9 8 R W Reset TC15 0 TC14 0 TC13 0 TC12 0 TC11 0 TC10 0 TC9 0 TC8 0 = Unimplemented or Reserved Figure 14-61. Timer Input Capture Holding Register 1 High (TC1H) Module Base + 0x003B 7 6 5 4 3 2 1 0 R W Reset TC7 0 TC6 0 TC5 0 TC4 0 TC3 0 TC2 0 TC1 0 TC0 0 = Unimplemented or Reserved Figure 14-62. Timer Input Capture Holding Register 1 Low (TC1H) Module Base + 0x003C 15 14 13 12 11 10 9 8 R W Reset TC15 0 TC14 0 TC13 0 TC12 0 TC11 0 TC10 0 TC9 0 TC8 0 = Unimplemented or Reserved Figure 14-63. Timer Input Capture Holding Register 2 High (TC2H) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 563 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Module Base + 0x003D 7 6 5 4 3 2 1 0 R W Reset TC7 0 TC6 0 TC5 0 TC4 0 TC3 0 TC2 0 TC1 0 TC0 0 = Unimplemented or Reserved Figure 14-64. Timer Input Capture Holding Register 2 Low (TC2H) Module Base + 0x003E 15 14 13 12 11 10 9 8 R W Reset TC15 0 TC14 0 TC13 0 TC12 0 TC11 0 TC10 0 TC9 0 TC8 0 = Unimplemented or Reserved Figure 14-65. Timer Input Capture Holding Register 3 High (TC3H) Module Base + 0x003F 7 6 5 4 3 2 1 0 R W Reset TC7 0 TC6 0 TC5 0 TC4 0 TC3 0 TC2 0 TC1 0 TC0 0 = Unimplemented or Reserved Figure 14-66. Timer Input Capture Holding Register 3 Low (TC3H) Read: Anytime Write: Has no effect. All bits reset to zero. These registers are used to latch the value of the input capture registers TC0-TC3. The corresponding IOSx bits in TIOS should be cleared (see Section 14.4.1.1, "IC Channels"). 14.4 Functional Description This section provides a complete functional description of the ECT block, detailing the operation of the design from the end user perspective in a number of subsections. MC9S12XE-Family Reference Manual Rev. 1.22 564 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) / 1, 2, ..., 128 Bus Clock Timer Prescaler 16-Bit Free-Running 16 BITMain Timer MAIN TIMER Bus Clock / 1, 4, 8, 16 Modulus Prescaler 16-Bit Load Register 16-Bit Modulus Down Counter 0 RESET Underflow RESET RESET RESET LATCH P0 Pin Logic Comparator Delay Counter EDG0 TC0 Capture/Compare Reg. PAC0 TC0H Hold Reg. PA0H Hold Reg. 0 P1 Pin Logic Comparator Delay Counter EDG1 TC1 Capture/Compare Reg. PAC1 TC1H Hold Reg. PA1H Hold Reg. 0 P2 Pin Logic Comparator Delay Counter EDG2 TC2 Capture/Compare Reg. PAC2 TC2H Hold Reg. Comparator Delay Counter EDG3 TC3 Capture/Compare Reg. PA2H Hold Reg. 0 P3 Pin Logic PAC3 TC3H Hold Reg. PA3H Hold Reg. P4 Pin Logic Comparator EDG4 EDG0 SH04 Comparator EDG5 EDG1 SH15 Comparator EDG6 EDG2 SH26 Comparator EDG7 EDG3 SH37 MUX TC7 Capture/Compare Reg. MUX TC6 Capture/Compare Reg. MUX TC5 Capture/Compare Reg. Write 0x0000 to Modulus Counter MUX TC4 Capture/Compare Reg. ICLAT, LATQ, BUFEN (Force Latch) P5 Pin Logic P6 Pin Logic LATQ (MDC Latch Enable) P7 Pin Logic Figure 14-67. Detailed Timer Block Diagram in Latch Mode when PRNT = 0 MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 565 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) / 1, 2,3, ..., 256 Bus Clock Timer Prescaler 16-Bit Free-Running 16 BITMain Timer MAIN TIMER Bus Clock / 1, 2,3, ..., 256 Modulus Prescaler 16-Bit Load Register 16-Bit Modulus Down Counter 0 RESET Underflow RESET RESET RESET LATCH P0 Pin Logic Comparator Delay Counter EDG0 TC0 Capture/Compare Reg. PAC0 8, 12, 16, ..., 1024 TC0H Hold Reg. PA0H Hold Reg. 0 P1 Pin Logic Comparator Delay Counter EDG1 TC1 Capture/Compare Reg. PAC1 8, 12, 16, ..., 1024 TC1H Hold Reg. PA1H Hold Reg. 0 P2 Pin Logic Comparator Delay Counter EDG2 TC2 Capture/Compare Reg. PAC2 8, 12, 16, ..., 1024 TC2H Hold Reg. Comparator Delay Counter EDG3 TC3 Capture/Compare Reg. PAC3 PA2H Hold Reg. 0 P3 Pin Logic 8, 12, 16, ..., 1024 TC3H Hold Reg. PA3H Hold Reg. P4 Pin Logic Comparator EDG4 EDG0 SH04 Comparator EDG5 EDG1 SH15 Comparator EDG6 EDG2 SH26 Comparator EDG7 EDG3 SH37 MUX TC7 Capture/Compare Reg. MUX TC6 Capture/Compare Reg. MUX TC5 Capture/Compare Reg. Write 0x0000 to Modulus Counter MUX TC4 Capture/Compare Reg. ICLAT, LATQ, BUFEN (Force Latch) P5 Pin Logic P6 Pin Logic LATQ (MDC Latch Enable) P7 Pin Logic Figure 14-68. Detailed Timer Block Diagram in Latch Mode when PRNT = 1 MC9S12XE-Family Reference Manual Rev. 1.22 566 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Bus Clock /1, 2, ..., 128 Timer Prescaler 16-Bit Free-Running 16 BIT MAIN TIMER Main Timer Bus Clock / 1, 4, 8, 16 Modulus Prescaler 16-Bit Load Register 16-Bit Modulus Down Counter 0 RESET P0 Pin Logic Comparator Delay Counter EDG0 TC0 Capture/Compare Reg. PAC0 LATCH0 LATCH3 LATCH2 LATCH1 TC0H Hold Reg. Comparator Delay Counter EDG1 TC1 Capture/Compare Reg. PA0H Hold Reg. 0 RESET P1 Pin Logic PAC1 TC1H Hold Reg. Comparator Delay Counter EDG2 TC2 Capture/Compare Reg. PA1H Hold Reg. 0 RESET P2 Pin Logic PAC2 TC2H Hold Reg. Comparator Delay Counter EDG3 TC3 Capture/Compare Reg. PA2H Hold Reg. 0 RESET P3 Pin Logic PAC3 TC3H Hold Reg. Comparator EDG4 EDG0 MUX SH04 P5 Pin Logic Comparator EDG5 EDG1 MUX SH15 P6 Pin Logic Comparator EDG6 EDG2 MUX SH26 P7 Pin Logic Comparator EDG7 EDG3 SH37 MUX TC7 Capture/Compare Reg. TC6 Capture/Compare Reg. TC5 Capture/Compare Reg. TC4 Capture/Compare Reg. PA3H Hold Reg. P4 Pin Logic LATQ, BUFEN (Queue Mode) Read TC3H Hold Reg. Read TC2H Hold Reg. Read TC1H Hold Reg. Read TC0H Hold Reg. Figure 14-69. Detailed Timer Block Diagram in Queue Mode when PRNT = 0 MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 567 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) /1, 2, 3, ... 256 Bus Clock Timer Prescaler 16-Bit Free-Running 16 BIT MAIN TIMER Main Timer Bus Clock / 1, 2, 3, ... 256 Modulus Prescaler 0 P0 Pin Logic Comparator Delay Counter EDG0 TC0 Capture/Compare Reg. PAC0 LATCH0 LATCH3 LATCH2 LATCH1 16-Bit Load Register 16-Bit Modulus Down Counter RESET 8, 12, 16, ... 1024 TC0H Hold Reg. Comparator Delay Counter EDG1 TC1 Capture/Compare Reg. PAC1 PA0H Hold Reg. 0 P1 Pin Logic RESET 8, 12, 16, ... 1024 TC1H Hold Reg. Comparator Delay Counter EDG2 TC2 Capture/Compare Reg. PAC2 PA1H Hold Reg. 0 P2 Pin Logic RESET 8, 12, 16, ... 1024 TC2H Hold Reg. Comparator Delay Counter EDG3 TC3 Capture/Compare Reg. PAC3 PA2H Hold Reg. 0 P3 Pin Logic RESET 8, 12, 16, ... 1024 TC3H Hold Reg. Comparator EDG4 EDG0 MUX SH04 P5 Pin Logic Comparator EDG5 EDG1 MUX SH15 P6 Pin Logic Comparator EDG6 EDG2 MUX SH26 P7 Pin Logic Comparator EDG7 EDG3 SH37 MUX TC7 Capture/Compare Reg. Read TC0H Hold Reg. TC6 Capture/Compare Reg. Read TC1H Hold Reg. Read TC2H Hold Reg. TC5 Capture/Compare Reg. TC4 Capture/Compare Reg. PA3H Hold Reg. P4 Pin Logic LATQ, BUFEN (Queue Mode) Read TC3H Hold Reg. Figure 14-70. Detailed Timer Block Diagram in Queue Mode when PRNT = 1 MC9S12XE-Family Reference Manual Rev. 1.22 568 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) Load Holding Register and Reset Pulse Accumulator 0 EDG0 P0 Edge Detector Delay Counter 8-Bit PAC0 (PACN0) 8, 12,16, ..., 1024 PA0H Holding Register Interrupt 8, 12,16, ..., 1024 EDG1 P1 Edge Detector Delay Counter 0 8-Bit PAC1 (PACN1) PA1H Holding Register 8, 12,16, ..., 1024 EDG2 P2 Edge Detector Delay Counter 0 8-Bit PAC2 (PACN2) PA2H Holding Register Interrupt 8, 12,16, ..., 1024 P3 Edge Detector Delay Counter 0 EDG3 8-Bit PAC3 (PACN3) PA3H Holding Register Figure 14-71. 8-Bit Pulse Accumulators Block Diagram MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 569 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) TIMCLK (Timer Clock) CLK1 CLK0 4:1 MUX PACLK / 65536 PACLK / 256 Prescaled Clock (PCLK) Clock Select (PAMOD) PACLK Edge Detector P7 Interrupt 8-Bit PAC3 (PACN3) PACA 8-Bit PAC2 (PACN2) MUX Divide by 64 Bus Clock Interrupt 8-Bit PAC1 (PACN1) PACB 8-Bit PAC0 (PACN0) Delay Counter Edge Detector P0 Figure 14-72. 16-Bit Pulse Accumulators Block Diagram 16-Bit Main Timer Px Edge Detector Delay Counter TCx Input Capture Register Set CxF Interrupt TCxH I.C. Holding Register BUFEN * LATQ * TFMOD Figure 14-73. Block Diagram for Port 7 with Output Compare/Pulse Accumulator A MC9S12XE-Family Reference Manual Rev. 1.22 570 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.4.1 Enhanced Capture Timer Modes of Operation The enhanced capture timer has 8 input capture, output compare (IC/OC) channels, same as on the HC12 standard timer (timer channels TC0 to TC7). When channels are selected as input capture by selecting the IOSx bit in TIOS register, they are called input capture (IC) channels. Four IC channels (channels 7-4) are the same as on the standard timer with one capture register each that memorizes the timer value captured by an action on the associated input pin. Four other IC channels (channels 3-0), in addition to the capture register, also have one buffer each called a holding register. This allows two different timer values to be saved without generating any interrupts. Four 8-bit pulse accumulators are associated with the four buffered IC channels (channels 3-0). Each pulse accumulator has a holding register to memorize their value by an action on its external input. Each pair of pulse accumulators can be used as a 16-bit pulse accumulator. The 16-bit modulus down-counter can control the transfer of the IC registers and the pulse accumulators contents to the respective holding registers for a given period, every time the count reaches zero. The modulus down-counter can also be used as a stand-alone time base with periodic interrupt capability. 14.4.1.1 IC Channels The IC channels are composed of four standard IC registers and four buffered IC channels. * An IC register is empty when it has been read or latched into the holding register. * A holding register is empty when it has been read. 14.4.1.1.1 Non-Buffered IC Channels The main timer value is memorized in the IC register by a valid input pin transition. If the corresponding NOVWx bit of the ICOVW register is cleared, with a new occurrence of a capture, the contents of IC register are overwritten by the new value. If the corresponding NOVWx bit of the ICOVW register is set, the capture register cannot be written unless it is empty. This will prevent the captured value from being overwritten until it is read. 14.4.1.1.2 Buffered IC Channels There are two modes of operations for the buffered IC channels: 1. IC latch mode (LATQ = 1) The main timer value is memorized in the IC register by a valid input pin transition (see Figure 1467 and Figure 14-68). The value of the buffered IC register is latched to its holding register by the modulus counter for a given period when the count reaches zero, by a write 0x0000 to the modulus counter or by a write to ICLAT in the MCCTL register. If the corresponding NOVWx bit of the ICOVW register is cleared, with a new occurrence of a capture, the contents of IC register are overwritten by the new value. In case of latching, the contents of its holding register are overwritten. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 571 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) If the corresponding NOVWx bit of the ICOVW register is set, the capture register or its holding register cannot be written by an event unless they are empty (see Section 14.4.1.1, "IC Channels"). This will prevent the captured value from being overwritten until it is read or latched in the holding register. 2. IC Queue Mode (LATQ = 0) The main timer value is memorized in the IC register by a valid input pin transition (see Figure 1469 and Figure 14-70). If the corresponding NOVWx bit of the ICOVW register is cleared, with a new occurrence of a capture, the value of the IC register will be transferred to its holding register and the IC register memorizes the new timer value. If the corresponding NOVWx bit of the ICOVW register is set, the capture register or its holding register cannot be written by an event unless they are empty (see Section 14.4.1.1, "IC Channels"). if the TFMOD bit of the ICSYS register is set,the timer flags C3F--C0F in TFLG register are set only when a latch on the corresponding holding register occurs,after C3F--C0F are set,user should clear flag C3F--C0F,then read TCx and TCxH to make TCx and TCxH be empty. In queue mode, reads of the holding register will latch the corresponding pulse accumulator value to its holding register. 14.4.1.1.3 Delayed IC Channels There are four delay counters in this module associated with IC channels 0-3. The use of this feature is explained in the diagram and notes below. BUS CLOCK DLY_CNT INPUT ON CH0-3 INPUT ON CH0-3 INPUT ON CH0-3 INPUT ON CH0-3 0 1 2 3 253 254 255 256 Rejected 255 Cycles Rejected 255.5 Cycles 255.5 Cycles Accepted 256 Cycles Accepted Figure 14-74. Channel Input Validity with Delay Counter Feature In Figure 14-74 a delay counter value of 256 bus cycles is considered. 1. Input pulses with a duration of (DLY_CNT - 1) cycles or shorter are rejected. 2. Input pulses with a duration between (DLY_CNT - 1) and DLY_CNT cycles may be rejected or accepted, depending on their relative alignment with the sample points. MC9S12XE-Family Reference Manual Rev. 1.22 572 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 3. Input pulses with a duration between (DLY_CNT - 1) and DLY_CNT cycles may be rejected or accepted, depending on their relative alignment with the sample points. 4. Input pulses with a duration of DLY_CNT or longer are accepted. 14.4.1.2 OC Channel Initialization An internal compare channel whose output drives OCx may be programmed before the timer drives the output compare state (OCx). The required output of the compare logic can be disconnected from the pin, leaving it driven by the GP IO port, by setting the appropriate OCPDx bit before enabling the output compare channel (by default the OCPD bits are cleared which would enable the output compare logic to drive the pin as soon as the timer output compare channel is enabled). The desired initial state can then be configured in the internal output compare logic by forcing a compare action with the logic disconnected from the IO (by writing a one to CFORCx bit with TIOSx, OCPDx and TEN bits set to one). Clearing the output compare disconnect bit (OCPDx) will then allow the internal compare logic to drive the programmed state to OCx. This allows a glitch free switching between general purpose I/O and timer output functionality. 14.4.1.3 Pulse Accumulators There are four 8-bit pulse accumulators with four 8-bit holding registers associated with the four IC buffered channels 3-0. A pulse accumulator counts the number of active edges at the input of its channel. The minimum pulse width for the PAI input is greater than two bus clocks.The maximum input frequency on the pulse accumulator channel is one half the bus frequency or Eclk. The user can prevent the 8-bit pulse accumulators from counting further than 0x00FF by utilizing the PACMX control bit in the ICSYS register. In this case, a value of 0x00FF means that 255 counts or more have occurred. Each pair of pulse accumulators can be used as a 16-bit pulse accumulator (see Figure 14-72). Pulse accumulator B operates only as an event counter, it does not feature gated time accumulation mode. The edge control for pulse accumulator B as a 16-bit pulse accumulator is defined by TCTL4[1:0]. To operate the 16-bit pulse accumulators A and B (PACA and PACB) independently of input capture or output compare 7 and 0 respectively, the user must set the corresponding bits: IOSx = 1, OMx = 0, and OLx = 0. OC7M7 or OC7M0 in the OC7M register must also be cleared. There are two modes of operation for the pulse accumulators: * Pulse accumulator latch mode The value of the pulse accumulator is transferred to its holding register when the modulus downcounter reaches zero, a write 0x0000 to the modulus counter or when the force latch control bit ICLAT is written. At the same time the pulse accumulator is cleared. * Pulse accumulator queue mode When queue mode is enabled, reads of an input capture holding register will transfer the contents of the associated pulse accumulator to its holding register. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 573 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) At the same time the pulse accumulator is cleared. 14.4.1.4 Modulus Down-Counter The modulus down-counter can be used as a time base to generate a periodic interrupt. It can also be used to latch the values of the IC registers and the pulse accumulators to their holding registers. The action of latching can be programmed to be periodic or only once. 14.4.1.5 Precision Timer By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this case, it is possible to set additional prescaler settings for the main timer counter and modulus down counter and enhance delay counter settings compared to the settings in the present ECT timer. 14.4.1.6 Flag Clearing Mechanisms The flags in the ECT can be cleared one of two ways: 1. Normal flag clearing mechanism (TFFCA = 0) Any of the ECT flags can be cleared by writing a one to the flag. 2. Fast flag clearing mechanism (TFFCA = 1) With the timer fast flag clear all (TFFCA) enabled, the ECT flags can only be cleared by accessing the various registers associated with the ECT modes of operation as described below. The flags cannot be cleared via the normal flag clearing mechanism. This fast flag clearing mechanism has the advantage of eliminating the software overhead required by a separate clear sequence. Extra care must be taken to avoid accidental flag clearing due to unintended accesses. -- Input capture A read from an input capture channel register causes the corresponding channel flag, CxF, to be cleared in the TFLG1 register. -- Output compare A write to the output compare channel register causes the corresponding channel flag, CxF, to be cleared in the TFLG1 register. -- Timer counter Any access to the TCNT register clears the TOF flag in the TFLG2 register. -- Pulse accumulator A Any access to the PACN3 and PACN2 registers clears the PAOVF and PAIF flags in the PAFLG register. -- Pulse accumulator B Any access to the PACN1 and PACN0 registers clears the PBOVF flag in the PBFLG register. -- Modulus down counter Any access to the MCCNT register clears the MCZF flag in the MCFLG register. MC9S12XE-Family Reference Manual Rev. 1.22 574 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.4.2 Reset The reset state of each individual bit is listed within the register description section (Section 14.3, "Memory Map and Register Definition") which details the registers and their bit-fields. 14.4.3 Interrupts This section describes interrupts originated by the ECT block. The MCU must service the interrupt requests. Table 14-39 lists the interrupts generated by the ECT to communicate with the MCU. Table 14-39. ECT Interrupts Interrupt Source Timer channel 7-0 Modulus counter underflow Pulse accumulator B overflow Pulse accumulator A input Pulse accumulator A overflow Timer overflow Description Active high timer channel interrupts 7-0 Active high modulus counter interrupt Active high pulse accumulator B interrupt Active high pulse accumulator A input interrupt Pulse accumulator overflow interrupt Timer 0verflow interrupt The ECT only originates interrupt requests. The following is a description of how the module makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are chip dependent. 14.4.3.1 Channel [7:0] Interrupt This active high output will be asserted by the module to request a timer channel 7-0 interrupt to be serviced by the system controller. 14.4.3.2 Modulus Counter Interrupt This active high output will be asserted by the module to request a modulus counter underflow interrupt to be serviced by the system controller. 14.4.3.3 Pulse Accumulator B Overflow Interrupt This active high output will be asserted by the module to request a timer pulse accumulator B overflow interrupt to be serviced by the system controller. 14.4.3.4 Pulse Accumulator A Input Interrupt This active high output will be asserted by the module to request a timer pulse accumulator A input interrupt to be serviced by the system controller. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 575 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 14 Enhanced Capture Timer (ECT16B8CV3) 14.4.3.5 Pulse Accumulator A Overflow Interrupt This active high output will be asserted by the module to request a timer pulse accumulator A overflow interrupt to be serviced by the system controller. 14.4.3.6 Timer Overflow Interrupt This active high output will be asserted by the module to request a timer overflow interrupt to be serviced by the system controller. MC9S12XE-Family Reference Manual Rev. 1.22 576 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-1. Revision History Revision Number V01.03 V01.04 V01.05 Revision Date 28 Jul 2006 17 Nov 2006 14 Aug 2007 Sections Affected 15.3.1.2/15-580 - Revise Table1-5 15.3.1.1/15-579 - Backward compatible for IBAD bit name Description of Changes 15.7.1.7/15-599 - Update flow-chart of interrupt routine for 10-bit address 15.1 Introduction The inter-IC bus (IIC) is a two-wire, bidirectional serial bus that provides a simple, efficient method of data exchange between devices. Being a two-wire device, the IIC bus minimizes the need for large numbers of connections between devices, and eliminates the need for an address decoder. This bus is suitable for applications requiring occasional communications over a short distance between a number of devices. It also provides flexibility, allowing additional devices to be connected to the bus for further expansion and system development. The interface is designed to operate up to 100 kbps with maximum bus loading and timing. The device is capable of operating at higher baud rates, up to a maximum of clock/20, with reduced bus loading. The maximum communication length and the number of devices that can be connected are limited by a maximum bus capacitance of 400 pF. 15.1.1 Features The IIC module has the following key features: * Compatible with I2C bus standard * Multi-master operation * Software programmable for one of 256 different serial clock frequencies * Software selectable acknowledge bit * Interrupt driven byte-by-byte data transfer * Arbitration lost interrupt with automatic mode switching from master to slave * Calling address identification interrupt * Start and stop signal generation/detection * Repeated start signal generation * Acknowledge bit generation/detection * Bus busy detection MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 577 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description * * General Call Address detection Compliant to ten-bit address 15.1.2 Modes of Operation The IIC functions the same in normal, special, and emulation modes. It has two low power modes: wait and stop modes. 15.1.3 Block Diagram The block diagram of the IIC module is shown in Figure 15-1. IIC Start Stop Arbitration Control Registers Interrupt Clock Control bus_clock In/Out Data Shift Register SCL SDA Address Compare Figure 15-1. IIC Block Diagram 15.2 External Signal Description The IICV3 module has two external pins. 15.2.1 IIC_SCL -- Serial Clock Line Pin This is the bidirectional serial clock line (SCL) of the module, compatible to the IIC bus specification. 15.2.2 IIC_SDA -- Serial Data Line Pin This is the bidirectional serial data line (SDA) of the module, compatible to the IIC bus specification. MC9S12XE-Family Reference Manual , Rev. 1.21 578 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers for the IIC module. 15.3.1 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Register Name 0x0000 IBAD 0x0001 IBFD 0x0002 IBCR 0x0003 IBSR 0x0004 IBDR 0x0005 IBCR2 R W R W R W R W R W R W D7 D6 D5 0 Bit 7 ADR7 6 ADR6 5 ADR5 4 ADR4 3 ADR3 2 ADR2 1 ADR1 Bit 0 0 IBC7 IBC6 IBC5 IBC4 IBC3 IBC2 0 IBC1 0 IBC0 IBEN TCF IBIE IAAS MS/SL IBB Tx/Rx TXAK 0 RSTA SRW IBIF IBSWAI RXAK IBAL D4 0 D3 0 D2 D1 D0 GCEN ADTYPE ADR10 ADR9 ADR8 = Unimplemented or Reserved Figure 15-2. IIC Register Summary 15.3.1.1 IIC Address Register (IBAD) Module Base +0x0000 7 6 5 4 3 2 1 0 R ADR7 W Reset 0 0 0 0 0 0 0 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 0 0 = Unimplemented or Reserved Figure 15-3. IIC Bus Address Register (IBAD) Read and write anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 579 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description This register contains the address the IIC bus will respond to when addressed as a slave; note that it is not the address sent on the bus during the address transfer. Table 15-2. IBAD Field Descriptions Field 7:1 ADR[7:1] 0 Reserved Description Slave Address -- Bit 1 to bit 7 contain the specific slave address to be used by the IIC bus module.The default mode of IIC bus is slave mode for an address match on the bus. Reserved -- Bit 0 of the IBAD is reserved for future compatibility. This bit will always read 0. 15.3.1.2 IIC Frequency Divider Register (IBFD) Module Base + 0x0001 7 6 5 4 3 2 1 0 R IBC7 W Reset 0 0 0 0 0 0 0 0 IBC6 IBC5 IBC4 IBC3 IBC2 IBC1 IBC0 = Unimplemented or Reserved Figure 15-4. IIC Bus Frequency Divider Register (IBFD) Read and write anytime Table 15-3. IBFD Field Descriptions Field 7:0 IBC[7:0] Description I Bus Clock Rate 7:0 -- This field is used to prescale the clock for bit rate selection. The bit clock generator is implemented as a prescale divider -- IBC7:6, prescaled shift register -- IBC5:3 select the prescaler divider and IBC2-0 select the shift register tap point. The IBC bits are decoded to give the tap and prescale values as shown in Table 15-4. Table 15-4. I-Bus Tap and Prescale Values IBC2-0 (bin) 000 001 010 011 100 101 110 111 SCL Tap (clocks) 5 6 7 8 9 10 12 15 SDA Tap (clocks) 1 1 2 2 3 3 4 4 MC9S12XE-Family Reference Manual , Rev. 1.21 580 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-5. Prescale Divider Encoding IBC5-3 (bin) 000 001 010 011 100 101 110 111 scl2start (clocks) 2 2 2 6 14 30 62 126 scl2stop (clocks) 7 7 9 9 17 33 65 129 scl2tap (clocks) 4 4 6 6 14 30 62 126 tap2tap (clocks) 1 2 4 8 16 32 64 128 Table 15-6. Multiplier Factor IBC7-6 00 01 10 11 MUL 01 02 04 RESERVED The number of clocks from the falling edge of SCL to the first tap (Tap[1]) is defined by the values shown in the scl2tap column of Table 15-4, all subsequent tap points are separated by 2IBC5-3 as shown in the tap2tap column in Table 15-4. The SCL Tap is used to generated the SCL period and the SDA Tap is used to determine the delay from the falling edge of SCL to SDA changing, the SDA hold time. IBC7-6 defines the multiplier factor MUL. The values of MUL are shown in the Table 15-6. SCL Divider SCL SDA SDA Hold MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 581 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description SDA SCL Hold(start) SCL Hold(stop) SCL START condition STOP condition Figure 15-5. SCL Divider and SDA Hold The equation used to generate the divider values from the IBFD bits is: SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)} The SDA hold delay is equal to the CPU clock period multiplied by the SDA Hold value shown in Table 15-7. The equation used to generate the SDA Hold value from the IBFD bits is: SDA Hold = MUL x {scl2tap + [(SDA_Tap - 1) x tap2tap] + 3} The equation for SCL Hold values to generate the start and stop conditions from the IBFD bits is: SCL Hold(start) = MUL x [scl2start + (SCL_Tap - 1) x tap2tap] SCL Hold(stop) = MUL x [scl2stop + (SCL_Tap - 1) x tap2tap] NOTE A master SCL divider period can be prolonged at higher internal bus frequencies. This happens when the internal bus cycle length becomes equal to a pad delay. The SCL input is used for clock arbitration of multiple masters. Thus after each SCL edge is internally driven an extra bus period is counted before the pad level is attained, allowing the next toggle. This has the effect of extending the SCL Divider values in Table 15-7 for MUL=1 and IBC[7:0] = 0x00 to 0x0F. Table 15-7. IIC Divider and Hold Values (Sheet 1 of 6) IBC[7:0] (hex) SCL Divider (clocks) SDA Hold (clocks) SCL Hold (start) SCL Hold (stop) MUL=1 00 01 02 03 04 05 20 22 24 26 28 30 7 7 8 8 9 9 6 7 8 9 10 11 11 12 13 14 15 16 MC9S12XE-Family Reference Manual , Rev. 1.21 582 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-7. IIC Divider and Hold Values (Sheet 2 of 6) IBC[7:0] (hex) 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F SCL Divider (clocks) 34 40 28 32 36 40 44 48 56 68 48 56 64 72 80 88 104 128 80 96 112 128 144 160 192 240 160 192 224 256 288 320 384 480 320 384 448 512 576 640 768 960 SDA Hold (clocks) 10 10 7 7 9 9 11 11 13 13 9 9 13 13 17 17 21 21 9 9 17 17 25 25 33 33 17 17 33 33 49 49 65 65 33 33 65 65 97 97 129 129 SCL Hold (start) 13 16 10 12 14 16 18 20 24 30 18 22 26 30 34 38 46 58 38 46 54 62 70 78 94 118 78 94 110 126 142 158 190 238 158 190 222 254 286 318 382 478 SCL Hold (stop) 18 21 15 17 19 21 23 25 29 35 25 29 33 37 41 45 53 65 41 49 57 65 73 81 97 121 81 97 113 129 145 161 193 241 161 193 225 257 289 321 385 481 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 583 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-7. IIC Divider and Hold Values (Sheet 3 of 6) IBC[7:0] (hex) 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F SCL Divider (clocks) 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 40 44 48 52 56 60 68 80 56 64 72 80 88 96 112 136 96 112 128 144 160 176 208 256 160 SDA Hold (clocks) 65 65 129 129 193 193 257 257 129 129 257 257 385 385 513 513 14 14 16 16 18 18 20 20 14 14 18 18 22 22 26 26 18 18 26 26 34 34 42 42 18 SCL Hold (start) 318 382 446 510 574 638 766 958 638 766 894 1022 1150 1278 1534 1918 12 14 16 18 20 22 26 32 20 24 28 32 36 40 48 60 36 44 52 60 68 76 92 116 76 SCL Hold (stop) 321 385 449 513 577 641 769 961 641 769 897 1025 1153 1281 1537 1921 22 24 26 28 30 32 36 42 30 34 38 42 46 50 58 70 50 58 66 74 82 90 106 130 82 MUL=2 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 MC9S12XE-Family Reference Manual , Rev. 1.21 584 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-7. IIC Divider and Hold Values (Sheet 4 of 6) IBC[7:0] (hex) 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F SCL Divider (clocks) 192 224 256 288 320 384 480 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 2304 2560 3072 3840 2560 3072 3584 4096 4608 5120 6144 7680 72 80 SDA Hold (clocks) 18 34 34 50 50 66 66 34 34 66 66 98 98 130 130 66 66 130 130 194 194 258 258 130 130 258 258 386 386 514 514 258 258 514 514 770 770 1026 1026 28 28 SCL Hold (start) 92 108 124 140 156 188 236 156 188 220 252 284 316 380 476 316 380 444 508 572 636 764 956 636 764 892 1020 1148 1276 1532 1916 1276 1532 1788 2044 2300 2556 3068 3836 24 28 SCL Hold (stop) 98 114 130 146 162 194 242 162 194 226 258 290 322 386 482 322 386 450 514 578 642 770 962 642 770 898 1026 1154 1282 1538 1922 1282 1538 1794 2050 2306 2562 3074 3842 44 48 MUL=4 80 81 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 585 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-7. IIC Divider and Hold Values (Sheet 5 of 6) IBC[7:0] (hex) 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB SCL Divider (clocks) 88 96 104 112 128 152 112 128 144 160 176 192 224 272 192 224 256 288 320 352 416 512 320 384 448 512 576 640 768 960 640 768 896 1024 1152 1280 1536 1920 1280 1536 1792 2048 SDA Hold (clocks) 32 32 36 36 40 40 28 28 36 36 44 44 52 52 36 36 52 52 68 68 84 84 36 36 68 68 100 100 132 132 68 68 132 132 196 196 260 260 132 132 260 260 SCL Hold (start) 32 36 40 44 52 64 40 48 56 64 72 80 96 120 72 88 104 120 136 152 184 232 152 184 216 248 280 312 376 472 312 376 440 504 568 632 760 952 632 760 888 1016 SCL Hold (stop) 52 56 60 64 72 84 60 68 76 84 92 100 116 140 100 116 132 148 164 180 212 260 164 196 228 260 292 324 388 484 324 388 452 516 580 644 772 964 644 772 900 1028 MC9S12XE-Family Reference Manual , Rev. 1.21 586 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-7. IIC Divider and Hold Values (Sheet 6 of 6) IBC[7:0] (hex) AC AD AE AF B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF SCL Divider (clocks) 2304 2560 3072 3840 2560 3072 3584 4096 4608 5120 6144 7680 5120 6144 7168 8192 9216 10240 12288 15360 SDA Hold (clocks) 388 388 516 516 260 260 516 516 772 772 1028 1028 516 516 1028 1028 1540 1540 2052 2052 SCL Hold (start) 1144 1272 1528 1912 1272 1528 1784 2040 2296 2552 3064 3832 2552 3064 3576 4088 4600 5112 6136 7672 SCL Hold (stop) 1156 1284 1540 1924 1284 1540 1796 2052 2308 2564 3076 3844 2564 3076 3588 4100 4612 5124 6148 7684 15.3.1.3 IIC Control Register (IBCR) Module Base + 0x0002 7 6 5 4 3 2 1 0 R IBEN W Reset 0 0 0 0 0 IBIE MS/SL Tx/Rx TXAK 0 0 IBSWAI RSTA 0 0 0 = Unimplemented or Reserved Figure 15-6. IIC Bus Control Register (IBCR) Read and write anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 587 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-8. IBCR Field Descriptions Field 7 IBEN Description I-Bus Enable -- This bit controls the software reset of the entire IIC bus module. 0 The module is reset and disabled. This is the power-on reset situation. When low the interface is held in reset but registers can be accessed 1 The IIC bus module is enabled.This bit must be set before any other IBCR bits have any effect If the IIC bus module is enabled in the middle of a byte transfer the interface behaves as follows: slave mode ignores the current transfer on the bus and starts operating whenever a subsequent start condition is detected. Master mode will not be aware that the bus is busy, hence if a start cycle is initiated then the current bus cycle may become corrupt. This would ultimately result in either the current bus master or the IIC bus module losing arbitration, after which bus operation would return to normal. I-Bus Interrupt Enable 0 Interrupts from the IIC bus module are disabled. Note that this does not clear any currently pending interrupt condition 1 Interrupts from the IIC bus module are enabled. An IIC bus interrupt occurs provided the IBIF bit in the status register is also set. Master/Slave Mode Select Bit -- Upon reset, this bit is cleared. When this bit is changed from 0 to 1, a START signal is generated on the bus, and the master mode is selected. When this bit is changed from 1 to 0, a STOP signal is generated and the operation mode changes from master to slave.A STOP signal should only be generated if the IBIF flag is set. MS/SL is cleared without generating a STOP signal when the master loses arbitration. 0 Slave Mode 1 Master Mode Transmit/Receive Mode Select Bit -- This bit selects the direction of master and slave transfers. When addressed as a slave this bit should be set by software according to the SRW bit in the status register. In master mode this bit should be set according to the type of transfer required. Therefore, for address cycles, this bit will always be high. 0 Receive 1 Transmit Transmit Acknowledge Enable -- This bit specifies the value driven onto SDA during data acknowledge cycles for both master and slave receivers. The IIC module will always acknowledge address matches, provided it is enabled, regardless of the value of TXAK. Note that values written to this bit are only used when the IIC bus is a receiver, not a transmitter. 0 An acknowledge signal will be sent out to the bus at the 9th clock bit after receiving one byte data 1 No acknowledge signal response is sent (i.e., acknowledge bit = 1) Repeat Start -- Writing a 1 to this bit will generate a repeated START condition on the bus, provided it is the current bus master. This bit will always be read as a low. Attempting a repeated start at the wrong time, if the bus is owned by another master, will result in loss of arbitration. 1 Generate repeat start cycle 6 IBIE 5 MS/SL 4 Tx/Rx 3 TXAK 2 RSTA 1 Reserved -- Bit 1 of the IBCR is reserved for future compatibility. This bit will always read 0. RESERVED 0 IBSWAI I Bus Interface Stop in Wait Mode 0 IIC bus module clock operates normally 1 Halt IIC bus module clock generation in wait mode Wait mode is entered via execution of a CPU WAI instruction. In the event that the IBSWAI bit is set, all clocks internal to the IIC will be stopped and any transmission currently in progress will halt.If the CPU were woken up by a source other than the IIC module, then clocks would restart and the IIC would resume from where was during the previous transmission. It is not possible for the IIC to wake up the CPU when its internal clocks are stopped. MC9S12XE-Family Reference Manual , Rev. 1.21 588 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description If it were the case that the IBSWAI bit was cleared when the WAI instruction was executed, the IIC internal clocks and interface would remain alive, continuing the operation which was currently underway. It is also possible to configure the IIC such that it will wake up the CPU via an interrupt at the conclusion of the current operation. See the discussion on the IBIF and IBIE bits in the IBSR and IBCR, respectively. 15.3.1.4 IIC Status Register (IBSR) Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset TCF IAAS IBB IBAL 0 SRW IBIF RXAK 1 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 15-7. IIC Bus Status Register (IBSR) This status register is read-only with exception of bit 1 (IBIF) and bit 4 (IBAL), which are software clearable. Table 15-9. IBSR Field Descriptions Field 7 TCF Description Data Transferring Bit -- While one byte of data is being transferred, this bit is cleared. It is set by the falling edge of the 9th clock of a byte transfer. Note that this bit is only valid during or immediately following a transfer to the IIC module or from the IIC module. 0 Transfer in progress 1 Transfer complete Addressed as a Slave Bit -- When its own specific address (I-bus address register) is matched with the calling address or it receives the general call address with GCEN== 1,this bit is set.The CPU is interrupted provided the IBIE is set.Then the CPU needs to check the SRW bit and set its Tx/Rx mode accordingly.Writing to the I-bus control register clears this bit. 0 Not addressed 1 Addressed as a slave Bus Busy Bit 0 This bit indicates the status of the bus. When a START signal is detected, the IBB is set. If a STOP signal is detected, IBB is cleared and the bus enters idle state. 1 Bus is busy Arbitration Lost -- The arbitration lost bit (IBAL) is set by hardware when the arbitration procedure is lost. Arbitration is lost in the following circumstances: 1. SDA sampled low when the master drives a high during an address or data transmit cycle. 2. SDA sampled low when the master drives a high during the acknowledge bit of a data receive cycle. 3. A start cycle is attempted when the bus is busy. 4. A repeated start cycle is requested in slave mode. 5. A stop condition is detected when the master did not request it. This bit must be cleared by software, by writing a one to it. A write of 0 has no effect on this bit. 6 IAAS 5 IBB 4 IBAL 3 Reserved -- Bit 3 of IBSR is reserved for future use. A read operation on this bit will return 0. RESERVED MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 589 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description Table 15-9. IBSR Field Descriptions (continued) Field 2 SRW Description Slave Read/Write -- When IAAS is set this bit indicates the value of the R/W command bit of the calling address sent from the master This bit is only valid when the I-bus is in slave mode, a complete address transfer has occurred with an address match and no other transfers have been initiated. Checking this bit, the CPU can select slave transmit/receive mode according to the command of the master. 0 Slave receive, master writing to slave 1 Slave transmit, master reading from slave I-Bus Interrupt -- The IBIF bit is set when one of the following conditions occurs: -- Arbitration lost (IBAL bit set) -- Data transfer complete (TCF bit set) -- Addressed as slave (IAAS bit set) It will cause a processor interrupt request if the IBIE bit is set. This bit must be cleared by software, writing a one to it. A write of 0 has no effect on this bit. Received Acknowledge -- The value of SDA during the acknowledge bit of a bus cycle. If the received acknowledge bit (RXAK) is low, it indicates an acknowledge signal has been received after the completion of 8 bits data transmission on the bus. If RXAK is high, it means no acknowledge signal is detected at the 9th clock. 0 Acknowledge received 1 No acknowledge received 1 IBIF 0 RXAK 15.3.1.5 IIC Data I/O Register (IBDR) Module Base + 0x0004 7 6 5 4 3 2 1 0 R D7 W Reset 0 0 0 0 0 0 0 0 D6 D5 D4 D3 D2 D1 D0 Figure 15-8. IIC Bus Data I/O Register (IBDR) In master transmit mode, when data is written to the IBDR a data transfer is initiated. The most significant bit is sent first. In master receive mode, reading this register initiates next byte data receiving. In slave mode, the same functions are available after an address match has occurred.Note that the Tx/Rx bit in the IBCR must correctly reflect the desired direction of transfer in master and slave modes for the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is desired, then reading the IBDR will not initiate the receive. Reading the IBDR will return the last byte received while the IIC is configured in either master receive or slave receive modes. The IBDR does not reflect every byte that is transmitted on the IIC bus, nor can software verify that a byte has been written to the IBDR correctly by reading it back. In master transmit mode, the first byte of data written to IBDR following assertion of MS/SL is used for the address transfer and should com.prise of the calling address (in position D7:D1) concatenated with the required R/W bit (in position D0). MC9S12XE-Family Reference Manual , Rev. 1.21 590 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.3.1.6 IIC Control Register 2(IBCR2) Module Base + 0x0005 7 6 5 4 3 2 1 0 R GCEN W Reset 0 0 ADTYPE 0 0 0 ADR10 ADR9 0 ADR8 0 0 0 0 0 Figure 15-9. IIC Bus Control Register 2(IBCR2) This register contains the variables used in general call and in ten-bit address. Read and write anytime Table 15-10. IBCR2 Field Descriptions Field 7 GCEN Description General Call Enable. 0 General call is disabled. The module dont receive any general call data and address. 1 enable general call. It indicates that the module can receive address and any data. Address Type-- This bit selects the address length. The variable must be configured correctly before IIC enters slave mode. 0 7-bit address 1 10-bit address 6 ADTYPE 5,4,3 Reserved -- Bit 5,4 and 3 of the IBCR2 are reserved for future compatibility. These bits will always read 0. RESERVED 2:0 ADR[10:8] Slave Address [10:8] --These 3 bits represent the MSB of the 10-bit address when address type is asserted (ADTYPE = 1). 15.4 Functional Description This section provides a complete functional description of the IICV3. 15.4.1 I-Bus Protocol The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices connected to it must have open drain or open collector outputs. Logic AND function is exercised on both lines with external pull-up resistors. The value of these resistors is system dependent. Normally, a standard communication is composed of four parts: START signal, slave address transmission, data transfer and STOP signal. They are described briefly in the following sections and illustrated in Figure 15-10. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 591 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description MSB CL 1 2 3 4 5 6 7 LSB 8 9 MSB 1 2 3 4 5 6 7 LSB 8 9 DA ADR7 ADR6 ADR5 ADR4ADR3 ADR2 ADR1R/W XXX D7 D6 D5 D4 D3 D2 D1 D0 Start Signal Calling Address Read/ Write Ack Bit Data Byte No Ack Bit LSB MSB CL 1 2 3 4 5 6 7 LSB 8 9 MSB 1 2 3 4 5 6 7 8 9 DA ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1R/W XX ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1R/W Start Signal Calling Address Read/ Write Ack Bit Repeated Start Signal New Calling Address Read/ Write No Ack Bit Figure 15-10. IIC-Bus Transmission Signals 15.4.1.1 START Signal When the bus is free, i.e. no master device is engaging the bus (both SCL and SDA lines are at logical high), a master may initiate communication by sending a START signal.As shown in Figure 15-10, a START signal is defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle states. SDA SCL START Condition STOP Condition Figure 15-11. Start and Stop Conditions MC9S12XE-Family Reference Manual , Rev. 1.21 592 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.4.1.2 Slave Address Transmission The first byte of data transfer immediately after the START signal is the slave address transmitted by the master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired direction of data transfer. 1 = Read transfer, the slave transmits data to the master. 0 = Write transfer, the master transmits data to the slave. If the calling address is 10-bit, another byte is followed by the first byte.Only the slave with a calling address that matches the one transmitted by the master will respond by sending back an acknowledge bit. This is done by pulling the SDA low at the 9th clock (see Figure 15-10). No two slaves in the system may have the same address. If the IIC bus is master, it must not transmit an address that is equal to its own slave address. The IIC bus cannot be master and slave at the same time.However, if arbitration is lost during an address cycle the IIC bus will revert to slave mode and operate correctly even if it is being addressed by another master. 15.4.1.3 Data Transfer As soon as successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction specified by the R/W bit sent by the calling master All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address information for the slave device. Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while SCL is high as shown in Figure 15-10. There is one clock pulse on SCL for each data bit, the MSB being transferred first. Each data byte has to be followed by an acknowledge bit, which is signalled from the receiving device by pulling the SDA low at the ninth clock. So one complete data byte transfer needs nine clock pulses. If the slave receiver does not acknowledge the master, the SDA line must be left high by the slave. The master can then generate a stop signal to abort the data transfer or a start signal (repeated start) to commence a new calling. If the master receiver does not acknowledge the slave transmitter after a byte transmission, it means 'end of data' to the slave, so the slave releases the SDA line for the master to generate STOP or START signal.Note in order to release the bus correctly,after no-acknowledge to the master,the slave must be immediately switched to receiver and a following dummy reading of the IBDR is necessary. 15.4.1.4 STOP Signal The master can terminate the communication by generating a STOP signal to free the bus. However, the master may generate a START signal followed by a calling command without generating a STOP signal first. This is called repeated START. A STOP signal is defined as a low-to-high transition of SDA while SCL at logical 1 (see Figure 15-10). The master can generate a STOP even if the slave has generated an acknowledge at which point the slave must release the bus. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 593 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.4.1.5 Repeated START Signal As shown in Figure 15-10, a repeated START signal is a START signal generated without first generating a STOP signal to terminate the communication. This is used by the master to communicate with another slave or with the same slave in different mode (transmit/receive mode) without releasing the bus. 15.4.1.6 Arbitration Procedure The Inter-IC bus is a true multi-master bus that allows more than one master to be connected on it. If two or more masters try to control the bus at the same time, a clock synchronization procedure determines the bus clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest one among the masters. The relative priority of the contending masters is determined by a data arbitration procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case the transition from master to slave mode does not generate a STOP condition. Meanwhile, a status bit is set by hardware to indicate loss of arbitration. 15.4.1.7 Clock Synchronization Because wire-AND logic is performed on SCL line, a high-to-low transition on SCL line affects all the devices connected on the bus. The devices start counting their low period and as soon as a device's clock has gone low, it holds the SCL line low until the clock high state is reached.However, the change of low to high in this device clock may not change the state of the SCL line if another device clock is within its low period. Therefore, synchronized clock SCL is held low by the device with the longest low period. Devices with shorter low periods enter a high wait state during this time (see Figure 15-11). When all devices concerned have counted off their low period, the synchronized clock SCL line is released and pulled high. There is then no difference between the device clocks and the state of the SCL line and all the devices start counting their high periods.The first device to complete its high period pulls the SCL line low again. WAIT SCL1 Start Counting High Period SCL2 SCL Internal Counter Reset Figure 15-12. IIC-Bus Clock Synchronization MC9S12XE-Family Reference Manual , Rev. 1.21 594 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 15.4.1.8 Handshaking The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold the SCL low after completion of one byte transfer (9 bits). In such case, it halts the bus clock and forces the master clock into wait states until the slave releases the SCL line. 15.4.1.9 Clock Stretching The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After the master has driven SCL low the slave can drive SCL low for the required period and then release it.If the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low period is stretched. 15.4.1.10 Ten-bit Address A ten-bit address is indicated if the first 5 bits of the first address byte are 0x11110. The following rules apply to the first address byte. Table 15-11. Definition of Bits in the First Byte SLAVE ADDRESS 0000000 0000010 0000011 11111XX 11110XX R/W BIT 0 x x x x DESCRIPTION General call address Reserved for different bus format Reserved for future purposes Reserved for future purposes 10-bit slave addressing The address type is identified by ADTYPE. When ADTYPE is 0, 7-bit address is applied. Reversely, the address is 10-bit address.Generally, there are two cases of 10-bit address.See the Fig.1-14 and 1-15. S Slave Add1st 7bits 11110+ADR10+ADR9 R/W 0 A1 Slave Add 2nd byte ADR[8:1] A2 Data A3 Figure 15-13. A master-transmitter addresses a slave-receiver with a 10-bit address S Slave Add1st 7bits R/W A1 11110+ADR10+ADR9 0 Slave Add 2nd byte ADR[8:1] A2 Sr Slave Add 1st 7bits 11110+ADR10+ADR9 R/W 1 A3 Data A4 Figure 15-14. A master-receiver addresses a slave-transmitter with a 10-bit address In the figure 1-15,the first two bytes are the similar to figure1-14.After the repeated START(Sr),the first slave address is transmitted again, but the R/W is 1, meaning that the slave is acted as a transmitter. 15.4.1.11 General Call Address To broadcast using a general call, a device must first generate the general call address($00), then after receiving acknowledge, it must transmit data. In communication, as a slave device, provided the GCEN is asserted, a device acknowledges the broadcast and receives data until the GCEN is disabled or the master device releases the bus or generates a new MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 595 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description transfer. In the broadcast, slaves always act as receivers. In general call, IAAS is also used to indicate the address match. In order to distinguish whether the address match is the normal address match or the general call address match, IBDR should be read after the address byte has been received. If the data is $00, the match is general call address match. The meaning of the general call address is always specified in the first data byte and must be dealt with by S/W, the IIC hardware does not decode and process the first data byte. When one byte transfer is done, the received data can be read from IBDR. The user can control the procedure by enabling or disabling GCEN. 15.4.2 Operation in Run Mode This is the basic mode of operation. 15.4.3 Operation in Wait Mode IIC operation in wait mode can be configured. Depending on the state of internal bits, the IIC can operate normally when the CPU is in wait mode or the IIC clock generation can be turned off and the IIC module enters a power conservation state during wait mode. In the later case, any transmission or reception in progress stops at wait mode entry. 15.4.4 Operation in Stop Mode The IIC is inactive in stop mode for reduced power consumption. The STOP instruction does not affect IIC register states. 15.5 Resets The reset state of each individual bit is listed in Section 15.3, "Memory Map and Register Definition," which details the registers and their bit-fields. 15.6 Interrupts Table 15-12. Interrupt Summary Interrupt IIC Interrupt Offset -- Vector -- Priority -- Source Description IICV3 uses only one interrupt vector. IBAL, TCF, IAAS When either of IBAL, TCF or IAAS bits is set bits in IBSR may cause an interrupt based on arbitration register lost, transfer complete or address detect conditions Internally there are three types of interrupts in IIC. The interrupt service routine can determine the interrupt type by reading the status register. IIC Interrupt can be generated on 1. Arbitration lost condition (IBAL bit set) MC9S12XE-Family Reference Manual , Rev. 1.21 596 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description 2. Byte transfer condition (TCF bit set) 3. Address detect condition (IAAS bit set) The IIC interrupt is enabled by the IBIE bit in the IIC control register. It must be cleared by writing 0 to the IBF bit in the interrupt service routine. 15.7 15.7.1 Application Information IIC Programming Examples Initialization Sequence 15.7.1.1 Reset will put the IIC bus control register to its default status. Before the interface can be used to transfer serial data, an initialization procedure must be carried out, as follows: 1. Update the frequency divider register (IBFD) and select the required division ratio to obtain SCL frequency from system clock. 2. Update the ADTYPE of IBCR2 to define the address length, 7 bits or 10 bits. 3. Update the IIC bus address register (IBAD) to define its slave address. If 10-bit address is applied IBCR2 should be updated to define the rest bits of address. 4. Set the IBEN bit of the IIC bus control register (IBCR) to enable the IIC interface system. 5. Modify the bits of the IIC bus control register (IBCR) to select master/slave mode, transmit/receive mode and interrupt enable or not. 6. If supported general call, the GCEN in IBCR2 should be asserted. 15.7.1.2 Generation of START After completion of the initialization procedure, serial data can be transmitted by selecting the 'master transmitter' mode. If the device is connected to a multi-master bus system, the state of the IIC bus busy bit (IBB) must be tested to check whether the serial bus is free. If the bus is free (IBB=0), the start condition and the first byte (the slave address) can be sent. The data written to the data register comprises the slave calling address and the LSB set to indicate the direction of transfer required from the slave. The bus free time (i.e., the time between a STOP condition and the following START condition) is built into the hardware that generates the START cycle. Depending on the relative frequencies of the system clock and the SCL period it may be necessary to wait until the IIC is busy after writing the calling address to the IBDR before proceeding with the following instructions. This is illustrated in the following example. An example of a program which generates the START signal and transmits the first byte of data (slave address) is shown below: CHFLAG TXSTART IBFREE BRSET BSET BRCLR IBSR,#$20,* IBCR,#$30 IBSR,#$20,* ;WAIT FOR IBB FLAG TO CLEAR ;SET TRANSMIT AND MASTER MODE;i.e. GENERATE START CONDITION ;WAIT FOR IBB FLAG TO SET MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 597 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description MOVB IBFREE BRCLR CALLING,IBDR IBSR,#$20,* ;TRANSMIT THE CALLING ADDRESS, D0=R/W ;WAIT FOR IBB FLAG TO SET 15.7.1.3 Post-Transfer Software Response Transmission or reception of a byte will set the data transferring bit (TCF) to 1, which indicates one byte communication is finished. The IIC bus interrupt bit (IBIF) is set also; an interrupt will be generated if the interrupt function is enabled during initialization by setting the IBIE bit. Software must clear the IBIF bit in the interrupt routine first. The TCF bit will be cleared by reading from the IIC bus data I/O register (IBDR) in receive mode or writing to IBDR in transmit mode. Software may service the IIC I/O in the main program by monitoring the IBIF bit if the interrupt function is disabled. Note that polling should monitor the IBIF bit rather than the TCF bit because their operation is different when arbitration is lost. Note that when an interrupt occurs at the end of the address cycle the master will always be in transmit mode, i.e. the address is transmitted. If master receive mode is required, indicated by R/W bit in IBDR, then the Tx/Rx bit should be toggled at this stage. During slave mode address cycles (IAAS=1), the SRW bit in the status register is read to determine the direction of the subsequent transfer and the Tx/Rx bit is programmed accordingly.For slave mode data cycles (IAAS=0) the SRW bit is not valid, the Tx/Rx bit in the control register should be read to determine the direction of the current transfer. The following is an example of a software response by a 'master transmitter' in the interrupt routine. ISR BCLR BRCLR BRCLR BRSET MOVB IBSR,#$02 IBCR,#$20,SLAVE IBCR,#$10,RECEIVE IBSR,#$01,END DATABUF,IBDR ;CLEAR THE IBIF FLAG ;BRANCH IF IN SLAVE MODE ;BRANCH IF IN RECEIVE MODE ;IF NO ACK, END OF TRANSMISSION ;TRANSMIT NEXT BYTE OF DATA TRANSMIT 15.7.1.4 Generation of STOP A data transfer ends with a STOP signal generated by the 'master' device. A master transmitter can simply generate a STOP signal after all the data has been transmitted. The following is an example showing how a stop condition is generated by a master transmitter. MASTX TST BEQ BRSET MOVB DEC BRA BCLR RTI TXCNT END IBSR,#$01,END DATABUF,IBDR TXCNT EMASTX IBCR,#$20 ;GET VALUE FROM THE TRANSMITING COUNTER ;END IF NO MORE DATA ;END IF NO ACK ;TRANSMIT NEXT BYTE OF DATA ;DECREASE THE TXCNT ;EXIT ;GENERATE A STOP CONDITION ;RETURN FROM INTERRUPT END EMASTX If a master receiver wants to terminate a data transfer, it must inform the slave transmitter by not acknowledging the last byte of data which can be done by setting the transmit acknowledge bit (TXAK) MC9S12XE-Family Reference Manual , Rev. 1.21 598 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description before reading the 2nd last byte of data. Before reading the last byte of data, a STOP signal must be generated first. The following is an example showing how a STOP signal is generated by a master receiver. MASR DEC BEQ MOVB DEC BNE BSET BRA BCLR MOVB RTI RXCNT ENMASR RXCNT,D1 D1 NXMAR IBCR,#$08 NXMAR IBCR,#$20 IBDR,RXBUF ;DECREASE THE RXCNT ;LAST BYTE TO BE READ ;CHECK SECOND LAST BYTE ;TO BE READ ;NOT LAST OR SECOND LAST ;SECOND LAST, DISABLE ACK ;TRANSMITTING ;LAST ONE, GENERATE `STOP' SIGNAL ;READ DATA AND STORE LAMAR ENMASR NXMAR 15.7.1.5 Generation of Repeated START At the end of data transfer, if the master continues to want to communicate on the bus, it can generate another START signal followed by another slave address without first generating a STOP signal. A program example is as shown. RESTART BSET MOVB IBCR,#$04 CALLING,IBDR ;ANOTHER START (RESTART) ;TRANSMIT THE CALLING ADDRESS;D0=R/W 15.7.1.6 Slave Mode In the slave interrupt service routine, the module addressed as slave bit (IAAS) should be tested to check if a calling of its own address has just been received. If IAAS is set, software should set the transmit/receive mode select bit (Tx/Rx bit of IBCR) according to the R/W command bit (SRW). Writing to the IBCR clears the IAAS automatically. Note that the only time IAAS is read as set is from the interrupt at the end of the address cycle where an address match occurred, interrupts resulting from subsequent data transfers will have IAAS cleared. A data transfer may now be initiated by writing information to IBDR, for slave transmits, or dummy reading from IBDR, in slave receive mode. The slave will drive SCL low in-between byte transfers, SCL is released when the IBDR is accessed in the required mode. In slave transmitter routine, the received acknowledge bit (RXAK) must be tested before transmitting the next byte of data. Setting RXAK means an 'end of data' signal from the master receiver, after which it must be switched from transmitter mode to receiver mode by software. A dummy read then releases the SCL line so that the master can generate a STOP signal. 15.7.1.7 Arbitration Lost If several masters try to engage the bus simultaneously, only one master wins and the others lose arbitration. The devices which lost arbitration are immediately switched to slave receive mode by the hardware. Their data output to the SDA line is stopped, but SCL continues to be generated until the end of the byte during which arbitration was lost. An interrupt occurs at the falling edge of the ninth clock of this transfer with IBAL=1 and MS/SL=0. If one master attempts to start transmission while the bus is being engaged by another master, the hardware will inhibit the transmission; switch the MS/SL bit from 1 to 0 without generating STOP condition; generate an interrupt to CPU and set the IBAL to indicate that the MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 599 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description attempt to engage the bus is failed. When considering these cases, the slave service routine should test the IBAL first and the software should clear the IBAL bit if it is set. Clear IBIF Y Master Mode ? N TX Tx/Rx ? RX Y Arbitration Lost ? N Last Byte Transmitted ? N Y Clear IBAL RXAK=0 ? Y End Of Addr Cycle (Master Rx) ? N N Last Byte To Be Read ? N Y N IAAS=1 ? N Y Y IAAS=1 ? N Y 10-bit address? Data Transfer TX/RX ? TX ACK From Receiver ? N Read Data From IBDR And Store Dummy Read From IBDR Y Y 2nd Last Byte To Be Read ? N RX 10-bit address transfer N IBDR== 11110xx1? Y Y (Read) 7-bit address transfer SRW=1 ? N (Write) Y Write Next Byte To IBDR Set TXAK =1 Generate Stop Signal Set TX Mode Tx Next Byte Write Data To IBDR set RX Mode set TX Mode Switch To Rx Mode Set RX Mode Switch To Rx Mode Write Data To IBDR Dummy Read From IBDR Generate Stop Signal Read Data From IBDR And Store Dummy Read From IBDR Dummy Read From IBDR RTI Figure 15-15. Flow-Chart of Typical IIC Interrupt Routine MC9S12XE-Family Reference Manual , Rev. 1.21 600 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description CAUTION When IIC is configured as 10-bit address,the point of the data array in interrupt routine must be reset after it's addressed. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 601 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 15 Inter-Integrated Circuit (IICV3) Block Description MC9S12XE-Family Reference Manual , Rev. 1.21 602 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-1. Revision History Revision Number V03.09 V03.10 Revision Date 04 May 2007 19 Aug 2008 Sections Affected 16.3.2.11/16621 Description of Changes - Corrected mnemonics of code example in CANTBSEL register description 16.4.7.4/16-655 - Corrected wake-up description 16.4.4.5/16-649 - Relocated initialization section 16.2/16-606 - Added note to external pin descriptions for use with integrated physical layer - Minor corrections - Orthographic corrections V03.11 31 Mar 2009 16.1 Introduction Freescale's scalable controller area network (S12MSCANV3) definition is based on the MSCAN12 definition, which is the specific implementation of the MSCAN concept targeted for the M68HC12 microcontroller family. The module is a communication controller implementing the CAN 2.0A/B protocol as defined in the Bosch specification dated September 1991. For users to fully understand the MSCAN specification, it is recommended that the Bosch specification be read first to familiarize the reader with the terms and concepts contained within this document. Though not exclusively intended for automotive applications, CAN protocol is designed to meet the specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI environment of a vehicle, cost-effectiveness, and required bandwidth. MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified application software. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 603 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.1.1 Glossary Table 16-2. Terminology ACK CAN CRC EOF FIFO IFS SOF CPU bus CAN bus oscillator clock bus clock CAN clock Acknowledge of CAN message Controller Area Network Cyclic Redundancy Code End of Frame First-In-First-Out Memory Inter-Frame Sequence Start of Frame CPU related read/write data bus CAN protocol related serial bus Direct clock from external oscillator CPU bus related clock CAN protocol related clock 16.1.2 Block Diagram MSCAN Oscillator Clock Bus Clock CANCLK MUX Presc. Tq Clk Receive/ Transmit Engine RXCAN TXCAN Transmit Interrupt Req. Receive Interrupt Req. Errors Interrupt Req. Wake-Up Interrupt Req. Control and Status Message Filtering and Buffering Configuration Registers Wake-Up Low Pass Filter Figure 16-1. MSCAN Block Diagram MC9S12XE-Family Reference Manual , Rev. 1.21 604 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.1.3 Features The basic features of the MSCAN are as follows: * Implementation of the CAN protocol -- Version 2.0A/B -- Standard and extended data frames -- Zero to eight bytes data length -- Programmable bit rate up to 1 Mbps1 -- Support for remote frames * Five receive buffers with FIFO storage scheme * Three transmit buffers with internal prioritization using a "local priority" concept * Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four 16-bit filters, or eight 8-bit filters * Programmable wake-up functionality with integrated low-pass filter * Programmable loopback mode supports self-test operation * Programmable listen-only mode for monitoring of CAN bus * Programmable bus-off recovery functionality * Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states (warning, error passive, bus-off) * Programmable MSCAN clock source either bus clock or oscillator clock * Internal timer for time-stamping of received and transmitted messages * Three low-power modes: sleep, power down, and MSCAN enable * Global initialization of configuration registers 16.1.4 Modes of Operation For a description of the specific MSCAN modes and the module operation related to the system operating modes refer to Section 16.4.4, "Modes of Operation". 1. Depending on the actual bit timing and the clock jitter of the PLL. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 605 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.2 External Signal Description NOTE On MCUs with an integrated CAN physical interface (transceiver) the MSCAN interface is connected internally to the transceiver interface. In these cases the external availability of signals TXCAN and RXCAN is optional. The MSCAN uses two external pins. 16.2.1 RXCAN -- CAN Receiver Input Pin RXCAN is the MSCAN receiver input pin. 16.2.2 TXCAN -- CAN Transmitter Output Pin TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the CAN bus: 0 = Dominant state 1 = Recessive state 16.2.3 CAN System A typical CAN system with MSCAN is shown in Figure 16-2. Each CAN station is connected physically to the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current needed for the CAN bus and has current protection against defective CAN or defective stations. CAN node 1 MCU CAN Controller (MSCAN) CAN node 2 CAN node n TXCAN Transceiver RXCAN CANH CANL CAN Bus Figure 16-2. CAN System MC9S12XE-Family Reference Manual , Rev. 1.21 606 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in the MSCAN. 16.3.1 Module Memory Map Figure 16-3 gives an overview on all registers and their individual bits in the MSCAN memory map. The register address results from the addition of base address and address offset. The base address is determined at the MCU level and can be found in the MCU memory map description. The address offset is defined at the module level. The MSCAN occupies 64 bytes in the memory space. The base address of the MSCAN module is determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the first address of the module address offset. The detailed register descriptions follow in the order they appear in the register map. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 607 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Register Name 0x0000 CANCTL0 0x0001 CANCTL1 0x0002 CANBTR0 0x0003 CANBTR1 0x0004 CANRFLG 0x0005 CANRIER 0x0006 CANTFLG 0x0007 CANTIER 0x0008 CANTARQ 0x0009 CANTAAK 0x000A CANTBSEL 0x000B CANIDAC 0x000C Reserved 0x000D CANMISC 0x000E CANRXERR R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 6 RXACT 5 4 SYNCH 3 2 1 Bit 0 RXFRM CSWAI TIME WUPE SLPRQ SLPAK INITRQ INITAK CANE CLKSRC LOOPB LISTEN BORM WUPM SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 SAMP TSEG22 TSEG21 RSTAT1 TSEG20 RSTAT0 TSEG13 TSTAT1 TSEG12 TSTAT0 TSEG11 TSEG10 WUPIF CSCIF OVRIF RXF WUPIE 0 CSCIE 0 RSTATE1 0 RSTATE0 0 TSTATE1 0 TSTATE0 OVRIE RXFIE TXE2 TXE1 TXE0 0 0 0 0 0 TXEIE2 TXEIE1 TXEIE0 0 0 0 0 0 ABTRQ2 ABTAK2 ABTRQ1 ABTAK1 ABTRQ0 ABTAK0 0 0 0 0 0 0 0 0 0 0 TX2 IDHIT2 TX1 IDHIT1 TX0 IDHIT0 0 0 IDAM1 0 IDAM0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 BOHOLD RXERR0 RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 = Unimplemented or Reserved Figure 16-3. MSCAN Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 608 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Register Name 0x000F CANTXERR 0x0010-0x0013 CANIDAR0-3 0x0014-0x0017 CANIDMRx 0x0018-0x001B CANIDAR4-7 0x001C-0x001F CANIDMR4-7 0x0020-0x002F CANRXFG 0x0030-0x003F CANTXFG R W R W R W R W R W R W R W Bit 7 TXERR7 6 TXERR6 5 TXERR5 4 TXERR4 3 TXERR3 2 TXERR2 1 TXERR1 Bit 0 TXERR0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0 AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0 See Section 16.3.3, "Programmer's Model of Message Storage" See Section 16.3.3, "Programmer's Model of Message Storage" = Unimplemented or Reserved Figure 16-3. MSCAN Register Summary (continued) 16.3.2 Register Descriptions This section describes in detail all the registers and register bits in the MSCAN module. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. All bits of all registers in this module are completely synchronous to internal clocks during a register read. 16.3.2.1 MSCAN Control Register 0 (CANCTL0) The CANCTL0 register provides various control bits of the MSCAN module as described below. Module Base + 0x0000 7 6 5 4 3 2 Access: User read/write(1) 1 0 R RXFRM W Reset: 0 RXACT CSWAI 0 = Unimplemented 0 SYNCH TIME 0 0 WUPE 0 SLPRQ 0 INITRQ 1 Figure 16-4. MSCAN Control Register 0 (CANCTL0) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 609 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 1. Read: Anytime Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM (which is set by the module only), and INITRQ (which is also writable in initialization mode) NOTE The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable again as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0). Table 16-3. CANCTL0 Register Field Descriptions Field 7 RXFRM(1) Description Received Frame Flag -- This bit is read and clear only. It is set when a receiver has received a valid message correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset. Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode. 0 No valid message was received since last clearing this flag 1 A valid message was received since last clearing of this flag Receiver Active Status -- This read-only flag indicates the MSCAN is receiving a message. The flag is controlled by the receiver front end. This bit is not valid in loopback mode. 0 MSCAN is transmitting or idle2 1 MSCAN is receiving a message (including when arbitration is lost)(2) CAN Stops in Wait Mode -- Enabling this bit allows for lower power consumption in wait mode by disabling all the clocks at the CPU bus interface to the MSCAN module. 0 The module is not affected during wait mode 1 The module ceases to be clocked during wait mode Synchronized Status -- This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and able to participate in the communication process. It is set and cleared by the MSCAN. 0 MSCAN is not synchronized to the CAN bus 1 MSCAN is synchronized to the CAN bus Timer Enable -- This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate. If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the active TX/RX buffer. Right after the EOF of a valid message on the CAN bus, the time stamp is written to the highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 16.3.3, "Programmer's Model of Message Storage"). The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization mode. 0 Disable internal MSCAN timer 1 Enable internal MSCAN timer Wake-Up Enable -- This configuration bit allows the MSCAN to restart from sleep mode or from power down mode (entered from sleep) when traffic on CAN is detected (see Section 16.4.5.5, "MSCAN Sleep Mode"). This bit must be configured before sleep mode entry for the selected function to take effect. 0 Wake-up disabled -- The MSCAN ignores traffic on CAN 1 Wake-up enabled -- The MSCAN is able to restart 6 RXACT 5 CSWAI(3) 4 SYNCH 3 TIME 2 WUPE(4) MC9S12XE-Family Reference Manual , Rev. 1.21 610 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-3. CANCTL0 Register Field Descriptions (continued) Field 1 SLPRQ(5) Description Sleep Mode Request -- This bit requests the MSCAN to enter sleep mode, which is an internal power saving mode (see Section 16.4.5.5, "MSCAN Sleep Mode"). The sleep mode request is serviced when the CAN bus is idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry to sleep mode by setting SLPAK = 1 (see Section 16.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). SLPRQ cannot be set while the WUPIF flag is set (see Section 16.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). Sleep mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN detects activity on the CAN bus and clears SLPRQ itself. 0 Running -- The MSCAN functions normally 1 Sleep mode request -- The MSCAN enters sleep mode when CAN bus idle 0 Initialization Mode Request -- When this bit is set by the CPU, the MSCAN skips to initialization mode (see INITRQ(6),(7) Section 16.4.4.5, "MSCAN Initialization Mode"). Any ongoing transmission or reception is aborted and synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1 (Section 16.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). The following registers enter their hard reset state and restore their default values: CANCTL0(8), CANRFLG(9), CANRIER(10), CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL. The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the error counters are not affected by initialization mode. When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits. Writing to other bits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after initialization mode is exited, which is INITRQ = 0 and INITAK = 0. 0 Normal operation 1 MSCAN in initialization mode 1. The MSCAN must be in normal mode for this bit to become set. 2. See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states. 3. In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the CPU enters wait (CSWAI = 1) or stop mode (see Section 16.4.5.2, "Operation in Wait Mode" and Section 16.4.5.3, "Operation in Stop Mode"). 4. The CPU has to make sure that the WUPE register and the WUPIE wake-up interrupt enable register (see Section 16.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required. 5. The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1). 6. The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1). 7. In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before requesting initialization mode. 8. Not including WUPE, INITRQ, and SLPRQ. 9. TSTAT1 and TSTAT0 are not affected by initialization mode. 10. RSTAT1 and RSTAT0 are not affected by initialization mode. 16.3.2.2 MSCAN Control Register 1 (CANCTL1) The CANCTL1 register provides various control bits and handshake status information of the MSCAN module as described below. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 611 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x0001 7 6 5 4 3 2 Access: User read/write(1) 1 0 R CANE W Reset: 0 0 = Unimplemented 0 1 0 0 CLKSRC LOOPB LISTEN BORM WUPM SLPAK INITAK 0 1 Figure 16-5. MSCAN Control Register 1 (CANCTL1) 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1); CANE is write once Table 16-4. CANCTL1 Register Field Descriptions Field 7 CANE 6 CLKSRC MSCAN Enable 0 MSCAN module is disabled 1 MSCAN module is enabled MSCAN Clock Source -- This bit defines the clock source for the MSCAN module (only for systems with a clock generation module; Section 16.4.3.2, "Clock System," and Section Figure 16-43., "MSCAN Clocking Scheme,"). 0 MSCAN clock source is the oscillator clock 1 MSCAN clock source is the bus clock Loopback Self Test Mode -- When this bit is set, the MSCAN performs an internal loopback which can be used for self test operation. The bit stream output of the transmitter is fed back to the receiver internally. The RXCAN input is ignored and the TXCAN output goes to the recessive state (logic 1). The MSCAN behaves as it does normally when transmitting and treats its own transmitted message as a message received from a remote node. In this state, the MSCAN ignores the bit sent during the ACK slot in the CAN frame acknowledge field to ensure proper reception of its own message. Both transmit and receive interrupts are generated. 0 Loopback self test disabled 1 Loopback self test enabled Listen Only Mode -- This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN messages with matching ID are received, but no acknowledgement or error frames are sent out (see Section 16.4.4.4, "Listen-Only Mode"). In addition, the error counters are frozen. Listen only mode supports applications which require "hot plugging" or throughput analysis. The MSCAN is unable to transmit any messages when listen only mode is active. 0 Normal operation 1 Listen only mode activated Bus-Off Recovery Mode -- This bit configures the bus-off state recovery mode of the MSCAN. Refer to Section 16.5.2, "Bus-Off Recovery," for details. 0 Automatic bus-off recovery (see Bosch CAN 2.0A/B protocol specification) 1 Bus-off recovery upon user request Wake-Up Mode -- If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is applied to protect the MSCAN from spurious wake-up (see Section 16.4.5.5, "MSCAN Sleep Mode"). 0 MSCAN wakes up on any dominant level on the CAN bus 1 MSCAN wakes up only in case of a dominant pulse on the CAN bus that has a length of Twup Description 5 LOOPB 4 LISTEN 3 BORM 2 WUPM MC9S12XE-Family Reference Manual , Rev. 1.21 612 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-4. CANCTL1 Register Field Descriptions (continued) Field 1 SLPAK Description Sleep Mode Acknowledge -- This flag indicates whether the MSCAN module has entered sleep mode (see Section 16.4.5.5, "MSCAN Sleep Mode"). It is used as a handshake flag for the SLPRQ sleep mode request. Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will clear the flag if it detects activity on the CAN bus while in sleep mode. 0 Running -- The MSCAN operates normally 1 Sleep mode active -- The MSCAN has entered sleep mode Initialization Mode Acknowledge -- This flag indicates whether the MSCAN module is in initialization mode (see Section 16.4.4.5, "MSCAN Initialization Mode"). It is used as a handshake flag for the INITRQ initialization mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-CANIDAR7, and CANIDMR0-CANIDMR7 can be written only by the CPU when the MSCAN is in initialization mode. 0 Running -- The MSCAN operates normally 1 Initialization mode active -- The MSCAN has entered initialization mode 0 INITAK 16.3.2.3 MSCAN Bus Timing Register 0 (CANBTR0) The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module. Module Base + 0x0002 7 6 5 4 3 2 Access: User read/write(1) 1 0 R SJW1 W Reset: 0 0 0 0 0 0 0 0 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 Figure 16-6. MSCAN Bus Timing Register 0 (CANBTR0) 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 16-5. CANBTR0 Register Field Descriptions Field 7-6 SJW[1:0] 5-0 BRP[5:0] Description Synchronization Jump Width -- The synchronization jump width defines the maximum number of time quanta (Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the CAN bus (see Table 16-6). Baud Rate Prescaler -- These bits determine the time quanta (Tq) clock which is used to build up the bit timing (see Table 16-7). Table 16-6. Synchronization Jump Width SJW1 0 0 1 1 SJW0 0 1 0 1 Synchronization Jump Width 1 Tq clock cycle 2 Tq clock cycles 3 Tq clock cycles 4 Tq clock cycles MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 613 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-7. Baud Rate Prescaler BRP5 0 0 0 0 : 1 BRP4 0 0 0 0 : 1 BRP3 0 0 0 0 : 1 BRP2 0 0 0 0 : 1 BRP1 0 0 1 1 : 1 BRP0 0 1 0 1 : 1 Prescaler value (P) 1 2 3 4 : 64 16.3.2.4 MSCAN Bus Timing Register 1 (CANBTR1) The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module. Module Base + 0x0003 7 6 5 4 3 2 Access: User read/write(1) 1 0 R SAMP W Reset: 0 0 0 0 0 0 0 0 TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10 Figure 16-7. MSCAN Bus Timing Register 1 (CANBTR1) 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 16-8. CANBTR1 Register Field Descriptions Field 7 SAMP Description Sampling -- This bit determines the number of CAN bus samples taken per bit time. 0 One sample per bit. 1 Three samples per bit(1). If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit rates, it is recommended that only one sample is taken per bit time (SAMP = 0). 6-4 Time Segment 2 -- Time segments within the bit time fix the number of clock cycles per bit time and the location TSEG2[2:0] of the sample point (see Figure 16-44). Time segment 2 (TSEG2) values are programmable as shown in Table 16-9. 3-0 Time Segment 1 -- Time segments within the bit time fix the number of clock cycles per bit time and the location TSEG1[3:0] of the sample point (see Figure 16-44). Time segment 1 (TSEG1) values are programmable as shown in Table 16-10. 1. In this case, PHASE_SEG1 must be at least 2 time quanta (Tq). MC9S12XE-Family Reference Manual , Rev. 1.21 614 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-9. Time Segment 2 Values TSEG22 0 0 : 1 TSEG21 0 0 : 1 TSEG20 0 1 : 0 Time Segment 2 1 Tq clock cycle(1) 2 Tq clock cycles : 7 Tq clock cycles 1 1 1 8 Tq clock cycles 1. This setting is not valid. Please refer to Table 16-37 for valid settings. Table 16-10. Time Segment 1 Values TSEG13 0 0 0 0 : 1 TSEG12 0 0 0 0 : 1 TSEG11 0 0 1 1 : 1 TSEG10 0 1 0 1 : 0 Time segment 1 1 Tq clock cycle(1) 2 Tq clock cycles1 3 Tq clock cycles1 4 Tq clock cycles : 15 Tq clock cycles 1 1 1 1 16 Tq clock cycles 1. This setting is not valid. Please refer to Table 16-37 for valid settings. The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time quanta (Tq) clock cycles per bit (as shown in Table 16-9 and Table 16-10). Eqn. 16-1 ( Prescaler value ) Bit Time = ----------------------------------------------------- * ( 1 + TimeSegment1 + TimeSegment2 ) f CANCLK 16.3.2.5 MSCAN Receiver Flag Register (CANRFLG) A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the CANRIER register. Module Base + 0x0004 7 6 5 4 3 2 Access: User read/write(1) 1 0 R WUPIF W Reset: 0 0 CSCIF RSTAT1 RSTAT0 TSTAT1 TSTAT0 OVRIF RXF 0 0 0 0 0 0 = Unimplemented Figure 16-8. MSCAN Receiver Flag Register (CANRFLG) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 615 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 1. Read: Anytime Write: Anytime when not in initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are read-only; write of 1 clears flag; write of 0 is ignored NOTE The CANRFLG register is held in the reset state1 when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable again as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0). Table 16-11. CANRFLG Register Field Descriptions Field 7 WUPIF Description Wake-Up Interrupt Flag -- If the MSCAN detects CAN bus activity while in sleep mode (see Section 16.4.5.5, "MSCAN Sleep Mode,") and WUPE = 1 in CANTCTL0 (see Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)"), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set. 0 No wake-up activity observed while in sleep mode 1 MSCAN detected activity on the CAN bus and requested wake-up CAN Status Change Interrupt Flag -- This flag is set when the MSCAN changes its current CAN bus status due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional 4bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the system on the actual CAN bus status (see Section 16.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)"). If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking interrupt. That guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no CAN status change interrupt is pending. If the TECs/RECs change their current value after the CSCIF is asserted, which would cause an additional state change in the RSTAT/TSTAT bits, these bits keep their status until the current CSCIF interrupt is cleared again. 0 No change in CAN bus status occurred since last interrupt 1 MSCAN changed current CAN bus status Receiver Status Bits -- The values of the error counters control the actual CAN bus status of the MSCAN. As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is: 00 RxOK: 0 receive error counter 96 01 RxWRN: 96 < receive error counter 127 10 RxERR: 127 < receive error counter 11 Bus-off(1): transmit error counter > 255 Transmitter Status Bits -- The values of the error counters control the actual CAN bus status of the MSCAN. As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is: 00 TxOK: 0 transmit error counter 96 01 TxWRN: 96 < transmit error counter 127 10 TxERR: 127 < transmit error counter 255 11 Bus-Off: transmit error counter > 255 6 CSCIF 5-4 RSTAT[1:0] 3-2 TSTAT[1:0] 1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode. MC9S12XE-Family Reference Manual , Rev. 1.21 616 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-11. CANRFLG Register Field Descriptions (continued) Field 1 OVRIF Description Overrun Interrupt Flag -- This flag is set when a data overrun condition occurs. If not masked, an error interrupt is pending while this flag is set. 0 No data overrun condition 1 A data overrun detected Receive Buffer Full Flag -- RXF is set by the MSCAN when a new message is shifted in the receiver FIFO. This flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier, matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt is pending while this flag is set. 0 No new message available within the RxFG 1 The receiver FIFO is not empty. A new message is available in the RxFG 1. Redundant Information for the most critical CAN bus status which is "bus-off". This only occurs if the Tx error counter exceeds a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state skips to RxOK too. Refer also to TSTAT[1:0] coding in this register. 2. To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs, reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition. 0 RXF(2) 16.3.2.6 MSCAN Receiver Interrupt Enable Register (CANRIER) Access: User read/write(1) 6 5 4 3 2 1 0 This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register. Module Base + 0x0005 7 R WUPIE W Reset: 0 0 0 0 0 0 0 0 CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE Figure 16-9. MSCAN Receiver Interrupt Enable Register (CANRIER) 1. Read: Anytime Write: Anytime when not in initialization mode NOTE The CANRIER register is held in the reset state when the initialization mode is active (INITRQ=1 and INITAK=1). This register is writable when not in initialization mode (INITRQ=0 and INITAK=0). The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 617 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-12. CANRIER Register Field Descriptions Field 7 WUPIE(1) 6 CSCIE Description Wake-Up Interrupt Enable 0 No interrupt request is generated from this event. 1 A wake-up event causes a Wake-Up interrupt request. CAN Status Change Interrupt Enable 0 No interrupt request is generated from this event. 1 A CAN Status Change event causes an error interrupt request. 5-4 Receiver Status Change Enable -- These RSTAT enable bits control the sensitivity level in which receiver state RSTATE[1:0] changes are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to indicate the actual receiver state and are only updated if no CSCIF interrupt is pending. 00 Do not generate any CSCIF interrupt caused by receiver state changes. 01 Generate CSCIF interrupt only if the receiver enters or leaves "bus-off" state. Discard other receiver state changes for generating CSCIF interrupt. 10 Generate CSCIF interrupt only if the receiver enters or leaves "RxErr" or "bus-off"(2) state. Discard other receiver state changes for generating CSCIF interrupt. 11 Generate CSCIF interrupt on all state changes. 3-2 Transmitter Status Change Enable -- These TSTAT enable bits control the sensitivity level in which transmitter TSTATE[1:0] state changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending. 00 Do not generate any CSCIF interrupt caused by transmitter state changes. 01 Generate CSCIF interrupt only if the transmitter enters or leaves "bus-off" state. Discard other transmitter state changes for generating CSCIF interrupt. 10 Generate CSCIF interrupt only if the transmitter enters or leaves "TxErr" or "bus-off" state. Discard other transmitter state changes for generating CSCIF interrupt. 11 Generate CSCIF interrupt on all state changes. 1 OVRIE 0 RXFIE Overrun Interrupt Enable 0 No interrupt request is generated from this event. 1 An overrun event causes an error interrupt request. Receiver Full Interrupt Enable 0 No interrupt request is generated from this event. 1 A receive buffer full (successful message reception) event causes a receiver interrupt request. 1. WUPIE and WUPE (see Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)") must both be enabled if the recovery mechanism from stop or wait is required. 2. Bus-off state is only defined for transmitters by the CAN standard (see Bosch CAN 2.0A/B protocol specification). Because the only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK, the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 16.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). 16.3.2.7 MSCAN Transmitter Flag Register (CANTFLG) The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register. MC9S12XE-Family Reference Manual , Rev. 1.21 618 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x0006 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 TXE2 TXE1 1 TXE0 1 0 0 0 0 0 1 = Unimplemented Figure 16-10. MSCAN Transmitter Flag Register (CANTFLG) 1. Read: Anytime Write: Anytime when not in initialization mode; write of 1 clears flag, write of 0 is ignored NOTE The CANTFLG register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 16-13. CANTFLG Register Field Descriptions Field 2-0 TXE[2:0] Description Transmitter Buffer Empty -- This flag indicates that the associated transmit message buffer is empty, and thus not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by the MSCAN when the transmission request is successfully aborted due to a pending abort request (see Section 16.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)"). If not masked, a transmit interrupt is pending while this flag is set. Clearing a TXEx flag also clears the corresponding ABTAKx (see Section 16.3.2.10, "MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)"). When a TXEx flag is set, the corresponding ABTRQx bit is cleared (see Section 16.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)"). When listen-mode is active (see Section 16.3.2.2, "MSCAN Control Register 1 (CANCTL1)") the TXEx flags cannot be cleared and no transmission is started. Read and write accesses to the transmit buffer will be blocked, if the corresponding TXEx bit is cleared (TXEx = 0) and the buffer is scheduled for transmission. 0 The associated message buffer is full (loaded with a message due for transmission) 1 The associated message buffer is empty (not scheduled) 16.3.2.8 MSCAN Transmitter Interrupt Enable Register (CANTIER) This register contains the interrupt enable bits for the transmit buffer empty interrupt flags. Module Base + 0x0007 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 TXEIE2 TXEIE1 0 TXEIE0 0 0 0 0 0 0 0 = Unimplemented Figure 16-11. MSCAN Transmitter Interrupt Enable Register (CANTIER) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 619 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 1. Read: Anytime Write: Anytime when not in initialization mode NOTE The CANTIER register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 16-14. CANTIER Register Field Descriptions Field 2-0 TXEIE[2:0] Description Transmitter Empty Interrupt Enable 0 No interrupt request is generated from this event. 1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt request. 16.3.2.9 MSCAN Transmitter Message Abort Request Register (CANTARQ) The CANTARQ register allows abort request of queued messages as described below. Module Base + 0x0008 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 ABTRQ2 ABTRQ1 0 ABTRQ0 0 0 0 0 0 0 0 = Unimplemented Figure 16-12. MSCAN Transmitter Message Abort Request Register (CANTARQ) 1. Read: Anytime Write: Anytime when not in initialization mode NOTE The CANTARQ register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 16-15. CANTARQ Register Field Descriptions Field Description 2-0 Abort Request -- The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be ABTRQ[2:0] aborted. The MSCAN grants the request if the message has not already started transmission, or if the transmission is not successful (lost arbitration or error). When a message is aborted, the associated TXE (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and abort acknowledge flags (ABTAK, see Section 16.3.2.10, "MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)") are set and a transmit interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated TXE flag is set. 0 No abort request 1 Abort request pending MC9S12XE-Family Reference Manual , Rev. 1.21 620 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3.2.10 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK) The CANTAAK register indicates the successful abort of a queued message, if requested by the appropriate bits in the CANTARQ register. Module Base + 0x0009 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 ABTAK2 ABTAK1 ABTAK0 0 0 0 0 0 0 0 0 = Unimplemented Figure 16-13. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK) 1. Read: Anytime Write: Unimplemented NOTE The CANTAAK register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK = 1). Table 16-16. CANTAAK Register Field Descriptions Field Description 2-0 Abort Acknowledge -- This flag acknowledges that a message was aborted due to a pending abort request ABTAK[2:0] from the CPU. After a particular message buffer is flagged empty, this flag can be used by the application software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx flag is cleared whenever the corresponding TXE flag is cleared. 0 The message was not aborted. 1 The message was aborted. 16.3.2.11 MSCAN Transmit Buffer Selection Register (CANTBSEL) The CANTBSEL register allows the selection of the actual transmit message buffer, which then will be accessible in the CANTXFG register space. Module Base + 0x000A 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 TX2 TX1 0 TX0 0 0 0 0 0 0 0 = Unimplemented Figure 16-14. MSCAN Transmit Buffer Selection Register (CANTBSEL) 1. Read: Find the lowest ordered bit set to 1, all other bits will be read as 0 Write: Anytime when not in initialization mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 621 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) NOTE The CANTBSEL register is held in the reset state when the initialization mode is active (INITRQ = 1 and INITAK=1). This register is writable when not in initialization mode (INITRQ = 0 and INITAK = 0). Table 16-17. CANTBSEL Register Field Descriptions Field 2-0 TX[2:0] Description Transmit Buffer Select -- The lowest numbered bit places the respective transmit buffer in the CANTXFG register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx bit is cleared and the buffer is scheduled for transmission (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)"). 0 The associated message buffer is deselected 1 The associated message buffer is selected, if lowest numbered bit The following gives a short programming example of the usage of the CANTBSEL register: To get the next available transmit buffer, application software must read the CANTFLG register and write this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1. Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered bit position set to 1 is presented. This mechanism eases the application software's selection of the next available Tx buffer. * LDAA CANTFLG; value read is 0b0000_0110 * STAA CANTBSEL; value written is 0b0000_0110 * LDAA CANTBSEL; value read is 0b0000_0010 If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG registers. 16.3.2.12 MSCAN Identifier Acceptance Control Register (CANIDAC) The CANIDAC register is used for identifier acceptance control as described below. Module Base + 0x000B 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 IDAM1 IDAM0 0 0 IDHIT2 IDHIT1 IDHIT0 0 0 0 0 0 0 0 = Unimplemented Figure 16-15. MSCAN Identifier Acceptance Control Register (CANIDAC) 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are read-only MC9S12XE-Family Reference Manual , Rev. 1.21 622 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-18. CANIDAC Register Field Descriptions Field 5-4 IDAM[1:0] 2-0 IDHIT[2:0] Description Identifier Acceptance Mode -- The CPU sets these flags to define the identifier acceptance filter organization (see Section 16.4.3, "Identifier Acceptance Filter"). Table 16-19 summarizes the different settings. In filter closed mode, no message is accepted such that the foreground buffer is never reloaded. Identifier Acceptance Hit Indicator -- The MSCAN sets these flags to indicate an identifier acceptance hit (see Section 16.4.3, "Identifier Acceptance Filter"). Table 16-20 summarizes the different settings. Table 16-19. Identifier Acceptance Mode Settings IDAM1 0 0 1 1 IDAM0 0 1 0 1 Identifier Acceptance Mode Two 32-bit acceptance filters Four 16-bit acceptance filters Eight 8-bit acceptance filters Filter closed Table 16-20. Identifier Acceptance Hit Indication IDHIT2 0 0 0 0 1 1 1 1 IDHIT1 0 0 1 1 0 0 1 1 IDHIT0 0 1 0 1 0 1 0 1 Identifier Acceptance Hit Filter 0 hit Filter 1 hit Filter 2 hit Filter 3 hit Filter 4 hit Filter 5 hit Filter 6 hit Filter 7 hit The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well. 16.3.2.13 MSCAN Reserved Register This register is reserved for factory testing of the MSCAN module and is not available in normal system operating modes. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 623 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x000C to Module Base + 0x000D 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented Figure 16-16. MSCAN Reserved Register 1. Read: Always reads zero in normal system operation modes Write: Unimplemented in normal system operation modes NOTE Writing to this register when in special system operating modes can alter the MSCAN functionality. 16.3.2.14 MSCAN Miscellaneous Register (CANMISC) This register provides additional features. Module Base + 0x000D 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: 0 0 0 0 0 0 0 BOHOLD 0 0 0 0 0 0 0 0 = Unimplemented Figure 16-17. MSCAN Miscellaneous Register (CANMISC) 1. Read: Anytime Write: Anytime; write of `1' clears flag; write of `0' ignored Table 16-21. CANMISC Register Field Descriptions Field 0 BOHOLD Description Bus-off State Hold Until User Request -- If BORM is set in MSCAN Control Register 1 (CANCTL1), this bit indicates whether the module has entered the bus-off state. Clearing this bit requests the recovery from bus-off. Refer to Section 16.5.2, "Bus-Off Recovery," for details. 0 Module is not bus-off or recovery has been requested by user in bus-off state 1 Module is bus-off and holds this state until user request 16.3.2.15 MSCAN Receive Error Counter (CANRXERR) This register reflects the status of the MSCAN receive error counter. MC9S12XE-Family Reference Manual , Rev. 1.21 624 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x000E 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0 0 0 0 0 0 0 0 0 = Unimplemented Figure 16-18. MSCAN Receive Error Counter (CANRXERR) 1. Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1) Write: Unimplemented NOTE Reading this register when in any other mode other than sleep or initialization mode may return an incorrect value. For MCUs with dual CPUs, this may result in a CPU fault condition. Writing to this register when in special modes can alter the MSCAN functionality. 16.3.2.16 MSCAN Transmit Error Counter (CANTXERR) This register reflects the status of the MSCAN transmit error counter. Module Base + 0x000F 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0 0 0 0 0 0 0 0 0 = Unimplemented Figure 16-19. MSCAN Transmit Error Counter (CANTXERR) 1. Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1) Write: Unimplemented NOTE Reading this register when in any other mode other than sleep or initialization mode, may return an incorrect value. For MCUs with dual CPUs, this may result in a CPU fault condition. Writing to this register when in special modes can alter the MSCAN functionality. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 625 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3.2.17 MSCAN Identifier Acceptance Registers (CANIDAR0-7) On reception, each message is written into the background receive buffer. The CPU is only signalled to read the message if it passes the criteria in the identifier acceptance and identifier mask registers (accepted); otherwise, the message is overwritten by the next message (dropped). The acceptance registers of the MSCAN are applied on the IDR0-IDR3 registers (see Section 16.3.3.1, "Identifier Registers (IDR0-IDR3)") of incoming messages in a bit by bit manner (see Section 16.4.3, "Identifier Acceptance Filter"). For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only the first two (CANIDAR0/1, CANIDMR0/1) are applied. Module Base + 0x0010 to Module Base + 0x0013 7 6 5 4 3 2 Access: User read/write(1) 1 0 R AC7 W Reset 0 0 0 0 0 0 0 0 AC6 AC5 AC4 AC3 AC2 AC1 AC0 Figure 16-20. MSCAN Identifier Acceptance Registers (First Bank) -- CANIDAR0-CANIDAR3 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 16-22. CANIDAR0-CANIDAR3 Register Field Descriptions Field 7-0 AC[7:0] Description Acceptance Code Bits -- AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison is then masked with the corresponding identifier mask register. Module Base + 0x0018 to Module Base + 0x001B 7 6 5 4 3 2 Access: User read/write(1) 1 0 R AC7 W Reset 0 0 0 0 0 0 0 0 AC6 AC5 AC4 AC3 AC2 AC1 AC0 Figure 16-21. MSCAN Identifier Acceptance Registers (Second Bank) -- CANIDAR4-CANIDAR7 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) MC9S12XE-Family Reference Manual , Rev. 1.21 626 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-23. CANIDAR4-CANIDAR7 Register Field Descriptions Field 7-0 AC[7:0] Description Acceptance Code Bits -- AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison is then masked with the corresponding identifier mask register. 16.3.2.18 MSCAN Identifier Mask Registers (CANIDMR0-CANIDMR7) The identifier mask register specifies which of the corresponding bits in the identifier acceptance register are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to "don't care." To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0]) in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to "don't care." Module Base + 0x0014 to Module Base + 0x0017 7 6 5 4 3 2 Access: User read/write(1) 1 0 R AM7 W Reset 0 0 0 0 0 0 0 0 AM6 AM5 AM4 AM3 AM2 AM1 AM0 Figure 16-22. MSCAN Identifier Mask Registers (First Bank) -- CANIDMR0-CANIDMR3 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 16-24. CANIDMR0-CANIDMR3 Register Field Descriptions Field 7-0 AM[7:0] Description Acceptance Mask Bits -- If a particular bit in this register is cleared, this indicates that the corresponding bit in the identifier acceptance register must be the same as its identifier bit before a match is detected. The message is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier acceptance register does not affect whether or not the message is accepted. 0 Match corresponding acceptance code register and identifier bits 1 Ignore corresponding acceptance code register bit Module Base + 0x001C to Module Base + 0x001F 7 6 5 4 3 2 Access: User read/write(1) 1 0 R AM7 W Reset 0 0 0 0 0 0 0 0 AM6 AM5 AM4 AM3 AM2 AM1 AM0 Figure 16-23. MSCAN Identifier Mask Registers (Second Bank) -- CANIDMR4-CANIDMR7 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 627 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 1. Read: Anytime Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1) Table 16-25. CANIDMR4-CANIDMR7 Register Field Descriptions Field 7-0 AM[7:0] Description Acceptance Mask Bits -- If a particular bit in this register is cleared, this indicates that the corresponding bit in the identifier acceptance register must be the same as its identifier bit before a match is detected. The message is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier acceptance register does not affect whether or not the message is accepted. 0 Match corresponding acceptance code register and identifier bits 1 Ignore corresponding acceptance code register bit 16.3.3 Programmer's Model of Message Storage The following section details the organization of the receive and transmit message buffers and the associated control registers. To simplify the programmer interface, the receive and transmit message buffers have the same outline. Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure. An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an internal timer after successful transmission or reception of a message. This feature is only available for transmit and receiver buffers, if the TIME bit is set (see Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)"). The time stamp register is written by the MSCAN. The CPU can only read these registers. MC9S12XE-Family Reference Manual , Rev. 1.21 628 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-26. Message Buffer Organization Offset Address 0x00X0 0x00X1 0x00X2 0x00X3 0x00X4 0x00X5 0x00X6 0x00X7 0x00X8 0x00X9 0x00XA 0x00XB 0x00XC 0x00XD 0x00XE Identifier Register 0 Identifier Register 1 Identifier Register 2 Identifier Register 3 Data Segment Register 0 Data Segment Register 1 Data Segment Register 2 Data Segment Register 3 Data Segment Register 4 Data Segment Register 5 Data Segment Register 6 Data Segment Register 7 Data Length Register Transmit Buffer Priority Register (1) Register Access R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R R Time Stamp Register (High Byte) 0x00XF Time Stamp Register (Low Byte) 1. Not applicable for receive buffers Figure 16-24 shows the common 13-byte data structure of receive and transmit buffers for extended identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 16-25. All bits of the receive and transmit buffers are `x' out of reset because of RAM-based implementation1. All reserved or unused bits of the receive and transmit buffers always read `x'. 1. Exception: The transmit buffer priority registers are 0 out of reset. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 629 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Figure 16-24. Receive/Transmit Message Buffer -- Extended Identifier Mapping Register Name 0x00X0 IDR0 R ID28 W R ID20 W R ID14 W R ID6 W R DB7 W R DB7 W R DB7 W R DB7 W R DB7 W R DB7 W R DB7 W R DB7 W R DLC3 W DLC2 DLC1 DLC0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DB6 DB5 DB4 DB3 DB2 DB1 DB0 ID5 ID4 ID3 ID2 ID1 ID0 RTR ID13 ID12 ID11 ID10 ID9 ID8 ID7 ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15 ID27 ID26 ID25 ID24 ID23 ID22 ID21 Bit 7 6 5 4 3 2 1 Bit0 0x00X1 IDR1 0x00X2 IDR2 0x00X3 IDR3 0x00X4 DSR0 0x00X5 DSR1 0x00X6 DSR2 0x00X7 DSR3 0x00X8 DSR4 0x00X9 DSR5 0x00XA DSR6 0x00XB DSR7 0x00XC DLR MC9S12XE-Family Reference Manual , Rev. 1.21 630 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Figure 16-24. Receive/Transmit Message Buffer -- Extended Identifier Mapping (continued) Register Name Bit 7 6 5 4 3 2 1 Bit0 = Unused, always read `x' Read: * For transmit buffers, anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). * For receive buffers, only when RXF flag is set (see Section 16.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)"). Write: * For transmit buffers, anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). * Unimplemented for receive buffers. Reset: Undefined because of RAM-based implementation Figure 16-25. Receive/Transmit Message Buffer -- Standard Identifier Mapping Register Name IDR0 0x00X0 R ID10 W R ID2 W R W R W ID1 ID0 RTR IDE (=0) ID9 ID8 ID7 ID6 ID5 ID4 ID3 Bit 7 6 5 4 3 2 1 Bit 0 IDR1 0x00X1 IDR2 0x00X2 IDR3 0x00X3 = Unused, always read `x' 16.3.3.1 Identifier Registers (IDR0-IDR3) The identifier registers for an extended format identifier consist of a total of 32 bits: ID[28:0], SRR, IDE, and RTR. The identifier registers for a standard format identifier consist of a total of 13 bits: ID[10:0], RTR, and IDE. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 631 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3.3.1.1 IDR0-IDR3 for Extended Identifier Mapping Module Base + 0x00X0 7 6 5 4 3 2 1 0 R ID28 W Reset: x x x x x x x x ID27 ID26 ID25 ID24 ID23 ID22 ID21 Figure 16-26. Identifier Register 0 (IDR0) -- Extended Identifier Mapping Table 16-27. IDR0 Register Field Descriptions -- Extended Field 7-0 ID[28:21] Description Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Module Base + 0x00X1 7 6 5 4 3 2 1 0 R ID20 W Reset: x x x x x x x x ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15 Figure 16-27. Identifier Register 1 (IDR1) -- Extended Identifier Mapping Table 16-28. IDR1 Register Field Descriptions -- Extended Field 7-5 ID[20:18] 4 SRR 3 IDE Description Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Substitute Remote Request -- This fixed recessive bit is used only in extended format. It must be set to 1 by the user for transmission buffers and is stored as received on the CAN bus for receive buffers. ID Extended -- This flag indicates whether the extended or standard identifier format is applied in this buffer. In the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send. 0 Standard format (11 bit) 1 Extended format (29 bit) Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. 2-0 ID[17:15] MC9S12XE-Family Reference Manual , Rev. 1.21 632 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x00X2 7 6 5 4 3 2 1 0 R ID14 W Reset: x x x x x x x x ID13 ID12 ID11 ID10 ID9 ID8 ID7 Figure 16-28. Identifier Register 2 (IDR2) -- Extended Identifier Mapping Table 16-29. IDR2 Register Field Descriptions -- Extended Field 7-0 ID[14:7] Description Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Module Base + 0x00X3 7 6 5 4 3 2 1 0 R ID6 W Reset: x x x x x x x x ID5 ID4 ID3 ID2 ID1 ID0 RTR Figure 16-29. Identifier Register 3 (IDR3) -- Extended Identifier Mapping Table 16-30. IDR3 Register Field Descriptions -- Extended Field 7-1 ID[6:0] 0 RTR Description Extended Format Identifier -- The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. Remote Transmission Request -- This flag reflects the status of the remote transmission request bit in the CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of the RTR bit to be sent. 0 Data frame 1 Remote frame MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 633 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3.3.1.2 IDR0-IDR3 for Standard Identifier Mapping Module Base + 0x00X0 7 6 5 4 3 2 1 0 R ID10 W Reset: x x x x x x x x ID9 ID8 ID7 ID6 ID5 ID4 ID3 Figure 16-30. Identifier Register 0 -- Standard Mapping Table 16-31. IDR0 Register Field Descriptions -- Standard Field 7-0 ID[10:3] Description Standard Format Identifier -- The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. See also ID bits in Table 16-32. Module Base + 0x00X1 7 6 5 4 3 2 1 0 R ID2 W Reset: x x x x x x x x ID1 ID0 RTR IDE (=0) = Unused; always read `x' Figure 16-31. Identifier Register 1 -- Standard Mapping Table 16-32. IDR1 Register Field Descriptions Field 7-5 ID[2:0] 4 RTR Description Standard Format Identifier -- The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an identifier is defined to be highest for the smallest binary number. See also ID bits in Table 16-31. Remote Transmission Request -- This flag reflects the status of the Remote Transmission Request bit in the CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of the RTR bit to be sent. 0 Data frame 1 Remote frame ID Extended -- This flag indicates whether the extended or standard identifier format is applied in this buffer. In the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send. 0 Standard format (11 bit) 1 Extended format (29 bit) 3 IDE MC9S12XE-Family Reference Manual , Rev. 1.21 634 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x00X2 7 6 5 4 3 2 1 0 R W Reset: x x x x x x x x = Unused; always read `x' Figure 16-32. Identifier Register 2 -- Standard Mapping Module Base + 0x00X3 7 6 5 4 3 2 1 0 R W Reset: x x x x x x x x = Unused; always read `x' Figure 16-33. Identifier Register 3 -- Standard Mapping 16.3.3.2 Data Segment Registers (DSR0-7) The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received. The number of bytes to be transmitted or received is determined by the data length code in the corresponding DLR register. Module Base + 0x00X4 to Module Base + 0x00XB 7 6 5 4 3 2 1 0 R DB7 W Reset: x x x x x x x x DB6 DB5 DB4 DB3 DB2 DB1 DB0 Figure 16-34. Data Segment Registers (DSR0-DSR7) -- Extended Identifier Mapping Table 16-33. DSR0-DSR7 Register Field Descriptions Field 7-0 DB[7:0] Data bits 7-0 Description MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 635 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.3.3.3 Data Length Register (DLR) This register keeps the data length field of the CAN frame. Module Base + 0x00XC 7 6 5 4 3 2 1 0 R DLC3 W Reset: x x x x x x x x DLC2 DLC1 DLC0 = Unused; always read "x" Figure 16-35. Data Length Register (DLR) -- Extended Identifier Mapping Table 16-34. DLR Register Field Descriptions Field 3-0 DLC[3:0] Description Data Length Code Bits -- The data length code contains the number of bytes (data byte count) of the respective message. During the transmission of a remote frame, the data length code is transmitted as programmed while the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame. Table 16-35 shows the effect of setting the DLC bits. Table 16-35. Data Length Codes Data Length Code DLC3 0 0 0 0 0 0 0 0 1 DLC2 0 0 0 0 1 1 1 1 0 DLC1 0 0 1 1 0 0 1 1 0 DLC0 0 1 0 1 0 1 0 1 0 Data Byte Count 0 1 2 3 4 5 6 7 8 16.3.3.4 Transmit Buffer Priority Register (TBPR) This register defines the local priority of the associated message buffer. The local priority is used for the internal prioritization process of the MSCAN and is defined to be highest for the smallest binary number. The MSCAN implements the following internal prioritization mechanisms: * All transmission buffers with a cleared TXEx flag participate in the prioritization immediately before the SOF (start of frame) is sent. MC9S12XE-Family Reference Manual , Rev. 1.21 636 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) * The transmission buffer with the lowest local priority field wins the prioritization. In cases of more than one buffer having the same lowest priority, the message buffer with the lower index number wins. Module Base + 0x00XD 7 6 5 4 3 2 Access: User read/write(1) 1 0 R PRIO7 W Reset: 0 0 0 0 0 0 0 0 PRIO6 PRIO5 PRIO4 PRIO3 PRIO2 PRIO1 PRIO0 Figure 16-36. Transmit Buffer Priority Register (TBPR) 1. Read: Anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") Write: Anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") 16.3.3.5 Time Stamp Register (TSRH-TSRL) If the TIME bit is enabled, the MSCAN will write a time stamp to the respective registers in the active transmit or receive buffer right after the EOF of a valid message on the CAN bus (see Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)"). In case of a transmission, the CPU can only read the time stamp after the respective transmit buffer has been flagged empty. The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The CPU can only read the time stamp registers. Module Base + 0x00XE 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: TSR15 TSR14 TSR13 TSR12 TSR11 TSR10 TSR9 TSR8 x x x x x x x x Figure 16-37. Time Stamp Register -- High Byte (TSRH) 1. Read: Anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") Write: Unimplemented MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 637 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Module Base + 0x00XF 7 6 5 4 3 2 Access: User read/write(1) 1 0 R W Reset: TSR7 TSR6 TSR5 TSR4 TSR3 TSR2 TSR1 TSR0 x x x x x x x x Figure 16-38. Time Stamp Register -- Low Byte (TSRL) 1. Read: Anytime when TXEx flag is set (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)") and the corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)") Write: Unimplemented MC9S12XE-Family Reference Manual , Rev. 1.21 638 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4 16.4.1 Functional Description General This section provides a complete functional description of the MSCAN. 16.4.2 Message Storage CAN Receive / Transmit Engine Memory Mapped I/O Rx0 Rx1 Rx2 Rx3 Rx4 RXF RxBG MSCAN Receiver Tx0 RxFG CPU bus TXE0 TxBG Tx1 PRIO TXE1 TxFG MSCAN CPU bus PRIO Tx2 TXE2 Transmitter TxBG PRIO Figure 16-39. User Model for Message Buffer Organization MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 639 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) The MSCAN facilitates a sophisticated message storage system which addresses the requirements of a broad range of network applications. 16.4.2.1 Message Transmit Background Modern application layer software is built upon two fundamental assumptions: * Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the previous message and only release the CAN bus in case of lost arbitration. * The internal message queue within any CAN node is organized such that the highest priority message is sent out first, if more than one message is ready to be sent. The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts with short latencies to the transmit interrupt. A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a message is finished while the CPU re-loads the second buffer. No buffer would then be ready for transmission, and the CAN bus would be released. At least three transmit buffers are required to meet the first of the above requirements under all circumstances. The MSCAN has three transmit buffers. The second requirement calls for some sort of internal prioritization which the MSCAN implements with the "local priority" concept described in Section 16.4.2.2, "Transmit Structures." 16.4.2.2 Transmit Structures The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple messages to be set up in advance. The three buffers are arranged as shown in Figure 16-39. All three buffers have a 13-byte data structure similar to the outline of the receive buffers (see Section 16.3.3, "Programmer's Model of Message Storage"). An additional Transmit Buffer Priority Register (TBPR) contains an 8-bit local priority field (PRIO) (see Section 16.3.3.4, "Transmit Buffer Priority Register (TBPR)"). The remaining two bytes are used for time stamping of a message, if required (see Section 16.3.3.5, "Time Stamp Register (TSRH-TSRL)"). To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set transmitter buffer empty (TXEx) flag (see Section 16.3.2.7, "MSCAN Transmitter Flag Register (CANTFLG)"). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the CANTBSEL register (see Section 16.3.2.11, "MSCAN Transmit Buffer Selection Register (CANTBSEL)"). This makes the respective buffer accessible within the CANTXFG address space (see Section 16.3.3, "Programmer's Model of Message Storage"). The algorithmic feature associated with the CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler MC9S12XE-Family Reference Manual , Rev. 1.21 640 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) software simpler because only one address area is applicable for the transmit process, and the required address space is minimized. The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers. Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag. The MSCAN then schedules the message for transmission and signals the successful transmission of the buffer by setting the associated TXE flag. A transmit interrupt (see Section 16.4.7.2, "Transmit Interrupt") is generated1 when TXEx is set and can be used to drive the application software to re-load the buffer. If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration, the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs this field when the message is set up. The local priority reflects the priority of this particular message relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error. When a high priority message is scheduled by the application software, it may become necessary to abort a lower priority message in one of the three transmit buffers. Because messages that are already in transmission cannot be aborted, the user must request the abort by setting the corresponding abort request bit (ABTRQ) (see Section 16.3.2.9, "MSCAN Transmitter Message Abort Request Register (CANTARQ)".) The MSCAN then grants the request, if possible, by: 1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register. 2. Setting the associated TXE flag to release the buffer. 3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0). 16.4.2.3 Receive Structures The received messages are stored in a five stage input FIFO. The five message buffers are alternately mapped into a single memory area (see Figure 16-39). The background receive buffer (RxBG) is exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the CPU (see Figure 16-39). This scheme simplifies the handler software because only one address area is applicable for the receive process. All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or extended), the data contents, and a time stamp, if enabled (see Section 16.3.3, "Programmer's Model of Message Storage"). The receiver full flag (RXF) (see Section 16.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)") signals the status of the foreground receive buffer. When the buffer contains a correctly received message with a matching identifier, this flag is set. On reception, each message is checked to see whether it passes the filter (see Section 16.4.3, "Identifier Acceptance Filter") and simultaneously is written into the active RxBG. After successful reception of a valid message, the MSCAN shifts the content of RxBG into the receiver FIFO, sets the RXF flag, and 1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 641 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) generates a receive interrupt1 (see Section 16.4.7.3, "Receive Interrupt") to the CPU. The user's receive handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be over-written by the next message. The buffer will then not be shifted into the FIFO. When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt, or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see Section 16.3.2.2, "MSCAN Control Register 1 (CANCTL1)") where the MSCAN treats its own messages exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver. An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly received messages with accepted identifiers and another message is correctly received from the CAN bus with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication is generated if enabled (see Section 16.4.7.5, "Error Interrupt"). The MSCAN remains able to transmit messages while the receiver FIFO is being filled, but all incoming messages are discarded. As soon as a receive buffer in the FIFO is available again, new valid messages will be accepted. 16.4.3 Identifier Acceptance Filter The MSCAN identifier acceptance registers (see Section 16.3.2.12, "MSCAN Identifier Acceptance Control Register (CANIDAC)") define the acceptable patterns of the standard or extended identifier (ID[10:0] or ID[28:0]). Any of these bits can be marked `don't care' in the MSCAN identifier mask registers (see Section 16.3.2.18, "MSCAN Identifier Mask Registers (CANIDMR0-CANIDMR7)"). A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits in the CANIDAC register (see Section 16.3.2.12, "MSCAN Identifier Acceptance Control Register (CANIDAC)"). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the acceptance. They simplify the application software's task to identify the cause of the receiver interrupt. If more than one hit occurs (two or more filters match), the lower hit has priority. A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU interrupt loading. The filter is programmable to operate in four different modes: * Two identifier acceptance filters, each to be applied to: -- The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame: - Remote transmission request (RTR) - Identifier extension (IDE) - Substitute remote request (SRR) -- The 11 bits of the standard identifier plus the RTR and IDE bits of the CAN 2.0A/B messages. This mode implements two filters for a full length CAN 2.0B compliant extended identifier. Although this mode can be used for standard identifiers, it is recommended to use the four or eight identifier acceptance filters. 1. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also. MC9S12XE-Family Reference Manual , Rev. 1.21 642 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) * * * Figure 16-40 shows how the first 32-bit filter bank (CANIDAR0-CANIDAR3, CANIDMR0-CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces a filter 1 hit. Four identifier acceptance filters, each to be applied to: -- The 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B messages. -- The 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages. Figure 16-41 shows how the first 32-bit filter bank (CANIDAR0-CANIDA3, CANIDMR0-3CANIDMR) produces filter 0 and 1 hits. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces filter 2 and 3 hits. Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard identifier or a CAN 2.0B compliant extended identifier. Figure 16-42 shows how the first 32-bit filter bank (CANIDAR0-CANIDAR3, CANIDMR0-CANIDMR3) produces filter 0 to 3 hits. Similarly, the second filter bank (CANIDAR4-CANIDAR7, CANIDMR4-CANIDMR7) produces filter 4 to 7 hits. Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is never set. IDR0 IDR0 ID21 ID3 ID20 ID2 IDR1 IDR1 ID15 IDE ID14 ID10 IDR2 IDR2 ID7 ID3 ID6 ID10 IDR3 IDR3 RTR ID3 CAN 2.0B Extended Identifier ID28 CAN 2.0A/B Standard Identifier ID10 AM7 CANIDMR0 AM0 AM7 CANIDMR1 AM0 AM7 CANIDMR2 AM0 AM7 CANIDMR3 AM0 AC7 CANIDAR0 AC0 AC7 CANIDAR1 AC0 AC7 CANIDAR2 AC0 AC7 CANIDAR3 AC0 ID Accepted (Filter 0 Hit) Figure 16-40. 32-bit Maskable Identifier Acceptance Filter MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 643 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) CAN 2.0B Extended Identifier CAN 2.0A/B Standard Identifier ID28 ID10 IDR0 IDR0 ID21 ID3 ID20 ID2 IDR1 IDR1 ID15 IDE ID14 ID10 IDR2 IDR2 ID7 ID3 ID6 ID10 IDR3 IDR3 RTR ID3 AM7 CANIDMR0 AM0 AM7 CANIDMR1 AM0 AC7 CANIDAR0 AC0 AC7 CANIDAR1 AC0 ID Accepted (Filter 0 Hit) AM7 CANIDMR2 AM0 AM7 CANIDMR3 AM0 AC7 CANIDAR2 AC0 AC7 CANIDAR3 AC0 ID Accepted (Filter 1 Hit) Figure 16-41. 16-bit Maskable Identifier Acceptance Filters MC9S12XE-Family Reference Manual , Rev. 1.21 644 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) CAN 2.0B Extended Identifier ID28 CAN 2.0A/B Standard Identifier ID10 IDR0 IDR0 ID21 ID3 ID20 ID2 IDR1 IDR1 ID15 IDE ID14 ID10 IDR2 IDR2 ID7 ID3 ID6 ID10 IDR3 IDR3 RTR ID3 AM7 CIDMR0 AM0 AC7 CIDAR0 AC0 ID Accepted (Filter 0 Hit) AM7 CIDMR1 AM0 AC7 CIDAR1 AC0 ID Accepted (Filter 1 Hit) AM7 CIDMR2 AM0 AC7 CIDAR2 AC0 ID Accepted (Filter 2 Hit) AM7 CIDMR3 AM0 AC7 CIDAR3 AC0 ID Accepted (Filter 3 Hit) Figure 16-42. 8-bit Maskable Identifier Acceptance Filters MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 645 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4.3.1 Protocol Violation Protection The MSCAN protects the user from accidentally violating the CAN protocol through programming errors. The protection logic implements the following features: * The receive and transmit error counters cannot be written or otherwise manipulated. * All registers which control the configuration of the MSCAN cannot be modified while the MSCAN is on-line. The MSCAN has to be in Initialization Mode. The corresponding INITRQ/INITAK handshake bits in the CANCTL0/CANCTL1 registers (see Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)") serve as a lock to protect the following registers: -- MSCAN control 1 register (CANCTL1) -- MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1) -- MSCAN identifier acceptance control register (CANIDAC) -- MSCAN identifier acceptance registers (CANIDAR0-CANIDAR7) -- MSCAN identifier mask registers (CANIDMR0-CANIDMR7) * The TXCAN is immediately forced to a recessive state when the MSCAN goes into the power down mode or initialization mode (see Section 16.4.5.6, "MSCAN Power Down Mode," and Section 16.4.4.5, "MSCAN Initialization Mode"). * The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which provides further protection against inadvertently disabling the MSCAN. 16.4.3.2 Clock System Figure 16-43 shows the structure of the MSCAN clock generation circuitry. MSCAN Bus Clock CANCLK CLKSRC Prescaler (1 .. 64) Time quanta clock (Tq) CLKSRC Oscillator Clock Figure 16-43. MSCAN Clocking Scheme The clock source bit (CLKSRC) in the CANCTL1 register (16.3.2.2/16-611) defines whether the internal CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock. The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the clock is required. If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the bus clock due to jitter considerations, especially at the faster CAN bus rates. MC9S12XE-Family Reference Manual , Rev. 1.21 646 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal oscillator (oscillator clock). A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the atomic unit of time handled by the MSCAN. Eqn. 16-2 f CANCLK = ----------------------------------------------------Tq ( Prescaler value ) A bit time is subdivided into three segments as described in the Bosch CAN specification. (see Figure 1644): * SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to happen within this section. * Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta. * Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long. Eqn. 16-3 f Tq Bit Rate = -------------------------------------------------------------------------------( number of Time Quanta ) NRZ Signal SYNC_SEG Time Segment 1 (PROP_SEG + PHASE_SEG1) 4 ... 16 8 ... 25 Time Quanta = 1 Bit Time Time Segment 2 (PHASE_SEG2) 2 ... 8 1 Transmit Point Sample Point (single or triple sampling) Figure 16-44. Segments within the Bit Time MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 647 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-36. Time Segment Syntax Syntax SYNC_SEG Transmit Point Description System expects transitions to occur on the CAN bus during this period. A node in transmit mode transfers a new value to the CAN bus at this point. A node in receive mode samples the CAN bus at this point. If the three samples per bit option is selected, then this point marks the position of the third sample. Sample Point The synchronization jump width (see the Bosch CAN specification for details) can be programmed in a range of 1 to 4 time quanta by setting the SJW parameter. The SYNC_SEG, TSEG1, TSEG2, and SJW parameters are set by programming the MSCAN bus timing registers (CANBTR0, CANBTR1) (see Section 16.3.2.3, "MSCAN Bus Timing Register 0 (CANBTR0)" and Section 16.3.2.4, "MSCAN Bus Timing Register 1 (CANBTR1)"). Table 16-37 gives an overview of the CAN compliant segment settings and the related parameter values. NOTE It is the user's responsibility to ensure the bit time settings are in compliance with the CAN standard. Table 16-37. CAN Standard Compliant Bit Time Segment Settings Time Segment 1 5 .. 10 4 .. 11 5 .. 12 6 .. 13 7 .. 14 8 .. 15 9 .. 16 TSEG1 4 .. 9 3 .. 10 4 .. 11 5 .. 12 6 .. 13 7 .. 14 8 .. 15 Time Segment 2 2 3 4 5 6 7 8 TSEG2 1 2 3 4 5 6 7 Synchronization Jump Width 1 .. 2 1 .. 3 1 .. 4 1 .. 4 1 .. 4 1 .. 4 1 .. 4 SJW 0 .. 1 0 .. 2 0 .. 3 0 .. 3 0 .. 3 0 .. 3 0 .. 3 16.4.4 16.4.4.1 Modes of Operation Normal System Operating Modes The MSCAN module behaves as described within this specification in all normal system operating modes. Write restrictions exist for some registers. MC9S12XE-Family Reference Manual , Rev. 1.21 648 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4.4.2 Special System Operating Modes The MSCAN module behaves as described within this specification in all special system operating modes. Write restrictions which exist on specific registers in normal modes are lifted for test purposes in special modes. 16.4.4.3 Emulation Modes In all emulation modes, the MSCAN module behaves just like in normal system operating modes as described within this specification. 16.4.4.4 Listen-Only Mode In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames and valid remote frames, but it sends only "recessive" bits on the CAN bus. In addition, it cannot start a transmission. If the MAC sub-layer is required to send a "dominant" bit (ACK bit, overload flag, or active error flag), the bit is rerouted internally so that the MAC sub-layer monitors this "dominant" bit, although the CAN bus may remain in recessive state externally. 16.4.4.5 MSCAN Initialization Mode The MSCAN enters initialization mode when it is enabled (CANE=1). When entering initialization mode during operation, any on-going transmission or reception is immediately aborted and synchronization to the CAN bus is lost, potentially causing CAN protocol violations. To protect the CAN bus system from fatal consequences of violations, the MSCAN immediately drives TXCAN into a recessive state. NOTE The user is responsible for ensuring that the MSCAN is not active when initialization mode is entered. The recommended procedure is to bring the MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going message can cause an error condition and can impact other CAN bus devices. In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL registers to their default values. In addition, the MSCAN enables the configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR, CANIDMR message filters. See Section 16.3.2.1, "MSCAN Control Register 0 (CANCTL0)," for a detailed description of the initialization mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 649 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Bus Clock Domain CAN Clock Domain INIT Flag INITRQ CPU Init Request SYNC sync. INITRQ INITAK Flag sync. INITAK SYNC INITAK Figure 16-45. Initialization Request/Acknowledge Cycle Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by using a special handshake mechanism. This handshake causes additional synchronization delay (see Figure 16-45). If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the INITAK flag is set. The application software must use INITAK as a handshake indication for the request (INITRQ) to go into initialization mode. NOTE The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and INITAK = 1) is active. 16.4.5 Low-Power Options If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving. If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption is reduced by stopping all clocks except those to access the registers from the CPU side. In power down mode, all clocks are stopped and no power is consumed. Table 16-38 summarizes the combinations of MSCAN and CPU modes. A particular combination of modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits. MC9S12XE-Family Reference Manual , Rev. 1.21 650 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) Table 16-38. CPU vs. MSCAN Operating Modes MSCAN Mode CPU Mode Normal Sleep CSWAI = X(1) SLPRQ = 0 SLPAK = 0 CSWAI = 0 SLPRQ = 0 SLPAK = 0 CSWAI = X SLPRQ = 1 SLPAK = 1 CSWAI = 0 SLPRQ = 1 SLPAK = 1 CSWAI = 1 SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X Power Down Reduced Power Consumption Disabled (CANE=0) CSWAI = X SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X CSWAI = X SLPRQ = X SLPAK = X RUN WAIT STOP 1. `X' means don't care. 16.4.5.1 Operation in Run Mode As shown in Table 16-38, only MSCAN sleep mode is available as low power option when the CPU is in run mode. 16.4.5.2 Operation in Wait Mode The WAI instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set, additional power can be saved in power down mode because the CPU clocks are stopped. After leaving this power down mode, the MSCAN restarts and enters normal mode again. While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts (registers can be accessed via background debug mode). 16.4.5.3 Operation in Stop Mode The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop mode, the MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK and CSWAI bits (Table 16-38). 16.4.5.4 MSCAN Normal Mode This is a non-power-saving mode. Enabling the MSCAN puts the module from disabled mode into normal mode. In this mode the module can either be in initialization mode or out of initialization mode. See Section 16.4.4.5, "MSCAN Initialization Mode". MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 651 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4.5.5 MSCAN Sleep Mode The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization delay and its current activity: * If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted successfully or aborted) and then goes into sleep mode. * If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN bus next becomes idle. * If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode. Bus Clock Domain CAN Clock Domain SLPRQ Flag SLPRQ CPU Sleep Request SYNC sync. SLPRQ SLPAK Flag sync. SLPAK SYNC SLPAK MSCAN in Sleep Mode Figure 16-46. Sleep Request / Acknowledge Cycle NOTE The application software must avoid setting up a transmission (by clearing one or more TXEx flag(s)) and immediately request sleep mode (by setting SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode directly depends on the exact sequence of operations. If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 16-46). The application software must use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode. When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks that allow register accesses from the CPU side continue to run. If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits due to the stopped clocks. TXCAN remains in a recessive state. If RXF = 1, the message can be read and RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO (RxFG) does not take place while in sleep mode. It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes place while in sleep mode. MC9S12XE-Family Reference Manual , Rev. 1.21 652 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) If the WUPE bit in CANCTL0 is not asserted, the MSCAN will mask any activity it detects on CAN. RXCAN is therefore held internally in a recessive state. This locks the MSCAN in sleep mode. WUPE must be set before entering sleep mode to take effect. The MSCAN is able to leave sleep mode (wake up) only when: * CAN bus activity occurs and WUPE = 1 or * the CPU clears the SLPRQ bit NOTE The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and SLPAK = 1) is active. After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received. The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it continues counting the 128 occurrences of 11 consecutive recessive bits. 16.4.5.6 MSCAN Power Down Mode The MSCAN is in power down mode (Table 16-38) when * CPU is in stop mode or * CPU is in wait mode and the CSWAI bit is set When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal consequences of violations to the above rule, the MSCAN immediately drives TXCAN into a recessive state. NOTE The user is responsible for ensuring that the MSCAN is not active when power down mode is entered. The recommended procedure is to bring the MSCAN into Sleep mode before the STOP or WAI instruction (if CSWAI is set) is executed. Otherwise, the abort of an ongoing message can cause an error condition and impact other CAN bus devices. In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in sleep mode before power down mode became active, the module performs an internal recovery cycle after powering up. This causes some fixed delay before the module enters normal mode again. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 653 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4.5.7 Disabled Mode The MSCAN is in disabled mode out of reset (CANE=0). All module clocks are stopped for power saving, however the register map can still be accessed as specified. 16.4.5.8 Programmable Wake-Up Function The MSCAN can be programmed to wake up from sleep or power down mode as soon as CAN bus activity is detected (see control bit WUPE in MSCAN Control Register 0 (CANCTL0). The sensitivity to existing CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line (see control bit WUPM in Section 16.3.2.2, "MSCAN Control Register 1 (CANCTL1)"). This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines. Such glitches can result from--for example--electromagnetic interference within noisy environments. 16.4.6 Reset Initialization The reset state of each individual bit is listed in Section 16.3.2, "Register Descriptions," which details all the registers and their bit-fields. 16.4.7 Interrupts This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated flags. Each interrupt is listed and described separately. 16.4.7.1 Description of Interrupt Operation The MSCAN supports four interrupt vectors (see Table 16-39), any of which can be individually masked (for details see Section 16.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)" to Section 16.3.2.8, "MSCAN Transmitter Interrupt Enable Register (CANTIER)"). Refer to the device overview section to determine the dedicated interrupt vector addresses. Table 16-39. Interrupt Vectors Interrupt Source Wake-Up Interrupt (WUPIF) Error Interrupts Interrupt (CSCIF, OVRIF) Receive Interrupt (RXF) Transmit Interrupts (TXE[2:0]) CCR Mask I bit I bit I bit I bit Local Enable CANRIER (WUPIE) CANRIER (CSCIE, OVRIE) CANRIER (RXFIE) CANTIER (TXEIE[2:0]) 16.4.7.2 Transmit Interrupt At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message for transmission. The TXEx flag of the empty message buffer is set. MC9S12XE-Family Reference Manual , Rev. 1.21 654 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.4.7.3 Receive Interrupt A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO. This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the foreground buffer. 16.4.7.4 Wake-Up Interrupt A wake-up interrupt is generated if activity on the CAN bus occurs during MSCAN sleep or power-down mode. NOTE This interrupt can only occur if the MSCAN was in sleep mode (SLPRQ = 1 and SLPAK = 1) before entering power down mode, the wake-up option is enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1). 16.4.7.5 Error Interrupt An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition occurrs. MSCAN Receiver Flag Register (CANRFLG) indicates one of the following conditions: * Overrun -- An overrun condition of the receiver FIFO as described in Section 16.4.2.3, "Receive Structures," occurred. * CAN Status Change -- The actual value of the transmit and receive error counters control the CAN bus state of the MSCAN. As soon as the error counters skip into a critical range (Tx/Rxwarning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change, which caused the error condition, is indicated by the TSTAT and RSTAT flags (see Section 16.3.2.5, "MSCAN Receiver Flag Register (CANRFLG)" and Section 16.3.2.6, "MSCAN Receiver Interrupt Enable Register (CANRIER)"). 16.4.7.6 Interrupt Acknowledge Interrupts are directly associated with one or more status flags in either the MSCAN Receiver Flag Register (CANRFLG) or the MSCAN Transmitter Flag Register (CANTFLG). Interrupts are pending as long as one of the corresponding flags is set. The flags in CANRFLG and CANTFLG must be reset within the interrupt handler to handshake the interrupt. The flags are reset by writing a 1 to the corresponding bit position. A flag cannot be cleared if the respective condition prevails. NOTE It must be guaranteed that the CPU clears only the bit causing the current interrupt. For this reason, bit manipulation instructions (BSET) must not be used to clear interrupt flags. These instructions may cause accidental clearing of interrupt flags which are set after entering the current interrupt service routine. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 655 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 16 Freescale's Scalable Controller Area Network (S12MSCANV3) 16.5 16.5.1 Initialization/Application Information MSCAN initialization The procedure to initially start up the MSCAN module out of reset is as follows: 1. Assert CANE 2. Write to the configuration registers in initialization mode 3. Clear INITRQ to leave initialization mode If the configuration of registers which are only writable in initialization mode shall be changed: 1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN bus becomes idle. 2. Enter initialization mode: assert INITRQ and await INITAK 3. Write to the configuration registers in initialization mode 4. Clear INITRQ to leave initialization mode and continue 16.5.2 Bus-Off Recovery The bus-off recovery is user configurable. The bus-off state can either be left automatically or on user request. For reasons of backwards compatibility, the MSCAN defaults to automatic recovery after reset. In this case, the MSCAN will become error active again after counting 128 occurrences of 11 consecutive recessive bits on the CAN bus (see the Bosch CAN specification for details). If the MSCAN is configured for user request (BORM set in MSCAN Control Register 1 (CANCTL1)), the recovery from bus-off starts after both independent events have become true: * 128 occurrences of 11 consecutive recessive bits on the CAN bus have been monitored * BOHOLD in MSCAN Miscellaneous Register (CANMISC) has been cleared by the user These two events may occur in any order. MC9S12XE-Family Reference Manual , Rev. 1.21 656 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Table 17-1. Revision History Revision Number V01.00 V01.01 RevisionDate 28 Apr 2005 05 Jul 2005 17.6/17-672 Sections Affected - Initial Release. - Added application section. - Removed table 1-1. Description of Changes 17.1 Introduction The period interrupt timer (PIT) is an array of 24-bit timers that can be used to trigger peripheral modules or raise periodic interrupts. Refer to Figure 17-1 for a simplified block diagram. 17.1.1 Glossary Acronyms and Abbreviations PIT ISR CCR SoC Periodic Interrupt Timer Interrupt Service Routine Condition Code Register System on Chip clock periods of the 16-bit timer modulus down-counters, which are generated by the 8-bit modulus down-counters. micro time bases 17.1.2 Features The PIT includes these features: * Eight timers implemented as modulus down-counters with independent time-out periods. * Time-out periods selectable between 1 and 224 bus clock cycles. Time-out equals m*n bus clock cycles with 1 <= m <= 256 and 1 <= n <= 65536. * Timers that can be enabled individually. * Eight time-out interrupts. * Eight time-out trigger output signals available to trigger peripheral modules. * Start of timer channels can be aligned to each other. 17.1.3 Modes of Operation Refer to the device overview for a detailed explanation of the chip modes. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 657 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) * * * * Run mode This is the basic mode of operation. Wait mode PIT operation in wait mode is controlled by the PITSWAI bit located in the PITCFLMT register. In wait mode, if the bus clock is globally enabled and if the PITSWAI bit is clear, the PIT operates like in run mode. In wait mode, if the PITSWAI bit is set, the PIT module is stalled. Stop mode In full stop mode or pseudo stop mode, the PIT module is stalled. Freeze mode PIT operation in freeze mode is controlled by the PITFRZ bit located in the PITCFLMT register. In freeze mode, if the PITFRZ bit is clear, the PIT operates like in run mode. In freeze mode, if the PITFRZ bit is set, the PIT module is stalled. 17.1.4 Block Diagram Micro Time Base 0 Time-Out 0 Interrupt 0 Interface Trigger 0 Interrupt 1 Interface Trigger 1 Interrupt 2 Interface Trigger 2 Interrupt 3 Interface Trigger 3 Interrupt 4 Interface Trigger 4 Interrupt 5 Interface Trigger 5 Interrupt 6 Interface Trigger 6 Interrupt 7 Interface Trigger 7 Figure 17-1 shows a block diagram of the PIT module. Bus Clock 8-Bit Micro Timer 0 16-Bit Timer 0 16-Bit Timer 1 8-Bit Micro Timer 1 Micro Time Base 1 Time-Out 1 16-Bit Timer 2 Time-Out 2 16-Bit Timer 3 Time-Out 3 16-Bit Timer 4 Time-Out 4 16-Bit Timer 5 Time-Out 5 16-Bit Timer 6 Time-Out 6 16-Bit Timer 7 Time-Out 7 Figure 17-1. PIT24B8C Block Diagram 17.2 External Signal Description The PIT module has no external pins. MC9S12XE-Family Reference Manual , Rev. 1.21 658 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.3 Register Definition This section consists of register descriptions in address order of the PIT. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Register Name 0x0000 PITCFLMT 0x0001 PITFLT 0x0002 PITCE 0x0003 PITMUX 0x0004 PITINTE 0x0005 PITTF 0x0006 PITMTLD0 0x0007 PITMTLD1 0x0008 PITLD0 (High) 0x0009 PITLD0 (Low) R W R W R W R W R W R W R W R W R W R W Bit 7 PITE 0 PFLT7 PCE7 6 PITSWAI 0 PFLT6 PCE6 5 PITFRZ 0 PFLT5 PCE5 4 0 3 0 2 0 1 0 PFLMT1 0 PFLT4 PCE4 0 PFLT3 PCE3 0 PFLT2 PCE2 0 PFLT1 PCE1 Bit 0 0 PFLMT0 0 PFLT0 PCE0 PMUX7 PMUX6 PMUX5 PMUX4 PMUX3 PMUX2 PMUX1 PMUX0 PINTE7 PINTE6 PINTE5 PINTE4 PINTE3 PINTE2 PINTE1 PINTE0 PTF7 PTF6 PTF5 PTF4 PTF3 PTF2 PTF1 PTF0 PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0 PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x000A R PITCNT0 (High) W 0x000B R PITCNT0 (Low) W 0x000C PITLD1 (High) R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 = Unimplemented or Reserved Figure 17-2. PIT Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 659 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Register Name 0x000D PITLD1 (Low) R W Bit 7 PLD7 6 PLD6 5 PLD5 4 PLD4 3 PLD3 2 PLD2 1 PLD1 Bit 0 PLD0 0x000E R PITCNT1 (High) W R 0x000F PITCNT1 (Low) W 0x0010 PITLD2 (High) 0x0011 PITLD2 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0012 R PITCNT2 (High) W 0x0013 R PITCNT2 (Low) W 0x0014 PITLD3 (High) 0x0015 PITLD3 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0016 R PITCNT3 (High) W 0x0017 R PITCNT3 (Low) W 0x0018 PITLD4 (High) 0x0019 PITLD4 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x001A R PITCNT4 (High) W 0x001B R PITCNT4 (Low) W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 = Unimplemented or Reserved Figure 17-2. PIT Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 660 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Register Name 0x001C PITLD5 (High) 0x001D PITLD5 (Low) R W R W Bit 7 PLD15 6 PLD14 5 PLD13 4 PLD12 3 PLD11 2 PLD10 1 PLD9 Bit 0 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x001E R PITCNT5 (High) W 0x001F R PITCNT5 (Low) W 0x0020 PITLD6 (High) 0x0021 PITLD6 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0022 R PITCNT6 (High) W 0x0023 R PITCNT6 (Low) W 0x0024 PITLD7 (High) 0x0025 PITLD7 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0026 R PITCNT7 (High) W 0x0027 R PITCNT7 (Low) W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 = Unimplemented or Reserved Figure 17-2. PIT Register Summary (Sheet 3 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 661 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.3.0.1 PIT Control and Force Load Micro Timer Register (PITCFLMT) Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset PITE 0 PITSWAI 0 PITFRZ 0 0 0 0 0 0 0 0 PFLMT1 0 0 PFLMT0 0 = Unimplemented or Reserved Figure 17-3. PIT Control and Force Load Micro Timer Register (PITCFLMT) Read: Anytime Write: Anytime; writes to the reserved bits have no effect Table 17-2. PITCFLMT Field Descriptions Field 7 PITE Description PIT Module Enable Bit -- This bit enables the PIT module. If PITE is cleared, the PIT module is disabled and flag bits in the PITTF register are cleared. When PITE is set, individually enabled timers (PCE set) start downcounting with the corresponding load register values. 0 PIT disabled (lower power consumption). 1 PIT is enabled. PIT Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 PIT operates normally in wait mode 1 PIT clock generation stops and freezes the PIT module when in wait mode PIT Counter Freeze while in Freeze Mode Bit -- When during debugging a breakpoint (freeze mode) is encountered it is useful in many cases to freeze the PIT counters to avoid e.g. interrupt generation. The PITFRZ bit controls the PIT operation while in freeze mode. 0 PIT operates normally in freeze mode 1 PIT counters are stalled when in freeze mode 6 PITSWAI 5 PITFRZ 1:0 PIT Force Load Bits for Micro Timer 1:0 -- These bits have only an effect if the corresponding micro timer is PFLMT[1:0] active and if the PIT module is enabled (PITE set). Writing a one into a PFLMT bit loads the corresponding 8-bit micro timer load register into the 8-bit micro timer down-counter. Writing a zero has no effect. Reading these bits will always return zero. Note: A micro timer force load affects all timer channels that use the corresponding micro time base. 17.3.0.2 PIT Force Load Timer Register (PITFLT) Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset 0 PFLT7 0 0 PFLT6 0 0 PFLT5 0 0 PFLT4 0 0 PFLT3 0 0 PFLT2 0 0 PFLT1 0 0 PFLT0 0 Figure 17-4. PIT Force Load Timer Register (PITFLT) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 662 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Table 17-3. PITFLT Field Descriptions Field 7:0 PFLT[7:0] Description PIT Force Load Bits for Timer 7-0 -- These bits have only an effect if the corresponding timer channel (PCE set) is enabled and if the PIT module is enabled (PITE set). Writing a one into a PFLT bit loads the corresponding 16-bit timer load register into the 16-bit timer down-counter. Writing a zero has no effect. Reading these bits will always return zero. 17.3.0.3 PIT Channel Enable Register (PITCE) 7 6 5 4 3 2 1 0 Module Base + 0x0002 R W Reset PCE7 0 PCE6 0 PCE5 0 PCE4 0 PCE3 0 PCE2 0 PCE1 0 PCE0 0 Figure 17-5. PIT Channel Enable Register (PITCE) Read: Anytime Write: Anytime Table 17-4. PITCE Field Descriptions Field 7:0 PCE[7:0] Description PIT Enable Bits for Timer Channel 7:0 -- These bits enable the PIT channels 7-0. If PCE is cleared, the PIT channel is disabled and the corresponding flag bit in the PITTF register is cleared. When PCE is set, and if the PIT module is enabled (PITE = 1) the 16-bit timer counter is loaded with the start count value and starts downcounting. 0 The corresponding PIT channel is disabled. 1 The corresponding PIT channel is enabled. 17.3.0.4 PIT Multiplex Register (PITMUX) 7 6 5 4 3 2 1 0 Module Base + 0x0003 R W Reset PMUX7 0 PMUX6 0 PMUX5 0 PMUX4 0 PMUX3 0 PMUX2 0 PMUX1 0 PMUX0 0 Figure 17-6. PIT Multiplex Register (PITMUX) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 663 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Table 17-5. PITMUX Field Descriptions Field 7:0 PMUX[7:0] Description PIT Multiplex Bits for Timer Channel 7:0 -- These bits select if the corresponding 16-bit timer is connected to micro time base 1 or 0. If PMUX is modified, the corresponding 16-bit timer is immediately switched to the other micro time base. 0 The corresponding 16-bit timer counts with micro time base 0. 1 The corresponding 16-bit timer counts with micro time base 1. 17.3.0.5 PIT Interrupt Enable Register (PITINTE) 7 6 5 4 3 2 1 0 Module Base + 0x0004 R W Reset PINTE7 0 PINTE6 0 PINTE5 0 PINTE4 0 PINTE3 0 PINTE2 0 PINTE1 0 PINTE0 0 Figure 17-7. PIT Interrupt Enable Register (PITINTE) Read: Anytime Write: Anytime Table 17-6. PITINTE Field Descriptions Field 7:0 PINTE[7:0] Description PIT Time-out Interrupt Enable Bits for Timer Channel 7:0 -- These bits enable an interrupt service request whenever the time-out flag PTF of the corresponding PIT channel is set. When an interrupt is pending (PTF set) enabling the interrupt will immediately cause an interrupt. To avoid this, the corresponding PTF flag has to be cleared first. 0 Interrupt of the corresponding PIT channel is disabled. 1 Interrupt of the corresponding PIT channel is enabled. 17.3.0.6 PIT Time-Out Flag Register (PITTF) 7 6 5 4 3 2 1 0 Module Base + 0x0005 R W Reset PTF7 0 PTF6 0 PTF5 0 PTF4 0 PTF3 0 PTF2 0 PTF1 0 PTF0 0 Figure 17-8. PIT Time-Out Flag Register (PITTF) Read: Anytime Write: Anytime (write to clear) MC9S12XE-Family Reference Manual , Rev. 1.21 664 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Table 17-7. PITTF Field Descriptions Field 7:0 PTF[7:0] Description PIT Time-out Flag Bits for Timer Channel 7:0 -- PTF is set when the corresponding 16-bit timer modulus down-counter and the selected 8-bit micro timer modulus down-counter have counted to zero. The flag can be cleared by writing a one to the flag bit. Writing a zero has no effect. If flag clearing by writing a one and flag setting happen in the same bus clock cycle, the flag remains set. The flag bits are cleared if the PIT module is disabled or if the corresponding timer channel is disabled. 0 Time-out of the corresponding PIT channel has not yet occurred. 1 Time-out of the corresponding PIT channel has occurred. 17.3.0.7 PIT Micro Timer Load Register 0 to 1 (PITMTLD0-1) 7 6 5 4 3 2 1 0 Module Base + 0x0006 R W Reset PMTLD7 0 PMTLD6 0 PMTLD5 0 PMTLD4 0 PMTLD3 0 PMTLD2 0 PMTLD1 0 PMTLD0 0 Figure 17-9. PIT Micro Timer Load Register 0 (PITMTLD0) Module Base + 0x0007 7 6 5 4 3 2 1 0 R W Reset PMTLD7 0 PMTLD6 0 PMTLD5 0 PMTLD4 0 PMTLD3 0 PMTLD2 0 PMTLD1 0 PMTLD0 0 Figure 17-10. PIT Micro Timer Load Register 1 (PITMTLD1) Read: Anytime Write: Anytime Table 17-8. PITMTLD0-1 Field Descriptions Field Description 7:0 PIT Micro Timer Load Bits 7:0 -- These bits set the 8-bit modulus down-counter load value of the micro timers. PMTLD[7:0] Writing a new value into the PITMTLD register will not restart the timer. When the micro timer has counted down to zero, the PMTLD register value will be loaded. The PFLMT bits in the PITCFLMT register can be used to immediately update the count register with the new value if an immediate load is desired. 17.3.0.8 PIT Load Register 0 to 7 (PITLD0-7) Module Base + 0x0008, 0x0009 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-11. PIT Load Register 0 (PITLD0) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 665 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Module Base + 0x000C, 0x000D 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-12. PIT Load Register 1 (PITLD1) Module Base + 0x0010, 0x0011 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-13. PIT Load Register 2 (PITLD2) Module Base + 0x0014, 0x0015 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-14. PIT Load Register 3 (PITLD3) Module Base + 0x0018, 0x0019 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-15. PIT Load Register 4 (PITLD4) Module Base + 0x001C, 0x001D 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-16. PIT Load Register 5 (PITLD5) Module Base + 0x0020, 0x0021 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-17. PIT Load Register 6 (PITLD6) MC9S12XE-Family Reference Manual , Rev. 1.21 666 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Module Base + 0x0024, 0x0025 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-18. PIT Load Register 7 (PITLD7) Read: Anytime Write: Anytime Table 17-9. PITLD0-7 Field Descriptions Field 15:0 PLD[15:0] Description PIT Load Bits 15:0 -- These bits set the 16-bit modulus down-counter load value. Writing a new value into the PITLD register must be a 16-bit access, to ensure data consistency. It will not restart the timer. When the timer has counted down to zero the PTF time-out flag will be set and the register value will be loaded. The PFLT bits in the PITFLT register can be used to immediately update the count register with the new value if an immediate load is desired. 17.3.0.9 PIT Count Register 0 to 7 (PITCNT0-7) Module Base + 0x000A, 0x000B 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-19. PIT Count Register 0 (PITCNT0) Module Base + 0x000E, 0x000F 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-20. PIT Count Register 1 (PITCNT1) Module Base + 0x0012, 0x0013 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-21. PIT Count Register 2 (PITCNT2) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 667 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Module Base + 0x0016, 0x0017 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 W R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Reset Figure 17-22. PIT Count Register 3 (PITCNT3) Module Base + 0x001A, 0x001B 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-23. PIT Count Register 4 (PITCNT4) Module Base + 0x001E, 0x001F 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-24. PIT Count Register 5 (PITCNT5) Module Base + 0x0022, 0x0023 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-25. PIT Count Register 6 (PITCNT6) Module Base + 0x0026, 0x0027 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17-26. PIT Count Register 7 (PITCNT7) Read: Anytime Write: Has no meaning or effect Table 17-10. PITCNT0-7 Field Descriptions Field Description 15:0 PIT Count Bits 15-0 -- These bits represent the current 16-bit modulus down-counter value. The read access PCNT[15:0] for the count register must take place in one clock cycle as a 16-bit access. MC9S12XE-Family Reference Manual , Rev. 1.21 668 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.4 Functional Description Figure 17-27 shows a detailed block diagram of the PIT module. The main parts of the PIT are status, control and data registers, two 8-bit down-counters, eight 16-bit down-counters and an interrupt/trigger interface. 8 PITFLT Register 8 PITMUX Register PFLT0 PMUX0 Timer 0 PITLD0 Register PITCNT0 Register PFLT1 PIT24B8C time-out 0 Bus Clock [0] PITMLD0 Register 8-Bit Micro Timer 0 PMUX [1] Timer 1 PITLD1 Register PITCNT1 Register time-out 1 PFLT2 [2] Timer 2 PITLD2 Register PITCNT2 Register PFLT3 [3] Timer 3 PITLD3 Register PITCNT3 Register PFLT4 [4] Timer 4 PITLD4 Register PITCNT4 Register PFLT5 [5] Timer 5 PITLD5 Register PITCNT5 Register PFLT6 [6] Timer 6 PITLD6 Register PITCNT6 Register PFLT7 [7] time-out 6 time-out 5 timeout 4 PITINTE Register time-out 2 PITMLD1 Register 8-Bit Micro Timer 1 [1] PITCFLMT Register PFLMT timeout 3 Interrupt / Trigger Interface 8 Hardware Trigger PITTF Register 8 Interrupt Request PMUX7 Timer 7 PITLD7 Register PITCNT7 Register time-out 7 Figure 17-27. PIT24B8C Detailed Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 669 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.4.1 Timer As shown in Figure 17-1 and Figure 17-27, the 24-bit timers are built in a two-stage architecture with eight 16-bit modulus down-counters and two 8-bit modulus down-counters. The 16-bit timers are clocked with two selectable micro time bases which are generated with 8-bit modulus down-counters. Each 16-bit timer is connected to micro time base 0 or 1 via the PMUX[7:0] bit setting in the PIT Multiplex (PITMUX) register. A timer channel is enabled if the module enable bit PITE in the PIT control and force load micro timer (PITCFLMT) register is set and if the corresponding PCE bit in the PIT channel enable (PITCE) register is set. Two 8-bit modulus down-counters are used to generate two micro time bases. As soon as a micro time base is selected for an enabled timer channel, the corresponding micro timer modulus down-counter will load its start value as specified in the PITMTLD0 or PITMTLD1 register and will start down-counting. Whenever the micro timer down-counter has counted to zero the PITMTLD register is reloaded and the connected 16-bit modulus down-counters count one cycle. Whenever a 16-bit timer counter and the connected 8-bit micro timer counter have counted to zero, the PITLD register is reloaded and the corresponding time-out flag PTF in the PIT time-out flag (PITTF) register is set, as shown in Figure 17-28. The time-out period is a function of the timer load (PITLD) and micro timer load (PITMTLD) registers and the bus clock fBUS: time-out period = (PITMTLD + 1) * (PITLD + 1) / fBUS. For example, for a 40 MHz bus clock, the maximum time-out period equals: 256 * 65536 * 25 ns = 419.43 ms. The current 16-bit modulus down-counter value can be read via the PITCNT register. The micro timer down-counter values cannot be read. The 8-bit micro timers can individually be restarted by writing a one to the corresponding force load micro timer PFLMT bits in the PIT control and force load micro timer (PITCFLMT) register. The 16-bit timers can individually be restarted by writing a one to the corresponding force load timer PFLT bits in the PIT forceload timer (PITFLT) register. If desired, any group of timers and micro timers can be restarted at the same time by using one 16-bit write to the adjacent PITCFLMT and PITFLT registers with the relevant bits set, as shown in Figure 17-28. MC9S12XE-Family Reference Manual , Rev. 1.21 670 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) Bus Clock 8-Bit Micro Timer Counter PITCNT Register 0 2 1 0 2 1 0 2 1 0 2 1 2 1 0 2 1 0 2 1 0 2 00 0001 0000 0001 0000 0001 0000 0001 8-Bit Force Load 16-Bit Force Load PTF Flag1 PITTRIG Time-Out Period Note 1. The PTF flag clearing depends on the software Time-Out Period After Restart Figure 17-28. PIT Trigger and Flag Signal Timing 17.4.2 Interrupt Interface Each time-out event can be used to trigger an interrupt service request. For each timer channel, an individual bit PINTE in the PIT interrupt enable (PITINTE) register exists to enable this feature. If PINTE is set, an interrupt service is requested whenever the corresponding time-out flag PTF in the PIT time-out flag (PITTF) register is set. The flag can be cleared by writing a one to the flag bit. NOTE Be careful when resetting the PITE, PINTE or PITCE bits in case of pending PIT interrupt requests, to avoid spurious interrupt requests. 17.4.3 Hardware Trigger The PIT module contains eight hardware trigger signal lines PITTRIG[7:0], one for each timer channel. These signals can be connected on SoC level to peripheral modules enabling e.g. periodic ATD conversion (please refer to the device overview for the mapping of PITTRIG[7:0] signals to peripheral modules). Whenever a timer channel time-out is reached, the corresponding PTF flag is set and the corresponding trigger signal PITTRIG triggers a rising edge. The trigger feature requires a minimum time-out period of two bus clock cycles because the trigger is asserted high for at least one bus clock cycle. For load register values PITLD = 0x0001 and PITMTLD = 0x0002 the flag setting, trigger timing and a restart with force load is shown in Figure 17-28. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 671 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) 17.5 17.5.1 Initialization Startup Set the configuration registers before the PITE bit in the PITCFLMT register is set. Before PITE is set, the configuration registers can be written in arbitrary order. 17.5.2 Shutdown When the PITCE register bits, the PITINTE register bits or the PITE bit in the PITCFLMT register are cleared, the corresponding PIT interrupt flags are cleared. In case of a pending PIT interrupt request, a spurious interrupt can be generated. Two strategies, which avoid spurious interrupts, are recommended: 1. Reset the PIT interrupt flags only in an ISR. When entering the ISR, the I mask bit in the CCR is set automatically. The I mask bit must not be cleared before the PIT interrupt flags are cleared. 2. After setting the I mask bit with the SEI instruction, the PIT interrupt flags can be cleared. Then clear the I mask bit with the CLI instruction to re-enable interrupts. 17.5.3 Flag Clearing A flag is cleared by writing a one to the flag bit. Always use store or move instructions to write a one in certain bit positions. Do not use the BSET instructions. Do not use any C-constructs that compile to BSET instructions. "BSET flag_register, #mask" must not be used for flag clearing because BSET is a readmodify-write instruction which writes back the "bit-wise or" of the flag_register and the mask into the flag_register. BSET would clear all flag bits that were set, independent from the mask. For example, to clear flag bit 0 use: MOVB #$01,PITTF. 17.6 Application Information To get started quickly with the PIT24B8C module this section provides a small code example how to use the block. Please note that the example provided is only one specific case out of the possible configurations and implementations. Functionality: Generate an PIT interrupt on channel 0 every 500 PIT clock cycles. ORG LDS MOVW ; place the program into specific ; range (to be selected) RAMEND ; load stack pointer to top of RAM #CH0_ISR,VEC_PIT_CH0 ; Change value of channel 0 ISR adr CODESTART ; ******************** Start PIT Initialization ******************************************************* CLR MOVB CLR MOVB MOVW PITCFLMT #$01,PITCE PITMUX #$63,PITMTLD0 #$0004,PITLD0 ; disable PIT ; enable timer channel 0 ; ch0 connected to micro timer 0 ; micro time base 0 equals 100 clock cycles ; time base 0 eq. 5 micro time bases 0 =5*100 = 500 MC9S12XE-Family Reference Manual , Rev. 1.21 672 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) MOVB MOVB CLI #$01,PITINTE #$80,PITCFLMT ; enable interupt channel 0 ; enable PIT ; clear Interupt disable Mask bit ;******************** Main Program ************************************************************* MAIN: BRA * ; loop until interrupt ;******************** Channel 0 Interupt Routine *************************************************** CH0_ISR: LDAA MOVB RTI PITTF #$01,PITTF ; 8 bit read of PIT time out flags ; clear PIT channel 0 time out flag ; return to MAIN MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 673 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 17 Periodic Interrupt Timer (S12PIT24B8CV2) MC9S12XE-Family Reference Manual , Rev. 1.21 674 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Table 18-1. Revision History Revision Number V01.00 V01.01 Revision Date 28 Apr 2005 05 Jul 2005 18.6/18-688 Sections Affected - Initial Release - Added application section. - Removed table 1-1 Description of Changes 18.1 Introduction The period interrupt timer (PIT) is an array of 24-bit timers that can be used to trigger peripheral modules or raise periodic interrupts. Refer to Figure 18-1 for a simplified block diagram. 18.1.1 Glossary Acronyms and Abbreviations PIT ISR CCR SoC Periodic Interrupt Timer Interrupt Service Routine Condition Code Register System on Chip clock periods of the 16-bit timer modulus down-counters, which are generated by the 8-bit modulus down-counters. micro time bases 18.1.2 Features The PIT includes these features: * Four timers implemented as modulus down-counters with independent time-out periods. * Time-out periods selectable between 1 and 224 bus clock cycles. Time-out equals m*n bus clock cycles with 1 <= m <= 256 and 1 <= n <= 65536. * Timers that can be enabled individually. * Four time-out interrupts. * Four time-out trigger output signals available to trigger peripheral modules. * Start of timer channels can be aligned to each other. 18.1.3 Modes of Operation Refer to the device overview for a detailed explanation of the chip modes. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 675 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) * * * * Run mode This is the basic mode of operation. Wait mode PIT operation in wait mode is controlled by the PITSWAI bit located in the PITCFLMT register. In wait mode, if the bus clock is globally enabled and if the PITSWAI bit is clear, the PIT operates like in run mode. In wait mode, if the PITSWAI bit is set, the PIT module is stalled. Stop mode In full stop mode or pseudo stop mode, the PIT module is stalled. Freeze mode PIT operation in freeze mode is controlled by the PITFRZ bit located in the PITCFLMT register. In freeze mode, if the PITFRZ bit is clear, the PIT operates like in run mode. In freeze mode, if the PITFRZ bit is set, the PIT module is stalled. 18.1.4 Block Diagram Figure 18-1 shows a block diagram of the PIT module. Micro Time Base 0 Time-Out 0 Interrupt 0 Interface Trigger 0 Interrupt 1 Interface Trigger 1 Interrupt 2 Interface Trigger 2 Interrupt 3 Interface Trigger 3 Bus Clock 8-Bit Micro Timer 0 16-Bit Timer 0 16-Bit Timer 1 8-Bit Micro Timer 1 Micro Time Base 1 Time-Out 1 16-Bit Timer 2 Time-Out 2 16-Bit Timer 3 Time-Out 3 Figure 18-1. PIT24B4C Block Diagram 18.2 External Signal Description The PIT module has no external pins. 18.3 Register Definition This section consists of register descriptions in address order of the PIT. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. MC9S12XE-Family Reference Manual , Rev. 1.21 676 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Register Name 0x0000 PITCFLMT 0x0001 PITFLT 0x0002 PITCE 0x0003 PITMUX 0x0004 PITINTE 0x0005 PITTF 0x0006 PITMTLD0 0x0007 PITMTLD1 0x0008 PITLD0 (High) 0x0009 PITLD0 (Low) R W R W R W R W R W R W R W R W R W R W Bit 7 PITE 0 6 PITSWAI 0 5 PITFRZ 0 4 0 3 0 2 0 1 0 PFLMT1 Bit 0 0 PFLMT0 0 PFLT0 PCE0 0 0 PFLT3 0 PFLT2 PCE2 0 PFLT1 PCE1 0 0 0 0 PCE3 0 0 0 0 PMUX3 PMUX2 PMUX1 PMUX0 0 0 0 0 PINTE3 PINTE2 PINTE1 PINTE0 0 0 0 0 PTF3 PTF2 PTF1 PTF0 PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0 PMTLD7 PMTLD6 PMTLD5 PMTLD4 PMTLD3 PMTLD2 PMTLD1 PMTLD0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x000A R PITCNT0 (High) W 0x000B R PITCNT0 (Low) W 0x000C PITLD1 (High) 0x000D PITLD1 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x000E R PITCNT1 (High) W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 = Unimplemented or Reserved Figure 18-2. PIT Register Summary (Sheet 1 of 2) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 677 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Register Name 0x000F R PITCNT1 (Low) W 0x0010 PITLD2 (High) 0x0011 PITLD2 (Low) R W R W Bit 7 PCNT7 6 PCNT6 5 PCNT5 4 PCNT4 3 PCNT3 2 PCNT2 1 PCNT1 Bit 0 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0012 R PITCNT2 (High) W 0x0013 R PITCNT2 (Low) W 0x0014 PITLD3 (High) 0x0015 PITLD3 (Low) R W R W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 PCNT6 PCNT5 PCNT4 PCNT3 PCNT2 PCNT1 PCNT0 PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0x0016 R PITCNT3 (High) W 0x0017 R PITCNT3 (Low) W 0x0018-0x0027 R RESERVED W PCNT15 PCNT14 PCNT13 PCNT12 PCNT11 PCNT10 PCNT9 PCNT8 PCNT7 0 PCNT6 0 PCNT5 0 PCNT4 0 PCNT3 0 PCNT2 0 PCNT1 0 PCNT0 0 = Unimplemented or Reserved Figure 18-2. PIT Register Summary (Sheet 2 of 2) 18.3.0.1 PIT Control and Force Load Micro Timer Register (PITCFLMT) Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset PITE 0 PITSWAI 0 PITFRZ 0 0 0 0 0 0 0 0 PFLMT1 0 0 PFLMT0 0 = Unimplemented or Reserved Figure 18-3. PIT Control and Force Load Micro Timer Register (PITCFLMT) Read: Anytime Write: Anytime; writes to the reserved bits have no effect MC9S12XE-Family Reference Manual , Rev. 1.21 678 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Table 18-2. PITCFLMT Field Descriptions Field 7 PITE Description PIT Module Enable Bit -- This bit enables the PIT module. If PITE is cleared, the PIT module is disabled and flag bits in the PITTF register are cleared. When PITE is set, individually enabled timers (PCE set) start downcounting with the corresponding load register values. 0 PIT disabled (lower power consumption). 1 PIT is enabled. PIT Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 PIT operates normally in wait mode 1 PIT clock generation stops and freezes the PIT module when in wait mode PIT Counter Freeze while in Freeze Mode Bit -- When during debugging a breakpoint (freeze mode) is encountered it is useful in many cases to freeze the PIT counters to avoid e.g. interrupt generation. The PITFRZ bit controls the PIT operation while in freeze mode. 0 PIT operates normally in freeze mode 1 PIT counters are stalled when in freeze mode 6 PITSWAI 5 PITFRZ 1:0 PIT Force Load Bits for Micro Timer 1:0 -- These bits have only an effect if the corresponding micro timer is PFLMT[1:0] active and if the PIT module is enabled (PITE set). Writing a one into a PFLMT bit loads the corresponding 8-bit micro timer load register into the 8-bit micro timer down-counter. Writing a zero has no effect. Reading these bits will always return zero. Note: A micro timer force load affects all timer channels that use the corresponding micro time base. 18.3.0.2 PIT Force Load Timer Register (PITFLT) 7 6 5 4 3 2 1 0 Module Base + 0x0001 R W Reset 0 0 0 0 0 0 0 0 0 PFLT3 0 0 PFLT2 0 0 PFLT1 0 0 PFLT0 0 Figure 18-4. PIT Force Load Timer Register (PITFLT) Read: Anytime Write: Anytime Table 18-3. PITFLT Field Descriptions Field 3:0 PFLT[3:0] Description PIT Force Load Bits for Timer 3-0 -- These bits have only an effect if the corresponding timer channel (PCE set) is enabled and if the PIT module is enabled (PITE set). Writing a one into a PFLT bit loads the corresponding 16-bit timer load register into the 16-bit timer down-counter. Writing a zero has no effect. Reading these bits will always return zero. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 679 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.3.0.3 PIT Channel Enable Register (PITCE) 7 6 5 4 3 2 1 0 Module Base + 0x0002 R W Reset 0 0 0 0 0 0 0 0 PCE3 0 PCE2 0 PCE1 0 PCE0 0 Figure 18-5. PIT Channel Enable Register (PITCE) Read: Anytime Write: Anytime Table 18-4. PITCE Field Descriptions Field 3:0 PCE[3:0] Description PIT Enable Bits for Timer Channel 3:0 -- These bits enable the PIT channels 3-0. If PCE is cleared, the PIT channel is disabled and the corresponding flag bit in the PITTF register is cleared. When PCE is set, and if the PIT module is enabled (PITE = 1) the 16-bit timer counter is loaded with the start count value and starts downcounting. 0 The corresponding PIT channel is disabled. 1 The corresponding PIT channel is enabled. MC9S12XE-Family Reference Manual , Rev. 1.21 680 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.3.0.4 PIT Multiplex Register (PITMUX) 7 6 5 4 3 2 1 0 Module Base + 0x0003 R W Reset 0 0 0 0 0 0 0 0 PMUX3 0 PMUX2 0 PMUX1 0 PMUX0 0 Figure 18-6. PIT Multiplex Register (PITMUX) Read: Anytime Write: Anytime Table 18-5. PITMUX Field Descriptions Field 3:0 PMUX[3:0] Description PIT Multiplex Bits for Timer Channel 3:0 -- These bits select if the corresponding 16-bit timer is connected to micro time base 1 or 0. If PMUX is modified, the corresponding 16-bit timer is switched to the other micro time base immediately. 0 The corresponding 16-bit timer counts with micro time base 0. 1 The corresponding 16-bit timer counts with micro time base 1. 18.3.0.5 PIT Interrupt Enable Register (PITINTE) 7 6 5 4 3 2 1 0 Module Base + 0x0004 R W Reset 0 0 0 0 0 0 0 0 PINTE3 0 PINTE2 0 PINTE1 0 PINTE0 0 Figure 18-7. PIT Interrupt Enable Register (PITINTE) Read: Anytime Write: Anytime Table 18-6. PITINTE Field Descriptions Field 3:0 PINTE[3:0] Description PIT Time-out Interrupt Enable Bits for Timer Channel 3:0 -- These bits enable an interrupt service request whenever the time-out flag PTF of the corresponding PIT channel is set. When an interrupt is pending (PTF set) enabling the interrupt will immediately cause an interrupt. To avoid this, the corresponding PTF flag has to be cleared first. 0 Interrupt of the corresponding PIT channel is disabled. 1 Interrupt of the corresponding PIT channel is enabled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 681 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.3.0.6 PIT Time-Out Flag Register (PITTF) 7 6 5 4 3 2 1 0 Module Base + 0x0005 R W Reset 0 0 0 0 0 0 0 0 PTF3 0 PTF2 0 PTF1 0 PTF0 0 Figure 18-8. PIT Time-Out Flag Register (PITTF) Read: Anytime Write: Anytime (write to clear) Table 18-7. PITTF Field Descriptions Field 3:0 PTF[3:0] Description PIT Time-out Flag Bits for Timer Channel 3:0 -- PTF is set when the corresponding 16-bit timer modulus down-counter and the selected 8-bit micro timer modulus down-counter have counted to zero. The flag can be cleared by writing a one to the flag bit. Writing a zero has no effect. If flag clearing by writing a one and flag setting happen in the same bus clock cycle, the flag remains set. The flag bits are cleared if the PIT module is disabled or if the corresponding timer channel is disabled. 0 Time-out of the corresponding PIT channel has not yet occurred. 1 Time-out of the corresponding PIT channel has occurred. 18.3.0.7 PIT Micro Timer Load Register 0 to 1 (PITMTLD0-1) 7 6 5 4 3 2 1 0 Module Base + 0x0006 R W Reset PMTLD7 0 PMTLD6 0 PMTLD5 0 PMTLD4 0 PMTLD3 0 PMTLD2 0 PMTLD1 0 PMTLD0 0 Figure 18-9. PIT Micro Timer Load Register 0 (PITMTLD0) Module Base + 0x0007 7 6 5 4 3 2 1 0 R W Reset PMTLD7 0 PMTLD6 0 PMTLD5 0 PMTLD4 0 PMTLD3 0 PMTLD2 0 PMTLD1 0 PMTLD0 0 Figure 18-10. PIT Micro Timer Load Register 1 (PITMTLD1) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual , Rev. 1.21 682 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Table 18-8. PITMTLD0-1 Field Descriptions Field Description 7:0 PIT Micro Timer Load Bits 7:0 -- These bits set the 8-bit modulus down-counter load value of the micro timers. PMTLD[7:0] Writing a new value into the PITMTLD register will not restart the timer. When the micro timer has counted down to zero, the PMTLD register value will be loaded. The PFLMT bits in the PITCFLMT register can be used to immediately update the count register with the new value if an immediate load is desired. 18.3.0.8 PIT Load Register 0 to 3 (PITLD0-3) Module Base + 0x0008, 0x0009 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-11. PIT Load Register 0 (PITLD0) Module Base + 0x000C, 0x000D 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-12. PIT Load Register 1 (PITLD1) Module Base + 0x0010, 0x0011 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-13. PIT Load Register 2 (PITLD2) Module Base + 0x0014, 0x0015 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R W Reset PLD15 PLD14 PLD13 PLD12 PLD11 PLD10 PLD9 PLD8 PLD7 PLD6 PLD5 PLD4 PLD3 PLD2 PLD1 PLD0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-14. PIT Load Register 3 (PITLD3) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 683 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Table 18-9. PITLD0-3 Field Descriptions Field 15:0 PLD[15:0] Description PIT Load Bits 15:0 -- These bits set the 16-bit modulus down-counter load value. Writing a new value into the PITLD register must be a 16-bit access, to ensure data consistency. It will not restart the timer. When the timer has counted down to zero the PTF time-out flag will be set and the register value will be loaded. The PFLT bits in the PITFLT register can be used to immediately update the count register with the new value if an immediate load is desired. 18.3.0.9 PIT Count Register 0 to 3 (PITCNT0-3) Module Base + 0x000A, 0x000B 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-15. PIT Count Register 0 (PITCNT0) Module Base + 0x000E, 0x000F 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-16. PIT Count Register 1 (PITCNT1) Module Base + 0x0012, 0x0013 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-17. PIT Count Register 2 (PITCNT2) Module Base + 0x0016, 0x0017 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R PCNT PCNT PCNT PCNT PCNT PCNT PCN PCN PCN PCN PCN PCN PCN PCN PCN PCN 15 14 13 12 11 10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 18-18. PIT Count Register 3 (PITCNT3) Read: Anytime Write: Has no meaning or effect MC9S12XE-Family Reference Manual , Rev. 1.21 684 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Table 18-10. PITCNT0-3 Field Descriptions Field Description 15:0 PIT Count Bits 15-0 -- These bits represent the current 16-bit modulus down-counter value. The read access PCNT[15:0] for the count register must take place in one clock cycle as a 16-bit access. 18.4 Functional Description Figure 18-19 shows a detailed block diagram of the PIT module. The main parts of the PIT are status, control and data registers, two 8-bit down-counters, four 16-bit down-counters and an interrupt/trigger interface. 4 PITFLT Register 4 PITMUX Register PFLT1 Bus Clock [0] PMUX PFLT2 [2] Timer 2 PITLD2 Register PITCNT2 Register PFLT3 [3] Timer 3 PITLD3 Register PITCNT3 Register PITMLD0 Register 8-Bit Micro Timer 0 [1] Timer 1 PITLD1 Register PITCNT1 Register time-out 1 PFLT0 PMUX0 Timer 0 PITLD0 Register PITCNT0 Register time-out 0 PIT24B4C PITMLD1 Register 8-Bit Micro Timer 1 [1] PITCFLMT Register PFLMT timeout 3 Interrupt / Trigger Interface 4 Hardware Trigger PITTF Register timeout 3 4 PITINTE Register Interrupt Request Figure 18-19. PIT24B4C Detailed Block Diagram 18.4.1 Timer As shown in Figure 18-1 and Figure 18-19, the 24-bit timers are built in a two-stage architecture with four 16-bit modulus down-counters and two 8-bit modulus down-counters. The 16-bit timers are clocked with two selectable micro time bases which are generated with 8-bit modulus down-counters. Each 16-bit timer is connected to micro time base 0 or 1 via the PMUX[3:0] bit setting in the PIT Multiplex (PITMUX) register. A timer channel is enabled if the module enable bit PITE in the PIT control and force load micro timer (PITCFLMT) register is set and if the corresponding PCE bit in the PIT channel enable (PITCE) register is set. Two 8-bit modulus down-counters are used to generate two micro time bases. As soon as a micro time base is selected for an enabled timer channel, the corresponding micro timer modulus down-counter will load its start value as specified in the PITMTLD0 or PITMTLD1 register and will start down-counting. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 685 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) Whenever the micro timer down-counter has counted to zero the PITMTLD register is reloaded and the connected 16-bit modulus down-counters count one cycle. Whenever a 16-bit timer counter and the connected 8-bit micro timer counter have counted to zero, the PITLD register is reloaded and the corresponding time-out flag PTF in the PIT time-out flag (PITTF) register is set, as shown in Figure 18-20. The time-out period is a function of the timer load (PITLD) and micro timer load (PITMTLD) registers and the bus clock fBUS: time-out period = (PITMTLD + 1) * (PITLD + 1) / fBUS. For example, for a 40 MHz bus clock, the maximum time-out period equals: 256 * 65536 * 25 ns = 419.43 ms. The current 16-bit modulus down-counter value can be read via the PITCNT register. The micro timer down-counter values cannot be read. The 8-bit micro timers can individually be restarted by writing a one to the corresponding force load micro timer PFLMT bits in the PIT control and force load micro timer (PITCFLMT) register. The 16-bit timers can individually be restarted by writing a one to the corresponding force load timer PFLT bits in the PIT forceload timer (PITFLT) register. If desired, any group of timers and micro timers can be restarted at the same time by using one 16-bit write to the adjacent PITCFLMT and PITFLT registers with the relevant bits set, as shown in Figure 18-20. Bus Clock 8-Bit Micro Timer Counter PITCNT Register 0 2 1 0 2 1 0 2 1 0 2 1 2 1 0 2 1 0 2 1 0 2 00 0001 0000 0001 0000 0001 0000 0001 8-Bit Force Load 16-Bit Force Load PTF Flag1 PITTRIG Time-Out Period Note 1. The PTF flag clearing depends on the software Time-Out Period After Restart Figure 18-20. PIT Trigger and Flag Signal Timing MC9S12XE-Family Reference Manual , Rev. 1.21 686 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) 18.4.2 Interrupt Interface Each time-out event can be used to trigger an interrupt service request. For each timer channel, an individual bit PINTE in the PIT interrupt enable (PITINTE) register exists to enable this feature. If PINTE is set, an interrupt service is requested whenever the corresponding time-out flag PTF in the PIT time-out flag (PITTF) register is set. The flag can be cleared by writing a one to the flag bit. NOTE Be careful when resetting the PITE, PINTE or PITCE bits in case of pending PIT interrupt requests, to avoid spurious interrupt requests. 18.4.3 Hardware Trigger The PIT module contains four hardware trigger signal lines PITTRIG[3:0], one for each timer channel. These signals can be connected on SoC level to peripheral modules enabling e.g. periodic ATD conversion (please refer to the device overview for the mapping of PITTRIG[3:0] signals to peripheral modules). Whenever a timer channel time-out is reached, the corresponding PTF flag is set and the corresponding trigger signal PITTRIG triggers a rising edge. The trigger feature requires a minimum time-out period of two bus clock cycles because the trigger is asserted high for at least one bus clock cycle. For load register values PITLD = 0x0001 and PITMTLD = 0x0002 the flag setting, trigger timing and a restart with force load is shown in Figure 18-20. 18.5 18.5.1 Initialization Startup Set the configuration registers before the PITE bit in the PITCFLMT register is set. Before PITE is set, the configuration registers can be written in arbitrary order. 18.5.2 Shutdown When the PITCE register bits, the PITINTE register bits or the PITE bit in the PITCFLMT register are cleared, the corresponding PIT interrupt flags are cleared. In case of a pending PIT interrupt request, a spurious interrupt can be generated. Two strategies, which avoid spurious interrupts, are recommended: 1. Reset the PIT interrupt flags only in an ISR. When entering the ISR, the I mask bit in the CCR is set automatically. The I mask bit must not be cleared before the PIT interrupt flags are cleared. 2. After setting the I mask bit with the SEI instruction, the PIT interrupt flags can be cleared. Then clear the I mask bit with the CLI instruction to re-enable interrupts. 18.5.3 Flag Clearing A flag is cleared by writing a one to the flag bit. Always use store or move instructions to write a one in certain bit positions. Do not use the BSET instructions. Do not use any C-constructs that compile to BSET instructions. "BSET flag_register, #mask" must not be used for flag clearing because BSET is a read- MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 687 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 18 Periodic Interrupt Timer (S12PIT24B4CV2) modify-write instruction which writes back the "bit-wise or" of the flag_register and the mask into the flag_register. BSET would clear all flag bits that were set, independent from the mask. For example, to clear flag bit 0 use: MOVB #$01,PITTF. 18.6 Application Information To get started quickly with the PIT24B4C module this section provides a small code example how to use the block. Please note that the example provided is only one specific case out of the possible configurations and implementations. Functionality: Generate an PIT interrupt on channel 0 every 500 PIT clock cycles. ORG LDS MOVW CODESTART ; place the program into specific ; range (to be selected) RAMEND ; load stack pointer to top of RAM #CH0_ISR,VEC_PIT_CH0 ; Change value of channel 0 ISR adr ; ******************** Start PIT Initialization ******************************************************* CLR MOVB CLR MOVB MOVW MOVB MOVB CLI PITCFLMT #$01,PITCE PITMUX #$63,PITMTLD0 #$0004,PITLD0 #$01,PITINTE #$80,PITCFLMT ; disable PIT ; enable timer channel 0 ; ch0 connected to micro timer 0 ; micro time base 0 equals 100 clock cycles ; time base 0 eq. 5 micro time bases 0 =5*100 = 500 ; enable interupt channel 0 ; enable PIT ; clear Interupt disable Mask bit ;******************** Main Program ************************************************************* MAIN: BRA * ; loop until interrupt ;******************** Channel 0 Interupt Routine *************************************************** CH0_ISR: LDAA MOVB RTI PITTF #$01,PITTF ; 8 bit read of PIT time out flags ; clear PIT channel 0 time out flag ; return to MAIN MC9S12XE-Family Reference Manual , Rev. 1.21 688 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Table 19-1. Revision History Revision Number V01.17 Revision Date 08-01-2004 Sections Affected 19.6/19-719 19.3.2.15/19706 Description of Changes - Added clarification of PWMIF operation in STOP and WAIT mode. - Added notes on minimum pulse width of emergency shutdown signal. 19.1 Introduction The PWM definition is based on the HC12 PWM definitions. It contains the basic features from the HC11 with some of the enhancements incorporated on the HC12: center aligned output mode and four available clock sources.The PWM module has eight channels with independent control of left and center aligned outputs on each channel. Each of the eight channels has a programmable period and duty cycle as well as a dedicated counter. A flexible clock select scheme allows a total of four different clock sources to be used with the counters. Each of the modulators can create independent continuous waveforms with software-selectable duty rates from 0% to 100%. The PWM outputs can be programmed as left aligned outputs or center aligned outputs. 19.1.1 Features The PWM block includes these distinctive features: * Eight independent PWM channels with programmable period and duty cycle * Dedicated counter for each PWM channel * Programmable PWM enable/disable for each channel * Software selection of PWM duty pulse polarity for each channel * Period and duty cycle are double buffered. Change takes effect when the end of the effective period is reached (PWM counter reaches zero) or when the channel is disabled. * Programmable center or left aligned outputs on individual channels * Eight 8-bit channel or four 16-bit channel PWM resolution * Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies * Programmable clock select logic * Emergency shutdown MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 689 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.1.2 Modes of Operation There is a software programmable option for low power consumption in wait mode that disables the input clock to the prescaler. In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is useful for emulation. 19.1.3 Block Diagram Figure 19-1 shows the block diagram for the 8-bit 8-channel PWM block. PWM8B8C PWM Channels Channel 7 Period and Duty Channel 6 Counter PWM7 PWM6 Counter Bus Clock Clock Select PWM Clock Period and Duty Channel 5 Period and Duty Control Channel 4 Period and Duty Counter Counter PWM5 PWM4 Channel 3 Enable Period and Duty Counter PWM3 Polarity Channel 2 Period and Duty Counter PWM2 Alignment Channel 1 Period and Duty Channel 0 Period and Duty Counter Counter PWM1 PWM0 Figure 19-1. PWM Block Diagram 19.2 External Signal Description The PWM module has a total of 8 external pins. MC9S12XE-Family Reference Manual , Rev. 1.21 690 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.2.1 PWM7 -- PWM Channel 7 This pin serves as waveform output of PWM channel 7 and as an input for the emergency shutdown feature. 19.2.2 PWM6 -- PWM Channel 6 This pin serves as waveform output of PWM channel 6. 19.2.3 PWM5 -- PWM Channel 5 This pin serves as waveform output of PWM channel 5. 19.2.4 PWM4 -- PWM Channel 4 This pin serves as waveform output of PWM channel 4. 19.2.5 PWM3 -- PWM Channel 3 This pin serves as waveform output of PWM channel 3. 19.2.6 PWM3 -- PWM Channel 2 This pin serves as waveform output of PWM channel 2. 19.2.7 PWM3 -- PWM Channel 1 This pin serves as waveform output of PWM channel 1. 19.2.8 PWM3 -- PWM Channel 0 This pin serves as waveform output of PWM channel 0. 19.3 Memory Map and Register Definition This section describes in detail all the registers and register bits in the PWM module. The special-purpose registers and register bit functions that are not normally available to device end users, such as factory test control registers and reserved registers, are clearly identified by means of shading the appropriate portions of address maps and register diagrams. Notes explaining the reasons for restricting access to the registers and functions are also explained in the individual register descriptions. 19.3.1 Module Memory Map This section describes the content of the registers in the PWM module. The base address of the PWM module is determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the first address of the module address offset. The figure below shows the registers associated MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 691 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) with the PWM and their relative offset from the base address. The register detail description follows the order they appear in the register map. Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented functions are indicated by shading the bit. . NOTE Register Address = Base Address + Address Offset, where the Base Address is defined at the MCU level and the Address Offset is defined at the module level. 19.3.2 Register Descriptions This section describes in detail all the registers and register bits in the PWM module. Register Name 0x0000 PWME 0x0001 PWMPOL 0x0002 PWMCLK R W R W R W Bit 7 PWME7 6 PWME6 5 PWME5 4 PWME4 3 PWME3 2 PWME2 1 PWME1 Bit 0 PWME0 PPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0 PCLK7 0 PCLKL6 PCLK5 PCLK4 PCLK3 0 PCLK2 PCLK1 PCLK0 0x0003 R PWMPRCLK W 0x0004 PWMCAE 0x0005 PWMCTL R W R W PCKB2 PCKB1 PCKB0 PCKA2 PCKA1 PCKA0 CAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 0 CAE0 0 CON67 0 CON45 0 CON23 0 CON01 0 PSWAI 0 PFRZ 0 0x0006 R PWMTST(1) W 0x0007 R PWMPRSC1 W 0x0008 R PWMSCLA W 0x0009 R PWMSCLB W 0 0 0 0 0 0 0 0 0 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 = Unimplemented or Reserved Figure 19-2. PWM Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual , Rev. 1.21 692 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Register Name 0x000A R PWMSCNTA W 1 0x000B R PWMSCNTB W 1 0x000C R PWMCNT0 W 0x000D R PWMCNT1 W 0x000E R PWMCNT2 W 0x000F R PWMCNT3 W 0x0010 R PWMCNT4 W 0x0011 R PWMCNT5 W 0x0012 R PWMCNT6 W 0x0013 R PWMCNT7 W 0x0014 R PWMPER0 W 0x0015 R PWMPER1 W 0x0016 R PWMPER2 W 0x0017 R PWMPER3 W Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0 0 0 0 0 0 0 0 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 6 0 6 0 6 0 6 0 6 0 6 0 6 0 6 0 6 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 4 0 4 0 4 0 4 0 4 0 4 0 4 0 4 0 4 3 0 3 0 3 0 3 0 3 0 3 0 3 0 3 0 3 2 0 2 0 2 0 2 0 2 0 2 0 2 0 2 0 2 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 = Unimplemented or Reserved Figure 19-2. PWM Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 693 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Register Name 0x0018 R PWMPER4 W 0x0019 R PWMPER5 W 0x001A R PWMPER6 W 0x001B R PWMPER7 W 0x001C R PWMDTY0 W 0x001D R PWMDTY1 W 0x001E R PWMDTY2 W 0x001F R PWMDTY3 W 0x0010 R PWMDTY4 W 0x0021 R PWMDTY5 W 0x0022 R PWMDTY6 W 0x0023 R PWMDTY7 W 0x0024 PWMSDN R W Bit 7 Bit 7 6 6 5 5 4 4 3 3 2 2 1 1 Bit 0 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 4 3 2 1 Bit 0 Bit 7 6 5 0 PWMRSTRT 4 3 0 2 PWM7IN 1 Bit 0 PWMIF PWMIE PWMLVL PWM7INL PWM7ENA = Unimplemented or Reserved Figure 19-2. PWM Register Summary (Sheet 3 of 3) 1. Intended for factory test purposes only. 19.3.2.1 PWM Enable Register (PWME) Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM MC9S12XE-Family Reference Manual , Rev. 1.21 694 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. NOTE The first PWM cycle after enabling the channel can be irregular. An exception to this is when channels are concatenated. Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low order PWMEx bit.In this case, the high order bytes PWMEx bits have no effect and their corresponding PWM output lines are disabled. While in run mode, if all eight PWM channels are disabled (PWME7-0 = 0), the prescaler counter shuts off for power savings. Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset PWME7 0 PWME6 0 PWME5 0 PWME4 0 PWME3 0 PWME2 0 PWME1 0 PWME0 0 Figure 19-3. PWM Enable Register (PWME) Read: Anytime Write: Anytime Field 7 PWME7 Description Pulse Width Channel 7 Enable 0 Pulse width channel 7 is disabled. 1 Pulse width channel 7 is enabled. The pulse modulated signal becomes available at PWM output bit 7 when its clock source begins its next cycle. Pulse Width Channel 6 Enable 0 Pulse width channel 6 is disabled. 1 Pulse width channel 6 is enabled. The pulse modulated signal becomes available at PWM output bit6 when its clock source begins its next cycle. If CON67=1, then bit has no effect and PWM output line 6 is disabled. Pulse Width Channel 5 Enable 0 Pulse width channel 5 is disabled. 1 Pulse width channel 5 is enabled. The pulse modulated signal becomes available at PWM output bit 5 when its clock source begins its next cycle. Pulse Width Channel 4 Enable 0 Pulse width channel 4 is disabled. 1 Pulse width channel 4 is enabled. The pulse modulated signal becomes available at PWM, output bit 4 when its clock source begins its next cycle. If CON45 = 1, then bit has no effect and PWM output bit4 is disabled. Pulse Width Channel 3 Enable 0 Pulse width channel 3 is disabled. 1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when its clock source begins its next cycle. 6 PWME6 5 PWME5 4 PWME4 3 PWME3 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 695 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Field 2 PWME2 Description Pulse Width Channel 2 Enable 0 Pulse width channel 2 is disabled. 1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output bit2 is disabled. Pulse Width Channel 1 Enable 0 Pulse width channel 1 is disabled. 1 Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when its clock source begins its next cycle. Pulse Width Channel 0 Enable 0 Pulse width channel 0 is disabled. 1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line0 is disabled. 1 PWME1 0 PWME0 19.3.2.2 PWM Polarity Register (PWMPOL) The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the PWMPOL register. If the polarity bit is one, the PWM channel output is high at the beginning of the cycle and then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts low and then goes high when the duty count is reached. Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset PPOL7 0 PPOL6 0 PPOL5 0 PPOL4 0 PPOL3 0 PPOL2 0 PPOL1 0 PPOL0 0 Figure 19-4. PWM Polarity Register (PWMPOL) Read: Anytime Write: Anytime NOTE PPOLx register bits can be written anytime. If the polarity is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition Field 7-0 PPOL[7:0] Description Pulse Width Channel 7-0 Polarity Bits 0 PWM channel 7-0 outputs are low at the beginning of the period, then go high when the duty count is reached. 1 PWM channel 7-0 outputs are high at the beginning of the period, then go low when the duty count is reached. MC9S12XE-Family Reference Manual , Rev. 1.21 696 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.3.2.3 PWM Clock Select Register (PWMCLK) Each PWM channel has a choice of two clocks to use as the clock source for that channel as described below. Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset PCLK7 0 PCLKL6 0 PCLK5 0 PCLK4 0 PCLK3 0 PCLK2 0 PCLK1 0 PCLK0 0 Figure 19-5. PWM Clock Select Register (PWMCLK) Read: Anytime Write: Anytime NOTE Register bits PCLK0 to PCLK7 can be written anytime. If a clock select is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition. Field 7 PCLK7 6 PCLK6 5 PCLK5 4 PCLK4 3 PCLK3 2 PCLK2 1 PCLK1 0 PCLK0 Description Pulse Width Channel 7 Clock Select 0 Clock B is the clock source for PWM channel 7. 1 Clock SB is the clock source for PWM channel 7. Pulse Width Channel 6 Clock Select 0 Clock B is the clock source for PWM channel 6. 1 Clock SB is the clock source for PWM channel 6. Pulse Width Channel 5 Clock Select 0 Clock A is the clock source for PWM channel 5. 1 Clock SA is the clock source for PWM channel 5. Pulse Width Channel 4 Clock Select 0 Clock A is the clock source for PWM channel 4. 1 Clock SA is the clock source for PWM channel 4. Pulse Width Channel 3 Clock Select 0 Clock B is the clock source for PWM channel 3. 1 Clock SB is the clock source for PWM channel 3. Pulse Width Channel 2 Clock Select 0 Clock B is the clock source for PWM channel 2. 1 Clock SB is the clock source for PWM channel 2. Pulse Width Channel 1 Clock Select 0 Clock A is the clock source for PWM channel 1. 1 Clock SA is the clock source for PWM channel 1. Pulse Width Channel 0 Clock Select 0 Clock A is the clock source for PWM channel 0. 1 Clock SA is the clock source for PWM channel 0. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 697 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.3.2.4 PWM Prescale Clock Select Register (PWMPRCLK) This register selects the prescale clock source for clocks A and B independently. Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 PCKB2 0 PCKB1 0 PCKB0 0 0 0 PCKA2 0 PCKA1 0 PCKA0 0 = Unimplemented or Reserved Figure 19-6. PWM Prescale Clock Select Register (PWMPRCLK) Read: Anytime Write: Anytime NOTE PCKB2-0 and PCKA2-0 register bits can be written anytime. If the clock pre-scale is changed while a PWM signal is being generated, a truncated or stretched pulse can occur during the transition. Field 6-4 PCKB[2:0] 2-0 PCKA[2:0] s Description Prescaler Select for Clock B -- Clock B is one of two clock sources which can be used for channels 2, 3, 6, or 7. These three bits determine the rate of clock B, as shown in Table 19-2. Prescaler Select for Clock A -- Clock A is one of two clock sources which can be used for channels 0, 1, 4 or 5. These three bits determine the rate of clock A, as shown in Table 19-3. Table 19-2. Clock B Prescaler Selects PCKB2 0 0 0 0 1 1 1 1 PCKB1 0 0 1 1 0 0 1 1 PCKB0 0 1 0 1 0 1 0 1 Value of Clock B Bus clock Bus clock / 2 Bus clock / 4 Bus clock / 8 Bus clock / 16 Bus clock / 32 Bus clock / 64 Bus clock / 128 Table 19-3. Clock A Prescaler Selects PCKA2 0 0 0 0 1 1 1 PCKA1 0 0 1 1 0 0 1 PCKA0 0 1 0 1 0 1 0 Value of Clock A Bus clock Bus clock / 2 Bus clock / 4 Bus clock / 8 Bus clock / 16 Bus clock / 32 Bus clock / 64 MC9S12XE-Family Reference Manual , Rev. 1.21 698 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Table 19-3. Clock A Prescaler Selects (continued) PCKA2 1 PCKA1 1 PCKA0 1 Value of Clock A Bus clock / 128 19.3.2.5 PWM Center Align Enable Register (PWMCAE) The PWMCAE register contains eight control bits for the selection of center aligned outputs or left aligned outputs for each PWM channel. If the CAEx bit is set to a one, the corresponding PWM output will be center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. See Section 19.4.2.5, "Left Aligned Outputs" and Section 19.4.2.6, "Center Aligned Outputs" for a more detailed description of the PWM output modes. Module Base + 0x0004 7 6 5 4 3 2 1 0 R W Reset CAE7 0 CAE6 0 CAE5 0 CAE4 0 CAE3 0 CAE2 0 CAE1 0 CAE0 0 Figure 19-7. PWM Center Align Enable Register (PWMCAE) Read: Anytime Write: Anytime NOTE Write these bits only when the corresponding channel is disabled. Field 7-0 CAE[7:0] Description Center Aligned Output Modes on Channels 7-0 0 Channels 7-0 operate in left aligned output mode. 1 Channels 7-0 operate in center aligned output mode. 19.3.2.6 PWM Control Register (PWMCTL) The PWMCTL register provides for various control of the PWM module. Module Base + 0x0005 7 6 5 4 3 2 1 0 R W Reset CON67 0 CON45 0 CON23 0 CON01 0 PSWAI 0 PFRZ 0 0 0 0 0 = Unimplemented or Reserved Figure 19-8. PWM Control Register (PWMCTL) Read: Anytime Write: Anytime MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 699 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) There are three control bits for concatenation, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. When channels 6 and 7are concatenated, channel 6 registers become the high order bytes of the double byte channel. When channels 4 and 5 are concatenated, channel 4 registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated, channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high order bytes of the double byte channel. See Section 19.4.2.7, "PWM 16-Bit Functions" for a more detailed description of the concatenation PWM Function. NOTE Change these bits only when both corresponding channels are disabled. Field 7 CON67 Description Concatenate Channels 6 and 7 0 Channels 6 and 7 are separate 8-bit PWMs. 1 Channels 6 and 7 are concatenated to create one 16-bit PWM channel. Channel 6 becomes the high order byte and channel 7 becomes the low order byte. Channel 7 output pin is used as the output for this 16-bit PWM (bit 7 of port PWMP). Channel 7 clock select control-bit determines the clock source, channel 7 polarity bit determines the polarity, channel 7 enable bit enables the output and channel 7 center aligned enable bit determines the output mode. Concatenate Channels 4 and 5 0 Channels 4 and 5 are separate 8-bit PWMs. 1 Channels 4 and 5 are concatenated to create one 16-bit PWM channel. Channel 4 becomes the high order byte and channel 5 becomes the low order byte. Channel 5 output pin is used as the output for this 16-bit PWM (bit 5 of port PWMP). Channel 5 clock select control-bit determines the clock source, channel 5 polarity bit determines the polarity, channel 5 enable bit enables the output and channel 5 center aligned enable bit determines the output mode. Concatenate Channels 2 and 3 0 Channels 2 and 3 are separate 8-bit PWMs. 1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high order byte and channel 3 becomes the low order byte. Channel 3 output pin is used as the output for this 16-bit PWM (bit 3 of port PWMP). Channel 3 clock select control-bit determines the clock source, channel 3 polarity bit determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit determines the output mode. Concatenate Channels 0 and 1 0 Channels 0 and 1 are separate 8-bit PWMs. 1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high order byte and channel 1 becomes the low order byte. Channel 1 output pin is used as the output for this 16-bit PWM (bit 1 of port PWMP). Channel 1 clock select control-bit determines the clock source, channel 1 polarity bit determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit determines the output mode. 6 CON45 5 CON23 4 CON01 MC9S12XE-Family Reference Manual , Rev. 1.21 700 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Field 3 PSWAI Description PWM Stops in Wait Mode -- Enabling this bit allows for lower power consumption in wait mode by disabling the input clock to the prescaler. 0 Allow the clock to the prescaler to continue while in wait mode. 1 Stop the input clock to the prescaler whenever the MCU is in wait mode. PWM Counters Stop in Freeze Mode -- In freeze mode, there is an option to disable the input clock to the prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode, the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that once normal program flow is continued, the counters are re-enabled to simulate real-time operations. Since the registers can still be accessed in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode. 0 Allow PWM to continue while in freeze mode. 1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation. 2 PFREZ 19.3.2.7 Reserved Register (PWMTST) This register is reserved for factory testing of the PWM module and is not available in normal modes. Module Base + 0x0006 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 19-9. Reserved Register (PWMTST) Read: Always read $00 in normal modes Write: Unimplemented in normal modes NOTE Writing to this register when in special modes can alter the PWM functionality. 19.3.2.8 Reserved Register (PWMPRSC) This register is reserved for factory testing of the PWM module and is not available in normal modes. Module Base + 0x0007 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 19-10. Reserved Register (PWMPRSC) Read: Always read $00 in normal modes MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 701 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Write: Unimplemented in normal modes NOTE Writing to this register when in special modes can alter the PWM functionality. 19.3.2.9 PWM Scale A Register (PWMSCLA) PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two. Clock SA = Clock A / (2 * PWMSCLA) NOTE When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA). Module Base + 0x0008 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0 Figure 19-11. PWM Scale A Register (PWMSCLA) Read: Anytime Write: Anytime (causes the scale counter to load the PWMSCLA value) 19.3.2.10 PWM Scale B Register (PWMSCLB) PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two. Clock SB = Clock B / (2 * PWMSCLB) NOTE When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB). Module Base + 0x0009 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Bit 0 0 Figure 19-12. PWM Scale B Register (PWMSCLB) MC9S12XE-Family Reference Manual , Rev. 1.21 702 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Read: Anytime Write: Anytime (causes the scale counter to load the PWMSCLB value). 19.3.2.11 Reserved Registers (PWMSCNTx) The registers PWMSCNTA and PWMSCNTB are reserved for factory testing of the PWM module and are not available in normal modes. Module Base + 0x000A, 0x000B 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 19-13. Reserved Registers (PWMSCNTx) Read: Always read $00 in normal modes Write: Unimplemented in normal modes NOTE Writing to these registers when in special modes can alter the PWM functionality. 19.3.2.12 PWM Channel Counter Registers (PWMCNTx) Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source. The counter can be read at any time without affecting the count or the operation of the PWM channel. In left aligned output mode, the counter counts from 0 to the value in the period register - 1. In center aligned output mode, the counter counts from 0 up to the value in the period register and then back down to 0. Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. The counter is also cleared at the end of the effective period (see Section 19.4.2.5, "Left Aligned Outputs" and Section 19.4.2.6, "Center Aligned Outputs" for more details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the PWMCNTx register. For more detailed information on the operation of the counters, see Section 19.4.2.4, "PWM Timer Counters". In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 703 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur. Module Base + 0x000C = PWMCNT0, 0x000D = PWMCNT1, 0x000E = PWMCNT2, 0x000F = PWMCNT3 Module Base + 0x0010 = PWMCNT4, 0x0011 = PWMCNT5, 0x0012 = PWMCNT6, 0x0013 = PWMCNT7 7 6 5 4 3 2 1 0 R W Reset Bit 7 0 0 6 0 0 5 0 0 4 0 0 3 0 0 2 0 0 1 0 0 Bit 0 0 0 Figure 19-14. PWM Channel Counter Registers (PWMCNTx) Read: Anytime Write: Anytime (any value written causes PWM counter to be reset to $00). 19.3.2.13 PWM Channel Period Registers (PWMPERx) There is a dedicated period register for each channel. The value in this register determines the period of the associated PWM channel. The period registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to $00) * The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active period due to the double buffering scheme. See Section 19.4.2.3, "PWM Period and Duty" for more information. To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA, or SB) and multiply it by the value in the period register for that channel: * Left aligned output (CAEx = 0) * PWMx Period = Channel Clock Period * PWMPERx Center Aligned Output (CAEx = 1) PWMx Period = Channel Clock Period * (2 * PWMPERx) For boundary case programming values, please refer to Section 19.4.2.8, "PWM Boundary Cases". MC9S12XE-Family Reference Manual , Rev. 1.21 704 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Module Base + 0x0014 = PWMPER0, 0x0015 = PWMPER1, 0x0016 = PWMPER2, 0x0017 = PWMPER3 Module Base + 0x0018 = PWMPER4, 0x0019 = PWMPER5, 0x001A = PWMPER6, 0x001B = PWMPER7 7 6 5 4 3 2 1 0 R W Reset Bit 7 1 6 1 5 1 4 1 3 1 2 1 1 1 Bit 0 1 Figure 19-15. PWM Channel Period Registers (PWMPERx) Read: Anytime Write: Anytime 19.3.2.14 PWM Channel Duty Registers (PWMDTYx) There is a dedicated duty register for each channel. The value in this register determines the duty of the associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value a match occurs and the output changes state. The duty registers for each channel are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * The effective period ends * The counter is written (counter resets to $00) * The channel is disabled In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform, not some variation in between. If the channel is not enabled, then writes to the duty register will go directly to the latches as well as the buffer. NOTE Reads of this register return the most recent value written. Reads do not necessarily return the value of the currently active duty due to the double buffering scheme. See Section 19.4.2.3, "PWM Period and Duty" for more information. NOTE Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time. If the polarity bit is one, the output starts high and then goes low when the duty count is reached, so the duty registers contain a count of the high time. If the polarity bit is zero, the output starts low and then goes high when the duty count is reached, so the duty registers contain a count of the low time. To calculate the output duty cycle (high time as a% of period) for a particular channel: * Polarity = 0 (PPOL x =0) Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% * Polarity = 1 (PPOLx = 1) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 705 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% For boundary case programming values, please refer to Section 19.4.2.8, "PWM Boundary Cases". Module Base + 0x001C = PWMDTY0, 0x001D = PWMDTY1, 0x001E = PWMDTY2, 0x001F = PWMDTY3 Module Base + 0x0020 = PWMDTY4, 0x0021 = PWMDTY5, 0x0022 = PWMDTY6, 0x0023 = PWMDTY7 7 6 5 4 3 2 1 0 R W Reset Bit 7 1 6 1 5 1 4 1 3 1 2 1 1 1 Bit 0 1 Figure 19-16. PWM Channel Duty Registers (PWMDTYx) Read: Anytime Write: Anytime 19.3.2.15 PWM Shutdown Register (PWMSDN) The PWMSDN register provides for the shutdown functionality of the PWM module in the emergency cases. For proper operation, channel 7 must be driven to the active level for a minimum of two bus clocks. Module Base + 0x0024 7 6 5 4 3 2 1 0 R W Reset PWMIF 0 PWMIE 0 0 PWMRSTRT 0 PWMLVL 0 0 0 PWM7IN 0 PWM7INL 0 PWM7ENA 0 = Unimplemented or Reserved Figure 19-17. PWM Shutdown Register (PWMSDN) Read: Anytime Write: Anytime Field 7 PWMIF Description PWM Interrupt Flag -- Any change from passive to asserted (active) state or from active to passive state will be flagged by setting the PWMIF flag = 1. The flag is cleared by writing a logic 1 to it. Writing a 0 has no effect. 0 No change on PWM7IN input. 1 Change on PWM7IN input PWM Interrupt Enable -- If interrupt is enabled an interrupt to the CPU is asserted. 0 PWM interrupt is disabled. 1 PWM interrupt is enabled. 6 PWMIE 5 PWM Restart -- The PWM can only be restarted if the PWM channel input 7 is de-asserted. After writing a logic PWMRSTRT 1 to the PWMRSTRT bit (trigger event) the PWM channels start running after the corresponding counter passes next "counter == 0" phase. Also, if the PWM7ENA bit is reset to 0, the PWM do not start before the counter passes $00. The bit is always read as "0". MC9S12XE-Family Reference Manual , Rev. 1.21 706 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Field 4 PWMLVL Description PWM Shutdown Output Level If active level as defined by the PWM7IN input, gets asserted all enabled PWM channels are immediately driven to the level defined by PWMLVL. 0 PWM outputs are forced to 0 1 Outputs are forced to 1. PWM Channel 7 Input Status -- This reflects the current status of the PWM7 pin. PWM Shutdown Active Input Level for Channel 7 -- If the emergency shutdown feature is enabled (PWM7ENA = 1), this bit determines the active level of the PWM7channel. 0 Active level is low 1 Active level is high PWM Emergency Shutdown Enable -- If this bit is logic 1, the pin associated with channel 7 is forced to input and the emergency shutdown feature is enabled. All the other bits in this register are meaningful only if PWM7ENA = 1. 0 PWM emergency feature disabled. 1 PWM emergency feature is enabled. 2 PWM7IN 1 PWM7INL 0 PWM7ENA 19.4 19.4.1 Functional Description PWM Clock Select There are four available clocks: clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These four clocks are based on the bus clock. Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the bus clock. Clock SA uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B as an input and divides it further with a reloadable counter. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock SB. Each PWM channel has the capability of selecting one of two clocks, either the pre-scaled clock (clock A or B) or the scaled clock (clock SA or SB). The block diagram in Figure 19-18 shows the four different clocks and how the scaled clocks are created. 19.4.1.1 Prescale The input clock to the PWM prescaler is the bus clock. It can be disabled whenever the part is in freeze mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode (freeze mode signal active) the input clock to the prescaler is disabled. This is useful for emulation in order to freeze the PWM. The input clock can also be disabled when all eight PWM channels are disabled (PWME7-0 = 0). This is useful for reducing power by disabling the prescale counter. Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock A and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the bus clock. The value selected for clock A is determined by the PCKA2, PCKA1, PCKA0 bits in the PWMPRCLK register. The value selected for clock B is determined by the PCKB2, PCKB1, PCKB0 bits also in the PWMPRCLK register. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 707 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.4.1.2 Clock Scale The scaled A clock uses clock A as an input and divides it further with a user programmable value and then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user programmable value and then divides this by 2. The rates available for clock SA are software selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock SB. MC9S12XE-Family Reference Manual , Rev. 1.21 708 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Clock A Clock A/2, A/4, A/6,....A/512 M U X PCLK0 M U X Clock to PWM Ch 0 PCKA2 PCKA1 PCKA0 8-Bit Down Counter Count = 1 Load PWMSCLA M U X 2 4 8 16 32 64 128 DIV 2 Clock SA Clock to PWM Ch 1 PCLK1 M U X PCLK2 M U X PCLK3 Clock to PWM Ch 3 Clock to PWM Ch 2 Divide by Prescaler Taps: Clock B Clock B/2, B/4, B/6,....B/512 M U X PCLK4 Clock to PWM Ch 4 M U X 8-Bit Down Counter Count = 1 Load PWMSCLB DIV 2 Clock SB M U X PCLK5 M U X PCLK6 M U X PCLK7 Clock to PWM Ch 5 Clock to PWM Ch 6 Bus Clock PFRZ Freeze Mode Signal PWME7-0 PCKB2 PCKB1 PCKB0 Clock to PWM Ch 7 Prescale Scale Clock Select Figure 19-18. PWM Clock Select Block Diagram Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale value from the scale register (PWMSCLA). When the down counter reaches one, a pulse is output and the MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 709 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 8-bit counter is re-loaded. The output signal from this circuit is further divided by two. This gives a greater range with only a slight reduction in granularity. Clock SA equals clock A divided by two times the value in the PWMSCLA register. NOTE Clock SA = Clock A / (2 * PWMSCLA) When PWMSCLA = $00, PWMSCLA value is considered a full scale value of 256. Clock A is thus divided by 512. Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register. NOTE Clock SB = Clock B / (2 * PWMSCLB) When PWMSCLB = $00, PWMSCLB value is considered a full scale value of 256. Clock B is thus divided by 512. As an example, consider the case in which the user writes $FF into the PWMSCLA register. Clock A for this case will be E divided by 4. A pulse will occur at a rate of once every 255x4 E cycles. Passing this through the divide by two circuit produces a clock signal at an E divided by 2040 rate. Similarly, a value of $01 in the PWMSCLA register when clock A is E divided by 4 will produce a clock at an E divided by 8 rate. Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded. Otherwise, when changing rates the counter would have to count down to $01 before counting at the proper rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or PWMSCLB is written prevents this. NOTE Writing to the scale registers while channels are operating can cause irregularities in the PWM outputs. 19.4.1.3 Clock Select Each PWM channel has the capability of selecting one of two clocks. For channels 0, 1, 4, and 5 the clock choices are clock A or clock SA. For channels 2, 3, 6, and 7 the choices are clock B or clock SB. The clock selection is done with the PCLKx control bits in the PWMCLK register. NOTE Changing clock control bits while channels are operating can cause irregularities in the PWM outputs. 19.4.2 PWM Channel Timers The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period register and a duty register (each are 8-bit). The waveform output period is controlled by a match between the period register and the value in the counter. The duty is controlled by a match between the duty register MC9S12XE-Family Reference Manual , Rev. 1.21 710 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) and the counter value and causes the state of the output to change during the period. The starting polarity of the output is also selectable on a per channel basis. Shown below in Figure 19-19 is the block diagram for the PWM timer. Clock Source 8-Bit Counter Gate (Clock Edge Sync) Up/Down Reset 8-bit Compare = T PWMDTYx R 8-bit Compare = PWMPERx PPOLx Q Q M U X M U X To Pin Driver PWMCNTx From Port PWMP Data Register Q Q T R CAEx PWMEx Figure 19-19. PWM Timer Channel Block Diagram 19.4.2.1 PWM Enable Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual PWM waveform is not available on the associated PWM output until its clock source begins its next cycle due to the synchronization of PWMEx and the clock source. An exception to this is when channels are concatenated. Refer to Section 19.4.2.7, "PWM 16-Bit Functions" for more detail. NOTE The first PWM cycle after enabling the channel can be irregular. On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high. There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 711 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.4.2.2 PWM Polarity Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown on the block diagram as a mux select of either the Q output or the Q output of the PWM output flip flop. When one of the bits in the PWMPOL register is set, the associated PWM channel output is high at the beginning of the waveform, then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts low and then goes high when the duty count is reached. 19.4.2.3 PWM Period and Duty Dedicated period and duty registers exist for each channel and are double buffered so that if they change while the channel is enabled, the change will NOT take effect until one of the following occurs: * * * The effective period ends The counter is written (counter resets to $00) The channel is disabled In this way, the output of the PWM will always be either the old waveform or the new waveform, not some variation in between. If the channel is not enabled, then writes to the period and duty registers will go directly to the latches as well as the buffer. A change in duty or period can be forced into effect "immediately" by writing the new value to the duty and/or period registers and then writing to the counter. This forces the counter to reset and the new duty and/or period values to be latched. In addition, since the counter is readable, it is possible to know where the count is with respect to the duty value and software can be used to make adjustments NOTE When forcing a new period or duty into effect immediately, an irregular PWM cycle can occur. Depending on the polarity bit, the duty registers will contain the count of either the high time or the low time. 19.4.2.4 PWM Timer Counters Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (see Section 19.4.1, "PWM Clock Select" for the available clock sources and rates). The counter compares to two registers, a duty register and a period register as shown in Figure 19-19. When the PWM counter matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change state. A match between the PWM counter and the period register behaves differently depending on what output mode is selected as shown in Figure 19-19 and described in Section 19.4.2.5, "Left Aligned Outputs" and Section 19.4.2.6, "Center Aligned Outputs". Each channel counter can be read at anytime without affecting the count or the operation of the PWM channel. Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up, the immediate load of both duty and period registers with values from the buffers, and the output to change according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When a MC9S12XE-Family Reference Manual , Rev. 1.21 712 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the PWMCNTx register. This allows the waveform to continue where it left off when the channel is reenabled. When the channel is disabled, writing "0" to the period register will cause the counter to reset on the next selected clock. NOTE If the user wants to start a new "clean" PWM waveform without any "history" from the old waveform, the user must write to channel counter (PWMCNTx) prior to enabling the PWM channel (PWMEx = 1). Generally, writes to the counter are done prior to enabling a channel in order to start from a known state. However, writing a counter can also be done while the PWM channel is enabled (counting). The effect is similar to writing the counter when the channel is disabled, except that the new period is started immediately with the output set according to the polarity bit. NOTE Writing to the counter while the channel is enabled can cause an irregular PWM cycle to occur. The counter is cleared at the end of the effective period (see Section 19.4.2.5, "Left Aligned Outputs" and Section 19.4.2.6, "Center Aligned Outputs" for more details). Table 19-4. PWM Timer Counter Conditions Counter Clears ($00) When PWMCNTx register written to any value Effective period ends Counter Counts When PWM channel is enabled (PWMEx = 1). Counts from last value in PWMCNTx. Counter Stops When PWM channel is disabled (PWMEx = 0) 19.4.2.5 Left Aligned Outputs The PWM timer provides the choice of two types of outputs, left aligned or center aligned. They are selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the corresponding PWM output will be left aligned. In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two registers, a duty register and a period register as shown in the block diagram in Figure 19-19. When the PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to also change state. A match between the PWM counter and the period register resets the counter and the output flip-flop, as shown in Figure 19-19, as well as performing a load from the double buffer period and duty register to the associated registers, as described in Section 19.4.2.3, "PWM Period and Duty". The counter counts from 0 to the value in the period register - 1. NOTE Changing the PWM output mode from left aligned to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 713 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) PPOLx = 0 PPOLx = 1 PWMDTYx Period = PWMPERx Figure 19-20. PWM Left Aligned Output Waveform To calculate the output frequency in left aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register for that channel. * PWMx Frequency = Clock (A, B, SA, or SB) / PWMPERx * PWMx Duty Cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) * Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% As an example of a left aligned output, consider the following case: Clock Source = E, where E = 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx Frequency = 10 MHz/4 = 2.5 MHz PWMx Period = 400 ns PWMx Duty Cycle = 3/4 *100% = 75% The output waveform generated is shown in Figure 19-21. E = 100 ns Duty Cycle = 75% Period = 400 ns Figure 19-21. PWM Left Aligned Output Example Waveform 19.4.2.6 Center Aligned Outputs For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the corresponding PWM output will be center aligned. MC9S12XE-Family Reference Manual , Rev. 1.21 714 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is equal to $00. The counter compares to two registers, a duty register and a period register as shown in the block diagram in Figure 19-19. When the PWM counter matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change state. A match between the PWM counter and the period register changes the counter direction from an up-count to a down-count. When the PWM counter decrements and matches the duty register again, the output flip-flop changes state causing the PWM output to also change state. When the PWM counter decrements and reaches zero, the counter direction changes from a down-count back to an up-count and a load from the double buffer period and duty registers to the associated registers is performed, as described in Section 19.4.2.3, "PWM Period and Duty". The counter counts from 0 up to the value in the period register and then back down to 0. Thus the effective period is PWMPERx*2. NOTE Changing the PWM output mode from left aligned to center aligned output (or vice versa) while channels are operating can cause irregularities in the PWM output. It is recommended to program the output mode before enabling the PWM channel. PPOLx = 0 PPOLx = 1 PWMDTYx PWMPERx Period = PWMPERx*2 PWMDTYx PWMPERx Figure 19-22. PWM Center Aligned Output Waveform To calculate the output frequency in center aligned output mode for a particular channel, take the selected clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period register for that channel. * PWMx Frequency = Clock (A, B, SA, or SB) / (2*PWMPERx) * PWMx Duty Cycle (high time as a% of period): -- Polarity = 0 (PPOLx = 0) Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100% -- Polarity = 1 (PPOLx = 1) Duty Cycle = [PWMDTYx / PWMPERx] * 100% MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 715 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) As an example of a center aligned output, consider the following case: Clock Source = E, where E = 10 MHz (100 ns period) PPOLx = 0 PWMPERx = 4 PWMDTYx = 1 PWMx Frequency = 10 MHz/8 = 1.25 MHz PWMx Period = 800 ns PWMx Duty Cycle = 3/4 *100% = 75% Shown in Figure 19-23 is the output waveform generated. E = 100 ns E = 100 ns DUTY CYCLE = 75% PERIOD = 800 ns Figure 19-23. PWM Center Aligned Output Example Waveform 19.4.2.7 PWM 16-Bit Functions The PWM timer also has the option of generating 8-channels of 8-bits or 4-channels of 16-bits for greater PWM resolution. This 16-bit channel option is achieved through the concatenation of two 8-bit channels. The PWMCTL register contains four control bits, each of which is used to concatenate a pair of PWM channels into one 16-bit channel. Channels 6 and 7 are concatenated with the CON67 bit, channels 4 and 5 are concatenated with the CON45 bit, channels 2 and 3 are concatenated with the CON23 bit, and channels 0 and 1 are concatenated with the CON01 bit. NOTE Change these bits only when both corresponding channels are disabled. When channels 6 and 7 are concatenated, channel 6 registers become the high order bytes of the double byte channel, as shown in Figure 19-24. Similarly, when channels 4 and 5 are concatenated, channel 4 registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated, channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high order bytes of the double byte channel. When using the 16-bit concatenated mode, the clock source is determined by the low order 8-bit channel clock select control bits. That is channel 7 when channels 6 and 7 are concatenated, channel 5 when channels 4 and 5 are concatenated, channel 3 when channels 2 and 3 are concatenated, and channel 1 when channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low order 8-bit channel as also shown in Figure 19-24. The polarity of the resulting PWM output is controlled by the PPOLx bit of the corresponding low order 8-bit channel as well. MC9S12XE-Family Reference Manual , Rev. 1.21 716 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Clock Source 7 High PWMCNT6 Low PWCNT7 Period/Duty Compare PWM7 Clock Source 5 High PWMCNT4 Low PWCNT5 Period/Duty Compare PWM5 Clock Source 3 High PWMCNT2 Low PWCNT3 Period/Duty Compare PWM3 Clock Source 1 High PWMCNT0 Low PWCNT1 Period/Duty Compare PWM1 Figure 19-24. PWM 16-Bit Mode Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the low order PWMEx bit. In this case, the high order bytes PWMEx bits have no effect and their corresponding PWM output is disabled. In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by 16-bit access to maintain data coherency. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 717 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by the low order CAEx bit. The high order CAEx bit has no effect. Table 19-5 is used to summarize which channels are used to set the various control bits when in 16-bit mode. Table 19-5. 16-bit Concatenation Mode Summary CONxx CON67 CON45 CON23 CON01 PWMEx PWME7 PWME5 PWME3 PWME1 PPOLx PPOL7 PPOL5 PPOL3 PPOL1 PCLKx PCLK7 PCLK5 PCLK3 PCLK1 CAEx CAE7 CAE5 CAE3 CAE1 PWMx Output PWM7 PWM5 PWM3 PWM1 19.4.2.8 PWM Boundary Cases Table 19-6 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned or center aligned) and 8-bit (normal) or 16-bit (concatenation). Table 19-6. PWM Boundary Cases PWMDTYx $00 (indicates no duty) $00 (indicates no duty) XX XX >= PWMPERx PWMPERx >$00 >$00 $00(1) (indicates no period) $001 (indicates no period) XX PPOLx 1 0 1 0 1 0 PWMx Output Always low Always high Always high Always low Always high Always low >= PWMPERx XX 1. Counter = $00 and does not count. 19.5 Resets The reset state of each individual bit is listed within the Section 19.3.2, "Register Descriptions" which details the registers and their bit-fields. All special functions or modes which are initialized during or just following reset are described within this section. * The 8-bit up/down counter is configured as an up counter out of reset. * All the channels are disabled and all the counters do not count. MC9S12XE-Family Reference Manual , Rev. 1.21 718 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) 19.6 Interrupts The PWM module has only one interrupt which is generated at the time of emergency shutdown, if the corresponding enable bit (PWMIE) is set. This bit is the enable for the interrupt. The interrupt flag PWMIF is set whenever the input level of the PWM7 channel changes while PWM7ENA = 1 or when PWMENA is being asserted while the level at PWM7 is active. In stop mode or wait mode (with the PSWAI bit set), the emergency shutdown feature will drive the PWM outputs to their shutdown output levels but the PWMIF flag will not be set. A description of the registers involved and affected due to this interrupt is explained in Section 19.3.2.15, "PWM Shutdown Register (PWMSDN)". The PWM block only generates the interrupt and does not service it. The interrupt signal name is PWM interrupt signal. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 719 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 19 Pulse-Width Modulator (S12PWM8B8CV1) MC9S12XE-Family Reference Manual , Rev. 1.21 720 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Table 20-1. Revision History Version Number 05.01 05.02 05.03 05.04 Revision Date 04/16/2004 10/14/2005 12/25/2008 08/05/2009 Effective Date Author Description of Changes Update OR and PF flag description; Correct baud rate tolerance in 4.7.5.1 and 4.7.5.2; Clean up classification and NDA message banners Correct alternative registers address; Remove unavailable baud rate in Table1-16 remove redundancy comments in Figure1-2 fix typo, SCIBDL reset value be 0x04, not 0x00 20.1 Introduction This block guide provides an overview of the serial communication interface (SCI) module. The SCI allows asynchronous serial communications with peripheral devices and other CPUs. 20.1.1 Glossary IR: InfraRed IrDA: Infrared Design Associate IRQ: Interrupt Request LIN: Local Interconnect Network LSB: Least Significant Bit MSB: Most Significant Bit NRZ: Non-Return-to-Zero RZI: Return-to-Zero-Inverted RXD: Receive Pin SCI : Serial Communication Interface TXD: Transmit Pin MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 721 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.1.2 Features The SCI includes these distinctive features: * Full-duplex or single-wire operation * Standard mark/space non-return-to-zero (NRZ) format * Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths * 13-bit baud rate selection * Programmable 8-bit or 9-bit data format * Separately enabled transmitter and receiver * Programmable polarity for transmitter and receiver * Programmable transmitter output parity * Two receiver wakeup methods: -- Idle line wakeup -- Address mark wakeup * Interrupt-driven operation with eight flags: -- Transmitter empty -- Transmission complete -- Receiver full -- Idle receiver input -- Receiver overrun -- Noise error -- Framing error -- Parity error -- Receive wakeup on active edge -- Transmit collision detect supporting LIN -- Break Detect supporting LIN * Receiver framing error detection * Hardware parity checking * 1/16 bit-time noise detection 20.1.3 Modes of Operation The SCI functions the same in normal, special, and emulation modes. It has two low power modes, wait and stop modes. * Run mode * Wait mode * Stop mode MC9S12XE-Family Reference Manual , Rev. 1.21 722 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.1.4 Block Diagram Figure 20-1 is a high level block diagram of the SCI module, showing the interaction of various function blocks. SCI Data Register RXD Data In Infrared Decoder Receive Shift Register IDLE Receive RDRF/OR Interrupt Generation BRKD RXEDG BERR Transmit TDRE Interrupt Generation TC Receive & Wakeup Control SCI Interrupt Request Bus Clock Baud Rate Generator Data Format Control 1/16 Transmit Control Transmit Shift Register Infrared Encoder Data Out TXD SCI Data Register Figure 20-1. SCI Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 723 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.2 External Signal Description The SCI module has a total of two external pins. 20.2.1 TXD -- Transmit Pin The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high impedance anytime the transmitter is disabled. 20.2.2 RXD -- Receive Pin The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is ignored when the receiver is disabled and should be terminated to a known voltage. 20.3 Memory Map and Register Definition This section provides a detailed description of all the SCI registers. 20.3.1 Module Memory Map and Register Definition The memory map for the SCI module is given below in Figure 20-2. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the SCI module and the address offset for each register. MC9S12XE-Family Reference Manual , Rev. 1.21 724 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Writes to a reserved register locations do not have any effect and reads of these locations return a zero. Details of register bit and field function follow the register diagrams, in bit order. Register Name 0x0000 SCIBDH1 0x0001 SCIBDL1 0x0002 SCICR11 0x0000 SCIASR12 0x0001 SCIACR12 0x0002 SCIACR22 0x0003 SCICR2 0x0004 SCISR1 0x0005 SCISR2 0x0006 SCIDRH 0x0007 SCIDRL R W R W R W R W R W R W R W R W R W R W R W R7 T7 AMAP R8 0 0 TXPOL 0 RXPOL 0 BRK13 0 TXDIR 0 RAF TIE TDRE TCIE TC RIE RDRF ILIE IDLE TE OR Bit 7 IREN 6 TNP1 5 TNP0 4 SBR12 3 SBR11 2 SBR10 1 SBR9 Bit 0 SBR8 SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0 LOOPS SCISWAI 0 RSRC 0 M 0 WAKE 0 ILT PE PT RXEDGIF BERRV 0 BERRIF BKDIF RXEDGIE 0 0 0 0 0 BERRIE BKDIE 0 0 0 0 BERRM1 BERRM0 BKDFE RE NF RWU FE SBK PF T8 R6 T6 0 0 R5 T5 R4 T4 R3 T3 R2 T2 R1 T1 R0 T0 1.These registers are accessible if the AMAP bit in the SCISR2 register is set to zero. 2,These registers are accessible if the AMAP bit in the SCISR2 register is set to one. = Unimplemented or Reserved Figure 20-2. SCI Register Summary MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 725 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.1 SCI Baud Rate Registers (SCIBDH, SCIBDL) Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset IREN 0 TNP1 0 TNP0 0 SBR12 0 SBR11 0 SBR10 0 SBR9 0 SBR8 0 Figure 20-3. SCI Baud Rate Register (SCIBDH) Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset SBR7 0 SBR6 0 SBR5 0 SBR4 0 SBR3 0 SBR2 1 SBR1 0 SBR0 0 Figure 20-4. SCI Baud Rate Register (SCIBDL) Read: Anytime, if AMAP = 0. If only SCIBDH is written to, a read will not return the correct data until SCIBDL is written to as well, following a write to SCIBDH. Write: Anytime, if AMAP = 0. NOTE Those two registers are only visible in the memory map if AMAP = 0 (reset condition). The SCI baud rate register is used by to determine the baud rate of the SCI, and to control the infrared modulation/demodulation submodule. Table 20-2. SCIBDH and SCIBDL Field Descriptions Field 7 IREN 6:5 TNP[1:0] 4:0 7:0 SBR[12:0] Description Infrared Enable Bit -- This bit enables/disables the infrared modulation/demodulation submodule. 0 IR disabled 1 IR enabled Transmitter Narrow Pulse Bits -- These bits enable whether the SCI transmits a 1/16, 3/16, 1/32 or 1/4 narrow pulse. See Table 20-3. SCI Baud Rate Bits -- The baud rate for the SCI is determined by the bits in this register. The baud rate is calculated two different ways depending on the state of the IREN bit. The formulas for calculating the baud rate are: When IREN = 0 then, SCI baud rate = SCI bus clock / (16 x SBR[12:0]) When IREN = 1 then, SCI baud rate = SCI bus clock / (32 x SBR[12:1]) Note: The baud rate generator is disabled after reset and not started until the TE bit or the RE bit is set for the first time. The baud rate generator is disabled when (SBR[12:0] = 0 and IREN = 0) or (SBR[12:1] = 0 and IREN = 1). Note: Writing to SCIBDH has no effect without writing to SCIBDL, because writing to SCIBDH puts the data in a temporary location until SCIBDL is written to. MC9S12XE-Family Reference Manual , Rev. 1.21 726 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Table 20-3. IRSCI Transmit Pulse Width TNP[1:0] 11 10 01 00 Narrow Pulse Width 1/4 1/32 1/16 3/16 20.3.2.2 SCI Control Register 1 (SCICR1) Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset LOOPS 0 SCISWAI 0 RSRC 0 M 0 WAKE 0 ILT 0 PE 0 PT 0 Figure 20-5. SCI Control Register 1 (SCICR1) Read: Anytime, if AMAP = 0. Write: Anytime, if AMAP = 0. NOTE This register is only visible in the memory map if AMAP = 0 (reset condition). Table 20-4. SCICR1 Field Descriptions Field 7 LOOPS Description Loop Select Bit -- LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must be enabled to use the loop function. 0 Normal operation enabled 1 Loop operation enabled The receiver input is determined by the RSRC bit. SCI Stop in Wait Mode Bit -- SCISWAI disables the SCI in wait mode. 0 SCI enabled in wait mode 1 SCI disabled in wait mode Receiver Source Bit -- When LOOPS = 1, the RSRC bit determines the source for the receiver shift register input. See Table 20-5. 0 Receiver input internally connected to transmitter output 1 Receiver input connected externally to transmitter Data Format Mode Bit -- MODE determines whether data characters are eight or nine bits long. 0 One start bit, eight data bits, one stop bit 1 One start bit, nine data bits, one stop bit Wakeup Condition Bit -- WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the most significant bit position of a received data character or an idle condition on the RXD pin. 0 Idle line wakeup 1 Address mark wakeup 6 SCISWAI 5 RSRC 4 M 3 WAKE MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 727 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Table 20-4. SCICR1 Field Descriptions (continued) Field 2 ILT Description Idle Line Type Bit -- ILT determines when the receiver starts counting logic 1s as idle character bits. The counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the stop bit avoids false idle character recognition, but requires properly synchronized transmissions. 0 Idle character bit count begins after start bit 1 Idle character bit count begins after stop bit Parity Enable Bit -- PE enables the parity function. When enabled, the parity function inserts a parity bit in the most significant bit position. 0 Parity function disabled 1 Parity function enabled Parity Type Bit -- PT determines whether the SCI generates and checks for even parity or odd parity. With even parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an odd number of 1s clears the parity bit and an even number of 1s sets the parity bit. 1 Even parity 1 Odd parity 1 PE 0 PT Table 20-5. Loop Functions LOOPS 0 1 1 RSRC x 0 1 Normal operation Loop mode with transmitter output internally connected to receiver input Single-wire mode with TXD pin connected to receiver input Function MC9S12XE-Family Reference Manual , Rev. 1.21 728 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.3 SCI Alternative Status Register 1 (SCIASR1) Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset RXEDGIF 0 0 0 0 0 0 0 0 0 BERRV 0 BERRIF 0 BKDIF 0 = Unimplemented or Reserved Figure 20-6. SCI Alternative Status Register 1 (SCIASR1) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 20-6. SCIASR1 Field Descriptions Field 7 RXEDGIF Description Receive Input Active Edge Interrupt Flag -- RXEDGIF is asserted, if an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the RXD input occurs. RXEDGIF bit is cleared by writing a "1" to it. 0 No active receive on the receive input has occurred 1 An active edge on the receive input has occurred Bit Error Value -- BERRV reflects the state of the RXD input when the bit error detect circuitry is enabled and a mismatch to the expected value happened. The value is only meaningful, if BERRIF = 1. 0 A low input was sampled, when a high was expected 1 A high input reassembled, when a low was expected Bit Error Interrupt Flag -- BERRIF is asserted, when the bit error detect circuitry is enabled and if the value sampled at the RXD input does not match the transmitted value. If the BERRIE interrupt enable bit is set an interrupt will be generated. The BERRIF bit is cleared by writing a "1" to it. 0 No mismatch detected 1 A mismatch has occurred Break Detect Interrupt Flag -- BKDIF is asserted, if the break detect circuitry is enabled and a break signal is received. If the BKDIE interrupt enable bit is set an interrupt will be generated. The BKDIF bit is cleared by writing a "1" to it. 0 No break signal was received 1 A break signal was received 2 BERRV 1 BERRIF 0 BKDIF MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 729 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.4 SCI Alternative Control Register 1 (SCIACR1) Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset RXEDGIE 0 0 0 0 0 0 0 0 0 0 0 BERRIE 0 BKDIE 0 = Unimplemented or Reserved Figure 20-7. SCI Alternative Control Register 1 (SCIACR1) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 20-7. SCIACR1 Field Descriptions Field 7 RSEDGIE Description Receive Input Active Edge Interrupt Enable -- RXEDGIE enables the receive input active edge interrupt flag, RXEDGIF, to generate interrupt requests. 0 RXEDGIF interrupt requests disabled 1 RXEDGIF interrupt requests enabled Bit Error Interrupt Enable -- BERRIE enables the bit error interrupt flag, BERRIF, to generate interrupt requests. 0 BERRIF interrupt requests disabled 1 BERRIF interrupt requests enabled Break Detect Interrupt Enable -- BKDIE enables the break detect interrupt flag, BKDIF, to generate interrupt requests. 0 BKDIF interrupt requests disabled 1 BKDIF interrupt requests enabled 1 BERRIE 0 BKDIE MC9S12XE-Family Reference Manual , Rev. 1.21 730 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.5 SCI Alternative Control Register 2 (SCIACR2) Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 BERRM1 0 BERRM0 0 BKDFE 0 = Unimplemented or Reserved Figure 20-8. SCI Alternative Control Register 2 (SCIACR2) Read: Anytime, if AMAP = 1 Write: Anytime, if AMAP = 1 Table 20-8. SCIACR2 Field Descriptions Field Description 2:1 Bit Error Mode -- Those two bits determines the functionality of the bit error detect feature. See Table 20-9. BERRM[1:0] 0 BKDFE Break Detect Feature Enable -- BKDFE enables the break detect circuitry. 0 Break detect circuit disabled 1 Break detect circuit enabled Table 20-9. Bit Error Mode Coding BERRM1 0 0 1 1 BERRM0 0 1 0 1 Bit error detect circuit is disabled Receive input sampling occurs during the 9th time tick of a transmitted bit (refer to Figure 20-19) Receive input sampling occurs during the 13th time tick of a transmitted bit (refer to Figure 20-19) Reserved Function MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 731 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.6 SCI Control Register 2 (SCICR2) Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset TIE 0 TCIE 0 RIE 0 ILIE 0 TE 0 RE 0 RWU 0 SBK 0 Figure 20-9. SCI Control Register 2 (SCICR2) Read: Anytime Write: Anytime Table 20-10. SCICR2 Field Descriptions Field 7 TIE Description Transmitter Interrupt Enable Bit -- TIE enables the transmit data register empty flag, TDRE, to generate interrupt requests. 0 TDRE interrupt requests disabled 1 TDRE interrupt requests enabled Transmission Complete Interrupt Enable Bit -- TCIE enables the transmission complete flag, TC, to generate interrupt requests. 0 TC interrupt requests disabled 1 TC interrupt requests enabled Receiver Full Interrupt Enable Bit -- RIE enables the receive data register full flag, RDRF, or the overrun flag, OR, to generate interrupt requests. 0 RDRF and OR interrupt requests disabled 1 RDRF and OR interrupt requests enabled Idle Line Interrupt Enable Bit -- ILIE enables the idle line flag, IDLE, to generate interrupt requests. 0 IDLE interrupt requests disabled 1 IDLE interrupt requests enabled Transmitter Enable Bit -- TE enables the SCI transmitter and configures the TXD pin as being controlled by the SCI. The TE bit can be used to queue an idle preamble. 0 Transmitter disabled 1 Transmitter enabled Receiver Enable Bit -- RE enables the SCI receiver. 0 Receiver disabled 1 Receiver enabled Receiver Wakeup Bit -- Standby state 0 Normal operation. 1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes the receiver by automatically clearing RWU. Send Break Bit -- Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13 or 14 bits). 0 No break characters 1 Transmit break characters 6 TCIE 5 RIE 4 ILIE 3 TE 2 RE 1 RWU 0 SBK MC9S12XE-Family Reference Manual , Rev. 1.21 732 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.7 SCI Status Register 1 (SCISR1) The SCISR1 and SCISR2 registers provides inputs to the MCU for generation of SCI interrupts. Also, these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures require that the status register be read followed by a read or write to the SCI data register.It is permissible to execute other instructions between the two steps as long as it does not compromise the handling of I/O, but the order of operations is important for flag clearing. Module Base + 0x0004 7 6 5 4 3 2 1 0 R W Reset TDRE 1 TC 1 RDRF 0 IDLE 0 OR 0 NF 0 FE 0 PF 0 = Unimplemented or Reserved Figure 20-10. SCI Status Register 1 (SCISR1) Read: Anytime Write: Has no meaning or effect Table 20-11. SCISR1 Field Descriptions Field 7 TDRE Description Transmit Data Register Empty Flag -- TDRE is set when the transmit shift register receives a byte from the SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data register low (SCIDRL). 0 No byte transferred to transmit shift register 1 Byte transferred to transmit shift register; transmit data register empty Transmit Complete Flag -- TC is set low when there is a transmission in progress or when a preamble or break character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted.When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when data, preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and clear of the TC flag (transmission not complete). 0 Transmission in progress 1 No transmission in progress Receive Data Register Full Flag -- RDRF is set when the data in the receive shift register transfers to the SCI data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data register low (SCIDRL). 0 Data not available in SCI data register 1 Received data available in SCI data register Idle Line Flag -- IDLE is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M =1) appear on the receiver input. Once the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL). 0 Receiver input is either active now or has never become active since the IDLE flag was last cleared 1 Receiver input has become idle Note: When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag. 6 TC 5 RDRF 4 IDLE MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 733 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Table 20-11. SCISR1 Field Descriptions (continued) Field 3 OR Description Overrun Flag -- OR is set when software fails to read the SCI data register before the receive shift register receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected. Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low (SCIDRL). 0 No overrun 1 Overrun Note: OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of events occurs: 1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear); 2. Receive second frame without reading the first frame in the data register (the second frame is not received and OR flag is set); 3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register); 4. Read status register SCISR1 (returns RDRF clear and OR set). Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received. Noise Flag -- NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1), and then reading SCI data register low (SCIDRL). 0 No noise 1 Noise Framing Error Flag -- FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register low (SCIDRL). 0 No framing error 1 Framing error Parity Error Flag -- PF is set when the parity enable bit (PE) is set and the parity of the received data does not match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low (SCIDRL). 0 No parity error 1 Parity error 2 NF 1 FE 0 PF MC9S12XE-Family Reference Manual , Rev. 1.21 734 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.8 SCI Status Register 2 (SCISR2) Module Base + 0x0005 7 6 5 4 3 2 1 0 R W Reset AMAP 0 0 0 0 0 TXPOL 0 RXPOL 0 BRK13 0 TXDIR 0 RAF 0 = Unimplemented or Reserved Figure 20-11. SCI Status Register 2 (SCISR2) Read: Anytime Write: Anytime Table 20-12. SCISR2 Field Descriptions Field 7 AMAP Description Alternative Map -- This bit controls which registers sharing the same address space are accessible. In the reset condition the SCI behaves as previous versions. Setting AMAP=1 allows the access to another set of control and status registers and hides the baud rate and SCI control Register 1. 0 The registers labelled SCIBDH (0x0000),SCIBDL (0x0001), SCICR1 (0x0002) are accessible 1 The registers labelled SCIASR1 (0x0000),SCIACR1 (0x0001), SCIACR2 (0x00002) are accessible Transmit Polarity -- This bit control the polarity of the transmitted data. In NRZ format, a one is represented by a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for inverted polarity. 0 Normal polarity 1 Inverted polarity Receive Polarity -- This bit control the polarity of the received data. In NRZ format, a one is represented by a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for inverted polarity. 0 Normal polarity 1 Inverted polarity Break Transmit Character Length -- This bit determines whether the transmit break character is 10 or 11 bit respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit. 0 Break character is 10 or 11 bit long 1 Break character is 13 or 14 bit long Transmitter Pin Data Direction in Single-Wire Mode -- This bit determines whether the TXD pin is going to be used as an input or output, in the single-wire mode of operation. This bit is only relevant in the single-wire mode of operation. 0 TXD pin to be used as an input in single-wire mode 1 TXD pin to be used as an output in single-wire mode Receiver Active Flag -- RAF is set when the receiver detects a logic 0 during the RT1 time period of the start bit search. RAF is cleared when the receiver detects an idle character. 0 No reception in progress 1 Reception in progress 4 TXPOL 3 RXPOL 2 BRK13 1 TXDIR 0 RAF MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 735 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.3.2.9 SCI Data Registers (SCIDRH, SCIDRL) Module Base + 0x0006 7 6 5 4 3 2 1 0 R W Reset R8 0 T8 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 20-12. SCI Data Registers (SCIDRH) Module Base + 0x0007 7 6 5 4 3 2 1 0 R W Reset R7 T7 0 R6 T6 0 R5 T5 0 R4 T4 0 R3 T3 0 R2 T2 0 R1 T1 0 R0 T0 0 Figure 20-13. SCI Data Registers (SCIDRL) Read: Anytime; reading accesses SCI receive data register Write: Anytime; writing accesses SCI transmit data register; writing to R8 has no effect Table 20-13. SCIDRH and SCIDRL Field Descriptions Field SCIDRH 7 R8 SCIDRH 6 T8 SCIDRL 7:0 R[7:0] T[7:0] Description Received Bit 8 -- R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1). Transmit Bit 8 -- T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1). R7:R0 -- Received bits seven through zero for 9-bit or 8-bit data formats T7:T0 -- Transmit bits seven through zero for 9-bit or 8-bit formats NOTE If the value of T8 is the same as in the previous transmission, T8 does not have to be rewritten.The same value is transmitted until T8 is rewritten In 8-bit data format, only SCI data register low (SCIDRL) needs to be accessed. When transmitting in 9-bit data format and using 8-bit write instructions, write first to SCI data register high (SCIDRH), then SCIDRL. MC9S12XE-Family Reference Manual , Rev. 1.21 736 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4 Functional Description This section provides a complete functional description of the SCI block, detailing the operation of the design from the end user perspective in a number of subsections. Figure 20-14 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, serial communication between the CPU and remote devices, including other CPUs. The SCI transmitter and receiver operate independently, although they use the same baud rate generator. The CPU monitors the status of the SCI, writes the data to be transmitted, and processes received data. IREN SCI Data Register RXD Infrared Receive Decoder Ir_RXD SCRXD Receive Shift Register RE R16XCLK Receive and Wakeup Control RWU LOOPS RSRC M Baud Rate Generator WAKE Data Format Control ILT PE SBR12:SBR0 PT TCIE TE /16 Transmit Control LOOPS SBK RSRC T8 Transmit Shift Register SCI Data Register RXEDGIE Active Edge Detect Break Detect BKDIE TC TDRE TC TDRE SCI Interrupt Request R8 NF FE PF RAF IDLE RDRF OR RIE TIE RDRF/OR RXEDGIF BKDIF RXD BERRIE Infrared Transmit Encoder R32XCLK TNP[1:0] IREN BERRM[1:0] Ir_TXD TXD ILIE IDLE Bus Clock BKDFE SCTXD R16XCLK LIN Transmit BERRIF Collision Detect Figure 20-14. Detailed SCI Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 737 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.1 Infrared Interface Submodule This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer specification defines a half-duplex infrared communication link for exchange data. The full standard includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 Kbits/s and 115.2 Kbits/s. The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse for every zero bit. No pulse is transmitted for every one bit. When receiving data, the IR pulses should be detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit stream to be received by the SCI.The polarity of transmitted pulses and expected receive pulses can be inverted so that a direct connection can be made to external IrDA transceiver modules that uses active low pulses. The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in the infrared submodule in order to generate either 3/16, 1/16, 1/32 or 1/4 narrow pulses during transmission. The infrared block receives two clock sources from the SCI, R16XCLK and R32XCLK, which are configured to generate the narrow pulse width during transmission. The R16XCLK and R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the R16XCLK clock. 20.4.1.1 Infrared Transmit Encoder The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A narrow pulse is transmitted for a zero bit and no pulse for a one bit. The narrow pulse is sent in the middle of the bit with a duration of 1/32, 1/16, 3/16 or 1/4 of a bit time. A narrow high pulse is transmitted for a zero bit when TXPOL is cleared, while a narrow low pulse is transmitted for a zero bit when TXPOL is set. 20.4.1.2 Infrared Receive Decoder The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is expected for each zero received and no pulse is expected for each one received. A narrow high pulse is expected for a zero bit when RXPOL is cleared, while a narrow low pulse is expected for a zero bit when RXPOL is set. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared physical layer specification. 20.4.2 LIN Support This module provides some basic support for the LIN protocol. At first this is a break detect circuitry making it easier for the LIN software to distinguish a break character from an incoming data stream. As a further addition is supports a collision detection at the bit level as well as cancelling pending transmissions. MC9S12XE-Family Reference Manual , Rev. 1.21 738 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.3 Data Format The SCI uses the standard NRZ mark/space data format. When Infrared is enabled, the SCI uses RZI data format where zeroes are represented by light pulses and ones remain low. See Figure 20-15 below. 8-Bit Data Format (Bit M in SCICR1 Clear) Start Bit Possible Parity Bit Bit 6 Bit 7 STOP Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Next Start Bit Standard SCI Data Infrared SCI Data 9-Bit Data Format (Bit M in SCICR1 Set) Start Bit Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 POSSIBLE PARITY Bit Bit 8 STOP Bit NEXT START Bit Standard SCI Data Infrared SCI Data Figure 20-15. SCI Data Formats Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit. Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters. A frame with eight data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame with nine data bits has a total of 11 bits. Table 20-14. Example of 8-Bit Data Formats Start Bit 1 1 Data Bits 8 7 Address Bits 0 0 (1) Parity Bits 0 1 Stop Bit 1 1 0 1 1 7 1 1. The address bit identifies the frame as an address character. See Section 20.4.6.6, "Receiver Wakeup". When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it. A frame with nine data bits has a total of 11 bits. Table 20-15. Example of 9-Bit Data Formats Start Bit 1 1 1 Data Bits 9 8 8 Address Bits 0 0 1 (1) Parity Bits 0 1 0 Stop Bit 1 1 1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 739 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 1. The address bit identifies the frame as an address character. See Section 20.4.6.6, "Receiver Wakeup". 20.4.4 Baud Rate Generation A 13-bit modulus counter in the baud rate generator derives the baud rate for both the receiver and the transmitter. The value from 0 to 8191 written to the SBR12:SBR0 bits determines the bus clock divisor. The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL). The baud rate clock is synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the transmitter. The receiver has an acquisition rate of 16 samples per bit time. Baud rate generation is subject to one source of error: * Integer division of the bus clock may not give the exact target frequency. Table 20-16 lists some examples of achieving target baud rates with a bus clock frequency of 25 MHz. When IREN = 0 then, SCI baud rate = SCI bus clock / (16 * SCIBR[12:0]) Table 20-16. Baud Rates (Example: Bus Clock = 25 MHz) Bits SBR[12:0] 41 81 163 326 651 1302 2604 5208 Receiver Clock (Hz) 609,756.1 308,642.0 153,374.2 76,687.1 38,402.5 19,201.2 9600.6 4800.0 Transmitter Clock (Hz) 38,109.8 19,290.1 9585.9 4792.9 2400.2 1200.1 600.0 300.0 Target Baud Rate 38,400 19,200 9,600 4,800 2,400 1,200 600 300 Error (%) .76 .47 .16 .15 .01 .01 .00 .00 MC9S12XE-Family Reference Manual , Rev. 1.21 740 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.5 Transmitter Internal Bus Bus Clock Baud Divider / 16 SCI Data Registers SBR12:SBR0 Start Stop 11-Bit Transmit Register 8 MSB 7 6 5 4 3 2 1 0 TXPOL SCTXD M H L T8 Load from SCIDR Preamble (All 1s) Break (All 0s) LOOP CONTROL To Receiver PT TDRE IRQ Parity Generation TIE TDRE Shift Enable PE LOOPS RSRC Transmitter Control TC IRQ TC TCIE TE SBK BERRM[1:0] BERRIF BER IRQ TCIE Transmit Collision Detect SCTXD SCRXD (From Receiver) Figure 20-16. Transmitter Block Diagram 20.4.5.1 Transmitter Character Length The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8 in SCI data register high (SCIDRH) is the ninth bit (bit 8). 20.4.5.2 Character Transmission To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through the TXD pin, after it has prefaced them with a start bit and appended them with a stop bit. The SCI data registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the transmit shift register. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 741 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the buffer (SCIDRH/L) to the transmitter shift register.The transmit driver routine may respond to this flag by writing another byte to the Transmitter buffer (SCIDRH/SCIDRL), while the shift register is still shifting out the first byte. To initiate an SCI transmission: 1. Configure the SCI: a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud rate generator. Remember that the baud rate generator is disabled when the baud rate is zero. Writing to the SCIBDH has no effect without also writing to SCIBDL. b) Write to SCICR1 to configure word length, parity, and other configuration bits (LOOPS,RSRC,M,WAKE,ILT,PE,PT). c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2 register bits (TIE,TCIE,RIE,ILIE,TE,RE,RWU,SBK). A preamble or idle character will now be shifted out of the transmitter shift register. 2. Transmit Procedure for each byte: a) Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind that the TDRE bit resets to one. b) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not result until the TDRE flag has been cleared. 3. Repeat step 2 for each subsequent transmission. NOTE The TDRE flag is set when the shift register is loaded with the next data to be transmitted from SCIDRH/L, which happens, generally speaking, a little over half-way through the stop bit of the previous frame. Specifically, this transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the previous frame. Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic 1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit position. Hardware supports odd or even parity. When parity is enabled, the most significant bit (MSB) of the data character is the parity bit. The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request. MC9S12XE-Family Reference Manual , Rev. 1.21 742 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) When the transmit shift register is not transmitting a frame, the TXD pin goes to the idle condition, logic 1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable signal goes low and the transmit signal goes idle. If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE to go high after the last frame before clearing TE. To separate messages with preambles with minimum idle line time, use this sequence between messages: 1. Write the last byte of the first message to SCIDRH/L. 2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift register. 3. Queue a preamble by clearing and then setting the TE bit. 4. Write the first byte of the second message to SCIDRH/L. 20.4.5.3 Break Characters Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit. Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at logic 1, transmitter logic continuously loads break characters into the transmit shift register. After software clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit of the next frame. The SCI recognizes a break character when there are 10 or 11(M = 0 or M = 1) consecutive zero received. Depending if the break detect feature is enabled or not receiving a break character has these effects on SCI registers. If the break detect feature is disabled (BKDFE = 0): * Sets the framing error flag, FE * Sets the receive data register full flag, RDRF * Clears the SCI data registers (SCIDRH/L) * May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF (see 3.4.4 and 3.4.5 SCI Status Register 1 and 2) If the break detect feature is enabled (BKDFE = 1) there are two scenarios1 The break is detected right from a start bit or is detected during a byte reception. * Sets the break detect interrupt flag, BLDIF * Does not change the data register full flag, RDRF or overrun flag OR * Does not change the framing error flag FE, parity error flag PE. * Does not clear the SCI data registers (SCIDRH/L) * May set noise flag NF, or receiver active flag RAF. 1. A Break character in this context are either 10 or 11 consecutive zero received bits MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 743 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Figure 20-17 shows two cases of break detect. In trace RXD_1 the break symbol starts with the start bit, while in RXD_2 the break starts in the middle of a transmission. If BRKDFE = 1, in RXD_1 case there will be no byte transferred to the receive buffer and the RDRF flag will not be modified. Also no framing error or parity error will be flagged from this transfer. In RXD_2 case, however the break signal starts later during the transmission. At the expected stop bit position the byte received so far will be transferred to the receive buffer, the receive data register full flag will be set, a framing error and if enabled and appropriate a parity error will be set. Once the break is detected the BRKDIF flag will be set. Start Bit Position Stop Bit Position BRKDIF = 1 RXD_1 Zero Bit Counter 1 2 3 4 5 6 7 8 9 10 . . . FE = 1 RXD_2 BRKDIF = 1 Zero Bit Counter 1 2 3 4 5 6 7 8 9 10 ... Figure 20-17. Break Detection if BRKDFE = 1 (M = 0) 20.4.5.4 Idle Characters An idle character (or preamble) contains all logic 1s and has no start, stop, or parity bit. Idle character length depends on the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle character that begins the first transmission initiated after writing the TE bit from 0 to 1. If the TE bit is cleared during a transmission, the TXD pin becomes idle after completion of the transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle character to be sent after the frame currently being transmitted. NOTE When queueing an idle character, return the TE bit to logic 1 before the stop bit of the current frame shifts out through the TXD pin. Setting TE after the stop bit appears on TXD causes data previously written to the SCI data register to be lost. Toggle the TE bit for a queued idle character while the TDRE flag is set and immediately before writing the next byte to the SCI data register. If the TE bit is clear and the transmission is complete, the SCI is not the master of the TXD pin MC9S12XE-Family Reference Manual , Rev. 1.21 744 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.5.5 LIN Transmit Collision Detection LIN Physical Interface This module allows to check for collisions on the LIN bus. Synchronizer Stage Receive Shift Register Compare Bit Error Bus Clock RXD Pin LIN Bus Sample Point Transmit Shift Register TXD Pin Figure 20-18. Collision Detect Principle If the bit error circuit is enabled (BERRM[1:0] = 0:1 or = 1:0]), the error detect circuit will compare the transmitted and the received data stream at a point in time and flag any mismatch. The timing checks run when transmitter is active (not idle). As soon as a mismatch between the transmitted data and the received data is detected the following happens: * The next bit transmitted will have a high level (TXPOL = 0) or low level (TXPOL = 1) * The transmission is aborted and the byte in transmit buffer is discarded. * the transmit data register empty and the transmission complete flag will be set * The bit error interrupt flag, BERRIF, will be set. * No further transmissions will take place until the BERRIF is cleared. 0 1 2 3 4 5 6 7 8 Sampling Begin 9 Sampling End 10 11 12 Sampling Begin 13 Sampling End 14 15 0 Output Transmit Shift Register Input Receive Shift Register BERRM[1:0] = 0:1 BERRM[1:0] = 1:1 Compare Sample Points Figure 20-19. Timing Diagram Bit Error Detection If the bit error detect feature is disabled, the bit error interrupt flag is cleared. NOTE The RXPOL and TXPOL bit should be set the same when transmission collision detect feature is enabled, otherwise the bit error interrupt flag may be set incorrectly. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 745 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.6 Receiver Internal Bus SBR12:SBR0 SCI Data Register 11-Bit Receive Shift Register 8 7 6 All 1s 5 4 3 2 1 0 RXPOL SCRXD From TXD Pin or Transmitter Loop Control Data Recovery H RE RAF MSB LOOPS RSRC FE M WAKE ILT PE PT Wakeup Logic NF PE RWU Parity Checking R8 IDLE ILIE Idle IRQ Start L RDRF/OR IRQ BRKDFE Stop Bus Clock Baud Divider RDRF OR RIE Break IRQ Break Detect Logic BRKDIF BRKDIE Active Edge Detect Logic RXEDGIF RXEDGIE RX Active Edge IRQ Figure 20-20. SCI Receiver Block Diagram 20.4.6.1 Receiver Character Length The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in SCI data register high (SCIDRH) is the ninth bit (bit 8). 20.4.6.2 Character Reception During an SCI reception, the receive shift register shifts a frame in from the RXD pin. The SCI data register is the read-only buffer between the internal data bus and the receive shift register. After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set, MC9S12XE-Family Reference Manual , Rev. 1.21 746 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request. 20.4.6.3 Data Sampling The RT clock rate. The RT clock is an internal signal with a frequency 16 times the baud rate. To adjust for baud rate mismatch, the RT clock (see Figure 20-21) is re-synchronized: * After every start bit * After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and RT10 samples returns a valid logic 0) To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three logic 1s.When the falling edge of a possible start bit occurs, the RT clock begins to count to 16. Start Bit RXD Samples 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 LSB Start Bit Qualification Start Bit Verification Data Sampling RT Clock RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT1 RT2 RT3 RT10 RT11 RT12 RT13 RT14 RT15 RT CLock Count Reset RT Clock RT16 RT4 Figure 20-21. Receiver Data Sampling To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7. Figure 20-17 summarizes the results of the start bit verification samples. Table 20-17. Start Bit Verification RT3, RT5, and RT7 Samples 000 001 010 011 100 101 110 111 Start Bit Verification Yes Yes Yes No Yes No No No Noise Flag 0 1 1 0 1 0 0 0 If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 747 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 20-18 summarizes the results of the data bit samples. Table 20-18. Data Bit Recovery RT8, RT9, and RT10 Samples 000 001 010 011 100 101 110 111 Data Bit Determination 0 0 0 1 0 1 1 1 Noise Flag 0 1 1 1 1 1 1 0 NOTE The RT8, RT9, and RT10 samples do not affect start bit verification. If any or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a successful start bit verification, the noise flag (NF) is set and the receiver assumes that the bit is a start bit (logic 0). To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 20-19 summarizes the results of the stop bit samples. Table 20-19. Stop Bit Recovery RT8, RT9, and RT10 Samples 000 001 010 011 100 101 110 111 Framing Error Flag 1 1 1 0 1 0 0 0 Noise Flag 0 1 1 1 1 1 1 0 MC9S12XE-Family Reference Manual , Rev. 1.21 748 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) In Figure 20-22 the verification samples RT3 and RT5 determine that the first low detected was noise and not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag is not set because the noise occurred before the start bit was found. Start Bit RXD Samples 1 1 1 0 1 1 1 0 0 0 0 0 0 0 LSB RT Clock RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT1 RT2 LSB RT6 RT10 RT11 RT12 RT13 RT14 RT15 RT Clock Count Reset RT Clock RT16 RT3 RT7 Figure 20-22. Start Bit Search Example 1 In Figure 20-23, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful. Perceived Start Bit Actual Start Bit RXD Samples 1 1 1 1 1 0 1 0 0 0 0 0 RT Clock RT10 RT11 RT12 RT13 RT14 RT15 RT16 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT1 RT2 RT3 RT4 RT Clock Count Reset RT Clock RT5 Figure 20-23. Start Bit Search Example 2 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 749 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) In Figure 20-24, a large burst of noise is perceived as the beginning of a start bit, although the test sample at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful. Perceived Start Bit Actual Start Bit RXD Samples 1 1 1 0 0 1 0 0 0 0 LSB RT Clock RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 LSB RT2 RT10 RT11 RT12 RT13 RT14 RT15 RT Clock Count Reset RT Clock RT16 RT9 RT3 Figure 20-24. Start Bit Search Example 3 Figure 20-25 shows the effect of noise early in the start bit time. Although this noise does not affect proper synchronization with the start bit time, it does set the noise flag. Perceived and Actual Start Bit RXD Samples 1 1 1 1 1 1 1 1 1 0 1 0 RT Clock RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT10 RT11 RT12 RT13 RT14 RT15 RT Clock Count Reset RT Clock Figure 20-25. Start Bit Search Example 4 MC9S12XE-Family Reference Manual , Rev. 1.21 750 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 RT16 RT1 Chapter 20 Serial Communication Interface (S12SCIV5) Figure 20-26 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample after the reset is low but is not preceded by three high samples that would qualify as a falling edge. Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may set the framing error flag. Start Bit RXD Samples 1 1 1 1 1 1 1 1 1 0 0 1 1 0 No Start Bit Found 0 0 0 0 0 0 0 LSB RT Clock RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 LSB RT2 RT Clock Count Reset RT Clock RT1 RT3 Figure 20-26. Start Bit Search Example 5 In Figure 20-27, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are ignored. Start Bit RXD Samples 1 1 1 1 1 1 1 1 1 0 0 0 0 1 0 1 RT Clock RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 RT10 RT11 RT12 RT13 RT14 RT15 RT Clock Count Reset RT Clock RT16 RT1 Figure 20-27. Start Bit Search Example 6 20.4.6.4 Framing Errors If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 751 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.6.5 Baud Rate Tolerance A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside the actual stop bit. A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the RT8, RT9, and RT10 stop bit samples are a logic zero. As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge within the frame. Re synchronization within frames will correct a misalignment between transmitter bit times and receiver bit times. 20.4.6.5.1 Slow Data Tolerance Figure 20-28 shows how much a slow received frame can be misaligned without causing a noise error or a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data samples at RT8, RT9, and RT10. MSB Stop Receiver RT Clock RT10 RT11 RT12 RT13 RT14 RT15 RT16 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 Data Samples Figure 20-28. Slow Data Let's take RTr as receiver RT clock and RTt as transmitter RT clock. For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles = 151 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 20-28, the receiver counts 151 RTr cycles at the point when the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data character with no errors is: ((151 - 144) / 151) x 100 = 4.63% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles to start data sampling of the stop bit. With the misaligned character shown in Figure 20-28, the receiver counts 167 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit character with no errors is: ((167 - 160) / 167) X 100 = 4.19% MC9S12XE-Family Reference Manual , Rev. 1.21 752 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.6.5.2 Fast Data Tolerance Figure 20-29 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10 instead of RT16 but is still sampled at RT8, RT9, and RT10. Stop Idle or Next Frame Receiver RT Clock RT10 RT11 RT12 RT13 RT14 RT15 RT16 RT1 RT2 RT3 RT4 RT5 RT6 RT7 RT8 RT9 Data Samples Figure 20-29. Fast Data For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 10 RTr cycles = 154 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 20-29, the receiver counts 154 RTr cycles at the point when the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit character with no errors is: ((160 - 154) / 160) x 100 = 3.75% For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 10 RTr cycles = 170 RTr cycles to finish data sampling of the stop bit. With the misaligned character shown in Figure 20-29, the receiver counts 170 RTr cycles at the point when the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles. The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit character with no errors is: ((176 - 170) /176) x 100 = 3.40% 20.4.6.6 Receiver Wakeup To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems, the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register 2 (SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will still load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag. The transmitting device can address messages to selected receivers by including addressing information in the initial frame or frames of each message. The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark wakeup. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 753 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.4.6.6.1 Idle Input line Wakeup (WAKE = 0) In this wakeup method, an idle condition on the RXD pin clears the RWU bit and wakes up the SCI. The initial frame or frames of every message contain addressing information. All receivers evaluate the addressing information, and receivers for which the message is addressed process the frames that follow. Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another idle character appears on the RXD pin. Idle line wakeup requires that messages be separated by at least one idle character and that no message contains idle characters. The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register full flag, RDRF. The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1). 20.4.6.6.2 Address Mark Wakeup (WAKE = 1) In this wakeup method, a logic 1 in the most significant bit (MSB) position of a frame clears the RWU bit and wakes up the SCI. The logic 1 in the MSB position marks a frame as an address frame that contains addressing information. All receivers evaluate the addressing information, and the receivers for which the message is addressed process the frames that follow.Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on standby until another address frame appears on the RXD pin. The logic 1 MSB of an address frame clears the receiver's RWU bit before the stop bit is received and sets the RDRF flag. Address mark wakeup allows messages to contain idle characters but requires that the MSB be reserved for use in address frames. NOTE With the WAKE bit clear, setting the RWU bit after the RXD pin has been idle can cause the receiver to wake up immediately. 20.4.7 Single-Wire Operation Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting. Transmitter TXD Receiver RXD Figure 20-30. Single-Wire Operation (LOOPS = 1, RSRC = 1) MC9S12XE-Family Reference Manual , Rev. 1.21 754 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Setting the RSRC bit connects the TXD pin to the receiver. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the TXD pin is going to be used as an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation. NOTE In single-wire operation data from the TXD pin is inverted if RXPOL is set. 20.4.8 Loop Operation In loop operation the transmitter output goes to the receiver input. The RXD pin is disconnected from the SCI. Transmitter TXD Receiver RXD Figure 20-31. Loop Operation (LOOPS = 1, RSRC = 0) Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Clearing the RSRC bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be enabled (TE = 1 and RE = 1). NOTE In loop operation data from the transmitter is not recognized by the receiver if RXPOL and TXPOL are not the same. 20.5 20.5.1 Initialization/Application Information Reset Initialization See Section 20.3.2, "Register Descriptions". 20.5.2 20.5.2.1 Modes of Operation Run Mode Normal mode of operation. To initialize a SCI transmission, see Section 20.4.5.2, "Character Transmission". MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 755 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.5.2.2 Wait Mode SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1 (SCICR1). * If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode. * If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver enable bit, RE, or the transmitter enable bit, TE. If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The transmission or reception resumes when either an internal or external interrupt brings the CPU out of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and resets the SCI. 20.5.2.3 Stop Mode The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not affect the SCI register states, but the SCI bus clock will be disabled. The SCI operation resumes from where it left off after an external interrupt brings the CPU out of stop mode. Exiting stop mode by reset aborts any transmission or reception in progress and resets the SCI. The receive input active edge detect circuit is still active in stop mode. An active edge on the receive input can be used to bring the CPU out of stop mode. 20.5.3 Interrupt Operation This section describes the interrupt originated by the SCI block.The MCU must service the interrupt requests. Table 20-20 lists the eight interrupt sources of the SCI. Table 20-20. SCI Interrupt Sources Interrupt TDRE TC RDRF OR IDLE Source SCISR1[7] SCISR1[6] SCISR1[5] SCISR1[3] SCISR1[4] ILIE RXEDGIE BERRIE BRKDIE Local Enable TIE TCIE RIE Description Active high level. Indicates that a byte was transferred from SCIDRH/L to the transmit shift register. Active high level. Indicates that a transmit is complete. Active high level. The RDRF interrupt indicates that received data is available in the SCI data register. Active high level. This interrupt indicates that an overrun condition has occurred. Active high level. Indicates that receiver input has become idle. Active high level. Indicates that an active edge (falling for RXPOL = 0, rising for RXPOL = 1) was detected. Active high level. Indicates that a mismatch between transmitted and received data in a single wire application has happened. Active high level. Indicates that a break character has been received. RXEDGIF SCIASR1[7] BERRIF BKDIF SCIASR1[1] SCIASR1[0] MC9S12XE-Family Reference Manual , Rev. 1.21 756 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.5.3.1 Description of Interrupt Operation The SCI only originates interrupt requests. The following is a description of how the SCI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are chip dependent. The SCI only has a single interrupt line (SCI Interrupt Signal, active high operation) and all the following interrupts, when generated, are ORed together and issued through that port. 20.5.3.1.1 TDRE Description The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1 with TDRE set and then writing to SCI data register low (SCIDRL). 20.5.3.1.2 TC Description The TC interrupt is set by the SCI when a transmission has been completed. Transmission is completed when all bits including the stop bit (if transmitted) have been shifted out and no data is queued to be transmitted. No stop bit is transmitted when sending a break character and the TC flag is set (providing there is no more data queued for transmission) when the break character has been shifted out. A TC interrupt indicates that there is no transmission in progress. TC is set high when the TDRE flag is set and no data, preamble, or break character is being transmitted. When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL).TC is cleared automatically when data, preamble, or break is queued and ready to be sent. 20.5.3.1.3 RDRF Description The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL). 20.5.3.1.4 OR Description The OR interrupt is set when software fails to read the SCI data register before the receive shift register receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status register one (SCISR1) and then reading SCI data register low (SCIDRL). 20.5.3.1.5 IDLE Description The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1) appear on the receiver input. Once the IDLE is cleared, a valid frame must again set the RDRF flag before an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then reading SCI data register low (SCIDRL). MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 757 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 20 Serial Communication Interface (S12SCIV5) 20.5.3.1.6 RXEDGIF Description The RXEDGIF interrupt is set when an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the RXD pin is detected. Clear RXEDGIF by writing a "1" to the SCIASR1 SCI alternative status register 1. 20.5.3.1.7 BERRIF Description The BERRIF interrupt is set when a mismatch between the transmitted and the received data in a single wire application like LIN was detected. Clear BERRIF by writing a "1" to the SCIASR1 SCI alternative status register 1. This flag is also cleared if the bit error detect feature is disabled. 20.5.3.1.8 BKDIF Description The BKDIF interrupt is set when a break signal was received. Clear BKDIF by writing a "1" to the SCIASR1 SCI alternative status register 1. This flag is also cleared if break detect feature is disabled. 20.5.4 Recovery from Wait Mode The SCI interrupt request can be used to bring the CPU out of wait mode. 20.5.5 Recovery from Stop Mode An active edge on the receive input can be used to bring the CPU out of stop mode. MC9S12XE-Family Reference Manual , Rev. 1.21 758 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-1. Revision History Revision Number V05.00 Revision Date 24 Mar 2005 Sections Affected 21.3.2/21-763 Description of Changes - Added 16-bit transfer width feature. 21.1 Introduction The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven. 21.1.1 Glossary of Terms SPI SS SCK MOSI MISO MOMI SISO Serial Peripheral Interface Slave Select Serial Clock Master Output, Slave Input Master Input, Slave Output Master Output, Master Input Slave Input, Slave Output 21.1.2 Features The SPI includes these distinctive features: * Master mode and slave mode * Selectable 8 or 16-bit transfer width * Bidirectional mode * Slave select output * Mode fault error flag with CPU interrupt capability * Double-buffered data register * Serial clock with programmable polarity and phase * Control of SPI operation during wait mode 21.1.3 Modes of Operation The SPI functions in three modes: run, wait, and stop. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 759 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) * * * Run mode This is the basic mode of operation. Wait mode SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in run mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock generation turned off. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. Stop mode The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and transmission of data continues, so that the slave stays synchronized to the master. For a detailed description of operating modes, please refer to Section 21.4.7, "Low Power Mode Options". 21.1.4 Block Diagram Figure 21-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control and data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic. MC9S12XE-Family Reference Manual , Rev. 1.21 760 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) SPI 2 SPI Control Register 1 BIDIROE 2 SPI Control Register 2 SPC0 SPI Status Register SPIF MODF SPTEF Interrupt Control SPI Interrupt Request Baud Rate Generator Counter Bus Clock Prescaler Clock Select SPPR 3 SPR 3 Shifter SPI Baud Rate Register LSBFE=1 SPI Data Register LSBFE=0 MSB LSBFE=0 LSBFE=1 LSBFE=0 LSB LSBFE=1 Data Out Data In Baud Rate Shift Clock Sample Clock Slave Control CPOL CPHA MOSI Phase + SCK In Slave Baud Rate Polarity Control Master Baud Rate Phase + SCK Out Polarity Control Master Control Port Control Logic SCK SS Figure 21-1. SPI Block Diagram 21.2 External Signal Description This section lists the name and description of all ports including inputs and outputs that do, or may, connect off chip. The SPI module has a total of four external pins. 21.2.1 MOSI -- Master Out/Slave In Pin This pin is used to transmit data out of the SPI module when it is configured as a master and receive data when it is configured as slave. 21.2.2 MISO -- Master In/Slave Out Pin This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data when it is configured as master. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 761 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.2.3 SS -- Slave Select Pin This pin is used to output the select signal from the SPI module to another peripheral with which a data transfer is to take place when it is configured as a master and it is used as an input to receive the slave select signal when the SPI is configured as slave. 21.2.4 SCK -- Serial Clock Pin In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock. 21.3 21.3.1 Memory Map and Register Definition Module Memory Map This section provides a detailed description of address space and registers used by the SPI. The memory map for the SPI is given in Figure 21-2. The address listed for each register is the sum of a base address and an address offset. The base address is defined at the SoC level and the address offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved bits have no effect. Register Name 0x0000 SPICR1 0x0001 SPICR2 0x0002 SPIBR 0x0003 SPISR 0x0004 SPIDRH 0x0005 SPIDRL 0x0006 Reserved 0x0007 Reserved R W R W R W R W R W R W R W R W = Unimplemented or Reserved Bit 7 SPIE 0 6 SPE 5 SPTIE 0 4 MSTR 3 CPOL 2 CPHA 0 1 SSOE Bit 0 LSBFE XFRW MODFEN BIDIROE 0 SPISWAI SPC0 0 SPPR2 0 SPPR1 SPTEF SPPR0 MODF SPR2 0 SPR1 0 SPR0 0 SPIF 0 R15 T15 R7 T7 R14 T14 R6 T6 R13 T13 R5 T5 R12 T12 R4 T4 R11 T11 R3 T3 R10 T10 R2 T2 R9 T9 R1 T1 R8 T8 R0 T0 Figure 21-2. SPI Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 762 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. 21.3.2.1 SPI Control Register 1 (SPICR1) 7 6 5 4 3 2 1 0 Module Base +0x0000 R W Reset SPIE 0 SPE 0 SPTIE 0 MSTR 0 CPOL 0 CPHA 1 SSOE 0 LSBFE 0 Figure 21-3. SPI Control Register 1 (SPICR1) Read: Anytime Write: Anytime Table 21-2. SPICR1 Field Descriptions Field 7 SPIE 6 SPE Description SPI Interrupt Enable Bit -- This bit enables SPI interrupt requests, if SPIF or MODF status flag is set. 0 SPI interrupts disabled. 1 SPI interrupts enabled. SPI System Enable Bit -- This bit enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset. 0 SPI disabled (lower power consumption). 1 SPI enabled, port pins are dedicated to SPI functions. SPI Transmit Interrupt Enable -- This bit enables SPI interrupt requests, if SPTEF flag is set. 0 SPTEF interrupt disabled. 1 SPTEF interrupt enabled. SPI Master/Slave Mode Select Bit -- This bit selects whether the SPI operates in master or slave mode. Switching the SPI from master to slave or vice versa forces the SPI system into idle state. 0 SPI is in slave mode. 1 SPI is in master mode. SPI Clock Polarity Bit -- This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Active-high clocks selected. In idle state SCK is low. 1 Active-low clocks selected. In idle state SCK is high. SPI Clock Phase Bit -- This bit is used to select the SPI clock format. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Sampling of data occurs at odd edges (1,3,5,...) of the SCK clock. 1 Sampling of data occurs at even edges (2,4,6,...) of the SCK clock. 5 SPTIE 4 MSTR 3 CPOL 2 CPHA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 763 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-2. SPICR1 Field Descriptions (continued) Field 1 SSOE 0 LSBFE Description Slave Select Output Enable -- The SS output feature is enabled only in master mode, if MODFEN is set, by asserting the SSOE as shown in Table 21-3. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. LSB-First Enable -- This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the data register always have the MSB in the highest bit position. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 Data is transferred most significant bit first. 1 Data is transferred least significant bit first. Table 21-3. SS Input / Output Selection MODFEN 0 0 1 1 SSOE 0 1 0 1 Master Mode SS not used by SPI SS not used by SPI SS input with MODF feature SS is slave select output Slave Mode SS input SS input SS input SS input 21.3.2.2 SPI Control Register 2 (SPICR2) 7 6 5 4 3 2 1 0 Module Base +0x0001 R W Reset 0 0 0 0 0 0 XFRW 0 MODFEN 0 BIDIROE 0 SPISWAI 0 SPC0 0 = Unimplemented or Reserved Figure 21-4. SPI Control Register 2 (SPICR2) Read: Anytime Write: Anytime; writes to the reserved bits have no effect MC9S12XE-Family Reference Manual , Rev. 1.21 764 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-4. SPICR2 Field Descriptions Field 6 XFRW Description Transfer Width -- This bit is used for selecting the data transfer width. If 8-bit transfer width is selected, SPIDRL becomes the dedicated data register and SPIDRH is unused. If 16-bit transfer width is selected, SPIDRH and SPIDRL form a 16-bit data register. Please refer to Section 21.3.2.4, "SPI Status Register (SPISR) for information about transmit/receive data handling and the interrupt flag clearing mechanism. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 8-bit Transfer Width (n = 8)(1) 1 16-bit Transfer Width (n = 16)1 Mode Fault Enable Bit -- This bit allows the MODF failure to be detected. If the SPI is in master mode and MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin configuration, refer to Table 21-3. In master mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 0 SS port pin is not used by the SPI. 1 SS port pin with MODF feature. Output Enable in the Bidirectional Mode of Operation -- This bit controls the MOSI and MISO output buffer of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0 set, a change of this bit will abort a transmission in progress and force the SPI into idle state. 0 Output buffer disabled. 1 Output buffer enabled. SPI Stop in Wait Mode Bit -- This bit is used for power conservation while in wait mode. 0 SPI clock operates normally in wait mode. 1 Stop SPI clock generation when in wait mode. 4 MODFEN 3 BIDIROE 1 SPISWAI 0 Serial Pin Control Bit 0 -- This bit enables bidirectional pin configurations as shown in Table 21-5. In master SPC0 mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state. 1. n is used later in this document as a placeholder for the selected transfer width. Table 21-5. Bidirectional Pin Configurations Pin Mode SPC0 BIDIROE MISO MOSI Master Mode of Operation Normal Bidirectional 0 1 X 0 1 Slave Mode of Operation Normal Bidirectional 0 1 X 0 1 Slave Out Slave In Slave I/O Slave In MOSI not used by SPI Master In MISO not used by SPI Master Out Master In Master I/O MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 765 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.3.2.3 SPI Baud Rate Register (SPIBR) 7 6 5 4 3 2 1 0 Module Base +0x0002 R W Reset 0 0 0 0 SPPR2 0 SPPR1 0 SPPR0 0 SPR2 0 SPR1 0 SPR0 0 = Unimplemented or Reserved Figure 21-5. SPI Baud Rate Register (SPIBR) Read: Anytime Write: Anytime; writes to the reserved bits have no effect Table 21-6. SPIBR Field Descriptions Field 6-4 SPPR[2:0] 2-0 SPR[2:0] Description SPI Baud Rate Preselection Bits -- These bits specify the SPI baud rates as shown in Table 21-7. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. SPI Baud Rate Selection Bits -- These bits specify the SPI baud rates as shown in Table 21-7. In master mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state. The baud rate divisor equation is as follows: BaudRateDivisor = (SPPR + 1) * 2(SPR + 1) Eqn. 21-1 The baud rate can be calculated with the following equation: Baud Rate = BusClock / BaudRateDivisor Eqn. 21-2 NOTE For maximum allowed baud rates, please refer to the SPI Electrical Specification in the Electricals chapter of this data sheet. Table 21-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 1 of 3) SPPR2 0 0 0 0 0 0 0 0 0 0 0 0 SPPR1 0 0 0 0 0 0 0 0 0 0 0 0 SPPR0 0 0 0 0 0 0 0 0 1 1 1 1 SPR2 0 0 0 0 1 1 1 1 0 0 0 0 SPR1 0 0 1 1 0 0 1 1 0 0 1 1 SPR0 0 1 0 1 0 1 0 1 0 1 0 1 Baud Rate Divisor 2 4 8 16 32 64 128 256 4 8 16 32 Baud Rate 12.5 Mbit/s 6.25 Mbit/s 3.125 Mbit/s 1.5625 Mbit/s 781.25 kbit/s 390.63 kbit/s 195.31 kbit/s 97.66 kbit/s 6.25 Mbit/s 3.125 Mbit/s 1.5625 Mbit/s 781.25 kbit/s MC9S12XE-Family Reference Manual , Rev. 1.21 766 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 2 of 3) SPPR2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SPPR1 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 SPPR0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 SPR2 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 SPR1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 SPR0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Baud Rate Divisor 64 128 256 512 6 12 24 48 96 192 384 768 8 16 32 64 128 256 512 1024 10 20 40 80 160 320 640 1280 12 24 48 96 192 384 768 1536 14 28 56 112 224 448 Baud Rate 390.63 kbit/s 195.31 kbit/s 97.66 kbit/s 48.83 kbit/s 4.16667 Mbit/s 2.08333 Mbit/s 1.04167 Mbit/s 520.83 kbit/s 260.42 kbit/s 130.21 kbit/s 65.10 kbit/s 32.55 kbit/s 3.125 Mbit/s 1.5625 Mbit/s 781.25 kbit/s 390.63 kbit/s 195.31 kbit/s 97.66 kbit/s 48.83 kbit/s 24.41 kbit/s 2.5 Mbit/s 1.25 Mbit/s 625 kbit/s 312.5 kbit/s 156.25 kbit/s 78.13 kbit/s 39.06 kbit/s 19.53 kbit/s 2.08333 Mbit/s 1.04167 Mbit/s 520.83 kbit/s 260.42 kbit/s 130.21 kbit/s 65.10 kbit/s 32.55 kbit/s 16.28 kbit/s 1.78571 Mbit/s 892.86 kbit/s 446.43 kbit/s 223.21 kbit/s 111.61 kbit/s 55.80 kbit/s MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 767 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (Sheet 3 of 3) SPPR2 1 1 1 1 1 1 1 1 1 1 SPPR1 1 1 1 1 1 1 1 1 1 1 SPPR0 0 0 1 1 1 1 1 1 1 1 SPR2 1 1 0 0 0 0 1 1 1 1 SPR1 1 1 0 0 1 1 0 0 1 1 SPR0 0 1 0 1 0 1 0 1 0 1 Baud Rate Divisor 896 1792 16 32 64 128 256 512 1024 2048 Baud Rate 27.90 kbit/s 13.95 kbit/s 1.5625 Mbit/s 781.25 kbit/s 390.63 kbit/s 195.31 kbit/s 97.66 kbit/s 48.83 kbit/s 24.41 kbit/s 12.21 kbit/s 21.3.2.4 SPI Status Register (SPISR) 7 6 5 4 3 2 1 0 Module Base +0x0003 R W Reset 0 0 1 0 0 0 0 0 = Unimplemented or Reserved SPIF 0 SPTEF MODF 0 0 0 0 Figure 21-6. SPI Status Register (SPISR) Read: Anytime Write: Has no effect Table 21-8. SPISR Field Descriptions Field 7 SPIF Description SPIF Interrupt Flag -- This bit is set after received data has been transferred into the SPI data register. For information about clearing SPIF Flag, please refer to Table 21-9. 0 Transfer not yet complete. 1 New data copied to SPIDR. SPI Transmit Empty Interrupt Flag -- If set, this bit indicates that the transmit data register is empty. For information about clearing this bit and placing data into the transmit data register, please refer to Table 21-10. 0 SPI data register not empty. 1 SPI data register empty. Mode Fault Flag -- This bit is set if the SS input becomes low while the SPI is configured as a master and mode fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in Section 21.3.2.2, "SPI Control Register 2 (SPICR2)". The flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to the SPI control register 1. 0 Mode fault has not occurred. 1 Mode fault has occurred. 5 SPTEF 4 MODF MC9S12XE-Family Reference Manual , Rev. 1.21 768 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-9. SPIF Interrupt Flag Clearing Sequence XFRW Bit 0 1 SPIF Interrupt Flag Clearing Sequence Read SPISR with SPIF == 1 Read SPISR with SPIF == 1 then Read SPIDRL Byte Read SPIDRL (1) or then Byte Read SPIDRH (2) or Word Read (SPIDRH:SPIDRL) 1. Data in SPIDRH is lost in this case. 2. SPIDRH can be read repeatedly without any effect on SPIF. SPIF Flag is cleared only by the read of SPIDRL after reading SPISR with SPIF == 1. Byte Read SPIDRL Table 21-10. SPTEF Interrupt Flag Clearing Sequence XFRW Bit 0 1 SPTEF Interrupt Flag Clearing Sequence Read SPISR with SPTEF == 1 then Read SPISR with SPTEF == 1 Write to SPIDRL (1) Byte Write to SPIDRL 1(2) or then Byte Write to SPIDRH 1(3) Byte Write to SPIDRL 1 or Word Write to (SPIDRH:SPIDRL) 1 1. Any write to SPIDRH or SPIDRL with SPTEF == 0 is effectively ignored. 2. Data in SPIDRH is undefined in this case. 3. SPIDRH can be written repeatedly without any effect on SPTEF. SPTEF Flag is cleared only by writing to SPIDRL after reading SPISR with SPTEF == 1. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 769 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.3.2.5 SPI Data Register (SPIDR = SPIDRH:SPIDRL) 7 6 5 4 3 2 1 0 Module Base +0x0004 R W Reset R15 T15 0 R14 T14 0 R13 T13 0 R12 T12 0 R11 T11 0 R10 T10 0 R9 T9 0 R8 T8 0 Figure 21-7. SPI Data Register High (SPIDRH) Module Base +0x0005 7 6 5 4 3 2 1 0 R W Reset R7 T7 0 R6 T6 0 R5 T5 0 R4 T4 0 R3 T3 0 R2 T2 0 R1 T1 0 R0 T0 0 Figure 21-8. SPI Data Register Low (SPIDRL) Read: Anytime; read data only valid when SPIF is set Write: Anytime The SPI data register is both the input and output register for SPI data. A write to this register allows data to be queued and transmitted. For an SPI configured as a master, queued data is transmitted immediately after the previous transmission has completed. The SPI transmitter empty flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept new data. Received data in the SPIDR is valid when SPIF is set. If SPIF is cleared and data has been received, the received data is transferred from the receive shift register to the SPIDR and SPIF is set. If SPIF is set and not serviced, and a second data value has been received, the second received data is kept as valid data in the receive shift register until the start of another transmission. The data in the SPIDR does not change. If SPIF is set and valid data is in the receive shift register, and SPIF is serviced before the start of a third transmission, the data in the receive shift register is transferred into the SPIDR and SPIF remains set (see Figure 21-9). If SPIF is set and valid data is in the receive shift register, and SPIF is serviced after the start of a third transmission, the data in the receive shift register has become invalid and is not transferred into the SPIDR (see Figure 21-10). MC9S12XE-Family Reference Manual , Rev. 1.21 770 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Data A Received Data B Received Data C Received SPIF Serviced Receive Shift Register Data A Data B Data C SPIF SPI Data Register Data A Data B Data C = Unspecified = Reception in progress Figure 21-9. Reception with SPIF serviced in Time Data A Received Data B Received Data C Received Data B Lost SPIF Serviced Receive Shift Register Data A Data B Data C SPIF SPI Data Register Data A Data C = Unspecified = Reception in progress Figure 21-10. Reception with SPIF serviced too late 21.4 Functional Description The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral devices. Software can poll the SPI status flags or SPI operation can be interrupt driven. The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set, the four associated SPI port pins are dedicated to the SPI function as: * Slave select (SS) * Serial clock (SCK) * Master out/slave in (MOSI) * Master in/slave out (MISO) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 771 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) The main element of the SPI system is the SPI data register. The n-bit1 data register in the master and the n-bit1 data register in the slave are linked by the MOSI and MISO pins to form a distributed 2n-bit1 register. When a data transfer operation is performed, this 2n-bit1 register is serially shifted n1 bit positions by the S-clock from the master, so data is exchanged between the master and the slave. Data written to the master SPI data register becomes the output data for the slave, and data read from the master SPI data register after a transfer operation is the input data from the slave. A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register. When a transfer is complete and SPIF is cleared, received data is moved into the receive data register. This data register acts as the SPI receive data register for reads and as the SPI transmit data register for writes. A common SPI data register address is shared for reading data from the read data buffer and for writing data to the transmit data register. The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1 (SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see Section 21.4.3, "Transmission Formats"). The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected. NOTE A change of CPOL or MSTR bit while there is a received byte pending in the receive shift register will destroy the received byte and must be avoided. 21.4.1 Master Mode The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate transmissions. A transmission begins by writing to the master SPI data register. If the shift register is empty, data immediately transfers to the shift register. Data begins shifting out on the MOSI pin under the control of the serial clock. * Serial clock The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and SPPR0 baud rate preselection bits in the SPI baud rate register, control the baud rate generator and determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK pin, the baud rate generator of the master controls the shift register of the slave peripheral. * MOSI, MISO pin In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is determined by the SPC0 and BIDIROE control bits. * SS pin If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output becomes low during each transmission and is high when the SPI is in idle state. If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error. If the SS input becomes low this indicates a mode fault error where another master tries to 1. n depends on the selected transfer width, please refer to Section 21.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12XE-Family Reference Manual , Rev. 1.21 772 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional mode). So the result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is forced into idle state. This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If the SPI interrupt enable bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt sequence is also requested. When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After the delay, SCK is started within the master. The rest of the transfer operation differs slightly, depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI control register 1 (see Section 21.4.3, "Transmission Formats"). NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, XFRW, MODFEN, SPC0, or BIDIROE with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in master mode will abort a transmission in progress and force the SPI into idle state. The remote slave cannot detect this, therefore the master must ensure that the remote slave is returned to idle state. 21.4.2 Slave Mode The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear. * Serial clock In slave mode, SCK is the SPI clock input from the master. * MISO, MOSI pin In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is determined by the SPC0 bit and BIDIROE bit in SPI control register 2. * SS pin The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle state. The SS input also controls the serial data output pin, if SS is high (not selected), the serial data output pin is high impedance, and, if SS is low, the first bit in the SPI data register is driven out of the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is ignored and no internal shifting of the SPI shift register occurs. Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin. NOTE When peripherals with duplex capability are used, take care not to simultaneously enable two receivers whose serial outputs drive the same system slave's serial data output line. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 773 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) As long as no more than one slave device drives the system slave's serial data output line, it is possible for several slaves to receive the same transmission from a master, although the master would not receive return information from all of the receiving slaves. If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit. When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data output pin. After the nth1 shift, the transfer is considered complete and the received data is transferred into the SPI data register. To indicate transfer is complete, the SPIF flag in the SPI status register is set. NOTE A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or BIDIROE with SPC0 set in slave mode will corrupt a transmission in progress and must be avoided. 21.4.3 Transmission Formats During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially) simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two serial data lines. A slave select line allows selection of an individual slave SPI device; slave devices that are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select line can be used to indicate multiple-master bus contention. MASTER SPI MISO MOSI SCK BAUD RATE GENERATOR SS MISO MOSI SCK SS SLAVE SPI SHIFT REGISTER SHIFT REGISTER VDD Figure 21-11. Master/Slave Transfer Block Diagram 21.4.3.1 Clock Phase and Polarity Controls Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase and polarity. 1. n depends on the selected transfer width, please refer to Section 21.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12XE-Family Reference Manual , Rev. 1.21 774 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on the transmission format. The CPHA clock phase control bit selects one of two fundamentally different transmission formats. Clock phase and polarity should be identical for the master SPI device and the communicating slave device. In some cases, the phase and polarity are changed between transmissions to allow a master device to communicate with peripheral slaves having different requirements. 21.4.3.2 CPHA = 0 Transfer Format The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first data bit of the master into the slave. In some peripherals, the first bit of the slave's data is available at the slave's data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle after SS has become low. A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register, depending on LSBFE bit. After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK line, with data being latched on odd numbered edges and shifted on even numbered edges. Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. After 2n1 (last) SCK edges: * Data that was previously in the master SPI data register should now be in the slave data register and the data that was in the slave data register should be in the master. * The SPIF flag in the SPI status register is set, indicating that the transfer is complete. Figure 21-12 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI. 1. n depends on the selected transfer width, please refer to Section 21.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 775 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) End of Idle State SCK Edge Number SCK (CPOL = 0) SCK (CPOL = 1) 1 2 Begin 3 4 5 6 Transfer 7 8 9 10 11 12 End 13 14 15 16 Begin of Idle State CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tL tT Bit 1 Bit 6 tI tL MSB first (LSBFE = 0): MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 LSB first (LSBFE = 1): LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. LSB Minimum 1/2 SCK for tT, tl, tL MSB Figure 21-12. SPI Clock Format 0 (CPHA = 0), with 8-bit Transfer Width selected (XFRW = 0) MC9S12XE-Family Reference Manual , Rev. 1.21 776 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 If next transfer begins here SAMPLE I MOSI/MISO Chapter 21 Serial Peripheral Interface (S12SPIV5) End of Idle State SCK Edge Number SCK (CPOL = 0) SCK (CPOL = 1) 1 2 3 4 Begin 5 6 7 8 9 10 11 12 13 Transfer 14 15 16 17 18 19 20 21 22 23 24 End 25 26 27 28 29 30 31 32 Begin of Idle State CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) MSB first (LSBFE = 0) LSB first (LSBFE = 1) tL tT tI tL MSB Bit 14Bit 13Bit 12Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB Minimum 1/2 SCK LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14 MSB for tT, tl, tL tL = Minimum leading time before the first SCK edge tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time) tL, tT, and tI are guaranteed for the master mode and required for the slave mode. Figure 21-13. SPI Clock Format 0 (CPHA = 0), with 16-Bit Transfer Width selected (XFRW = 1) In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the SPI data register is not transmitted; instead the last received data is transmitted. If the SS line is deasserted for at least minimum idle time (half SCK cycle) between successive transmissions, then the content of the SPI data register is transmitted. In master mode, with slave select output enabled the SS line is always deasserted and reasserted between successive transfers for at least minimum idle time. 21.4.3.3 CPHA = 1 Transfer Format Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin, the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the CPHA bit at the beginning of the n1-cycle transfer operation. The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first edge commands the slave to transfer its first data bit to the serial data input pin of the master. A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the master and slave. 1. n depends on the selected transfer width, please refer to Section 21.3.2.2, "SPI Control Register 2 (SPICR2) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 777 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 If next transfer begins here SAMPLE I MOSI/MISO Chapter 21 Serial Peripheral Interface (S12SPIV5) When the third edge occurs, the value previously latched from the serial data input pin is shifted into the LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master data is coupled out of the serial data output pin of the master to the serial input pin on the slave. This process continues for a total of n1 edges on the SCK line with data being latched on even numbered edges and shifting taking place on odd numbered edges. Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and is transferred to the parallel SPI data register after the last bit is shifted in. After 2n1 SCK edges: * Data that was previously in the SPI data register of the master is now in the data register of the slave, and data that was in the data register of the slave is in the master. * The SPIF flag bit in SPISR is set indicating that the transfer is complete. Figure 21-14 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or reconfigured as a general-purpose output not affecting the SPI. End of Idle State SCK Edge Number SCK (CPOL = 0) SCK (CPOL = 1) 1 2 3 Begin 4 5 6 7 Transfer 8 9 10 11 12 End 13 14 15 16 Begin of Idle State CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tL tT tI tL MSB first (LSBFE = 0): LSB first (LSBFE = 1): MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB Minimum 1/2 SCK for tT, tl, tL LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 MSB tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 21-14. SPI Clock Format 1 (CPHA = 1), with 8-Bit Transfer Width selected (XFRW = 0) MC9S12XE-Family Reference Manual , Rev. 1.21 778 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 If next transfer begins here SAMPLE I MOSI/MISO Chapter 21 Serial Peripheral Interface (S12SPIV5) End of Idle State SCK Edge Number SCK (CPOL = 0) SCK (CPOL = 1) 1 2 3 4 Begin 5 6 7 8 9 10 11 12 13 Transfer 14 15 16 17 18 19 20 21 22 23 24 End 25 26 27 28 29 30 31 32 Begin of Idle State CHANGE O MOSI pin CHANGE O MISO pin SEL SS (O) Master only SEL SS (I) tL MSB first (LSBFE = 0) LSB first (LSBFE = 1) MSB Bit 14Bit 13Bit 12Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14 MSB tT tI tL Minimum 1/2 SCK for tT, tl, tL tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers tT = Minimum trailing time after the last SCK edge tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers Figure 21-15. SPI Clock Format 1 (CPHA = 1), with 16-Bit Transfer Width selected (XFRW = 1) The SS line can remain active low between successive transfers (can be tied low at all times). This format is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data line. * Back-to-back transfers in master mode In master mode, if a transmission has completed and new data is available in the SPI data register, this data is sent out immediately without a trailing and minimum idle time. The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one half SCK cycle after the last SCK edge. 21.4.4 SPI Baud Rate Generation Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2, SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in the SPI baud rate. The SPI clock rate is determined by the product of the value in the baud rate preselection bits (SPPR2-SPPR0) and the value in the baud rate selection bits (SPR2-SPR0). The module clock divisor equation is shown in Equation 21-3. BaudRateDivisor = (SPPR + 1) * 2(SPR + 1) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 779 If next transfer begins here SAMPLE I MOSI/MISO Eqn. 21-3 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection bits (SPR2-SPR0) are 001 and the preselection bits (SPPR2-SPPR0) are 000, the module clock divisor becomes 4. When the selection bits are 010, the module clock divisor becomes 8, etc. When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 21-7 for baud rate calculations for all bit conditions, based on a 25 MHz bus clock. The two sets of selects allows the clock to be divided by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc. The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking place. In the other cases, the divider is disabled to decrease IDD current. NOTE For maximum allowed baud rates, please refer to the SPI Electrical Specification in the Electricals chapter of this data sheet. 21.4.5 21.4.5.1 Special Features SS Output The SS output feature automatically drives the SS pin low during transmission to select external devices and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin is connected to the SS input pin of the external device. The SS output is available only in master mode during normal SPI operation by asserting SSOE and MODFEN bit as shown in Table 21-3. The mode fault feature is disabled while SS output is enabled. NOTE Care must be taken when using the SS output feature in a multimaster system because the mode fault feature is not available for detecting system errors between masters. 21.4.5.2 Bidirectional Mode (MOMI or SISO) The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 21-11). In this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and MOSI pin in slave mode are not used by the SPI. MC9S12XE-Family Reference Manual , Rev. 1.21 780 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) Table 21-11. Normal Mode and Bidirectional Mode When SPE = 1 Master Mode MSTR = 1 Slave Mode MSTR = 0 Serial Out MOSI Serial In SPI MOSI Normal Mode SPC0 = 0 SPI Serial In MISO Serial Out MISO Serial Out MOMI BIDIROE Serial In BIDIROE SPI Serial Out SISO Bidirectional Mode SPC0 = 1 SPI Serial In The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output, serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift register. * The SCK is output for the master mode and input for the slave mode. * The SS is the input or output for the master mode, and it is always the input for the slave mode. * The bidirectional mode does not affect SCK and SS functions. NOTE In bidirectional master mode, with mode fault enabled, both data pins MISO and MOSI can be occupied by the SPI, though MOSI is normally used for transmissions in bidirectional mode and MISO is not used by the SPI. If a mode fault occurs, the SPI is automatically switched to slave mode. In this case MISO becomes occupied by the SPI and MOSI is not used. This must be considered, if the MISO pin is used for another purpose. 21.4.6 Error Conditions The SPI has one error condition: * Mode fault error 21.4.6.1 Mode Fault Error If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not permitted in normal operation, the MODF bit in the SPI status register is set automatically, provided the MODFEN bit is set. In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 781 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn't occur in slave mode. If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output buffer is disabled. So SCK, MISO, and MOSI pins are forced to be high impedance inputs to avoid any possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is forced into idle state. If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in the bidirectional mode for SPI system configured in slave mode. The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed by a write to SPI control register 1. If the mode fault flag is cleared, the SPI becomes a normal master or slave again. NOTE If a mode fault error occurs and a received data byte is pending in the receive shift register, this data byte will be lost. 21.4.7 21.4.7.1 Low Power Mode Options SPI in Run Mode In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are disabled. 21.4.7.2 SPI in Wait Mode SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI control register 2. * If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode * If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation state when the CPU is in wait mode. - If SPISWAI is set and the SPI is configured for master, any transmission and reception in progress stops at wait mode entry. The transmission and reception resumes when the SPI exits wait mode. If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in progress continues if the SCK continues to be driven from the master. This keeps the slave synchronized to the master and the SCK. If the master transmits several bytes while the slave is in wait mode, the slave will continue to send out bytes consistent with the operation mode at the start of wait mode (i.e., if the slave is currently sending its SPIDR to the master, it will continue to send the same byte. Else if the slave is currently sending the last received byte from the master, it will continue to send each previous master byte). MC9S12XE-Family Reference Manual , Rev. 1.21 782 Freescale Semiconductor - Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) NOTE Care must be taken when expecting data from a master while the slave is in wait or stop mode. Even though the shift register will continue to operate, the rest of the SPI is shut down (i.e., a SPIF interrupt will not be generated until exiting stop or wait mode). Also, the byte from the shift register will not be copied into the SPIDR register until after the slave SPI has exited wait or stop mode. In slave mode, a received byte pending in the receive shift register will be lost when entering wait or stop mode. An SPIF flag and SPIDR copy is generated only if wait mode is entered or exited during a tranmission. If the slave enters wait mode in idle mode and exits wait mode in idle mode, neither a SPIF nor a SPIDR copy will occur. 21.4.7.3 SPI in Stop Mode Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is exchanged correctly. In slave mode, the SPI will stay synchronized with the master. The stop mode is not dependent on the SPISWAI bit. 21.4.7.4 Reset The reset values of registers and signals are described in Section 21.3, "Memory Map and Register Definition", which details the registers and their bit fields. * If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit garbage, or the data last received from the master before the reset. * Reading from the SPIDR after reset will always read zeros. 21.4.7.5 Interrupts The SPI only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following is a description of how the SPI makes a request and how the MCU should acknowledge that request. The interrupt vector offset and interrupt priority are chip dependent. The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request. 21.4.7.5.1 MODF MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the MODF feature (see Table 21-3). After MODF is set, the current transfer is aborted and the following bit is changed: * MSTR = 0, The master bit in SPICR1 resets. The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing process which is described in Section 21.3.2.4, "SPI Status Register (SPISR)". MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 783 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 21 Serial Peripheral Interface (S12SPIV5) 21.4.7.5.2 SPIF SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does not clear until it is serviced. SPIF has an automatic clearing process, which is described in Section 21.3.2.4, "SPI Status Register (SPISR)". 21.4.7.5.3 SPTEF SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing process, which is described in Section 21.3.2.4, "SPI Status Register (SPISR)". MC9S12XE-Family Reference Manual , Rev. 1.21 784 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-1. Revision History Revision Number V02.05 Revision Date 9 Jul 2009 Sections Affected 22.3.2.12/22801 22.3.2.13/22801 22.3.2.15/22803 22.3.2.16/22804 22.3.2.19/22806 22.4.2/22-809 22.4.3/22-809 22.1.2/22-786 22.3.2.15/22803 22.3.2.2/22-792 22.3.2.3/22-793 22.3.2.4/22-794 22.4.3/22-809 Description of Changes - Revised flag clearing procedure, whereby TEN or PAEN bit must be set when clearing flags. - Add fomula to describe prescaler V02.06 26 Aug 2009 - Correct typo: TSCR ->TSCR1 - Correct reference: Figure 1-25 -> Figure 1-31 - Add description, "a counter overflow when TTOV[7] is set", to be the condition of channel 7 override event. - Phrase the description of OC7M to make it more explicit V02.07 04 May 2010 22.3.2.8/22-797 - Add Table 22-10 22.3.2.11/22- - in TCRE bit description part,add Note - Add Figure 22-31 800 22.4.3/22-809 22.1 Introduction The basic timer consists of a 16-bit, software-programmable counter driven by a enhanced programmable prescaler. This timer can be used for many purposes, including input waveform measurements while simultaneously generating an output waveform. Pulse widths can vary from microseconds to many seconds. This timer contains 8 complete input capture/output compare channels and one pulse accumulator. The input capture function is used to detect a selected transition edge and record the time. The output compare function is used for generating output signals or for timer software delays. The 16-bit pulse accumulator is used to operate as a simple event counter or a gated time accumulator. The pulse accumulator shares timer channel 7 when in event mode. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 785 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description A full access for the counter registers or the input capture/output compare registers should take place in one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the same result as accessing them in one word. 22.1.1 Features The TIM16B8CV2 includes these distinctive features: * Eight input capture/output compare channels. * Clock prescaling. * 16-bit counter. * 16-bit pulse accumulator. 22.1.2 Stop: Freeze: Wait: Normal: Modes of Operation Timer is off because clocks are stopped. Timer counter keep on running, unless TSFRZ in TSCR1 (0x0006) is set to 1. Counters keep on running, unless TSWAI in TSCR1 (0x0006) is set to 1. Timer counter keep on running, unless TEN in TSCR1 (0x0006) is cleared to 0. MC9S12XE-Family Reference Manual Rev. 1.22 786 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.1.3 Block Diagrams Channel 0 Input capture Output compare Channel 1 Input capture Output compare Channel 2 Input capture Output compare Channel 3 Input capture Output compare Registers Channel 4 Input capture Output compare Channel 5 Input capture Output compare Bus clock Prescaler IOC0 16-bit Counter IOC1 Timer overflow interrupt Timer channel 0 interrupt IOC2 IOC3 IOC4 IOC5 Timer channel 7 interrupt Channel 6 Input capture Output compare 16-bit Pulse accumulator Channel 7 Input capture Output compare IOC6 PA overflow interrupt PA input interrupt IOC7 Figure 22-1. TIM16B8CV2 Block Diagram MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 787 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description TIMCLK (Timer clock) CLK1 CLK0 4:1 MUX PACLK / 256 Prescaled clock (PCLK) PACLK / 65536 Clock select (PAMOD) PACLK Edge detector PT7 Intermodule Bus Interrupt PACNT MUX Divide by 64 M clock Figure 22-2. 16-Bit Pulse Accumulator Block Diagram 16-bit Main Timer PTn Edge detector Set CnF Interrupt TCn Input Capture Reg. Figure 22-3. Interrupt Flag Setting MC9S12XE-Family Reference Manual Rev. 1.22 788 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description PULSE ACCUMULATOR CHANNEL 7 OUTPUT COMPARE OCPD TEN TIOS7 PAD Figure 22-4. Channel 7 Output Compare/Pulse Accumulator Logic 22.2 External Signal Description The TIM16B8CV2 module has a total of eight external pins. 22.2.1 IOC7 -- Input Capture and Output Compare Channel 7 Pin This pin serves as input capture or output compare for channel 7. This can also be configured as pulse accumulator input. 22.2.2 IOC6 -- Input Capture and Output Compare Channel 6 Pin This pin serves as input capture or output compare for channel 6. 22.2.3 IOC5 -- Input Capture and Output Compare Channel 5 Pin This pin serves as input capture or output compare for channel 5. 22.2.4 IOC4 -- Input Capture and Output Compare Channel 4 Pin This pin serves as input capture or output compare for channel 4. Pin 22.2.5 IOC3 -- Input Capture and Output Compare Channel 3 Pin This pin serves as input capture or output compare for channel 3. 22.2.6 IOC2 -- Input Capture and Output Compare Channel 2 Pin This pin serves as input capture or output compare for channel 2. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 789 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.2.7 IOC1 -- Input Capture and Output Compare Channel 1 Pin This pin serves as input capture or output compare for channel 1. 22.2.8 IOC0 -- Input Capture and Output Compare Channel 0 Pin NOTE For the description of interrupts see Section 22.6, "Interrupts". This pin serves as input capture or output compare for channel 0. 22.3 Memory Map and Register Definition This section provides a detailed description of all memory and registers. 22.3.1 Module Memory Map The memory map for the TIM16B8CV2 module is given below in Figure 22-5. The address listed for each register is the address offset. The total address for each register is the sum of the base address for the TIM16B8CV2 module and the address offset for each register. 22.3.2 Register Descriptions This section consists of register descriptions in address order. Each description includes a standard register diagram with an associated figure number. Details of register bit and field function follow the register diagrams, in bit order. Register Name 0x0000 TIOS 0x0001 CFORC 0x0002 OC7M 0x0003 OC7D 0x0004 TCNTH 0x0005 TCNTL R W R W R W R W R W R W Bit 7 6 5 4 3 2 1 Bit 0 IOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0 0 FOC7 OC7M7 0 FOC6 OC7M6 0 FOC5 OC7M5 0 FOC4 OC7M4 0 FOC3 OC7M3 0 FOC2 OC7M2 0 FOC1 OC7M1 0 FOC0 OC7M0 OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0 TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 = Unimplemented or Reserved Figure 22-5. TIM16B8CV2 Register Summary (Sheet 1 of 3) MC9S12XE-Family Reference Manual Rev. 1.22 790 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Register Name 0x0006 TSCR1 0x0007 TTOV 0x0008 TCTL1 0x0009 TCTL2 0x000A TCTL3 0x000B TCTL4 0x000C TIE 0x000D TSCR2 0x000E TFLG1 0x000F TFLG2 R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 TEN 6 TSWAI 5 TSFRZ 4 TFFCA 3 PRNT 2 0 1 0 Bit 0 0 TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0 OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4 OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0 EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A C7I C6I 0 C5I 0 C4I 0 C3I C2I C1I C0I TOI TCRE PR2 PR1 PR0 C7F C6F 0 C5F 0 C4F 0 C3F 0 C2F 0 C1F 0 C0F 0 TOF Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0x0010-0x001F TCxH-TCxL Bit 7 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0x0020 PACTL 0x0021 PAFLG 0x0022 PACNTH 0x0023 PACNTL 0x0024-0x002B Reserved PAEN 0 PAMOD 0 PEDGE 0 CLK1 0 CLK0 0 PAOVI PAI 0 PAOVF PAIF R PACNT15 W R W R W PACNT7 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 = Unimplemented or Reserved Figure 22-5. TIM16B8CV2 Register Summary (Sheet 2 of 3) MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 791 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Register Name 0x002C OCPD 0x002D R W R Bit 7 OCPD7 6 OCPD6 5 OCPD5 4 OCPD4 3 OCPD3 2 OCPD2 1 OCPD1 Bit 0 OCPD0 0x002E PTPSR 0x002F Reserved R W R W PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 = Unimplemented or Reserved Figure 22-5. TIM16B8CV2 Register Summary (Sheet 3 of 3) 22.3.2.1 Timer Input Capture/Output Compare Select (TIOS) Module Base + 0x0000 7 6 5 4 3 2 1 0 R IOS7 W Reset 0 0 0 0 0 0 0 0 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0 Figure 22-6. Timer Input Capture/Output Compare Select (TIOS) Read: Anytime Write: Anytime Table 22-2. TIOS Field Descriptions Field 7:0 IOS[7:0] Description Input Capture or Output Compare Channel Configuration 0 The corresponding channel acts as an input capture. 1 The corresponding channel acts as an output compare. 22.3.2.2 Timer Compare Force Register (CFORC) Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset 0 FOC7 0 0 FOC6 0 0 FOC5 0 0 FOC4 0 0 FOC3 0 0 FOC2 0 0 FOC1 0 0 FOC0 0 Figure 22-7. Timer Compare Force Register (CFORC) MC9S12XE-Family Reference Manual Rev. 1.22 792 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Read: Anytime but will always return 0x0000 (1 state is transient) Write: Anytime Table 22-3. CFORC Field Descriptions Field 7:0 FOC[7:0] Description Force Output Compare Action for Channel 7:0 -- A write to this register with the corresponding data bit(s) set causes the action which is programmed for output compare "x" to occur immediately. The action taken is the same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not get set. Note: A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides any channel 6:0 compares. If forced output compare on any channel occurs at the same time as the successful output compare then forced output compare action will take precedence and interrupt flag won't get set. 22.3.2.3 Output Compare 7 Mask Register (OC7M) Module Base + 0x0002 7 6 5 4 3 2 1 0 R OC7M7 W Reset 0 0 0 0 0 0 0 0 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0 Figure 22-8. Output Compare 7 Mask Register (OC7M) Read: Anytime Write: Anytime Table 22-4. OC7M Field Descriptions Field 7:0 OC7M[7:0] Description Output Compare 7 Mask -- A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides any channel 6:0 compares. For each OC7M bit that is set, the output compare action reflects the corresponding OC7D bit. 0 The corresponding OC7Dx bit in the output compare 7 data register will not be transferred to the timer port on a channel 7 event, even if the corresponding pin is setup for output compare. 1 The corresponding OC7Dx bit in the output compare 7 data register will be transferred to the timer port on a channel 7 event. Note: The corresponding channel must also be setup for output compare (IOSx = 1 and OCPDx = 0) for data to be transferred from the output compare 7 data register to the timer port. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 793 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.3.2.4 Output Compare 7 Data Register (OC7D) Module Base + 0x0003 7 6 5 4 3 2 1 0 R OC7D7 W Reset 0 0 0 0 0 0 0 0 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0 Figure 22-9. Output Compare 7 Data Register (OC7D) Read: Anytime Write: Anytime Table 22-5. OC7D Field Descriptions Field 7:0 OC7D[7:0] Description Output Compare 7 Data -- A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, can cause bits in the output compare 7 data register to transfer to the timer port data register depending on the output compare 7 mask register. 22.3.2.5 Timer Count Register (TCNT) Module Base + 0x0004 15 14 13 12 11 10 9 9 R TCNT15 W Reset 0 0 0 0 0 0 0 0 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8 Figure 22-10. Timer Count Register High (TCNTH) Module Base + 0x0005 7 6 5 4 3 2 1 0 R TCNT7 W Reset 0 0 0 0 0 0 0 0 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0 Figure 22-11. Timer Count Register Low (TCNTL) The 16-bit main timer is an up counter. A full access for the counter register should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. Read: Anytime MC9S12XE-Family Reference Manual Rev. 1.22 794 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Write: Has no meaning or effect in the normal mode; only writable in special modes (test_mode = 1). The period of the first count after a write to the TCNT registers may be a different size because the write is not synchronized with the prescaler clock. 22.3.2.6 Timer System Control Register 1 (TSCR1) Module Base + 0x0006 7 6 5 4 3 2 1 0 R TEN W Reset 0 0 0 0 0 TSWAI TSFRZ TFFCA PRNT 0 0 0 0 0 0 = Unimplemented or Reserved Figure 22-12. Timer System Control Register 1 (TSCR1) Read: Anytime Write: Anytime Table 22-6. TSCR1 Field Descriptions Field 7 TEN Description Timer Enable 0 Disables the main timer, including the counter. Can be used for reducing power consumption. 1 Allows the timer to function normally. If for any reason the timer is not active, there is no /64 clock for the pulse accumulator because the /64 is generated by the timer prescaler. Timer Module Stops While in Wait 0 Allows the timer module to continue running during wait. 1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU out of wait. TSWAI also affects pulse accumulator. Timer Stops While in Freeze Mode 0 Allows the timer counter to continue running while in freeze mode. 1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation. TSFRZ does not stop the pulse accumulator. 6 TSWAI 5 TSFRZ MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 795 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-6. TSCR1 Field Descriptions (continued) Field 4 TFFCA Description Timer Fast Flag Clear All 0 Allows the timer flag clearing to function normally. 1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010-0x001F) causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT register (0x0004, 0x0005) clears the TOF flag. Any access to the PACNT registers (0x0022, 0x0023) clears the PAOVF and PAIF flags in the PAFLG register (0x0021). This has the advantage of eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to unintended accesses. Precision Timer 0 Enables legacy timer. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler selection. 1 Enables precision timer. All bits of the PTPSR register are used for Precision Timer Prescaler Selection, and all bits. This bit is writable only once out of reset. 3 PRNT 22.3.2.7 Timer Toggle On Overflow Register 1 (TTOV) Module Base + 0x0007 7 6 5 4 3 2 1 0 R TOV7 W Reset 0 0 0 0 0 0 0 0 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0 Figure 22-13. Timer Toggle On Overflow Register 1 (TTOV) Read: Anytime Write: Anytime Table 22-7. TTOV Field Descriptions Field 7:0 TOV[7:0] Description Toggle On Overflow Bits -- TOVx toggles output compare pin on overflow. This feature only takes effect when in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override events. 0 Toggle output compare pin on overflow feature disabled. 1 Toggle output compare pin on overflow feature enabled. MC9S12XE-Family Reference Manual Rev. 1.22 796 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2) Module Base + 0x0008 7 6 5 4 3 2 1 0 R OM7 W Reset 0 0 0 0 0 0 0 0 OL7 OM6 OL6 OM5 OL5 OM4 OL4 Figure 22-14. Timer Control Register 1 (TCTL1) Module Base + 0x0009 7 6 5 4 3 2 1 0 R OM3 W Reset 0 0 0 0 0 0 0 0 OL3 OM2 OL2 OM1 OL1 OM0 OL0 Figure 22-15. Timer Control Register 2 (TCTL2) Read: Anytime Write: Anytime Table 22-8. TCTL1/TCTL2 Field Descriptions Field 7:0 OMx Description Output Mode -- These eight pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OMx bits on timer port, the corresponding bit in OC7M should be cleared. For an output line to be driven by an OCx the OCPDx must be cleared. Output Level -- These eight pairs of control bits are encoded to specify the output action to be taken as a result of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to OCx. Note: To enable output action by OLx bits on timer port, the corresponding bit in OC7M should be cleared. For an output line to be driven by an OCx the OCPDx must be cleared. 7:0 OLx Table 22-9. Compare Result Output Action OMx 0 0 1 1 OLx 0 1 0 1 Action No output compare action on the timer output signal Toggle OCx output line Clear OCx output line to zero Set OCx output line to one MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 797 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description To operate the 16-bit pulse accumulator independently of input capture or output compare 7 and 0 respectively the user must set the corresponding bits IOSx = 1, OMx = 0 and OLx = 0. OC7M7 in the OC7M register must also be cleared. To enable output action using the OM7 and OL7 bits on the timer port,the corresponding bit OC7M7 in the OC7M register must also be cleared. The settings for these bits can be seen in Table 22-10 Table 22-10. The OC7 and OCx event priority OC7M7=0 OC7Mx=1 TC7=TCx TC7>TCx IOCx=OC7Dx IOCx=OC7Dx IOC7=OM7/O +OMx/OLx IOC7=OM7/O L7 L7 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OMx/OLx IOC7=OM7/OL7 OC7Mx=1 TC7=TCx TC7>TCx IOCx=OC7Dx IOCx=OC7Dx IOC7=OC7D7 +OMx/OLx IOC7=OC7D7 OC7M7=1 OC7Mx=0 TC7=TCx TC7>TCx IOCx=OMx/OLx IOC7=OC7D7 Note: in Table 22-10, the IOS7 and IOSx should be set to 1 IOSx is the register TIOS bit x, OC7Mx is the register OC7M bit x, TCx is timer Input Capture/Output Compare register, IOCx is channel x, OMx/OLx is the register TCTL1/TCTL2, OC7Dx is the register OC7D bit x. IOCx = OC7Dx+ OMx/OLx, means that both OC7 event and OCx event will change channel x value. 22.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3 and TCTL4) Module Base + 0x000A 7 6 5 4 3 2 1 0 R EDG7B W Reset 0 0 0 0 0 0 0 0 EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A Figure 22-16. Timer Control Register 3 (TCTL3) Module Base + 0x000B 7 6 5 4 3 2 1 0 R EDG3B W Reset 0 0 0 0 0 0 0 0 EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A Figure 22-17. Timer Control Register 4 (TCTL4) MC9S12XE-Family Reference Manual Rev. 1.22 798 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Read: Anytime Write: Anytime. Table 22-11. TCTL3/TCTL4 Field Descriptions Field 7:0 EDGnB EDGnA Description Input Capture Edge Control -- These eight pairs of control bits configure the input capture edge detector circuits. Table 22-12. Edge Detector Circuit Configuration EDGnB 0 0 1 1 EDGnA 0 1 0 1 Configuration Capture disabled Capture on rising edges only Capture on falling edges only Capture on any edge (rising or falling) 22.3.2.10 Timer Interrupt Enable Register (TIE) Module Base + 0x000C 7 6 5 4 3 2 1 0 R C7I W Reset 0 0 0 0 0 0 0 0 C6I C5I C4I C3I C2I C1I C0I Figure 22-18. Timer Interrupt Enable Register (TIE) Read: Anytime Write: Anytime. Table 22-13. TIE Field Descriptions Field 7:0 C7I:C0I Description Input Capture/Output Compare "x" Interrupt Enable -- The bits in TIE correspond bit-for-bit with the bits in the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set, the corresponding flag is enabled to cause a interrupt. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 799 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.3.2.11 Timer System Control Register 2 (TSCR2) Module Base + 0x000D 7 6 5 4 3 2 1 0 R TOI W Reset 0 0 0 0 TCRE PR2 0 PR1 0 PR0 0 0 0 0 0 = Unimplemented or Reserved Figure 22-19. Timer System Control Register 2 (TSCR2) Read: Anytime Write: Anytime. Table 22-14. TSCR2 Field Descriptions Field 7 TOI 3 TCRE Description Timer Overflow Interrupt Enable 0 Interrupt inhibited. 1 Hardware interrupt requested when TOF flag set. Timer Counter Reset Enable -- This bit allows the timer counter to be reset by a successful output compare 7 event. This mode of operation is similar to an up-counting modulus counter. 0 Counter reset inhibited and counter free runs. 1 Counter reset by a successful output compare 7. Note: If TC7 = 0x0000 and TCRE = 1, TCNT will stay at 0x0000 continuously. If TC7 = 0xFFFF and TCRE = 1, TOF will never be set when TCNT is reset from 0xFFFF to 0x0000. Note: TCRE=1 and TC7!=0, the TCNT cycle period will be TC7 x "prescaler counter width" + "1 Bus Clock", for a more detail explanation please refer to Section 22.4.3, "Output Compare Timer Prescaler Select -- These three bits select the frequency of the timer prescaler clock derived from the Bus Clock as shown in Table 22-15. 2 PR[2:0] Table 22-15. Timer Clock Selection PR2 0 0 0 0 1 1 1 1 PR1 0 0 1 1 0 0 1 1 PR0 0 1 0 1 0 1 0 1 Timer Clock Bus Clock / 1 Bus Clock / 2 Bus Clock / 4 Bus Clock / 8 Bus Clock / 16 Bus Clock / 32 Bus Clock / 64 Bus Clock / 128 MC9S12XE-Family Reference Manual Rev. 1.22 800 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description NOTE The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. 22.3.2.12 Main Timer Interrupt Flag 1 (TFLG1) Module Base + 0x000E 7 6 5 4 3 2 1 0 R C7F W Reset 0 0 0 0 0 0 0 0 C6F C5F C4F C3F C2F C1F C0F Figure 22-20. Main Timer Interrupt Flag 1 (TFLG1) Read: Anytime Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero will not affect current status of the bit. Table 22-16. TRLG1 Field Descriptions Field 7:0 C[7:0]F Description Input Capture/Output Compare Channel "x" Flag -- These flags are set when an input capture or output compare event occurs. Clearing requires writing a one to the corresponding flag bit while TEN or PAEN is set to one. When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel (0x0010-0x001F) will cause the corresponding channel flag CxF to be cleared. 22.3.2.13 Main Timer Interrupt Flag 2 (TFLG2) Module Base + 0x000F 7 6 5 4 3 2 1 0 R TOF W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Unimplemented or Reserved Figure 22-21. Main Timer Interrupt Flag 2 (TFLG2) TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit to one while TEN bit of TSCR1 or PAEN bit of PACTL is set to one. Read: Anytime Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared). Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 801 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-17. TRLG2 Field Descriptions Field 7 TOF Description Timer Overflow Flag -- Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. Clearing this bit requires writing a one to bit 7 of TFLG2 register while the TEN bit of TSCR1 or PAEN bit of PACTL is set to one (See also TCRE control bit explanation.) 22.3.2.14 Timer Input Capture/Output Compare Registers High and Low 0-7 (TCxH and TCxL) Module Base + 0x0010 = TC0H 0x0012 = TC1H 0x0014 = TC2H 0x0016 = TC3H 15 14 0x0018 = TC4H 0x001A = TC5H 0x001C = TC6H 0x001E = TC7H 13 12 11 10 9 0 R Bit 15 W Reset 0 0 0 0 0 0 0 0 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Figure 22-22. Timer Input Capture/Output Compare Register x High (TCxH) Module Base + 0x0011 = TC0L 0x0013 = TC1L 0x0015 = TC2L 0x0017 = TC3L 7 6 0x0019 = TC4L 0x001B = TC5L 0x001D = TC6L 0x001F = TC7L 5 4 3 2 1 0 R Bit 7 W Reset 0 0 0 0 0 0 0 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Figure 22-23. Timer Input Capture/Output Compare Register x Low (TCxL) Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the free-running counter when a defined transition is sensed by the corresponding input capture edge detector or to trigger an output action for output compare. Read: Anytime Write: Anytime for output compare function.Writes to these registers have no meaning or effect during input capture. All timer input capture/output compare registers are reset to 0x0000. NOTE Read/Write access in byte mode for high byte should takes place before low byte otherwise it will give a different result. MC9S12XE-Family Reference Manual Rev. 1.22 802 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.3.2.15 16-Bit Pulse Accumulator Control Register (PACTL) Module Base + 0x0020 7 6 5 4 3 2 1 0 R W Reset 0 PAEN 0 0 PAMOD 0 PEDGE 0 CLK1 0 CLK0 0 PAOVI 0 PAI 0 Unimplemented or Reserved Figure 22-24. 16-Bit Pulse Accumulator Control Register (PACTL) When PAEN is set, the PACT is enabled.The PACT shares the input pin with IOC7. Read: Any time Write: Any time Table 22-18. PACTL Field Descriptions Field 6 PAEN Description Pulse Accumulator System Enable -- PAEN is independent from TEN. With timer disabled, the pulse accumulator can function unless pulse accumulator is disabled. 0 16-Bit Pulse Accumulator system disabled. 1 Pulse Accumulator system enabled. Pulse Accumulator Mode -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). See Table 22-19. 0 Event counter mode. 1 Gated time accumulation mode. Pulse Accumulator Edge Control -- This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). For PAMOD bit = 0 (event counter mode). See Table 22-19. 0 Falling edges on IOC7 pin cause the count to be incremented. 1 Rising edges on IOC7 pin cause the count to be incremented. For PAMOD bit = 1 (gated time accumulation mode). 0 IOC7 input pin high enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing falling edge on IOC7 sets the PAIF flag. 1 IOC7 input pin low enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing rising edge on IOC7 sets the PAIF flag. Clock Select Bits -- Refer to Table 22-20. Pulse Accumulator Overflow Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAOVF is set. Pulse Accumulator Input Interrupt Enable 0 Interrupt inhibited. 1 Interrupt requested if PAIF is set. 5 PAMOD 4 PEDGE 3:2 CLK[1:0] 1 PAOVI 0 PAI MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 803 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-19. Pin Action PAMOD 0 0 1 1 PEDGE 0 1 0 1 Pin Action Falling edge Rising edge Div. by 64 clock enabled with pin high level Div. by 64 clock enabled with pin low level NOTE If the timer is not active (TEN = 0 in TSCR), there is no divide-by-64 because the /64 clock is generated by the timer prescaler. Table 22-20. Timer Clock Selection CLK1 0 0 1 1 CLK0 0 1 0 1 Timer Clock Use timer prescaler clock as timer counter clock Use PACLK as input to timer counter clock Use PACLK/256 as timer counter clock frequency Use PACLK/65536 as timer counter clock frequency For the description of PACLK please refer Figure 22-30. If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an input clock to the timer counter. The change from one selected clock to the other happens immediately after these bits are written. 22.3.2.16 Pulse Accumulator Flag Register (PAFLG) Module Base + 0x0021 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 PAOVF PAIF 0 0 0 0 0 0 0 0 Unimplemented or Reserved Figure 22-25. Pulse Accumulator Flag Register (PAFLG) Read: Anytime Write: Anytime When the TFFCA bit in the TSCR register is set, any access to the PACNT register will clear all the flags in the PAFLG register. Timer module or Pulse Accumulator must stay enabled (TEN=1 or PAEN=1) while clearing these bits. MC9S12XE-Family Reference Manual Rev. 1.22 804 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-21. PAFLG Field Descriptions Field 1 PAOVF Description Pulse Accumulator Overflow Flag -- Set when the 16-bit pulse accumulator overflows from 0xFFFF to 0x0000. Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of PACTL register is set to one. Pulse Accumulator Input edge Flag -- Set when the selected edge is detected at the IOC7 input pin.In event mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at the IOC7 input pin triggers PAIF. Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of PACTL register is set to one. Any access to the PACNT register will clear all the flags in this register when TFFCA bit in register TSCR(0x0006) is set. 0 PAIF 22.3.2.17 Pulse Accumulators Count Registers (PACNT) Module Base + 0x0022 15 14 13 12 11 10 9 0 R PACNT15 W Reset 0 0 0 0 0 0 0 0 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8 Figure 22-26. Pulse Accumulator Count Register High (PACNTH) Module Base + 0x0023 7 6 5 4 3 2 1 0 R PACNT7 W Reset 0 0 0 0 0 0 0 0 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 Figure 22-27. Pulse Accumulator Count Register Low (PACNTL) Read: Anytime Write: Anytime These registers contain the number of active input edges on its input pin since the last reset. When PACNT overflows from 0xFFFF to 0x0000, the Interrupt flag PAOVF in PAFLG (0x0021) is set. Full count register access should take place in one clock cycle. A separate read/write for high byte and low byte will give a different result than accessing them as a word. NOTE Reading the pulse accumulator counter registers immediately after an active edge on the pulse accumulator input pin may miss the last count because the input has to be synchronized with the bus clock first. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 805 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.3.2.18 Output Compare Pin Disconnect Register(OCPD) Module Base + 0x002C 7 6 5 4 3 2 1 0 R OCPD7 W Reset 0 0 0 0 0 0 0 0 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0 Figure 22-28. Ouput Compare Pin Disconnect Register (OCPD) Read: Anytime Write: Anytime All bits reset to zero. Table 22-22. OCPD Field Description Field Description Output Compare Pin Disconnect Bits 0 Enables the timer channel port. Ouptut Compare action will occur on the channel pin. These bits do not affect the input capture or pulse accumulator functions 1 Disables the timer channel port. Output Compare action will not occur on the channel pin, but the output compare flag still become set . OCPD[7:0} 22.3.2.19 Precision Timer Prescaler Select Register (PTPSR) Module Base + 0x002E 7 6 5 4 3 2 1 0 R PTPS7 W Reset 0 0 0 0 0 0 0 0 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Figure 22-29. Precision Timer Prescaler Select Register (PTPSR) Read: Anytime Write: Anytime All bits reset to zero. MC9S12XE-Family Reference Manual Rev. 1.22 806 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Table 22-23. PTPSR Field Descriptions Field 7:0 PTPS[7:0] Description Precision Timer Prescaler Select Bits -- These eight bits specify the division rate of the main Timer prescaler. These are effective only when the PRNT bit of TSCR1 is set to 1. Table 22-24 shows some selection examples in this case. The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter stages equal zero. The Prescaler can be calculated as follows depending on logical value of the PTPS[7:0] and PRNT bit: PRNT = 1 : Prescaler = PTPS[7:0] + 1 Table 22-24. Precision Timer Prescaler Selection Examples when PRNT = 1 PTPS7 0 0 0 0 0 0 0 0 0 0 0 0 1 PTPS6 0 0 0 0 0 0 0 0 0 0 0 1 1 PTPS5 0 0 0 0 0 0 0 0 0 0 1 1 1 PTPS4 0 0 0 0 0 0 0 0 0 1 1 1 1 PTPS3 0 0 0 0 0 0 0 0 1 1 1 1 1 PTPS2 0 0 0 0 1 1 1 1 1 1 1 1 1 PTPS1 0 0 1 1 0 0 1 1 1 1 1 1 1 PTPS0 0 1 0 1 0 1 0 1 1 1 1 1 1 Prescale Factor 1 2 3 4 5 6 7 8 16 32 64 128 256 22.4 Functional Description This section provides a complete functional description of the timer TIM16B8CV2 block. Please refer to the detailed timer block diagram in Figure 22-30 as necessary. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 807 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Bus Clock CLK[1:0] PR[2:1:0] PACLK PACLK/256 PACLK/65536 channel 7 output compare MUX TCRE CxI CxF PRESCALER TCNT(hi):TCNT(lo) CLEAR COUNTER 16-BIT COUNTER TE CHANNEL 0 16-BIT COMPARATOR TC0 EDG0A EDG0B EDGE DETECT C0F OM:OL0 TOV0 TOF TOI INTERRUPT LOGIC TOF C0F CH. 0 CAPTURE IOC0 PIN LOGIC CH. 0COMPARE IOC0 PIN IOC0 C1F OM:OL1 TOV1 CH. 1 CAPTURE IOC1 PIN LOGIC CH. 1 COMPARE IOC1 PIN CHANNEL 1 16-BIT COMPARATOR TC1 EDG1A EDG1B EDGE DETECT C1F CHANNEL2 IOC1 CHANNEL7 16-BIT COMPARATOR TC7 EDG7A EDG7B EDGE DETECT C7F OM:OL7 TOV7 C7F CH.7 CAPTURE IOC7 PIN PA INPUT LOGIC CH. 7 COMPARE IOC7 PIN IOC7 PAOVF PACNT(hi):PACNT(lo) PEDGE PAE EDGE DETECT PACLK/65536 PACLK/256 INTERRUPT REQUEST PAOVI PAOVF 16-BIT COUNTER PACLK TEN INTERRUPT LOGIC DIVIDE-BY-64 PAI PAIF PAIF Bus Clock PAOVF PAOVI Figure 22-30. Detailed Timer Block Diagram 22.4.1 Prescaler The prescaler divides the bus clock by 1,2,4,8,16,32,64 or 128. The prescaler select bits, PR[2:0], select the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2). MC9S12XE-Family Reference Manual Rev. 1.22 808 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description The prescaler divides the bus clock by a prescalar value. Prescaler select bits PR[2:0] of in timer system control register 2 (TSCR2) are set to define a prescalar value that generates a divide by 1, 2, 4, 8, 16, 32, 64 and 128 when the PRNT bit in TSCR1 is disabled. By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this case, it is possible to set additional prescaler settings for the main timer counter in the present timer by using PTPSR[7:0] bits of PTPSR register. 22.4.2 Input Capture Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The input capture function captures the time at which an external event occurs. When an active edge occurs on the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel registers, TCx. The minimum pulse width for the input capture input is greater than two bus clocks. An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of PACTL regsiter must be set to one) while clearing CxF (writing one to CxF). 22.4.3 Output Compare Setting the I/O select bit, IOSx, configures channel x as an output compare channel. The output compare function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the timer counter reaches the value in the channel registers of an output compare channel, the timer can set, clear, or toggle the channel pin if the corresponding OCPDx bit is set to zero. An output compare on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests. Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of PACTL regsiter must be set to one) while clearing CxF (writing one to CxF). The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both OMx and OLx results in no output compare action on the output compare channel pin. Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output compare does not set the channel flag. A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides output compares on all other output compare channels. The output compare 7 mask register masks the bits in the output compare 7 data register. The timer counter reset enable bit, TCRE, enables channel 7 output compares to reset the timer counter. A channel 7 output compare can reset the timer counter even if the IOC7 pin is being used as the pulse accumulator input. Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is stored in an internal latch. When the pin becomes available for general-purpose output, the last value written to the bit appears at the pin. When TCRE is set and TC7 is not equal to 0, then TCNT will cycle from 0 to TC7. When TCNT reaches TC7 value, it lasts only one bus cycle then resets to 0. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 809 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description Note: in Figure 22-31, if PR[2:0] is equal to 0, one prescaler counter is equal to one bus clock Figure 22-31. The TCNT cycle diagram under TCRE=1 condition prescaler counter TC7 0 1 bus clock 1 ----TC7-1 TC7 0 TC7 event TC7 event 22.4.3.1 OC Channel Initialization Internal register whose output drives OCx can be programmed before timer drives OCx. The desired state can be programmed to this Internal register by writing a one to CFORCx bit with TIOSx, OCPDx and TEN bits set to one. Setting OCPDx to zero allows Interal register to drive the programmed state to OCx. This allows a glitch free switch over of port from general purpose I/O to timer output once the OCPDx bit is set to zero. 22.4.4 Pulse Accumulator The pulse accumulator (PACNT) is a 16-bit counter that can operate in two modes: Event counter mode -- Counting edges of selected polarity on the pulse accumulator input pin, PAI. Gated time accumulation mode -- Counting pulses from a divide-by-64 clock. The PAMOD bit selects the mode of operation. The minimum pulse width for the PAI input is greater than two bus clocks. 22.4.5 Event Counter Mode Clearing the PAMOD bit configures the PACNT for event counter operation. An active edge on the IOC7 pin increments the pulse accumulator counter. The PEDGE bit selects falling edges or rising edges to increment the count. NOTE The PACNT input and timer channel 7 use the same pin IOC7. To use the IOC7, disconnect it from the output logic by clearing the channel 7 output mode and output level bits, OM7 and OL7. Also clear the channel 7 output compare 7 mask bit, OC7M7. The Pulse Accumulator counter register reflect the number of active input edges on the PACNT input pin since the last reset. The PAOVF bit is set when the accumulator rolls over from 0xFFFF to 0x0000. The pulse accumulator overflow interrupt enable bit, PAOVI, enables the PAOVF flag to generate interrupt requests. MC9S12XE-Family Reference Manual Rev. 1.22 810 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description NOTE The pulse accumulator counter can operate in event counter mode even when the timer enable bit, TEN, is clear. 22.4.6 Gated Time Accumulation Mode Setting the PAMOD bit configures the pulse accumulator for gated time accumulation operation. An active level on the PACNT input pin enables a divided-by-64 clock to drive the pulse accumulator. The PEDGE bit selects low levels or high levels to enable the divided-by-64 clock. The trailing edge of the active level at the IOC7 pin sets the PAIF. The PAI bit enables the PAIF flag to generate interrupt requests. The pulse accumulator counter register reflect the number of pulses from the divided-by-64 clock since the last reset. NOTE The timer prescaler generates the divided-by-64 clock. If the timer is not active, there is no divided-by-64 clock. 22.5 Resets The reset state of each individual bit is listed within Section 22.3, "Memory Map and Register Definition" which details the registers and their bit fields. 22.6 Interrupts This section describes interrupts originated by the TIM16B8CV2 block. Table 22-25 lists the interrupts generated by the TIM16B8CV2 to communicate with the MCU. Table 22-25. TIM16B8CV1 Interrupts Interrupt C[7:0]F PAOVI PAOVF TOF 1. Chip Dependent. Offset (1) Vector1 -- -- -- -- Priority1 -- -- -- -- Source Timer Channel 7-0 Pulse Accumulator Input Pulse Accumulator Overflow Timer Overflow Description Active high timer channel interrupts 7-0 Active high pulse accumulator input interrupt Pulse accumulator overflow interrupt Timer Overflow interrupt -- -- -- -- The TIM16B8CV2 uses a total of 11 interrupt vectors. The interrupt vector offsets and interrupt numbers are chip dependent. MC9S12XE-Family Reference Manual Rev. 1.22 Freescale Semiconductor 811 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 22 Timer Module (TIM16B8CV2) Block Description 22.6.1 Channel [7:0] Interrupt (C[7:0]F) This active high outputs will be asserted by the module to request a timer channel 7 - 0 interrupt to be serviced by the system controller. 22.6.2 Pulse Accumulator Input Interrupt (PAOVI) This active high output will be asserted by the module to request a timer pulse accumulator input interrupt to be serviced by the system controller. 22.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) This active high output will be asserted by the module to request a timer pulse accumulator overflow interrupt to be serviced by the system controller. 22.6.4 Timer Overflow Interrupt (TOF) This active high output will be asserted by the module to request a timer overflow interrupt to be serviced by the system controller. MC9S12XE-Family Reference Manual Rev. 1.22 812 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-1. Revision History Revision Number V01.02 V01.03 V01.04 Revision Date 09 Sep 2005 23 Sep 2005 08 Jun 2007 Sections Affected Description of Changes 23.3.2.3/23-820 - Updates for API external access and LVR flags. 23.3.2.1/23-818 - VAE reset value is 1. 23.4.6/23-825 - Added temperature sensor to customer information 23.1 Introduction Module VREG_3V3 is a tri output voltage regulator that provides two separate 1.84V (typical) supplies differing in the amount of current that can be sourced and a 2.82V (typical) supply. The regulator input voltage range is from 3.3V up to 5V (typical). 23.1.1 Features Module VREG_3V3 includes these distinctive features: * Three parallel, linear voltage regulators with bandgap reference * Low-voltage detect (LVD) with low-voltage interrupt (LVI) * Power-on reset (POR) * Low-voltage reset (LVR) * High Temperature Detect (HTD) with High Temperature Interrupt (HTI) * Autonomous periodical interrupt (API) 23.1.2 Modes of Operation There are three modes VREG_3V3 can operate in: 1. Full performance mode (FPM) (MCU is not in stop mode) The regulator is active, providing the nominal supply voltages with full current sourcing capability. Features LVD (low-voltage detect), LVR (low-voltage reset), and POR (power-on reset) and HTD (High Temperature Detect) are available. The API is available. 2. Reduced power mode (RPM) (MCU is in stop mode) The purpose is to reduce power consumption of the device. The output voltage may degrade to a lower value than in full performance mode, additionally the current sourcing capability is substantially reduced. Only the POR is available in this mode, LVD, LVR and HTD are disabled. The API is available. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 813 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 3. Shutdown mode Controlled by VREGEN (see device level specification for connectivity of VREGEN). This mode is characterized by minimum power consumption. The regulator outputs are in a highimpedance state, only the POR feature is available, LVD, LVR and HTD are disabled. The API internal RC oscillator clock is not available. This mode must be used to disable the chip internal regulator VREG_3V3, i.e., to bypass the VREG_3V3 to use external supplies. 23.1.3 Block Diagram Figure 23-1 shows the function principle of VREG_3V3 by means of a block diagram. The regulator core REG consists of three parallel subblocks, REG1, REG2 and REG3, providing three independent output voltages. MC9S12XE-Family Reference Manual , Rev. 1.21 814 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) VBG VDDPLL REG3 VDDR REG VDDA VSSA REG1 REG2 VSSPLL VDDF VDD VSS LVD VDDX LVR LVR POR POR C HTD VREGEN CTRL HTI LVI API API API Rate Select Bus Clock LVD: Low Voltage Detect LVR: Low Voltage Reset POR: Power-on Reset HTD: High Temperature Detect REG: Regulator Core CTRL: Regulator Control API: Auto. Periodical Interrupt PIN Figure 23-1. VREG_3V3 Block Diagram MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 815 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.2 External Signal Description Due to the nature of VREG_3V3 being a voltage regulator providing the chip internal power supply voltages, most signals are power supply signals connected to pads. Table 23-2 shows all signals of VREG_3V3 associated with pins. Table 23-2. Signal Properties Name VDDR VDDA VSSA VDDX VDD VSS VDDF VDDPLL VSSPLL VREGEN (optional) VREG_API (optional) Function Power input (positive supply) Quiet input (positive supply) Quiet input (ground) Power input (positive supply) Primary output (positive supply) Primary output (ground) Secondary output (positive supply) Tertiary output (positive supply) Tertiary output (ground) Optional Regulator Enable VREG Autonomous Periodical Interrupt output Reset State -- -- -- -- -- -- -- -- -- -- -- Pull Up -- -- -- -- -- -- -- -- -- -- -- NOTE Check device level specification for connectivity of the signals. 23.2.1 VDDR -- Regulator Power Input Pins Signal VDDR is the power input of VREG_3V3. All currents sourced into the regulator loads flow through this pin. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDR and VSSR (if VSSR is not available VSS) can smooth ripple on VDDR. For entering Shutdown Mode, pin VDDR should also be tied to ground on devices without VREGEN pin. 23.2.2 VDDA, VSSA -- Regulator Reference Supply Pins Signals VDDA/VSSA, which are supposed to be relatively quiet, are used to supply the analog parts of the regulator. Internal precision reference circuits are supplied from these signals. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDA and VSSA can further improve the quality of this supply. 23.2.3 VDD, VSS -- Regulator Output1 (Core Logic) Pins Signals VDD/VSS are the primary outputs of VREG_3V3 that provide the power supply for the core logic. These signals are connected to device pins to allow external decoupling capacitors (220 nF, X7R ceramic). In Shutdown Mode an external supply driving VDD/VSS can replace the voltage regulator. MC9S12XE-Family Reference Manual , Rev. 1.21 816 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.2.4 VDDF -- Regulator Output2 (NVM Logic) Pins Signals VDDF/VSS are the secondary outputs of VREG_3V3 that provide the power supply for the NVM logic. These signals are connected to device pins to allow external decoupling capacitors (220 nF, X7R ceramic). In Shutdown Mode an external supply driving VDDF/VSS can replace the voltage regulator. 23.2.5 VDDPLL, VSSPLL -- Regulator Output3 (PLL) Pins Signals VDDPLL/VSSPLL are the secondary outputs of VREG_3V3 that provide the power supply for the PLL and oscillator. These signals are connected to device pins to allow external decoupling capacitors (100 nF...220 nF, X7R ceramic). In Shutdown Mode, an external supply driving VDDPLL/VSSPLL can replace the voltage regulator. 23.2.6 VDDX -- Power Input Pin Signals VDDX/VSS are monitored by VREG_3V3 with the LVR feature. 23.2.7 VREGEN -- Optional Regulator Enable Pin This optional signal is used to shutdown VREG_3V3. In that case, VDD/VSS and VDDPLL/VSSPLL must be provided externally. Shutdown mode is entered with VREGEN being low. If VREGEN is high, the VREG_3V3 is either in Full Performance Mode or in Reduced Power Mode. For the connectivity of VREGEN, see device specification. NOTE Switching from FPM or RPM to shutdown of VREG_3V3 and vice versa is not supported while MCU is powered. 23.2.8 VREG_API -- Optional Autonomous Periodical Interrupt Output Pin This pin provides the signal selected via APIEA if system is set accordingly. See 23.3.2.3, "Autonomous Periodical Interrupt Control Register (VREGAPICL) and 23.4.8, "Autonomous Periodical Interrupt (API) for details. For the connectivity of VREG_API, see device specification. 23.3 Memory Map and Register Definition This section provides a detailed description of all registers accessible in VREG_3V3. If enabled in the system, the VREG_3V3 will abort all read and write accesses to reserved registers within it's memory slice. See device level specification for details. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 817 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.3.1 Module Memory Map A summary of the registers associated with the VREG_3V3 sub-block is shown in Figure 23-2. Detailed descriptions of the registers and bits are given in the subsections that follow Figure 23-2. Register Summary Address 0x02F0 Name R VREGHTCL W VREGCTRL R W Bit 7 0 6 0 5 VSEL 0 4 VAE 0 3 HTEN 0 2 HTDS 1 HTIE Bit 0 HTIF 0x02F1 0 0 LVDS LVIE LVIF 0x02F2 VREGAPIC R L W VREGAPIT R R W VREGAPIR R H W VREGAPIR R L W Reserved 06 VREGHTTR R W R W APICLK 0 0 APIFES APIEA APIFE APIE 0 APIF 0 0x02F3 APITR5 APITR4 APITR3 APITR2 APITR1 APITR0 0x02F4 APIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8 0x02F5 APIR7 0 APIR6 0 APIR5 0 APIR4 0 APIR3 0 APIR2 0 APIR1 0 APIR0 0 0x02F6 0x02F7 HTOEN 0 0 0 HTTR3 HTTR2 HTTR1 HTTR0 23.3.2 Register Descriptions This section describes all the VREG_3V3 registers and their individual bits. 23.3.2.1 0x02F0 High Temperature Control Register (VREGHTCL) The VREGHTCL register allows to configure the VREG temperature sense features. 7 6 5 4 3 2 1 0 R W Reset 0 0 VSEL VAE 1 HTEN 0 HTDS HTIE 0 0 HTIF 0 0 0 0 = Unimplemented or Reserved MC9S12XE-Family Reference Manual , Rev. 1.21 818 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-3. VREGHTCL Field Descriptions Field 7, 6 Reserved 5 VSEL Description These reserved bits are used for test purposes and writable only in special modes. They must remain clear for correct temperature sensor operation. Voltage Access Select Bit -- If set, the bandgap reference voltage VBG can be accessed internally (i.e. multiplexed to an internal Analog to Digital Converter channel). The internal access must be enabled by bit VAE. See device level specification for connectivity. 0 An internal temperature proportional voltage VHT can be accessed internally if VAE is set. 1 Bandgap reference voltage VBG can be accessed internally if VAE is set. Voltage Access Enable Bit -- If set, the voltage selected by bit VSEL can be accessed internally (i.e. multiplexed to an internal Analog to Digital Converter channel). See device level specification for connectivity. 0 Voltage selected by VSEL can not be accessed internally (i.e. External analog input is connected to Analog to Digital Converter channel). 1 Voltage selected by VSEL can be accessed internally. High Temperature Enable Bit -- If set the temperature sense is enabled. 0 The temperature sense is disabled. 1 The temperature sense is enabled. High Temperature Detect Status Bit -- This read-only status bit reflects the temperature status. Writes have no effect. 0 Temperature TDIE is below level THTID or RPM or Shutdown Mode. 1 Temperature TDIE is above level THTIA and FPM. High Temperature Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever HTIF is set. High Temperature Interrupt Flag -- HTIF -- High Temperature Interrupt Flag HTIF is set to 1 when HTDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (HTIE=1), HTIF causes an interrupt request. 0 No change in HTDS bit. 1 HTDS bit has changed. Note: On entering the reduced power mode the HTIF is not cleared by the VREG. 4 VAE 3 HTEN 2 HTDS 1 HTIE 0 HTIF 23.3.2.2 Control Register (VREGCTRL) The VREGCTRL register allows the configuration of the VREG_3V3 low-voltage detect features. 0x02F1 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 LVDS 0 LVIE 0 LVIF 0 = Unimplemented or Reserved Figure 23-3. Control Register (VREGCTRL) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 819 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-4. VREGCTRL Field Descriptions Field 2 LVDS 1 LVIE 0 LVIF Description Low-Voltage Detect Status Bit -- This read-only status bit reflects the input voltage. Writes have no effect. 0 Input voltage VDDA is above level VLVID or RPM or shutdown mode. 1 Input voltage VDDA is below level VLVIA and FPM. Low-Voltage Interrupt Enable Bit 0 Interrupt request is disabled. 1 Interrupt will be requested whenever LVIF is set. Low-Voltage Interrupt Flag -- LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request. 0 No change in LVDS bit. 1 LVDS bit has changed. Note: On entering the Reduced Power Mode the LVIF is not cleared by the VREG_3V3. 23.3.2.3 Autonomous Periodical Interrupt Control Register (VREGAPICL) The VREGAPICL register allows the configuration of the VREG_3V3 autonomous periodical interrupt features. 0x02F2 7 6 5 4 3 2 1 0 R W Reset APICLK 0 0 0 0 0 APIES 0 APIEA 0 APIFE 0 APIE 0 APIF 0 = Unimplemented or Reserved Figure 23-4. Autonomous Periodical Interrupt Control Register (VREGAPICL) Table 23-5. VREGAPICL Field Descriptions Field 7 APICLK Description Autonomous Periodical Interrupt Clock Select Bit -- Selects the clock source for the API. Writable only if APIFE = 0; APICLK cannot be changed if APIFE is set by the same write operation. 0 Autonomous periodical interrupt clock used as source. 1 Bus clock used as source. Autonomous Periodical Interrupt External Select Bit -- Selects the waveform at the external pin.If set, at the external pin a clock is visible with 2 times the selected API Period (Table 23-9). If not set, at the external pin will be a high pulse at the end of every selected period with the size of half of the min period (Table 23-9). See device level specification for connectivity. 0 At the external periodic high pulses are visible, if APIEA and APIFE is set. 1 At the external pin a clock is visible, if APIEA and APIFE is set. Autonomous Periodical Interrupt External Access Enable Bit -- If set, the waveform selected by bit APIES can be accessed externally. See device level specification for connectivity. 0 Waveform selected by APIES can not be accessed externally. 1 Waveform selected by APIES can be accessed externally, if APIFE is set. Autonomous Periodical Interrupt Feature Enable Bit -- Enables the API feature and starts the API timer when set. 0 Autonomous periodical interrupt is disabled. 1 Autonomous periodical interrupt is enabled and timer starts running. 4 APIES 3 APIEA 2 APIFE MC9S12XE-Family Reference Manual , Rev. 1.21 820 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-5. VREGAPICL Field Descriptions (continued) Field 1 APIE 0 APIF Description Autonomous Periodical Interrupt Enable Bit 0 API interrupt request is disabled. 1 API interrupt will be requested whenever APIF is set. Autonomous Periodical Interrupt Flag -- APIF is set to 1 when the in the API configured time has elapsed. This flag can only be cleared by writing a 1 to it. Clearing of the flag has precedence over setting. Writing a 0 has no effect. If enabled (APIE = 1), APIF causes an interrupt request. 0 API timeout has not yet occurred. 1 API timeout has occurred. 23.3.2.4 Autonomous Periodical Interrupt Trimming Register (VREGAPITR) The VREGAPITR register allows to trim the API timeout period. 0x02F3 7 6 5 4 3 2 1 0 R W Reset APITR5 01 APITR4 01 APITR3 01 APITR2 01 APITR1 01 APITR0 01 0 0 0 0 1. Reset value is either 0 or preset by factory. See Section 1 (Device Overview) for details. = Unimplemented or Reserved Figure 23-5. Autonomous Periodical Interrupt Trimming Register (VREGAPITR) Table 23-6. VREGAPITR Field Descriptions Field 7-2 APITR[5:0] Description Autonomous Periodical Interrupt Period Trimming Bits -- See Table 23-7 for trimming effects. Table 23-7. Trimming Effect of APIT Bit APITR[5] APITR[4] APITR[3] APITR[2] APITR[1] APITR[0] Increases period Decreases period less than APITR[5] increased it Decreases period less than APITR[4] Decreases period less than APITR[3] Decreases period less than APITR[2] Decreases period less than APITR[1] Trimming Effect 23.3.2.5 Autonomous Periodical Interrupt Rate High and Low Register (VREGAPIRH / VREGAPIRL) The VREGAPIRH and VREGAPIRL register allows the configuration of the VREG_3V3 autonomous periodical interrupt rate. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 821 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 0x02F4 7 6 5 4 3 2 1 0 R W Reset APIR15 0 APIR14 0 APIR13 0 APIR12 0 APIR11 0 APIR10 0 APIR9 0 APIR8 0 = Unimplemented or Reserved Figure 23-6. Autonomous Periodical Interrupt Rate High Register (VREGAPIRH) 0x02F5 7 6 5 4 3 2 1 0 R W Reset APIR7 0 APIR6 0 APIR5 0 APIR4 0 APIR3 0 APIR2 0 APIR1 0 APIR0 0 Figure 23-7. Autonomous Periodical Interrupt Rate Low Register (VREGAPIRL) Table 23-8. VREGAPIRH / VREGAPIRL Field Descriptions Field 15-0 APIR[15:0] Description Autonomous Periodical Interrupt Rate Bits -- These bits define the timeout period of the API. See Table 239 for details of the effect of the autonomous periodical interrupt rate bits. Writable only if APIFE = 0 of VREGAPICL register. Table 23-9. Selectable Autonomous Periodical Interrupt Periods APICLK 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 APIR[15:0] 0000 0001 0002 0003 0004 0005 ..... FFFD FFFE FFFF 0000 0001 0002 0003 0004 0005 ..... FFFD FFFE Selected Period 0.2 ms(1) 0.4 ms1 0.6 ms1 0.8 ms1 1.0 ms1 1.2 ms1 ..... 13106.8 ms1 13107.0 ms1 13107.2 ms1 2 * bus clock period 4 * bus clock period 6 * bus clock period 8 * bus clock period 10 * bus clock period 12 * bus clock period ..... 131068 * bus clock period 131070 * bus clock period MC9S12XE-Family Reference Manual , Rev. 1.21 822 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-9. Selectable Autonomous Periodical Interrupt Periods (continued) APICLK APIR[15:0] Selected Period 1 FFFF 131072 * bus clock period 1. When trimmed within specified accuracy. See electrical specifications for details. The period can be calculated as follows depending of APICLK: Period = 2*(APIR[15:0] + 1) * 0.1 ms or period = 2*(APIR[15:0] + 1) * bus clock period 23.3.2.6 0x02F6 Reserved 06 The Reserved 06 is reserved for test purposes. 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 23-8. Reserved 06 23.3.2.7 Fiption High Temperature Trimming Register (VREGHTTR) The VREGHTTR register allows to trim the VREG temperature sense. 0x02F7 7 6 5 4 3 2 1 0 R W Reset HTOEN 0 0 0 0 0 0 0 HTTR3 01 HTTR2 01 HTTR1 01 HTTR0 01 1. Reset value is either 0 or preset by factory. See Section 1 (Device Overview) for details. = Unimplemented or Reserved Figure 23-9. VREGHTTR Table 23-10. VREGHTTR field descriptions Field 7 HTOEN 3-0 HTTR[3:0] Description High Temperature Offset Enable Bit -- If set the temperature sense offset is enabled 0 The temperature sense offset is disabled 1 The temperature sense offset is enabled High Temperature Trimming Bits -- See Table 23-11 for trimming effects. Table 23-11. Trimming Effect Bit HTTR[3] Trimming Effect Increases VHT twice of HTTR[2] MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 823 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-11. Trimming Effect (continued) Bit HTTR[2] HTTR[1] HTTR[0] Trimming Effect Increases VHT twice of HTTR[1] Increases VHT twice of HTTR[0] Increases VHT (to compensate Temperature Offset) 23.4 23.4.1 Functional Description General Module VREG_3V3 is a voltage regulator, as depicted in Figure 23-1. The regulator functional elements are the regulator core (REG), a low-voltage detect module (LVD), a control block (CTRL), a power-on reset module (POR), and a low-voltage reset module (LVR)and a high temperature sensor (HTD). 23.4.2 Regulator Core (REG) Respectively its regulator core has three parallel, independent regulation loops (REG1,REG2 and REG3). REG1 and REG3 differ only in the amount of current that can be delivered. The regulators are linear regulator with a bandgap reference when operated in Full Performance Mode. They act as a voltage clamp in Reduced Power Mode. All load currents flow from input VDDR to VSS or VSSPLL. The reference circuits are supplied by VDDA and VSSA. 23.4.2.1 Full Performance Mode In Full Performance Mode, the output voltage is compared with a reference voltage by an operational amplifier. The amplified input voltage difference drives the gate of an output transistor. 23.4.2.2 Reduced Power Mode In Reduced Power Mode, the gate of the output transistor is connected directly to a reference voltage to reduce power consumption. Mode switching from reduced power to full performance requires a transition time of tvup, if the voltage regulator is enabled. 23.4.3 Low-Voltage Detect (LVD) Subblock LVD is responsible for generating the low-voltage interrupt (LVI). LVD monitors the input voltage (VDDA-VSSA) and continuously updates the status flag LVDS. Interrupt flag LVIF is set whenever status flag LVDS changes its value. The LVD is available in FPM and is inactive in Reduced Power Mode or Shutdown Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 824 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) 23.4.4 Power-On Reset (POR) This functional block monitors VDD. If VDD is below VPORD, POR is asserted; if VDD exceeds VPORD, the POR is deasserted. POR asserted forces the MCU into Reset. POR Deasserted will trigger the poweron sequence. 23.4.5 Low-Voltage Reset (LVR) Block LVR monitors the supplies VDD, VDDX and VDDF. If one (or more) drops below it's corresponding assertion level, signal LVR asserts; if all VDD,VDDX and VDDF supplies are above their corresponding deassertion levels, signal LVR deasserts. The LVR function is available only in Full Performance Mode. 23.4.6 HTD - High Temperature Detect Subblock HTD is responsible for generating the high temperature interrupt (HTI). HTD monitors the die temperature TDIE and continuously updates the status flag HTDS. Interrupt flag HTIF is set whenever status flag HTDS changes its value. The HTD is available in FPM and is inactive in Reduced Power Mode and Shutdown Mode. The HT Trimming bits HTTR[3:0] can be set so that the temperature offset is zero, if accurate temperature measurement is desired. See Table 23-11 for the trimming effect of APITR. 23.4.7 Regulator Control (CTRL) This part contains the register block of VREG_3V3 and further digital functionality needed to control the operating modes. CTRL also represents the interface to the digital core logic. 23.4.8 Autonomous Periodical Interrupt (API) Subblock API can generate periodical interrupts independent of the clock source of the MCU. To enable the timer, the bit APIFE needs to be set. The API timer is either clocked by a trimmable internal RC oscillator or the bus clock. Timer operation will freeze when MCU clock source is selected and bus clock is turned off. See CRG specification for details. The clock source can be selected with bit APICLK. APICLK can only be written when APIFE is not set. The APIR[15:0] bits determine the interrupt period. APIR[15:0] can only be written when APIFE is cleared. As soon as APIFE is set, the timer starts running for the period selected by APIR[15:0] bits. When the configured time has elapsed, the flag APIF is set. An interrupt, indicated by flag APIF = 1, is triggered if interrupt enable bit APIE = 1. The timer is started automatically again after it has set APIF. The procedure to change APICLK or APIR[15:0] is first to clear APIFE, then write to APICLK or APIR[15:0], and afterwards set APIFE. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 825 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) The API Trimming bits APITR[5:0] must be set so the minimum period equals 0.2 ms if stable frequency is desired. See Table 23-7 for the trimming effect of APITR. NOTE The first period after enabling the counter by APIFE might be reduced by API start up delay tsdel. The API internal RC oscillator clock is not available if VREG_3V3 is in Shutdown Mode. It is possible to generate with the API a waveform at an external pin by enabling the API by setting APIFE and enabling the external access with setting APIEA. By setting APIES the waveform can be selected. If APIES is set, then at the external pin a clock is visible with 2 times the selected API Period (Table 23-9). If APIES is not set, then at the external pin will be a high pulse at the end of every selected period with the size of half of the min period (Table 23-9). See device level specification for connectivity. 23.4.9 Resets This section describes how VREG_3V3 controls the reset of the MCU.The reset values of registers and signals are provided in Section 23.3, "Memory Map and Register Definition". Possible reset sources are listed in Table 23-12. Table 23-12. Reset Sources Reset Source Power-on reset Low-voltage reset Local Enable Always active Available only in Full Performance Mode 23.4.10 Description of Reset Operation 23.4.10.1 Power-On Reset (POR) During chip power-up the digital core may not work if its supply voltage VDD is below the POR deassertion level (VPORD). Therefore, signal POR, which forces the other blocks of the device into reset, is kept high until VDD exceeds VPORD. The MCU will run the start-up sequence after POR deassertion. The power-on reset is active in all operation modes of VREG_3V3. 23.4.10.2 Low-Voltage Reset (LVR) For details on low-voltage reset, see Section 23.4.5, "Low-Voltage Reset (LVR)". 23.4.11 Interrupts This section describes all interrupts originated by VREG_3V3. The interrupt vectors requested by VREG_3V3 are listed in Table 23-13. Vector addresses and interrupt priorities are defined at MCU level. MC9S12XE-Family Reference Manual , Rev. 1.21 826 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) Table 23-13. Interrupt Vectors Interrupt Source Low-voltage interrupt (LVI) Local Enable LVIE = 1; available only in Full Performance Mode HTIE=1; available only in Full Performance Mode APIE = 1 High Temperature Interrupt (HTI) Autonomous periodical interrupt (API) 23.4.11.1 Low-Voltage Interrupt (LVI) In FPM, VREG_3V3 monitors the input voltage VDDA. Whenever VDDA drops below level VLVIA, the status bit LVDS is set to 1. On the other hand, LVDS is reset to 0 when VDDA rises above level VLVID. An interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable bit LVIE = 1. NOTE On entering the Reduced Power Mode, the LVIF is not cleared by the VREG_3V3. 23.4.11.2 HTI - High Temperature Interrupt In FPM VREG monitors the die temperature TDIE. Whenever TDIE exceeds level THTIA the status bit HTDS is set to 1. Vice versa, HTDS is reset to 0 when TDIE get below level THTID. An interrupt, indicated by flag HTIF=1, is triggered by any change of the status bit HTDS if interrupt enable bit HTIE=1. NOTE On entering the Reduced Power Mode the HTIF is not cleared by the VREG. 23.4.11.3 Autonomous Periodical Interrupt (API) As soon as the configured timeout period of the API has elapsed, the APIF bit is set. An interrupt, indicated by flag APIF = 1, is triggered if interrupt enable bit APIE = 1. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 827 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 23 Voltage Regulator (S12VREGL3V3V1) MC9S12XE-Family Reference Manual , Rev. 1.21 828 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-1. Revision History Revision Number V01.10 V01.11 Revision Date 30 Nov 2007 19 Dec 2007 Sections Affected 24.1.3/24-832 24.4.2/24-865 24.4.2/24-865 - Correction toTable 24-6 Description of Changes - Removed Load Data Field command 0x05 - Updated Command Error Handling tables based on parent-child relationship with FTM256K2 24.4.2/24-865 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands 24.4.2/24-865 - Corrected maximum allowed ERPART for Full Partition D-Flash and Partition D-Flash commands 24.3.1/24-834 - Corrected P-Flash IFR Accessibility table 24.1.3/24-832 - Corrected Buffer RAM size in Feature List 24.3.1/24-834 - Corrected EEE Resource Memory Map 24.1.2.2/24-831 - Changed D-Flash size from 16Kbytes to 32Kbytes 24.3.1/24-834 - Corrected P-Flash Memory Map - Change references for D-Flash from 16 Kbytes to 32 Kbytes - Clarify single bit fault correction for P-Flash phrase 24.1/24-830 24.3.2.1/24-841 - Expand FDIV vs OSCCLK Frequency table 24.4.2.4/24-868 - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields 24.4.2.6/24-869 - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields 24.4.2.11/24- - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields 873 - Relate Key 0 to associated Backdoor Comparison Key address 24.4.2.11/24- - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command 873 24.4.2.11/24- The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: 873 24.4.2.19/24- - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear 882 - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during 24.3.2/24-839 reset sequence 24.3.2.1/24-841 24.4.1.2/24-860 24.6/24-888 V01.12 25 Sep 2009 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 829 24.1 Introduction The FTM128K2 module implements the following: * 128 Kbytes of P-Flash (Program Flash) memory, consisting of 2 physical Flash blocks, intended primarily for nonvolatile code storage * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both * 2 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 24.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 830 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 24.1.2 24.1.2.1 * * * * * * Features P-Flash Features 128 Kbytes of P-Flash memory composed of two 64 Kbyte Flash blocks. The 64 Kbyte Flash blocks are each divided into 64 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory 24.1.2.2 * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 831 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) * * * * Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Ability to program up to four words in a burst sequence 24.1.2.3 * * * * * * * Emulated EEPROM Features Up to 2 Kbytes of emulated EEPROM (EEE) accessible as 2 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 24.1.2.4 * User Buffer RAM Features Up to 2 Kbytes of RAM for user access 24.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 24.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 24-1. MC9S12XE-Family Reference Manual , Rev. 1.21 832 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 8Kx72 sector 0 sector 1 sector 63 Protection Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK P-Flash Block 1 8Kx72 sector 0 sector 1 sector 63 CPU Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 1Kx16 Tag RAM 64x16 Figure 24-1. FTM128K2 Block Diagram 24.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 833 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 24.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x78_0000 and 0x7F_FFFF as shown in Table 24-2. The P-Flash memory map is shown in Figure 24-2. Table 24-2. P-Flash Memory Addressing Global Address Size (Bytes) 64 K 384 K 64 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 24-3) No P-Flash Memory P-Flash Block 1 0x7F_0000 - 0x7F_FFFF 0x79_0000 - 0x7E_FFFF 0x78_0000 - 0x78_FFFF The FPROT register, described in Section 24.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 24-3. Table 24-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 24.4.2.11, "Verify Backdoor Access Key Command," and Section 24.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 24.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 24.3.2.10, "EEE Protection Register (EPROT)" Flash Nonvolatile byte Refer to Section 24.3.2.14, "Flash Option Register (FOPT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 0x7F_FF0E2 4 1 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 834 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-3. Flash Configuration Field(1) Global Address 0x7F_FF0F2 Size (Bytes) 1 Description Flash Security byte Refer to Section 24.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 835 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) P-Flash START = 0x78_0000 0x78_FFFF Flash Protected/Unprotected Region 96 Kbytes 0x7F_0000 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 24-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 836 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 24.4.2.6, "Program Once Command" Reserved Field Description Table 24-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF Size (Bytes) 512 512 512 Accessed From XBUS0 (PBLK0)(1) Unimplemented Unimplemented XBUS1 (PBLK1) 0x40_0600 - 0x40_07FF 512 1. Refer to Table 24-4 for more details. Table 24-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1F7F 0x12_1F80 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_F7FF 0x13_F800 - 0x13_FFFF 1. MMCCTL1 register bit Size (Bytes) 32,768 98,304 128 3,968 3,968 128 7,168 1,024 40,960 8,192 63,488 2,048 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 837 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 128 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F800 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 2 Kbyte Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 24-3. EEE Resource Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 838 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) The Full Partition D-Flash command (see Section 24.4.2.14) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. Table 24-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 24.4.2.14, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 24.4.2.14, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 24.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 24-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG R W R W R W R W R CCIE W 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 24-4. FTM128K2 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 839 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Address & Name 0x0005 FERCNFG 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 R 7 6 5 4 3 2 1 0 0 ERSERIE PGMERIE EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE W R CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0 ECCR7 ECCR6 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 ECCR15 ECCR14 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ETAG7 ETAG6 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ETAG15 ETAG14 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 RNV6 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 PGMERIF 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF 0 ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0 Figure 24-4. FTM128K2 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 840 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Address & Name 0x0013 FRSV2 R W 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-4. FTM128K2 Register Summary (continued) 24.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 24-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 24-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 24.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 841 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 842 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 24.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 24-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 24-3) as indicated by reset condition F in Figure 24-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 24-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 24-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 24-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 24-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 843 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 24.5. 24.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 24-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 24.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 24.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 844 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 24.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 24.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 24-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 24.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 24.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 845 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 24.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 24.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 24.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 24.3.2.6) 0 FSFD 24.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 24-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 24-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 24.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 24.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 24.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 846 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 24.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 24.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 24.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 24.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 24.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 24.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 24-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 24.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 847 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 24.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 24.4.2, "Flash Command Description," and Section 24.6, "Initialization" for details. 24.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 24-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 848 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 24.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 849 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 24-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 24.3.2.9.1, "P-Flash Protection Restrictions," and Table 24-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 24-3) as indicated by reset condition `F' in Figure 24-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 24-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 24-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 24-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 24-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 850 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 24-21 and Table 24-22. Table 24-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 24-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 24-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 851 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] Freescale Semiconductor FPLS[1:0] Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 24-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 0x7F_8000 0x7F_FFFF 852 FPHS[1:0] FPLS[1:0] FPOPEN = 0 FPOPEN = 1 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 24-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 24-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 24-14 for a definition of the scenarios. 24.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 24-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 24-3) as indicated by reset condition F in Figure 24-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 853 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 24-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 24-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 24-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 24.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 854 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 24-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 24-17. Flash Common Command Object Low Register (FCCOBLO) 24.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 24-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 24-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 24.4.2. Table 24-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 855 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 24.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 24-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 24-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 24.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 24.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 856 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 24-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 24-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 24-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 857 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 24.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 24-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 24-3) as indicated by reset condition F in Figure 24-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 24-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 24.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 858 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 24.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 24.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 24-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 859 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4 24.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 24.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 24-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 24.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 24.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 860 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 24.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 24-26. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 861 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 24-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 862 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.1.3 Valid Flash Module Commands Table 24-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Reserved Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 863 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.1.4 P-Flash Commands Table 24-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 24-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Program a phrase in a P-Flash block. Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 24.4.1.5 D-Flash and EEE Commands Table 24-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 24-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. MC9S12XE-Family Reference Manual , Rev. 1.21 864 Freescale Semiconductor 0x08 Erase All Blocks Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-32. D-Flash Commands FCMD 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Command Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash Function on D-Flash Memory Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 24.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 24.3.2.7). CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 865 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.2.1 Erase Verify All Blocks Command Table 24-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 24-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR FPVIOL FSTAT MGSTAT1 MGSTAT0 Error Condition Set if CCOBIX[2:0] != 000 at command launch None Set if any errors have been encountered during the read(1) Set if any non-correctable errors have been encountered during the read1 FERSTAT EPVIOLIF None 1. As found in the memory map for FTM256K2. 24.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 24-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 866 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-36. Erase Verify Block Command Error Handling Register Error Bit ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 Error Condition Set if CCOBIX[2:0] != 000 at command launch Set if an invalid global address [22:16] is supplied(1) None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. 2. As found in the memory map for FTM256K2. 24.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases.128 Table 24-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. Table 24-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if command not available in current mode (see Table 24-30) ACCERR FSTAT Set if the requested section crosses a 128 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 None Set if an invalid global address [22:0] is supplied(1) Set if a misaligned phrase address is supplied (global address [2:0] != 000) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 867 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 1. As defined by the memory map for FTM256K2. 2. As found in the memory map for FTM256K2. 24.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 24.4.2.6. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 24-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 Table 24-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 24-30) Set if an invalid phrase index is supplied 24.4.2.5 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. MC9S12XE-Family Reference Manual , Rev. 1.21 868 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 24-41. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 24-42. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if an invalid global address [22:0] is supplied(1) Set if a misaligned phrase address is supplied (global address [2:0] != 000) FPVIOL MGSTAT1 MGSTAT0 Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation(2) Set if any non-correctable errors have been encountered during the verify operation2 FSTAT FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. 2. As found in the memory map for FTM256K2. 24.4.2.6 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 24.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 869 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 24-43. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 24-44. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 24.4.2.7 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. MC9S12XE-Family Reference Manual , Rev. 1.21 870 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-45. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. Table 24-46. Erase All Blocks Command Error Handling Register Error Bit ACCERR Set if command not available in current mode (see Table 24-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 Error Condition Set if CCOBIX[2:0] != 000 at command launch FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM256K2. 24.4.2.8 Erase P-Flash Block Command Table 24-47. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 871 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-48. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch ACCERR Set if command not available in current mode (see Table 24-30) Set if an invalid global address [22:16] is supplied(1) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation(2) Set if any non-correctable errors have been encountered during the verify operation2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. 2. As found in the memory map for FTM256K2. 24.4.2.9 Erase P-Flash Sector Command Table 24-49. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Global address [15:0] anywhere within the sector to be erased. Refer to Section 24.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 24-50. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if an invalid global address [22:16] is supplied(1) Set if a misaligned phrase address is supplied (global address [2:0] != 000) FPVIOL MGSTAT1 MGSTAT0 Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FSTAT FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. MC9S12XE-Family Reference Manual , Rev. 1.21 872 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.2.10 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 24-51. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 24-52. Unsecure Flash Command Error Handling Register Error Bit ACCERR Set if command not available in current mode (see Table 24-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 Error Condition Set if CCOBIX[2:0] != 000 at command launch FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM256K2. 24.4.2.11 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 24-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 243). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 24-53. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0C Key 0 Key 1 FCCOB Parameters Not required MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 873 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-53. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 011 100 FCCOB Parameters Key 2 Key 3 Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 24-54. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if an incorrect backdoor key is supplied ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 24.3.2.2) Set if the backdoor key has mismatched since the last reset None None None None 24.4.2.12 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 24-55. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. MC9S12XE-Family Reference Manual , Rev. 1.21 874 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Valid margin level settings for the Set User Margin Level command are defined in Table 24-56. Table 24-56. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state Table 24-57. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if command not available in current mode (see Table 24-30) ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an invalid global address [22:16] is supplied(1) Set if an invalid margin level setting is supplied None None None FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 24.4.2.13 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 24-58. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 875 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set Field Margin Level command are defined in Table 24-59. Table 24-59. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 0x0002 0x0003 Level Description Return to Normal Level User Margin-1 Level(1) User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 24-60. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if command not available in current mode (see Table 24-30) ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an invalid global address [22:16] is supplied(1) Set if an invalid margin level setting is supplied None None None FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM256K2. CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. MC9S12XE-Family Reference Manual , Rev. 1.21 876 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.2.14 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. Table 24-61. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 8 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 24-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 24-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 24-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 24-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 877 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-62. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read Set if command not available in current mode (see Table 24-30) Set if an invalid DFPART or ERPART selection is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the maximum ERPART for FTM256K2. 24.4.2.15 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 24-63. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 878 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-64. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if command not available in current mode (see Table 24-30) Set if an invalid global address [22:0] is supplied ACCERR FSTAT Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 24.4.2.16 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 24-65. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 879 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-66. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 24.4.2.17 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 24-67. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 24.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 880 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-68. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 24.4.2.18 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 24-69. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 24-70. Enable EEPROM Emulation Command Error Handling Register Error Bit ACCERR Set if Full Partition D-Flash or Partition D-Flash command not previously run FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Error Condition Set if CCOBIX[2:0] != 000 at command launch MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 881 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.2.19 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 24-71. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 24-72. Disable EEPROM Emulation Command Error Handling Register Error Bit ACCERR Set if Full Partition D-Flash or Partition D-Flash command not previously run FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Error Condition Set if CCOBIX[2:0] != 000 at command launch 24.4.2.20 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 24-73. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 24.4.2.14), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 882 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) Table 24-74. EEPROM Emulation Query Command Error Handling Register Error Bit ACCERR Set if command not available in current mode (see Table 24-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Error Condition Set if CCOBIX[2:0] != 000 at command launch 24.4.2.21 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 32 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 24-75. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 8 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 24-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 24-7) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 883 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) * * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 24-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 24-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 24-76. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if command not available in current mode (see Table 24-30) ACCERR Set if partitions have already been defined FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an invalid DFPART or ERPART selection is supplied(1) None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read FERSTAT EPVIOLIF None 1. As defined by the maximum ERPART for FTM256K2. MC9S12XE-Family Reference Manual , Rev. 1.21 884 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) 24.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 24-77. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 24.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 24.3.2.5, "Flash Configuration Register (FCNFG)", Section 24.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 24.3.2.7, "Flash Status Register (FSTAT)", and Section 24.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 24-27. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 885 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 24-27. Flash Module Interrupts Implementation 24.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 24.4.3, "Interrupts"). 24.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 24.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 24-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 886 Freescale Semiconductor Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 24.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 24.3.2.2), the Verify Backdoor Access Key command (see Section 24.4.2.11) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 24-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 24.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 24.4.2.11 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 887 Chapter 24 128 KByte Flash Module (S12XFTM128K2V1) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 24.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 24.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 24-30. 24.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 888 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-1. Revision History Revision Number V01.08 Revision Date 14 Nov 2007 Sections Affected 25.5.2/25-949 Description of Changes - Changed terminology from `word program' to "Program P-Flash' in the BDM unsecuring description, Section 25.5.2 25.4.2/25-925 - Added requirement that user not write any Flash module register during execution of commands `Erase All Blocks', Section 25.4.2.8, and `Unsecure Flash', Section 25.4.2.11 25.4.2.8/25-931 - Added statement that security is released upon successful completion of command `Erase All Blocks', Section 25.4.2.8 25.4.2.5/25-928 - Corrected Error Handling table for Load Data Field command 25.4.2/25-925 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands 25.3.1/25-894 - Corrected P-Flash IFR Accessibility table - Clarify single bit fault correction for P-Flash phrase 25.1/25-889 25.3.2.1/25-901 - Expand FDIV vs OSCCLK Frequency table 25.4.2.4/25-928 - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields 25.4.2.7/25-930 - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields 25.4.2.12/25- - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields 934 - Relate Key 0 to associated Backdoor Comparison Key address 25.4.2.12/25- - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command 934 25.4.2.12/25- The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: 934 25.4.2.20/25- - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear 943 - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during 25.3.2/25-899 reset sequence 25.3.2.1/25-901 25.4.1.2/25-920 25.6/25-949 V01.09 19 Dec 2007 V01.10 25 Sep 2009 25.1 Introduction The FTM256K2 module implements the following: * 256 Kbytes of P-Flash (Program Flash) memory, consisting of 2 physical Flash blocks, intended primarily for nonvolatile code storage MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 889 * * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both 4 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 25.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 890 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 25.1.2 25.1.2.1 * * * * * * Features P-Flash Features 256 Kbytes of P-Flash memory composed of two 128 Kbyte Flash blocks. The 128 Kbyte Flash blocks are each divided into 128 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory 25.1.2.2 * * * * * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Ability to program up to four words in a burst sequence MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 891 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.1.2.3 * * * * * * * Emulated EEPROM Features Up to 4 Kbytes of emulated EEPROM (EEE) accessible as 4 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 25.1.2.4 * User Buffer RAM Features Up to 4 Kbytes of RAM for user access 25.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 25.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 25-1. MC9S12XE-Family Reference Manual , Rev. 1.21 892 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 16Kx72 sector 0 sector 1 sector 127 Protection Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK P-Flash Block 1 16Kx72 sector 0 sector 1 sector 127 CPU Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 2Kx16 Tag RAM 128x16 Figure 25-1. FTM256K2 Block Diagram 25.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 893 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 25.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x78_0000 and 0x7F_FFFF as shown in Table 25-2. The P-Flash memory map is shown in Figure 25-2. Table 25-2. P-Flash Memory Addressing Global Address Size (Bytes) 128 K 256 K 128 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 25-3) No P-Flash Memory P-Flash Block 1 0x7E_0000 - 0x7F_FFFF 0x7A_0000 - 0x7D_FFFF 0x78_0000 - 0x79_FFFF The FPROT register, described in Section 25.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 25-3. Table 25-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 25.4.2.12, "Verify Backdoor Access Key Command," and Section 25.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 25.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 25.3.2.10, "EEE Protection Register (EPROT)" Flash Nonvolatile byte Refer to Section 25.3.2.14, "Flash Option Register (FOPT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 0x7F_FF0E2 4 1 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 894 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-3. Flash Configuration Field(1) Global Address 0x7F_FF0F2 Size (Bytes) 1 Description Flash Security byte Refer to Section 25.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 895 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) P-Flash START = 0x78_0000 0x79_FFFF Flash Protected/Unprotected Region 224 Kbytes 0x7E_0000 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 25-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 896 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 25.4.2.7, "Program Once Command" Reserved Field Description Table 25-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF Size (Bytes) 512 512 512 Accessed From XBUS0 (PBLK0)(1) Unimplemented Unimplemented XBUS1 (PBLK1) 0x40_0600 - 0x40_07FF 512 1. Refer to Table 25-4 for more details. Table 25-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1EFF 0x12_1F00 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_EFFF 0x13_F000 - 0x13_FFFF 1. MMCCTL1 register bit Size (Bytes) 32,768 98,304 128 3,968 3,840 256 7,168 1,024 40,960 8,192 61,440 4,096 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 897 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 256 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F000 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 4 Kbytes Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 25-3. EEE Resource Memory Map The Full Partition D-Flash command (see Section 25.4.2.15) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. MC9S12XE-Family Reference Manual , Rev. 1.21 898 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 25.4.2.15, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 25.4.2.15, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 25.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 25-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG 0x0005 FERCNFG R W R W R W R W R CCIE W R ERSERIE W PGMERIE 0 EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 25-4. FTM256K2 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 899 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Address & Name 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 0x0013 FRSV2 R 7 6 0 5 4 3 MGBUSY 2 RSVD 1 MGSTAT1 0 MGSTAT0 CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 NV7 NV6 ECCR7 ECCR6 ECCR15 ECCR14 ETAG7 ETAG6 ETAG15 ETAG14 CCOB6 CCOB14 RNV6 RNV6 PGMERIF ACCERR FPVIOL 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 25-4. FTM256K2 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 900 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Address & Name 7 6 5 4 3 2 1 0 = Unimplemented or Reserved Figure 25-4. FTM256K2 Register Summary (continued) 25.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 25-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 25-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 25.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 901 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 902 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 25.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 25-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 25-3) as indicated by reset condition F in Figure 25-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 25-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 25-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 25-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 25-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 903 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 25.5. 25.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 25-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 25.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 25.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 904 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 25.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 25.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 25-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 25.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 25.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 905 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 25.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 25.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 25.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 25.3.2.6) 0 FSFD 25.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 25-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 25-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 25.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 25.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 25.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 906 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 25.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 25.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 25.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 25.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 25.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 25.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 25-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 25.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 907 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 25.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 25.4.2, "Flash Command Description," and Section 25.6, "Initialization" for details. 25.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 25-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 908 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 25.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 909 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 25-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 25.3.2.9.1, "P-Flash Protection Restrictions," and Table 25-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 25-3) as indicated by reset condition `F' in Figure 25-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 25-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 25-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 25-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 25-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 910 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 25-21 and Table 25-22. Table 25-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 25-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 25-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 911 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] Freescale Semiconductor FPLS[1:0] Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 25-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 0x7F_8000 0x7F_FFFF 912 FPHS[1:0] FPLS[1:0] FPOPEN = 0 FPOPEN = 1 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 25-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 25-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 25-14 for a definition of the scenarios. 25.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 25-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 25-3) as indicated by reset condition F in Figure 25-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 913 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 25-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 25-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 25-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 25.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 914 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 25-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 25-17. Flash Common Command Object Low Register (FCCOBLO) 25.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 25-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 25-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 25.4.2. Table 25-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 915 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 25.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 25-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 25-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 25.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 25.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 916 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 25-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 25-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 25-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 917 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 25.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 25-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 25-3) as indicated by reset condition F in Figure 25-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 25-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 25.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 918 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 25.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 25.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 25-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 919 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4 25.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 25.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 25-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 25.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 25.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 920 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 25.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 25-26. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 921 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 25-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 922 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.1.3 Valid Flash Module Commands Table 25-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Load Data Field Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 923 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.1.4 P-Flash Commands Table 25-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 25-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Load Data Field Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Load data for simultaneous multiple P-Flash block operations. Program a phrase in a P-Flash block and any previously loaded phrases for any other PFlash block (see Load Data Field command). Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 25.4.1.5 D-Flash and EEE Commands Table 25-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 25-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. MC9S12XE-Family Reference Manual , Rev. 1.21 924 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-32. D-Flash Commands FCMD Command Function on D-Flash Memory Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 0x08 Erase All Blocks 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash 25.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 25.3.2.7). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 925 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 25.4.2.1 Erase Verify All Blocks Command Table 25-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 25-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR Set if a Load Data Field command sequence is currently active FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Error Condition Set if CCOBIX[2:0] != 000 at command launch 25.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 25-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 926 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-36. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if a Load Data Field command sequence is currently active Set if an invalid global address [22:16] is supplied 25.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. The section to be verified cannot cross a 128 Kbyte boundary in the P-Flash memory space. Table 25-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. Table 25-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the requested section crosses a 128 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 927 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-38. Erase Verify P-Flash Section Command Error Handling Register FERSTAT Error Bit EPVIOLIF None Error Condition 25.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 25.4.2.7. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 25-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 Table 25-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 25-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid phrase index is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 25.4.2.5 Load Data Field Command The Load Data Field command is executed to provide FCCOB parameters for multiple P-Flash blocks for a future simultaneous program operation in the P-Flash memory space. MC9S12XE-Family Reference Manual , Rev. 1.21 928 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-41. Load Data Field Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 1. Global address [2:0] must be 000 0x05 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 Word 1 Word 2 Word 3 Upon clearing CCIF to launch the Load Data Field command, the FCCOB registers will be transferred to the Memory Controller and be programmed in the block specified at the global address given with a future Program P-Flash command launched on a P-Flash block. The CCIF flag will set after the Load Data Field operation has completed. Note that once a Load Data Field command sequence has been initiated, the Load Data Field command sequence will be cancelled if any command other than Load Data Field or the future Program P-Flash is launched. Similarly, if an error occurs after launching a Load Data Field or Program P-Flash command, the associated Load Data Field command sequence will be cancelled. Table 25-42. Load Data Field Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 25-30) Set if an invalid global address [22:0] is supplied ACCERR FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence Set if a Load Data Field command sequence is currently active and global address [16:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area None None None 25.4.2.6 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 929 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 25-43. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 25-44. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 25-30) Set if an invalid global address [22:0] is supplied ACCERR Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence FSTAT Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 25.4.2.7 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 25.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program MC9S12XE-Family Reference Manual , Rev. 1.21 930 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 25-45. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 25-46. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 25-30) Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 25.4.2.8 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 931 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-47. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. Table 25-48. Erase All Blocks Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 25.4.2.9 Erase P-Flash Block Command Table 25-49. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 932 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-50. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 25-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid global address [22:16] is supplied Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 25.4.2.10 Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 25-51. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to Section 25.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 25-52. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 25-30) Set if an invalid global address [22:16] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 933 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.2.11 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 25-53. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 25-54. Unsecure Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 25.4.2.12 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 25-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 253). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 25-55. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x0C Key 0 Key 1 Key 2 Key 3 FCCOB Parameters Not required MC9S12XE-Family Reference Manual , Rev. 1.21 934 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 25-56. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 25.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None 25.4.2.13 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 25-57. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set User Margin Level command are defined in Table 25-58. Table 25-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 935 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) Level Description 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state Table 25-59. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 25-30) Set if an invalid global address [22:16] is supplied NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 25.4.2.14 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 25-60. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. MC9S12XE-Family Reference Manual , Rev. 1.21 936 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Valid margin level settings for the Set Field Margin Level command are defined in Table 25-61. Table 25-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 0x0002 0x0003 Level Description Return to Normal Level User Margin-1 Level(1) User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 25-62. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 25-30) Set if an invalid global address [22:16] is supplied CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 25.4.2.15 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 937 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-63. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 25-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 25-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 25-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 25-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 938 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-64. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 25-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid DFPART or ERPART selection is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 25.4.2.16 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 25-65. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 939 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-66. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 25.4.2.17 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 25-67. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 940 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-68. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 25.4.2.18 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 25-69. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 25.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 941 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-70. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 25.4.2.19 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 25-71. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 25-72. Enable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run MC9S12XE-Family Reference Manual , Rev. 1.21 942 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.2.20 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 25-73. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 25-74. Disable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run 25.4.2.21 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 25-75. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 25.4.2.15), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 943 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) Table 25-76. EEPROM Emulation Query Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 25-30) 25.4.2.22 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 64 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 25-77. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 25-7) MC9S12XE-Family Reference Manual , Rev. 1.21 944 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) * * * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 25-7) Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 25-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 25-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 25-78. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid DFPART or ERPART selection is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 25-30) Set if partitions have already been defined MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 945 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) 25.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 25-79. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 25.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 25.3.2.5, "Flash Configuration Register (FCNFG)", Section 25.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 25.3.2.7, "Flash Status Register (FSTAT)", and Section 25.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 25-27. MC9S12XE-Family Reference Manual , Rev. 1.21 946 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 25-27. Flash Module Interrupts Implementation 25.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 25.4.3, "Interrupts"). 25.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 25.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 25-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 947 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 25.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 25.3.2.2), the Verify Backdoor Access Key command (see Section 25.4.2.12) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 25-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 25.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 25.4.2.12 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 948 Freescale Semiconductor Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 25.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 25.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 25-30. 25.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 949 Chapter 25 256 KByte Flash Module (S12XFTM256K2V1) MC9S12XE-Family Reference Manual , Rev. 1.21 950 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-1. Revision History Revision Number V01.10 V01.11 Revision Date 29 Nov 2007 19 Dec 2007 26.4.2/26-987 26.4.2/26-987 26.3.1/26-956 V01.12 25 Sep 2009 Sections Affected - Cleanup - Updated Command Error Handling tables based on parent-child relationship with FTM512K3 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands - Corrected P-Flash IFR Accessibility table Description of Changes - Clarify single bit fault correction for P-Flash phrase 26.1/26-951 26.3.2.1/26-963 - Expand FDIV vs OSCCLK Frequency table 26.4.2.4/26-990 - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields 26.4.2.7/26-993 - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields 26.4.2.12/26- - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields 997 - Relate Key 0 to associated Backdoor Comparison Key address 26.4.2.12/26- - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command 997 26.4.2.12/26- The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: 997 26.4.2.20/26- - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear 1006 - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during 26.3.2/26-961 reset sequence 26.3.2.1/26-963 26.4.1.2/26-982 26.6/26-1012 26.1 Introduction The FTM384K2 module implements the following: * 384 Kbytes of P-Flash (Program Flash) memory, consisting of 2 physical Flash blocks, intended primarily for nonvolatile code storage * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 951 * 4 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 26.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 952 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 26.1.2 26.1.2.1 * Features P-Flash Features * * * * * 384 Kbytes of P-Flash memory composed of one 256 Kbyte Flash block and one 128 Kbyte Flash block. The 256 Kbyte Flash block consists of two 128 Kbyte sections each divided into 128 sectors of 1024 bytes. The 128 Kbyte Flash block is divided into 128 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory 26.1.2.2 * * * * * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Ability to program up to four words in a burst sequence MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 953 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.1.2.3 * * * * * * * Emulated EEPROM Features Up to 4 Kbytes of emulated EEPROM (EEE) accessible as 4 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 26.1.2.4 * User Buffer RAM Features Up to 4 Kbytes of RAM for user access 26.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 26.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 26-1. MC9S12XE-Family Reference Manual , Rev. 1.21 954 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 Protection Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK P-Flash Block 1 16Kx72 sector 0 sector 1 sector 127 CPU Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 2Kx16 Tag RAM 128x16 Figure 26-1. FTM384K2 Block Diagram 26.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 955 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 26.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x78_0000 and 0x7F_FFFF as shown in Table 26-2. The P-Flash memory map is shown in Figure 26-2. Table 26-2. P-Flash Memory Addressing Global Address Size (Bytes) 256 K 128 K 128 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 26-3) No P-Flash Memory P-Flash Block 1 0x7C_0000 - 0x7F_FFFF 0x7A_0000 - 0x7B_FFFF 0x78_0000 - 0x79_FFFF The FPROT register, described in Section 26.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 26-3. Table 26-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 26.4.2.12, "Verify Backdoor Access Key Command," and Section 26.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 26.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 26.3.2.10, "EEE Protection Register (EPROT)" Flash Nonvolatile byte Refer to Section 26.3.2.14, "Flash Option Register (FOPT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 0x7F_FF0E2 4 1 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 956 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-3. Flash Configuration Field(1) Global Address 0x7F_FF0F2 Size (Bytes) 1 Description Flash Security byte Refer to Section 26.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 957 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) P-Flash START = 0x78_0000 0x79_FFFF Flash Protected/Unprotected Region 352 Kbytes 0x7C_0000 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 26-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 958 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 26.4.2.7, "Program Once Command" Reserved Field Description Table 26-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF Size (Bytes) 512 512 512 Accessed From XBUS0 (PBLK0)(1) Unimplemented Unimplemented XBUS1 (PBLK1) 0x40_0600 - 0x40_07FF 512 1. Refer to Table 26-4 for more details. Table 26-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1EFF 0x12_1F00 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_EFFF 0x13_F000 - 0x13_FFFF 1. MMCCTL1 register bit Size (Bytes) 32,768 98,304 128 3,968 3,840 256 7,168 1,024 40,960 8,192 61,440 4,096 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 959 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 256 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F000 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 4 Kbytes Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 26-3. EEE Resource Memory Map The Full Partition D-Flash command (see Section 26.4.2.15) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. MC9S12XE-Family Reference Manual , Rev. 1.21 960 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 26.4.2.15, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 26.4.2.15, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 26.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 26-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG 0x0005 FERCNFG R W R W R W R W R CCIE W R ERSERIE W PGMERIE 0 EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 26-4. FTM384K2 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 961 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Address & Name 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 0x0013 FRSV2 R 7 6 0 5 4 3 MGBUSY 2 RSVD 1 MGSTAT1 0 MGSTAT0 CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 NV7 NV6 ECCR7 ECCR6 ECCR15 ECCR14 ETAG7 ETAG6 ETAG15 ETAG14 CCOB6 CCOB14 RNV6 RNV6 PGMERIF ACCERR FPVIOL 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 26-4. FTM384K2 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 962 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Address & Name 7 6 5 4 3 2 1 0 = Unimplemented or Reserved Figure 26-4. FTM384K2 Register Summary (continued) 26.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 26-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 26-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 26.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 963 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 964 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 26.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 26-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 26-3) as indicated by reset condition F in Figure 26-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 26-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 26-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 26-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 26-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 965 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 26.5. 26.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 26-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 26.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 26.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 966 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 26.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 26.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 26-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 26.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 26.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 967 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 26.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 26.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 26.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 26.3.2.6) 0 FSFD 26.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 26-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 26-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 26.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 26.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 26.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 968 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 26.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 26.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 26.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 26.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 26.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 26.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 26-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 26.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 969 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 26.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 26.4.2, "Flash Command Description," and Section 26.6, "Initialization" for details. 26.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 26-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 970 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 26.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 971 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 26-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 26.3.2.9.1, "P-Flash Protection Restrictions," and Table 26-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 26-3) as indicated by reset condition `F' in Figure 26-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 26-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 26-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 26-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 26-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 972 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 26-21 and Table 26-22. Table 26-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 26-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 26-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 973 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] Freescale Semiconductor FPLS[1:0] Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 26-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 0x7F_8000 0x7F_FFFF 974 FPHS[1:0] FPLS[1:0] FPOPEN = 0 FPOPEN = 1 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 26-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 26-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 26-14 for a definition of the scenarios. 26.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 26-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 26-3) as indicated by reset condition F in Figure 26-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 975 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 26-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 26-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 26-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 26.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 976 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 26-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 26-17. Flash Common Command Object Low Register (FCCOBLO) 26.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 26-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 26-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 26.4.2. Table 26-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 977 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 26.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 26-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 26-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 26.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 26.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 978 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 26-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 26-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 26-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 979 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 26.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 26-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 26-3) as indicated by reset condition F in Figure 26-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 26-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 26.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 980 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 26.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 26.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 26-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 981 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4 26.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 26.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 26-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 26.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 26.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 982 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 26.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 26-26. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 983 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 26-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 984 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.1.3 Valid Flash Module Commands Table 26-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Load Data Field Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 985 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.1.4 P-Flash Commands Table 26-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 26-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Load Data Field Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Load data for simultaneous multiple P-Flash block operations. Program a phrase in a P-Flash block and any previously loaded phrases for any other PFlash block (see Load Data Field command). Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 26.4.1.5 D-Flash and EEE Commands Table 26-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 26-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. MC9S12XE-Family Reference Manual , Rev. 1.21 986 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-32. D-Flash Commands FCMD Command Function on D-Flash Memory Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 0x08 Erase All Blocks 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash 26.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 26.3.2.7). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 987 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 26.4.2.1 Erase Verify All Blocks Command Table 26-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 26-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR Set if a Load Data Field command sequence is currently active FSTAT FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(1) Set if any non-correctable errors have been encountered during the read1 Error Condition Set if CCOBIX[2:0] != 000 at command launch FERSTAT EPVIOLIF None 1. As found in the memory map for FTM512K3. 26.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 26-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 988 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-36. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 Set if a Load Data Field command sequence is currently active Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 2. As found in the memory map for FTM512K3. 26.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. The section to be verified cannot cross a 256 Kbyte boundary in the P-Flash memory space. Table 26-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 989 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied(1) Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the requested section crosses a 256 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 2. As found in the memory map for FTM512K3. 26.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 26.4.2.7. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 26-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 MC9S12XE-Family Reference Manual , Rev. 1.21 990 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 26-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid phrase index is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 26.4.2.5 Load Data Field Command The Load Data Field command is executed to provide FCCOB parameters for multiple P-Flash blocks for a future simultaneous program operation in the P-Flash memory space. Table 26-41. Load Data Field Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 1. Global address [2:0] must be 000 0x05 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 Word 1 Word 2 Word 3 Upon clearing CCIF to launch the Load Data Field command, the FCCOB registers will be transferred to the Memory Controller and be programmed in the block specified at the global address given with a future Program P-Flash command launched on a P-Flash block. The CCIF flag will set after the Load Data Field operation has completed. Note that once a Load Data Field command sequence has been initiated, the Load Data Field command sequence will be cancelled if any command other than Load Data Field or the future Program P-Flash is launched. Similarly, if an error occurs after launching a Load Data Field or Program P-Flash command, the associated Load Data Field command sequence will be cancelled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 991 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-42. Load Data Field Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 26-30) Set if an invalid global address [22:0] is supplied(1) ACCERR FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 Set if the global address [22:0] points to a protected area None None FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 26.4.2.6 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 26-43. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 992 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-44. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 26-30) Set if an invalid global address [22:0] is supplied(1) ACCERR Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence FSTAT Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 26.4.2.7 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 26.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 26-45. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 993 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 26-46. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 26-30) Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 26.4.2.8 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. Table 26-47. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 994 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-48. Erase All Blocks Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM512K3. 26.4.2.9 Erase P-Flash Block Command Table 26-49. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. Table 26-50. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 26-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an invalid global address [22:16] is supplied(1) Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation(2) Set if any non-correctable errors have been encountered during the verify operation2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 2. As found in the memory map for FTM512K3. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 995 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.2.10 Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 26-51. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to Section 26.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 26-52. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 26-30) Set if an invalid global address [22:16] is supplied(1) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. 26.4.2.11 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 26-53. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security MC9S12XE-Family Reference Manual , Rev. 1.21 996 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 26-54. Unsecure Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM512K3. 26.4.2.12 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 26-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 263). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 26-55. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x0C Key 0 Key 1 Key 2 Key 3 FCCOB Parameters Not required Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 997 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-56. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 26.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None 26.4.2.13 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 26-57. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set User Margin Level command are defined in Table 26-58. Table 26-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state MC9S12XE-Family Reference Manual , Rev. 1.21 998 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-59. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 None None None Set if command not available in current mode (see Table 26-30) Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 26.4.2.14 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 26-60. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set Field Margin Level command are defined in Table 26-61. Table 26-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 999 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0002 0x0003 Level Description User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 26-62. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 None None None Set if command not available in current mode (see Table 26-30) Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM512K3. CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 26.4.2.15 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. MC9S12XE-Family Reference Manual , Rev. 1.21 1000 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-63. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 26-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 26-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 26-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 26-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1001 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-64. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 26-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid DFPART or ERPART selection is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 26.4.2.16 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 26-65. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1002 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-66. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 26.4.2.17 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 26-67. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1003 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-68. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 26.4.2.18 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 26-69. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 26.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1004 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-70. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 26.4.2.19 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 26-71. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 26-72. Enable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1005 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.2.20 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 26-73. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 26-74. Disable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run 26.4.2.21 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 26-75. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 26.4.2.15), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 1006 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) Table 26-76. EEPROM Emulation Query Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 26-30) 26.4.2.22 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 26-77. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 26-7) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1007 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) * * * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 26-7) Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 26-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 26-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 26-78. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid DFPART or ERPART selection is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 26-30) Set if partitions have already been defined MC9S12XE-Family Reference Manual , Rev. 1.21 1008 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) 26.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 26-79. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 26.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 26.3.2.5, "Flash Configuration Register (FCNFG)", Section 26.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 26.3.2.7, "Flash Status Register (FSTAT)", and Section 26.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 26-27. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1009 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 26-27. Flash Module Interrupts Implementation 26.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 26.4.3, "Interrupts"). 26.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 26.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 26-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 1010 Freescale Semiconductor Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 26.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 26.3.2.2), the Verify Backdoor Access Key command (see Section 26.4.2.12) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 26-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 26.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 26.4.2.12 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1011 Chapter 26 384 KByte Flash Module (S12XFTM384K2V1) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 26.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 26.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 26-30. 26.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 1012 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-1. Revision History Revision Number V01.09 Revision Date 14 Nov 2007 Sections Affected Description of Changes 27.5.2/27-1073 - Changed terminology from `word program' to "Program P-Flash' in the BDM unsecuring description, Section 27.5.2 27.4.2/27-1049 - Added requirement that user not write any Flash module register during execution of commands `Erase All Blocks', Section 27.4.2.8, and `Unsecure Flash', Section 27.4.2.11 - Added statement that security is released upon successful completion of 27.4.2.8/27command `Erase All Blocks', Section 27.4.2.8 1055 27.4.2/27-1049 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands 27.1/27-1014 27.3.2.1/271025 27.4.2.4/271052 27.4.2.7/271054 27.4.2.12/271058 27.4.2.12/271058 27.4.2.12/271058 27.4.2.20/271067 - Clarify single bit fault correction for P-Flash phrase - Expand FDIV vs OSCCLK Frequency table - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields - Relate Key 0 to associated Backdoor Comparison Key address - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during reset sequence V01.10 V01.11 19 Dec 2007 25 Sep 2009 27.3.2/27-1023 27.3.2.1/271025 27.4.1.2/271044 27.6/27-1073 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1013 27.1 Introduction The FTM512K3 module implements the following: * 512 Kbytes of P-Flash (Program Flash) memory, consisting of 3 physical Flash blocks, intended primarily for nonvolatile code storage * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both * 4 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 27.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1014 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 27.1.2 27.1.2.1 * Features P-Flash Features * * * * * 512 Kbytes of P-Flash memory composed of one 256 Kbyte Flash block and two 128 Kbyte Flash blocks. The 256 Kbyte Flash block consists of two 128 Kbyte sections each divided into 128 sectors of 1024 bytes. The 128 Kbyte Flash blocks are each divided into 128 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1015 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.1.2.2 * * * * * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Ability to program up to four words in a burst sequence 27.1.2.3 * * * * * * * Emulated EEPROM Features Up to 4 Kbytes of emulated EEPROM (EEE) accessible as 4 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 27.1.2.4 * User Buffer RAM Features Up to 4 Kbytes of RAM for user access 27.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 27.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 27-1. MC9S12XE-Family Reference Manual , Rev. 1.21 1016 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 Protection P-Flash Block 1N 16Kx72 sector 0 sector 1 sector 127 Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK P-Flash Block 1S 16Kx72 sector 0 sector 1 sector 127 CPU Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 2Kx16 Tag RAM 128x16 Figure 27-1. FTM512K3 Block Diagram 27.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1017 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 27.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x78_0000 and 0x7F_FFFF as shown in Table 27-2. The P-Flash memory map is shown in Figure 27-2. Table 27-2. P-Flash Memory Addressing Global Address Size (Bytes) 256 K 128 K 128 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 27-3) P-Flash Block 1N P-Flash Block 1S 0x7C_0000 - 0x7F_FFFF 0x7A_0000 - 0x7B_FFFF 0x78_0000 - 0x79_FFFF The FPROT register, described in Section 27.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 27-3. Table 27-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 27.4.2.12, "Verify Backdoor Access Key Command," and Section 27.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 27.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 27.3.2.10, "EEE Protection Register (EPROT)" Flash Nonvolatile byte Refer to Section 27.3.2.14, "Flash Option Register (FOPT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 0x7F_FF0E2 4 1 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 1018 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-3. Flash Configuration Field(1) Global Address 0x7F_FF0F2 Size (Bytes) 1 Description Flash Security byte Refer to Section 27.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1019 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) P-Flash START = 0x78_0000 Flash Protected/Unprotected Region 480 Kbytes 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 27-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 1020 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 27.4.2.7, "Program Once Command" Reserved Field Description Table 27-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF Size (Bytes) 512 512 512 Accessed From XBUS0 (PBLK0S)(1) Unimplemented XBUS0 (PBLK1N) XBUS1 (PBLK1S) 0x40_0600 - 0x40_07FF 512 1. Refer to Table 27-4 for more details. Table 27-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1EFF 0x12_1F00 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_EFFF 0x13_F000 - 0x13_FFFF 1. MMCCTL1 register bit Size (Bytes) 32,768 98,304 128 3,968 3,840 256 7,168 1,024 40,960 8,192 61,440 4,096 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1021 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 256 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F000 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 4 Kbytes Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 27-3. EEE Resource Memory Map The Full Partition D-Flash command (see Section 27.4.2.15) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. MC9S12XE-Family Reference Manual , Rev. 1.21 1022 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 27.4.2.15, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 27.4.2.15, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 27.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 27-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG 0x0005 FERCNFG R W R W R W R W R CCIE W R ERSERIE W PGMERIE 0 EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 27-4. FTM512K3 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1023 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Address & Name 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 0x0013 FRSV2 R 7 6 0 5 4 3 MGBUSY 2 RSVD 1 MGSTAT1 0 MGSTAT0 CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 NV7 NV6 ECCR7 ECCR6 ECCR15 ECCR14 ETAG7 ETAG6 ETAG15 ETAG14 CCOB6 CCOB14 RNV6 RNV6 PGMERIF ACCERR FPVIOL 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 27-4. FTM512K3 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 1024 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Address & Name 7 6 5 4 3 2 1 0 = Unimplemented or Reserved Figure 27-4. FTM512K3 Register Summary (continued) 27.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 27-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 27-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 27.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1025 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 1026 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 27.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 27-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 27-3) as indicated by reset condition F in Figure 27-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 27-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 27-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 27-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 27-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1027 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 27.5. 27.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 27-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 27.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 27.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 1028 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 27.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 27.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 27-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 27.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 27.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1029 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 27.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 27.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 27.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 27.3.2.6) 0 FSFD 27.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 27-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 27-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 27.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 27.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 27.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 1030 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 27.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 27.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 27.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 27.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 27.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 27.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 27-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 27.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1031 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 27.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 27.4.2, "Flash Command Description," and Section 27.6, "Initialization" for details. 27.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 27-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 1032 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 27.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1033 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 27-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 27.3.2.9.1, "P-Flash Protection Restrictions," and Table 27-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 27-3) as indicated by reset condition `F' in Figure 27-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 27-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 27-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 27-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 27-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 1034 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 27-21 and Table 27-22. Table 27-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 27-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 27-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1035 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] Freescale Semiconductor FPLS[1:0] Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 27-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 0x7F_8000 0x7F_FFFF 1036 FPHS[1:0] FPLS[1:0] FPOPEN = 0 FPOPEN = 1 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 27-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 27-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 27-14 for a definition of the scenarios. 27.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 27-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 27-3) as indicated by reset condition F in Figure 27-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1037 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 27-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 27-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 27-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 27.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 1038 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 27-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 27-17. Flash Common Command Object Low Register (FCCOBLO) 27.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 27-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 27-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 27.4.2. Table 27-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1039 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 27.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 27-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 27-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 27.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 27.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 1040 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 27-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 27-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 27-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1041 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 27.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 27-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 27-3) as indicated by reset condition F in Figure 27-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 27-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 27.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 1042 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 27.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 27.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 27-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1043 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4 27.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 27.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 27-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 27.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 27.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 1044 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 27.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 27-26. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1045 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 27-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 1046 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.1.3 Valid Flash Module Commands Table 27-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Load Data Field Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1047 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.1.4 P-Flash Commands Table 27-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 27-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Load Data Field Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Load data for simultaneous multiple P-Flash block operations. Program a phrase in a P-Flash block and any previously loaded phrases for any other PFlash block (see Load Data Field command). Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 27.4.1.5 D-Flash and EEE Commands Table 27-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 27-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. MC9S12XE-Family Reference Manual , Rev. 1.21 1048 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-32. D-Flash Commands FCMD Command Function on D-Flash Memory Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 0x08 Erase All Blocks 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash 27.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 27.3.2.7). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1049 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 27.4.2.1 Erase Verify All Blocks Command Table 27-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 27-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR Set if a Load Data Field command sequence is currently active FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Error Condition Set if CCOBIX[2:0] != 000 at command launch 27.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 27-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1050 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-36. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if a Load Data Field command sequence is currently active Set if an invalid global address [22:16] is supplied 27.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. The section to be verified cannot cross a 256 Kbyte boundary in the P-Flash memory space. Table 27-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. Table 27-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the requested section crosses a 256 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1051 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-38. Erase Verify P-Flash Section Command Error Handling Register FERSTAT Error Bit EPVIOLIF None Error Condition 27.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 27.4.2.7. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 27-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 Table 27-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 27-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid phrase index is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 27.4.2.5 Load Data Field Command The Load Data Field command is executed to provide FCCOB parameters for multiple P-Flash blocks for a future simultaneous program operation in the P-Flash memory space. MC9S12XE-Family Reference Manual , Rev. 1.21 1052 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-41. Load Data Field Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 1. Global address [2:0] must be 000 0x05 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 Word 1 Word 2 Word 3 Upon clearing CCIF to launch the Load Data Field command, the FCCOB registers will be transferred to the Memory Controller and be programmed in the block specified at the global address given with a future Program P-Flash command launched on a P-Flash block. The CCIF flag will set after the Load Data Field operation has completed. Note that once a Load Data Field command sequence has been initiated, the Load Data Field command sequence will be cancelled if any command other than Load Data Field or the future Program P-Flash is launched. Similarly, if an error occurs after launching a Load Data Field or Program P-Flash command, the associated Load Data Field command sequence will be cancelled. Table 27-42. Load Data Field Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 27-30) Set if an invalid global address [22:0] is supplied ACCERR FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area None None None 27.4.2.6 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1053 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 27-43. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 27-44. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 27-30) Set if an invalid global address [22:0] is supplied ACCERR Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence FSTAT Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 27.4.2.7 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 27.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program MC9S12XE-Family Reference Manual , Rev. 1.21 1054 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 27-45. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 27-46. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 27-30) Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 27.4.2.8 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1055 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-47. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. Table 27-48. Erase All Blocks Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 27.4.2.9 Erase P-Flash Block Command Table 27-49. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1056 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-50. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 27-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid global address [22:16] is supplied Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 27.4.2.10 Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 27-51. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to Section 27.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 27-52. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 27-30) Set if an invalid global address [22:16] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1057 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.2.11 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 27-53. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 27-54. Unsecure Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 27.4.2.12 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 27-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 273). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 27-55. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x0C Key 0 Key 1 Key 2 Key 3 FCCOB Parameters Not required MC9S12XE-Family Reference Manual , Rev. 1.21 1058 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 27-56. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 27.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None 27.4.2.13 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 27-57. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set User Margin Level command are defined in Table 27-58. Table 27-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1059 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) Level Description 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state Table 27-59. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 27-30) Set if an invalid global address [22:16] is supplied NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 27.4.2.14 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 27-60. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. MC9S12XE-Family Reference Manual , Rev. 1.21 1060 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Valid margin level settings for the Set Field Margin Level command are defined in Table 27-61. Table 27-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 0x0002 0x0003 Level Description Return to Normal Level User Margin-1 Level(1) User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 27-62. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 27-30) Set if an invalid global address [22:16] is supplied CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 27.4.2.15 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1061 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-63. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 27-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 27-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 27-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 27-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 1062 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-64. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 27-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid DFPART or ERPART selection is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 27.4.2.16 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 27-65. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1063 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-66. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 27.4.2.17 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 27-67. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1064 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-68. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 27.4.2.18 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 27-69. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 27.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1065 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-70. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 27.4.2.19 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 27-71. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 27-72. Enable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run MC9S12XE-Family Reference Manual , Rev. 1.21 1066 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.2.20 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 27-73. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 27-74. Disable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run 27.4.2.21 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 27-75. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 27.4.2.15), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1067 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) Table 27-76. EEPROM Emulation Query Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 27-30) 27.4.2.22 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 27-77. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 27-7) MC9S12XE-Family Reference Manual , Rev. 1.21 1068 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) * * * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 27-7) Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 27-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 27-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 27-78. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid DFPART or ERPART selection is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 27-30) Set if partitions have already been defined MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1069 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) 27.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 27-79. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 27.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 27.3.2.5, "Flash Configuration Register (FCNFG)", Section 27.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 27.3.2.7, "Flash Status Register (FSTAT)", and Section 27.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 27-27. MC9S12XE-Family Reference Manual , Rev. 1.21 1070 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 27-27. Flash Module Interrupts Implementation 27.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 27.4.3, "Interrupts"). 27.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 27.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 27-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1071 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 27.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 27.3.2.2), the Verify Backdoor Access Key command (see Section 27.4.2.12) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 27-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 27.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 27.4.2.12 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 1072 Freescale Semiconductor Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 27.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 27.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 27-30. 27.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1073 Chapter 27 512 KByte Flash Module (S12XFTM512K3V1) MC9S12XE-Family Reference Manual , Rev. 1.21 1074 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-1. Revision History Revision Number V02.09 V02.10 Revision Date 29 Nov 2007 19 Dec 2007 Sections Affected - Cleanup 28.4.2/28-1111 - Updated Command Error Handling tables based on parent-child relationship with FTM1024K5 28.4.2/28-1111 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands 28.3.1/28-1080 - Corrected P-Flash Memory Addressing table 28.1/28-1075 28.3.2.1/281087 28.4.2.4/281114 28.4.2.7/281117 28.4.2.12/281121 28.4.2.12/281121 28.4.2.12/281121 28.4.2.20/281130 - Clarify single bit fault correction for P-Flash phrase - Expand FDIV vs OSCCLK Frequency table - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields - Relate Key 0 to associated Backdoor Comparison Key address - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during reset sequence Description of Changes V02.11 25 Sep 2009 28.3.2/28-1085 28.3.2.1/281087 28.4.1.2/281106 28.6/28-1136 28.1 Introduction The FTM768K4 module implements the following: * 768 Kbytes of P-Flash (Program Flash) memory, consisting of 4 physical Flash blocks, intended primarily for nonvolatile code storage MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1075 * * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both 4 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 28.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1076 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 28.1.2 28.1.2.1 * Features P-Flash Features * * * * * 768 Kbytes of P-Flash memory composed of two 256 Kbyte Flash blocks and two 128 Kbyte Flash blocks. The 256 Kbyte Flash block consists of two 128 Kbyte sections each divided into 128 sectors of 1024 bytes. The 128 Kbyte Flash blocks are each divided into 128 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory 28.1.2.2 * * * * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1077 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) * Ability to program up to four words in a burst sequence 28.1.2.3 * * * * * * * Emulated EEPROM Features Up to 4 Kbytes of emulated EEPROM (EEE) accessible as 4 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 28.1.2.4 * User Buffer RAM Features Up to 4 Kbytes of RAM for user access 28.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 28.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 28-1. MC9S12XE-Family Reference Manual , Rev. 1.21 1078 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 Protection P-Flash Block 1S 16Kx72 sector 0 sector 1 sector 127 P-Flash Block 1N 16Kx72 sector 0 sector 1 sector 127 Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK P-Flash Block 2 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 CPU Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 2Kx16 Tag RAM 128x16 Figure 28-1. FTM768K4 Block Diagram 28.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1079 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 28.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x74_0000 and 0x7F_FFFF as shown in Table 28-2. The P-Flash memory map is shown in Figure 28-2. Table 28-2. P-Flash Memory Addressing Global Address Size (Bytes) 256 K 128 K 128 K 256 K 256 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 28-3) P-Flash Block 1N P-Flash Block 1S P-Flash Block 2 No P-Flash Memory 0x7C_0000 - 0x7F_FFFF 0x7A_0000 - 0x7B_FFFF 0x78_0000 - 0x79_FFFF 0x74_0000 - 0x77_FFFF 0x70_0000 - 0x73_FFFF The FPROT register, described in Section 28.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 28-3. Table 28-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 28.4.2.12, "Verify Backdoor Access Key Command," and Section 28.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 28.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 28.3.2.10, "EEE Protection Register (EPROT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 4 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 1080 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-3. Flash Configuration Field(1) Global Address 0x7F_FF0E2 0x7F_FF0F2 Size (Bytes) 1 1 Description Flash Nonvolatile byte Refer to Section 28.3.2.14, "Flash Option Register (FOPT)" Flash Security byte Refer to Section 28.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1081 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) P-Flash START = 0x74_0000 Flash Protected/Unprotected Region 736 Kbytes 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 28-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 1082 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 28.4.2.7, "Program Once Command" Reserved Field Description Table 28-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF 0x40_0600 - 0x40_07FF 0x40_0800 - 0x40_09FF Size (Bytes) 512 512 512 512 512 Accessed From XBUS0 (PBLK0S)(1) Unimplemented XBUS0 (PBLK1N) XBUS1 (PBLK1S) XBUS0 (PBLK2S) Unimplemented 0x40_0A00 - 0x40_0BFF 512 1. Refer to Table 28-4 for more details. Table 28-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1EFF 0x12_1F00 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_EFFF 0x13_F000 - 0x13_FFFF Size (Bytes) 32,768 98,304 128 3,968 3,840 256 7,168 1,024 40,960 8,192 61,440 4,096 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1083 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 1. MMCCTL1 register bit D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 256 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F000 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 4 Kbytes Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 28-3. EEE Resource Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 1084 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) The Full Partition D-Flash command (see Section 28.4.2.15) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. Table 28-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 28.4.2.15, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 28.4.2.15, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 28.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 28-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG R W R W R W R W R CCIE W 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 28-4. FTM768K4 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1085 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Address & Name 0x0005 FERCNFG 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 R 7 6 5 4 3 2 1 0 0 ERSERIE PGMERIE EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE W R CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0 ECCR7 ECCR6 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 ECCR15 ECCR14 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ETAG7 ETAG6 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ETAG15 ETAG14 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 RNV6 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 PGMERIF 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF 0 ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0 Figure 28-4. FTM768K4 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 1086 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Address & Name 0x0013 FRSV2 R W 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-4. FTM768K4 Register Summary (continued) 28.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 28-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 28-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 28.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1087 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 1088 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 28.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 28-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 28-3) as indicated by reset condition F in Figure 28-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 28-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 28-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 28-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 28-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1089 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 28.5. 28.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 28-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 28.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 28.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 1090 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 28.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 28.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 28-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 28.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 28.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1091 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 28.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 28.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 28.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 28.3.2.6) 0 FSFD 28.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 28-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 28-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 28.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 28.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 28.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 1092 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 28.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 28.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 28.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 28.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 28.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 28.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 28-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 28.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1093 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 28.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 28.4.2, "Flash Command Description," and Section 28.6, "Initialization" for details. 28.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 28-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 1094 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 28.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1095 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 28-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 28.3.2.9.1, "P-Flash Protection Restrictions," and Table 28-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 28-3) as indicated by reset condition `F' in Figure 28-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 28-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 28-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 28-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 28-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 1096 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 28-21 and Table 28-22. Table 28-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 28-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 28-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1097 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] Freescale Semiconductor FPLS[1:0] Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 28-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 0x7F_8000 0x7F_FFFF 1098 FPHS[1:0] FPLS[1:0] FPOPEN = 0 FPOPEN = 1 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 28-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 28-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 28-14 for a definition of the scenarios. 28.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 28-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 28-3) as indicated by reset condition F in Figure 28-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1099 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 28-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 28-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 28-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 28.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 1100 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 28-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 28-17. Flash Common Command Object Low Register (FCCOBLO) 28.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 28-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 28-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 28.4.2. Table 28-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1101 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 28.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 28-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 28-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 28.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 28.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 1102 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 28-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 28-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 28-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1103 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 28.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 28-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 28-3) as indicated by reset condition F in Figure 28-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 28-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 28.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 1104 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 28.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 28.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 28-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1105 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4 28.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 28.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 28-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 28.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 28.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 1106 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 28.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 28-26. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1107 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 28-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 1108 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.1.3 Valid Flash Module Commands Table 28-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Load Data Field Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1109 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.1.4 P-Flash Commands Table 28-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 28-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Load Data Field Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Load data for simultaneous multiple P-Flash block operations. Program a phrase in a P-Flash block and any previously loaded phrases for any other PFlash block (see Load Data Field command). Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 28.4.1.5 D-Flash and EEE Commands Table 28-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 28-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. MC9S12XE-Family Reference Manual , Rev. 1.21 1110 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-32. D-Flash Commands FCMD Command Function on D-Flash Memory Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 0x08 Erase All Blocks 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash 28.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 28.3.2.7). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1111 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 28.4.2.1 Erase Verify All Blocks Command Table 28-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 28-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR Set if a Load Data Field command sequence is currently active FSTAT FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(1) Set if any non-correctable errors have been encountered during the read1 Error Condition Set if CCOBIX[2:0] != 000 at command launch FERSTAT EPVIOLIF None 1. As found in the memory map for FTM1024K5. 28.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 28-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1112 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-36. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 Set if a Load Data Field command sequence is currently active Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 2. As found in the memory map for FTM1024K5. 28.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. The section to be verified cannot cross a 256 Kbyte boundary in the P-Flash memory space. Table 28-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1113 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied(1) Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the requested section crosses a 256 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read(2) Set if any non-correctable errors have been encountered during the read2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 2. As found in the memory map for FTM1024K5. 28.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 28.4.2.7. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 28-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 MC9S12XE-Family Reference Manual , Rev. 1.21 1114 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 28-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid phrase index is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 28.4.2.5 Load Data Field Command The Load Data Field command is executed to provide FCCOB parameters for multiple P-Flash blocks for a future simultaneous program operation in the P-Flash memory space. Table 28-41. Load Data Field Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 1. Global address [2:0] must be 000 0x05 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 Word 1 Word 2 Word 3 Upon clearing CCIF to launch the Load Data Field command, the FCCOB registers will be transferred to the Memory Controller and be programmed in the block specified at the global address given with a future Program P-Flash command launched on a P-Flash block. The CCIF flag will set after the Load Data Field operation has completed. Note that once a Load Data Field command sequence has been initiated, the Load Data Field command sequence will be cancelled if any command other than Load Data Field or the future Program P-Flash is launched. Similarly, if an error occurs after launching a Load Data Field or Program P-Flash command, the associated Load Data Field command sequence will be cancelled. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1115 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-42. Load Data Field Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 28-30) Set if an invalid global address [22:0] is supplied(1) ACCERR FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 Set if the global address [22:0] points to a protected area None None FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 28.4.2.6 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 28-43. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1116 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-44. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 28-30) Set if an invalid global address [22:0] is supplied(1) ACCERR Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence FSTAT Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 28.4.2.7 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 28.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 28-45. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1117 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 28-46. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 28-30) Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 28.4.2.8 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. Table 28-47. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1118 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-48. Erase All Blocks Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM1024K5. 28.4.2.9 Erase P-Flash Block Command Table 28-49. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. Table 28-50. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 28-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if an invalid global address [22:16] is supplied(1) Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation(2) Set if any non-correctable errors have been encountered during the verify operation2 FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 2. As found in the memory map for FTM1024K5. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1119 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.2.10 Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 28-51. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to Section 28.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 28-52. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 28-30) Set if an invalid global address [22:16] is supplied(1) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. 28.4.2.11 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 28-53. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security MC9S12XE-Family Reference Manual , Rev. 1.21 1120 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 28-54. Unsecure Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation(1) Set if any non-correctable errors have been encountered during the verify operation1 FERSTAT EPVIOLIF Set if any area of the buffer RAM EEE partition is protected 1. As found in the memory map for FTM1024K5. 28.4.2.12 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 28-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 283). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 28-55. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x0C Key 0 Key 1 Key 2 Key 3 FCCOB Parameters Not required Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1121 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-56. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 28.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None 28.4.2.13 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 28-57. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set User Margin Level command are defined in Table 28-58. Table 28-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state MC9S12XE-Family Reference Manual , Rev. 1.21 1122 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-59. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 None None None Set if command not available in current mode (see Table 28-30) Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 28.4.2.14 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 28-60. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set Field Margin Level command are defined in Table 28-61. Table 28-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1123 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0002 0x0003 Level Description User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 28-62. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 None None None Set if command not available in current mode (see Table 28-30) Set if an invalid global address [22:16] is supplied(1) FERSTAT EPVIOLIF None 1. As defined by the memory map for FTM1024K5. CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 28.4.2.15 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. MC9S12XE-Family Reference Manual , Rev. 1.21 1124 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-63. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 28-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 28-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 28-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 28-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1125 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-64. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 28-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid DFPART or ERPART selection is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 28.4.2.16 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 28-65. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1126 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-66. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 28.4.2.17 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 28-67. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1127 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-68. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 28.4.2.18 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 28-69. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 28.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1128 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-70. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 28.4.2.19 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 28-71. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 28-72. Enable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1129 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.2.20 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 28-73. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 28-74. Disable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run 28.4.2.21 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 28-75. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 28.4.2.15), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 1130 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) Table 28-76. EEPROM Emulation Query Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 28-30) 28.4.2.22 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 28-77. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 28-7) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1131 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) * * * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 28-7) Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 28-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 28-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 28-78. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid DFPART or ERPART selection is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 28-30) Set if partitions have already been defined MC9S12XE-Family Reference Manual , Rev. 1.21 1132 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) 28.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 28-79. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 28.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 28.3.2.5, "Flash Configuration Register (FCNFG)", Section 28.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 28.3.2.7, "Flash Status Register (FSTAT)", and Section 28.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 28-27. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1133 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 28-27. Flash Module Interrupts Implementation 28.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 28.4.3, "Interrupts"). 28.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 28.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 28-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 1134 Freescale Semiconductor Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 28.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 28.3.2.2), the Verify Backdoor Access Key command (see Section 28.4.2.12) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 28-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 28.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 28.4.2.12 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1135 Chapter 28 768 KByte Flash Module (S12XFTM768K4V2) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 28.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 28.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 28-30. 28.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 1136 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-1. Revision History Revision Number V02.08 Revision Date 14 Nov 2007 Sections Affected Description of Changes 29.5.2/29-1198 - Changed terminology from `word program' to "Program P-Flash' in the BDM unsecuring description, Section 29.5.2 29.4.2/29-1174 - Added requirement that user not write any Flash module register during execution of commands `Erase All Blocks', Section 29.4.2.8, and `Unsecure Flash', Section 29.4.2.11 - Added statement that security is released upon successful completion of 29.4.2.8/29command `Erase All Blocks', Section 29.4.2.8 1180 29.4.2/29-1174 - Corrected Error Handling table for Full Partition D-Flash, Partition D-Flash, and EEPROM Emulation Query commands 29.1/29-1138 29.3.2.1/291150 29.4.2.4/291177 29.4.2.7/291179 29.4.2.12/291183 29.4.2.12/291183 29.4.2.12/291183 29.4.2.20/291192 - Clarify single bit fault correction for P-Flash phrase - Expand FDIV vs OSCCLK Frequency table - Add statement concerning code runaway when executing Read Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Program Once command from Flash block containing associated fields - Add statement concerning code runaway when executing Verify Backdoor Access Key command from Flash block containing associated fields - Relate Key 0 to associated Backdoor Comparison Key address - Change "power down reset" to "reset" - Add ACCERR condition for Disable EEPROM Emulation command The following changes were made to clarify module behavior related to Flash register access during reset sequence and while Flash commands are active: - Add caution concerning register writes while command is active - Writes to FCLKDIV are allowed during reset sequence while CCIF is clear - Add caution concerning register writes while command is active - Writes to FCCOBIX, FCCOBHI, FCCOBLO registers are ignored during reset sequence V02.09 V02.10 19 Dec 2007 25 Sep 2009 29.3.2/29-1148 29.3.2.1/291150 29.4.1.2/291169 29.6/29-1198 MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1137 29.1 Introduction The FTM1024K5 module implements the following: * 1024 Kbytes of P-Flash (Program Flash) memory, consisting of 5 physical Flash blocks, intended primarily for nonvolatile code storage * 32 Kbytes of D-Flash (Data Flash) memory, consisting of 1 physical Flash block, that can be used as nonvolatile storage to support the built-in hardware scheme for emulated EEPROM, as basic Flash memory primarily intended for nonvolatile data storage, or as a combination of both * 4 Kbytes of buffer RAM, consisting of 1 physical RAM block, that can be used as emulated EEPROM using a built-in hardware scheme, as basic RAM, or as a combination of both The Flash memory is ideal for single-supply applications allowing for field reprogramming without requiring external high voltage sources for program or erase operations. The Flash module includes a memory controller that executes commands to modify Flash memory contents or configure module resources for emulated EEPROM operation. The user interface to the memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is written to with the command, global address, data, and any required command parameters. The memory controller must complete the execution of a command before the FCCOB register can be written to with a new command. CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. The RAM and Flash memory may be read as bytes, aligned words, or misaligned words. Read access time is one bus cycle for bytes and aligned words, and two bus cycles for misaligned words. For Flash memory, an erased bit reads 1 and a programmed bit reads 0. It is not possible to read from a Flash block while any command is executing on that specific Flash block. It is possible to read from a Flash block while a command is executing on a different Flash block. Both P-Flash and D-Flash memories are implemented with Error Correction Codes (ECC) that can resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is always read by phrase, only one single bit fault in the phrase containing the byte or word accessed will be corrected. 29.1.1 Glossary Buffer RAM -- The buffer RAM constitutes the volatile memory store required for EEE. Memory space in the buffer RAM not required for EEE can be partitioned to provide volatile memory space for applications. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1138 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Command Write Sequence -- An MCU instruction sequence to execute built-in algorithms (including program and erase) on the Flash memory. D-Flash Memory -- The D-Flash memory constitutes the nonvolatile memory store required for EEE. Memory space in the D-Flash memory not required for EEE can be partitioned to provide nonvolatile memory space for applications. D-Flash Sector -- The D-Flash sector is the smallest portion of the D-Flash memory that can be erased. The D-Flash sector consists of four 64 byte rows for a total of 256 bytes. EEE (Emulated EEPROM) -- A method to emulate the small sector size features and endurance characteristics associated with an EEPROM. EEE IFR -- Nonvolatile information register located in the D-Flash block that contains data required to partition the D-Flash memory and buffer RAM for EEE. The EEE IFR is visible in the global memory map by setting the EEEIFRON bit in the MMCCTL1 register. NVM Command Mode -- An NVM mode using the CPU to setup the FCCOB register to pass parameters required for Flash command execution. Phrase -- An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes eight ECC bits for single bit fault correction and double bit fault detection within the phrase. P-Flash Memory -- The P-Flash memory constitutes the main nonvolatile memory store for applications. P-Flash Sector -- The P-Flash sector is the smallest portion of the P-Flash memory that can be erased. Each P-Flash sector contains 1024 bytes. Program IFR -- Nonvolatile information register located in the P-Flash block that contains the Device ID, Version ID, and the Program Once field. The Program IFR is visible in the global memory map by setting the PGMIFRON bit in the MMCCTL1 register. 29.1.2 29.1.2.1 * Features P-Flash Features * * * * * 1024 Kbytes of P-Flash memory composed of three 256 Kbyte Flash blocks and two 128 Kbyte Flash blocks. The 256 Kbyte Flash block consists of two 128 Kbyte sections each divided into 128 sectors of 1024 bytes. The 128 Kbyte Flash blocks are each divided into 128 sectors of 1024 bytes. Single bit fault correction and double bit fault detection within a 64-bit phrase during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and phrase program operation Ability to program up to one phrase in each P-Flash block simultaneously Flexible protection scheme to prevent accidental program or erase of P-Flash memory MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1139 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.1.2.2 * * * * * * D-Flash Features Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access Dedicated commands to control access to the D-Flash memory over EEE operation Single bit fault correction and double bit fault detection within a word during read operations Automated program and erase algorithm with verify and generation of ECC parity bits Fast sector erase and word program operation Ability to program up to four words in a burst sequence 29.1.2.3 * * * * * * * Emulated EEPROM Features Up to 4 Kbytes of emulated EEPROM (EEE) accessible as 4 Kbytes of RAM Flexible protection scheme to prevent accidental program or erase of data Automatic EEE file handling using an internal Memory Controller Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory Ability to disable EEE operation and allow priority access to the D-Flash memory Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory 29.1.2.4 * User Buffer RAM Features Up to 4 Kbytes of RAM for user access 29.1.2.5 * * * Other Flash Module Features No external high-voltage power supply required for Flash memory program and erase operations Interrupt generation on Flash command completion and Flash error detection Security mechanism to prevent unauthorized access to the Flash memory 29.1.3 Block Diagram The block diagram of the Flash module is shown in Figure 29-1. MC9S12XE-Family Reference Manual , Rev. 1.21 1140 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Flash Interface Command Interrupt Request Error Interrupt Request Registers 16bit internal bus P-Flash Block 0 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 Protection P-Flash Block 1S 16Kx72 sector 0 sector 1 sector 127 P-Flash Block 1N 16Kx72 sector 0 sector 1 sector 127 Security Oscillator Clock (XTAL) XGATE Clock Divider FCLK Memory Controller D-Flash 16Kx22 sector 0 sector 1 sector 127 P-Flash Block 2 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 CPU P-Flash Block 3 32Kx72 16Kx72 16Kx72 sector 0 sector 1 sector 127 sector 0 sector 1 sector 127 Scratch RAM 512x16 Buffer RAM 2Kx16 Tag RAM 128x16 Figure 29-1. FTM1024K5 Block Diagram 29.2 External Signal Description The Flash module contains no signals that connect off-chip. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1141 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.3 Memory Map and Registers This section describes the memory map and registers for the Flash module. Read data from unimplemented memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space in the Flash module will be ignored by the Flash module. 29.3.1 Module Memory Map The S12X architecture places the P-Flash memory between global addresses 0x70_0000 and 0x7F_FFFF as shown in Table 29-2. The P-Flash memory map is shown in Figure 29-2. Table 29-2. P-Flash Memory Addressing Global Address Size (Bytes) 256 K 128 K 128 K 256 K 256 K Description P-Flash Block 0 Contains Flash Configuration Field (see Table 29-3) P-Flash Block 1N P-Flash Block 1S P-Flash Block 2 P-Flash Block 3 0x7C_0000 - 0x7F_FFFF 0x7A_0000 - 0x7B_FFFF 0x78_0000 - 0x79_FFFF 0x74_0000 - 0x77_FFFF 0x70_0000 - 0x73_FFFF The FPROT register, described in Section 29.3.2.9, can be set to protect regions in the Flash memory from accidental program or erase. Three separate memory regions, one growing upward from global address 0x7F_8000 in the Flash memory (called the lower region), one growing downward from global address 0x7F_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash memory, can be activated for protection. The Flash memory addresses covered by these protectable regions are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code since it covers the vector space. Default protection settings as well as security information that allows the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in Table 29-3. Table 29-3. Flash Configuration Field(1) Global Address Size (Bytes) 8 Description Backdoor Comparison Key Refer to Section 29.4.2.12, "Verify Backdoor Access Key Command," and Section 29.5.1, "Unsecuring the MCU using Backdoor Key Access" Reserved P-Flash Protection byte. Refer to Section 29.3.2.9, "P-Flash Protection Register (FPROT)" EEE Protection byte Refer to Section 29.3.2.10, "EEE Protection Register (EPROT)" 0x7F_FF00 - 0x7F_FF07 0x7F_FF08 - 0x7F_FF0B(2) 0x7F_FF0C2 0x7F_FF0D2 4 1 1 MC9S12XE-Family Reference Manual , Rev. 1.21 1142 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-3. Flash Configuration Field(1) Global Address 0x7F_FF0E2 0x7F_FF0F2 Size (Bytes) 1 1 Description Flash Nonvolatile byte Refer to Section 29.3.2.14, "Flash Option Register (FOPT)" Flash Security byte Refer to Section 29.3.2.2, "Flash Security Register (FSEC)" 1. Older versions may have swapped protection byte addresses 2. 0x7FF08 - 0x7F_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in the 0x7F_FF08 - 0x7F_FF0B reserved field should be programmed to 0xFF. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1143 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) P-Flash START = 0x70_0000 Flash Protected/Unprotected Region 992 Kbytes 0x7F_8000 0x7F_8400 0x7F_8800 0x7F_9000 Flash Protected/Unprotected Lower Region 1, 2, 4, 8 Kbytes 0x7F_A000 Flash Protected/Unprotected Region 8 Kbytes (up to 29 Kbytes) 0x7F_C000 0x7F_E000 Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes 0x7F_F000 0x7F_F800 P-Flash END = 0x7F_FFFF Flash Configuration Field 16 bytes (0x7F_FF00 - 0x7F_FF0F) Figure 29-2. P-Flash Memory Map MC9S12XE-Family Reference Manual , Rev. 1.21 1144 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-4. Program IFR Fields Global Address (PGMIFRON) 0x40_0000 - 0x40_0007 0x40_0008 - 0x40_00E7 0x40_00E8 - 0x40_00E9 0x40_00EA - 0x40_00FF 0x40_0100 - 0x40_013F 0x40_0140 - 0x40_01FF Size (Bytes) 8 224 2 22 64 192 Device ID Reserved Version ID Reserved Program Once Field Refer to Section 29.4.2.7, "Program Once Command" Reserved Field Description Table 29-5. P-Flash IFR Accessibility Global Address (PGMIFRON) 0x40_0000 - 0x40_01FF 0x40_0200 - 0x40_03FF 0x40_0400 - 0x40_05FF 0x40_0600 - 0x40_07FF 0x40_0800 - 0x40_09FF 0x40_0A00 - 0x40_0BFF 0x40_0C00 - 0x40_0DFF Size (Bytes) 512 512 512 512 512 512 512 Accessed From XBUS0 (PBLK0S)(1) Unimplemented XBUS0 (PBLK1N) XBUS1 (PBLK1S) XBUS0 (PBLK2S) Unimplemented XBUS0 (PBLK3S) Unimplemented 0x40_0E00 - 0x40_0FFF 512 1. Refer to Table 29-4 for more details. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1145 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-6. EEE Resource Fields Global Address 0x10_0000 - 0x10_7FFF 0x10_8000 - 0x11_FFFF 0x12_0000 - 0x12_007F 0x12_0080 - 0x12_0FFF 0x12_1000 - 0x12_1EFF 0x12_1F00 - 0x12_1FFF 0x12_2000 - 0x12_3BFF 0x12_3C00 - 0x12_3FFF 0x12_4000 - 0x12_DFFF 0x12_E000 - 0x12_FFFF 0x13_0000 - 0x13_EFFF 0x13_F000 - 0x13_FFFF 1. MMCCTL1 register bit Size (Bytes) 32,768 98,304 128 3,968 3,840 256 7,168 1,024 40,960 8,192 61,440 4,096 Description D-Flash Memory (User and EEE) Reserved EEE Nonvolatile Information Register (EEEIFRON(1) = 1) Reserved Reserved EEE Tag RAM (TMGRAMON1 = 1) Reserved Memory Controller Scratch RAM (TMGRAMON1 = 1) Reserved Reserved Reserved Buffer RAM (User and EEE) MC9S12XE-Family Reference Manual , Rev. 1.21 1146 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) D-Flash START = 0x10_0000 D-Flash User Partition D-Flash Memory 32 Kbytes D-Flash EEE Partition D-Flash END = 0x10_7FFF 0x12_0000 0x12_1000 0x12_2000 0x12_4000 EEE Nonvolatile Information Register (EEEIFRON) 128 bytes EEE Tag RAM (TMGRAMON) 256 bytes Memory Controller Scratch RAM (TMGRAMON) 1024 bytes 0x12_E000 0x12_FFFF Buffer RAM START = 0x13_F000 Buffer RAM User Partition 0x13_FE00 0x13_FE40 0x13_FE80 0x13_FEC0 0x13_FF00 0x13_FF40 0x13_FF80 0x13_FFC0 Buffer RAM END = 0x13_FFFF Buffer RAM 4 Kbytes Buffer RAM EEE Partition Protectable Region (EEE only) 64, 128, 192, 256, 320, 384, 448, 512 bytes Figure 29-3. EEE Resource Memory Map The Full Partition D-Flash command (see Section 29.4.2.15) is used to program the EEE nonvolatile information register fields where address 0x12_0000 defines the D-Flash partition for user access and address 0x12_0004 defines the buffer RAM partition for EEE operations. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1147 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-7. EEE Nonvolatile Information Register Fields Global Address (EEEIFRON) 0x12_0000 - 0x12_0001 0x12_0002 - 0x12_0003 0x12_0004 - 0x12_0005 0x12_0006 - 0x12_0007 Size (Bytes) 2 2 2 2 Description D-Flash User Partition (DFPART) Refer to Section 29.4.2.15, "Full Partition D-Flash Command" D-Flash User Partition (duplicate(1)) Buffer RAM EEE Partition (ERPART) Refer to Section 29.4.2.15, "Full Partition D-Flash Command" Buffer RAM EEE Partition (duplicate1) 0x12_0008 - 0x12_007F 120 Reserved 1. Duplicate value used if primary value generates a double bit fault when read during the reset sequence. 29.3.2 Register Descriptions The Flash module contains a set of 20 control and status registers located between Flash module base + 0x0000 and 0x0013. A summary of the Flash module registers is given in Figure 29-4 with detailed descriptions in the following subsections. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. Address & Name 0x0000 FCLKDIV 0x0001 FSEC 0x0002 FCCOBIX 0x0003 FECCRIX 0x0004 FCNFG 0x0005 FERCNFG R W R W R W R W R CCIE W R ERSERIE W PGMERIE 0 EPVIOLIE ERSVIE1 ERSVIE0 DFDIE SFDIE 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 ECCRIX2 ECCRIX1 ECCRIX0 0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0 KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0 7 FDIVLD FDIV6 FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0 6 5 4 3 2 1 0 Figure 29-4. FTM1024K5 Register Summary MC9S12XE-Family Reference Manual , Rev. 1.21 1148 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Address & Name 0x0006 FSTAT 0x0007 FERSTAT 0x0008 FPROT 0x0009 EPROT 0x000A FCCOBHI 0x000B FCCOBLO 0x000C ETAGHI 0x000D ETAGLO 0x000E FECCRHI 0x000F FECCRLO 0x0010 FOPT 0x0011 FRSV0 0x0012 FRSV1 0x0013 FRSV2 R 7 6 0 5 4 3 MGBUSY 2 RSVD 1 MGSTAT1 0 MGSTAT0 CCIF W R ERSERIF W R FPOPEN W R EPOPEN W R CCOB15 W R CCOB7 W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 NV7 NV6 ECCR7 ECCR6 ECCR15 ECCR14 ETAG7 ETAG6 ETAG15 ETAG14 CCOB6 CCOB14 RNV6 RNV6 PGMERIF ACCERR FPVIOL 0 EPVIOLIF ERSVIF1 ERSVIF0 DFDIF SFDIF FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0 RNV5 RNV4 EPDIS EPS2 EPS1 EPS0 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0 ETAG13 ETAG12 ETAG11 ETAG10 ETAG9 ETAG8 ETAG5 ETAG4 ETAG3 ETAG2 ETAG1 ETAG0 ECCR13 ECCR12 ECCR11 ECCR10 ECCR9 ECCR8 ECCR5 ECCR4 ECCR3 ECCR2 ECCR1 ECCR0 NV5 NV4 NV3 NV2 NV1 NV0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 29-4. FTM1024K5 Register Summary (continued) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1149 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Address & Name 7 6 5 4 3 2 1 0 = Unimplemented or Reserved Figure 29-4. FTM1024K5 Register Summary (continued) 29.3.2.1 Flash Clock Divider Register (FCLKDIV) The FCLKDIV register is used to control timed events in program and erase algorithms. Offset Module Base + 0x0000 7 6 5 4 3 2 1 0 R W Reset FDIVLD FDIV[6:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-5. Flash Clock Divider Register (FCLKDIV) All bits in the FCLKDIV register are readable, bits 6-0 are write once and bit 7 is not writable. Table 29-8. FCLKDIV Field Descriptions Field 7 FDIVLD 6-0 FDIV[6:0] Description Clock Divider Loaded 0 FCLKDIV register has not been written 1 FCLKDIV register has been written since the last reset Clock Divider Bits -- FDIV[6:0] must be set to effectively divide OSCCLK down to generate an internal Flash clock, FCLK, with a target frequency of 1 MHz for use by the Flash module to control timed events during program and erase algorithms. Table 29-9 shows recommended values for FDIV[6:0] based on OSCCLK frequency. Please refer to Section 29.4.1, "Flash Command Operations," for more information. CAUTION The FCLKDIV register should never be written while a Flash command is executing (CCIF=0). The FCLKDIV register is writable during the Flash reset sequence even though CCIF is clear. MC9S12XE-Family Reference Manual , Rev. 1.21 1150 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-9. FDIV vs OSCCLK Frequency OSCCLK Frequency (MHz) MIN(1) MAX(2) OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] FDIV[6:0] OSCCLK Frequency (MHz) MIN 1 FDIV[6:0] MAX 2 MAX 2 33.60 1.60 2.40 3.20 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 2.10 3.15 4.20 5.25 6.30 7.35 8.40 9.45 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 22.05 23.10 24.15 25.20 26.25 27.30 28.35 29.40 30.45 31.50 32.55 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 34.65 35.70 36.75 37.80 38.85 39.90 40.95 42.00 43.05 44.10 45.15 46.20 47.25 48.30 49.35 50.40 51.45 52.50 53.55 54.60 55.65 56.70 57.75 58.80 59.85 60.90 61.95 63.00 64.05 65.10 66.15 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B 0x2C 0x2D 0x2E 0x2F 0x30 0x31 0x32 0x33 0x34 0x35 0x36 0x37 0x38 0x39 0x3A 0x3B 0x3C 0x3D 0x3E 0x3F 67.20 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 68.25 69.30 70.35 71.40 72.45 73.50 74.55 75.60 76.65 77.70 78.75 79.80 80.85 81.90 82.95 84.00 85.05 86.10 87.15 88.20 89.25 90.30 91.35 92.40 93.45 94.50 95.55 96.60 97.65 98.70 99.75 100.80 0x40 0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x53 0x54 0x55 0x56 0x57 0x58 0x59 0x5A 0x5B 0x5C 0x5D 0x5E 0x5F 32.55 33.60 0x1F 66.15 67.20 1. FDIV shown generates an FCLK frequency of >0.8 MHz MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1151 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 2. FDIV shown generates an FCLK frequency of 1.05 MHz 29.3.2.2 Flash Security Register (FSEC) The FSEC register holds all bits associated with the security of the MCU and Flash module. Offset Module Base + 0x0001 7 6 5 4 3 2 1 0 R W Reset F KEYEN[1:0] RNV[5:2] SEC[1:0] F F F F F F F = Unimplemented or Reserved Figure 29-6. Flash Security Register (FSEC) All bits in the FSEC register are readable but not writable. During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the Flash configuration field at global address 0x7F_FF0F located in P-Flash memory (see Table 29-3) as indicated by reset condition F in Figure 29-6. If a double bit fault is detected while reading the P-Flash phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set to leave the Flash module in a secured state with backdoor key access disabled. Table 29-10. FSEC Field Descriptions Field Description 7-6 Backdoor Key Security Enable Bits -- The KEYEN[1:0] bits define the enabling of backdoor key access to the KEYEN[1:0] Flash module as shown in Table 29-11. 5-2 RNV[5:2} 1-0 SEC[1:0] Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements. Flash Security Bits -- The SEC[1:0] bits define the security state of the MCU as shown in Table 29-12. If the Flash module is unsecured using backdoor key access, the SEC bits are forced to 10. Table 29-11. Flash KEYEN States KEYEN[1:0] 00 01 10 Status of Backdoor Key Access DISABLED DISABLED(1) ENABLED 11 DISABLED 1. Preferred KEYEN state to disable backdoor key access. MC9S12XE-Family Reference Manual , Rev. 1.21 1152 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-12. Flash Security States SEC[1:0] 00 01 10 Status of Security SECURED SECURED(1) UNSECURED 11 SECURED 1. Preferred SEC state to set MCU to secured state. The security function in the Flash module is described in Section 29.5. 29.3.2.3 Flash CCOB Index Register (FCCOBIX) The FCCOBIX register is used to index the FCCOB register for Flash memory operations. Offset Module Base + 0x0002 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 CCOBIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-7. FCCOB Index Register (FCCOBIX) CCOBIX bits are readable and writable while remaining bits read 0 and are not writable. Table 29-13. FCCOBIX Field Descriptions Field 2-0 CCOBIX[1:0] Description Common Command Register Index-- The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to. See Section 29.3.2.11, "Flash Common Command Object Register (FCCOB)," for more details. 29.3.2.4 Flash ECCR Index Register (FECCRIX) The FECCRIX register is used to index the FECCR register for ECC fault reporting. Offset Module Base + 0x0003 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 ECCRIX[2:0] 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-8. FECCR Index Register (FECCRIX) ECCRIX bits are readable and writable while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1153 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-14. FECCRIX Field Descriptions Field Description 2-0 ECC Error Register Index-- The ECCRIX bits are used to select which word of the FECCR register array is ECCRIX[2:0] being read. See Section 29.3.2.13, "Flash ECC Error Results Register (FECCR)," for more details. 29.3.2.5 Flash Configuration Register (FCNFG) The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array read access from the CPU or XGATE. Offset Module Base + 0x0004 7 6 5 4 3 2 1 0 R CCIE W Reset 0 0 0 IGNSF 0 0 FDFD FSFD 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-9. Flash Configuration Register (FCNFG) CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not writable. Table 29-15. FCNFG Field Descriptions Field 7 CCIE Description Command Complete Interrupt Enable -- The CCIE bit controls interrupt generation when a Flash command has completed. 0 Command complete interrupt disabled 1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 29.3.2.7) Ignore Single Bit Fault -- The IGNSF controls single bit fault reporting in the FERSTAT register (see Section 29.3.2.8). 0 All single bit faults detected during array reads are reported 1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be generated 4 IGNSF MC9S12XE-Family Reference Manual , Rev. 1.21 1154 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-15. FCNFG Field Descriptions (continued) Field 1 FDFD Description Force Double Bit Fault Detect -- The FDFD bit allows the user to simulate a double bit fault during Flash array read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD. The FECCR registers will not be updated during the Flash array read operation with FDFD set unless an actual double bit fault is detected. 0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected 1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see Section 29.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG register is set (see Section 29.3.2.6) Force Single Bit Fault Detect -- The FSFD bit allows the user to simulate a single bit fault during Flash array read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD. The FECCR registers will not be updated during the Flash array read operation with FSFD set unless an actual single bit fault is detected. 0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected 1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 29.3.2.7) and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see Section 29.3.2.6) 0 FSFD 29.3.2.6 Flash Error Configuration Register (FERCNFG) The FERCNFG register enables the Flash error interrupts for the FERSTAT flags. Offset Module Base + 0x0005 7 6 5 4 3 2 1 0 R ERSERIE W Reset 0 0 PGMERIE 0 EPVIOLIE 0 0 ERSVIE1 0 ERSVIE0 0 DFDIE 0 SFDIE 0 = Unimplemented or Reserved Figure 29-10. Flash Error Configuration Register (FERCNFG) All assigned bits in the FERCNFG register are readable and writable. Table 29-16. FERCNFG Field Descriptions Field 7 ERSERIE Description EEE Erase Error Interrupt Enable -- The ERSERIE bit controls interrupt generation when a failure is detected during an EEE erase operation. 0 ERSERIF interrupt disabled 1 An interrupt will be requested whenever the ERSERIF flag is set (see Section 29.3.2.8) EEE Program Error Interrupt Enable -- The PGMERIE bit controls interrupt generation when a failure is detected during an EEE program operation. 0 PGMERIF interrupt disabled 1 An interrupt will be requested whenever the PGMERIF flag is set (see Section 29.3.2.8) EEE Protection Violation Interrupt Enable -- The EPVIOLIE bit controls interrupt generation when a protection violation is detected during a write to the buffer RAM EEE partition. 0 EPVIOLIF interrupt disabled 1 An interrupt will be requested whenever the EPVIOLIF flag is set (see Section 29.3.2.8) 6 PGMERIE 4 EPVIOLIE MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1155 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-16. FERCNFG Field Descriptions (continued) Field 3 ERSVIE1 Description EEE Error Type 1 Interrupt Enable -- The ERSVIE1 bit controls interrupt generation when a change state error is detected during an EEE operation. 0 ERSVIF1 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF1 flag is set (see Section 29.3.2.8) EEE Error Type 0 Interrupt Enable -- The ERSVIE0 bit controls interrupt generation when a sector format error is detected during an EEE operation. 0 ERSVIF0 interrupt disabled 1 An interrupt will be requested whenever the ERSVIF0 flag is set (see Section 29.3.2.8) Double Bit Fault Detect Interrupt Enable -- The DFDIE bit controls interrupt generation when a double bit fault is detected during a Flash block read operation. 0 DFDIF interrupt disabled 1 An interrupt will be requested whenever the DFDIF flag is set (see Section 29.3.2.8) Single Bit Fault Detect Interrupt Enable -- The SFDIE bit controls interrupt generation when a single bit fault is detected during a Flash block read operation. 0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 29.3.2.8) 1 An interrupt will be requested whenever the SFDIF flag is set (see Section 29.3.2.8) 2 ERSVIE0 1 DFDIE 0 SFDIE 29.3.2.7 Flash Status Register (FSTAT) The FSTAT register reports the operational status of the Flash module. Offset Module Base + 0x0006 7 6 5 4 3 2 1 0 R CCIF W Reset 1 0 ACCERR 0 0 FPVIOL 0 MGBUSY RSVD MGSTAT[1:0] 0 0 0(1) 01 = Unimplemented or Reserved Figure 29-11. Flash Status Register (FSTAT) 1. Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 29.6). CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable but not writable, while remaining bits read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 1156 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-17. FSTAT Field Descriptions Field 7 CCIF Description Command Complete Interrupt Flag -- The CCIF flag indicates that a Flash command has completed. The CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command completion or command violation. 0 Flash command in progress 1 Flash command has completed Flash Access Error Flag -- The ACCERR bit indicates an illegal access has occurred to the Flash memory caused by either a violation of the command write sequence (see Section 29.4.1.2) or issuing an illegal Flash command or when errors are encountered while initializing the EEE buffer ram during the reset sequence. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR. 0 No access error detected 1 Access error detected Flash Protection Violation Flag --The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of P-Flash memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL is set, it is not possible to launch a command or start a command write sequence. 0 No protection violation detected 1 Protection violation detected Memory Controller Busy Flag -- The MGBUSY flag reflects the active state of the Memory Controller. 0 Memory Controller is idle 1 Memory Controller is busy executing a Flash command (CCIF = 0) or is handling internal EEE operations Reserved Bit -- This bit is reserved and always reads 0. 5 ACCERR 4 FPVIOL 3 MGBUSY 2 RSVD 1-0 Memory Controller Command Completion Status Flag -- One or more MGSTAT flag bits are set if an error MGSTAT[1:0] is detected during execution of a Flash command or during the Flash reset sequence. See Section 29.4.2, "Flash Command Description," and Section 29.6, "Initialization" for details. 29.3.2.8 Flash Error Status Register (FERSTAT) The FERSTAT register reflects the error status of internal Flash operations. Offset Module Base + 0x0007 7 6 5 4 3 2 1 0 R ERSERIF W Reset 0 0 PGMERIF 0 EPVIOLIF 0 0 ERSVIF1 0 ERSVIF0 0 DFDIF 0 SFDIF 0 = Unimplemented or Reserved Figure 29-12. Flash Error Status Register (FERSTAT) All flags in the FERSTAT register are readable and only writable to clear the flag. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1157 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-18. FERSTAT Field Descriptions Field 7 ERSERIF Description EEE Erase Error Interrupt Flag -- The setting of the ERSERIF flag occurs due to an error in a Flash erase command that resulted in the erase operation not being successful during EEE operations. The ERSERIF flag is cleared by writing a 1 to ERSERIF. Writing a 0 to the ERSERIF flag has no effect on ERSERIF. While ERSERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Erase command successfully completed on the D-Flash EEE partition 1 Erase command failed on the D-Flash EEE partition EEE Program Error Interrupt Flag -- The setting of the PGMERIF flag occurs due to an error in a Flash program command that resulted in the program operation not being successful during EEE operations. The PGMERIF flag is cleared by writing a 1 to PGMERIF. Writing a 0 to the PGMERIF flag has no effect on PGMERIF. While PGMERIF is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 Program command successfully completed on the D-Flash EEE partition 1 Program command failed on the D-Flash EEE partition EEE Protection Violation Interrupt Flag --The setting of the EPVIOLIF flag indicates an attempt was made to write to a protected area of the buffer RAM EEE partition. The EPVIOLIF flag is cleared by writing a 1 to EPVIOLIF. Writing a 0 to the EPVIOLIF flag has no effect on EPVIOLIF. While EPVIOLIF is set, it is possible to write to the buffer RAM EEE partition as long as the address written to is not in a protected area. 0 No EEE protection violation 1 EEE protection violation detected EEE Error Interrupt 1 Flag --The setting of the ERSVIF1 flag indicates that the memory controller was unable to change the state of a D-Flash EEE sector. The ERSVIF1 flag is cleared by writing a 1 to ERSVIF1. Writing a 0 to the ERSVIF1 flag has no effect on ERSVIF1. While ERSVIF1 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector state change error detected 1 EEE sector state change error detected EEE Error Interrupt 0 Flag --The setting of the ERSVIF0 flag indicates that the memory controller was unable to format a D-Flash EEE sector for EEE use. The ERSVIF0 flag is cleared by writing a 1 to ERSVIF0. Writing a 0 to the ERSVIF0 flag has no effect on ERSVIF0. While ERSVIF0 is set, it is possible to write to the buffer RAM EEE partition but the data written will not be transferred to the D-Flash EEE partition. 0 No EEE sector format error detected 1 EEE sector format error detected Double Bit Fault Detect Interrupt Flag -- The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The DFDIF flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF. 0 No double bit fault detected 1 Double bit fault detected or an invalid Flash array read operation attempted Single Bit Fault Detect Interrupt Flag -- With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation was attempted on a Flash block that was under a Flash command operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on SFDIF. 0 No single bit fault detected 1 Single bit fault detected and corrected or an invalid Flash array read operation attempted 6 PGMERIF 4 EPVIOLIF 3 ERSVIF1 2 ERSVIF0 1 DFDIF 0 SFDIF 29.3.2.9 P-Flash Protection Register (FPROT) The FPROT register defines which P-Flash sectors are protected against program and erase operations. MC9S12XE-Family Reference Manual , Rev. 1.21 1158 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Offset Module Base + 0x0008 7 6 5 4 3 2 1 0 R FPOPEN W Reset F RNV6 FPHDIS F F F FPHS[1:0] F FPLDIS F F FPLS[1:0] F = Unimplemented or Reserved Figure 29-13. Flash Protection Register (FPROT) The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected region can only be increased (see Section 29.3.2.9.1, "P-Flash Protection Restrictions," and Table 29-23). During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte in the Flash configuration field at global address 0x7F_FF0C located in P-Flash memory (see Table 29-3) as indicated by reset condition `F' in Figure 29-13. To change the P-Flash protection that will be loaded during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected. Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if any of the P-Flash sectors contained in the same P-Flash block are protected. Table 29-19. FPROT Field Descriptions Field 7 FPOPEN Description Flash Protection Operation Enable -- The FPOPEN bit determines the protection function for program or erase operations as shown in Table 29-20 for the P-Flash block. 0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the corresponding FPHS and FPLS bits 1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the corresponding FPHS and FPLS bits Reserved Nonvolatile Bit -- The RNV bit should remain in the erased state for future enhancements. Flash Protection Higher Address Range Disable -- The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x7F_FFFF. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Higher Address Size -- The FPHS bits determine the size of the protected/unprotected area in P-Flash memory as shown inTable 29-21. The FPHS bits can only be written to while the FPHDIS bit is set. Flash Protection Lower Address Range Disable -- The FPLDIS bit determines whether there is a protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x7F_8000. 0 Protection/Unprotection enabled 1 Protection/Unprotection disabled Flash Protection Lower Address Size -- The FPLS bits determine the size of the protected/unprotected area in P-Flash memory as shown in Table 29-22. The FPLS bits can only be written to while the FPLDIS bit is set. 6 RNV[6] 5 FPHDIS 4-3 FPHS[1:0] 2 FPLDIS 1-0 FPLS[1:0] MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1159 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-20. P-Flash Protection Function FPOPEN 1 1 1 1 0 0 0 FPHDIS 1 1 0 0 1 1 0 FPLDIS 1 0 1 0 1 0 1 Function(1) No P-Flash Protection Protected Low Range Protected High Range Protected High and Low Ranges Full P-Flash Memory Protected Unprotected Low Range Unprotected High Range 0 0 0 Unprotected High and Low Ranges 1. For range sizes, refer to Table 29-21 and Table 29-22. Table 29-21. P-Flash Protection Higher Address Range FPHS[1:0] 00 01 10 11 Global Address Range 0x7F_F800-0x7F_FFFF 0x7F_F000-0x7F_FFFF 0x7F_E000-0x7F_FFFF 0x7F_C000-0x7F_FFFF Protected Size 2 Kbytes 4 Kbytes 8 Kbytes 16 Kbytes Table 29-22. P-Flash Protection Lower Address Range FPLS[1:0] 00 01 10 11 Global Address Range 0x7F_8000-0x7F_83FF 0x7F_8000-0x7F_87FF 0x7F_8000-0x7F_8FFF 0x7F_8000-0x7F_9FFF Protected Size 1 Kbyte 2 Kbytes 4 Kbytes 8 Kbytes All possible P-Flash protection scenarios are shown in Figure 29-14. Although the protection scheme is loaded from the Flash memory at global address 0x7F_FF0C during the reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single chip mode while providing as much protection as possible if reprogramming is not required. MC9S12XE-Family Reference Manual , Rev. 1.21 1160 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) FPHDIS = 1 FPLDIS = 1 FLASH START FPHDIS = 1 FPLDIS = 0 6 FPHDIS = 0 FPLDIS = 1 5 FPHDIS = 0 FPLDIS = 0 4 Scenario 7 0x7F_8000 0x7F_FFFF Scenario FLASH START 3 2 1 0 FPHS[1:0] FPHS[1:0] FPLS[1:0] FPOPEN = 0 1161 0x7F_8000 0x7F_FFFF Unprotected region Protected region not defined by FPLS, FPHS Protected region with size defined by FPLS Protected region with size defined by FPHS Figure 29-14. P-Flash Protection Scenarios MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor FPLS[1:0] FPOPEN = 1 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.3.2.9.1 P-Flash Protection Restrictions The general guideline is that P-Flash protection can only be added and not removed. Table 29-23 specifies all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario. See the FPHS and FPLS bit descriptions for additional restrictions. Table 29-23. P-Flash Protection Scenario Transitions From Protection Scenario 0 1 2 3 4 5 6 X X To Protection Scenario(1) 0 X 1 X X X 2 X 3 X X X X X X X X X X X X 4 5 6 7 X X X X X X X X 7 1. Allowed transitions marked with X, see Figure 29-14 for a definition of the scenarios. 29.3.2.10 EEE Protection Register (EPROT) The EPROT register defines which buffer RAM EEE partition areas are protected against writes. Offset Module Base + 0x0009 7 6 5 4 3 2 1 0 R EPOPEN W Reset F F RNV[6:4] EPDIS F F F F EPS[2:0] F F = Unimplemented or Reserved Figure 29-15. EEE Protection Register (EPROT) All bits in the EPROT register are readable and writable except for RNV[6:4] which are only readable. The EPOPEN and EPDIS bits can only be written to the protected state. The EPS bits can be written anytime until the EPDIS bit is cleared. If the EPOPEN bit is cleared, the state of the EPDIS and EPS bits is irrelevant. During the reset sequence, the EPROT register is loaded from the EEE protection byte in the Flash configuration field at global address 0x7F_FF0D located in P-Flash memory (see Table 29-3) as indicated by reset condition F in Figure 29-15. To change the EEE protection that will be loaded during the reset sequence, the P-Flash sector containing the EEE protection byte must be unprotected, then the EEE protection byte must be programmed. If a double bit fault is detected while reading the P-Flash phrase MC9S12XE-Family Reference Manual , Rev. 1.21 1162 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) containing the EEE protection byte during the reset sequence, the EPOPEN bit will be cleared and remaining bits in the EPROT register will be set to leave the buffer RAM EEE partition fully protected. Trying to write data to any protected area in the buffer RAM EEE partition will result in a protection violation error and the EPVIOLIF flag will be set in the FERSTAT register. Trying to write data to any protected area in the buffer RAM partitioned for user access will not be prevented and the EPVIOLIF flag in the FERSTAT register will not set. Table 29-24. EPROT Field Descriptions Field 7 EPOPEN 6-4 RNV[6:4] 3 EPDIS Description Enables writes to the Buffer RAM partitioned for EEE 0 The entire buffer RAM EEE partition is protected from writes 1 Unprotected buffer RAM EEE partition areas are enabled for writes Reserved Nonvolatile Bits -- The RNV bits should remain in the erased state for future enhancements Buffer RAM Protection Address Range Disable -- The EPDIS bit determines whether there is a protected area in a specific region of the buffer RAM EEE partition. 0 Protection enabled 1 Protection disabled Buffer RAM Protection Size -- The EPS[2:0] bits determine the size of the protected area in the buffer RAM EEE partition as shown inTable 29-21. The EPS bits can only be written to while the EPDIS bit is set. 2-0 EPS[2:0] Table 29-25. Buffer RAM EEE Partition Protection Address Range EPS[2:0] 000 001 010 011 100 101 110 111 Global Address Range 0x13_FFC0 - 0x13_FFFF 0x13_FF80 - 0x13_FFFF 0x13_FF40 - 0x13_FFFF 0x13_FF00 - 0x13_FFFF 0x13_FEC0 - 0x13_FFFF 0x13_FE80 - 0x13_FFFF 0x13_FE40 - 0x13_FFFF 0x13_FE00 - 0x13_FFFF Protected Size 64 bytes 128 bytes 192 bytes 256 bytes 320 bytes 384 bytes 448 bytes 512 bytes 29.3.2.11 Flash Common Command Object Register (FCCOB) The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register. Byte wide reads and writes are allowed to the FCCOB register. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1163 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Offset Module Base + 0x000A 7 6 5 4 3 2 1 0 R CCOB[15:8] W Reset 0 0 0 0 0 0 0 0 Figure 29-16. Flash Common Command Object High Register (FCCOBHI) Offset Module Base + 0x000B 7 6 5 4 3 2 1 0 R CCOB[7:0] W Reset 0 0 0 0 0 0 0 0 Figure 29-17. Flash Common Command Object Low Register (FCCOBLO) 29.3.2.11.1 FCCOB - NVM Command Mode NVM command mode uses the indexed FCCOB register to provide a command code and its relevant parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates the command's execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the FCCOB register array. The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 29-26. The return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX = 111) are ignored with reads from these fields returning 0x0000. Table 29-26 shows the generic Flash command format. The high byte of the first word in the CCOB array contains the command code, followed by the parameters for this specific Flash command. For details on the FCCOB settings required by each command, see the Flash command descriptions in Section 29.4.2. Table 29-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 000 LO HI 001 LO HI 010 LO Data 0 [7:0] Global address [7:0] Data 0 [15:8] 0, Global address [22:16] Global address [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) FCMD[7:0] defining Flash command MC9S12XE-Family Reference Manual , Rev. 1.21 1164 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-26. FCCOB - NVM Command Mode (Typical Usage) CCOBIX[2:0] 011 LO HI 100 LO HI 101 LO Data 3 [7:0] Data 2 [7:0] Data 3 [15:8] Data 1 [7:0] Data 2 [15:8] Byte HI FCCOB Parameter Fields (NVM Command Mode) Data 1 [15:8] 29.3.2.12 EEE Tag Counter Register (ETAG) The ETAG register contains the number of outstanding words in the buffer RAM EEE partition that need to be programmed into the D-Flash EEE partition. The ETAG register is decremented prior to the related tagged word being programmed into the D-Flash EEE partition. All tagged words have been programmed into the D-Flash EEE partition once all bits in the ETAG register read 0 and the MGBUSY flag in the FSTAT register reads 0. Offset Module Base + 0x000C 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 29-18. EEE Tag Counter High Register (ETAGHI) Offset Module Base + 0x000D 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ETAG[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 29-19. EEE Tag Counter Low Register (ETAGLO) All ETAG bits are readable but not writable and are cleared by the Memory Controller. 29.3.2.13 Flash ECC Error Results Register (FECCR) The FECCR registers contain the result of a detected ECC fault for both single bit and double bit faults. The FECCR register provides access to several ECC related fields as defined by the ECCRIX index bits in the FECCRIX register (see Section 29.3.2.4). Once ECC fault information has been stored, no other MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1165 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) fault information will be recorded until the specific ECC fault flag has been cleared. In the event of simultaneous ECC faults, the priority for fault recording is: 1. Double bit fault over single bit fault 2. CPU over XGATE Offset Module Base + 0x000E 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[15:8] 0 0 0 0 = Unimplemented or Reserved Figure 29-20. Flash ECC Error Results High Register (FECCRHI) Offset Module Base + 0x000F 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 ECCR[7:0] 0 0 0 0 = Unimplemented or Reserved Figure 29-21. Flash ECC Error Results Low Register (FECCRLO) All FECCR bits are readable but not writable. Table 29-27. FECCR Index Settings ECCRIX[2:0] Bits [15:8] 000 001 010 011 100 101 110 111 Parity bits read from Flash block FECCR Register Content Bit[7] CPU or XGATE source identity Global address [15:0] Data 0 [15:0] Data 1 [15:0] (P-Flash only) Data 2 [15:0] (P-Flash only) Data 3 [15:0] (P-Flash only) Not used, returns 0x0000 when read Not used, returns 0x0000 when read Bits[6:0] Global address [22:16] MC9S12XE-Family Reference Manual , Rev. 1.21 1166 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-28. FECCR Index=000 Bit Descriptions Field 15:8 PAR[7:0] 7 XBUS01 Description ECC Parity Bits -- Contains the 8 parity bits from the 72 bit wide P-Flash data word or the 6 parity bits, allocated to PAR[5:0], from the 22 bit wide D-Flash word with PAR[7:6]=00. Bus Source Identifier -- The XBUS01 bit determines whether the ECC error was caused by a read access from the CPU or XGATE. 0 ECC Error happened on the CPU access 1 ECC Error happened on the XGATE access 6-0 Global Address -- The GADDR[22:16] field contains the upper seven bits of the global address having GADDR[22:16] caused the error. The P-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The following four words addressed by ECCRIX = 010 to 101 contain the 64-bit wide data phrase. The four data words and the parity byte are the uncorrected data read from the P-Flash block. The D-Flash word addressed by ECCRIX = 001 contains the lower 16 bits of the global address. The uncorrected 16-bit data word is addressed by ECCRIX = 010. 29.3.2.14 Flash Option Register (FOPT) The FOPT register is the Flash option register. Offset Module Base + 0x0010 7 6 5 4 3 2 1 0 R W Reset F F F F NV[7:0] F F F F = Unimplemented or Reserved Figure 29-22. Flash Option Register (FOPT) All bits in the FOPT register are readable but are not writable. During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash configuration field at global address 0x7F_FF0E located in P-Flash memory (see Table 29-3) as indicated by reset condition F in Figure 29-22. If a double bit fault is detected while reading the P-Flash phrase containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set. Table 29-29. FOPT Field Descriptions Field 7-0 NV[7:0] Description Nonvolatile Bits -- The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper use of the NV bits. 29.3.2.15 Flash Reserved0 Register (FRSV0) This Flash register is reserved for factory testing. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1167 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Offset Module Base + 0x0011 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-23. Flash Reserved0 Register (FRSV0) All bits in the FRSV0 register read 0 and are not writable. 29.3.2.16 Flash Reserved1 Register (FRSV1) This Flash register is reserved for factory testing. Offset Module Base + 0x0012 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-24. Flash Reserved1 Register (FRSV1) All bits in the FRSV1 register read 0 and are not writable. 29.3.2.17 Flash Reserved2 Register (FRSV2) This Flash register is reserved for factory testing. Offset Module Base + 0x0013 7 6 5 4 3 2 1 0 R W Reset 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 = Unimplemented or Reserved Figure 29-25. Flash Reserved2 Register (FRSV2) All bits in the FRSV2 register read 0 and are not writable. MC9S12XE-Family Reference Manual , Rev. 1.21 1168 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4 29.4.1 Functional Description Flash Command Operations Flash command operations are used to modify Flash memory contents or configure module resources for EEE operation. The next sections describe: * How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from OSCCLK for Flash program and erase command operations * The command write sequence used to set Flash command parameters and launch execution * Valid Flash commands available for execution 29.4.1.1 Writing the FCLKDIV Register Prior to issuing any Flash program or erase command after a reset, the user is required to write the FCLKDIV register to divide OSCCLK down to a target FCLK of 1 MHz. Table 29-9 shows recommended values for the FDIV field based on OSCCLK frequency. NOTE Programming or erasing the Flash memory cannot be performed if the bus clock runs at less than 1 MHz. Setting FDIV too high can destroy the Flash memory due to overstress. Setting FDIV too low can result in incomplete programming or erasure of the Flash memory cells. When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written, any Flash program or erase command loaded during a command write sequence will not execute and the ACCERR bit in the FSTAT register will set. 29.4.1.2 Command Write Sequence The Memory Controller will launch all valid Flash commands entered using a command write sequence. Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see Section 29.3.2.7) and the CCIF flag should be tested to determine the status of the current command write sequence. If CCIF is 0, the previous command write sequence is still active, a new command write sequence cannot be started, and all writes to the FCCOB register are ignored. CAUTION Writes to any Flash register must be avoided while a Flash command is active (CCIF=0) to prevent corruption of Flash register contents and Memory Controller behavior. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1169 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.1.2.1 Define FCCOB Contents The FCCOB parameter fields must be loaded with all required parameters for the Flash command being executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX register (see Section 29.3.2.3). The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag will remain clear until the Flash command has completed. Upon completion, the Memory Controller will return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic command write sequence is shown in Figure 29-26. MC9S12XE-Family Reference Manual , Rev. 1.21 1170 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) START Read: FCLKDIV register Clock Register Written Check FDIVLD Set? yes no Write: FCLKDIV register Read: FSTAT register Note: FCLKDIV must be set after each reset FCCOB Availability Check CCIF Set? yes no Results from previous Command yes Write: FSTAT register Clear ACCERR/FPVIOL 0x30 Access Error and Protection Violation Check ACCERR/ FPVIOL Set? no Write to FCCOBIX register to identify specific command parameter to load. Write to FCCOB register to load required command parameter. More Parameters? no yes Write: FSTAT register (to launch command) Clear CCIF 0x80 Read: FSTAT register Bit Polling for Command Completion Check CCIF Set? yes EXIT no Figure 29-26. Generic Flash Command Write Sequence Flowchart MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1171 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.1.3 Valid Flash Module Commands Table 29-30. Flash Commands by Mode Unsecured FCMD Command NS (1) Secured NS (5) NX (2) SS(3) ST(4) NX (6) SS(7) ST(8) 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 Erase Verify All Blocks Erase Verify Block Erase Verify P-Flash Section Read Once Load Data Field Program P-Flash Program Once Erase All Blocks Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level Full Partition D-Flash Erase Verify D-Flash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query 0x20 Partition D-Flash 1. Unsecured Normal Single Chip mode. 2. Unsecured Normal Expanded mode. 3. Unsecured Special Single Chip mode. 4. Unsecured Special Mode. 5. Secured Normal Single Chip mode. 6. Secured Normal Expanded mode. 7. Secured Special Single Chip mode. 8. Secured Special Mode. MC9S12XE-Family Reference Manual , Rev. 1.21 1172 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.1.4 P-Flash Commands Table 29-31 summarizes the valid P-Flash commands along with the effects of the commands on the PFlash block and other resources within the Flash module. Table 29-31. P-Flash Commands FCMD 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Command Erase Verify All Blocks Erase Verify Block Erase Verify PFlash Section Read Once Load Data Field Program P-Flash Program Once Function on P-Flash Memory Verify that all P-Flash (and D-Flash) blocks are erased. Verify that a P-Flash block is erased. Verify that a given number of words starting at the address provided are erased. Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that was previously programmed using the Program Once command. Load data for simultaneous multiple P-Flash block operations. Program a phrase in a P-Flash block and any previously loaded phrases for any other PFlash block (see Load Data Field command). Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block 0 that is allowed to be programmed only once. Erase all P-Flash (and D-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Erase a single P-Flash block. An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN bits in the FPROT register are set prior to launching the command. Erase all bytes in a P-Flash sector. Supports a method of releasing MCU security by erasing all P-Flash (and D-Flash) blocks and verifying that all P-Flash (and D-Flash) blocks are erased. Supports a method of releasing MCU security by verifying a set of security keys. Specifies a user margin read level for all P-Flash blocks. Specifies a field margin read level for all P-Flash blocks (special modes only). 0x08 Erase All Blocks 0x09 Erase P-Flash Block Erase P-Flash Sector Unsecure Flash Verify Backdoor Access Key Set User Margin Level Set Field Margin Level 0x0A 0x0B 0x0C 0x0D 0x0E 29.4.1.5 D-Flash and EEE Commands Table 29-32 summarizes the valid D-Flash and EEE commands along with the effects of the commands on the D-Flash block and EEE operation. Table 29-32. D-Flash Commands FCMD 0x01 0x02 Command Erase Verify All Blocks Erase Verify Block Function on D-Flash Memory Verify that all D-Flash (and P-Flash) blocks are erased. Verify that the D-Flash block is erased. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1173 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-32. D-Flash Commands FCMD Command Function on D-Flash Memory Erase all D-Flash (and P-Flash) blocks. An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN bits in the FPROT register and the EPDIS and EPOPEN bits in the EPROT register are set prior to launching the command. Supports a method of releasing MCU security by erasing all D-Flash (and P-Flash) blocks and verifying that all D-Flash (and P-Flash) blocks are erased. Specifies a user margin read level for the D-Flash block. Specifies a field margin read level for the D-Flash block (special modes only). Erase the D-Flash block and partition an area of the D-Flash block for user access. Verify that a given number of words starting at the address provided are erased. Program up to four words in the D-Flash block. Erase all bytes in a sector of the D-Flash block. Enable EEPROM emulation where writes to the buffer RAM EEE partition will be copied to the D-Flash EEE partition. Suspend all current erase and program activity related to EEPROM emulation but leave current EEE tags set. Returns EEE partition and status variables. Partition an area of the D-Flash block for user access. 0x08 Erase All Blocks 0x0B 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x20 Unsecure Flash Set User Margin Level Set Field Margin Level Full Partition DFlash Erase Verify DFlash Section Program D-Flash Erase D-Flash Sector Enable EEPROM Emulation Disable EEPROM Emulation EEPROM Emulation Query Partition D-Flash 29.4.2 Flash Command Description This section provides details of all available Flash commands launched by a command write sequence. The ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following illegal steps are performed, causing the command not to be processed by the Memory Controller: * Starting any command write sequence that programs or erases Flash memory before initializing the FCLKDIV register * Writing an invalid command as part of the command write sequence * For additional possible errors, refer to the error handling table provided for each command If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation will return invalid data. If the SFDIF or DFDIF flags were not previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set and the FECCR registers will be loaded with the global address used in the invalid read operation with the data and parity fields set to all 0. If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting any command write sequence (see Section 29.3.2.7). MC9S12XE-Family Reference Manual , Rev. 1.21 1174 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) CAUTION A Flash word or phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash word or phrase is not allowed. 29.4.2.1 Erase Verify All Blocks Command Table 29-33. Erase Verify All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x01 FCCOB Parameters Not required The Erase Verify All Blocks command will verify that all P-Flash and D-Flash blocks have been erased. Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks operation has completed. Table 29-34. Erase Verify All Blocks Command Error Handling Register Error Bit ACCERR Set if a Load Data Field command sequence is currently active FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Error Condition Set if CCOBIX[2:0] != 000 at command launch 29.4.2.2 Erase Verify Block Command The Erase Verify Block command allows the user to verify that an entire P-Flash or D-Flash block has been erased. The FCCOB upper global address bits determine which block must be verified. Table 29-35. Erase Verify Block Command FCCOB Requirements CCOBIX[2:0] 000 0x02 FCCOB Parameters Global address [22:16] of the Flash block to be verified. Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that the selected P-Flash or D-Flash block is erased. The CCIF flag will set after the Erase Verify Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1175 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-36. Erase Verify Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if a Load Data Field command sequence is currently active Set if an invalid global address [22:16] is supplied 29.4.2.3 Erase Verify P-Flash Section Command The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and the number of phrases. The section to be verified cannot cross a 256 Kbyte boundary in the P-Flash memory space. Table 29-37. Erase Verify P-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x03 FCCOB Parameters Global address [22:16] of a P-Flash block Global address [15:0] of the first phrase to be verified Number of phrases to be verified Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash Section operation has completed. Table 29-38. Erase Verify P-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the requested section crosses a 256 Kbyte boundary FPVIOL MGSTAT1 MGSTAT0 None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read MC9S12XE-Family Reference Manual , Rev. 1.21 1176 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-38. Erase Verify P-Flash Section Command Error Handling Register FERSTAT Error Bit EPVIOLIF None Error Condition 29.4.2.4 Read Once Command The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the nonvolatile information register of P-Flash block 0. The Read Once field is programmed using the Program Once command described in Section 29.4.2.7. The Read Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 29-39. Read Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x04 FCCOB Parameters Not Required Read Once phrase index (0x0000 - 0x0007) Read Once word 0 value Read Once word 1 value Read Once word 2 value Read Once word 3 value Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the Read Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. 128 Table 29-40. Read Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 29-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid phrase index is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 29.4.2.5 Load Data Field Command The Load Data Field command is executed to provide FCCOB parameters for multiple P-Flash blocks for a future simultaneous program operation in the P-Flash memory space. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1177 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-41. Load Data Field Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 1. Global address [2:0] must be 000 0x05 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 Word 1 Word 2 Word 3 Upon clearing CCIF to launch the Load Data Field command, the FCCOB registers will be transferred to the Memory Controller and be programmed in the block specified at the global address given with a future Program P-Flash command launched on a P-Flash block. The CCIF flag will set after the Load Data Field operation has completed. Note that once a Load Data Field command sequence has been initiated, the Load Data Field command sequence will be cancelled if any command other than Load Data Field or the future Program P-Flash is launched. Similarly, if an error occurs after launching a Load Data Field or Program P-Flash command, the associated Load Data Field command sequence will be cancelled. Table 29-42. Load Data Field Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 29-30) Set if an invalid global address [22:0] is supplied ACCERR FSTAT Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area None None None 29.4.2.6 Program P-Flash Command The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an embedded algorithm. MC9S12XE-Family Reference Manual , Rev. 1.21 1178 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) CAUTION A P-Flash phrase must be in the erased state before being programmed. Cumulative programming of bits within a Flash phrase is not allowed. Table 29-43. Program P-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x06 FCCOB Parameters Global address [22:16] to identify P-Flash block Global address [15:0] of phrase location to be programmed(1) Word 0 program value Word 1 program value Word 2 program value 101 Word 3 program value 1. Global address [2:0] must be 000 Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the data words to the supplied global address and will then proceed to verify the data words read back as expected. The CCIF flag will set after the Program P-Flash operation has completed. Table 29-44. Program P-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if command not available in current mode (see Table 29-30) Set if an invalid global address [22:0] is supplied ACCERR Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if a Load Data Field command sequence is currently active and the selected block has previously been selected in the same command sequence FSTAT Set if a Load Data Field command sequence is currently active and global address [17:0] does not match that previously supplied in the same command sequence FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if the global address [22:0] points to a protected area Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 29.4.2.7 Program Once Command The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the nonvolatile information register located in P-Flash block 0. The Program Once reserved field can be read using the Read Once command as described in Section 29.4.2.4. The Program Once command must only be issued once since the nonvolatile information register in P-Flash block 0 cannot be erased. The Program MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1179 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Once command must not be executed from the Flash block containing the Program Once reserved field to avoid code runaway. Table 29-45. Program Once Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x07 FCCOB Parameters Not Required Program Once phrase index (0x0000 - 0x0007) Program Once word 0 value Program Once word 1 value Program Once word 2 value Program Once word 3 value Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed. The reserved nonvolatile information register accessed by the Program Once command cannot be erased and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program Once command, any attempt to read addresses within P-Flash block 0 will return invalid data. Table 29-46. Program Once Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 101 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 29-30) Set if an invalid phrase index is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 Set if the requested phrase has already been programmed(1) None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation FERSTAT EPVIOLIF None 1. If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will be allowed to execute again on that same phrase. 29.4.2.8 Erase All Blocks Command The Erase All Blocks operation will erase the entire P-Flash and D-Flash memory space including the EEE nonvolatile information register. MC9S12XE-Family Reference Manual , Rev. 1.21 1180 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-47. Erase All Blocks Command FCCOB Requirements CCOBIX[2:0] 000 0x08 FCCOB Parameters Not required Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All Blocks operation has completed. Table 29-48. Erase All Blocks Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 29.4.2.9 Erase P-Flash Block Command Table 29-49. Erase P-Flash Block Command FCCOB Requirements CCOBIX[2:0] 000 001 0x09 FCCOB Parameters Global address [22:16] to identify P-Flash block The Erase P-Flash Block operation will erase all addresses in a P-Flash block. Global address [15:0] in P-Flash block to be erased Upon clearing CCIF to launch the Erase P-Flash Block command, the Memory Controller will erase the selected P-Flash block and verify that it is erased. The CCIF flag will set after the Erase P-Flash Block operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1181 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-50. Erase P-Flash Block Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 29-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid global address [22:16] is supplied Set if an area of the selected P-Flash block is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 29.4.2.10 Erase P-Flash Sector Command The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector. Table 29-51. Erase P-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0A FCCOB Parameters Global address [22:16] to identify P-Flash block to be erased Global address [15:0] anywhere within the sector to be erased. Refer to Section 29.1.2.1 for the P-Flash sector size. Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash Sector operation has completed. Table 29-52. Erase P-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 29-30) Set if an invalid global address [22:16] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned phrase address is supplied (global address [2:0] != 000) Set if the selected P-Flash sector is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None MC9S12XE-Family Reference Manual , Rev. 1.21 1182 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.2.11 Unsecure Flash Command The Unsecure Flash command will erase the entire P-Flash and D-Flash memory space and, if the erase is successful, will release security. Table 29-53. Unsecure Flash Command FCCOB Requirements CCOBIX[2:0] 000 0x0B FCCOB Parameters Not required Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire P-Flash and D-Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash memory space was properly erased, security will be released. If the erase verify is not successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security state. During the execution of this command (CCIF=0) the user must not write to any Flash module register. The CCIF flag is set after the Unsecure Flash operation has completed. Table 29-54. Unsecure Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if any area of the P-Flash memory is protected Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation Set if any area of the buffer RAM EEE partition is protected 29.4.2.12 Verify Backdoor Access Key Command The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the FSEC register (see Table 29-11). The Verify Backdoor Access Key command releases security if usersupplied keys match those stored in the Flash security bytes of the Flash configuration field (see Table 293). The Verify Backdoor Access Key command must not be executed from the Flash block containing the backdoor comparison key to avoid code runaway. Table 29-55. Verify Backdoor Access Key Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 0x0C Key 0 Key 1 Key 2 Key 3 FCCOB Parameters Not required MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1183 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash configuration field with Key 0 compared to 0x7F_FF00, etc. If the backdoor keys match, security will be released. If the backdoor keys do not match, security is not released and all future attempts to execute the Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is set after the Verify Backdoor Access Key operation has completed. Table 29-56. Verify Backdoor Access Key Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 100 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an incorrect backdoor key is supplied Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see Section 29.3.2.2) Set if the backdoor key has mismatched since the last reset FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None 29.4.2.13 Set User Margin Level Command The Set User Margin Level command causes the Memory Controller to set the margin level for future read operations of a specific P-Flash or D-Flash block. Table 29-57. Set User Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0D FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the user margin level for the targeted block and then set the CCIF flag. Valid margin level settings for the Set User Margin Level command are defined in Table 29-58. Table 29-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 Level Description Return to Normal Level User Margin-1 Level(1) MC9S12XE-Family Reference Manual , Rev. 1.21 1184 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-58. Valid Set User Margin Level Settings CCOB (CCOBIX=001) Level Description 0x0002 User Margin-0 Level(2) 1. Read margin to the erased state 2. Read margin to the programmed state Table 29-59. Set User Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 29-30) Set if an invalid global address [22:16] is supplied NOTE User margin levels can be used to check that Flash memory contents have adequate margin for normal level read operations. If unexpected results are encountered when checking Flash memory contents at user margin levels, a potential loss of information has been detected. 29.4.2.14 Set Field Margin Level Command The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set the margin level specified for future read operations of a specific P-Flash or D-Flash block. Table 29-60. Set Field Margin Level Command FCCOB Requirements CCOBIX[2:0] 000 001 0x0E FCCOB Parameters Global address [22:16] to identify the Flash block Margin level setting Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the field margin level for the targeted block and then set the CCIF flag. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1185 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Valid margin level settings for the Set Field Margin Level command are defined in Table 29-61. Table 29-61. Valid Set Field Margin Level Settings CCOB (CCOBIX=001) 0x0000 0x0001 0x0002 0x0003 Level Description Return to Normal Level User Margin-1 Level(1) User Margin-0 Level(2) Field Margin-1 Level1 0x0004 Field Margin-0 Level2 1. Read margin to the erased state 2. Read margin to the programmed state Table 29-62. Set Field Margin Level Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid margin level setting is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if command not available in current mode (see Table 29-30) Set if an invalid global address [22:16] is supplied CAUTION Field margin levels must only be used during verify of the initial factory programming. NOTE Field margin levels can be used to check that Flash memory contents have adequate margin for data retention at the normal level setting. If unexpected results are encountered when checking Flash memory contents at field margin levels, the Flash memory contents should be erased and reprogrammed. 29.4.2.15 Full Partition D-Flash Command The Full Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. MC9S12XE-Family Reference Manual , Rev. 1.21 1186 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-63. Full Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x0F FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Full Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 29-7) * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 29-7) * Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 29-7) * Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 29-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Full Partition D-Flash operation has completed, the CCIF flag will set. Running the Full Partition D-Flash command a second time will result in the previous partition values and the entire D-Flash memory being erased. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1187 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-64. Full Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR Set if command not available in current mode (see Table 29-30) FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if an invalid DFPART or ERPART selection is supplied None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 29.4.2.16 Erase Verify D-Flash Section Command The Erase Verify D-Flash Section command will verify that a section of code in the D-Flash user partition is erased. The Erase Verify D-Flash Section command defines the starting point of the data to be verified and the number of words. Table 29-65. Erase Verify D-Flash Section Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x10 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of the first word to be verified Number of words to be verified Upon clearing CCIF to launch the Erase Verify D-Flash Section command, the Memory Controller will verify the selected section of D-Flash memory is erased. The CCIF flag will set after the Erase Verify DFlash Section operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1188 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-66. Erase Verify D-Flash Section Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) ACCERR FSTAT Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to an area of the D-Flash EEE partition Set if the requested section breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None 29.4.2.17 Program D-Flash Command The Program D-Flash operation programs one to four previously erased words in the D-Flash user partition. The Program D-Flash operation will confirm that the targeted location(s) were successfully programmed upon completion. CAUTION A Flash word must be in the erased state before being programmed. Cumulative programming of bits within a Flash word is not allowed. Table 29-67. Program D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 100 101 0x11 FCCOB Parameters Global address [22:16] to identify the D-Flash block Global address [15:0] of word to be programmed Word 0 program value Word 1 program value, if desired Word 2 program value, if desired Word 3 program value, if desired Upon clearing CCIF to launch the Program D-Flash command, the user-supplied words will be transferred to the Memory Controller and be programmed. The CCOBIX index value at Program D-Flash command launch determines how many words will be programmed in the D-Flash block. No protection checks are made in the Program D-Flash operation on the D-Flash block, only access error checks. The CCIF flag is set when the operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1189 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-68. Program D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] < 010 at command launch Set if CCOBIX[2:0] > 101 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) ACCERR Set if an invalid global address [22:0] is supplied Set if a misaligned word address is supplied (global address [0] != 0) FSTAT Set if the global address [22:0] points to an area in the D-Flash EEE partition Set if the requested group of words breaches the end of the D-Flash block or goes into the D-Flash EEE partition FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 29.4.2.18 Erase D-Flash Sector Command The Erase D-Flash Sector operation will erase all addresses in a sector of the D-Flash user partition. Table 29-69. Erase D-Flash Sector Command FCCOB Requirements CCOBIX[2:0] 000 001 0x12 FCCOB Parameters Global address [22:16] to identify D-Flash block Global address [15:0] anywhere within the sector to be erased. See Section 29.1.2.2 for D-Flash sector size. Upon clearing CCIF to launch the Erase D-Flash Sector command, the Memory Controller will erase the selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase D-Flash Sector operation has completed. MC9S12XE-Family Reference Manual , Rev. 1.21 1190 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-70. Erase D-Flash Sector Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 001 at command launch Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) ACCERR Set if an invalid global address [22:0] is supplied FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF Set if a misaligned word address is supplied (global address [0] != 0) Set if the global address [22:0] points to the D-Flash EEE partition None Set if any errors have been encountered during the verify operation Set if any non-correctable errors have been encountered during the verify operation None 29.4.2.19 Enable EEPROM Emulation Command The Enable EEPROM Emulation command causes the Memory Controller to enable EEE activity. EEE activity is disabled after any reset. Table 29-71. Enable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x13 FCCOB Parameters Not required Upon clearing CCIF to launch the Enable EEPROM Emulation command, the CCIF flag will set after the Memory Controller enables EEE operations using the contents of the EEE tag RAM and tag counter. The Full Partition D-Flash or the Partition D-Flash command must be run prior to launching the Enable EEPROM Emulation command. Table 29-72. Enable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1191 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.2.20 Disable EEPROM Emulation Command The Disable EEPROM Emulation command causes the Memory Controller to suspend current EEE activity. Table 29-73. Disable EEPROM Emulation Command FCCOB Requirements CCOBIX[2:0] 000 0x14 FCCOB Parameters Not required Upon clearing CCIF to launch the Disable EEPROM Emulation command, the Memory Controller will halt EEE operations at the next convenient point without clearing the EEE tag RAM or tag counter before setting the CCIF flag. Table 29-74. Disable EEPROM Emulation Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if Full Partition D-Flash or Partition D-Flash command not previously run 29.4.2.21 EEPROM Emulation Query Command The EEPROM Emulation Query command returns EEE partition and status variables. Table 29-75. EEPROM Emulation Query Command FCCOB Requirements CCOBIX[2:0] 000 001 010 011 0x15 Return DFPART Return ERPART Return ECOUNT(1) Return Ready Sector Count FCCOB Parameters Not required 100 Return Dead Sector Count 1. Indicates sector erase count Upon clearing CCIF to launch the EEPROM Emulation Query command, the CCIF flag will set after the EEE partition and status variables are stored in the FCCOBIX register.If the Emulation Query command is executed prior to partitioning (Partition D-Flash Command Section 29.4.2.15), the following reset values are returned: DFPART = 0x_FFFF, ERPART = 0x_FFFF, ECOUNT = 0x_FFFF, Dead Sector Count = 0x_00, Ready Sector Count = 0x_00. MC9S12XE-Family Reference Manual , Rev. 1.21 1192 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) Table 29-76. EEPROM Emulation Query Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 000 at command launch ACCERR FSTAT FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None None None None Set if a Load Data Field command sequence is currently active Set if command not available in current mode (see Table 29-30) 29.4.2.22 Partition D-Flash Command The Partition D-Flash command allows the user to allocate sectors within the D-Flash block for applications and a partition within the buffer RAM for EEPROM access. The D-Flash block consists of 128 sectors with 256 bytes per sector. The Erase All Blocks command must be run prior to launching the Partition D-Flash command. Table 29-77. Partition D-Flash Command FCCOB Requirements CCOBIX[2:0] 000 001 010 0x20 FCCOB Parameters Not required Number of 256 byte sectors for the D-Flash user partition (DFPART) Number of 256 byte sectors for buffer RAM EEE partition (ERPART) Upon clearing CCIF to launch the Partition D-Flash command, the following actions are taken to define a partition within the D-Flash block for direct access (DFPART) and a partition within the buffer RAM for EEE use (ERPART): * Validate the DFPART and ERPART values provided: -- DFPART <= 128 (maximum number of 256 byte sectors in D-Flash block) -- ERPART <= 16 (maximum number of 256 byte sectors in buffer RAM) -- If ERPART > 0, 128 - DFPART >= 12 (minimum number of 256 byte sectors in the D-Flash block required to support EEE) -- If ERPART > 0, ((128-DFPART)/ERPART) >= 8 (minimum ratio of D-Flash EEE space to buffer RAM EEE space to support EEE) * Erase verify the D-Flash block and the EEE nonvolatile information register * Program DFPART to the EEE nonvolatile information register at global address 0x12_0000 (see Table 29-7) MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1193 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) * * * Program a duplicate DFPART to the EEE nonvolatile information register at global address 0x12_0002 (see Table 29-7) Program ERPART to the EEE nonvolatile information register at global address 0x12_0004 (see Table 29-7) Program a duplicate ERPART to the EEE nonvolatile information register at global address 0x12_0006 (see Table 29-7) The D-Flash user partition will start at global address 0x10_0000. The buffer RAM EEE partition will end at global address 0x13_FFFF. After the Partition D-Flash operation has completed, the CCIF flag will set. Running the Partition D-Flash command a second time will result in the ACCERR bit within the FSTAT register being set. The data value written corresponds to the number of 256 byte sectors allocated for either direct D-Flash access (DFPART) or buffer RAM EEE access (ERPART). Table 29-78. Partition D-Flash Command Error Handling Register Error Bit Error Condition Set if CCOBIX[2:0] != 010 at command launch Set if a Load Data Field command sequence is currently active ACCERR FSTAT Set if an invalid DFPART or ERPART selection is supplied FPVIOL MGSTAT1 MGSTAT0 FERSTAT EPVIOLIF None Set if any errors have been encountered during the read Set if any non-correctable errors have been encountered during the read None Set if command not available in current mode (see Table 29-30) Set if partitions have already been defined MC9S12XE-Family Reference Manual , Rev. 1.21 1194 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) 29.4.3 Interrupts The Flash module can generate an interrupt when a Flash command operation has completed or when a Flash command operation has detected an EEE error or an ECC fault. Table 29-79. Flash Interrupt Sources Interrupt Source Flash Command Complete Flash EEE Erase Error Flash EEE Program Error Flash EEE Protection Violation Flash EEE Error Type 1 Violation Flash EEE Error Type 0 Violation ECC Double Bit Fault on Flash Read ECC Single Bit Fault on Flash Read Interrupt Flag CCIF (FSTAT register) ERSERIF (FERSTAT register) PGMERIF (FERSTAT register) EPVIOLIF (FERSTAT register) ERSVIF1 (FERSTAT register) ERSVIF0 (FERSTAT register) DFDIF (FERSTAT register) SFDIF (FERSTAT register) Local Enable CCIE (FCNFG register) ERSERIE (FERCNFG register) PGMERIE (FERCNFG register) EPVIOLIE (FERCNFG register) ERSVIE1 (FERCNFG register) ERSVIE0 (FERCNFG register) DFDIE (FERCNFG register) SFDIE (FERCNFG register) Global (CCR) Mask I Bit I Bit I Bit I Bit I Bit I Bit I Bit I Bit NOTE Vector addresses and their relative interrupt priority are determined at the MCU level. 29.4.3.1 Description of Flash Interrupt Operation The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the Flash command interrupt request. The Flash module uses the ERSEIF, PGMEIF, EPVIOLIF, ERSVIF1, ERSVIF0, DFDIF and SFDIF flags in combination with the ERSEIE, PGMEIE, EPVIOLIE, ERSVIE1, ERSVIE0, DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed description of the register bits involved, refer to Section 29.3.2.5, "Flash Configuration Register (FCNFG)", Section 29.3.2.6, "Flash Error Configuration Register (FERCNFG)", Section 29.3.2.7, "Flash Status Register (FSTAT)", and Section 29.3.2.8, "Flash Error Status Register (FERSTAT)". The logic used for generating the Flash module interrupts is shown in Figure 29-27. MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1195 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) CCIE CCIF ERSERIE ERSERIF PGMERIE PGMERIF EPVIOLIE EPVIOLIF ERSVIE1 ERSVIF1 ERSVIE0 ERSVIF0 DFDIE DFDIF SFDIE SFDIF Flash Command Interrupt Request Flash Error Interrupt Request Figure 29-27. Flash Module Interrupts Implementation 29.4.4 Wait Mode The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU from wait via the CCIF interrupt (see Section 29.4.3, "Interrupts"). 29.4.5 Stop Mode If a Flash command is active (CCIF = 0) or an EE-Emulation operation is pending when the MCU requests stop mode, the current Flash operation will be completed before the CPU is allowed to enter stop mode. 29.5 Security The Flash module provides security information to the MCU. The Flash security state is defined by the SEC bits of the FSEC register (see Table 29-12). During reset, the Flash module initializes the FSEC register using data read from the security byte of the Flash configuration field at global address 0x7F_FF0F. MC9S12XE-Family Reference Manual , Rev. 1.21 1196 Freescale Semiconductor Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) The security state out of reset can be permanently changed by programming the security byte of the Flash configuration field. This assumes that you are starting from a mode where the necessary P-Flash erase and program commands are available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully programmed, its new value will take affect after the next MCU reset. The following subsections describe these security-related subjects: * Unsecuring the MCU using Backdoor Key Access * Unsecuring the MCU in Special Single Chip Mode using BDM * Mode and Security Effects on Flash Command Availability 29.5.1 Unsecuring the MCU using Backdoor Key Access The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the contents of the backdoor keys (four 16-bit words programmed at addresses 0x7F_FF00-0x7F_FF07). If the KEYEN[1:0] bits are in the enabled state (see Section 29.3.2.2), the Verify Backdoor Access Key command (see Section 29.4.2.12) allows the user to present four prospective keys for comparison to the keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC register (see Table 29-12) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash block 0 will not be available for read access and will return invalid data. The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an external stimulus. This external stimulus would typically be through one of the on-chip serial ports. If the KEYEN[1:0] bits are in the enabled state (see Section 29.3.2.2), the MCU can be unsecured by the backdoor key access sequence described below: 1. Follow the command sequence for the Verify Backdoor Access Key command as explained in Section 29.4.2.12 2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10 The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method to re-enable the Verify Backdoor Access Key command. After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the contents of the backdoor keys by programming addresses 0x7F_FF00-0x7F_FF07 in the Flash configuration field. The security as defined in the Flash security byte (0x7F_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor keys stored in addresses 0x7F_FF00-0x7F_FF07 are unaffected by the Verify Backdoor Access Key command sequence. After the next reset of the MCU, the security state of the Flash module is determined by the Flash security byte MC9S12XE-Family Reference Manual , Rev. 1.21 Freescale Semiconductor 1197 Chapter 29 1024 KByte Flash Module (S12XFTM1024K5V2) (0x7F_FF0F). The Verify Backdoor Access Key command sequence has no effect on the program and erase protections defined in the Flash protection register, FPROT. 29.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM The MCU can be unsecured in special single chip mode by erasing the P-Flash and D-Flash memory by one of the following methods: * Reset the MCU into special single chip mode, delay while the erase test is performed by the BDM, send BDM commands to disable protection in the P-Flash and D-Flash memory, and execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. * Reset the MCU into special expanded wide mode, disable protection in the P-Flash and D-Flash memory and run code from external memory to execute the Erase All Blocks command write sequence to erase the P-Flash and D-Flash memory. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the MCU into special single chip mode. The BDM will execute the Erase Verify All Blocks command write sequence to verify that the P-Flash and D-Flash memory is erased. If the P-Flash and D-Flash memory are verified as erased the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte may be programmed to the unsecure state by the following method: * Send BDM commands to execute a `Program P-Flash' command sequence to program the Flash security byte to the unsecured state and reset the MCU. 29.5.3 Mode and Security Effects on Flash Command Availability The availability of Flash module commands depends on the MCU operating mode and security state as shown in Table 29-30. 29.6 Initialization On each system reset the Flash module executes a reset sequence which establishes initial values for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the FOPT and FSEC registers. The Flash module reverts to built-in default values that leave the module in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set. The ACCERR bit in the FSTAT register is set if errors are encountered while initializing the EEE buffer ram during the reset sequence. CCIF remains clear throughout the reset sequence. The Flash module holds off all CPU access for the initial portion of the reset sequence. While Flash reads are possible when the hold is removed, writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers are ignored to prevent command activity while the Memory Controller remains busy. Completion of the reset sequence is marked by setting CCIF high which enables writes to the FCCOBIX, FCCOBHI, and FCCOBLO registers to launch any available Flash command. If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The state of the word being programmed or the sector/block being erased is not guaranteed. MC9S12XE-Family Reference Manual , Rev. 1.21 1198 Freescale Semiconductor Appendix A Electrical Characteristics Appendix A Electrical Characteristics A.1 General NOTE The electrical characteristics given in this section should be used as a guide only. Values cannot be guaranteed by Freescale and are subject to change without notice. This supplement contains the most accurate electrical information for the MC9S12XE-Family microcontroller available at the time of publication. This introduction is intended to give an overview on several common topics like power supply, current injection etc. A.1.1 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding the following classification is used and the parameters are tagged accordingly in the tables where appropriate. NOTE This classification is shown in the column labeled "C" in the parameter tables where appropriate. P: C: T: Those parameters are guaranteed during production testing on each individual device. Those parameters are achieved by the design characterization by measuring a statistically relevant sample size across process variations. Those parameters are achieved by design characterization on a small sample size from typical devices under typical conditions unless otherwise noted. All values shown in the typical column are within this category. Those parameters are derived mainly from simulations. D: A.1.2 Power Supply The MC9S12XE-Family utilizes several pins to supply power to the I/O ports, A/D converter, oscillator, and PLL as well as the digital core. The VDDA, VSSA pin pairs supply the A/D converter and parts of the internal voltage regulator. The VDDX, VSSX pin pairs [7:1] supply the I/O pins. VDDR supplies the internal voltage regulator. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1199 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics NOTE Connecting VDDR to VSS disables the internal voltage regulator. The VDDF, VSS1 pin pair supplies the internal NVM logic. The VDD, VSS2 are the supply pins for the internal digital logic. VDDPLL, VSSPLL pin pair supply the oscillator and the PLL. VSS1, VSS2 and VSS3 are internally connected by metal. VDDA1, and VDDA2 are internally connected by metal. All VDDX pins are internally connected by metal. All VSSX pins are internally connected by metal. VDDA is connected to all VDDX pins by diodes for ESD protection such that VDDX must not exceed VDDA by more than a diode voltage drop. VDDA can exceed VDDX by more than a diode drop in order to support applications with a 5V A/D converter range and 3.3V I/O pin range. VSSA and VSSX are connected by anti-parallel diodes for ESD protection. NOTE In the following context VDD35 is used for either VDDA, VDDR, and VDDX; VSS35 is used for either VSSA and VSSX unless otherwise noted. IDD35 denotes the sum of the currents flowing into the VDDA and VDDR pins. The Run mode current in the VDDX domain is external load dependent. VDD is used for VDD, VSS is used for VSS1, VSS2 and VSS3. VDDPLL is used for VDDPLL, VSSPLL is used for VSSPLL IDD is used for the sum of the currents flowing into VDD, VDDF and VDDPLL. A.1.3 Pins There are four groups of functional pins. A.1.3.1 I/O Pins Standard I/O pins have a level in the range of 3.13V to 5.5 V. This class of pins is comprised of all port I/O pins (including PortAD), BKGD and the RESET pins.The internal structure of all those pins is identical; however, some of the functionality may be disabled. For example the BKGD pin pull up is always enabled. A.1.3.2 Analog Reference This group is made up by the VRH and VRL pins. MC9S12XE-Family Reference Manual , Rev. 1.21 1200 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.1.3.3 Oscillator The pins EXTAL, XTAL dedicated to the oscillator have a nominal 1.8 V level. They are supplied by VDDPLL. A.1.3.4 TEST This pin is used for production testing only. A.1.4 Current Injection Power supply must maintain regulation within operating VDD35 or VDD range during instantaneous and operating maximum current conditions. If positive injection current (Vin > VDD35) is greater than IDD35, the injection current may flow out of VDD35 and could result in external power supply going out of regulation. Ensure external VDD35 load will shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not consuming power; e.g., if no system clock is present, or if clock rate is very low which would reduce overall power consumption. A.1.5 Absolute Maximum Ratings Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the device. This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1201 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either VSS35 or VDD35). Table A-1. Absolute Maximum Ratings(1) Num 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Rating I/O, regulator and analog supply voltage Digital logic supply voltage(2) PLL supply voltage2 NVM supply voltage 2 Symbol VDD35 VDD VDDPLL VDDF VDDX VSSX VIN VRH, VRL VILV VTEST I I I D Min -0.3 -0.3 -0.3 -0.3 -6.0 -0.3 -0.3 -0.3 -0.3 -0.3 -25 -25 -0.25 -100 Max 6.0 2.16 2.16 3.6 0.3 0.3 6.0 6.0 2.16 10.0 +25 +25 0 +100 Unit V V V V V V V V V V mA mA mA mA Voltage difference VDDX to VDDA Voltage difference VSSX to VSSA Digital I/O input voltage Analog reference EXTAL, XTAL TEST input Instantaneous maximum current Single pin limit for all digital I/O pins(3) Instantaneous maximum current Single pin limit for EXTAL, XTAL(4) Instantaneous maximum current Single pin limit for TEST (5) Maximum current Single pin limit for power supply pins DL DT I DV 15 Storage temperature range Tstg -65 155 C 1. Beyond absolute maximum ratings device might be damaged. 2. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute maximum ratings apply when the device is powered from an external source. 3. All digital I/O pins are internally clamped to VSSX and VDDX, or VSSA and VDDA. 4. Those pins are internally clamped to VSSPLL and VDDPLL. 5. This pin is clamped low to VSSPLL, but not clamped high. This pin must be tied low in applications. A.1.6 ESD Protection and Latch-up Immunity All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade integrated circuits. During the device qualification ESD stresses were performed for the Human Body Model (HBM) and the Charge Device Model. A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification. Complete DC parametric and functional testing is performed per the applicable device MC9S12XE-Family Reference Manual , Rev. 1.21 1202 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. Table A-2. ESD and Latch-up Test Conditions Model Human Body Series resistance Storage capacitance Number of pulse per pin Positive Negative Charged Device Number of pulse per pin Positive Negative Latch-up Minimum input voltage limit Maximum input voltage limit Description Symbol R1 C -- -- -- -- Value 1500 100 1 1 3 3 -2.5 7.5 V V Unit Ohm pF Table A-3. ESD and Latch-Up Protection Characteristics Num 1 2 3 C C C C Rating Human Body Model (HBM) Charge Device Model (CDM) corner pins Charge Device Model (CDM) edge pins Latch-up current at TA = 125C Positive Negative Latch-up current at TA = 27C Positive Negative Symbol VHBM VCDM ILAT +100 -100 ILAT +200 -200 -- -- -- -- mA Min 2000 750 500 Max -- -- -- Unit V V mA 4 C MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1203 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.1.7 Operating Conditions This section describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following data. NOTE Please refer to the temperature rating of the device (C, V, M) with regards to the ambient temperature TA and the junction temperature TJ. For power dissipation calculations refer to Section A.1.8, "Power Dissipation and Thermal Characteristics". Table A-4. Operating Conditions Rating I/O, regulator and analog supply voltage NVM logic supply voltage(1) Voltage difference VDDX to VDDA Voltage difference VDDR to VDDX Voltage difference VSSX to VSSA Voltage difference VSS1 , VSS2 , VSS3 , VSSPLL to VSSX Digital logic supply voltage1 PLL supply voltage Oscillator (Loop Controlled Pierce) (Full Swing Pierce) Bus frequency(3) C Operating junction temperature range Operating ambient temperature range(4) V Operating junction temperature range Operating ambient temperature range2 M Operating junction temperature range Operating ambient temperature range2 (2) Symbol VDD35 VDDF VDDX VDDR VSSX VSS VDD VDDPLL fosc fbus TJ TA TJ TA Min 3.13 2.7 Typ 5 2.8 Max 5.5 2.9 Unit V V refer to Table A-15 -0.1 0 0.1 V refer to Table A-15 -0.1 1.72 1.72 4 2 0.5 -40 -40 -40 -40 0 1.8 1.8 -- -- -- -- 27 -- 27 0.1 1.98 1.98 16 40 50 110 85 C 130 105 V V V MHz MHz C C TJ -40 -- 150 TA -40 27 125 1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. . 2. This refers to the oscillator base frequency. Typical crystal & resonator tolerances are supported. 3. Please refer to Table A-25 for maximum bus frequency limits with frequency modulation enabled 4. Please refer to Section A.1.8, "Power Dissipation and Thermal Characteristics" for more details about the relation between ambient temperature TA and device junction temperature TJ. NOTE Using the internal voltage regulator, operation is guaranteed in a power down until a low voltage reset assertion. MC9S12XE-Family Reference Manual , Rev. 1.21 1204 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.1.8 Power Dissipation and Thermal Characteristics Power dissipation and thermal characteristics are closely related. The user must assure that the maximum operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in C can be obtained from: T T T J A D = Junction Temperature, [C ] = Ambient Temperature, [C ] = Total Chip Power Dissipation, [W] = Package Thermal Resistance, [C/W] J = T + (P * ) A D JA P JA The total power dissipation can be calculated from: P P D =P INT +P IO INT = Chip Internal Power Dissipation, [W] P IO = RDSON IIOi2 i PIO is the sum of all output currents on I/O ports associated with VDDX, whereby R V OL = ----------- ;for outputs driven low DSON I OL R V -V DD35 OH = --------------------------------------- ;for outputs driven high DSON I OH Two cases with internal voltage regulator enabled and disabled must be considered: 1. Internal voltage regulator disabled P INT =I DD V DD +I DDPLL V DDPLL +I DDA V DDA 2. Internal voltage regulator enabled P INT =I DDR V DDR +I DDA V DDA MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1205 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-5. Thermal Package Characteristics (9S12XEP100)(1) Num C Rating 208MAPBGA 1 2 3 4 5 D D D D D Thermal resistance 208MAPBGA, single sided PCB2 Thermal resistance208MAPBGA, double sided PCB with 2 internal planes3 Junction to Board 208MAPBGA(2) Junction to Case 208MAPBGA4 Junction to Package Top 208MAPBGA5 LQFP144 6 7 8 9 10 D D D D D Thermal resistance LQFP144, single sided PCB3 Thermal resistance LQFP144, double sided PCB with 2 internal planes3 Junction to Board LQFP 144 Junction to Case LQFP 1444 Junction to Package Top LQFP144 5 Symbol Min Typ Max Unit JA JA JB JC JT JA JA JB JC JT -- -- -- -- -- -- -- -- -- -- 53 31 20 9 2 C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W -- -- -- -- -- -- -- -- -- -- 41 32 22 7.4 3 LQFP112 11 12 13 14 15 D D D D D Thermal resistance LQFP112, single sided PCB(3) Thermal resistance LQFP112, double sided PCB with 2 internal planes(4) Junction to Board LQFP112 Junction to Case LQFP112 4 5 JA JA JB JC JT -- -- -- -- -- -- -- -- -- -- 43 32 22 7 3 Junction to Package Top LQFP112 QFP80 16 17 18 19 D D D D Thermal resistance QFP 80, single sided PCB3 Thermal resistance QFP 80, double sided PCB with 2 internal planes3 Junction to Board QFP 80 Junction to Case QFP 80 (5) JA JA JB JC -- -- -- -- -- -- -- -- 45 33 19 11 -- -- 3 C/W 20 D Junction to Package Top QFP 80(6) JT 1. The values for thermal resistance are achieved by package simulations for the 9S12XEP100 die. 2. Measured per JEDEC JESD51-8. Measured on top surface of the board near the package. 3. Junction to ambient thermal resistance, JA was simulated to be equivalent to the JEDEC specification JESD51-2 in a horizontal configuration in natural convection. 4. Junction to ambient thermal resistance, JA was simulated to be equivalent to the JEDEC specification JESD51-7 in a horizontal configuration in natural convection. 5. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the "case" temperature. This basic cold plate measurement technique is described by MILSTD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. 6. Thermal characterization parameter JT is the "resistance" from junction to reference point thermocouple on top center of the case as defined in JESD51-2. JT is a useful value to use to estimate junction temperature in a steady state customer enviroment. MC9S12XE-Family Reference Manual , Rev. 1.21 1206 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-6. Thermal Package Characteristics (9S12XEQ512)(1) Num C Rating LQFP144 1a 1b 2a 2b 3 4 5 D D D D D D D Thermal resistance single sided PCB, natural convection Thermal resistance single sided PCB @ 200 ft/min Thermal resistance double sided PCB with 2 internal planes, natural convection Thermal resistance double sided PCB with 2 internal planes @ 200 ft/min Junction to Board LQFP 144 Junction to Case LQFP 1442. Junction to Package Top LQFP144 3 Symbol Min Typ Max Unit JA JA JA JA JB JC JT -- -- -- -- -- -- -- -- -- -- -- -- -- -- 49 40 40 34 28 9 2 C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W C/W LQFP112 6a 6b 7a 7b 8 9 10 D D D D D D D Thermal resistance single sided PCB, natural convection Thermal resistance single sided PCB @ 200 ft/min Thermal resistance double sided PCB with 2 internal planes, natural convection Thermal resistance double sided PCB with 2 internal planes @ 200 ft/min Junction to Board LQFP112 Junction to Case LQFP112 2. JA JA JA JA JB JC JT -- -- -- -- -- -- -- -- -- -- -- -- -- -- 50 40 40 34 28 9 2 Junction to Package Top LQFP1123 QFP80 11a 11b 12a 12b 13 14 D D D D D D Thermal resistance single sided PCB, natural convection Thermal resistance single sided PCB @ 200 ft/min Thermal resistance double sided PCB with 2 internal planes, natural convection Thermal resistance double sided PCB with 2 internal planes @ 200 ft/min Junction to Board QFP 80 Junction to Case QFP 80(2) (3) JA JA JA JA JB JC -- -- -- -- -- -- -- -- -- -- -- -- 50 40 37 31 23 13 -- -- 3 C/W 15 D Junction to Package Top QFP 80 JT 1. The values for thermal resistance are achieved by package simulations for the 9S12XEQ512 die. 2. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the "case" temperature. This basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. 3. Thermal characterization parameter JT is the "resistance" from junction to reference point thermocouple on top center of the case as defined in JESD51-2. JT is a useful value to use to estimate junction temperature in a steady state customer enviroment. A.1.9 I/O Characteristics MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1207 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST and supply pins. s Table A-7. 3.3-V I/O Characteristics Conditions are 3.13 V < VDD35 < 3.6 V temperature from -40C to +150C, unless otherwise noted I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins. Num C 1 P Input high voltage T Input high voltage 2 P Input low voltage T Input low voltage 3 4a T Input hysteresis P Input leakage current (pins in high impedance input mode)(1) Vin = VDD35 or VSS35 M Temperature range -40C to 150C V Temperature range -40C to 130C C Temperature range -40C to 110C C Input leakage current (pins in high impedance input mode) Vin = VDD35 or VSS35 -40C 27C 70C 85C 100C 105C 110C 120C 125C 130C 150C C Output high voltage (pins in output mode) Partial drive IOH = -0.75 mA P Output high voltage (pins in output mode) Full drive IOH = -4 mA C Output low voltage (pins in output mode) Partial Drive IOL = +0.9 mA P Output low voltage (pins in output mode) Full Drive IOL = +4.75 mA P Internal pull up resistance VIH min > input voltage > VIL max P Internal pull down resistance VIH min > input voltage > VIL max D Input capacitance T Injection current Single pin limit Total device limit, sum of all injected currents D Port H, J, P interrupt input pulse filtered (STOP)(3) (2) Rating Symbol VIH VIH VIL VIL VHYS I in Min 0.65*VDD35 -- -- -- -- -- Typ -- Max V Unit VDD35 + 0.3 V 0.35*VDD35 V -- -- V mV VSS35 - 0.3 -- -- 250 -1 -0.75 -0.5 I in -- -- -- -- -- 1 1 8 14 26 32 40 60 74 92 240 1 0.75 0.5 -- A 4b -- nA 5 6 7 8 9 10 11 12 V OH VDD35 - 0.4 -- VDD35 - 0.4 -- -- -- 25 25 -- -2.5 -25 -- -- -- -- -- -- 6 -- -- -- 0.4 0.4 50 50 -- 2.5 25 3 V V V V K K pF mA VOH VOL V OL RPUL RPDH Cin IICS IICP tPULSE 13 s MC9S12XE-Family Reference Manual , Rev. 1.21 1208 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-7. 3.3-V I/O Characteristics Conditions are 3.13 V < VDD35 < 3.6 V temperature from -40C to +150C, unless otherwise noted I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins. 14 15 16 17 D Port H, J, P interrupt input pulse passed(STOP)3 D Port H, J, P interrupt input pulse filtered (STOP) D Port H, J, P interrupt input pulse passed(STOP) D IRQ pulse width, edge-sensitive mode (STOP) tPULSE tPULSE tPULSE PWIRQ 10 -- 4 1 4 -- -- -- -- -- -- 3 -- -- -- s tcyc tcyc tcyc tosc PWXIRQ 18 D XIRQ pulse width with X-bit set (STOP) 1. Maximum leakage current occurs at maximum operating temperature. 2. Refer to Section A.1.4, "Current Injection" for more details 3. Parameter only applies in stop or pseudo stop mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1209 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-8. 5V I/O Characteristics Conditions are 4.5 V < VDD35 < 5.5 V temperature from -40C to +150C, unless otherwise noted I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins. Num 1 C Rating P Input high voltage T Input high voltage 2 P Input low voltage T Input low voltage 3 4a T Input hysteresis P Input leakage current (pins in high impedance input mode)(1) Vin = VDD35 or VSS35 M Temperature range -40C to 150C V Temperature range -40C to 130C C Temperature range -40C to 110C C Input leakage current (pins in high impedance input mode) Vin = VDD35 or VSS35 -40C 27C 70C 85C 100C 105C 110C 120C 125C 130C 150C C Output high voltage (pins in output mode) Partial drive IOH = -2 mA P Output high voltage (pins in output mode) Full drive IOH = -10 mA C Output low voltage (pins in output mode) Partial drive IOL = +2 mA P Output low voltage (pins in output mode) Full drive IOL = +10 mA P Internal pull up resistance VIH min > input voltage > VIL max P Internal pull down resistance VIH min > input voltage > VIL max D Input capacitance T Injection current Single pin limit Total device Limit, sum of all injected currents P Port H, J, P interrupt input pulse filtered(STOP)(3) P Port H, J, P interrupt input pulse passed(STOP) 3 (2) Symbol VIH VIH VIL VIL VHYS I in Min Typ Max -- Unit V 0.65*VDD35 -- -- -- -- -- VDD35 + 0.3 V 0.35*VDD35 V -- -- V mV VSS35 - 0.3 -- -- 250 -1 -0.75 -0.5 I in -- -- -- -- -- 1 1 8 14 26 32 40 60 74 92 240 1 0.75 0.5 -- A 4b -- nA 5 6 7 8 9 10 11 12 V OH VDD35 - 0.8 -- VDD35 - 0.8 -- -- -- 25 25 -- -2.5 -25 -- 10 -- -- -- -- -- -- -- -- 6 -- -- -- 0.8 0.8 50 50 -- 2.5 25 3 -- 3 V V V V K K pF mA VOH VOL V OL RPUL RPDH Cin IICS IICP tPULSE tPULSE tPULSE 13 14 15 s s tcyc D Port H, J, P interrupt input pulse filtered (STOP) MC9S12XE-Family Reference Manual , Rev. 1.21 1210 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-8. 5V I/O Characteristics Conditions are 4.5 V < VDD35 < 5.5 V temperature from -40C to +150C, unless otherwise noted I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins. 16 17 D Port H, J, P interrupt input pulse passed (STOP) D IRQ pulse width, edge-sensitive mode (STOP) tPULSE PWIRQ 4 1 4 -- -- -- -- -- -- tcyc tcyc tosc PWXIRQ 18 D XIRQ pulse width with X-bit set (STOP) 1. Maximum leakage current occurs at maximum operating temperature. 2. Refer to Section A.1.4, "Current Injection" for more details 3. Parameter only applies in stop or pseudo stop mode. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1211 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-9. Characteristics of Expantion Bus Inputs Port C, D, PE5, PE6, and PE7 for Reduced Input Voltage Thresholds Conditions are 4.5 V < VDD35 < 5.5 V Temperature from -40C to +150C, unless otherwise noted Num C 1 2 3 D Input high voltage D Input low voltage T Input hysteresis Rating Symbol VIH VIL VHYS Min 1.75 -- -- Typ -- -- 100 Max -- 0.75 -- Unit V V mV A.1.10 Supply Currents This section describes the current consumption characteristics of the device family as well as the conditions for the measurements. A.1.10.1 Typical Run Current Measurement Conditions Since the current consumption of the output drivers is load dependent, all measurements are without output loads and with minimum I/O activity. The currents are measured in single chip mode, S12XCPU code is executed from Flash and XGATE code is executed from RAM. VDD35=5V, internal voltage regulator is enabled and the bus frequency is 50MHz using a 4-MHz oscillator in loop controlled Pierce mode. Furthermore in expanded modes the currents flowing in the system are highly dependent on the load at the address, data, and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be given. A very good estimate is to take the single chip currents and add the currents due to the external loads. Since the DBG and BDM modules are typically not used in the end application, the supply current values for these modules is not specified. An overhead of current consumption exisits independent of the listed modules, due to voltage regulation and clock logic that is not dedicated to a specific module. This is listed in the table row named "overhead". A.1.10.2 Maximum Run Current Measurement Conditions Currents are measured in single chip mode, S12XCPU and XGATE code is executed from RAM with VDD35=5.5V, internal voltage regulator enabled and a 50MHz bus frequency from a 4-MHz input. Characterized parameters are derived using a 4MHz loop controlled Pierce oscillator. Production test parameters are tested with a 4MHz square wave oscillator. A.1.10.3 Current Conditions Unbonded ports must be correctly initialized to prevent current consumption due to floating inputs. Typical Stop current is measured with VDD35=5V, maximum Stop current is measured with VDD35=5.5V. Pseudo Stop currents are measured with the oscillator configured for 4MHz LCP mode. Table A-10. shows the configuration of the peripherals for typical run current. MC9S12XE-Family Reference Manual , Rev. 1.21 1212 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-10. Module Configurations for Typical Run Supply Current VDD35=5V Peripheral S12XCPU XGATE MSCAN SPI SCI IIC PWM ECT ATD PIT RTI Overhead Configuration 420 cycle loop: 384 DBNE cycles plus subroutine entry to stimulate stacking (RAM access) XGATE fetches code from RAM, XGATE runs in an infinite loop, reading the Status and Flag registers of CAN's, SPI's, SCI's in sequence and doing some bit manipulation on the data Configured to loop-back mode using a bit rate of 500kbit/s Configured to master mode, continuously transmit data (0x55 or 0xAA) at 2Mbit/s Configured into loop mode, continuously transmit data (0x55) at speed of 19200 baud Operate in master mode and continuously transmit data (0x55 or 0xAA) at 100Kbit/s Configured to toggle its pins at the rate of 1kHz The peripheral shall be configured in output compare mode. Pulse accumulator and modulus counter enabled. The peripheral is configured to operate at its maximum specified frequency and to continuously convert voltages on all input channels in sequence. PIT is enabled, Micro-timer register 0 and 1 loaded with $0F and timer registers 0 to 3 are loaded with $03/07/0F/1F. Enabled with RTI Control Register (RTICTL) set to $59 VREG supplying 1.8V from a 5V input voltage, core clock tree active, PLL on Table A-11. Module Configurations for Maximum Run Supply Current VDD35=5.5V Peripheral S12XCPU XGATE MSCAN SPI SCI IIC PWM ECT ATD Overhead Configuration 420 cycle loop: 384 DBNE cycles plus subroutine entry to stimulate stacking (RAM access) XGATE fetches code from RAM, XGATE runs in an infinite loop, reading the Status and Flag registers of CAN's, SPI's, SCI's in sequence and doing some bit manipulation on the data Configured to loop-back mode using a bit rate of 1Mbit/s Configured to master mode, continuously transmit data (0x55 or 0xAA) at 4Mbit/s Configured into loop mode, continuously transmit data (0x55) at speed of 57600 baud Operate in master mode and continuously transmit data (0x55 or 0xAA) at 100Kbit/s Configured to toggle its pins at the rate of 40kHz The peripheral shall be configured in output compare mode. Pulse accumulator and modulus counter enabled. The peripheral is configured to operate at its maximum specified frequency and to continuously convert voltages on all input channels in sequence. VREG supplying 1.8V from a 5V input voltage, PLL on MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1213 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-12. Module Run Supply Currents Conditions are shown in Table A-10 at ambient temperature unless otherwise noted Num 1 2 3 4 5 6 7 8 9 10 11 12 C T T T T T T T T T T T T Rating S12XCPU XGATE Each MSCAN Each SPI Each SCI Each IIC PWM ECT Each ATD PIT RTI Overhead Min -- -- -- -- -- -- -- -- -- -- -- -- Typ 12.76 24.20 1.05 0.22 0.28 0.40 0.55 1.16 0.82 0.61 0.17 35.56 Max -- -- -- -- -- -- -- -- -- -- -- -- Unit mA MC9S12XE-Family Reference Manual , Rev. 1.21 1214 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-13. Run and Wait Current Characteristics Conditions are shown in Table A-4 unless otherwise noted Num C Rating Peripheral Set1 fosc=4MHz, fbus=50MHz Peripheral Set(1) All devices except 512K, 384K options fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Peripheral Set1 Devices S12XEQ512, S12XEx384 fosc=4MHz, fbus=50MHz Peripheral Set fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Peripheral Set(3) fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Peripheral Set(4) fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Peripheral Set(5) fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Peripheral Set(6) fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=20MHz fosc=4MHz, fbus=8MHz Wait supply current 8 9 T T C Peripheral Set ,PLL on XGATE executing code from RAM Peripheral Set2 fosc=4MHz, fbus=50MHz fosc=4MHz, fbus=8MHz 1 (2) Symbol Min Typ Max Unit Run supply current (No external load, Peripheral Configuration see Table A-11.) 1 P IDD35 -- -- 100 mA Run supply current (No external load, Peripheral Configuration see Table A-10.) 2 C T T 2a T 3 T T T 4 T T T 5 T T T 6 T T T 7 T T T IDD35 -- -- -- 84 43 24 -- -- -- mA -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- IDDW -- 72 63 35 21 62 34 21 60 33 20 59 33 20 57 33 20 -- -- -- -- -- mA mA mA -- -- -- mA -- -- -- mA -- -- -- mA -- -- -- 85 mA -- -- 50 12 -- -- 10 10 P All modules disabled, RTI enabled, PLL off -- -- 1. The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI7/CAN0-CAN4/XGATE 2. The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI7/CAN0-CAN4 3. The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2/SCI0-SCI7 4. The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM/SPI0-SPI2 5. The following peripherals are on: ATD0/ATD1/ECT/IIC1/PWM 6. The following peripherals are on: ATD0/ATD1/ECT/IIC1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1215 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-14. Pseudo Stop and Full Stop Current Conditions are shown in Table A-4, junction temperature, unless otherwise noted Num C Rating Symbol Min Typ Max Unit A Pseudo stop current (API, RTI, and COP disabled) PLL off, LCP mode 10 C P C C C P P P C C C C C C C P C C C P C P P T T T T T T T T -40C 27C 70C 85C 105C 110C 130C 150C 27C 70C 85C 105C 125C 150C Stop Current 12 -40C 27C 70C 85C 105C 110C 125C 130C 150C -40C 27C 85C 110C 130C 27C 85C 125C IDDS -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 20 30 100 150 300 350 550 650 1400 32 42 162 362 662 300 420 820 -- 100 -- -- -- 2000 -- 3500 7500 -- -- -- -- -- -- -- -- A IDDPS -- -- -- -- -- -- -- -- -- -- -- -- -- -- 175 185 255 305 455 505 805 1555 205 275 325 475 810 1575 -- 255 -- -- -- 2155 3655 7655 -- -- -- -- -- -- Pseudo stop current (API, RTI, and COP enabled) PLL off, LCP mode 11 IDDPS A Stop Current (API active) 13 IDDS A Stop Current (one ATD active) 14 IDDS A MC9S12XE-Family Reference Manual , Rev. 1.21 1216 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.2 ATD Characteristics This section describes the characteristics of the analog-to-digital converter. A.2.1 ATD Operating Characteristics The Table A-15 and Table A-16 show conditions under which the ATD operates. The following constraints exist to obtain full-scale, full range results: VSSA VRL VIN VRH VDDA. This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that it ties to. If the input level goes outside of this range it will effectively be clipped. Table A-15. ATD Operating Characteristics Conditions are shown in Table A-4 unless otherwise noted, supply voltage 3.13V < VDDA < 5.5 V Num C 1 D Reference potential Low High D Voltage difference VDDX to VDDA D Voltage difference VSSX to VSSA C Differential reference voltage(1) C ATD Clock Frequency (derived from bus clock via the prescaler) P ATD Clock Frequency in Stop mode (internal generated temperature and voltage dependent clock, ICLK) D ADC conversion in stop, recovery time(2) ATD Conversion Period(3) 12 bit resolution: D 10 bit resolution: 8 bit resolution: tATDSTPRC V Rating Symbol VRL VRH VDDX VSSX VRH-VRL fATDCLk Min VSSA VDDA/2 -2.35 -0.1 3.13 0.25 0.6 -- Typ -- -- 0 0 5.0 -- 1 -- Max VDDA/2 VDDA 0.1 0.1 5.5 8.3 1.7 1.5 Unit V V V V V MHz MHz us 2 3 4 5 6 7 8 NCONV12 NCONV10 NCONV8 20 19 17 -- -- -- 42 41 39 ATD clock Cycles 1. Full accuracy is not guaranteed when differential voltage is less than 4.50 V 2. When converting in Stop Mode (ICLKSTP=1) an ATD Stop Recovery time tATDSTPRCV is required to switch back to bus clock based ATDCLK when leaving Stop Mode. Do not access ATD registers during this time. 3. The minimum time assumes a sample time of 4 ATD clock cycles. The maximum time assumes a sample time of 24 ATD clock cycles and the discharge feature (SMP_DIS) enabled, which adds 2 ATD clock cycles. A.2.2 Factors Influencing Accuracy Source resistance, source capacitance and current injection have an influence on the accuracy of the ATD. A further factor is that PortAD pins that are configured as output drivers switching. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1217 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.2.2.1 Port AD Output Drivers Switching PortAD output drivers switching can adversely affect the ATD accuracy whilst converting the analog voltage on other PortAD pins because the output drivers are supplied from the VDDA/VSSA ATD supply pins. Although internal design measures are implemented to minimize the affect of output driver noise, it is recommended to configure PortAD pins as outputs only for low frequency, low load outputs. The impact on ATD accuracy is load dependent and not specified. The values specified are valid under condition that no PortAD output drivers switch during conversion. A.2.2.2 Source Resistance Due to the input pin leakage current as specified in Table A-8 in conjunction with the source resistance there will be a voltage drop from the signal source to the ATD input. The maximum source resistance RS specifies results in an error (10-bit resolution) of less than 1/2 LSB (2.5 mV) at the maximum leakage current. If device or operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source resistance of up to 10Kohm are allowed. A.2.2.3 Source Capacitance When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input voltage 1LSB (10-bit resolution), then the external filter capacitor, Cf 1024 * (CINS-CINN). A.2.2.4 Current Injection There are two cases to consider. 1. A current is injected into the channel being converted. The channel being stressed has conversion values of $3FF (in 10-bit mode) for analog inputs greater than VRH and $000 for values less than VRL unless the current is higher than specified as disruptive condition. 2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy of the conversion depending on the source resistance. MC9S12XE-Family Reference Manual , Rev. 1.21 1218 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics The additional input voltage error on the converted channel can be calculated as: VERR = K * RS * IINJ with IINJ being the sum of the currents injected into the two pins adjacent to the converted channel. Table A-16. ATD Electrical Characteristics Conditions are shown in Table A-4 unless otherwise noted Num C 1 2 3 4 5 Rating Symbol RS CINN CINS RINA INA Kp Kn Min -- -- -- -- -2.5 -- -- Typ -- -- -- 5 -- -- -- Max 1 10 16 15 2.5 1E-4 2E-3 Unit K pF k mA A/A A/A C Max input source resistance(1) D Total input capacitance Non sampling Total input capacitance Sampling D Input internal Resistance C Disruptive analog input current C Coupling ratio positive current injection 6 C Coupling ratio negative current injection 1. Refer to A.2.2.2 for further information concerning source resistance A.2.3 ATD Accuracy Table A-17 and Table A-18 specify the ATD conversion performance excluding any errors due to current injection, input capacitance and source resistance. A.2.3.1 ATD Accuracy Definitions For the following definitions see also Figure A-1. Differential non-linearity (DNL) is defined as the difference between two adjacent switching steps. V -V i i-1 DNL ( i ) = ------------------------- - 1 1LSB The integral non-linearity (INL) is defined as the sum of all DNLs: INL ( n ) = i=1 n V -V n 0 DNL ( i ) = -------------------- - n 1LSB MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1219 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics DNL Vi-1 $3FF $3FE $3FD $3FC $3FB $3FA $3F9 $3F8 $3F7 $3F6 $3F5 $3F4 10-Bit Resolution $3F3 LSB 10-Bit Absolute Error Boundary Vi 8-Bit Absolute Error Boundary $FF $FE $FD 8-Bit Resolution Vin mV 9 8 7 6 5 4 3 2 1 0 5 10 15 20 25 30 35 40 50 Ideal Transfer Curve 2 10-Bit Transfer Curve 1 8-Bit Transfer Curve 50555060506550705075508050855090509551005105511051155120 Figure A-1. ATD Accuracy Definitions NOTE Figure A-1 shows only definitions, for specification values refer to Table A-17 and Table A-18 MC9S12XE-Family Reference Manual , Rev. 1.21 1220 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-17. ATD Conversion Performance 5V range Conditions are shown in Table A-4. unless otherwise noted. VREF = VRH - VRL = 5.12V. fATDCLK = 8.3MHz The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions. Num C 1 2 3 4 5 6 7 8 9 10 11 P Resolution P Differential Nonlinearity P Integral Nonlinearity P Absolute Error C Resolution C Differential Nonlinearity C Integral Nonlinearity C Absolute Error3. C Resolution C Differential Nonlinearity C Integral Nonlinearity (3) Rating(1) ,(2) 12-Bit 12-Bit 12-Bit 12-Bit 10-Bit 10-Bit 10-Bit 10-Bit 8-Bit 8-Bit 8-Bit Symbol LSB DNL INL AE LSB DNL INL AE LSB DNL INL Min -- -4 -5 -7 -- -1 -2 -3 -- -0.5 -1 Typ 1.25 2 2.5 4 5 0.5 1 2 20 0.3 0.5 Max -- 4 5 7 -- 1 2 3 -- 0.5 1 Unit mV counts counts counts mV counts counts counts mV counts counts 12 C Absolute Error3. 8-Bit AE -1.5 1 1.5 counts 1. The 8-bit and 10-bit mode operation is structurally tested in production test. Absolute values are tested in 12-bit mode. 2. Better performance is possible using specially designed multi-layer PCBs or averaging techniques. 3. These values include the quantization error which is inherently 1/2 count for any A/D converter. Table A-18. ATD Conversion Performance 3.3V range Conditions are shown in Table A-4. unless otherwise noted. VREF = VRH - VRL = 3.3V. fATDCLK = 8.3MHz The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions. Num C 1 2 3 4 5 6 7 8 9 10 11 P Resolution P Differential Nonlinearity P Integral Nonlinearity P Absolute Error(3) C Resolution C Differential Nonlinearity C Integral Nonlinearity C Absolute Error3. C Resolution C Differential Nonlinearity C Integral Nonlinearity Rating(1),(2) 12-Bit 12-Bit 12-Bit 12-Bit 10-Bit 10-Bit 10-Bit 10-Bit 8-Bit 8-Bit 8-Bit Symbol LSB DNL INL AE LSB DNL INL AE LSB DNL INL Min -- -6 -7 -8 -- -1.5 -2 -3 -- -0.5 -1 Typ 0.80 3 3 4 3.22 1 1 2 12.89 0.3 0.5 Max -- 6 7 8 -- 1.5 2 3 -- 0.5 1 Unit mV counts counts counts mV counts counts counts mV counts counts 12 C Absolute Error3. 8-Bit AE -1.5 1 1.5 counts 1. The 8-bit and 10-bit mode operation is structurally tested in production test. Absolute values are tested in 12-bit mode. 2. Better performance is possible using specially designed multi-layer PCBs or averaging techniques. 3. These values include the quantization error which is inherently 1/2 count for any A/D converter. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1221 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3 A.3.1 NVM, Flash and Emulated EEPROM Timing Parameters The time base for all NVM program or erase operations is derived from the oscillator. A minimum oscillator frequency fNVMOSC is required for performing program or erase operations. The NVM modules do not have any means to monitor the frequency and will not prevent program or erase operation at frequencies above or below the specified minimum. When attempting to program or erase the NVM modules at a lower frequency, a full program or erase transition is not assured. The program and erase operations are timed using a clock derived from the oscillator using the FCLKDIV register. The frequency of this clock must be set within the limits specified as fNVMOP. The minimum program and erase times shown in Table A-19 are calculated for maximum fNVMOP and maximum fNVMBUS unless otherwise shown. The maximum times are calculated for minimum fNVMOP A.3.1.1 Erase Verify All Blocks (Blank Check) (FCMD=0x01) The time it takes to perform a blank check is dependant on the location of the first non-blank word starting at relative address zero. It takes one bus cycle per phrase to verify plus a setup of the command. Assuming that no non blank location is found, then the erase verify all blocks is given by. 1 t check = 33500 --------------------f NVMBUS A.3.1.2 Erase Verify Block (Blank Check) (FCMD=0x02) The time it takes to perform a blank check is dependant on the location of the first non-blank word starting at relative address zero. It takes one bus cycle per phrase to verify plus a setup of the command. Assuming that no non blank location is found, then the erase verify time for a single 256K NVM array is given by 1 t check = 33500 --------------------f NVMBUS For a 128K NVM or D-Flash array the erase verify time is given by 1 t check = 17200 --------------------f NVMBUS A.3.1.3 Erase Verify P-Flash Section (FCMD=0x03) The maximum time depends on the number of phrases being verified (NVP) 1 t check = ( 752 + N VP ) --------------------f NVMBUS MC9S12XE-Family Reference Manual , Rev. 1.21 1222 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.1.4 Read Once (FCMD=0x04) The maximum read once time is given by 1 t = ( 400 ) --------------------f NVMBUS A.3.1.5 Load Data Field (FCMD=0x05) The maximum load data field time is given by 1 t = ( 450 ) --------------------f NVMBUS A.3.1.6 Program P-Flash (FCMD=0x06) The programming time for a single phrase of four P-Flash words + associated eight ECC bits is dependant on the bus frequency as a well as on the frequency fNVMOP and can be calculated according to the following formulas, whereby NDLOAD is the number of extra blocks being programmed by the Load Data Field command (DLOAD), i.e. programming 2,3,4 blocks using DLOAD, NDLOAD =1,2,3 respectively. The typical phrase programming time can be calculated using the following equation 1 1 t bwpgm = ( 128 + ( 12 N DLOAD ) ) ------------------------ + ( 1725 + ( 510 N DLOAD ) ) ---------------------------f NVMBUS f NVMOP The maximum phrase programming time can be calculated using the following equation 1 1 t bwpgm = ( 130 + ( 14 N DLOAD ) ) ------------------------ + ( 2125 + ( 510 N DLOAD ) ) ---------------------------f NVMBUS f NVMOP A.3.1.7 P-Flash Program Once (FCMD=0x07) The maximum P-Flash Program Once time is given by 1 1 t bwpgm 162 ------------------------ + 2400 ---------------------------f NVMBUS f NVMOP A.3.1.8 Erase All Blocks (FCMD=0x08) For S12XEP100, S12XEP768, S12XEQ512 and S12XEQ384 erasing all blocks takes: 1 1 t mass 100100 ------------------------ + 70000 ---------------------------f NVMBUS f NVMOP For S12XET256, S12XEA256 and S12XEG128 erasing all blocks takes: 1 1 t mass 100100 ------------------------ + 35000 ---------------------------f NVMBUS f NVMOP MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1223 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.1.9 Erase P-Flash Block (FCMD=0x09) Erasing a 256K NVM block takes 1 1 t mass 100100 ------------------------ + 70000 ---------------------------f NVMBUS f NVMOP Erasing a 128K NVM block takes 1 1 t mass 100100 ------------------------ + 35000 ---------------------------f NVMBUS f NVMOP A.3.1.10 Erase P-Flash Sector (FCMD=0x0A) The typical time to erase a1024-byte P-Flash sector can be calculated using 1 1 t era = 20020 ------------------ + 700 --------------------- f NVMOP f NVMBUS The maximum time to erase a1024-byte P-Flash sector can be calculated using 1 1 t era = 20020 ------------------ + 1100 --------------------- - f NVMBUS f NVMOP A.3.1.11 Unsecure Flash (FCMD=0x0B) The maximum time for unsecuring the flash is given by 1 1 t uns = 100100 ------------------------ + 70000 ---------------------------- f NVMBUS f NVMOP A.3.1.12 Verify Backdoor Access Key (FCMD=0x0C) The maximum verify backdoor access key time is given by 1 t = 400 ---------------------------f NVMBUS A.3.1.13 Set User Margin Level (FCMD=0x0D) The maximum set user margin level time is given by 1 t = 350 ---------------------------f NVMBUS A.3.1.14 Set Field Margin Level (FCMD=0x0E) The maximum set field margin level time is given by MC9S12XE-Family Reference Manual , Rev. 1.21 1224 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics 1 t = 350 ---------------------------f NVMBUS A.3.1.15 Full Partition D-Flash (FCMD=0x0F) The maximum time for partitioning the D-flash (ERPART=16, DFPART=0) is given by : 1 1 t part 21800 ------------------------ + 400000 ---------------------------- + t f NVMOP f NVMBUS mass A.3.1.16 Erase Verify D-Flash Section (FCMD=0x10) Erase Verify D-Flash for a given number of words NW is given by . 1 t check ( 840 + N W ) ---------------------------f NVMBUS A.3.1.17 D-Flash Programming (FCMD=0x11) D-Flash programming time is dependent on the number of words being programmed and their location with respect to a row boundary, because programming across a row boundary requires extra steps. The DFlash programming time is specified for different cases (1,2,3,4 words and 4 words across a row boundary) at a 50MHz bus frequency. The typical programming time can be calculated using the following equation, whereby Nw denotes the number of words; BC=0 if no boundary is crossed and BC=1 if a boundary is crossed. 1 1 t dpgm = ( 15 + ( 54 N w ) + ( 16 BC ) ) ------------------ + ( 460 + ( 640 N W ) + ( 500 BC ) ) --------------------- - f NVMOP f NVMBUS The maximum programming time can be calculated using the following equation 1 1 t dpgm = ( 15 + ( 56 N w ) + ( 16 BC ) ) ------------------ + ( 460 + ( 840 N W ) + ( 500 BC ) ) --------------------- f NVMOP f NVMBUS A.3.1.18 Erase D-Flash Sector (FCMD=0x12) Typical D-Flash sector erase times are those expected on a new device, where no margin verify fails occur. They can be calculated using the following equation. 1 1 t eradf 5025 ------------------------ + 700 ---------------------------f NVMBUS f NVMOP Maximum D-Fash sector erase times can be calculated using the following equation. 1 1 t eradf 20100 ------------------------ + 3300 ---------------------------f NVMBUS f NVMOP The D-Flash sector erase time on a new device is ~5ms and can extend to 20ms as the flash is cycled. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1225 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.1.19 Enable EEE (FCMD=0x13) The maximum time to enable EPROM emulation is given by 1 t = ( ( 1100 BWN + ( 176 ( 1 + BWN ) + ( BWN + N SEC ) 32364 ) ) ) ------------------ + f NVMOP 1 ( 3050 ( 1 + BWN ) + ( N - SEC + BWN ) 290500 ) --------------------- f NVMBUS where NSEC is the number of sectors of constant data. A constant sector is one in which all 63 records contain the latest active data and would need to be copied. The maximum possible is 33 (2048 EEE RAM words /63 =32.5) although this is a highly unlikely scenario. The impact of a worst case brownout recovery scenario is denoted by BWN = 2 for non brownout situations BWN =0. MC9S12XE-Family Reference Manual , Rev. 1.21 1226 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.1.20 Maximum CCOB Latency The maximum time a CCOB command has to wait to be actioned due to an EEE clean up is given where BWN = 1 if a brownout has occured otherwise BWN = 0. BWN = 1 only for the first ENEEE after reset. 1 1 t 32364 ------------------------ + 292600 ---------------------------- ( 1 + BWN ) f NVMBUS f NVMOP 1100 1 + BWN 350 -------------------- + ------------------------ f NVMOP f NVMBUS A.3.1.21 Disable EEE (FCMD=0x14) Maximum time to disable EPROM emulation is given by 1 t = 300 ---------------------------f NVMBUS A.3.1.22 EEE Query (FCMD=0x15) Maximum time for the EEE query command is given by 1 t = 300 ---------------------------f NVMBUS A.3.1.23 Partition D-Flash (FCMD=0x20) The maximum time for partitioning the D-flash (ERPART=16, DFPART=0) is given by 1 1 t 21800 ------------------------ + 400000 ---------------------------f NVMBUS f NVMOP MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1227 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.1.24 EEE Copy Down The typical EEE copy down time is given by the following equation 1 t dfcd = ( 14000 + ( 316 ERPART ) + ( 1500 ( 124 - DFPART ) ) ) x --------------------f NVMBUS The maximum EEE copy down time is given by the following equation 1 t dfcd = ( 34000 + ( 316 ERPART ) + ( 1500 ( 124 - DFPART ) ) ) x --------------------f NVMBUS Worst case for Enable EEPROM Emulation allows for all the EEE records to have to be copied which is a very low probability scenario only likely in the case that the EEE is mostly full of unchanging data (the records for which are stored in consecutive D-Flash sectors). Table A-19. NVM Timing Characteristics Conditions are as shown in Table A-4, with fNVMBUS = 50MHz and fNVMOP= 1MHz unless otherwise noted. Num C 1 2 3 4 5a 5b 5c 6 7 7a 8 9a 9b 9c 9d 9e 10 11 12 D External oscillator clock D Bus frequency for programming or erase operations D Operating frequency D P-Flash phrase programming D P- Flash phrase program time using D-LOAD on 4 blocks D P-Flash phrase program time using D-LOAD on 3 blocks D P-Flash phrase program time using D-LOAD on 2 blocks P P-Flash sector erase time P Erase All Blocks (Mass erase) time D Unsecure Flash D P-Flash erase verify (blank check) time D D-Flash word programming one word D D-Flash word programming two words D D-Flash word programming three words D D-Flash word programming four words D D-Flash word programming four words crossing row boundary D D-Flash sector erase time D D-Flash erase verify (blank check) time D EEE copy down (mask sets 5M48H, 3M25J, 2M53J) (2) Rating Symbol fNVMOSC fNVMBUS fNVMOP tbwpgm tbwpgm4 tbwpgm3 tbwpgm2 tera tmass tuns tcheck tdpgm tdpgm tdpgm tdpgm tdpgm teradf tcheck tdfrcd Min 2 1 800 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- 162 231 208 185 20 101 101 -- 88 153 212 282 298 5.2(3) -- 255000 Max 50(1) 50 1050 173 264 233 202 21 102 102 335002 95 165 230 316 342 21 17500 275000(4) 225000(5) Unit MHz MHz kHz s s s s ms ms ms tcyc s s s s s ms tcyc tcyc tcyc 12 D EEE copy down (other mask sets) tdfrcd -- 205000 1. Restrictions for oscillator in crystal mode apply. 2. Valid for both "Erase verify all" or "Erase verify block" on 256K block without failing locations 3. This is a typical value for a new device 4. Maximum partitioning 5. Maximum partitioning MC9S12XE-Family Reference Manual , Rev. 1.21 1228 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.3.2 NVM Reliability Parameters The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process monitors and burn-in to screen early life failures. The data retention and program/erase cycling failure rates are specified at the operating conditions noted. The program/erase cycle count on the sector is incremented every time a sector or mass erase event is executed. The standard shipping condition for both the D-Flash and P-Flash memory is erased with security disabled. However it is recommended that each block or sector is erased before factory programming to ensure that the full data retention capability is achieved. Data retention time is measured from the last erase operation. Table A-20. NVM Reliability Characteristics Conditions are shown in Table A-4 unless otherwise noted Num C Rating P-Flash Arrays 1 2 3 C Data retention at an average junction temperature of TJavg = 85C(1) after up to 10,000 program/erase cycles C Data retention at an average junction temperature of TJavg = 85C(3) after less than 100 program/erase cycles C P-Flash number of program/erase cycles (-40C tj 150C) D-Flash Array 4 5 6 7 C Data retention at an average junction temperature of TJavg = 85C3 after up to 50,000 program/erase cycles C Data retention at an average junction temperature of TJavg = 85C3 after less than 10,000 program/erase cycles C Data retention at an average junction temperature of TJavg = 85C3 after less than 100 program/erase cycles C D-Flash number of program/erase cycles (-40C tj 150C) Emulated EEPROM 8 9 C Data retention at an average junction temperature of TJavg = 1 85C after spec. program/erase cycles C Data retention at an average junction temperature of TJavg = 3 85C after less than 20% spec.program/erase cycles. (e.g. after <20,000 cycles / Spec 100,000 cycles) C Data retention at an average junction temperature of TJavg = 3 85C after less than 0.2% spec. program/erase cycles (e.g. after < 200 cycles / Spec 100,000 cycles) C EEPROM number of program/erase cycles with a ratio of EEE_NVM to EEE_RAM = 8 (-40C tj 150C) C EEPROM number of program/erase cycles with a ratio of EEE_NVM to EEE_RAM = 128 (-40C tj 150C) C EEPROM number of program/erase cycles with a ratio of EEE_NVM to EEE_RAM = 16384(6) (-40C tj 150C) tEENVMRET tEENVMRET 54 10 1002 1002 -- -- Years Years tDNVMRET tDNVMRET tDNVMRET nDFLPE 5 10 20 50K 1002 1002 1002 500K3 -- -- -- -- Years Years Years Cycles tPNVMRET tPNVMRET nPFLPE 15 20 10K 100(2) 1002 100K3 -- -- -- Years Years Cycles Symbol Min Typ Max Unit 10 tEENVMRET 20 1002 -- Years 11 12 13 nEEPE nEEPE nEEPE 100K(4) 3M4 325M4 1M(5) 30M5 3.2G5 -- -- -- Cycles Cycles Cycles MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1229 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics 1. TJavg does not exceed 85C in a typical temperature profile over the lifetime of a consumer, industrial or automotive application. 2. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer to Engineering Bulletin EB618 3. TJavg does not exceed 85C in a typical temperature profile over the lifetime of a consumer, industrial or automotive application. 4. This represents the number of writes of updated data words to the EEE_RAM partition. Minimum specification (endurance and data retention) of the Emulated EEPROM array is based on the minimum specification of the D-Flash array per item 6. 5. This represents the number of writes of updated data words to the EEE_RAM partition. Typical endurance performance for the Emulated EEPROM array is based on typical endurance performance and the EEE algorithm implemented on this product family. Spec. table quotes typical endurance evaluated at 25C for this product family. 6. This is equivalent to using a single byte or aligned word in the EEE_RAM with 32K D-Flash allocated for EEEPROM The number of program/erase cycles for the EEPROM/D-Flash depends upon the partitioning of D-Flash used for EEPROM Emulation. Defining RAM size allocated for EEE as EEE-RAM and D-Flash partition allocated to EEE as EEE_NVM, the minimum number of program/erase cycles is specified depending upon the ratio of EEE_NVM/EEE_RAM. The minimum ratio EEE_NVM/EEE_RAM =8. Figure A-2. Program/Erase Dependency on D-Flash Partitioning # K Cycles (Log) 1,000,000 100,000 10,000 1,000 100 10 10 100 1000 10,000 100,000 20% Spec Cycles 10 Year Data Retention Spec Cycles 5 Year Data Retention EEE_NVM/EEE_RAM ratio (Log) MC9S12XE-Family Reference Manual , Rev. 1.21 1230 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.4 Voltage Regulator Table A-21. Voltage Regulator Electrical Characteristics Device functionality is guaranteed on power down to the LVR assert level. Conditions are shown in Table A-4 unless otherwise noted Num 1 C P Input Voltages Characteristic Symbol VVDDR,A Min 3.13 1.72 -- -- 2.6 -- -- Typical -- 1.84 1.6 --(1) 2.82 2.2 --1 1.84 1.6 --1 4.23 4.38 -- 3.02 -- -- -- 5.25 Max 5.5 1.98 -- -- 2.9 -- -- 1.98 -- -- 4.40 4.49 3.13 -- -- + 5% 100 5.45 Unit V V V V V V V V V V V V V V V -- us mV/oC 2 P Output Voltage Core Full Performance Mode Reduced Power Mode (MCU STOP mode) Shutdown Mode Output Voltage Flash Full Performance Mode Reduced Power Mode (MCU STOP mode) Shutdown Mode Output Voltage PLL Full Performance Mode Reduced Power Mode (MCU STOP mode) Shutdown Mode Low Voltage Interrupt Asser Level (2) Low Voltage InterruptDeassert Level VDDX Low Voltage Reset Deassert (3) VDDX Low Voltage Reset assert 3 VDDX Low Voltage Reset assert 3 Trimmed API internal clock(4) f / fnominal The first period after enabling the counter by APIFE might be reduced by API start up delay Temperature Sensor Slope VDD 3 P VDDF 4 P VDDPLL 1.72 -- -- 4.04 4.19 -- -- 2.97 - 5% -- 5.05 5 6a 6b 6c 7 8 9 P P D P C D T VLVIA VLVID VLVRXD VLVRXA VLVRXA dfAPI tsdel dVTS High Temperature Interrupt Assert THTIA 120 132 144 (5) o C 110 122 134 THTID 10 T (VREGHTTR=$88) High Temperature Interrupt Deassert (VREGHTTR=$88) 1. Voltage Regulator Disabled. High Impedance Output 2. Monitors VDDA, active only in Full Performance Mode. Indicates I/O & ADC performance degradation due to low supply voltage. 3. Monitors VDDX, active only in Full Performance Mode. MCU is monitored by the POR in RPM (see Figure A-3) 4. The API Trimming bits must be set that the minimum period equals to 0.2 ms. 5. A hysteresis is guaranteed by design NOTE The LVR monitors the voltages VDDF and VDDX. If the voltage drops on these supplies to a level which could prohibit the correct function of the microcontroller, the LVR triggers. A.5 Output Loads MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1231 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.5.1 Resistive Loads The voltage regulator is intended to supply the internal logic and oscillator. It allows no external DC loads. A.5.2 Capacitive Loads Table A-22. - Required Capacitive Loads The capacitive loads are specified in Table A-22. Ceramic capacitors with X7R dielectricum are required. Num 1 3 Characteristic VDD/VDDF external capacitive load VDDPLL external capacitive load Symbol CDDext CDDPLLext Min 176 80 Recommended 220 220 Max 264 264 Unit nF nF A.5.3 Chip Power-up and Voltage Drops LVI (low voltage interrupt), POR (power-on reset) and LVRs (low voltage reset) handle chip power-up or drops of the supply voltage. Their function is shown in Figure A-3 . Figure A-3. MC9S12XE-Family - Chip Power-up and Voltage Drops (not scaled) V VLVID VLVIA VLVRXD VLVRXA VDDX VDD VPORD t LVI LVI enabled LVI disabled due to LVR POR LVRX MC9S12XE-Family Reference Manual , Rev. 1.21 1232 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Figure A-4. MC9S12XE-Family Power Sequencing V VDDR, VDDX VDDA >= 0 t During power sequencing VDDA can be powered up before VDDR, VDDX. VDDR and VDDX must be powered up together adhering to the operating conditions differential. VRH power up must follow VDDA to avoid current injection. A.6 Reset, Oscillator and PLL This section summarizes the electrical characteristics of the various startup scenarios for oscillator and phase-locked loop (PLL). A.6.1 Startup Table A-23 summarizes several startup characteristics explained in this section. Detailed description of the startup behavior can be found in the Clock and Reset Generator (CRG) block description Table A-23. Startup Characteristics Conditions are shown in Table A-4unless otherwise noted Num C 1 2 3 Rating Symbol PWRSTL tRST tWRS Min 2 192 -- Typ -- -- -- 50 Max -- 4000(1) 14 100 Unit tosc nbus tcyc s D Reset input pulse width, minimum input time D Startup from reset D Wait recovery startup time 4 D Fast wakeup from STOP(2) -- tfws 1. This is the time between RESET deassertion and start of CPU code execution. 2. Including voltage regulator startup; VDD /VDDF filter capacitors 220 nF, VDD35 = 5 V, T= 25C A.6.1.1 POR The release level VPORR and the assert level VPORA are derived from the VDD supply. They are also valid if the device is powered externally. After releasing the POR reset the oscillator and the clock quality check are started. If after a time tCQOUT no valid oscillation is detected, the MCU will start using the internal self clock. The fastest startup time possible is given by nuposc. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1233 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.6.1.2 SRAM Data Retention Provided an appropriate external reset signal is applied to the MCU, preventing the CPU from executing code when VDD35 is out of specification limits, the SRAM contents integrity is guaranteed if after the reset the PORF bit in the CRG flags register has not been set. A.6.1.3 External Reset When external reset is asserted for a time greater than PWRSTL the CRG module generates an internal reset, and the CPU starts fetching the reset vector without doing a clock quality check, if there was an oscillation before reset. A.6.1.4 Stop Recovery Out of stop the controller can be woken up by an external interrupt. A clock quality check as after POR is performed before releasing the clocks to the system. If the MCU is woken-up by an interrupt and the fast wake-up feature is enabled (FSTWKP = 1 and SCME = 1), the system will resume operation in self-clock mode after tfws. A.6.1.5 Pseudo Stop and Wait Recovery The recovery from pseudo stop and wait is essentially the same since the oscillator is not stopped in both modes. The controller can be woken up by internal or external interrupts. After twrs the CPU starts fetching the interrupt vector. MC9S12XE-Family Reference Manual , Rev. 1.21 1234 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.6.2 Oscillator Table A-24. Oscillator Characteristics Conditions are shown in Table A-4. unless otherwise noted Num C 1a 1b 2 3a 3b 3c 4a 4b 4c 4d 4e 5 6 7 8 9 10 11 12 13 Rating Symbol fOSC fOSC iOSC tUPOSC tUPOSC tUPOSC tUPOSC tUPOSC tUPOSC tUPOSC tUPOSC tCQOUT fCMFA fEXT tEXTL tEXTH tEXTR tEXTF CIN VIH,EXTAL VIH,EXTAL VIL,EXTAL VIL,EXTAL VHYS,EXTAL Min 4.0 2.0 100 -- -- -- -- -- -- -- -- 0.45 200 2.0 9.5 9.5 -- -- -- 0.75*VDDPLL -- -- VSSPLL - 0.3 -- Typ -- -- -- 2 1.6 1 8 4 2 1 0.8 -- 400 -- -- -- -- -- 7 -- -- -- -- Max 16 40 -- 10 8 5 40 20 10 5 4 2.5 1000 50 -- -- 1 1 -- -- VDDPLL + 0.3 0.25*VDDPLL -- -- Unit MHz MHz A ms ms ms ms ms ms ms ms s KHz MHz ns ns ns ns pF V V V V mV V C Crystal oscillator range (loop controlled Pierce) C Crystal oscillator range (full swing Pierce) (1),(2) P Startup Current C Oscillator start-up time (LCP, 4MHz)(3) C Oscillator start-up time (LCP, 8MHz)3 C Oscillator start-up time (LCP, 16MHz)3 C Oscillator start-up time (full swing Pierce, 2MHz)3 C Oscillator start-up time (full swing Pierce, 4MHz)3 C Oscillator start-up time (full swing Pierce, 8MHz)3 C Oscillator start-up time (full swing Pierce, 16MHz)3 C Oscillator start-up time (full swing Pierce, 40MHz)3 D Clock Quality check time-out P Clock Monitor Failure Assert Frequency P External square wave input frequency D External square wave pulse width low D External square wave pulse width high D External square wave rise time D External square wave fall time D Input Capacitance (EXTAL, XTAL pins) P EXTAL Pin Input High Voltage T EXTAL Pin Input High Voltage,(4) 14 P EXTAL Pin Input Low Voltage ,4 T EXTAL Pin Input Low Voltage 15 16 C EXTAL Pin Input Hysteresis C 180 EXTAL Pin oscillation amplitude (loop controlled -- -- VPP,EXTAL 0.9 Pierce) 1. Depending on the crystal a damping series resistor might be necessary 2. Only valid if full swing Pierce oscillator/external clock mode is selected 3. These values apply for carefully designed PCB layouts with capacitors that match the crystal/resonator requirements.. 4. Only applies if EXTAL is externally driven MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1235 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.6.3 A.6.3.1 Phase Locked Loop Jitter Information With each transition of the clock fcmp, the deviation from the reference clock fref is measured and input voltage to the VCO is adjusted accordingly.The adjustment is done continuously with no abrupt changes in the clock output frequency. Noise, voltage, temperature and other factors cause slight variations in the control loop resulting in a clock jitter. This jitter affects the real minimum and maximum clock periods as illustrated in Figure A-5. 0 1 2 3 N-1 N tmin1 tnom tmax1 tminN tmaxN Figure A-5. Jitter Definitions The relative deviation of tnom is at its maximum for one clock period, and decreases towards zero for larger number of clock periods (N). MC9S12XE-Family Reference Manual , Rev. 1.21 1236 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Defining the jitter as: t (N) t (N) max min J ( N ) = max 1 - ---------------------- , 1 - ---------------------- Nt Nt nom nom The following equation is a good fit for the maximum jitter: j1 J ( N ) = ------- + j 2 N J(N) 1 5 10 20 N Figure A-6. Maximum bus clock jitter approximation MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1237 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics This is important to note with respect to timers, serial modules where a prescaler will eliminate the effect of the jitter to a large extent. Table A-25. IPLL Characteristics Conditions are shown in Table A-4 unless otherwise noted Num C 1 2 3 4 5 7 8 9 10 11 12 Rating Symbol fSCM fVCO fREF |Lock| |unl| tlock j1 j2 fbus fbus Min 1 32 1 0 0.5 -- -- -- -- -- Typ -- -- -- -- -- 214 -- -- -- -- Max 4 120 40 1.5 2.5 150 + 256/fREF 1.2 0 48 49 Unit MHz MHz MHz %(2) %2 s % % MHz MHz P Self Clock Mode frequency(1) C VCO locking range C Reference Clock D Lock Detection D Un-Lock Detection C Time to lock C Jitter fit parameter 1(3) C Jitter fit parameter 23 D Bus Frequency for FM1=1, FM0=1 (frequency modulation in PLLCTL register of s12xe_crg) D Bus Frequency for FM1=1, FM0=0 (frequency modulation in PLLCTL register of s12xe_crg) fbus D Bus Frequency for FM1=0, FM0=1 (frequency -- -- 49 MHz modulation in PLLCTL register of s12xe_crg) 1. Bus frequency is equivalent to fSCM/2 2. % deviation from target frequency 3. fOSC = 4MHz, fBUS = 50MHz equivalent fPLL = 100MHz: REFDIV=$01, REFRQ=01, SYNDIV=$18, VCOFRQ=11, POSTDIV=$ 00. A.7 A.7.1 External Interface Timing MSCAN Table A-26. MSCAN Wake-up Pulse Characteristics Conditions are shown in Table A-4 unless otherwise noted Num C 1 2 Rating Symbol tWUP tWUP Min -- 5 Typ -- -- Max 1.5 -- Unit s s P MSCAN wakeup dominant pulse filtered P MSCAN wakeup dominant pulse pass A.7.2 SPI Timing This section provides electrical parametrics and ratings for the SPI. In Table A-27 the measurement conditions are listed. MC9S12XE-Family Reference Manual , Rev. 1.21 1238 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-27. Measurement Conditions Description Drive mode Load capacitance CLOAD(1), on all outputs Thresholds for delay measurement points 1. Timing specified for equal load on all SPI output pins. Avoid asymmetric load. Value Full drive mode 50 (20% / 80%) VDDX Unit -- pF V A.7.2.1 Master Mode In Figure A-7 the timing diagram for master mode with transmission format CPHA = 0 is depicted. SS1 (Output) 2 SCK (CPOL = 0) (Output) SCK (CPOL = 1) (Output) 5 MISO (Input) 6 Bit MSB-1. . . 1 9 Bit MSB-1. . . 1 LSB OUT LSB IN 11 1 4 4 12 13 12 13 3 MSB IN2 10 MOSI (Output) MSB OUT2 1. If configured as an output. 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, bit 2... MSB. Figure A-7. SPI Master Timing (CPHA = 0) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1239 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics In Figure A-8 the timing diagram for master mode with transmission format CPHA=1 is depicted. SS1 (Output) 1 2 SCK (CPOL = 0) (Output) 4 SCK (CPOL = 1) (Output) 5 MISO (Input) 9 MOSI (Output) Port Data Master MSB OUT2 6 Bit MSB-1. . . 1 11 Bit MSB-1. . . 1 Master LSB OUT Port Data LSB IN MSB IN2 4 12 13 12 13 3 1.If configured as output 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1,bit 2... MSB. Figure A-8. SPI Master Timing (CPHA = 1) MC9S12XE-Family Reference Manual , Rev. 1.21 1240 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics In Table A-28 the timing characteristics for master mode are listed. Table A-28. SPI Master Mode Timing Characteristics Num 1 1 2 3 4 5 6 9 10 11 12 C D D D D D D D D D D D SCK period Enable lead time Enable lag time Clock (SCK) high or low time Data setup time (inputs) Data hold time (inputs) Data valid after SCK edge Data valid after SS fall (CPHA = 0) Data hold time (outputs) Rise and fall time inputs Characteristic SCK frequency Symbol fsck tsck tlead tlag twsck tsu thi tvsck tvss tho trfi trfo Min 1/2048 21 -- -- -- 8 8 -- -- 0 -- -- Typ -- -- 1/2 1/2 1/2 -- -- -- -- -- -- -- Max 1/2 (1) Unit fbus tbus tsck tsck tsck ns ns ns ns ns ns ns 2048 -- -- -- -- -- 15 15 -- 8 8 13 D Rise and fall time outputs 1. See Figure A-9. fSCK/fbus 1/2 1/4 5 10 15 20 25 30 35 40 fbus [MHz] Figure A-9. Derating of maximum fSCK to fbus ratio in Master Mode MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1241 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.2.2 Slave Mode In Figure A-10 the timing diagram for slave mode with transmission format CPHA = 0 is depicted. SS (Input) 1 SCK (CPOL = 0) (Input) 2 SCK (CPOL = 1) (Input) 10 7 MISO (Output) See Note 5 MOSI (Input) NOTE: Not defined MSB IN Slave MSB 6 Bit MSB-1. . . 1 LSB IN 9 Bit MSB-1 . . . 1 4 4 12 13 8 11 11 See Note 12 13 3 Slave LSB OUT Figure A-10. SPI Slave Timing (CPHA = 0) In Figure A-11 the timing diagram for slave mode with transmission format CPHA = 1 is depicted. SS (Input) 1 2 SCK (CPOL = 0) (Input) 4 SCK (CPOL = 1) (Input) 9 MISO (Output) See Note 7 MOSI (Input) NOTE: Not defined Slave 5 MSB OUT 6 MSB IN Bit MSB-1 . . . 1 LSB IN 4 12 13 12 13 3 11 Bit MSB-1 . . . 1 Slave LSB OUT 8 Figure A-11. SPI Slave Timing (CPHA = 1) MC9S12XE-Family Reference Manual , Rev. 1.21 1242 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics In Table A-29 the timing characteristics for slave mode are listed. Table A-29. SPI Slave Mode Timing Characteristics Num 1 1 2 3 4 5 6 7 8 9 10 11 12 C D D D D D D D D D D D D D Characteristic SCK frequency SCK period Enable lead time Enable lag time Clock (SCK) high or low time Data setup time (inputs) Data hold time (inputs) Slave access time (time to data active) Slave MISO disable time Data valid after SCK edge Data valid after SS fall Data hold time (outputs) Rise and fall time inputs Symbol fsck tsck tlead tlag twsck tsu thi ta tdis tvsck tvss tho trfi trfo Min DC 4 4 4 4 8 8 -- -- -- -- 20 -- -- Typ -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 1/4 -- -- -- -- -- 20 22 28 + 0.5 tbus(1) 28 + 0.5 tbus1 -- 8 8 Unit fbus tbus tbus tbus tbus ns ns ns ns ns ns ns ns ns 13 D Rise and fall time outputs 1. 0.5 tbus added due to internal synchronization delay MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1243 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.3 External Bus Timing The following conditions are assumed for all following external bus timing values: * Crystal input within 45% to 55% duty * Equal 25 pF load on all pins * Pad full drive (reduced drive must be off) A.7.3.1 Normal Expanded Mode (External Wait Feature Disabled) 1 1 CSx ADDRx ADDR1 ADDR2 2 RE 3 4 WE 8 6 7 10 DATAx (Read) DATA1 5 11 (Write) DATA2 9 EWAIT UDS, LDS Figure A-12. Example 1a: Normal Expanded Mode -- Read Followed by Write MC9S12XE-Family Reference Manual , Rev. 1.21 1244 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-30. Example 1a: Normal Expanded Mode Timing 50 MHz bus (EWAIT disabled) No. 1 2 3 4 5 6 7 8 9 10 Characteristic Frequency of internal bus Internal cycle time Frequency of external bus External cycle time (selected by EXSTR) Address (1) Symbol C fi tcyc fo tcyce tADRE PWRE tADWE PWWE tDSR tDSR tDHR tACCR tWDWE tDSW D D D D D D D D D D D VDD5=5.0V Min D.C. 20 D.C. 40 4 28 4 18 19 23 0 4 5 23 6 Max 50.0 25.0 C D D D D D D D D D D D VDD5=3.3V Min D.C. 40 D.C. 80 13 58 15 38 38 N/A 0 4 5 43 4 Max 25.0 12.5 - Unit MHz ns MHz ns ns ns ns ns ns ns ns ns ns ns ns valid to RE fall Pulse width, RE Address valid to WE fall Pulse width, WE Read data setup time (if ITHRS = 0) Read data setup time (if ITHRS = 1) Read data hold time Read enable access time Write data valid to WE fall Write data setup time 11 Write data hold time tDHW 1. Includes the following signals: ADDRx, UDS, LDS, and CSx. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1245 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.3.2 Normal Expanded Mode (External Wait Feature Enabled) 1 CSx ADDRx ADDR1 ADDR2 2 RE 3 WE 8 6 7 DATAx 12 13 EWAIT (Read) DATA1 UDS, LDS Figure A-13. Example 1b: Normal Expanded Mode -- Stretched Read Access MC9S12XE-Family Reference Manual , Rev. 1.21 1246 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics 1 CSx ADDRx ADDR1 ADDR2 RE 4 WE 9 5 10 DATAx 12 13 EWAIT (Write) DATA1 11 UDS, LDS Figure A-14. Example 1b: Normal Expanded Mode -- Stretched Write Access Table A-31. Example 1b: Normal Expanded Mode Timing at 50MHz bus (EWAIT enabled) VDD5 = 5.0V No. Characteristic Symbol C Frequency of internal bus Internal cycle time Frequency of external bus fi tcyc fo 2 stretch cycles Min D.C. 20 D.C. Max 50.0 16.7 3 stretch cycles Min D.C. 20 D.C. Max 50.0 12.5 C VDD5 = 3.3V 2 stretch cycles Min D.C. 20 D.C. Max 25.0 8.33 3 stretch cycles Min D.C. 20 D.C. Max 25.0 6.25 MHz ns MHz Unit MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1247 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-31. Example 1b: Normal Expanded Mode Timing at 50MHz bus (EWAIT enabled) VDD5 = 5.0V No. Characteristic Symbol C 1 2 3 4 5 6 External cycle time (selected by EXSTR) External cycle time (EXSTR+1EWAIT) Address (1) valid to RE fall Pulse width, RE Pulse width, WE Read data setup time (if ITHRS = 0) Read data setup time (if ITHRS = 1) 7 8 9 Read data hold time Read enable access time Write data valid to WE fall (2) VDD5 = 3.3V C D D D D D D D D D D D D D 0 65 5 123 4 0 50 20 61 2 stretch cycles Min 120 160 13 138 15 118 38 Max N/A 0 105 5 163 4 0 90 101 3 stretch cycles Min 160 200 13 178 15 158 38 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit 2 stretch cycles Min Max 16 3 stretch cycles Min 80 100 4 88 4 78 19 23 0 69 5 93 6 0 50 Max 36 58 tcyce tcycew tADRE PWRE tADWE PWWE tDSR tDSR tDHR tACCR tWDWE tDSW tDHW tADWF D D D D D D D D D D D D 60 80 4 68 4 58 19 23 0 49 5 63 6 0 Address valid to WE fall 10 Write data setup time 11 Write data hold time 12 Address to EWAIT fall tADWR D 30 39 13 Address to EWAIT rise 1. Includes the following signals: ADDRx, UDS, LDS, and CSx. 2. Affected by EWAIT. MC9S12XE-Family Reference Manual , Rev. 1.21 1248 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.3.3 Emulation Single-Chip Mode (Without Wait States) 1 2 3 1 ECLK2X ECLK 4 ADDR [22:20]/ ACC [2:0] ADDR [19:16]/ IQSTAT [3:0] ADDR [15:0]/ IVD [15:0] 5 6 7 addr1 acc1 addr2 acc2 addr3 addr1 iqstat0 addr2 iqstat1 addr3 addr1 ivd0 addr2 ivd1 addr3 8 9 DATAx data0 (read) data1 10 12 R/W 12 (write) data2 11 LSTRB Figure A-15. Example 2a: Emulation Single-Chip Mode -- Read Followed by Write MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1249 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-32. Example 2a: Emulation Single-Chip Mode Timing 50 Mhz bus, VDD5=5.0V (EWAIT disabled) No. 1 2 3 4 5 6 7 8 9 10 11 C D D D D D D D D D D Cycle time Pulse width, E high Pulse width, E low Address delay time Address hold time IVDx delay time (2) IVDx hold time Read data setup time (ITHRS = 1 only) Read data hold time Write data delay time Write data hold time Characteristic (1) Frequency of internal bus Symbol fi tcyc PWEH PWEL tAD tAH tIVDD tIVDH tDSR tDHR tDDW tDHW tRWD Min D.C. 20 9 9 0 0 15 0 0 -1 Max 50.0 5 4.5 5 5 Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns 12 D Read/write data delay time (3) 1. Typical Supply and Silicon, Room Temperature Only 2. Includes also ACCx, IQSTATx 3. Includes LSTRB MC9S12XE-Family Reference Manual , Rev. 1.21 1250 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.3.4 Emulation Expanded Mode (With Optional Access Stretching) 1 2 3 ECLK2X ECLK 4 ADDR [22:20]/ ACC [2:0] ADDR [19:16]/ IQSTAT [3:0] ADDR [15:0]/ IVD [15:0] 5 6 7 ADDR1 ACC1 ADDR1 000 ADDR2 ADDR1 IQSTAT0 ADDR1 IQSTAT1 ADDR2 ADDR1 ? ADDR1 IVD1 ADDR2 8 9 DATAx DATA0 (Read) DATA1 12 12 R/W LSTRB Figure A-16. Example 2b: Emulation Expanded Mode -- Read with 1 Stretch Cycle MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1251 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics 1 2 3 ECLK2X ECLK 4 ADDR [22:20]/ ACC [2:0] ADDR [19:16]/ IQSTAT [3:0] ADDR [15:0]/ IVD [15:0] 5 6 ADDR1 ACC1 ADDR1 000 ADDR2 7 ADDR1 IQSTAT0 ADDR1 IQSTAT1 ADDR2 ADDR1 ? ADDR1 x ADDR2 10 DATAx (write) data1 11 12 12 R/W LSTRB Figure A-17. Example 2b: Emulation Expanded Mode O Write with 1 Stretch Cycle MC9S12XE-Family Reference Manual , Rev. 1.21 1252 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics Table A-33. Example 2b: Emulation Expanded Mode Timing 50 MHz bus, VDD5=5.0V (EWAIT disabled) No. 1 2 3 4 5 6 7 8 9 10 11 C D D D D D D D D D D Characteristic Internal cycle time Cycle time Pulse width, E high E falling to sampling E rising Address delay time Address hold time IVD delay time (2) IVD hold time Read data setup time Read data hold time Write data delay time Write data hold time (1) Symbol tcyc tcyce PWEH tEFSR tAD tAH tIVDD tIVDH tDSR tDHR tDDW tDHW tRWD 1 stretch cycle Min 20 40 9 28 Max 11 32 2 stretch cycles Min 20 60 9 48 Max 11 52 3 stretch cycles Min 20 80 9 68 Max 11 72 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns refer to table Table A-32 refer to table Table A-32 refer to table Table A-32 12 D Read/write data delay time (3) 1. Typical Supply and Silicon, Room Temperature Only 2. Includes also ACCx, IQSTATx 3. Includes LSTRB MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1253 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix A Electrical Characteristics A.7.3.5 External Tag Trigger Timing 1 ECLK ADDR ADDR DATAx DATA R/W TAGHI/TAGLO 2 3 Figure A-18. External Trigger Timing Table A-34. External Tag Trigger Timing VDD35 = 5.0 V No. 1 2 C D D D Characteristic (1) Frequency of internal bus Cycle time TAGHI/TAGLO setup time Symbol fi tcyc tTS tTH Min D.C. 20 10 0 Max 50.0 -- -- Unit MHz ns ns ns 3 D TAGHI/TAGLO hold time 1. Typical supply and silicon, room temperature only MC9S12XE-Family Reference Manual , Rev. 1.21 1254 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix B Package Information Appendix B Package Information This section provides the physical dimensions of the packages. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1255 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix B Package Information B.1 208 MAPBGA LASER MARK FOR PIN A1 IDENTIFICATION IN THIS AREA M K NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO DATUM PLANE Z. 4. DATUM Z (SEATING PLANE) IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 5. PARALLELISM MEASEMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. E M X 0.2 4X D X DIM A A1 A2 b D E e S MILLIMETERS MIN MAX --2.00 0.40 0.60 1.00 1.30 0.50 0.70 17.00 BSC 17.00 BSC 1.00 BSC 0.50 BSC 15X e 3 208X b S A B C D E F G H J K L M N P R T 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 METALIZED MARK FOR PIN A1 IDENTIFICATION IN THIS AREA 0.3 M X Y Z 0.1 M Z 15X e 5 0.2 Z A A2 A1 Z 4 0.2 Z 208X S VIEW M M VIEW K (ROTATED 90 CLOCKWISE) CASE 1159A-01 ISSUE B DATE 12/12/98 Figure B-1. 208MAPBGA Mechanical Dimensions B.2 144-Pin LQFP MC9S12XE-Family Reference Manual , Rev. 1.21 1256 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix B Package Information 4X 0.20 T L-M N 4X 36 TIPS 0.20 T L-M N PIN 1 IDENT 1 144 109 108 J1 J1 L M B V 140X 4X P C L X G VIEW Y 36 73 B1 V1 VIEW Y NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DATUMS L, M, N TO BE DETERMINED AT THE SEATING PLANE, DATUM T. 4. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE, DATUM T. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE H. 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.35. MILLIMETERS DIM MIN MAX A 20.00 BSC A1 10.00 BSC B 20.00 BSC B1 10.00 BSC C 1.40 1.60 C1 0.05 0.15 C2 1.35 1.45 D 0.17 0.27 E 0.45 0.75 F 0.17 0.23 G 0.50 BSC J 0.09 0.20 K 0.50 REF P 0.25 BSC R1 0.13 0.20 R2 0.13 0.20 S 22.00 BSC S1 11.00 BSC V 22.00 BSC V1 11.00 BSC Y 0.25 REF Z 1.00 REF AA 0.09 0.16 0 1 0 7 2 11 13 37 72 N A1 S1 A S VIEW AB C 2 2 T 0.1 T 144X SEATING PLANE PLATING J F AA C2 0.05 R2 R1 D 0.08 M BASE METAL 0.25 GAGE PLANE T L-M N (K) C1 (Y) VIEW AB (Z) E 1 SECTION J1-J1 (ROTATED 90 ) 144 PL Figure B-2. 144-Pin LQFP Mechanical Dimensions (Case No. 918-03) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1257 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix B Package Information B.3 PIN 1 IDENT 112-Pin LQFP Package 4X 112 1 0.20 T L-M N 4X 28 TIPS 85 84 0.20 T L-M N J1 J1 C L 4X P VIEW Y 108X G X X=L, M OR N VIEW Y B L M B1 V1 V J AA 28 57 F D 0.13 M BASE METAL 29 56 T L-M N N A1 S1 A S SECTION J1-J1 ROTATED 90 COUNTERCLOCKWISE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DATUMS L, M AND N TO BE DETERMINED AT SEATING PLANE, DATUM T. 4. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE, DATUM T. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. DIMENSIONS A AND B INCLUDE MOLD MISMATCH. 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.46. MILLIMETERS MIN MAX 20.000 BSC 10.000 BSC 20.000 BSC 10.000 BSC --1.600 0.050 0.150 1.350 1.450 0.270 0.370 0.450 0.750 0.270 0.330 0.650 BSC 0.090 0.170 0.500 REF 0.325 BSC 0.100 0.200 0.100 0.200 22.000 BSC 11.000 BSC 22.000 BSC 11.000 BSC 0.250 REF 1.000 REF 0.090 0.160 8 0 7 0 13 11 11 13 C2 C 0.050 2 VIEW AB 0.10 T 112X SEATING PLANE 3 T R R2 0.25 GAGE PLANE R R1 C1 (Y) (Z) VIEW AB (K) E 1 DIM A A1 B B1 C C1 C2 D E F G J K P R1 R2 S S1 V V1 Y Z AA 1 2 3 Figure B-3. 112-Pin LQFP Mechanical Dimensions (Case No. 987) MC9S12XE-Family Reference Manual , Rev. 1.21 1258 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix B Package Information B.4 80-Pin QFP Package L 60 61 41 40 S S B B P D L H A-B B V 0.05 D M M C A-B -A- -B- S S D 0.20 0.20 -A-,-B-,-DDETAIL A DETAIL A 80 1 20 21 -D0.20 M F A H A-B S S D S 0.05 A-B J S N 0.20 E C -CSEATING PLANE M C A-B D S M DETAIL C -HH G DATUM PLANE D 0.20 M C A-B S D S SECTION B-B VIEW ROTATED 90 0.10 M U T DATUM PLANE -H- R K W X DETAIL C Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N P Q R S T U V W X MILLIMETERS MIN MAX 13.90 14.10 13.90 14.10 2.15 2.45 0.22 0.38 2.00 2.40 0.22 0.33 0.65 BSC --0.25 0.13 0.23 0.65 0.95 12.35 REF 5 10 0.13 0.17 0.325 BSC 0 7 0.13 0.30 16.95 17.45 0.13 --0 --16.95 17.45 0.35 0.45 1.6 REF Figure B-4. 80-Pin QFP Mechanical Dimensions (Case No. 841B) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1259 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix C PCB Layout Guidelines Appendix C PCB Layout Guidelines The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the MCU itself. The following rules must be observed: * Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the corresponding pins . * Central point of the ground star should be the VSS3 pin. * Use low ohmic low inductance connections between VSS1, VSS2 and VSS3. * VSSPLL must be directly connected to VSS3. * Keep traces of VSSPLL, EXTAL, and XTAL as short as possible and occupied board area for C7, C8, and Q1 as small as possible. * Do not place other signals or supplies underneath area occupied by C7, C8, and Q1 and the connection area to the MCU. * Central power input should be fed in at the VDDA/VSSA pins. Example layouts are illustrated on the following pages. MC9S12XE-Family Reference Manual , Rev. 1.21 1260 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix C PCB Layout Guidelines Table C-1. Recommended Decoupling Capacitor Choice Component C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 Q1 Purpose VDDF filter capacitor VDDX4 filter capacitor (MAPBGA208, LQFP144 only VDDX2 filter capacitor VDDPLL filter capacitor OSC load capacitor OSC load capacitor VDDR filter capacitor VDDX3 filter capacitor (MAPBGA208, LQFP144 only VDD filter capacitor VDDA1 filter capacitor VDDX1 filter capacitor VDDX5 filter capacitor (MAPBGA208 package only) VDDX6 filter capacitor (MAPBGA208 package only) VDDX7 filter capacitor (MAPBGA208 package only) VDDA2 filter capacitor(MAPBGA208 package only) Quartz X7R/tantalum X7R/tantalum Ceramic X7R Ceramic X7R X7R/tantalum X7R/tantalum X7R/tantalum X7R/tantalum Ceramic X7R -- >=100 nF >=100 nF 220 nF >=100 nF >=100 nF >=100 nF >=100 nF >=100 nF >=100 nF -- Type Ceramic X7R X7R/tantalum X7R/tantalum Ceramic X7R Value 220 nF >=100 nF >=100 nF 220 nF From crystal manufacturer MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1261 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix C PCB Layout Guidelines Figure C-1. 144-Pin LQFP Recommended PCB Layout (Loop Controlled Pierce Oscillator) MC9S12XE-Family Reference Manual , Rev. 1.21 1262 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix C PCB Layout Guidelines Figure C-2. 112-Pin LQFP Recommended PCB Layout (Loop Controlled Pierce Oscillator) MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1263 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix C PCB Layout Guidelines Figure C-3. 80-Pin QFP Recommended PCB Layout (Loop Controlled Pierce Oscillator) MC9S12XE-Family Reference Manual , Rev. 1.21 1264 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix D Derivative Differences Appendix D Derivative Differences D.1 Memory Sizes and Package Options S12XE - Family Table D-1. Package and Memory Options of MC9S12XE-Family Device 9S12XEP100 Package 208 MAPBGA 144 LQFP 112 LQFP 208 MAPBGA 144 LQFP 112 LQFP 144 LQFP 112 LQFP 80 QFP 144 LQFP 112 LQFP 80 QFP 144 LQFP 112 LQFP 80 QFP 144 LQFP 112 LQFP 80 QFP 112 LQFP 80 QFP Flash RAM EEPROM D-Flash 1M 64K 9S12XEP768 768K 48K 9S12XEQ512 512K 32K 4K 384K 24K 32K 9S12XEQ384 9S12XEG384 9S12XES384 9S12XET256 9S12XEA256(1) 9S12XEG128 9S12XEA1281 384K 16K 256K 16K 128K 12K 2K 32K 1. The 9S12XEA128/256 are a special bondouts for access to extra ADC channels in 80QFP.Available in 80QFP / 256K/128K memory sizes only. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. The 9S12XET256/9S12XEG128 use the standard 80QFP bondout, compatible with other family members. MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1265 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix D Derivative Differences Table D-2. Peripheral Options of MC9S12XE-Family Members Device Package XGATE CAN SCI SPI IIC ECT TIM(1) PIT A/D I/O 9S12XEP100 9S12XEP768 208 MAPBGA 144LQFP 112LQFP 208 MAPBGA 144LQFP 112LQFP 144LQFP 112LQFP 80QFP 144LQFP 112LQFP 80QFP 144LQFP 112LQFP 80QFP 144LQFP 112LQFP 80QFP 144LQFP 112LQFP 80QFP 80QFP 112LQFP 80QFP 80QFP yes 5 5 5 5 5 5 4 4 4 4 4 4 2 2 2 1 1 1 3 3 3 3 2 2 2 8 8 8 8 8 8 6 6 2 6 6 2 6 6 2 2 2 2 4 4 2 2 2 2 2 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 1 1 1 3 3 3 3 2 2 2 2 2 1 2 2 1 2 1 1 2 1 1 2 1 1 2 1 1 1 1 1 1 1 1 1 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 8ch 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 8ch 8ch 8ch 8ch 8ch 8ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 2ch 2ch 2ch 2/32 2/24 2/162 2/32 2/24 2/16 (2) 152 119 91 152 119 91 119 91 59 119 91 59 119 91 59 119 91 59 119 91 59 59 91 59 59 9S12XEQ512 9S12XEQ384 9S12XEG384 2/24 2/162 2/82 2/24 2/162 2/82 2/24 2/162 2/82 2/24 2/162 2/82 2/24 2/162 2/82 2/122 1/16 1/8 2/122 9S12XES384 no 9S12XET256 9S12XEA256 (3) yes 9S12XEG128 9S12XEA1283 1. TIM available via rerouting on EP100,EP768 devices 112/144 pinout options. TIM not available on EG128,ET256,EA256, EQ384,EQ512 devices. 2. The device features 2 16-channel ATD modules, only one of which is bonded out in this package option 3. This is a special bondout for access to extra ADC channels in 80QFP. WARNING: NOT PIN-COMPATIBLE WITH REST OF FAMILY. The 9S12XET256/9S12XEG128 use the standard 80QFP bondouts, compatible with other family members. MC9S12XE-Family Reference Manual , Rev. 1.21 1266 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix D Derivative Differences D.2 * * * * Pinout explanations: Pinout compatibility is maintained throughout the device family A/D is the number of modules/total number of A/D channels. I/O is the sum of ports capable to act as digital input or output. . For additional flexibility especially for the low pin count packages several I/O functions can be routed under software control to different pins. For details refer to the device overview section.. Versions with 5 CAN modules will have CAN0, CAN1, CAN2, CAN3 and CAN4. Versions with 4 CAN modules will have CAN0, CAN1, CAN2 and CAN4. Versions with 3 CAN modules will have CAN0, CAN1 and CAN4. Versions with 2 CAN modules will have CAN0 and CAN4. Versions with 1 CAN module will have CAN0. Versions with 3 SPI modules will have SPI0, SPI1 and SPI2. Versions with 2 SPI modules will have SPI0 and SPI1. Versions with 1 SPI modules will have SPI0. Versions with 8 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4, SCI5, SCI6 and SCI7. Versions with 7 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4, SCI5, and SCI6. Versions with 6 SCI modules will have SCI0, SCI1, SCI2, SCI3, SCI4 and SCI5. Versions with 5 SCI modules will have SCI0, SCI1, SCI2, SCI3 and SCI4. Versions with 4 SCI modules will have SCI0, SCI1, SCI2 and SCI4. Versions with 3 SCI modules will have SCI0, SCI1 and SCI2. Versions with 2 SCI modules will have SCI0 and SCI1. Versions with 1 SCI module will have SCI0. Versions with 2 IIC modules will have IIC0 and IIC1. Versions with 1 IIC module will have IIC0. Versions with 1 ATD module will have ATD0. * * * * * * * * * * * * * * * * * * * MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1267 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map Appendix E Detailed Register Address Map The following tables show the detailed register map of the S12XE-Family. NOTE Smaller derivatives within the S12XE-Family feature a subset of the listed modules. Refer to Appendix D Derivative Differences for more information about derivative device module subsets. 0x0000-0x0009 Port Integration Module (PIM) Map 1 of 6 Address 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 0x0007 0x0008 0x0009 Name PORTA PORTB DDRA DDRB PORTC PORTD DDRC DDRD PORTE DDRE R W R W R W R W R W R W R W R W R W R W Bit 7 PA7 PB7 DDRA7 DDRB7 PC7 PD7 DDRC7 DDRD7 PE7 DDRE7 Bit 6 PA6 PB6 DDRA6 DDRB6 PC6 PD6 DDRC6 DDRD6 PE6 DDRE6 Bit 5 PA5 PB5 DDRA5 DDRB5 PC5 PD5 DDRC5 DDRD5 PE5 DDRE5 Bit 4 PA4 PB4 DDRA4 DDRB4 PC4 PD4 DDRC4 DDRD4 PE4 DDRE4 Bit 3 PA3 PB3 DDRA3 DDRB3 PC3 PD3 DDRC3 DDRD3 PE3 DDRE3 Bit 2 PA2 PB2 DDRA2 DDRB2 PC2 PD2 DDRC2 DDRD2 PE2 DDRE2 Bit 1 PA1 PB1 DDRA1 DDRB1 PC1 PD1 DDRC1 DDRD1 PE1 0 Bit 0 PA 0 PB0 DDRA0 DDRB0 PC0 PD0 DDRC0 DDRD0 PE0 0 0x000A-0x000B Module Mapping Control (S12XMMC) Map 1 of 2 Address 0x000A 0x000B Name MMCCTL0 MODE R W R W Bit 7 CS3E1 MODC Bit 6 CS2E1 MODB Bit 5 CS1E1 MODA Bit 4 CS0E1 0 Bit 3 CS3E0 0 Bit 2 CS2E0 0 Bit 1 CS1E0 0 Bit 0 CS0E0 0 0x000C-0x000D Port Integration Module (PIM) Map 2 of 6 Address 0x000C 0x000D Name PUCR RDRIV R W R W Bit 7 PUPKE RDPK Bit 6 BKPUE 0 Bit 5 0 0 Bit 4 PUPEE RDPE Bit 3 PUPDE RDPD Bit 2 PUPCE RDPC Bit 1 PUPBE RDPB Bit 0 PUPAE RDPA MC9S12XE-Family Reference Manual , Rev. 1.21 1268 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x000E-0x000F External Bus Interface (S12XEBI) Map Address 0x000E 0x000F Name EBICTL0 EBICTL1 R W R W Bit 7 ITHRS 0 Bit 6 0 Bit 5 HDBE Bit 4 ASIZ4 Bit 3 ASIZ3 0 Bit 2 ASIZ2 Bit 1 ASIZ1 Bit 0 ASIZ0 EXSTR12 EXSTR11 EXSTR10 EXSTR02 EXSTR01 EXSTR00 0x0010-0x0017 Module Mapping Control (S12XMMC) Map 2 of 2 Address 0x0010 0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 Name GPAGE DIRECT Reserved MMCCTL1 Reserved PPAGE RPAGE EPAGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 GP3 DP11 0 Bit 2 GP2 DP10 0 Bit 1 GP1 DP9 0 Bit 0 GP0 DP8 0 R 0 GP6 GP5 GP4 W R DP15 DP14 DP13 DP12 W R 0 0 0 0 W R TGMRAM MGROMO EEEIFRO PGMIFRO ON N N N W R 0 0 0 0 W R PIX7 PIX6 PIX5 PIX4 W R RP7 RP6 RP5 RP4 W R EP7 EP6 EP5 EP4 W RAMHM 0 EROMON 0 ROMHM 0 ROMON 0 PIX3 RP3 EP3 PIX2 RP2 EP2 PIX1 RP1 EP1 PIX0 RP0 EP0 0x0018-0x001B Miscellaneous Peripheral Address 0x0018 Name Reserved Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 0 R 0 0 0 0 0 0 0 W R 0 0 0 0 0 0 0 0x0019 Reserved W R 1 1 0 0 1 1 0 0x001A PARTIDH(1) W R 1 0 0 1 0 0 1 0x001B PARTIDL1 W 1. Refer to Part ID assignments in the device description section for a full list of S12XE-FamilyPart ID values. 0x001C-0x001D Port Integration Module (PIM) Map 3 of 6 Address 0x001C 0x001D Name ECLKCTL Reserved R W R W Bit 7 NECLK 0 Bit 6 NCLKX2 0 Bit 5 DIV16 0 Bit 4 EDIV4 0 Bit 3 EDIV3 0 Bit 2 EDIV2 0 Bit 1 EDIV1 0 Bit 0 EDIV0 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1269 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x001E-0x001F Port Integration Module (PIM) Map 3 of 6 Address 0x001E 0x001F Name IRQCR Reserved R W R W Bit 7 IRQE 0 Bit 6 IRQEN 0 Bit 5 0 0 Bit 4 0 0 Bit 3 0 0 Bit 2 0 0 Bit 1 0 0 Bit 0 0 0 0x0020-0x0027 Debug Module (S12XDBG) Map Address 0x0020 Name DBGC1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R 0 ARM XGSBPE BDM DBGBRK W TRIG R TBF EXTF 0 0 0 SSF2 0x0021 DBGSR W R 0x0022 DBGTCR TSOURCE TRANGE TRCMOD W R 0 0 0 0 0x0023 DBGC2 CDCM W R Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 0x0024 DBGTBH W R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 0x0025 DBGTBL W R 0 CNT 0x0026 DBGCNT W R 0 0 0 0 0x0027 DBGSCRX SC3 SC2 W R 0 0 0 0 MC3 MC2 0x0027 DBGMFR W R 0 DBGXCTL 0x0028 NDB TAG BRK RW RWE (1) (COMPA/C) W R DBGXCTL 0x0028 SZE SZ TAG BRK RW RWE (2) (COMPB/D) W R 0 0x0029 DBGXAH Bit 22 21 20 19 18 W R 0x002A DBGXAM Bit 15 14 13 12 11 10 W R 0x002B DBGXAL Bit 7 6 5 4 3 2 W R 0x002C DBGXDH Bit 15 14 13 12 11 10 W R 0x002D DBGXDL Bit 7 6 5 4 3 2 W R 0x002E DBGXDHM Bit 15 14 13 12 11 10 W R 0x002F DBGXDLM Bit 7 6 5 4 3 2 W 1. This represents the contents if the Comparator A or C control register is blended into this address 2. This represents the contents if the Comparator B or D control register is blended into this address COMRV SSF1 SSF0 TALIGN ABCM Bit 9 Bit 1 Bit 8 Bit 0 SC1 MC1 SC0 MC0 SRC SRC 17 9 1 9 1 9 1 COMPE COMPE Bit 16 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1270 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0030-0x0031 Reserved Register Space 0x0030 0x0031 Reserved Reserved R W R W 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x0032-0x0033 Port Integration Module (PIM) Map 4 of 6 Address 0x0032 0x0033 Name PORTK DDRK R W R W Bit 7 PK7 DDRK7 Bit 6 PK6 DDRK6 Bit 5 PK5 DDRK5 Bit 4 PK4 DDRK4 Bit 3 PK3 DDRK3 Bit 2 PK2 DDRK2 Bit 1 PK1 DDRK1 Bit 0 PK0 DDRK0 0x0034-0x003F Clock and Reset Generator (CRG) Map Address 0x0034 0x0035 0x0036 0x0037 0x0038 0x0039 0x003A 0x003B 0x003C 0x003D 0x003E 0x003F Name SYNR REFDV POSTDIV CRGFLG CRGINT CLKSEL PLLCTL RTICTL COPCTL FORBYP CTCTL ARMCOP R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit 6 Bit 5 SYNDIV5 REFDIV5 Bit 4 SYNDIV4 REFDIV4 Bit 3 SYNDIV3 REFDIV3 Bit 2 SYNDIV2 REFDIV2 Bit 1 SYNDIV1 REFDIV1 Bit 0 SYNDIV0 REFDIV0 VCOFRQ[1:0] REFFRQ[1:0] 0 0 0 LOCK 0 POSTDIV[4:0]] LOCKIF LOCKIE 0 ILAF 0 0 PRE RTR2 RTIF RTIE PLLSEL CME RTDEC PORF 0 LVRF 0 XCLKS SCMIF SCMIE RTIWAI PCE RTR1 SCM 0 PSTP PLLON RTR6 PLLWAI FSTWKP RTR3 COPWAI SCME RTR0 FM1 RTR5 FM0 RTR4 WCOP 0 0 0 Bit 7 RSBCK 0 0 0 6 0 WRTMASK 0 0 0 5 0 0 CR2 0 0 0 2 CR1 0 0 0 1 CR0 0 0 0 Bit 0 0 0 Reserved For Factory Test 0 Reserved For Factory Test 0 0 4 3 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1271 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0040-0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 1 of 3) Address 0x0040 0x0041 0x0042 0x0043 0x0044 0x0045 0x0046 0x0047 0x0048 0x0049 0x004A 0x004B 0x004C 0x004D 0x004E 0x004F 0x0050 0x0051 0x0052 0x0053 0x0054 0x0055 Name TIOS CFORC OC7M OC7D TCNT (high) TCNT (low) TSCR1 TTOV TCTL1 TCTL2 TCTL3 TCTL4 TIE TSCR2 TFLG1 TFLG2 TC0 (hi) TC0 (lo) TC1 (hi) TC1 (lo) TC2 (hi) TC2 (lo) Bit 7 R IOS7 W R 0 W FOC7 R OC7M7 W R OC7D7 W R TCNT15 W R TCNT7 W R TEN W R TOV7 W R OM7 W R OM3 W R EDG7B W R EDG3B W R C7I W R TOI W R C7F W R TOF W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W Bit 6 IOS6 0 FOC6 OC7M6 OC7D6 TCNT14 TCNT6 TSWAI TOV6 OL7 OL3 EDG7A EDG3A C6I 0 Bit 5 IOS5 0 FOC5 OC7M5 OC7D5 TCNT13 TCNT5 TSFRZ TOV5 OM6 OM2 EDG6B EDG2B C5I 0 Bit 4 IOS4 0 FOC4 OC7M4 OC7D4 TCNT12 TCNT4 TFFCA TOV4 OL6 OL2 EDG6A EDG2A C4I 0 Bit 3 IOS3 0 FOC3 OC7M3 OC7D3 TCNT11 TCNT3 PRNT TOV3 OM5 OM1 EDG5B EDG1B C3I TCRE C3F 0 Bit 2 IOS2 0 FOC2 OC7M2 OC7D2 TCNT10 TCNT2 0 Bit 1 IOS1 0 FOC1 OC7M1 OC7D1 TCNT9 TCNT1 0 Bit 0 IOS0 0 FOC0 OC7M0 OC7D0 TCNT8 TCNT0 0 TOV2 OL5 OL1 EDG5A EDG1A C2I PR2 C2F 0 TOV1 OM4 OM0 EDG4B EDG0B C1I PR1 C1F 0 TOV0 OL4 OL0 EDG4A EDG0A C0I PR0 C0F 0 C6F 0 C5F 0 C4F 0 14 6 14 6 14 6 13 5 13 5 13 5 12 4 12 4 12 4 11 3 11 3 11 3 10 2 10 2 10 2 9 1 9 1 9 1 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1272 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0040-0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 2 of 3) Address 0x0056 0x0057 0x0058 0x0059 0x005A 0x005B 0x005C 0x005D 0x005E 0x005F 0x0060 0x0061 0x0062 0x0063 0x0064 0x0065 0x0066 0x0067 0x0068 0x0069 0x006A 0x006B 0x006C Name TC3 (hi) TC3 (lo) TC4 (hi) TC4 (lo) TC5 (hi) TC5 (lo) TC6 (hi) TC6 (lo) TC7 (hi) TC7 (lo) PACTL PAFLG PACN3 (hi) PACN2 (lo) PACN1 (hi) PACN0 (lo) MCCTL MCFLG ICPAR DLYCT ICOVW ICSYS OCPD R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 Bit 15 Bit 7 0 0 PACNT7 (15) PACNT7 PACNT7 (15) PACNT7 MCZI MCZF 0 Bit 6 14 6 14 6 14 6 14 6 14 6 PAEN 0 PACNT6 (14) PACNT6 PACNT6 (14) PACNT6 MODMC 0 0 Bit 5 13 5 13 5 13 5 13 5 13 5 PAMOD 0 PACNT5 (13) PACNT5 PACNT5 (13) PACNT5 RDMCL 0 0 Bit 4 12 4 12 4 12 4 12 4 12 4 PEDGE 0 PACNT4 (12) PACNT4 PACNT4 (12) PACNT4 0 ICLAT 0 0 Bit 3 11 3 11 3 11 3 11 3 11 3 CLK1 0 PACNT3 (11) PACNT3 PACNT3 (11) PACNT3 0 FLMC POLF3 Bit 2 10 2 10 2 10 2 10 2 10 2 CLK0 0 PACNT2 (10) PACNT2 PACNT2 (10) PACNT2 MCEN POLF2 Bit 1 9 1 9 1 9 1 9 1 9 1 PAOVI PAOVF PACNT1 (9) PACNT1 PACNT1 (9) PACNT1 MCPR1 POLF1 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 PAI PAIF PACNT0 (8) PACNT0 PACNT0 (8) PACNT0 MCPR0 POLF0 PA3EN DLY3 NOVW3 TFMOD OCPD3 PA2EN DLY2 NOVW2 PACMX OCPD2 PA1EN DLY1 NOVW1 BUFEN OCPD1 PA0EN DLY0 NOVW0 LATQ OCPD0 DLY7 NOVW7 SH37 OCPD7 DLY6 NOVW6 SH26 OCPD6 DLY5 NOVW5 SH15 OCPD5 DLY4 NOVW4 SH04 OCPD4 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1273 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0040-0x007F Enhanced Capture Timer 16-Bit 8-Channels (ECT) Map (Sheet 3 of 3) Address 0x006D 0x006E 0x006F 0x0070 0x0071 0x0072 0x0073 0x0074 0x0075 0x0076 0x0077 0x0078 0x0079 0x007A 0x007B 0x007C 0x007D 0x007E 0x007F Name TIMTST PTPSR PTMCPSR PBCTL PBFLG PA3H PA2H PA1H PA0H MCCNT (hi) MCCNT (lo) TC0H (hi) TC0H (lo) TC1H (hi) TC1H (lo) TC2H (hi) TC2H (lo) TC3H (hi) TC3H (lo) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 R 0 0 0 0 0 0 0 W Reserved For Factory Test R PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 W R PTMPS7 PTMPS6 PTMPS5 PTMPS4 PTMPS3 PTMPS2 PTMPS1 W R 0 0 0 0 0 PBEN PBOVI W R 0 0 0 0 0 0 PBOVF W R PA3H7 PA3H6 PA3H5 PA3H4 PA3H3 PA3H2 PA3H1 W R PA2H7 PA2H6 PA2H5 PA2H4 PA2H3 PA2H2 PA2H1 W R PA1H7 PA1H6 PA1H5 PA1H4 PA1H3 PA1H2 PA1H1 W R PA0H7 PA0H6 PA0H5 PA0H4 PA0H3 PA0H2 PA0H1 W R MCCNT15 MCCNT14 MCCNT13 MCCNT12 MCCNT11 MCCNT10 MCCNT9 W R MCCNT7 MCCNT6 MCCNT5 MCCNT4 MCCNT3 MCCNT2 MCCNT1 W R TC15 TC14 TC13 TC12 TC11 TC10 TC9 W R TC7 TC6 TC5 TC4 TC3 TC2 TC1 W R TC15 TC14 TC13 TC12 TC11 TC10 TC9 W R TC7 TC6 TC5 TC4 TC3 TC2 TC1 W R TC15 TC14 TC13 TC12 TC11 TC10 TC9 W R TC7 TC6 TC5 TC4 TC3 TC2 TC1 W R TC15 TC14 TC13 TC12 TC11 TC10 TC9 W R TC7 TC6 TC5 TC4 TC3 TC2 TC1 W PTPS0 PTMPS0 0 0 PA3H0 PA2H0 PA1H 0 PA0H0 MCCNT8 MCCNT0 TC8 TC0 TC8 TC0 TC8 TC0 TC8 TC0 MC9S12XE-Family Reference Manual , Rev. 1.21 1274 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0080-0x00AF Analog-to-Digital Converter 12-bit 16-Channels (ATD1) Map (Sheet 1 of 3) Address 0x0080 0x0081 0x0082 0x0083 0x0084 0x0085 0x0086 0x0087 0x0088 0x0089 0x008A 0x008B 0x008C 0x008D Name ATD1CTL0 ATD1CTL1 ATD1CTL2 ATD1CTL3 ATD1CTL4 ATD1CTL5 ATD1STAT0 Reserved ATD1CMPEH ATD1CMPEL ATD1STAT2H ATD1STATL ATD1DIENH ATD1DIENL Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 WRAP1 ETRIG CH1 ASCIE FRZ1 PRS1 CB CC1 0 Bit 0 WRAP0 ETRIG CH0 ACMPIE FRZ0 PRS0 CA CC0 0 R 0 0 0 0 WRAP3 WRAP2 W R ETRIG ETRIG ETRIG SRES1 SRES0 SMP_DIS SEL CH3 CH2 W R 0 AFFC ICLKSTP ETRIGLE ETRIGP ETRIGE W R DJM S8C S4C S2C S1C FIFO W R SMP2 SMP1 SMP0 PRS4 PRS3 PRS2 W R 0 SC SCAN MULT CD CC W R 0 CC3 CC2 SCF ETORF FIFOR W R 0 0 0 0 0 0 W R CMPE15 CMPE14 CMPE13 CMPE12 CMPE11 CMPE10 W R CMPE7 CMPE6 CMPE5 CMPE4 CMPE3 CMPE2 W R CCF15 CCF14 CCF13 CCF12 CCF11 CCF10 W R CCF7 CCF6 CCF5 CCF4 CCF3 CCF2 W R IEN15 IEN14 IEN13 IEN12 IEN11 IEN10 W R IEN7 IEN6 IEN5 IEN4 IEN3 IEN2 W R CMPHT15 CMPHT14 CMPHT13 CMPHT12 CMPHT11 CMPHT10 W R CMPHT7 CMPHT6 CMPHT5 CMPHT4 CMPHT3 CMPHT2 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W CMPE9 CMPE1 CCF9 CCF1 CMPE8 CMPE0 CCF8 CCF0 IEN9 IEN1 CMPHT9 CMPHT1 9 0 9 0 9 0 IEN8 IEN0 CMPHT8 CMPHT0 Bit8 0 Bit8 0 Bit8 0 0x008E ATD1CMPHTH 0x008F ATD1CMPHTL 0x0090 0x0091 0x0092 0x0093 0x0094 0x0095 ATD1DR0H ATD1DR0L ATD1DR1H ATD1DR1L ATD1DR2H ATD1DR2L MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1275 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0080-0x00AF Analog-to-Digital Converter 12-bit 16-Channels (ATD1) Map (Sheet 2 of 3) Address 0x0096 0x0097 0x0098 0x0099 0x009A 0x009B 0x009C 0x009D 0x009E 0x009F 0x00A0 0x00A1 0x00A2 0x00A3 0x00A4 0x00A5 0x00A6 0x00A7 0x00A8 0x00A9 0x00AA 0x00AB Name ATD1DR3H ATD1DR3L ATD1DR4H ATD1DR4L ATD1DR5H ATD1DR5L ATD1DR6H ATD1DR6L ATD1DR7H ATD1DR7L ATD1DR8H ATD1DR8L ATD1DR9H ATD1DR9L ATD1DR10H ATD1DR10L ATD1DR11H ATD1DR11L ATD1DR12H ATD1DR12L ATD1DR13H ATD1DR13L R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit 6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 Bit 5 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 Bit 4 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 Bit 3 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 Bit 2 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 Bit 1 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 Bit 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1276 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0080-0x00AF Analog-to-Digital Converter 12-bit 16-Channels (ATD1) Map (Sheet 3 of 3) Address 0x00AC 0x00AD 0x00AE 0x00AF Name ATD1DR14H R W R ATD1DR14L W R ATD1DR15H W R ATD1DR15L W Bit 7 Bit15 Bit7 Bit15 Bit7 Bit 6 14 Bit6 14 Bit6 Bit 5 13 0 13 0 Bit 4 12 0 12 0 Bit 3 11 0 11 0 Bit 2 10 0 10 0 Bit 1 9 0 9 0 Bit 0 Bit8 0 Bit8 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1277 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00B0-0x00B7 Inter IC Bus (IIC1) Map Address 0x00B0 0x00B1 0x00B2 0x00B3 0x00B4 0x00B5 0x00B6 0x00B7 Name IBAD IBFD IBCR IBSR IBDR IBCR2 Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 ADR7 IBC7 IBEN TCF Bit 6 ADR6 IBC6 IBIE IAAS Bit 5 ADR5 IBC5 MS/SL IBB Bit 4 ADR4 IBC4 TX/RX IBAL D4 0 0 0 Bit 3 ADR3 IBC3 TXAK 0 Bit 2 ADR2 IBC2 0 RSTA SRW Bit 1 ADR1 IBC1 0 Bit 0 0 IBC0 IBSWAI RXAK IBIF D1 ADR9 0 0 D7 GCEN 0 0 D6 ADTYPE 0 0 D5 0 0 0 D3 0 0 0 D2 ADR10 0 0 D0 ADR8 0 0 0x00B8-0x00BF Asynchronous Serial Interface (SCI2) Map Address 0x00B8 Name SCI2BDH(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF RAF 0 R0 T0 R IREN TNP1 TNP0 SBR12 SBR11 W R SBR7 SBR6 SBR5 SBR4 SBR3 0x00B9 SCI2BDL1 W R LOOPS SCISWAI RSRC M WAKE 0x00BA SCI2CR11 W R 0 0 0 0 RXEDGIF 0x00B8 SCI2ASR1(2) W R 0 0 0 0 RXEDGIE 0x00B9 SCI2ACR12 W R 0 0 0 0 0 0x00BA SCI2ACR22 W R 0x00BB SCI2CR2 TIE TCIE RIE ILIE TE W R TDRE TC RDRF IDLE OR 0x00BC SCI2SR1 W R 0 0 0x00BD SCI2SR2 AMAP TXPOL RXPOL W R R8 0 0 0 0x00BE SCI2DRH T8 W R R7 R6 R5 R4 R3 0x00BF SCI2DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI2SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI2SR2 register is set to one BERRM1 RE NF BRK13 0 R2 T2 TXDIR 0 R1 T1 MC9S12XE-Family Reference Manual , Rev. 1.21 1278 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00C0-0x00C7 Asynchronous Serial Interface (SCI3) Map Address 0x00C0 0x00C1 0x00C2 0x00C0 0x00C1 Name SCI3BDH(1) Bit 7 Bit 6 TNP1 SBR6 SCISWAI 0 Bit 5 TNP0 SBR5 RSRC 0 Bit 4 SBR12 SBR4 M 0 Bit 3 SBR11 SBR3 WAKE 0 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF RAF 0 R0 T0 R IREN W R SCI3BDL1 SBR7 W R LOOPS SCI3CR11 W R SCI3ASR1(2) RXEDGIF W SCI3ACR12 R 0 0 0 0 RXEDGIE W R 0 0 0 0 0 0x00C2 SCI3ACR22 W R 0x00C3 SCI3CR2 TIE TCIE RIE ILIE TE W R TDRE TC RDRF IDLE OR 0x00C4 SCI3SR1 W R 0 0 0x00C5 SCI3SR2 AMAP TXPOL RXPOL W R R8 0 0 0 0x00C6 SCI3DRH T8 W R R7 R6 R5 R4 R3 0x00C7 SCI3DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI3SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI3SR2 register is set to one BERRM1 RE NF BRK13 0 R2 T2 TXDIR 0 R1 T1 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1279 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00C8-0x00CF Asynchronous Serial Interface (SCI0) Map Address 0x00C8 Name SCI0BDH(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF RAF 0 R0 T0 R IREN TNP1 TNP0 SBR12 SBR11 W R SBR7 SBR6 SBR5 SBR4 SBR3 0x00C9 SCI0BDL1 W R LOOPS SCISWAI RSRC M WAKE 0x00CA SCI0CR11 W R 0 0 0 0 RXEDGIF 0x00C8 SCI0ASR1(2) W R 0 0 0 0 RXEDGIE 0x00C9 SCI0ACR12 W R 0 0 0 0 0 0x00CA SCI0ACR22 W R 0x00CB SCI0CR2 TIE TCIE RIE ILIE TE W R TDRE TC RDRF IDLE OR 0x00CC SCI0SR1 W R 0 0 0x00CD SCI0SR2 AMAP TXPOL RXPOL W R R8 0 0 0 0x00CE SCI0DRH T8 W R R7 R6 R5 R4 R3 0x00CF SCI0DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI0SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI0SR2 register is set to one BERRM1 RE NF BRK13 0 R2 T2 TXDIR 0 R1 T1 0x00D0-0x00D7 Asynchronous Serial Interface (SCI1) Map Address 0x00D0 0x00D1 0x00D2 0x00D0 0x00D1 0x00D2 0x00D3 0x00D4 Name SCI1BDH(1) Bit 7 Bit 6 TNP1 SBR6 SCISWAI 0 0 0 Bit 5 TNP0 SBR5 RSRC 0 0 0 Bit 4 SBR12 SBR4 M 0 0 0 Bit 3 SBR11 SBR3 WAKE 0 0 0 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF R IREN W R SBR7 SCI1BDL1 W R LOOPS SCI1CR11 W R RXEDGIF SCI1ASR1(2) W R RXEDGIE SCI1ACR12 W R 0 SCI1ACR22 W R SCI1CR2 TIE W R TDRE SCI1SR1 W BERRM1 RE NF TCIE TC RIE RDRF ILIE IDLE TE OR MC9S12XE-Family Reference Manual , Rev. 1.21 1280 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00D0-0x00D7 Asynchronous Serial Interface (SCI1) Map (continued) Address 0x00D5 Name SCI1SR2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 BRK13 0 R2 T2 Bit 1 TXDIR 0 R1 T1 Bit 0 RAF 0 R0 T0 R 0 0 AMAP TXPOL RXPOL W R R8 0 0 0 0x00D6 SCI1DRH T8 W R R7 R6 R5 R4 R3 0x00D7 SCI1DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI1SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI1SR2 register is set to one 0x00D8-0x00DF Serial Peripheral Interface (SPI0) Map Address 0x00D8 0x00D9 0x00DA 0x00DB 0x00DC 0x00DD 0x00DE 0x00DF Name SPI0CR1 SPI0CR2 SPI0BR SPI0SR SPI0DRH SPI0DRL Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 SPIE 0 0 SPIF R15 T15 R7 T7 0 0 Bit 6 SPE XFRW SPPR2 0 R14 T14 R6 T6 0 0 Bit 5 SPTIE 0 Bit 4 MSTR MODFEN SPPR0 MODF R12 T12 R4 T4 0 0 Bit 3 CPOL BIDIROE 0 0 R11 T11 R3 T3 0 0 Bit 2 CPHA 0 Bit 1 SSOE SPISWAI SPR1 0 R9 T9 R1 T1 0 0 Bit 0 LSBFE SPC0 SPR0 0 R8 T8 R0 T0 0 0 SPPR1 SPTEF R13 T13 R5 T5 0 0 SPR2 0 R10 T10 R2 T2 0 0 0x00E0-0x00E7 Inter IC Bus (IIC0) Map Address 0x00E0 0x00E1 0x00E2 0x00E3 0x00E4 Name IBAD IBFD IBCR IBSR IBDR R W R W R W R W R W Bit 7 ADR7 IBC7 IBEN TCF Bit 6 ADR6 IBC6 IBIE IAAS Bit 5 ADR5 IBC5 MS/SL IBB Bit 4 ADR4 IBC4 TX/RX IBAL D4 Bit 3 ADR3 IBC3 TXAK 0 Bit 2 ADR2 IBC2 0 RSTA SRW Bit 1 ADR1 IBC1 0 Bit 0 0 IBC0 IBSWAI RXAK IBIF D1 D7 D6 D5 D3 D2 D0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1281 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00E0-0x00E7 Inter IC Bus (IIC0) Map (continued) Address 0x00E5 0x00E6 0x00E7 Name IBCR2 Reserved Reserved R W R W R W Bit 7 GCEN 0 0 Bit 6 ADTYPE 0 0 Bit 5 0 0 0 Bit 4 0 0 0 Bit 3 0 0 0 Bit 2 ADR10 0 0 Bit 1 ADR9 0 0 Bit 0 ADR8 0 0 0x00E8-0x00EF Reserved Address 0x00E8 0x00E9 0x00EA 0x00EB 0x00EC 0x00ED 0x00EE 0x00EF Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 0 0 0 0 0 0 0 0 Bit 6 0 0 0 0 0 0 0 0 Bit 5 0 0 0 0 0 0 0 0 Bit 4 0 0 0 0 0 0 0 0 Bit 3 0 0 0 0 0 0 0 0 Bit 2 0 0 0 0 0 0 0 0 Bit 1 0 0 0 0 0 0 0 0 Bit 0 0 0 0 0 0 0 0 0 0x00F0-0x00F7 Serial Peripheral Interface (SPI1) Map Address 0x00F0 0x00F1 0x00F2 0x00F3 0x00F4 0x00F5 0x00F6 0x00F7 Name SPI1CR1 SPI1CR2 SPI1BR SPI1SR SPI1DRH SPI1DRL Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 SPIE 0 0 SPIF R15 T15 R7 T7 0 0 Bit 6 SPE XFRW SPPR2 0 R14 T14 R6 T6 0 0 Bit 5 SPTIE 0 Bit 4 MSTR MODFEN SPPR0 MODF R12 T12 R4 T4 0 0 Bit 3 CPOL BIDIROE 0 0 R11 T11 R3 T3 0 0 Bit 2 CPHA 0 Bit 1 SSOE SPISWAI SPR1 0 R9 T9 R1 T1 0 0 Bit 0 LSBFE SPC0 SPR0 0 R8 T8 R0 T0 0 0 SPPR1 SPTEF R13 T13 R5 T5 0 0 SPR2 0 R10 T10 R2 T2 0 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1282 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00F8-0x00FF Serial Peripheral Interface (SPI2) Map Address 0x00F8 0x00F9 0x00FA 0x00FB 0x00FC 0x00FD 0x00FE 0x00FF Name SPI2CR1 SPI2CR2 SPI2BR SPI2SR SPI2DRH SPI2DRL Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 SPIE 0 0 SPIF R15 T15 R7 T7 0 0 Bit 6 SPE XFRW SPPR2 0 R14 T14 R6 T6 0 0 Bit 5 SPTIE 0 Bit 4 MSTR MODFEN SPPR0 MODF R12 T12 R4 T4 0 0 Bit 3 CPOL BIDIROE 0 0 R11 T11 R3 T3 0 0 Bit 2 CPHA 0 Bit 1 SSOE SPISWAI SPR1 0 R9 T9 R1 T1 0 0 Bit 0 LSBFE SPC0 SPR0 0 R8 T8 R0 T0 0 0 SPPR1 SPTEF R13 T13 R5 T5 0 0 SPR2 0 R10 T10 R2 T2 0 0 0x0100-0x0113 NVM Control Register (FTM) Map Address 0x0100 0x0101 0x0102 0x0103 0x0104 0x0105 0x0106 0x0107 0x0108 0x0109 0x010A 0x010B Name FCLKDIV FSEC FCCOBIX FECCRIX FCNFG FERCNFG FSTAT FERSTAT FPROT EPROT FCCOBHI FCCOBLO R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 FDIVLD KEYEN1 0 0 Bit 6 FDIV6 KEYEN0 0 0 0 Bit 5 FDIV5 RNV5 0 0 0 Bit 4 FDIV4 RNV4 0 0 Bit 3 FDIV3 RNV3 0 0 0 Bit 2 FDIV2 RNV2 Bit 1 FDIV1 SEC1 Bit 0 FDIV0 SEC0 CCOBIX2 ECCRIX2 0 CCOBIX1 ECCRIX1 FDFD DFDIE CCOBIX0 ECCRIX0 FSFD SFDIE CCIE IGNSF ERSERIE PGMERIE EACCEIE EPVIOLIE CCIF 0 ACCERR 0 FPVIOL EPVIOLIF FPHS1 RNV4 ERSVIE1 MGBUSY ERSVIE0 RSVD MGSTAT1 MGSTAT0 ERSERIF PGMERIF FPOPEN EPOPEN CCOB15 CCOB7 RNV6 RNV6 ERSVIF1 FPHS0 EPDIS CCOB11 CCOB3 ERSVIF0 FPLDIS EPS2 CCOB10 CCOB2 DFDIF FPLS1 EPS1 CCOB9 CCOB1 SFDIF FPLS0 EPS0 CCOB8 CCOB0 FPHDIS RNV5 CCOB14 CCOB6 CCOB13 CCOB5 CCOB12 CCOB4 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1283 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0100-0x0113 NVM Control Register (FTM) Map (continued) Address 0x010C 0x010D 0x010E 0x010F 0x0110 0x0111 0x0112 0x0113 Name ETAGHI ETAGLO FECCRHI FECCRLO FOPT Reserved Reserved Reserved Bit 7 R ETAG15 W R ETAG7 W R ECCR15 W R ECCR7 W R NV7 W R 0 W R 0 W R 0 W Bit 6 ETAG14 ETAG6 ECCR14 ECCR6 NV6 0 0 0 Bit 5 ETAG13 ETAG5 ECCR13 ECCR5 NV5 0 0 0 Bit 4 ETAG12 ETAG4 ECCR12 ECCR4 NV4 0 0 0 Bit 3 ETAG11 ETAG3 ECCR11 ECCR3 NV3 0 0 0 Bit 2 ETAG10 ETAG2 ECCR10 ECCR2 NV2 0 0 0 Bit 1 ETAG9 ETAG1 ECCR9 ECCR1 NV1 0 0 0 Bit 0 ETAG8 ETAG0 ECCR8 ECCR0 NV0 0 0 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1284 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0114-0x011F Memory Protection Unit (MPU) Map Address 0x0114 Name MPUFLG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 R WPF NEXF 0 0 0 0 SVSF AEF W R 0 ADDR[22:16] 0x0115 MPUASTAT0 W R ADDR[15:8] 0x0116 MPUASTAT1 W R ADDR[7:0] 0x0117 MPUASTAT2 W R 0 0 0 0 0 0 0 0 0x0118 Reserved W R 0 0 0 0 0x0119 MPUSEL SVSEN SEL[2:0] W R MSTR0 MSTR1 MSTR2 MSTR3 LOW_ADDR[22:19] 0x011A MPUDESC0(1) W R 0x011B MPUDESC11 LOW_ADDR[18:11] W R LOW_ADDR[10:3] 0x011C MPUDESC21 W R 0 0 WP NEX HIGH_ADDR[22:19] 0x011D MPUDESC31 W R HIGH_ADDR[18:11] 0x011E MPUDESC41 W R HIGH_ADDR[10:3] 0x011F MPUDESC51 W 1. The module addresses 0x03C6-0x03CB represent a window in the register map through which different descriptor registers are visible. 0x0120-0x012F Interrupt Module (S12XINT) Map Address 0x0120 0x0121 0x0122 0x0123 0x0124 0x0125 0x0126 0x0127 Name R W R IVBR W R Reserved W R Reserved W R Reserved W R Reserved W R INT_XGPRIO W R INT_CFADDR W Reserved Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 IVB_ADDR[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XILVL[2:0] 0 0 INT_CFADDR[7:4] MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1285 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0120-0x012F Interrupt Module (S12XINT) Map (continued) Address Name R W R W R W R W R W R W R W R W Bit 7 RQST RQST RQST RQST RQST RQST RQST RQST Bit 6 0 0 0 0 0 0 0 0 Bit 5 0 0 0 0 0 0 0 0 Bit 4 0 0 0 0 0 0 0 0 Bit 3 0 0 0 0 0 0 0 0 Bit 2 Bit 1 PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] PRIOLVL[2:0] Bit 0 0x0128 INT_CFDATA0 0x0129 INT_CFDATA1 0x012A INT_CFDATA2 0x012B INT_CFDATA3 0x012C INT_CFDATA4 0x012D INT_CFDATA5 0x012E INT_CFDATA6 0x012F INT_CFDATA7 MC9S12XE-Family Reference Manual , Rev. 1.21 1286 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00130-0x0137 Asynchronous Serial Interface (SCI4) Map Address 0x0130 Name SCI4BDH(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF RAF 0 R0 T0 R IREN TNP1 TNP0 SBR12 SBR11 W R SBR7 SBR6 SBR5 SBR4 SBR3 0x0131 SCI4BDL1 W R LOOPS SCISWAI RSRC M WAKE 0x0132 SCI4CR11 W R 0 0 0 0 RXEDGIF 0x0130 SCI4ASR1(2) W R 0 0 0 0 RXEDGIE 0x0131 SCI4ACR12 W R 0 0 0 0 0 0x0132 SCI4ACR22 W R 0x0133 SCI4CR2 TIE TCIE RIE ILIE TE W R TDRE TC RDRF IDLE OR 0x0134 SCI4SR1 W R 0 0 0x0135 SCI4SR2 AMAP TXPOL RXPOL W R R8 0 0 0 0x0136 SCI4DRH T8 W R R7 R6 R5 R4 R3 0x0137 SCI4DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI4SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI4SR2 register is set to one BERRM1 RE NF BRK13 0 R2 T2 TXDIR 0 R1 T1 0x0138-0x013F Asynchronous Serial Interface (SCI5) Map Address 0x0138 0x0139 0x013A 0x0138 0x0139 0x013A 0x013B 0x013C Name SCI5BDH(1) Bit 7 Bit 6 TNP1 SBR6 SCISWAI 0 0 0 Bit 5 TNP0 SBR5 RSRC 0 0 0 Bit 4 SBR12 SBR4 M 0 0 0 Bit 3 SBR11 SBR3 WAKE 0 0 0 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF R IREN W R SBR7 SCI5BDL1 W R LOOPS SCI5CR11 W R RXEDGIF SCI5ASR1(2) W R RXEDGIE SCI5ACR12 W R 0 SCI5ACR22 W R SCI5CR2 TIE W R TDRE SCI5SR1 W BERRM1 RE NF TCIE TC RIE RDRF ILIE IDLE TE OR MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1287 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0138-0x013F Asynchronous Serial Interface (SCI5) Map (continued) Address 0x013D Name SCI5SR2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 BRK13 0 R2 T2 Bit 1 TXDIR 0 R1 T1 Bit 0 RAF 0 R0 T0 R 0 0 AMAP TXPOL RXPOL W R R8 0 0 0 0x013E SCI5DRH T8 W R R7 R6 R5 R4 R3 0x013F SCI5DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI5SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI5SR2 register is set to one 0x0140-0x017F MSCAN (CAN0) Map Address 0x0140 0x0141 0x0142 0x0143 0x0144 0x0145 0x0146 0x0147 0x0148 0x0149 0x014A 0x014B 0x014C 0x014D 0x014E 0x014F Name CAN0CTL0 CAN0CTL1 CAN0BTR0 CAN0BTR1 CAN0RFLG CAN0RIER CAN0TFLG CAN0TIER CAN0TARQ CAN0TAAK CAN0TBSEL CAN0IDAC Reserved CAN0MISC CAN0RXERR CAN0TXERR Bit 7 R RXFRM W R CANE W R SJW1 W R SAMP W R WUPIF W R WUPIE W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R RXERR7 W R TXERR7 W R AC7 W Bit 6 RXACT Bit 5 CSWAI LOOPB BRP5 TSEG21 RSTAT1 Bit 4 SYNCH Bit 3 TIME BORM BRP3 TSEG13 TSTAT1 Bit 2 WUPE WUPM BRP2 TSEG12 TSTAT0 Bit 1 SLPRQ SLPAK Bit 0 INITRQ INITAK CLKSRC SJW0 TSEG22 CSCIF CSCIE 0 0 0 0 0 0 0 0 RXERR6 TXERR6 LISTEN BRP4 TSEG20 RSTAT0 BRP1 TSEG11 OVRIF OVRIE TXE1 TXEIE1 ABTRQ1 ABTAK1 BRP0 TSEG10 RXF RXFIE TXE0 TXEIE0 ABTRQ0 ABTAK0 RSTATE1 0 0 0 0 0 RSTATE0 0 0 0 0 0 TSTATE1 0 0 0 0 0 0 0 0 RXERR3 TXERR3 TSTATE0 TXE2 TXEIE2 ABTRQ2 ABTAK2 TX2 IDHIT2 0 0 RXERR2 TXERR2 TX1 IDHIT1 0 0 RXERR1 TXERR1 TX0 IDHIT0 0 IDAM1 0 0 RXERR5 TXERR5 IDAM0 0 0 RXERR4 TXERR4 BOHOLD RXERR0 TXERR0 0x0150- CAN0IDAR0- 0x0153 CAN0IDAR3 AC6 AC5 AC4 AC3 AC2 AC1 AC0 MC9S12XE-Family Reference Manual , Rev. 1.21 1288 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0140-0x017F MSCAN (CAN0) Map (continued) Address Name Bit 7 AM7 AC7 AM7 Bit 6 AM6 AC6 AM6 Bit 5 AM5 AC5 AM5 Bit 4 AM4 AC4 AM4 Bit 3 AM3 AC3 AM3 Bit 2 AM2 AC2 AM2 Bit 1 AM1 AC1 AM1 Bit 0 AM0 AC0 AM0 0x0154- CAN0IDMR0- R 0x0157 CAN0IDMR3 W 0x0158- CAN0IDAR4- R 0x015B CAN0IDAR7 W 0x015C R CAN0IDMR4- - W CAN0IDMR7 0x015F R 0x0160- CAN0RXFG 0x016F W R 0x0170- CAN0TXFG 0x017F W FOREGROUND RECEIVE BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) FOREGROUND TRANSMIT BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) Detailed MSCAN Foreground Receive and Transmit Buffer Layout Address 0xXXX0 Name R R W R R W R R W R R W R CANxRDSR0- W CANxRDSR7 CANRxDLR Extended ID Standard ID CANxRIDR0 Extended ID Standard ID CANxRIDR1 Extended ID Standard ID CANxRIDR2 Extended ID Standard ID CANxRIDR3 Bit 7 ID28 ID10 ID20 ID2 ID14 Bit 6 ID27 ID9 ID19 ID1 ID13 Bit 5 ID26 ID8 ID18 ID0 ID12 Bit 4 ID25 ID7 SRR=1 RTR ID11 Bit 3 ID24 ID6 IDE=1 IDE=0 ID10 Bit 2 ID23 ID5 ID17 Bit 1 ID22 ID4 ID16 Bit 0 ID21 ID3 ID15 0xXXX1 ID9 ID8 ID7 0xXXX2 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR 0xXXX3 0xXXX4 - 0xXXXB 0xXXXC DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 R W R 0xXXXD Reserved W R 0xXXXE CANxRTSRH W R 0xXXXF CANxRTSRL W Extended ID R CANxTIDR0 W 0xXX10 Standard ID R W DLC3 DLC2 DLC1 DLC0 TSR15 TSR7 TSR14 TSR6 TSR13 TSR5 TSR12 TSR4 TSR11 TSR3 TSR10 TSR2 TSR9 TSR1 TSR8 TSR0 ID28 ID10 ID27 ID9 ID26 ID8 ID25 ID7 ID24 ID6 ID23 ID5 ID22 ID4 ID21 ID3 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1289 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map Detailed MSCAN Foreground Receive and Transmit Buffer Layout (continued) Address 0xXX0x XX10 Name R W R W Extended ID R CANxTIDR2 W Standard ID R W Extended ID R CANxTIDR3 W Standard ID R W R CANxTDSR0- W CANxTDSR7 R W R CANxTTBPR W R CANxTTSRH W R CANxTTSRL W CANxTDLR Extended ID CANxTIDR1 Standard ID Bit 7 ID20 ID2 ID14 Bit 6 ID19 ID1 ID13 Bit 5 ID18 ID0 ID12 Bit 4 SRR=1 RTR ID11 Bit 3 IDE=1 IDE=0 ID10 ID9 ID8 ID7 Bit 2 ID17 Bit 1 ID16 Bit 0 ID15 0xXX12 ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR 0xXX13 0xXX14 - 0xXX1B 0xXX1C 0xXX1D 0xXX1E 0xXX1F DB7 DB6 DB5 DB4 DB3 DLC3 DB2 DLC2 PRIO2 TSR10 TSR2 DB1 DLC1 PRIO1 TSR9 TSR1 DB0 DLC0 PRIO0 TSR8 TSR0 PRIO7 TSR15 TSR7 PRIO6 TSR14 TSR6 PRIO5 TSR13 TSR5 PRIO4 TSR12 TSR4 PRIO3 TSR11 TSR3 MC9S12XE-Family Reference Manual , Rev. 1.21 1290 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0180-0x01BF MSCAN (CAN1) Map (Sheet 1 of 2) Address 0x0180 0x0181 0x0182 0x0183 0x0184 0x0185 0x0186 0x0187 0x0188 0x0189 0x018A 0x018B 0x018C 0x018D 0x018E 0x018F 0x0190 0x0191 0x0192 0x0193 0x0194 0x0195 Name CAN1CTL0 CAN1CTL1 CAN1BTR0 CAN1BTR1 CAN1RFLG CAN1RIER CAN1TFLG CAN1TIER CAN1TARQ CAN1TAAK CAN1TBSEL CAN1IDAC Reserved CAN1MISC CAN1RXERR CAN1TXERR CAN1IDAR0 CAN1IDAR1 CAN1IDAR2 CAN1IDAR3 CAN1IDMR0 CAN1IDMR1 Bit 7 R RXFRM W R CANE W R SJW1 W R SAMP W R WUPIF W R WUPIE W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R RXERR7 W R TXERR7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W Bit 6 RXACT Bit 5 CSWAI LOOPB BRP5 TSEG21 RSTAT1 Bit 4 SYNCH Bit 3 TIME BORM BRP3 TSEG13 TSTAT1 Bit 2 WUPE WUPM BRP2 TSEG12 TSTAT0 Bit 1 SLPRQ SLPAK Bit 0 INITRQ INITAK CLKSRC SJW0 TSEG22 CSCIF CSCIE 0 0 0 0 0 0 0 0 RXERR6 TXERR6 LISTEN BRP4 TSEG20 RSTAT0 BRP1 TSEG11 OVRIF OVRIE TXE1 TXEIE1 ABTRQ1 ABTAK1 BRP0 TSEG10 RXF RXFIE TXE0 TXEIE0 ABTRQ0 ABTAK0 RSTATE1 0 0 0 0 0 RSTATE0 0 0 0 0 0 TSTATE1 0 0 0 0 0 0 0 0 RXERR3 TXERR3 TSTATE0 TXE2 TXEIE2 ABTRQ2 ABTAK2 TX2 IDHIT2 0 0 RXERR2 TXERR2 TX1 IDHIT1 0 0 RXERR1 TXERR1 TX0 IDHIT0 0 IDAM1 0 0 RXERR5 TXERR5 IDAM0 0 0 RXERR4 TXERR4 BOHOLD RXERR0 TXERR0 AC6 AC6 AC6 AC6 AM6 AM6 AC5 AC5 AC5 AC5 AM5 AM5 AC4 AC4 AC4 AC4 AM4 AM4 AC3 AC3 AC3 AC3 AM3 AM3 AC2 AC2 AC2 AC2 AM2 AM2 AC1 AC1 AC1 AC1 AM1 AM1 AC0 AC0 AC0 AC0 AM0 AM0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1291 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0180-0x01BF MSCAN (CAN1) Map (Sheet 2 of 2) Address 0x0196 0x0197 0x0198 0x0199 0x019A 0x019B 0x019C 0x019D 0x019E 0x019F 0x01A0- 0x01AF 0x01B0- 0x01BF Name CAN1IDMR2 CAN1IDMR3 CAN1IDAR4 CAN1IDAR5 CAN1IDAR6 CAN1IDAR7 CAN1IDMR4 CAN1IDMR5 CAN1IDMR6 CAN1IDMR7 R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 AM7 AM7 AC7 AC7 AC7 AC7 AM7 AM7 AM7 AM7 Bit 6 AM6 AM6 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AM6 Bit 5 AM5 AM5 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AM5 Bit 4 AM4 AM4 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AM4 Bit 3 AM3 AM3 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AM3 Bit 2 AM2 AM2 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AM2 Bit 1 AM1 AM1 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AM1 Bit 0 AM0 AM0 AC0 AC0 AC0 AC0 AM0 AM0 AM0 AM0 CAN1RXFG FOREGROUND RECEIVE BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) FOREGROUND TRANSMIT BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) CAN1TXFG 0x01C0-0x01FF MSCAN (CAN2) Map (Sheet 1 of 3) Address 0x01C0 0x01C1 0x01C2 0x01C3 0x01C4 0x01C5 0x01C6 0x01C7 Name CAN2CTL0 CAN2CTL1 CAN2BTR0 CAN2BTR1 CAN2RFLG CAN2RIER CAN2TFLG CAN2TIER Bit 7 R RXFRM W R CANE W R SJW1 W R SAMP W R WUPIF W R WUPIE W R 0 W R 0 W Bit 6 RXACT Bit 5 CSWAI LOOPB BRP5 TSEG21 RSTAT1 Bit 4 SYNCH Bit 3 TIME BORM BRP3 TSEG13 TSTAT1 Bit 2 WUPE WUPM BRP2 TSEG12 TSTAT0 Bit 1 SLPRQ SLPAK Bit 0 INITRQ INITAK CLKSRC SJW0 TSEG22 CSCIF CSCIE 0 0 LISTEN BRP4 TSEG20 RSTAT0 BRP1 TSEG11 OVRIF OVRIE TXE1 TXEIE1 BRP0 TSEG10 RXF RXFIE TXE0 TXEIE0 RSTATE1 0 0 RSTATE0 0 0 TSTATE1 0 0 TSTATE0 TXE2 TXEIE2 MC9S12XE-Family Reference Manual , Rev. 1.21 1292 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x01C0-0x01FF MSCAN (CAN2) Map (Sheet 2 of 3) Address 0x01C8 0x01C9 0x01CA 0x01CB 0x01CC 0x01CD Name CAN2TARQ CAN2TAAK CAN2TBSEL CAN2IDAC Reserved CAN2MISC Bit 7 R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R RXERR7 W R TXERR7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W R AM7 W R AM7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W R AM7 W Bit 6 0 0 0 0 0 0 RXERR6 TXERR6 Bit 5 0 0 0 Bit 4 0 0 0 Bit 3 0 0 0 0 0 0 RXERR3 TXERR3 Bit 2 ABTRQ2 ABTAK2 Bit 1 ABTRQ1 ABTAK1 Bit 0 ABTRQ0 ABTAK0 TX2 IDHIT2 0 0 RXERR2 TXERR2 TX1 IDHIT1 0 0 RXERR1 TXERR1 TX0 IDHIT0 0 IDAM1 0 0 RXERR5 TXERR5 IDAM0 0 0 RXERR4 TXERR4 BOHOLD RXERR0 TXERR0 0x01CE CAN2RXERR 0x01CF 0x01D0 0x01D1 0x01D2 0x01D3 0x01D4 0x01D5 0x01D6 0x01D7 0x01D8 0x01D9 0x01DA 0x01DB 0x01DC 0x01DD 0x01DE CAN2TXERR CAN2IDAR0 CAN2IDAR1 CAN2IDAR2 CAN2IDAR3 CAN2IDMR0 CAN2IDMR1 CAN2IDMR2 CAN2IDMR3 CAN2IDAR4 CAN2IDAR5 CAN2IDAR6 CAN2IDAR7 CAN2IDMR4 CAN2IDMR5 CAN2IDMR6 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AM6 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AM5 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AM4 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AM3 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AM2 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AM1 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AC0 AC0 AC0 AC0 AM0 AM0 AM0 AM0 AC0 AC0 AC0 AC0 AM0 AM0 AM0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1293 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x01C0-0x01FF MSCAN (CAN2) Map (Sheet 3 of 3) Address 0x01DF 0x01E0- 0x01EF 0x01F0- 0x01FF Name CAN2IDMR7 R W R W R W Bit 7 AM7 Bit 6 AM6 Bit 5 AM5 Bit 4 AM4 Bit 3 AM3 Bit 2 AM2 Bit 1 AM1 Bit 0 AM0 CAN2RXFG FOREGROUND RECEIVE BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) FOREGROUND TRANSMIT BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) CAN2TXFG MC9S12XE-Family Reference Manual , Rev. 1.21 1294 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0200-0x023F MSCAN (CAN3) Address 0x0200 0x0201 0x0202 0x0203 0x0204 0x0205 0x0206 0x0207 0x0208 0x0209 0x020A 0x020B 0x020C 0x020D 0x020E 0x020F 0x0210 0x0211 0x0212 0x0213 0x0214 0x0215 Name CAN3CTL0 CAN3CTL1 CAN3BTR0 CAN3BTR1 CAN3RFLG CAN3RIER CAN3TFLG CAN3TIER CAN3TARQ CAN3TAAK CAN3TBSEL CAN3IDAC Reserved CAN3MISC CAN3RXERR CAN3TXERR CAN3IDAR0 CAN3IDAR1 CAN3IDAR2 CAN3IDAR3 CAN3IDMR0 CAN3IDMR1 Bit 7 R RXFRM W R CANE W R SJW1 W R SAMP W R WUPIF W R WUPIE W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R 0 W R RXERR7 W R TXERR7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W Bit 6 RXACT Bit 5 CSWAI LOOPB BRP5 TSEG21 RSTAT1 Bit 4 SYNCH Bit 3 TIME BORM BRP3 TSEG13 TSTAT1 Bit 2 WUPE WUPM BRP2 TSEG12 TSTAT0 Bit 1 SLPRQ SLPAK Bit 0 INITRQ INITAK CLKSRC SJW0 TSEG22 CSCIF CSCIE 0 0 0 0 0 0 0 0 RXERR6 TXERR6 LISTEN BRP4 TSEG20 RSTAT0 BRP1 TSEG11 OVRIF OVRIE TXE1 TXEIE1 ABTRQ1 ABTAK1 BRP0 TSEG10 RXF RXFIE TXE0 TXEIE0 ABTRQ0 ABTAK0 RSTATE1 0 0 0 0 0 RSTATE0 0 0 0 0 0 TSTATE1 0 0 0 0 0 0 0 0 RXERR3 TXERR3 TSTATE0 TXE2 TXEIE2 ABTRQ2 ABTAK2 TX2 IDHIT2 0 0 RXERR2 TXERR2 TX1 IDHIT1 0 0 RXERR1 TXERR1 TX0 IDHIT0 0 IDAM1 0 0 RXERR5 TXERR5 IDAM0 0 0 RXERR4 TXERR4 BOHOLD RXERR0 TXERR0 AC6 AC6 AC6 AC6 AM6 AM6 AC5 AC5 AC5 AC5 AM5 AM5 AC4 AC4 AC4 AC4 AM4 AM4 AC3 AC3 AC3 AC3 AM3 AM3 AC2 AC2 AC2 AC2 AM2 AM2 AC1 AC1 AC1 AC1 AM1 AM1 AC0 AC0 AC0 AC0 AM0 AM0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1295 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0200-0x023F MSCAN (CAN3) (continued) Address 0x0216 0x0217 0x0218 0x0219 0x021A 0x021B 0x021C 0x021D 0x021E 0x021F 0x0220- 0x022F 0x0230- 0x023F Name CAN3IDMR2 CAN3IDMR3 CAN3IDAR4 CAN3IDAR5 CAN3IDAR6 CAN3IDAR7 CAN3IDMR4 CAN3IDMR5 CAN3IDMR6 CAN3IDMR7 R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 AM7 AM7 AC7 AC7 AC7 AC7 AM7 AM7 AM7 AM7 Bit 6 AM6 AM6 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AM6 Bit 5 AM5 AM5 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AM5 Bit 4 AM4 AM4 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AM4 Bit 3 AM3 AM3 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AM3 Bit 2 AM2 AM2 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AM2 Bit 1 AM1 AM1 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AM1 Bit 0 AM0 AM0 AC0 AC0 AC0 AC0 AM0 AM0 AM0 AM0 CAN3RXFG FOREGROUND RECEIVE BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) FOREGROUND TRANSMIT BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) CAN3TXFG 0x0240-0x027F Port Integration Module (PIM) Map 5 of 6 Address 0x0240 0x0241 0x0242 0x0243 0x0244 0x0245 0x0246 0x0247 Name PTT PTIT DDRT RDRT PERT PPST Reserved Reserved R W R W R W R W R W R W R W R W Bit 7 PTT7 PTIT7 Bit 6 PTT6 PTIT6 Bit 5 PTT5 PTIT5 Bit 4 PTT4 PTIT4 Bit 3 PTT3 PTIT3 Bit 2 PTT2 PTIT2 Bit 1 PTT1 PTIT1 Bit 0 PTT0 PTIT0 DDRT7 RDRT7 PERT7 PPST7 0 0 DDRT7 RDRT6 PERT6 PPST6 0 0 DDRT5 RDRT5 PERT5 PPST5 0 0 DDRT4 RDRT4 PERT4 PPST4 0 0 DDRT3 RDRT3 PERT3 PPST3 0 0 DDRT2 RDRT2 PERT2 PPST2 0 0 DDRT1 RDRT1 PERT1 PPST1 0 0 DDRT0 RDRT0 PERT0 PPST0 0 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1296 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0240-0x027F Port Integration Module (PIM) Map 5 of 6 (continued) Address 0x0248 0x0249 0x024A 0x024B 0x024C 0x024D 0x024E 0x024F 0x0250 0x0251 0x0252 0x0253 0x0254 0x0255 0x0256 0x0257 0x0258 0x0259 0x025A 0x025B 0x025C 0x025D 0x025E 0x025F Name PTS PTIS DDRS RDRS PERS PPSS WOMS Reserved PTM PTIM DDRM RDRM PERM PPSM WOMM MODRR PTP PTIP DDRP RDRP PERP PPSP PIEP PIFP R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 PTS7 PTIS7 Bit 6 PTS6 PTIS6 Bit 5 PTS5 PTIS5 Bit 4 PTS4 PTIS4 Bit 3 PTS3 PTIS3 Bit 2 PTS2 PTIS2 Bit 1 PTS1 PTIS1 Bit 0 PTS0 PTIS0 DDRS7 RDRS7 PERS7 PPSS7 WOMS7 0 DDRS7 RDRS6 PERS6 PPSS6 WOMS6 0 DDRS5 RDRS5 PERS5 PPSS5 WOMS5 0 DDRS4 RDRS4 PERS4 PPSS4 WOMS4 0 DDRS3 RDRS3 PERS3 PPSS3 WOMS3 0 DDRS2 RDRS2 PERS2 PPSS2 WOMS2 0 DDRS1 RDRS1 PERS1 PPSS1 WOMS1 0 DDRS0 RDRS0 PERS0 PPSS0 WOMS0 0 PTM7 PTIM7 PTM6 PTIM6 PTM5 PTIM5 PTM4 PTIM4 PTM3 PTIM3 PTM2 PTIM2 PTM1 PTIM1 PTM0 PTIM0 DDRM7 RDRM7 PERM7 PPSM7 WOMM7 0 DDRM7 RDRM6 PERM6 PPSM6 WOMM6 MODRR6 PTP6 PTIP6 DDRM5 RDRM5 PERM5 PPSM5 WOMM5 MODRR5 PTP5 PTIP5 DDRM4 RDRM4 PERM4 PPSM4 WOMM4 MODRR4 PTP4 PTIP4 DDRM3 RDRM3 PERM3 PPSM3 WOMM3 MODRR3 PTP3 PTIP3 DDRM2 RDRM2 PERM2 PPSM2 WOMM2 MODRR2 PTP2 PTIP2 DDRM1 RDRM1 PERM1 PPSM1 WOMM1 MODRR1 PTP1 PTIP1 DDRM0 RDRM0 PERM0 PPSM0 WOMM0 MODRR0 PTP0 PTIP0 PTP7 PTIP7 DDRP7 RDRP7 PERP7 PPSP7 PIEP7 PIFP7 DDRP7 RDRP6 PERP6 PPSP6 PIEP6 PIFP6 DDRP5 RDRP5 PERP5 PPSP5 PIEP5 PIFP5 DDRP4 RDRP4 PERP4 PPSP4 PIEP4 PIFP4 DDRP3 RDRP3 PERP3 PPSP3 PIEP3 PIFP3 DDRP2 RDRP2 PERP2 PPSP2 PIEP2 PIFP2 DDRP1 RDRP1 PERP1 PPSP1 PIEP1 PIFP1 DDRP0 RDRP0 PERP0 PPSS0 PIEP0 PIFP0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1297 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0240-0x027F Port Integration Module (PIM) Map 5 of 6 (continued) Address 0x0260 0x0261 0x0262 0x0263 0x0264 0x0265 0x0266 0x0267 0x0268 0x0269 0x026A 0x026B 0x026C 0x026D 0x026E 0x026f 0x0270 0x0271 0x0272 0x0273 0x0274 0x0275 0x0276 0x0277 Name PTH PTIH DDRH RDRH PERH PPSH PIEH PIFH PTJ PTIJ DDRJ RDRJ PERJ PPSJ PIEJ PIFJ PT0AD0 PT1AD0 DDR0AD0 DDR1AD0 RDR0AD0 RDR1AD0 PER0AD0 PER1AD0 R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 PTH7 PTIH7 Bit 6 PTH6 PTIH6 Bit 5 PTH5 PTIH5 Bit 4 PTH4 PTIH4 Bit 3 PTH3 PTIH3 Bit 2 PTH2 PTIH2 Bit 1 PTH1 PTIH1 Bit 0 PTH0 PTIH0 DDRH7 RDRH7 PERH7 PPSH7 PIEH7 PIFH7 PTJ7 PTIJ7 DDRH7 RDRH6 PERH6 PPSH6 PIEH6 PIFH6 PTJ6 PTIJ6 DDRH5 RDRH5 PERH5 PPSH5 PIEH5 PIFH5 PTJ5 PTIJ5 DDRH4 RDRH4 PERH4 PPSH4 PIEH4 PIFH4 PTJ4 PTIJ4 DDRH3 RDRH3 PERH3 PPSH3 PIEH3 PIFH3 PTJ3 PTIJ3 DDRH2 RDRH2 PERH2 PPSH2 PIEH2 PIFH2 PTJ2 PTIJ2 DDRH1 RDRH1 PERH1 PPSH1 PIEH1 PIFH1 PTJ1 PTIJ1 DDRH0 RDRH0 PERH0 PPSH0 PIEH0 PIFH0 PTJ0 PTIJ0 DDRJ7 RDRJ7 PERJ7 PPSJ7 PIEJ7 PIFJ7 PT0AD0 7 PT1AD0 7 DDRJ7 RDRJ6 PERJ6 PPSJ6 PIEJ6 PIFJ6 PT0AD0 6 PT1AD0 6 DDRJ5 RDRJ5 PERJ5 PPSJ5 PIEJ5 PIFJ5 PT0AD0 5 PT1AD0 5 DDRJ4 RDRJ4 PERJ4 PPSJ4 PIEJ4 PIFJ4 PT0AD0 4 PT1AD0 4 DDRJ3 RDRJ3 PERJ3 PPSJ3 PIEJ3 PIFJ3 PT0AD0 3 PT1AD0 3 DDRJ2 RDRJ2 PERJ2 PPSJ2 PIEJ2 PIFJ2 PT0AD0 2 PT1AD0 2 DDRJ1 RDRJ1 PERJ1 PPSJ1 PIEJ1 PIFJ1 PT0AD0 1 PT1AD0 1 DDRJ0 RDRJ0 PERJ0 PPSJ0 PIEJ0 PIFJ0 PT0AD0 0 PT1AD0 0 DDR0AD0 DDR0AD0 DDR0AD0 DDR0AD0 DDR0AD0 DDR0AD0 DDR0AD0 DDR0AD0 7 6 5 4 3 2 1 0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 DDR1AD0 7 6 5 4 3 2 1 0 RDR0AD0 RDR0AD0 RDR0AD0 RDR0AD0 RDR0AD0 RDR0AD0 RDR0AD0 RDR0AD0 7 6 5 4 3 2 1 0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 RDR1AD0 7 6 5 4 3 2 1 0 PER0AD0 PER0AD0 PER0AD0 PER0AD0 PER0AD0 PER0AD0 PER0AD0 PER0AD0 7 6 5 4 3 2 1 0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 PER1AD0 7 6 5 4 3 2 1 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1298 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0240-0x027F Port Integration Module (PIM) Map 5 of 6 (continued) Address 0x0278 0x0279 0x027A 0x027B 0x027C 0x027D 0x027E 0x027F Name PT0AD1 PT1AD1 DDR0AD1 DDR1AD1 RDR0AD1 RDR1AD1 PER0AD1 PER1AD1 R W R W R W R W R W R W R W R W Bit 7 PT0AD1 7 PT1AD1 7 Bit 6 PT0AD1 6 PT1AD1 6 Bit 5 PT0AD1 5 PT1AD1 5 Bit 4 PT0AD1 4 PT1AD1 4 Bit 3 PT0AD1 3 PT1AD1 3 Bit 2 PT0AD1 2 PT1AD1 2 Bit 1 PT0AD1 1 PT1AD1 1 Bit 0 PT0AD1 0 PT1AD1 0 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 DDR0AD1 7 6 5 4 3 2 1 0 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 DDR1AD1 7 6 5 4 3 2 1 0 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 RDR0AD1 7 6 5 4 3 2 1 0 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 RDR1AD1 7 6 5 4 3 2 1 0 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 PER0AD1 7 6 5 4 3 2 1 0 PER1AD1 PER1AD1 PER1AD1 PER1AD1 PER1AD1 PER1A1D PER1AD1 PER1AD1 7 6 5 4 3 2 1 0 0x0280-0x02BF MSCAN (CAN4) Map Address 0x0280 0x0281 0x0282 0x0283 0x0284 0x0285 0x0286 0x0287 0x0288 0x0289 0x028A 0x028B 0x028C Name CAN4CTL0 Bit 7 Bit 6 RXACT Bit 5 CSWAI LOOPB BRP5 TSEG21 RSTAT1 Bit 4 SYNCH Bit 3 TIME BORM BRP3 TSEG13 TSTAT1 Bit 2 WUPE WUPM BRP2 TSEG12 TSTAT0 Bit 1 SLPRQ SLPAK Bit 0 INITRQ INITAK R RXFRM W R CAN4CTL1 CANE W R CAN4BTR0 SJW1 W R CAN4BTR1 SAMP W R CAN4RFLG WUPIF W R CAN4RIER WUPIE W R 0 CAN4TFLG W R 0 CAN4TIER W R 0 CAN4TARQ W R 0 CAN4TAAK W R 0 CAN4TBSEL W R 0 CAN4IDAC W R 0 Reserved W CLKSRC SJW0 TSEG22 CSCIF CSCIE 0 0 0 0 0 0 0 LISTEN BRP4 TSEG20 RSTAT0 BRP1 TSEG11 OVRIF OVRIE TXE1 TXEIE1 ABTRQ1 ABTAK1 BRP0 TSEG10 RXF RXFIE TXE0 TXEIE0 ABTRQ0 ABTAK0 RSTATE1 0 0 0 0 0 RSTATE0 0 0 0 0 0 TSTATE1 0 0 0 0 0 0 0 TSTATE0 TXE2 TXEIE2 ABTRQ2 ABTAK2 TX2 IDHIT2 0 TX1 IDHIT1 0 TX0 IDHIT0 0 IDAM1 0 IDAM0 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1299 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0280-0x02BF MSCAN (CAN4) Map (continued) Address 0x028D 0x028E 0x028F 0x0290 0x0291 0x0292 0x0293 0x0294 0x0295 0x0296 0x0297 0x0298 0x0299 0x029A 0x029B 0x029C 0x029D 0x029E 0x029F 0x02A0- 0x02AF 0x02B0- 0x02BF Name CAN4MISC CAN4RXERR CAN4TXERR CAN4IDAR0 CAN4IDAR1 CAN4IDAR2 CAN4IDAR3 CAN4IDMR0 CAN4IDMR1 CAN4IDMR2 CAN4IDMR3 CAN4IDAR4 CAN4IDAR5 CAN4IDAR6 CAN4IDAR7 CAN4IDMR4 CAN4IDMR5 CAN4IDMR6 CAN4IDMR7 Bit 7 R 0 W R RXERR7 W R TXERR7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W R AM7 W R AM7 W R AC7 W R AC7 W R AC7 W R AC7 W R AM7 W R AM7 W R AM7 W R AM7 W R W R W Bit 6 0 RXERR6 TXERR6 Bit 5 0 RXERR5 TXERR5 Bit 4 0 RXERR4 TXERR4 Bit 3 0 RXERR3 TXERR3 Bit 2 0 RXERR2 TXERR2 Bit 1 0 RXERR1 TXERR1 Bit 0 BOHOLD RXERR0 TXERR0 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AM6 AC6 AC6 AC6 AC6 AM6 AM6 AM6 AM6 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AM5 AC5 AC5 AC5 AC5 AM5 AM5 AM5 AM5 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AM4 AC4 AC4 AC4 AC4 AM4 AM4 AM4 AM4 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AM3 AC3 AC3 AC3 AC3 AM3 AM3 AM3 AM3 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AM2 AC2 AC2 AC2 AC2 AM2 AM2 AM2 AM2 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AM1 AC1 AC1 AC1 AC1 AM1 AM1 AM1 AM1 AC0 AC0 AC0 AC0 AM0 AM0 AM0 AM0 AC0 AC0 AC0 AC0 AM0 AM0 AM0 AM0 CAN4RXFG FOREGROUND RECEIVE BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) FOREGROUND TRANSMIT BUFFER (See Detailed MSCAN Foreground Receive and Transmit Buffer Layout) CAN4TXFG MC9S12XE-Family Reference Manual , Rev. 1.21 1300 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x02C0-0x02EF Analog-to-Digital Converter 12-Bit 16-Channel (ATD0) Map Address 0x02C0 0x02C1 0x02C2 0x02C3 0x02C4 0x02C5 0x02C6 0x02C7 0x02C8 0x02C9 0x02CA 0x02CB 0x02CC 0x02CD Name ATD0CTL0 ATD0CTL1 ATD0CTL2 ATD0CTL3 ATD0CTL4 ATD0CTL5 ATD0STAT0 Reserved ATD0CMPEH ATD0CMPEL ATD0STAT2H ATD0STAT2L ATD0DIENH ATD0DIENL Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 WRAP1 ETRIG CH1 ASCIE FRZ1 PRS1 CB CC1 0 Bit 0 WRAP0 ETRIG CH0 ACMPIE FRZ0 PRS0 CA CC0 0 R 0 0 0 0 WRAP3 WRAP2 W R ETRIG ETRIG ETRIG SRES1 SRES0 SMP_DIS SEL CH3 CH2 W R 0 AFFC ICLKSTP ETRIGLE ETRIGP ETRIGE W R DJM S8C S4C S2C S1C FIFO W R SMP2 SMP1 SMP0 PRS4 PRS3 PRS2 W R 0 SC SCAN MULT CD CC W R 0 CC3 CC2 SCF ETORF FIFOR W R 0 0 0 0 0 0 W R CMPE15 CMPE14 CMPE13 CMPE12 CMPE11 CMPE10 W R CMPE7 CMPE6 CMPE5 CMPE4 CMPE3 CMPE2 W R CCF15 CCF14 CCF13 CCF12 CCF11 CCF10 W R CCF7 CCF6 CCF5 CCF4 CCF3 CCF2 W R IEN15 IEN14 IEN13 IEN12 IEN11 IEN10 W R IEN7 IEN6 IEN5 IEN4 IEN3 IEN2 W R CMPHT15 CMPHT14 CMPHT13 CMPHT12 CMPHT11 CMPHT10 W R CMPHT7 CMPHT6 CMPHT5 CMPHT4 CMPHT3 CMPHT2 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W R Bit15 14 13 12 11 10 W R Bit7 Bit6 0 0 0 0 W CMPE9 CMPE1 CCF9 CCF1 CMPE8 CMPE0 CCF8 CCF0 IEN9 IEN1 CMPHT9 CMPHT1 9 0 9 0 9 0 IEN8 IEN0 CMPHT8 CMPHT0 Bit8 0 Bit8 0 Bit8 0 0x02CE ATD0CMPHTH 0x02CF ATD0CMPHTL 0x02D0 0x02D1 0x02D2 0x02D3 0x02D4 0x02D5 ATD0DR0H ATD0DR0L ATD0DR1H ATD0DR1L ATD0DR2H ATD0DR2L MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1301 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x02C0-0x02EF Analog-to-Digital Converter 12-Bit 16-Channel (ATD0) Map (continued) Address 0x02D6 0x02D7 0x02D8 0x02D9 0x02DA 0x02DB 0x02DC 0x02DD 0x02DE 0x02DF 0x02E0 0x02E1 0x02E2 0x02E3 0x02E4 0x02E5 0x02E6 0x02E7 0x02E8 0x02E9 0x02EA 0x02EB 0x02EC Name ATD0DR3H ATD0DR3L ATD0DR4H ATD0DR4L ATD0DR5H ATD0DR5L ATD0DR6H ATD0DR6L ATD0DR7H ATD0DR7L ATD0DR8H ATD0DR8L ATD0DR9H ATD0DR9L ATD0DR10H ATD0DR10L ATD0DR11H ATD0DR11L ATD0DR12H ATD0DR12L ATD0DR13H ATD0DR13L ATD0DR14H R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit7 Bit15 Bit 6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit6 14 Bit 5 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 0 13 Bit 4 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 0 12 Bit 3 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 0 11 Bit 2 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 0 10 Bit 1 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 0 9 Bit 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 0 Bit8 MC9S12XE-Family Reference Manual , Rev. 1.21 1302 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x02C0-0x02EF Analog-to-Digital Converter 12-Bit 16-Channel (ATD0) Map (continued) Address 0x02ED 0x02EE 0x02EF Name R W R ATD0DR15H W R ATD0DR15L W ATD0DR14L Bit 7 Bit7 Bit15 Bit7 Bit 6 Bit6 14 Bit6 Bit 5 0 13 0 Bit 4 0 12 0 Bit 3 0 11 0 Bit 2 0 10 0 Bit 1 0 9 0 Bit 0 0 Bit8 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1303 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x02F0-0x02F7 Voltage Regulator (VREG_3V3) Map Address 0x02F0 0x02F1 0x02F2 0x02F3 0x02F4 0x02F5 0x02F6 0x02F7 Name VREGHTCL VREGCTRL VREGAPICL VREGAPITR VREGAPIRH VREGAPIRL Reserved VREGHTTR Bit 7 R 0 W R 0 W R APICLK W R APITR5 W R APIR15 W R APIR7 W R 0 W R HTOEN W Bit 6 0 0 0 Bit 5 VSEL 0 0 Bit 4 VAE 0 Bit 3 HTEN 0 Bit 2 HTDS LVDS Bit 1 HTIE LVIE APIE 0 Bit 0 HTIF LVIF APIF 0 APIFES APITR2 APIR12 APIR4 0 0 APIEA APITR1 APIR11 APIR3 0 APIFE APITR0 APIR10 APIR2 0 APITR4 APIR14 APIR6 0 0 APITR3 APIR13 APIR5 0 0 APIR9 APIR1 0 APIR8 APIR0 0 HTTR3 HTTR2 HTTR1 HTTR0 0x02F8-0x02FF Reserved Address 0x02F8- 0x02FF Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0x0300-0x0327 Pulse Width Modulator 8-Bit 8-Channel (PWM) Map (Sheet 1 of 3) Address 0x0300 0x0301 0x0302 0x0303 0x0304 0x0305 0x0306 0x0307 0x0308 0x0309 Name PWME Bit 7 Bit 6 PWME6 PPOL6 PCLK6 PCKB2 CAE6 CON45 0 0 Bit 5 PWME5 PPOL5 PCLK5 PCKB1 CAE5 CON23 0 0 Bit 4 PWME4 PPOL4 PCLK4 PCKB0 CAE4 CON01 0 0 Bit 3 PWME3 PPOL3 PCLK3 0 Bit 2 PWME2 PPOL2 PCLK2 PCKA2 CAE2 PFRZ 0 0 Bit 1 PWME1 PPOL1 PCLK1 PCKA1 CAE1 0 0 0 Bit 0 PWME0 PPOL0 PCLK0 PCKA0 CAE0 0 0 0 R PWME7 W R PWMPOL PPOL7 W R PWMCLK PCLK7 W R 0 PWMPRCLK W R PWMCAE CAE7 W R PWMCTL CON67 W R 0 PWMTST Test Only W R 0 PWMPRSC W R PWMSCLA Bit 7 W R PWMSCLB Bit 7 W CAE3 PSWAI 0 0 6 6 5 5 4 4 3 3 2 2 1 1 Bit 0 Bit 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1304 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0300-0x0327 Pulse Width Modulator 8-Bit 8-Channel (PWM) Map (Sheet 2 of 3) Address 0x030A 0x030B 0x030C 0x030D 0x030E 0x030F 0x0310 0x0311 0x0312 0x0313 0x0314 0x0315 0x0316 0x0317 0x0318 0x0319 0x031A 0x031B 0x031C 0x031D 0x031E 0x031F 0x0320 Name R W R PWMSCNTB W R PWMCNT0 W R PWMCNT1 W R PWMCNT2 W R PWMCNT3 W R PWMCNT4 W R PWMCNT5 W R PWMCNT6 W R PWMCNT7 W R PWMPER0 W R PWMPER1 W R PWMPER2 W R PWMPER3 W R PWMPER4 W R PWMPER5 W R PWMPER6 W R PWMPER7 W R PWMDTY0 W R PWMDTY1 W R PWMDTY2 W R PWMDTY3 W R PWMDTY4 W PWMSCNTA Bit 7 0 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 0 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 7 Bit 6 0 0 6 0 6 0 6 0 6 0 6 0 6 0 6 0 6 0 6 6 6 6 6 6 6 6 6 6 6 6 6 Bit 5 0 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 0 5 5 5 5 5 5 5 5 5 5 5 5 5 Bit 4 0 0 4 0 4 0 4 0 4 0 4 0 4 0 4 0 4 0 4 4 4 4 4 4 4 4 4 4 4 4 4 Bit 3 0 0 3 0 3 0 3 0 3 0 3 0 3 0 3 0 3 0 3 3 3 3 3 3 3 3 3 3 3 3 3 Bit 2 0 0 2 0 2 0 2 0 2 0 2 0 2 0 2 0 2 0 2 2 2 2 2 2 2 2 2 2 2 2 2 Bit 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 Bit 0 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 Bit 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1305 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0300-0x0327 Pulse Width Modulator 8-Bit 8-Channel (PWM) Map (Sheet 3 of 3) Address 0x0321 0x0322 0x0323 Name PWMDTY5 PWMDTY6 PWMDTY7 R W R W R W R W R W R W R W Bit 7 Bit 7 Bit 7 Bit 7 Bit 6 6 6 6 Bit 5 5 5 5 0 PWM RSTRT 0 0 0 Bit 4 4 4 4 Bit 3 3 3 3 0 PWMLVL 0 0 0 0 0 0 0 0 0 Bit 2 2 2 2 PWM7IN PWM7INL 0 0 0 Bit 1 1 1 1 Bit 0 Bit 0 Bit 0 Bit 0 PWM7 ENA 0 0 0 0x0324 PWMSDN PWMIF 0 0 0 PWMIE 0 0 0 0x0325 0x0326 0x0327 Reserved Reserved Reserved 0x0328-0x032F Reserved Address 0x0328- 0x032F Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0x00330-0x0337 Asynchronous Serial Interface (SCI6) Map Address 0x0330 0x0331 0x0332 0x0330 0x0331 0x0332 0x0333 0x0334 Name SCI6BDH(1) Bit 7 Bit 6 TNP1 SBR6 SCISWAI 0 0 0 Bit 5 TNP0 SBR5 RSRC 0 0 0 Bit 4 SBR12 SBR4 M 0 0 0 Bit 3 SBR11 SBR3 WAKE 0 0 0 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF R IREN W R SBR7 SCI6BDL1 W R LOOPS SCI6CR11 W R RXEDGIF SCI6ASR1(2) W R RXEDGIE SCI6ACR12 W R 0 SCI6ACR22 W R SCI6CR2 TIE W R TDRE SCI6SR1 W BERRM1 RE NF TCIE TC RIE RDRF ILIE IDLE TE OR MC9S12XE-Family Reference Manual , Rev. 1.21 1306 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00330-0x0337 Asynchronous Serial Interface (SCI6) Map (continued) Address 0x0335 Name SCI6SR2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 BRK13 0 R2 T2 Bit 1 TXDIR 0 R1 T1 Bit 0 RAF 0 R0 T0 R 0 0 AMAP TXPOL RXPOL W R R8 0 0 0 0x0336 SCI6DRH T8 W R R7 R6 R5 R4 R3 0x0337 SCI6DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI6SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI6SR2 register is set to one MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1307 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00338-0x033F Asynchronous Serial Interface (SCI7) Map Address 0x0338 Name SCI7BDH(1) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 SBR10 SBR2 ILT BERRV 0 Bit 1 SBR9 SBR1 PE BERRIF BERRIE BERRM0 RWU FE Bit 0 SBR8 SBR0 PT BKDIF BKDIE BKDFE SBK PF RAF 0 R0 T0 R IREN TNP1 TNP0 SBR12 SBR11 W R SBR7 SBR6 SBR5 SBR4 SBR3 0x0339 SCI7BDL1 W R LOOPS SCISWAI RSRC M WAKE 0x033A SCI7CR11 W R 0 0 0 0 RXEDGIF 0x0338 SCI7ASR1(2) W R 0 0 0 0 RXEDGIE 0x0339 SCI7ACR12 W R 0 0 0 0 0 0x033A SCI7ACR22 W R 0x033B SCI7CR2 TIE TCIE RIE ILIE TE W R TDRE TC RDRF IDLE OR 0x033C SCI7SR1 W R 0 0 0x033D SCI7SR2 AMAP TXPOL RXPOL W R R8 0 0 0 0x033E SCI7DRH T8 W R R7 R6 R5 R4 R3 0x033F SCI7DRL W T7 T6 T5 T4 T3 1. Those registers are accessible if the AMAP bit in the SCI7SR2 register is set to zero 2. Those registers are accessible if the AMAP bit in the SCI7SR2 register is set to one BERRM1 RE NF BRK13 0 R2 T2 TXDIR 0 R1 T1 0x00340-0x0367 - Periodic Interrupt Timer (PIT) Map (Sheet 1 of 3) Address 0x0340 0x0341 0x0342 0x0343 0x0344 0x0345 0x0346 0x0347 0x0348 Name PITCFLMT PITFLT PITCE PITMUX PITINTE PITTF PITMTLD0 PITMTLD1 PITLD0 (hi) Bit 7 R PITE W R 0 W PFLT7 R PCE7 W R PMUX7 W R PINTE7 W R PTF7 W R PMTLD7 W R PMTLD7 W R PLD15 W Bit 6 PITSWAI 0 PFLT6 PCE6 PMUX6 PINTE6 PTF6 PMTLD6 PMTLD6 PLD14 Bit 5 PITFRZ 0 PFLT5 PCE5 PMUX5 PINTE5 PTF5 PMTLD5 PMTLD5 PLD13 Bit 4 0 0 PFLT4 PCE4 PMUX4 PINTE4 PTF4 PMTLD4 PMTLD4 PLD12 Bit 3 0 0 PFLT3 PCE3 PMUX3 PINTE3 PTF3 PMTLD3 PMTLD3 PLD11 Bit 2 0 0 PFLT2 PCE2 PMUX2 PINTE2 PTF2 PMTLD2 PMTLD2 PLD10 Bit 1 0 PFLMT1 0 PFLT1 PCE1 PMUX1 PINTE1 PTF1 PMTLD1 PMTLD1 PLD9 Bit 0 0 PFLMT0 0 PFLT0 PCE0 PMUX0 PINTE0 PTF0 PMTLD0 PMTLD0 PLD8 MC9S12XE-Family Reference Manual , Rev. 1.21 1308 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00340-0x0367 - Periodic Interrupt Timer (PIT) Map (Sheet 2 of 3) Address 0x0349 0x034A 0x034B 0x034C 0x034D 0x034E 0x034F 0x0350 0x0351 0x0352 0x0353 0x0354 0x0355 0x0356 0x0357 0x0358 0x0359 0x035A 0x035B 0x035C 0x035D 0x035E 0x035F Name PITLD0 (lo) PITCNT0 (hi) PITCNT0 (lo) PITLD1 (hi) PITLD1 (lo) PITCNT1 (hi) PITCNT1 (lo) PITLD2 (hi) PITLD2 (lo) PITCNT2 (hi) PITCNT2 (lo) PITLD3 (hi) PITLD3 (lo) PITCNT3 (hi) PITCNT3 (lo) PITLD4 (hi) PITLD4 (lo) PITCNT4 (hi) PITCNT4 (lo) PITLD5 (hi) PITLD5 (lo) PITCNT5 (hi) PITCNT5 (lo) R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W Bit 7 PLD7 PCNT15 PCNT7 PLD15 PLD7 PCNT15 PCNT7 PLD15 PLD7 PCNT15 PCNT7 PLD15 PLD7 PCNT15 PCNT7 PLD15 PLD7 PCNT15 PCNT7 PLD15 PLD7 PCNT15 PCNT7 Bit 6 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 Bit 5 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 Bit 4 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 Bit 3 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 Bit 2 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 Bit 1 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 Bit 0 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1309 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x00340-0x0367 - Periodic Interrupt Timer (PIT) Map (Sheet 3 of 3) Address 0x0360 0x0361 0x0362 0x0363 0x0364 0x0365 0x0366 0x0367 Name PITLD6 (hi) PITLD6 (lo) PITCNT6 (hi) PITCNT6 (lo) PITLD7 (hi) PITLD7 (lo) PITCNT7 (hi) PITCNT7 (lo) Bit 7 R PLD15 W R PLD7 W R PCNT15 W R PCNT7 W R PLD15 W R PLD7 W R PCNT15 W R PCNT7 W Bit 6 PLD14 PLD6 PCNT14 PCNT6 PLD14 PLD6 PCNT14 PCNT6 Bit 5 PLD13 PLD5 PCNT13 PCNT5 PLD13 PLD5 PCNT13 PCNT5 Bit 4 PLD12 PLD4 PCNT12 PCNT4 PLD12 PLD4 PCNT12 PCNT4 Bit 3 PLD11 PLD3 PCNT11 PCNT3 PLD11 PLD3 PCNT11 PCNT3 Bit 2 PLD10 PLD2 PCNT10 PCNT2 PLD10 PLD2 PCNT10 PCNT2 Bit 1 PLD9 PLD1 PCNT9 PCNT1 PLD9 PLD1 PCNT9 PCNT1 Bit 0 PLD8 PLD0 PCNT8 PCNT0 PLD8 PLD0 PCNT8 PCNT0 MC9S12XE-Family Reference Manual , Rev. 1.21 1310 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0368-0x037F Port Integration Module (PIM) Map 6 of 6 Address 0x0368 0x0369 0x036A 0x036B 0x036C 0x036D 0x036E 0x036F 0x0370 0x0371 0x0372 0x0373 0x0374 0x0375 0x0376 0x0377 0x0378 0x0379 0x037A 0x037B 0x037C Name PTR PTIR DDRR RDRR PERR PPSR Reserved PTRRR PTL PTIL DDRL RDRL PERL PPSL WOML PTLRR PTF PTIF DDRF RDRF PERF Bit 7 R PTR7 W R PTIR7 W R DDRR7 W R RDRR7 W R PERR7 W R PPSR7 W R 0 W R PTRRR7 W R PTL7 W R PTIL7 W R DDRL7 W R RDRL7 W R PERL7 W R PPSL7 W R WOML7 W R PTLRR7 W R PTF7 W R PTIF7 W R DDRF7 W R RDRF7 W R PERF7 W Bit 6 PTR6 PTIR6 Bit 5 PTR5 PTIR5 Bit 4 PTR4 PTIR4 Bit 3 PTR3 PTIR3 Bit 2 PTR2 PTIR2 Bit 1 PTR1 PTIR1 Bit 0 PTR0 PTIR0 DDRR7 RDRR6 PERR6 PPSR6 0 DDRR5 RDRR5 PERR5 PPSR5 0 DDRR4 RDRR4 PERR4 PPSR4 0 DDRR3 RDRR3 PERR3 PPSR3 0 DDRR2 RDRR2 PERR2 PPSR2 0 DDRR1 RDRR1 PERR1 PPSR1 0 DDRR0 RDRR0 PERR0 PPSR0 0 PTRRR6 PTL6 PTIL6 PTRRR5 PTL5 PTIL5 PTRRR4 PTL4 PTIL4 PTRRR3 PTL3 PTIL3 PTRRR2 PTL2 PTIL2 PTRRR1 PTL1 PTIL1 PTRRR0 PTL0 PTIL0 DDRL7 RDRL6 PERL6 PPSL6 WOML6 PTLRR6 PTF6 PTIF6 DDRL5 RDRL5 PERL5 PPSL5 WOML5 PTLRR5 PTF5 PTIF5 DDRL4 RDRL4 PERL4 PPSL4 WOML4 PTLRR4 PTF4 PTIF4 DDRL3 RDRL3 PERL3 PPSL3 WOML3 0 DDRL2 RDRL2 PERL2 PPSL2 WOML2 0 DDRL1 RDRL1 PERL1 PPSL1 WOML1 0 DDRL0 RDRL0 PERL0 PPSL0 WOML0 0 PTF3 PTIF3 PTF2 PTIF2 PTF1 PTIF1 PTF0 PTIF0 DDRF7 RDRF6 PERF6 DDRF5 RDRF5 PERF5 DDRF4 RDRF4 PERF4 DDRF3 RDRF3 PERF3 DDRF2 RDRF2 PERF2 DDRF1 RDRF1 PERF1 DDRF0 RDRF0 PERF0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1311 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0368-0x037F Port Integration Module (PIM) Map 6 of 6 (continued) Address 0x037D 0x037E 0x037F Name PPSF Reserved PTFRR R W R W R W Bit 7 PPSF7 0 0 Bit 6 PPSF6 0 0 Bit 5 PPSF5 0 Bit 4 PPSF4 0 Bit 3 PPSF3 0 Bit 2 PPSF2 0 Bit 1 PPSF1 0 Bit 0 PPSF0 0 PTFRR5 PTFRR4 PTFRR3 PTFRR2 PTFRR1 PTFRR0 MC9S12XE-Family Reference Manual , Rev. 1.21 1312 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0380-0x03BF XGATE Map (Sheet 1 of 3) Address 0x0380 Name XGMCTL R W R W R W R W Bit 7 0 XGEM XGE 0 0 0 0 0 Bit 6 0 XGFRZM XGFRZ Bit 5 0 XGDBGM XGDBG Bit 4 0 XGSSM XGSS Bit 3 0 XGFACTM XGFACT XGCHID[6:0] 0 XGCHPL 0 0 0 Bit 2 0 Bit 1 0 XGS WEFM XGSWEF Bit 0 XGIEM 0x0381 0x0382 0x0383 0x0384 0x0385 0x0386 0x0387 0x0388 0x0389 0x038A 0x023B 0x023C 0x038D 0x038E 0x038F 0x0390 0x0391 0x0392 0x0393 0x0394 0x0395 XGMCTL XGCHID XGCHPL Reserved XGISPSEL XGVBR XGVBR XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIF XGIE R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W R W 0 0 0 0 0 0 XGISPSEL[1:0] XGVBR[15:8] XGVBR[7:1] 0 0 0 0 0 0 0 0 XGIF_78 XGIF_70 XGIF_68 XGIF_60 XGIF_58 XGIF_50 XGIF_48 XGIF_40 XGIF_38 XGIF_30 XGIF_28 XGIF_20 XGIF_18 XGIF_10 XGIF_77 XGIF_6F XGIF_67 XGIF_5F XGIF_57 XGIF_4F XGIF_47 XGIF_3F XGIF_37 XGIF_2F XGIF_27 XGIF_1F XGIF_17 XGIF_76 XGIF_6E XGIF_66 XGIF_5E XGIF_56 XGIF_4E XGIF_46 XGIF_3E XGIF_36 XGIF_2E XGIF_26 XGIF_1E XGIF_16 XGIF_75 XGIF_6D XGIF_65 XGIF_5D XGIF_55 XGIF_4D XGIF_45 XGIF_3D XGIF_35 XGIF_2D XGIF_25 XGIF_1D XGIF_15 XGIF_74 XGIF_6C XGIF_64 XGIF_5C XGIF_54 XGIF_4C XGIF_44 XGIF_3C XGIF_34 XGIF_2C XGIF_24 XGIF_1C XGIF_14 XGIF_73 XGIF_6B XGIF_63 XGIF_5B XGIF_53 XGIF_4B XGIF_43 XGIF_3B XGIF_33 XGIF_2B XGIF_23 XGIF_1B XGIF_13 XGIF_72 XGIF_6A XGIF_62 XGIF_5A XGIF_52 XGIF_4A XGIF_42 XGIF_3A XGIF_32 XGIF_2A XGIF_22 XGIF_1A XGIF_12 XGIF_71 XGIF_69 XGIF_61 XGIF_59 XGIF_51 XGIF_49 XGIF_41 XGIF_39 XGIF_31 XGIF_29 XGIF_21 XGIF_19 XGIF_11 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1313 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0380-0x03BF XGATE Map (Sheet 2 of 3) Address 0x0396 0x0397 0x0398 0x0399 0x039A 0x039B 0x039C 0x039D 0x039E 0x039F 0x03A0 0x03A1 0x03A2 0x03A3 0x03A4 0x03A5 0x03A6 0x03A7 0x03A8 0x03A9 0x03AA 0x03AB 0x03AC Name XGIF XGIF XGSWTM XGSWT XGSEMM XGSEM Reserved XGCCR XGPC (hi) XGPC (lo) Reserved Reserved XGR1 (hi) XGR1 (lo) XGR2 (hi) XGR2 (lo) XGR3 (hi) XGR3 (lo) XGR4 (hi) XGR4 (lo) XGR5 (hi) XGR5(lo) XGR6 (hi) Bit 7 R XGIF_0F W R 0 W R 0 W R W R 0 W R W R 0 W R 0 W R W R W R 0 W R 0 W R W R W R W R W R W R W R W R W R W R W R W Bit 6 XGIF_0E 0 0 Bit 5 XGIF_0D 0 0 Bit 4 XGIF_0C 0 Bit 3 XGIF_0B 0 Bit 2 XGIF_0A 0 0 Bit 1 XGIF_09 0 0 Bit 0 0 0 0 0 0 XGSWTM[7:0] XGSWT[7:0] 0 0 0 0 XGSEMM[7:0] XGSEM[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 XGN XGZ XGV XGC XGPC[15:8] XGPC[7:0] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 XGR1[15:8] XGR1[7:0] XGR2[15:8] XGR2[7:0] XGR3[15:8] XGR3[7:0] XGR4[15:8] XGR4[7:0] XGR5[15:8] XGR5[7:0] XGR6[15:8] MC9S12XE-Family Reference Manual , Rev. 1.21 1314 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0380-0x03BF XGATE Map (Sheet 3 of 3) Address 0x03AD 0x03AE 0x03AF 0x03B0- 0x03BF Name XGR6 (lo) XGR7 (hi) XGR7 (lo) Reserved R W R W R W R W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 XGR6[7:0] XGR7[15:8] XGR7[7:0] 0 0 0 0 0 0 0 0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1315 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x03C0-0x03CF Reserved Address 0x03C0 -0x03CF Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 0x03D0-0x03FF Timer Module (TIM) Map (Sheet 1 of 2) Address 0x03D0 0x03D1 0x03D2 0x03D3 0x03D4 0x03D5 0x03D6 0x03D7 0x03D8 0x03D9 0x03DA 0x03DB 0x03DC 0x03DD 0x03DE 0x03DF 0x03E0 0x03E1 0x03E2 0x03E3 Name TIOS CFORC OC7M OC7D TCNTH TCNTL TSCR1 TTOV TCTL1 TCTL2 TCTL3 TCTL4 TIE TSCR2 TFLG1 TFLG2 TC0H TC0L TC1H TC1L Bit 7 R IOS7 W R 0 W FOC7 R OC7M7 W R OC7D7 W R TCNT15 W R TCNT7 W R TEN W R TOV7 W R OM7 W R OM3 W R EDG7B W R EDG3B W R C7I W R TOI W R C7F W R TOF W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W Bit 6 IOS6 0 FOC6 OC7M6 OC7D6 TCNT14 TCNT6 TSWAI TOV6 OL7 OL3 EDG7A EDG3A C6I 0 Bit 5 IOS5 0 FOC5 OC7M5 OC7D5 TCNT13 TCNT5 TSFRZ TOV5 OM6 OM2 EDG6B EDG2B C5I 0 Bit 4 IOS4 0 FOC4 OC7M4 OC7D4 TCNT12 TCNT4 TFFCA TOV4 OL6 OL2 EDG6A EDG2A C4I 0 Bit 3 IOS3 0 FOC3 OC7M3 OC7D3 TCNT11 TCNT3 PRNT TOV3 OM5 OM1 EDG5B EDG1B C3I TCRE C3F 0 Bit 2 IOS2 0 FOC2 OC7M2 OC7D2 TCNT10 TCNT2 0 Bit 1 IOS1 0 FOC1 OC7M1 OC7D1 TCNT9 TCNT1 0 Bit 0 IOS0 0 FOC0 OC7M0 OC7D0 TCNT8 TCNT0 0 TOV2 OL5 OL1 EDG5A EDG1A C2I PR2 C2F 0 TOV1 OM4 OM0 EDG4B EDG0B C1I PR1 C1F 0 TOV0 OL4 OL0 EDG4A EDG0A C0I PR0 C0F 0 C6F 0 C5F 0 C4F 0 Bit 14 Bit 6 Bit 14 Bit 6 Bit 13 Bit 5 Bit 13 Bit 5 Bit 12 Bit 4 Bit 12 Bit 4 Bit 11 Bit 3 Bit 11 Bit 3 Bit 10 Bit 2 Bit 10 Bit 2 Bit 9 Bit 1 Bit 9 Bit 1 Bit 8 Bit 0 Bit 8 Bit 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1316 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x03D0-0x03FF Timer Module (TIM) Map (Sheet 2 of 2) Address 0x03E4 0x03E5 0x03E6 0x03E7 0x03E8 0x03E9 0x03EA 0x03EB 0x03EC 0x03ED 0x03EE 0x03EF 0x03F0 0x03F1 0x03F2 0x03F3 0x03F4- 0x03FB 0x03FC 0x03FD 0x03FE 0x03FF Name TC2H TC2L TC3H TC3L TC4H TC4L TC5H TC5L TC6H TC6L TC7H TC7L PACTL PAFLG PACNTH PACNTL Reserved OCPD Reserved PTPSR Reserved Bit 7 R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R Bit 15 W R Bit 7 W R 0 W R 0 W R PACNT15 W R PACNT7 W R 0 W R OCPD7 W R W R PTPSR7 W R W Bit 6 Bit 14 Bit 6 Bit 14 Bit 6 Bit 14 Bit 6 Bit 14 Bit 6 Bit 14 Bit 6 Bit 14 Bit 6 PAEN 0 Bit 5 Bit 13 Bit 5 Bit 13 Bit 5 Bit 13 Bit 5 Bit 13 Bit 5 Bit 13 Bit 5 Bit 13 Bit 5 PAMOD 0 Bit 4 Bit 12 Bit 4 Bit 12 Bit 4 Bit 12 Bit 4 Bit 12 Bit 4 Bit 12 Bit 4 Bit 12 Bit 4 PEDGE 0 Bit 3 Bit 11 Bit 3 Bit 11 Bit 3 Bit 11 Bit 3 Bit 11 Bit 3 Bit 11 Bit 3 Bit 11 Bit 3 CLK1 0 Bit 2 Bit 10 Bit 2 Bit 10 Bit 2 Bit 10 Bit 2 Bit 10 Bit 2 Bit 10 Bit 2 Bit 10 Bit 2 CLK0 0 Bit 1 Bit 9 Bit 1 Bit 9 Bit 1 Bit 9 Bit 1 Bit 9 Bit 1 Bit 9 Bit 1 Bit 9 Bit 1 PAOVI PAOVF PACNT9 PACNT1 0 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 Bit 8 Bit 0 PAI PAIF PACNT8 PACNT0 0 PACNT14 PACNT6 0 PACNT13 PACNT5 0 PACNT12 PACNT4 0 PACNT11 PACNT3 0 PACNT10 PACNT2 0 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0 PTPSR6 PTPSR5 PTPSR4 PTPSR3 PTPSR2 PTPSR1 PTPSR0 MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1317 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix E Detailed Register Address Map 0x0400-0x07FF Reserved Address 0x0400- 0x07FF Name Reserved R W Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 0 MC9S12XE-Family Reference Manual , Rev. 1.21 1318 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix F Ordering Information Appendix F Ordering Information The following figure provides an ordering partnumber example for the devices covered by this data book. There are two options when ordering a device. Customers must choose between ordering either the maskspecific partnumber or the generic / mask-independent partnumber Ordering the mask-specific partnumber enables the customer to specify which particular maskset they will receive whereas ordering the generic maskset means that FSL will ship the currently preferred maskset (which may change over time). In either case, the marking on the device will always show the generic / mask-independent partnumber and the mask set number. NOTE The mask identifier suffix and the Tape & Reel suffix are always both omitted from the partnumber which is actually marked on the device. For specific partnumbers to order, please contact your local sales office. The below figure illustrates the structure of a typical mask-specific ordering number for the MC9S12XE-Family devices S 9 S12X EP100 J1 C AG R R = Tape & Reel Tape & Reel No R = No Tape & Reel AA = 80 QFP AL = 112 LQFP Package Option AG = 144 LQFP VL = 208 MAPBGA C = -40C to 85C Temperature Option V = -40C to 105C M = -40C to 125C Maskset identifier Suffix First digit references fab J=TSMC, F=ATMC Second digit differentiates mask rev. 1=1M48H (This suffix is omitted in generic partnumbers) Device Title Controller Family Main Memory Type: 9 = Flash 3 = ROM (if available) Status / Partnumber type: S or SC = Maskset specific partnumber MC = Generic / mask-independebt partnumber P or PC = prototype status (pre qualification Figure F-1. Order Part Number Example MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1319 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix F Ordering Information MC9S12XE-Family Reference Manual , Rev. 1.21 1320 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix F Ordering Information MC9S12XE-Family Reference Manual Rev. 1.21 Freescale Semiconductor 1321 Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 Appendix F Ordering Information MC9S12XE-Family Reference Manual , Rev. 1.21 1322 Freescale Semiconductor Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010 How to Reach Us: Home Page: www.freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 1-800-521-6274 or 480-768-2130 Europe, Middle East, and Africa: +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) Japan: Freescale Semiconductor Japan Ltd. Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-0047, Japan 0120-191014 or +81-3-3440-3569 Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong 852-26668334 For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2005,2006,2007. All rights reserved. MC9S12XEP100RMV1 Rev. 1.21 04/2010 |
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